BIPV intelligent chip photovoltaic module and packaging process thereof

Abstract

The invention relates to the technical field of photovoltaic modules, in particular to a BIPV intelligent chip photovoltaic module which comprises a bottom plate, side plates are fixedly connected to the two sides of the top of the bottom plate, a top plate is fixedly connected to the tops of the side plates, a front plate is fixedly connected to the front side of the bottom plate, and a back plate is fixedly connected to the back of the bottom plate. A first packaging plate and a limiting rod are fixedly connected to the top of the bottom plate, one end of the limiting rod sequentially penetrates through the side plate and the vertical plate and extends to the inner side of the vertical plate, the end, extending to the inner side of the vertical plate, of the limiting rod makes contact with the surface of the chip plate, and the limiting rod transversely moves between the side plate and the vertical plate and is used for limiting the chip plate. When the chip board is replaced, firstly, the rotating rod is rotated to enable the moving plate to rise to the position where the popping groove cannot be shielded, then the limiting rod is pulled out to enable the chip board not to be limited, at the moment, the chip board is popped out through the elastic force effect of the second spring, the chip board can be rapidly replaced, operation is easy, and time is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic modules, and in particular to a BIPV smart chip photovoltaic module and a packaging process thereof. Background Art

[0002] BIPV, or photovoltaic building integration, is an innovative application that combines photovoltaic power generation technology with architectural design. Its advantage is that it can effectively combine the green energy of the building with the appearance of the building, making the building more environmentally friendly and intelligent, reducing energy consumption and operating costs, thereby greatly improving the return on investment of the building. Specifically, BIPV requires that photovoltaic power generation building materials be integrated with the building. In addition to having good power generation capabilities, it also has shading, heat preservation, waterproofing or architectural aesthetics. The photovoltaic module is composed of a certain number of solar cells in series and parallel combination packaged together. Since the current and voltage of a single solar cell are very small, we first connect them in series to obtain high voltage, and then connect them in parallel to obtain high current, and then output them through an anti-reverse current diode. Conventional photovoltaic modules are connected using a junction box with a bypass diode. The disadvantage is that once there is a shading or a defect in the battery itself causes a hot spot, the bypass diode is activated, the battery string corresponding to the diode is short-circuited, and the output power of the module drops by at least 1 / 3. At the same time, the system is prone to current and voltage mismatch, hot spots, shading, dust shading and other problems, resulting in a decrease in the power generation of the entire system.

[0003] The most important structure in a photovoltaic module is the BIPV smart chip. Most failures of photovoltaic modules are caused by damage to the BIPV smart chip. However, existing photovoltaic modules are produced through a packaging process and cannot be easily opened. During use, the internal BIPV smart chip cannot be replaced if it fails. Summary of the invention

[0004] The purpose of the present invention is to provide a BIPV smart chip photovoltaic module and its packaging process to solve the problem that the existing photovoltaic modules cannot be easily opened due to the production through the packaging process, and when in use, the internal BIPV smart chip cannot be replaced after a failure.

[0005] To achieve the above-mentioned purpose, a BIPV smart chip photovoltaic module is provided, comprising a bottom plate, side plates are fixedly connected to both sides of the top of the bottom plate, a top plate is fixedly connected to the top of the side plates, a front plate is fixedly connected to the front side of the bottom plate, a back plate is fixedly connected to the back of the bottom plate, a first packaging plate is fixedly connected to the top of the bottom plate, vertical plates are fixedly connected to both sides of the top of the first packaging plate, a second packaging plate is fixedly connected to the top of the vertical plates, and a chip plate is arranged on the top of the first packaging plate and between the two groups of vertical plates; Also includes: A limiting rod, one end of which passes through the side plate and the vertical plate in sequence and extends to the inner side of the vertical plate. One end of the limiting rod extending to the inner side of the vertical plate contacts the surface of the chip board. The limiting rod moves laterally between the side plate and the vertical plate to limit the chip board.

[0006] As a further improvement of the technical solution, a baffle is fixedly connected to the surface of the limit rod, and a first spring is fixedly connected between one side of the baffle and one side of the vertical plate.

[0007] As a further improvement of the present technical solution, the limiting rod is internally rotatably connected to a rotating rod, one end of the rotating rod is fixedly connected to a handle, the other end of the rotating rod is fixedly connected to a fixed rod, one end of the fixed rod is movably connected to a telescopic rod, one end of the telescopic rod is rotatably connected to a movable part, and the surface of the movable part is fixedly connected to a first slider.

[0008] As a further improvement of the present technical solution, the fixed rod is provided with an inner cavity, one end of the telescopic rod extends into the inner cavity of the fixed rod, and a third spring is fixedly connected between the end of the telescopic rod extending into the inner cavity of the fixed rod and the bottom of the inner cavity of the fixed rod.

[0009] As a further improvement of the present technical solution, a movable plate is arranged on the front side of the first slider, the surface of the movable plate contacts the back of the front plate, a first sliding groove is opened on the back of the movable plate, and the inner cavity of the first sliding groove is slidably connected to the surface of the first slider.

[0010] As a further improvement of the present technical solution, a second slider is fixedly connected to the surface of the movable plate, a second slide groove is provided on the back of the front plate, the inner cavity of the second slide groove is slidably connected to the surface of the second slider, and a pop-up groove is provided on the front plate.

[0011] As a further improvement of the technical solution, a mounting plate is fixedly connected to the surface of the back plate, a second spring is fixedly connected to the surface of the mounting plate, a spring plate is fixedly connected to one end of the second spring, and the spring plate is in contact with the chip board.

[0012] As a further improvement of the technical solution, a junction box is fixedly connected to the bottom of the base plate.

[0013] The second object of the present invention is to provide a packaging process for a BIPV smart chip photovoltaic module, comprising the following method steps: S1. Install the bottom plate, the first packaging plate, the chip plate, the second packaging plate and the top plate in sequence according to the corresponding order through packaging; S2, rotating the rotating rod to make the movable plate rise to a position where it cannot cover the ejection slot, so that the ejection slot leaks out; S3, pull out the limit rod to make it out of contact with the chip board, so that the chip board is not limited, and the chip board is ejected from the ejection slot through the spring plate under the elastic force of the second spring; S4. After inserting the new chip board, loosen the limit rod, and the first spring can drive the limit rod back to the initial position to limit the chip board again.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In this BIPV smart chip photovoltaic module and its packaging process, firstly, the rotating rod is rotated to make the movable plate rise to a position where it cannot block the pop-up slot, and then the chip board is not limited by pulling out the limit rod. At this time, the chip board is ejected by the elastic force of the second spring, and the chip board can be quickly replaced, which is simple to operate and saves time.

[0015] 2. In this BIPV smart chip photovoltaic module and its packaging process, the initial state of the second spring is a contracted state. At this time, the second spring generates thrust on the chip board, and the chip board is fixed in place by the limiting rod. When the chip board is not restricted, the second spring can pop out the chip board through the spring plate, which is convenient for maintenance and repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of the top plate of the present invention; Figure 3 A top view of the chip board of the present invention; Figure 4 It is a structural schematic diagram of the chip board of the present invention; Figure 5 It is a structural schematic diagram of the movable plate of the present invention; Figure 6 For the present invention Figure 4 A magnified view of the structure at center A; Figure 7 It is a structural schematic diagram of the spring plate of the present invention; Figure 8 It is a cross-sectional view of the fixing rod structure of the present invention.

[0017] The meaning of each number in the figure is: 1. Bottom plate; 2. Side plate; 3. Front plate; 4. Back plate; 5. Top plate; 6. First packaging plate; 7. Vertical plate; 8. Chip plate; 9. Second packaging plate; 10. Limit rod; 11. Baffle plate; 12. First spring; 13. Rotating rod; 14. Handle; 15. Fixed rod; 16. Telescopic rod; 17. Movable part; 18. First slider; 19. Moving plate; 20. First slide groove; 21. Second slider; 22. Second slide groove; 23. Pop-up groove; 24. Mounting plate; 25. Second spring; 26. Spring plate; 27. Third spring; 28. Junction box. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] See also Figure 1-Figure 8 As shown, the purpose of this embodiment is to provide a BIPV smart chip photovoltaic module, including a bottom plate 1, both sides of the top of the bottom plate 1 are fixedly connected to side plates 2, the top of the side plates 2 is fixedly connected to a top plate 5, the front side of the bottom plate 1 is fixedly connected to a front plate 3, the back of the bottom plate 1 is fixedly connected to a back plate 4, the top of the bottom plate 1 is fixedly connected to a first packaging board 6, both sides of the top of the first packaging board 6 are fixedly connected to vertical plates 7, the top of the vertical plates 7 is fixedly connected to a second packaging board 9, and a chip board 8 is arranged on the top of the first packaging board 6 and between the two groups of vertical plates 7; Also includes: A limiting rod 10, one end of which passes through the side plate 2 and the vertical plate 7 in sequence and extends to the inner side of the vertical plate 7. One end of the limiting rod 10 extending to the inner side of the vertical plate 7 contacts the surface of the chip board 8. The limiting rod 10 moves laterally between the side plate 2 and the vertical plate 7 to limit the chip board 8.

[0022] A baffle plate 11 is fixedly connected to the surface of the limiting rod 10 , and a first spring 12 is fixedly connected between one side of the baffle plate 11 and one side of the vertical plate 7 .

[0023] The initial state of the first spring 12 is a normal relaxed state. In this state, the limit rod 10 just blocks the chip board 8. When the limit rod 10 is pulled to break away from the limit on the limit rod 10 and then the limit rod 10 is released, the first spring 12 can drive the limit rod 10 to return to the initial position and will not cause the limit rod 10 to break away from its position.

[0024] The limiting rod 10 is internally rotatably connected to a rotating rod 13, one end of the rotating rod 13 is fixedly connected to a handle 14, the other end of the rotating rod 13 is fixedly connected to a fixed rod 15, one end of the fixed rod 15 is movably connected to a telescopic rod 16, one end of the telescopic rod 16 is rotatably connected to a movable part 17, and a first slider 18 is fixedly connected to the surface of the movable part 17.

[0025] The fixed rod 15 is provided with an inner cavity, one end of the telescopic rod 16 extends into the inner cavity of the fixed rod 15 , and a third spring 27 is fixedly connected between the end of the telescopic rod 16 extending into the inner cavity of the fixed rod 15 and the bottom of the inner cavity of the fixed rod 15 .

[0026] A movable plate 19 is provided on the front side of the first slider 18, and the surface of the movable plate 19 contacts the back of the front plate 3. A first sliding groove 20 is provided on the back of the movable plate 19, and the inner cavity of the first sliding groove 20 is slidably connected to the surface of the first slider 18. A second slider 21 is fixedly connected to the surface of the movable plate 19, and a second sliding groove 22 is provided on the back of the front plate 3, and the inner cavity of the second sliding groove 22 is slidably connected to the surface of the second slider 21, and a pop-up groove 23 is provided on the front plate 3.

[0027] The area of ​​the movable plate 19 is larger than the ejection slot 23 , and the telescopic rod 16 is recovered into the inner cavity of the fixed rod 15 during the process that the movable plate 19 rises and leaves the ejection slot 23 .

[0028] First, rotate the rotating rod 13 to make the movable plate 19 rise to a position where it cannot block the pop-up slot 23, and then pull out the limiting rod 10 to remove the limit from the chip board 8. At this time, the chip board 8 is ejected by the elastic force of the second spring 25, so that the chip board 8 can be quickly replaced, which is simple to operate and saves time.

[0029] The surface of the back plate 4 is fixedly connected with a mounting plate 24 , the surface of the mounting plate 24 is fixedly connected with a second spring 25 , one end of the second spring 25 is fixedly connected with a spring plate 26 , the spring plate 26 contacts the chip board 8 , and the bottom of the base plate 1 is fixedly connected with a junction box 28 .

[0030] The initial state of the second spring 25 is a contracted state. At this time, the second spring 25 generates a thrust on the chip board 8 , and the chip board 8 is limited and fixed in place by the limiting rod 10 .

[0031] The second object of the present invention is to provide a packaging process for a BIPV smart chip photovoltaic module, comprising the following method steps: S1, by packaging, the bottom plate 1, the first packaging plate 6, the chip plate 8, the second packaging plate 9 and the top plate 5 are installed in sequence according to the corresponding order; S2, rotating the rotating rod 13 to make the movable plate 19 rise to a position where it cannot block the ejection slot 23, so that the ejection slot 23 leaks out; S3, pull out the limiting rod 10 to make it out of contact with the chip board 8, so that the chip board 8 is not limited, and the chip board 8 is ejected from the ejection slot 23 through the spring plate 26 under the elastic force of the second spring 25; S4. After inserting the new chip board 8, loosen the limiting rod 10, and the first spring 12 can drive the limiting rod 10 to return to the initial position to limit the chip board 8 again.

[0032] Working principle: the initial state of the first spring 12 is a normal relaxed state. In this state, the limit rod 10 just blocks the chip board 8. When the limit rod 10 is pulled to make it free from the limit on the limit rod 10 and then the limit rod 10 is released, the first spring 12 can drive the limit rod 10 to return to the initial position. The initial state of the second spring 25 is a contracted state. At this time, the second spring 25 generates a thrust on the chip board 8. The chip board 8 is limited and fixed in place by the limit rod 10, and the limit rod 10 will not be separated from its position. The rotating rod 13 is rotated to make the movable plate 19 rise to a position where it cannot block the pop-up slot 23, and then the chip board 8 is not limited by pulling out the limit rod 10. At this time, the chip board 8 is ejected by the elastic force of the second spring 25, and the chip board 8 can be quickly replaced.

[0033] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A BIPV smart chip photovoltaic module, comprising a base plate (1), characterized in that: The two sides of the top of the bottom plate (1) are fixedly connected to side plates (2), the top of the side plates (2) is fixedly connected to a top plate (5), the front side of the bottom plate (1) is fixedly connected to a front plate (3), the back of the bottom plate (1) is fixedly connected to a back plate (4), the top of the bottom plate (1) is fixedly connected to a first packaging plate (6), the two sides of the top of the first packaging plate (6) are fixedly connected to vertical plates (7), the top of the vertical plates (7) is fixedly connected to a second packaging plate (9), and a chip board (8) is provided at the top of the first packaging plate (6) and between the two groups of vertical plates (7); Also includes: A limiting rod (10), one end of which passes through the side plate (2) and the vertical plate (7) in sequence and extends to the inner side of the vertical plate (7); one end of the limiting rod (10) extending to the inner side of the vertical plate (7) contacts the surface of the chip board (8); the limiting rod (10) moves laterally between the side plate (2) and the vertical plate (7) to limit the chip board (8).

2. The BIPV smart chip photovoltaic module according to claim 1, characterized in that: A baffle (11) is fixedly connected to the surface of the limiting rod (10), and a first spring (12) is fixedly connected between one side of the baffle (11) and one side of the vertical plate (7).

3. The BIPV smart chip photovoltaic module according to claim 2, characterized in that: The limiting rod (10) is rotatably connected to a rotating rod (13) inside, one end of the rotating rod (13) is fixedly connected to a handle (14), the other end of the rotating rod (13) is fixedly connected to a fixing rod (15), one end of the fixing rod (15) is movably connected to a telescopic rod (16), one end of the telescopic rod (16) is rotatably connected to a movable member (17), and a first sliding block (18) is fixedly connected to the surface of the movable member (17).

4. The BIPV smart chip photovoltaic module according to claim 3, characterized in that: The fixed rod (15) is provided with an inner cavity, one end of the telescopic rod (16) extends into the inner cavity of the fixed rod (15), and a third spring (27) is fixedly connected between the end of the telescopic rod (16) extending into the inner cavity of the fixed rod (15) and the bottom of the inner cavity of the fixed rod (15).

5. The BIPV smart chip photovoltaic module according to claim 3, characterized in that: A movable plate (19) is arranged on the front side of the first sliding block (18), the surface of the movable plate (19) contacts the back of the front plate (3), a first sliding groove (20) is provided on the back of the movable plate (19), and the inner cavity of the first sliding groove (20) is slidably connected to the surface of the first sliding block (18).

6. The BIPV smart chip photovoltaic module according to claim 5, characterized in that: A second sliding block (21) is fixedly connected to the surface of the movable plate (19), a second sliding groove (22) is provided on the back of the front plate (3), an inner cavity of the second sliding groove (22) is slidably connected to the surface of the second sliding block (21), and an ejection groove (23) is provided on the front plate (3).

7. The BIPV smart chip photovoltaic module according to claim 1, characterized in that: A mounting plate (24) is fixedly connected to the surface of the back plate (4), a second spring (25) is fixedly connected to the surface of the mounting plate (24), one end of the second spring (25) is fixedly connected to a spring plate (26), and the spring plate (26) is in contact with the chip board (8).

8. The BIPV smart chip photovoltaic module according to claim 1, characterized in that: A junction box (28) is fixedly connected to the bottom of the base plate (1).

9. A packaging process for a BIPV smart chip photovoltaic module as claimed in any one of claims 1 to 8, characterized in that: The method comprises the following steps: S1, installing the bottom plate (1), the first packaging plate (6), the chip plate (8), the second packaging plate (9) and the top plate (5) in sequence according to a corresponding order through packaging; S2, rotating the rotating rod (13) to raise the movable plate (19) to a position where it cannot block the ejection groove (23), so that the ejection groove (23) leaks out; S3, pulling out the limiting rod (10) to make it out of contact with the chip plate (8), so that the chip plate (8) is not limited, and under the elastic force of the second spring (25), the chip plate (8) is ejected from the ejection slot (23) through the spring plate (26); S4. After inserting the new chip board (8), loosen the limiting rod (10), and the first spring (12) can drive the limiting rod (10) to return to the initial position, so as to limit the chip board (8) again.

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