Carrier heat dissipation device and carrier
By using a combination technology of semiconductor refrigeration sheet and pump circulation mechanism in the vehicle, rapid cooling, heating and constant temperature of the vehicle seat are achieved, and the problems of low efficiency and strong foreign body sense in the existing technology are solved, and waterproofing is improved and comfort.
Patent Information
- Application Number
- CN202411893264.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-02-21
AI Technical Summary
The existing vehicle heating and refrigeration system is inefficient and slow in achieving constant seat temperature, and has problems such as foreign body sense and insufficient waterproofness.
The semiconductor refrigeration sheet is used to output the cold and cold, adjust the temperature through the pump and circulation mechanism, realize rapid cooling and constant temperature, and is arranged on the vehicle through the temperature control pipe to avoid openings in the vehicle.
It realizes rapid cooling, heating and constant temperature of the vehicle seat, improving the waterproofness of the vehicle and the comfort of the driver and passengers.
Smart Images

Figure CN119489728A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heating and cooling system for a vehicle, and in particular to a vehicle heating and cooling device and a vehicle. Background Art
[0002] Many vehicles, such as motorcycles, which are exposed to the outside, often face the problem of seats being cold in winter and hot in summer when in use. The same problem also exists in multi-wheeled vehicles such as cars.
[0003] Among the existing solutions, many add cooling or heating to the seat cushions, back cushions and other parts, or open holes in the seat cushions to transfer heat or cool air. This will make the driver and passengers have a noticeable foreign body sensation and reduce the comfort level. If heat or cool air is transferred through air ducts, they are easily flattened, affecting the functional use. At the same time, traditional solutions are very slow to reach the preset temperature or maintain a constant temperature, and the efficiency is extremely low. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide a carrier heating and cooling device and a carrier.
[0005] The technical problem to be solved by the present invention is achieved by adopting the following technical solutions:
[0006] The present invention provides a vehicle heating and cooling device, comprising a constant temperature mechanism and a pump arranged in a housing, wherein:
[0007] The pump is connected to a first pipeline, and the circulation mechanism of the constant temperature mechanism is connected to a second pipeline;
[0008] The circulation mechanism is also connected to the pump via a circulation pipeline;
[0009] The constant temperature mechanism includes a refrigeration fin.
[0010] As a preferred technical solution of the present invention, a heat insulation sheet is installed on the outer side of the constant temperature mechanism, wherein:
[0011] The bottom of the constant temperature mechanism is installed on the heat sink, and a heat dissipation fan is installed on the other side of the heat sink;
[0012] A heat insulating portion is also provided on the top of the constant temperature mechanism.
[0013] As a preferred technical solution of the present invention, the first pipeline and the second pipeline are connected at the terminal through a temperature control pipeline, wherein:
[0014] The temperature control pipeline is arranged on the carrier.
[0015] Preferably, the present invention provides another carrier heating and cooling device, the difference being that both the first pipe and the second pipe are connected to a constant temperature plate, wherein:
[0016] The thermostatic plate has a first through hole and a second through hole;
[0017] The first through hole is communicated with the first pipeline, and the second through hole is communicated with the second pipeline.
[0018] Preferably, the thermostat has a guide groove, wherein:
[0019] The guide groove communicates with the first through hole and the second through hole.
[0020] Preferably, the thermostatic plate is also covered with at least one layer of a first gasket, and the first gasket is covered with at least one layer of a second gasket.
[0021] Further preferably, the thermostat and the first gasket are structures made of plastic or polymer materials.
[0022] The present invention also provides a carrier having the above-mentioned carrier heating and cooling device.
[0023] The beneficial effects of the present invention are as follows: the present invention outputs cold and heat through semiconductor refrigeration sheets, and cooling and heating can be achieved by switching electrodes. The temperature is adjusted by a pump through a circulation mechanism, and constant temperature can also be achieved. It can be applied to vehicles and can achieve cooling and heating faster. At the same time, since no holes are opened on the vehicle, the waterproofness of the vehicle and the comfort of the driver and passengers are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is one of the structural schematic diagrams of the present invention;
[0025] Figure 2 This is the second structural schematic diagram of the present invention;
[0026] Figure 3 This is the third structural schematic diagram of the present invention;
[0027] Figure 4 This is the fourth structural schematic diagram of the present invention;
[0028] Figure 5 This is the fifth structural diagram of the present invention;
[0029] Figure 6 This is the sixth structural diagram of the present invention;
[0030] Figure 7 This is the seventh structural diagram of the present invention;
[0031] Figure 8 This is the eighth structural schematic diagram of the present invention;
[0032] Fig. 9 This is the ninth structural diagram of the present invention;
[0033] Fig.10 This is the tenth structural diagram of the present invention;
[0034] In the figure: 001, first shell; 002, second shell; 1, first pipeline; 2, second pipeline; 21, circulation pipeline; 22, temperature control pipeline; 3, pump; 4, circulation mechanism; 5, heat sink; 6, cooling fan; 7, thermal insulation; 8, constant temperature mechanism; 81, thermal insulation plate; 9, constant temperature plate; 91, first through hole; 92, second through hole; 93, guide groove; 94, first gasket; 95, second gasket. DETAILED DESCRIPTION
[0035] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.
[0036] Example 1
[0037] like Figure 1-7 As shown, this embodiment provides a vehicle heating and cooling device, including a constant temperature mechanism 8 and a pump 3 arranged in a housing, wherein:
[0038] The pump 3 is connected to the first pipeline 1, and the circulation mechanism 4 of the constant temperature mechanism 8 is connected to the second pipeline 2; the circulation mechanism 4 is also connected to the pump 3 through the circulation pipeline 21, so that the pump 3 can circulate the liquid. When the liquid passes through the circulation mechanism 4 (such as a liquid storage cavity, etc.), the constant temperature mechanism 8 can exchange heat with the liquid, and realize heat exchange with the temperature control pipeline 22 at the terminal of the first pipeline 1 and the second pipeline 2, so as to realize heating and cooling adjustment and constant temperature;
[0039] The constant temperature mechanism 8 includes a cooling plate, namely a semiconductor cooling plate, which has a faster temperature adjustment speed.
[0040] A heat insulating sheet 81 is installed on the outer side of the thermostatic mechanism 8, wherein the bottom of the thermostatic mechanism 8 is installed on the heat sink 5, and a heat dissipation fan 6 is installed on the other side of the heat sink 5 to achieve better heat dissipation;
[0041] A heat insulating portion 7 is also provided on the top of the constant temperature mechanism 8. The heat insulating portion 7 and the heat insulating sheet 81 both help to maintain the temperature.
[0042] The first pipe 1 and the second pipe 2 are connected at the terminal through the temperature control pipe 22, wherein the temperature control pipe 22 is arranged in the vehicle to adjust the body temperature felt by the driver and passengers; its typical installation method includes installation in the seat cushion and backrest of the vehicle.
[0043] Example 2
[0044] like Figure 1-5 As shown in , 8-10, this embodiment provides a carrier heating and cooling device, which is different from the embodiment 1 in that the first pipe 1 and the second pipe 2 are both connected to the thermostat 9, wherein the thermostat 9 has a first through hole 91 and a second through hole 92, and specifically, the thermostat 9 has a guide groove 93, wherein the guide groove 93 connects the first through hole 91 and the second through hole 92; in this embodiment, the thermostat 9 is made of a flexible polymer material. The thermostat 9 can also be called a surface transducer.
[0045] The first through hole 91 is connected to the first pipeline, and the second through hole 92 is connected to the second pipeline 2. After the circulating liquid transported by the pump 3 passes through the first pipeline 1 and the first through hole 91, it enters the guide groove 93, and then returns to the circulation mechanism 4 through the second through hole 92 and the second pipeline 2, and then returns to the pump 3 through the circulation pipeline 21. When the liquid passes through the circulation mechanism 4 (such as the liquid storage cavity, etc.), the constant temperature mechanism 8 can exchange heat with the liquid, thereby realizing the temperature regulation of the liquid in the guide groove 93;
[0046] Compared with the prior art, the liquid in the solution of this embodiment is circulated through the pipeline, which has a better effect.
[0047] Furthermore, the thermostat 9 is also covered with at least one layer of a first gasket 94, and the first gasket 94 is covered with at least one layer of a second gasket 95. Then, the heating and cooling device can be installed on the vehicle, and the driver and the passenger contact the second gasket 95 or the cover thereon to achieve temperature regulation and constant temperature. The thermostat 9, the first gasket 94 and the second gasket 95 form a three-layer gasket structure, which can significantly improve the comfort of the driver and the passenger when riding. In the prior art, such as covering the surface of the vehicle with metal wires such as woven mesh and copper wire for heat conduction, there are great safety hazards, and the lack of a multi-layer gasket structure will cause the metal wire or woven mesh to deform when the driver and the passenger rides, affecting the service life, and the presence of the metal wire or woven mesh can be clearly felt, and the foreign body sensation is very strong, which greatly affects the riding comfort.
[0048] As a preferred embodiment, when installed on a vehicle such as a motorcycle or a car, if installed under the leather layer, the combination will bring a better riding experience. Specifically, when applied to a car, it can avoid punching holes on the surface leather or covering, and when liquid leaks in the car, it can avoid damage to the seat;
[0049] Especially for vehicles used in outdoor environments, such as motorcycles and ATVs, they can be heated and cooled, bringing great comfort to users.
[0050] Preferably, the thermostatic sheet 9 and the first gasket 94 are structures made of plastic or polymer materials; preferably, the second gasket 95 is a structure made of aluminum foil.
[0051] The contact surface of the solution in this embodiment with the driver and the passenger is supported by the second gasket 95, and the entirety of the gasket is in contact with the driver and the passenger, so that the heating and cooling effects are transmitted more evenly, thereby improving the riding experience;
[0052] Furthermore, since the second gasket 95 is in contact with the driver and the passenger as a whole, it reduces the pressure on the guide groove 93, which can not only provide a more uniform heating and cooling effect, but also avoid the guide groove 93 from being deformed by pressure because the spacing between the guide grooves 93 is relatively large;
[0053] Accordingly, the spacing between the guide grooves 93 is relatively large, which also makes the driver and passengers feel better;
[0054] According to actual tests, when the solution in this embodiment is adopted, the pipeline formed by the guide groove 93 and the constant temperature plate 94 can withstand greater pressure from the driver and passengers without deformation;
[0055] Example 3
[0056] This embodiment provides a carrier, which is equipped with the heating and cooling device in embodiment 1 or embodiment 2.
[0057] Specifically, the vehicle includes but is not limited to various forms of vehicles such as motorcycles, bicycles, mopeds, cars, and trucks.
[0058] The heating and cooling device of the present invention outputs heat and cold through semiconductor refrigeration sheets, and can perform cooling and heating by switching electrodes. The temperature is adjusted by a pump through a circulation mechanism, and a constant temperature can also be achieved. It can be applied to vehicles and can achieve cooling and heating more quickly. At the same time, since no holes are opened on the vehicle, the waterproofness of the vehicle and the comfort of the driver and passengers are improved.
[0059] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.
Claims
1. A carrier heating and cooling device, characterized in that: It comprises a constant temperature mechanism (8) and a pump (3) arranged in a housing, wherein: The pump (3) is connected to a first pipeline (1), and the circulation mechanism (4) of the constant temperature mechanism (8) is connected to a second pipeline (2); The circulation mechanism (4) is also connected to the pump (3) via a circulation pipeline (21); The constant temperature mechanism (8) comprises a refrigeration fin.
2. The carrier heating and cooling device according to claim 1, characterized in that: A heat insulating sheet (81) is installed on the outer side of the thermostatic mechanism (8), wherein: The bottom of the constant temperature mechanism (8) is installed on the heat sink (5), and a heat dissipation fan (6) is installed on the other side of the heat sink (5); A heat insulating portion (7) is also provided on the top of the constant temperature mechanism (8).
3. A carrier heating and cooling device according to claim 1 or 2, characterized in that: The first pipeline (1) and the second pipeline (2) are connected at the terminal through a temperature control pipeline (22), wherein: The temperature control pipeline (22) is arranged on the carrier.
4. A carrier heating and cooling device according to claim 1 or 2, characterized in that: The first pipe (1) and the second pipe (2) are both connected to a constant temperature plate (9), wherein: The constant temperature plate (9) has a first through hole (91) and a second through hole (92); The first through hole (91) is in communication with the first pipeline, and the second through hole (92) is in communication with the second pipeline (2).
5. The carrier heating and cooling device according to claim 4, characterized in that: The thermostatic plate (9) has a guide groove (93), wherein: The guide groove (93) communicates with the first through hole (91) and the second through hole (92).
6. A carrier heating and cooling device according to claim 4 or 5, characterized in that: The thermostatic plate (9) is also covered with at least one layer of a first gasket (94), and the first gasket (94) is covered with at least one layer of a second gasket (95).
7. The carrier heating and cooling device according to claim 6, characterized in that: The thermostatic plate (9) and the first gasket (94) are structures made of plastic or polymer materials; The second gasket (95) comprises a structure made of aluminum foil.
8. A carrier, characterized in that: A carrier heating and cooling device as claimed in any one of claims 1 to 7.
Citation Information
Cited By
Anti-blocking transduction piece for carrier
CN224297330U