Chip bonding device and method

Abstract

The invention provides a chip bonding device and method. The chip bonding device comprises a bonding head used for adsorbing a chip to be bonded and adjusting the pose of the chip; the infrared vision system is used for penetrating through the chip so as to acquire images of the first mark on the back surface of the chip and the second mark at the target bonding position of the chip; and a controller configured to: acquire, via the infrared vision system, an image with the first marker and the second marker; analyzing the image to determine the poses of the first mark and the second mark in the image; adjusting the pose of the bonding head according to the pose difference of the first mark and the second mark in the image, so that the chip is aligned with the target bonding position; and bonding the chip to the target bonding position through the bonding head. According to the invention, extra errors caused by using a calibration sheet as an intermediate medium in the bonding process can be avoided, the bonding precision is improved, and the bonding process is simplified, so that the bonding efficiency is improved, and the productivity of equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a chip bonding device, a chip bonding method, and a computer-readable storage medium. Background Art

[0002] In the chip to wafer bonding process, the conventional solution is to use a calibration sheet with reference points attached to the nozzle as an intermediate medium, where the calibration sheet can be engraved with high-precision patterns, and then use two sets of visual systems to identify the chip to be bonded and the calibration sheet, as well as the bonding target wafer and the calibration sheet. After that, the chip and wafer are converted to the same calibration sheet coordinate system, thereby achieving high-precision alignment and bonding between the chip and the wafer.

[0003] However, the solutions adopted in the above-mentioned prior art have many problems. First, the calibration sheet as an intermediate medium is prone to additional errors. Secondly, since the sizes of chips vary, including a variety of sizes ranging from 1mm×1mm to 26mm×33mm, chips of different sizes need to be adsorbed by bonding head nozzles of different sizes. Therefore, each bonding head nozzle needs to be equipped with a special calibration sheet, which is very costly. Finally, with the use of the calibration sheet as an intermediate positioning medium, it is necessary to perform one positioning of the chip and the calibration sheet and one positioning of the wafer and the calibration sheet, a total of two positionings, which increases the bonding process and requires more time, resulting in reduced equipment capacity.

[0004] In order to solve the above problems existing in the prior art, the art is in urgent need of a chip bonding technology that can avoid the additional errors caused by using a calibration sheet as an intermediate medium in the bonding process, improve the bonding accuracy, simplify the bonding process, thereby improving the bonding efficiency and increasing the equipment production capacity. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a chip bonding device, a chip bonding method, and a computer-readable storage medium, which can avoid the additional errors caused by using a calibration sheet as an intermediate medium in the bonding process, improve the bonding accuracy, simplify the bonding process, thereby improving the bonding efficiency and enhancing the equipment production capacity.

[0007] Specifically, the chip bonding device provided according to the first aspect of the present invention includes: a bonding head, used to absorb the chip to be bonded and adjust its posture; an infrared vision system, used to penetrate the chip to collect an image of a first mark on the back of the chip and a second mark at a target bonding position of the chip; and a controller, configured to: obtain an image with the first mark and the second mark via the infrared vision system; parse the image to determine the posture of the first mark and the second mark in the image; adjust the posture of the bonding head according to the difference in posture of the first mark and the second mark in the image to align the chip with the target bonding position; and bond the chip to the target bonding position via the bonding head.

[0008] Further, in some embodiments of the present invention, the depth of field of the infrared vision system is smaller than the distance from the chip to the target bonding position, and the infrared vision system first focuses on the first mark to capture a first image including the first mark, and then focuses on the second mark to capture a second image including the second mark, so that the controller can respectively determine the position and posture of the first mark in the first image and the position and posture of the second mark in the second image, or

[0009] The depth of field of the infrared vision system is greater than or equal to the distance from the chip to the target bonding position, and the infrared vision system captures a third image that includes both the first mark and the second mark, so that the controller can simultaneously determine the positions of the first mark and the second mark in the third image.

[0010] Furthermore, in some embodiments of the present invention, the controller is further configured to:

[0011] When the distance from the chip to the target bonding position is greater than the depth of field of the infrared vision system, the infrared vision system is controlled to respectively capture the first image and the second image, so as to roughly adjust the posture of the bonding head according to the posture of the first mark in the first image and the posture of the second mark in the second image; the bonding head is controlled to lift the chip to approach the target bonding position; and after the distance from the chip to the target bonding position is less than or equal to the depth of field of the infrared vision system, the infrared vision system is controlled to capture a third image containing both the first mark and the second mark, so as to finely adjust the posture of the bonding head according to the postures of the first mark and the second mark in the third image.

[0012] Furthermore, in some embodiments of the present invention, the infrared vision system further includes an adjustment module for focusing on the first mark and / or the second mark respectively to capture clear images thereof.

[0013] Furthermore, in some embodiments of the present invention, a plurality of first marks are provided on the back side of the chip, and a plurality of second marks are correspondingly provided at the target bonding position, and the controller is further configured to: determine the translation adjustment amount of the bond head in the X direction and the Y direction in the horizontal plane according to the position difference between at least one first mark and its corresponding second mark in the image; determine the rotation adjustment amount of the bond head in the Rz direction in the horizontal plane according to the position difference between the plurality of first marks and the plurality of second marks corresponding to them in the image; and adjust the posture of the bond head according to the translation adjustment amount and the rotation adjustment amount to align the chip with the target bonding position.

[0014] Furthermore, in some embodiments of the present invention, it also includes: a translation adjustment mechanism, connected to the controller, used to adjust the position of the bond head in the horizontal plane according to the translation adjustment amount; and a rotation adjustment mechanism, connected to the controller, used to adjust the first posture of the bond head in the horizontal plane according to the rotation adjustment amount.

[0015] Further, in some embodiments of the present invention, the detection surface of the infrared vision system is parallel to the plane where each of the second marks is located, and the controller is further configured to: analyze the image to determine a first imaging length of one of the first marks in the X direction, and determine a second imaging length of another first mark in the X direction, wherein the two first marks are distributed along the Y direction and have the same real length; determine a first inclination angle of the back side of the chip relative to the plane where each of the second marks is located based on the difference between the first imaging length and the second imaging length, and the spacing between the two first marks along the Y direction; and determine a first inclination adjustment amount of the bonding head in the Rx direction based on the first inclination angle.

[0016] Furthermore, in some embodiments of the present invention, the controller is also configured to: analyze the image to determine a third imaging length of one of the first marks in the Y direction, and determine a fourth imaging length of another of the first marks in the Y direction, wherein the two first marks are distributed along the X direction and have the same real length; determine a second inclination angle of the back side of the chip relative to the plane where the second marks are located based on the difference between the third imaging length and the fourth imaging length, and the spacing between the two first marks along the X direction; and determine a second inclination adjustment amount of the bonding head in the Ry direction based on the second inclination angle.

[0017] Furthermore, in some embodiments of the present invention, it further comprises: a tilt adjustment mechanism connected to the controller, and used for leveling the bonding head according to the first tilt adjustment amount and / or the second tilt adjustment amount.

[0018] Furthermore, in some embodiments of the present invention, the infrared vision system includes a plurality of detection modules, each used to collect an image of the corresponding at least one first mark and at least one second mark.

[0019] Furthermore, in some embodiments of the present invention, it further comprises: a lifting mechanism for lifting the bonding head so as to bring the bonding head close to the target bonding position and bond the chip to the target bonding position.

[0020] Furthermore, in some embodiments of the present invention, the target bonding position includes a patch area reserved on the wafer to be bonded, and the chip bonding device also includes: a wafer chuck for adsorbing the wafer to cooperate with the bonding head to bond the chip to the patch area reserved thereon.

[0021] In addition, the chip bonding method provided according to the second aspect of the present invention comprises the following steps:

[0022] The chip to be bonded is adsorbed by the bonding head of the chip bonding device provided by the first aspect of the present invention; the infrared vision system of the chip bonding device penetrates the chip to collect images of a first mark on the back of the chip and a second mark at a target bonding position of the chip; the image is analyzed to determine the positions of the first mark and the second mark in the image; according to the position difference between the first mark and the second mark in the image, the position of the bonding head is adjusted to align the chip with the target bonding position; and the chip is bonded to the target bonding position via the bonding head.

[0023] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the chip bonding method provided by the third aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0025] Figure 1A schematic structural diagram of a chip bonding device provided according to some embodiments of the present invention is shown;

[0026] Figure 2 A flow chart of a chip bonding method provided according to some embodiments of the present invention is shown;

[0027] Figure 3 A schematic flow chart of a chip picking process according to some embodiments of the present invention is shown;

[0028] Figure 4 A schematic diagram of the structure of chip handover provided according to some embodiments of the present invention is shown;

[0029] Figure 5 A schematic diagram showing a first mark and a second mark before and after position adjustment in a top-down perspective according to some embodiments of the present invention is shown;

[0030] Figure 6 A schematic diagram showing a structure of a chip provided in some embodiments of the present invention at a first tilt angle; and

[0031] Figure 7 A schematic structural diagram of a chip bonding device provided according to some embodiments of the present invention bonding a chip to a target bonding position is shown.

[0032] Reference numerals:

[0033] 100 Chip bonding device;

[0034] 110 Bonding head;

[0035] 120 infrared vision system;

[0036] 210 chips;

[0037] 220 wafer;

[0038] 211, 212 first mark;

[0039] 221 Second Mark;

[0040] 230 images;

[0041] Steps S210 to S250;

[0042] 310 chip vision station; and

[0043] 320 Pickup head. DETAILED DESCRIPTION

[0044] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0047] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0048] As mentioned above, there are many problems with the solutions adopted in the prior art. First, the calibration sheet as an intermediate medium is prone to additional errors. Secondly, since the sizes of chips vary, including a variety of sizes ranging from 1mm×1mm to 26mm×33mm, chips of different sizes need to be adsorbed by bonding head nozzles of different sizes. Therefore, each bonding head nozzle needs to be equipped with a special calibration sheet, which is very costly. Finally, with the use of the calibration sheet as an intermediate positioning medium, it is necessary to perform (one positioning of the chip and the calibration sheet and one positioning of the wafer and the calibration sheet, a total of two positionings, which increases the bonding process and requires more time, resulting in reduced equipment capacity.

[0049] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a chip bonding device, a chip bonding method, and a computer-readable storage medium, which can avoid the additional errors caused by using a calibration sheet as an intermediate medium in the bonding process, improve the bonding accuracy, simplify the bonding process, thereby improving the bonding efficiency and enhancing the equipment production capacity.

[0050] In some non-limiting embodiments, the chip bonding device provided in the first aspect of the present invention can be used to implement the chip bonding method provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention has computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the chip bonding method provided in the second aspect of the present invention.

[0051] The working principle of the above-mentioned chip bonding device will be described below in conjunction with some embodiments of the chip bonding method. Those skilled in the art will understand that these embodiments of the chip bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the chip bonding device. Similarly, the chip bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these chip bonding methods.

[0052] Please see Figure 1 , Figure 1 A schematic structural diagram of a chip bonding device provided according to some embodiments of the present invention is shown.

[0053] like Figure 1As shown, in some embodiments of the present invention, the chip bonding device 100 may mainly include: a bonding head 110, an infrared vision system 120 and a controller (not shown in the drawings). The bonding head 110 can be used to adsorb the chip 210 to be bonded and adjust its posture. The infrared vision system 120 can provide infrared light that can penetrate the chip 210, and collect images of the first marks 211, 212 on the back thereof and the second mark 221 of the target bonding position of the chip through two sets of cameras. Optionally, the infrared vision system 120 can move with the bonding head 110, or the bonding head 110 can also move alone.

[0054] The bonding process in the present invention can be mainly applied to the chip-to-wafer bonding process. The chip-to-wafer bonding process is a new high-dimensional 3D packaging solution that can simultaneously achieve higher density chip integration and realize chip storage on a wafer substrate. Figure 1 As shown, the bonding target of the chip 210 can be a wafer 220. At this time, the target bonding position of the chip 210 can include a patch area reserved on the wafer 220 to be bonded, so that the chip 210 can be bonded. Usually, the patch area on the wafer 220 is fixed. For this, the bonding head 110 needs to move it after picking up the chip 210 to align and bond each chip 210 to the patch position reserved for each chip on the wafer 220, which corresponds to the chip-to-wafer bonding process provided by the present invention. A plurality of second marks 221 may be included in the patch area.

[0055] Since the infrared vision system 120 in this embodiment can provide penetrating infrared rays, the vision system can directly see the reference mark points hidden on the back of the chip 210 and the front of the wafer 220. Therefore, the marks on the back of the chip and the front of the wafer can be located without the use of a calibration sheet as an intermediate medium, thereby improving the positioning accuracy. Moreover, after abandoning the calibration sheet, the application of the nozzle is more flexible, and the cost can be reduced and the bonding efficiency can be improved.

[0056] The controller in the chip bonding apparatus 100 can be used to implement multiple steps in the chip bonding method provided in the second aspect of the present invention. Figure 2 , Figure 2 A flow chart of a chip bonding method provided according to some embodiments of the present invention is shown.

[0057] like Figure 2 As shown, in some embodiments of the present invention, the chip bonding method may include the following steps: First, step S210 may be performed: the chip to be bonded is adsorbed by the bonding head of the chip bonding device.

[0058] Specifically, see Figure 3 , Figure 3 FIG. 2 is a flow chart showing a chip picking process according to some embodiments of the present invention. Figure 3 As shown, in some embodiments, the outer contour of the chip 210 to be bonded can be first identified by the wafer vision stage 310, wherein the back of the chip 210 can include first marks 211, 212. Then, the controller can control the pick-up head 320 to move above the chip 210 to pick up the chip 210. Optionally, the pick-up head 320 can pick up one of the chips on the UV film by vacuum adsorption. Since the front of the chip 210 is a surface with a circuit, the pick-up head 320 can preferably use a non-contact adsorption method to adsorb the front of the chip 210, so as not to damage or affect the circuit on the front of the chip 210 during the process of picking up the chip 210.

[0059] Since the pickup head 320 adsorbs the front side (i.e., the bonding side) of the chip 210 when it adsorbs the chip 210 from the UV film, it cannot directly bond with the wafer 220. Therefore, a handover is required to turn the front side of the chip 210 over to bond with the wafer 220.

[0060] Specifically, see Figure 4 , Figure 4 FIG. 2 shows a schematic diagram of a chip connection structure provided by some embodiments of the present invention. Figure 4 As shown, the pick-up head 320 adsorbing the chip 210 to be bonded is moved above the receiving position of the bonding head 110, and then the pick-up head 320 delivers the chip 210 to the bonding head 110. Since the bonding head 110 adsorbs the back of the chip 210, and there is no circuit on the surface, the chip can be adsorbed by vacuum adsorption.

[0061] Then, step S220 may be performed: the infrared vision system of the chip bonding device penetrates the chip to collect images of the first mark on the back side of the chip and the second mark at the target bonding position of the chip.

[0062] Specifically, in some embodiments, returning to Figure 1 As shown, the bonding head 110 carries the chip 210 and moves to the bottom of the bonding area of ​​the wafer 220. The infrared vision system 120 may include multiple detection modules (not shown in the drawings), which can be used to collect images of at least one corresponding first mark 211 and / or 212, and at least one second mark 221. The controller can obtain images with the first marks 211, 212 and the second mark 221 through the infrared vision system 120.

[0063] In some preferred embodiments, the infrared vision system 120 may include an adjustment module (not shown in the attached figure), which can be used to focus on the first mark 211, 212 and / or the second mark 221 respectively to collect clear images thereof. On this basis, the controller can perform a real-time online distributed adjustment alignment scheme based on the depth of field of the infrared vision system 120 and the distance from the chip 210 to the target bonding position on the wafer 220.

[0064] Specifically, in one embodiment, when the depth of field of the infrared vision system 120 is less than the distance from the chip 210 to the target bonding position on the wafer 220, the controller can control the infrared vision system 120 to first focus on the first marks 211 and 212 on the back of the chip 210 to collect a first image containing the first marks 211 and 212. Then, the second mark 221 on the bonding surface (front side) of the wafer 220 is focused to collect a second image containing the second mark 221, so that the controller can respectively determine the positions of the first marks 211 and 212 in the first image and the position of the second mark 221 in the second image.

[0065] Further, in the embodiment where the distance from the chip 210 to the target bonding position is greater than the depth of field of the infrared vision system 120, that is, the target bonding position on the chip 210 and / or the wafer 220 is outside the depth of field, at this time, the first image and / or the second image acquired by the infrared vision system 120 is relatively blurred. In this regard, the controller can control the infrared vision system 120 to respectively acquire the first image and the second image, so as to roughly adjust the posture of the bonding head 110 according to the posture of the first marks 211 and 212 in the first image and the posture of the second mark 221 in the second image.

[0066] The controller can control the bonding head 110 to lift (usually increase) the chip 210 so that the chip 210 is close to the target bonding position until the depth of field of the infrared vision system 120 is greater than or equal to the distance from the chip 210 to the target bonding position on the wafer 220, that is, the chip 210 and / or the target bonding position on the wafer 220 is within the depth of field.

[0067] In another embodiment, when the depth of field of the infrared vision system 120 is greater than or equal to the distance from the chip 210 to the target bonding position on the wafer 220, the first image and / or the second image acquired by the infrared vision system 120 is relatively clear. In this regard, the controller can control the infrared vision system 120 to acquire a third image containing both the first markers 211, 212 and the second marker 221, so that the controller can simultaneously determine the positions of the first markers 211, 212 and the second marker 221 in the third image.

[0068] Furthermore, in the embodiment where the distance from the chip 210 to the target bonding position is less than or equal to the depth of field of the infrared vision system 120, the controller can control the infrared vision system 120 to capture a third image that simultaneously includes the first marks 211, 212 and the second mark 221, so as to finely adjust the posture of the bonding head 110 according to the postures of the first marks 211, 212 and the second mark 221 in the third image.

[0069] Through the above two embodiments, by roughly adjusting the position of the bonding head 110, on the one hand, the amount of adjustment for subsequent fine adjustment can be reduced to improve the real-time performance of the alignment, and on the other hand, the requirements for the depth of field of the infrared vision system can be reduced, thereby reducing the hardware cost of the fine adjustment. In addition, by finely adjusting the position of the bonding head 110, the positions of the first marks 211, 212 and the second mark 221 in the same image coordinate system can be obtained, thereby reducing the need for secondary coordinate conversion operations, and there is no need to perform two independent calibrations and positioning of the chip 210 and the wafer 220, so that real-time and higher-precision alignment can be achieved, thereby simultaneously improving the alignment efficiency and alignment accuracy.

[0070] Next, step S230 may be performed: parsing the image to determine the positions of the first marker and the second marker in the image.

[0071] Specifically, you can refer to Figure 5 , Figure 5 Schematic diagrams of first and second marks before and after position adjustment in a top-down perspective according to some embodiments of the present invention are shown.

[0072] like Figure 5 As shown, in some embodiments, the controller can determine the translation adjustment amount of the bonding head 110 in the X direction and the Y direction in the horizontal plane according to the position difference between at least one first mark 211 (or the first mark 212) and its corresponding second mark 221 in the image 230.

[0073] Furthermore, the controller can also determine the rotation adjustment amount of the bonding head 110 in the Rz direction in the horizontal plane according to the position difference between the plurality of first marks 211, 212 and the corresponding plurality of second marks 221 in the image 230. In other words, the angle error of the chip 210 can be determined by positioning the two marks on the chip 210, so that the subsequent bonding head 110 moves alone to adjust the angle error of the chip 210, and then aligns and bonds with the wafer after completion.

[0074] In some preferred embodiments, the detection surface of the infrared vision system 120 may be parallel to the plane where each second mark 221 in the wafer 220 is located. Figure 6 , Figure 6A schematic structural diagram of a chip provided according to some embodiments of the present invention at a first tilt angle is shown.

[0075] like Figure 6 As shown, the controller can determine the first imaging length h1 of a first mark 211 in the X direction and the second imaging length h2 of another first mark 212 in the X direction by analyzing the image 230. The two first marks 211 and 212 are distributed along the Y direction, that is, arranged front and back, and have the same real length. Then, according to the difference between the first imaging length h1 and the second imaging length h2, and the spacing between the two first marks 211 and 212 along the Y direction, the first tilt angle of the back side of the chip 210 relative to the plane where each second mark 221 is located can be determined. Figure 6 The first tilt angle in the figure indicates that the chip 210 is not flat in the front-to-back direction, with the front being lower and the back being higher. Then, according to the obtained first tilt angle, the first tilt adjustment amount of the bonding head 110 in the Rx direction can be determined.

[0076] Furthermore, by analyzing the image 230, the controller can also determine the third imaging length h3 of a first mark 211 in the Y direction, and determine the fourth imaging length h4 of another first mark 212 in the Y direction. The two first marks 211 and 212 are distributed along the X direction, that is, arranged left and right, and have the same real length. Then, based on the difference between the third imaging length h3 and the fourth imaging length h4, and the spacing between the two first marks 211 and 212 along the X direction, the second inclination angle of the back of the chip 210 relative to the plane where the second marks 221 are located can be determined. The second inclination angle can be understood as the unevenness of the chip 210 in the left and right directions. Then, based on the obtained second inclination angle, the second inclination adjustment amount of the bonding head 110 in the Ry direction can be determined.

[0077] Please continue to return Figure 2 , then step S240 may be performed: adjusting the posture of the bonding head according to the posture difference between the first mark and the second mark in the image, so as to align the chip with the target bonding position.

[0078] Specifically, in some embodiments, the chip bonding device 100 may include a translation adjustment mechanism and a rotation adjustment mechanism (not shown in the drawings), wherein both the translation adjustment mechanism and the rotation adjustment mechanism may be connected to a controller. Figure 5 As shown, the controller can macro-adjust the posture of the bonding head 110 according to the translation adjustment amount and the rotation adjustment amount obtained above, so that the chip 210 is aligned with the target bonding position. The controller can adjust the position (x, y) of the bonding head 110 in the horizontal plane through the translation adjustment mechanism. The controller can adjust the first posture θ of the bonding head 110 in the horizontal plane through the rotation adjustment mechanism according to the rotation adjustment amount obtained above.

[0079] Furthermore, in some preferred embodiments, the chip bonding device 100 may further include a tilt adjustment mechanism (not shown in the drawings), which may be connected to a controller. The controller may fine-tune the bonding head 110 according to the first tilt adjustment amount and / or the second tilt adjustment amount obtained above, thereby improving the parallelism between the upper plane (back side) of the chip 210 and the lower plane (bonding surface) of the wafer 220, thereby improving the accuracy of the entire mark alignment.

[0080] Please continue to return Figure 2 Finally, step S250 may be performed: bonding the chip to a target bonding position via a bonding head.

[0081] Specifically, see Figure 7 , Figure 7 A schematic structural diagram of a chip bonding device provided according to some embodiments of the present invention bonding a chip to a target bonding position is shown.

[0082] like Figure 7 As shown, in some embodiments, the chip bonding device 100 may also include a wafer chuck (not shown in the drawings), which can be used to adsorb the wafer 220 so that its bonding surface (front side) faces downward, so as to cooperate with the bonding head 110 to bond the chip 210 to the patch area reserved thereon. Optionally, the chip bonding device 100 may also include a lifting mechanism (not shown in the drawings), which can be used to drive the bonding head 110 to move in the z-axis direction, that is, to lift the bonding head 110 so that the bonding head 110 can approach the target bonding position and bond the chip 210 to the target bonding position. Finally, after completing the bonding of the chip 210 to the wafer 220, the bonding head 110 descends to avoid, so as to facilitate the subsequent processing of the bonded chip and wafer.

[0083] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0084] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0085] The various illustrative logic modules and circuits described in conjunction with the embodiments disclosed herein may be implemented or executed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in cooperation with a DSP core, or any other such configuration.

[0086] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0087] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0088] In summary, the present invention provides a chip bonding device, a chip bonding method, and a computer-readable storage medium, which can avoid the additional errors caused by using a calibration sheet as an intermediate medium in the bonding process, improve the bonding accuracy, simplify the bonding process, thereby improving the bonding efficiency and enhancing the equipment production capacity.

[0089] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip bonding device, characterized in that: include: The bonding head is used to absorb the chip to be bonded and adjust its posture; an infrared vision system for penetrating the chip to capture an image of a first mark on the back side of the chip and a second mark at a target bonding position of the chip; as well as A controller is configured to: acquire an image with the first marker and the second marker via the infrared vision system; analyze the image to determine the positions of the first marker and the second marker in the image; According to the difference in postures of the first mark and the second mark in the image, the posture of the bonding head is adjusted to align the chip with the target bonding position; and the chip is bonded to the target bonding position via the bonding head.

2. The chip bonding device according to claim 1, characterized in that: The depth of field of the infrared vision system is smaller than the distance from the chip to the target bonding position, and the infrared vision system first focuses on the first mark to acquire a first image including the first mark, and then focuses on the second mark to acquire a second image including the second mark, so that the controller can respectively determine the position and posture of the first mark in the first image and the position and posture of the second mark in the second image, or The depth of field of the infrared vision system is greater than or equal to the distance from the chip to the target bonding position, and the infrared vision system captures a third image that includes both the first mark and the second mark, so that the controller can simultaneously determine the positions of the first mark and the second mark in the third image.

3. The chip bonding device according to claim 2, characterized in that: The controller is further configured to: When the distance from the chip to the target bonding position is greater than the depth of field of the infrared vision system, controlling the infrared vision system to respectively capture the first image and the second image, so as to roughly adjust the posture of the bonding head according to the posture of the first mark in the first image and the posture of the second mark in the second image; Controlling the bonding head to lift the chip to approach the target bonding position; as well as After the distance from the chip to the target bonding position is less than or equal to the depth of field of the infrared vision system, the infrared vision system is controlled to capture a third image containing both the first mark and the second mark, so as to finely adjust the posture of the bonding head according to the postures of the first mark and the second mark in the third image.

4. The chip bonding device according to claim 2, characterized in that: The infrared vision system also includes an adjustment module for focusing the first mark and / or the second mark respectively to capture clear images thereof.

5. The chip bonding device according to claim 1, characterized in that: The back side of the chip is provided with a plurality of the first marks, and the target bonding position is correspondingly provided with a plurality of the second marks, and the controller is further configured as follows: Determining translation adjustment amounts of the bonding head in the X direction and the Y direction in the horizontal plane according to a position difference between at least one of the first marks and its corresponding second mark in the image; determining a rotation adjustment amount of the bonding head in the Rz direction in the horizontal plane according to a position difference between the plurality of first marks and the plurality of second marks corresponding thereto in the image; as well as The position and posture of the bonding head are adjusted according to the translation adjustment amount and the rotation adjustment amount so that the chip is aligned with the target bonding position.

6. The chip bonding device according to claim 5, characterized in that: Also includes: A translation adjustment mechanism, connected to the controller, for adjusting the position of the bonding head in the horizontal plane according to the translation adjustment amount; as well as A rotation adjustment mechanism is connected to the controller and is used to adjust the first posture of the bonding head in the horizontal plane according to the rotation adjustment amount.

7. The chip bonding device according to claim 5, characterized in that: The detection surface of the infrared vision system is parallel to the plane where each of the second marks is located, and the controller is further configured as follows: parsing the image to determine a first imaging length of one of the first marks in the X direction, and determining a second imaging length of another of the first marks in the X direction, wherein the two first marks are distributed along the Y direction and have the same real length; Determining a first inclination angle of the back side of the chip relative to the plane where the second marks are located according to a difference between the first imaging length and the second imaging length and a distance between two first marks along the Y direction; and A first tilt adjustment amount of the bonding head in the Rx direction is determined according to the first tilt angle.

8. The chip bonding device according to claim 7, characterized in that: The controller is also configured to: parsing the image to determine a third imaging length of one of the first marks in the Y direction, and determining a fourth imaging length of another of the first marks in the Y direction, wherein the two first marks are distributed along the X direction and have the same real length; Determining a second inclination angle of the back side of the chip relative to the plane where the second marks are located according to a difference between the third imaging length and the fourth imaging length and a distance between two first marks along the X direction; and A second tilt adjustment amount of the bonding head in the Ry direction is determined according to the second tilt angle.

9. The chip bonding device according to claim 8, characterized in that: Also includes: A tilt adjustment mechanism is connected to the controller and is used to level the bonding head according to the first tilt adjustment amount and / or the second tilt adjustment amount.

10. The chip bonding device according to claim 5, characterized in that: The infrared vision system includes a plurality of detection modules, each of which is used to collect images of the corresponding at least one first mark and at least one second mark.

11. The chip bonding device according to claim 1, characterized in that: Also includes: The lifting mechanism is used to lift the bonding head so that the bonding head is close to the target bonding position and bonds the chip to the target bonding position.

12. The chip bonding device according to claim 1, characterized in that: The target bonding position includes a patch area reserved on a wafer to be bonded, and the chip bonding device also includes: The wafer chuck is used to absorb the wafer so as to cooperate with the bonding head to bond the chip to the patch area reserved thereon.

13. A chip bonding method, characterized in that: The following steps are involved: Adsorbing the chip to be bonded by the bonding head of the chip bonding device according to any one of claims 1 to 12; Penetrating the chip via an infrared vision system of the chip bonding device to collect an image of a first mark on the back side of the chip and a second mark at a target bonding position of the chip; Parsing the image to determine the poses of the first marker and the second marker in the image; According to the difference in postures of the first mark and the second mark in the image, adjusting the posture of the bonding head so that the chip is aligned with the target bonding position; as well as The chip is bonded to the target bonding position via the bonding head.

14. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the chip bonding method according to claim 13 is implemented.

Images