On-site data acquisition gateway

Abstract

The invention discloses an on-site data acquisition gateway, which comprises a shell, a main control board, a power supply module, an interface array, a cooling assembly, a buffer assembly, a sealing assembly and an electromagnetic shielding layer, an accommodating cavity is formed in the shell, and a functional opening is formed in the shell; the main control board is arranged in the accommodating cavity; the power supply module is arranged in the accommodating cavity; the interface array is embedded in the interface array opening; the cooling assembly comprises a fan, heat dissipation fins, a flat heat pipe and a circulating water path, a first plate part of the flat heat pipe abuts against the main control board and the power module, a second plate part of the flat heat pipe is embedded in the heat dissipation opening, the circulating water path is arranged in the heat dissipation fins, one side of each heat dissipation fin abuts against the second plate part, and the other side of each heat dissipation fin is fixedly connected with the fan; a plurality of oil buffers of the buffer assembly are fixedly connected with the main control board and the shell respectively; a plurality of sealing pieces of the sealing assembly are respectively arranged at the functional openings; and the electromagnetic shielding layers are uniformly distributed along the inner wall of the shell.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial field data acquisition devices, and in particular to a field data acquisition gateway. Background Art

[0002] In all aspects of modern manufacturing, intelligent manufacturing technologies (such as big data analysis and prediction) are needed to improve output efficiency and product competitiveness, including product development, process optimization, quality control, logistics planning and other manufacturing aspects. Data collection and data collection gateways are indispensable technical links in intelligent manufacturing. Data collection is a necessary technology for realizing industrial interconnection 4.0 intelligent manufacturing, and is a bridge connecting manufacturing site equipment and data use terminals. At this stage, data collection mostly relies on data collection gateways. Data collection gateways are data communication devices that parse, transform, and collect discrete data in industrial sites. The transformed data can meet the needs of commonly used terminal data use. Therefore, data collection gateways are indispensable in the field of intelligent manufacturing, especially in recent years. The rapid development of industrial interconnection technology has made the role of data collection gateways more and more prominent.

[0003] After investigating several mainstream auto parts suppliers, the following conclusions were drawn: According to the data collection method, the key production and operation data in the equipment terminal can be divided into six categories, namely open source PLC, special equipment, closed source industrial computer, image, sensor, and manual recording. The first five categories are automatically collected data, accounting for about 97%, which are the main target objects for data collection gateways. However, the hardware interfaces, transmission protocols, data storage forms, etc. of the above five target objects are diverse, which greatly increases the difficulty and cost of data collection.

[0004] Currently, there are relatively few data collection gateways available for commercial application, and the existing ones can be divided into the following three categories: data collection gateways that are customized for each data collection object, but have high development costs and low deployment efficiency; data collection gateways that come with the device or are brand-matched, which are often expensive and not universal and have serious limitations; data collection gateways developed by third parties based on the data communication protocols they master, which are only applicable to specific types of equipment and also have disadvantages such as high cost and strong limitations.

[0005] The above three data acquisition gateways have a common disadvantage, that is, they have high requirements for the use environment, high failure rate, and cannot be used for a long time in complex industrial environments such as high temperature, high humidity, high salt, and high acid. In summary, the existing data acquisition gateways have the following obvious disadvantages: high cost; low deployment efficiency; strong limitations, still need to be used in combination with customized development; poor environmental adaptability and high failure rate. The above disadvantages have led to data acquisition occupying a large amount of the cost budget of the entire digital factory development at this stage. Summary of the invention

[0006] To solve at least one aspect of the above problems, the present invention provides a data acquisition gateway for field use, comprising: a shell, the interior of the shell has a accommodating cavity, the shell is provided with functional openings, the functional openings include an interface array opening, a power supply opening, a heat dissipation opening and a buffer opening, the interface array opening is opened on the front side plate of the shell, the power supply opening is opened on the rear side plate of the shell, the heat dissipation opening is opened on the left side plate of the shell, and the buffer opening is opened on the bottom plate of the shell; a main control board, the main control board is arranged in the accommodating cavity; a power module, the power module is arranged in the accommodating cavity, the power module is electrically connected to the main control board; an interface array, the interface array is embedded in the interface array opening, the interface array is electrically connected to the main control board; a cooling component, the cooling component includes a fan, a heat dissipation fin, a flat heat pipe, a circulating water circuit, the The flat plate heat pipe includes a first plate portion and a second plate portion which are perpendicular to each other, the first plate portion is arranged parallel to the main control board, and the first plate portion is abutted against the main control board and the power module, the second plate portion is embedded in the heat dissipation opening and tightly fits the heat dissipation opening, the second plate portion is parallel to the left side plate of the shell, the circulating water path is arranged in the heat dissipation fins, one side of the heat dissipation fins is abutted against the second plate portion, and the other side of the heat dissipation fins is fixedly connected to the fan; a buffer assembly, the buffer assembly includes a plurality of oil pressure buffers, the plurality of oil pressure buffers respectively extend from the bottom plate of the shell into the accommodating cavity, and the top ends of the plurality of oil pressure buffers are respectively fixedly connected to the main control board; a sealing assembly, the sealing assembly includes a plurality of seals, and the plurality of seals are respectively arranged at the functional opening; an electromagnetic shielding layer, the electromagnetic shielding layer is evenly distributed along the inner wall of the shell.

[0007] Preferably, it further comprises a display, the display is electrically connected to the main control board, the top plate of the shell is provided with a display opening, and the display is embedded in the display opening.

[0008] Preferably, it further comprises a switch module, the switch module is electrically connected to the main control board, the top plate of the shell is provided with a switch opening, the switch module is embedded in the switch opening, and the switch module adopts.

[0009] Preferably, the power module includes a plug-in power supply and a rechargeable battery, the plug-in power supply is electrically connected to the rechargeable battery, and the rechargeable battery is electrically connected to the main control board.

[0010] Preferably, it further comprises a solar energy component, wherein the solar energy component is arranged outside the right side plate of the shell, and the solar cell panel is electrically connected to the rechargeable battery.

[0011] Preferably, the water inlet and the water outlet of the circulating water circuit are respectively arranged at two ends of the heat dissipation fins.

[0012] Preferably, the sealing assembly further comprises a blocking piece, and the blocking piece is used for snapping the interface array.

[0013] Preferably, the main control board includes a central CPU, a network card drive controller, a Bluetooth drive controller, a level signal microprocessor, a network drive controller, a power control circuit, a camera drive controller and a memory.

[0014] Preferably, the shell comprises a structural layer and an anti-corrosion layer, and the anti-corrosion layer uniformly covers the outer surface of the structural layer.

[0015] The data acquisition gateway for on-site use of the present invention has the following beneficial effects: an integrated data acquisition gateway suitable for a variety of industrial scenarios is realized by carrying a preset acquisition program on the main control board, changing the disadvantage that the existing data acquisition gateway can only perform one-to-one acquisition, and adopting a one-to-many simultaneous acquisition mode, which has strong adaptability, reduces the difficulty of promoting data acquisition, can perform data acquisition efficiently and at low cost, improves data acquisition efficiency, and reduces the deployment cost of data acquisition; and, the anti-corrosion layer of the shell enables the gateway to be used in complex and changeable industrial environments, and has functions such as waterproofing, high temperature resistance, dustproofing, and corrosion resistance, thereby improving the service life and stability of the equipment; at the same time, the cooperation of the main control board and the external interface array has a secondary development function, which can cover actual industrial production scenarios more widely, realize multiple uses of one machine, and improve the compatibility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to better understand the above and other purposes, features, advantages and functions of the present invention, reference may be made to the embodiments shown in the accompanying drawings. The same reference numerals in the accompanying drawings refer to the same components. It should be understood by those skilled in the art that the accompanying drawings are intended to schematically illustrate the preferred embodiments of the present invention and have no limiting effect on the scope of the present invention, and the components in the drawings are not drawn to scale.

[0017] Figure 1 It shows a schematic diagram of the structure of a data acquisition gateway used on-site according to an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the structure of an electromagnetic shielding layer of a data acquisition gateway used on-site according to an embodiment of the present invention is shown;

[0019] Figure 3 A schematic diagram of the internal structure of a receiving cavity of a data acquisition gateway for on-site use according to an embodiment of the present invention is shown;

[0020] Figure 4A schematic diagram of the heat dissipation fins and circulating water circuit structure of a data acquisition gateway for use on-site according to an embodiment of the present invention is shown;

[0021] Figure 5 A schematic diagram of the sealing component setting of a data acquisition gateway for use on site according to an embodiment of the present invention is shown.

[0022] Reference numerals:

[0023] 11. Shell 11; 12. Cooling assembly; 121. Fan; 122. Heat dissipation fins; 123. Flat heat pipe; 124. Circulating water circuit; 13. Sealing assembly; 14. Buffer assembly; 15. Electromagnetic shielding layer; 211. Plug-in power supply; 212. Rechargeable battery; 213. Solar panel; 22. Switch module; 23. Interface array; 24. Display; 25. Main control board. DETAILED DESCRIPTION

[0024] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0025] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0026] In order to at least partially solve one or more of the above-mentioned problems and other potential problems, an embodiment of the present disclosure proposes a data acquisition gateway for field use, comprising: a shell 11, a main control board 25, a power module, an interface array 23, a cooling component 12, a sealing component 13, a buffer component 14, and an electromagnetic shielding layer 15; the shell 11 has an accommodating cavity inside, and functional openings are opened on the shell 11, and the functional openings include an interface array 23 opening, a power opening, a heat dissipation opening and a buffer opening, the interface array 23 opening is opened on the front side plate of the shell 11, the power opening is opened on the rear side plate of the shell 11, the heat dissipation opening is opened on the left side plate of the shell 11, and the buffer opening is opened on the bottom plate of the shell 11; the main control board 25 is arranged in the accommodating cavity; the power module is arranged in the accommodating cavity, and the power module is electrically connected to the main control board 25; the interface array 23 is embedded in the opening of the interface array 23, and the interface array 23 is electrically connected to the main control board 25; the cooling component 12 It includes a fan 121, a heat dissipation fin 122, a flat plate heat pipe 123, and a circulating water circuit 124. The flat plate heat pipe 123 includes a first plate portion and a second plate portion which are perpendicular to each other. The first plate portion is arranged parallel to the main control board 25, and the first plate portion abuts against the main control board 25 and the power module. The second plate portion is embedded in the heat dissipation opening and fits the heat dissipation opening. The second plate portion is parallel to the left side plate of the shell 11. The circulating water circuit 124 is arranged in the heat dissipation fin 122, one side of the heat dissipation fin 122 abuts against the second plate portion, and the other side of the heat dissipation fin 122 is fixedly connected to the fan 121; the buffer assembly 14 includes a plurality of oil pressure buffers, and the plurality of oil pressure buffers extend into the accommodating cavity from the bottom plate of the shell 11 respectively, and the top ends of the plurality of oil pressure buffers are fixedly connected to the main control board 25 respectively; the sealing assembly 13 includes a plurality of seals, and the plurality of seals are respectively arranged at the functional openings; the electromagnetic shielding layer 15 is a closed cavity structure, and the electromagnetic shielding layer 15 is evenly distributed along the inner wall of the shell 11.

[0027] Specifically, Figure 1-Figure 5 As shown, the shell 11 adopts a cubic structure, and the front side plate, left side plate, rear side plate and right side plate of the shell 11 are fixedly connected in sequence, and the top plate and the bottom plate are fixedly connected to the top and bottom of each side plate, respectively, so that a closed accommodating cavity is formed inside the shell 11, and the fixed connection between the external device and the shell 11 is realized by opening a functional opening on the shell 11. The external device includes an interface array 23, a cooling component 12, a buffer component 14, a display 24, a switch module 22, etc. In some embodiments, the shell 11 includes a structural layer and an anti-corrosion layer. The structural layer is a supporting structure of the shell 11, and is made of high-strength engineering plastics, high-strength metals, etc. to prevent the shell 11 from deformation; the anti-corrosion layer is evenly covered on the outer surface of the structural layer, and the anti-corrosion layer adopts anti-corrosion paint to prevent the shell 11 from being corroded in the working environment.

[0028] The main control board 25 is the core of the gateway body function operation, similar to a microcomputer, and includes a variety of microprocessors inside to support the gateway body data acquisition function. The various microprocessors include a central CPU, a network card driver controller, a Bluetooth driver controller, a level signal microprocessor, a network driver controller (such as 4G network, 5G network, etc.), a power control circuit, a camera driver controller, memory and other support circuits. The operating system of the gateway body runs on the main control board 25, and the data acquisition, data processing, and data transmission programs run in the built-in programs on the operating system. In actual applications, the main control board 25 can use an existing commercial microcomputer, such as a Raspberry Pi 4B control board.

[0029] The main control board 25 includes a communication module, and the main control board 25 is connected to a host computer via the communication module. The host computer may be a PC, a cloud, or a mobile terminal.

[0030] The main control board 25 includes a data acquisition system, which includes a data acquisition module. The data acquisition module includes a plurality of preset acquisition parameters, which correspond to a plurality of target acquisition devices one by one. The plurality of preset acquisition parameters include CPU hardware information such as IP address, port number, stack number, slot number, program information such as data type, data address, and acquisition frequency of the target acquisition device. The preset acquisition parameters are used to realize the acquisition of designated data of the target acquisition device by the data acquisition module. The plurality of preset acquisition parameters are pre-stored in the data acquisition module of the main control board 25. The plurality of target acquisition devices include open source PLC devices, special equipment, closed source industrial computers or control motherboards, sensor devices, and image recognition devices, etc. The data acquisition module includes a plurality of data acquisition units, and the plurality of data acquisition units realize data acquisition of the target acquisition device based on the corresponding preset acquisition parameters.

[0031] In another embodiment, the main control board 25 receives the preset acquisition parameters online by connecting to the host computer. The main control board 25 sets the preset acquisition parameters of the data acquisition module online by connecting to the computer software (i.e., the host computer), and downloads them to the data acquisition module of the main control board 25. The data acquisition module will run according to the set program to realize data acquisition. For example, in the preset acquisition parameter setting of the target acquisition device, the preset acquisition parameters of the target acquisition device can be set in the computer software and downloaded to the network main control board 25 for operation. For example, if the data of Siemens S7 1200 PLC is to be collected, the CPU hardware information such as the IP address, port number, stack number, slot number of the PLC, the PLC program information such as the data type and data address, and the data acquisition elements such as the acquisition frequency can be downloaded to the main control board 25, so that the main control board 25 can collect the above specified data information.

[0032] The data acquisition system also includes a self-check module, which is used to initialize and check whether the hardware of the gateway is normal, and send an alarm signal when an abnormality occurs. In the functional self-check of the gateway body, the computer software can be used to view and analyze the structure of the gateway body self-check, obtain the self-check message, and analyze the cause of the gateway body failure.

[0033] The data acquisition system also includes gateway parameters, which include data acquisition module startup parameters, data acquisition module stop parameters, data sending and receiving addresses, data sending and receiving frequencies, data sending and receiving fields, etc.

[0034] The data acquisition system includes a system update module, which receives system update parameters by connecting to the host computer. The system update parameters are data acquisition parameters for updating the target acquisition device. The secondary development of the data acquisition function of the main control board 25 is realized through the system update module. The computer-side software and the system update module cooperate with each other to add data acquisition parameters of devices not involved in the program of the original data acquisition module. The system update module supports secondary development. If the built-in program cannot cover the acquired device, the developer can manually add the acquisition program to achieve functional expansion.

[0035] The main control board 25 supports secondary development for new data acquisition scenarios by loading an embedded data acquisition system. The computer software has built-in communication protocols and communication parameter setting interfaces for a variety of industrial equipment, which can realize one-to-many acquisition. At the same time, data acquisition equipment can be customized according to user needs. At the same time, the computer software also supports the setting of the data sending function of the gateway body, as well as the management of the self-diagnosis and alarm signals of the gateway body hardware equipment.

[0036] The power module includes a plug-in power supply 211, and the power module is used to provide power supply for the main control board 25. Other electrical components of the data acquisition gateway are electrically connected to the power module by connecting to the main control board 25. The power opening is used to set a power connector, which is embedded in the power opening, and the power module is connected to an external power supply system through the power connector. In some embodiments, the power module is fixedly arranged on the main control board 25.

[0037] The interface array 23 is the key interface for data collection and is the interface for interacting with the target collection device. Due to the large number of industrial field devices and various interface forms, the interface array 23 integrates different data interfaces together, such as RJ45 network port, USB, mini USB, Type-C, RS232 / RS485 / RS422, level signal, etc. The data interfaces can run simultaneously, so that one gateway can collect data from multiple devices. At the same time, the multi-interface array 23 supports extended interfaces, such as external cameras, to expand data collection capabilities. The shell 11 and the interface array 23 are relatively fixedly connected by embedding the interface array 23 in the opening of the interface column. The interface array 23 is connected to the main control board 25 through the built-in circuit. The built-in circuit is set in the accommodating cavity to connect the interface array 23 and the main control board 25.

[0038] The cooling component 12 is used to dissipate the heat generated by the main control board 25 and the power module to the outside to ensure the normal operation of the main control board 25 and the power module. Since the shell 11 is a sealed design, if the cooling component 12 is missing, the high heat generated by the main control board 25 and the power module during operation will easily damage the microcontroller on the main control board 25.

[0039] The first plate portion and the second plate portion of the flat plate heat pipe 123 adopt an integrally formed structure. The first plate portion of the flat plate heat pipe 123 is arranged in parallel above the main control board 25 and the power module. The heat conduction between the cooling assembly 12 and the main control board 25 and the power module is realized by abutting against the main control board 25 and the power module. The second plate portion is embedded in the heat dissipation opening. The second plate portion and the heat dissipation fin 122 are abutted to realize heat conduction. The fan 121 is arranged on the other side of the heat dissipation fin 122 to realize cooling of the heat dissipation fin 122. By respectively arranging the fan 121 and the second plate portion on both sides of the heat dissipation fin 122, the temperature difference on both sides of the heat dissipation fin 122 is increased, thereby accelerating the cooling. In some embodiments, the cooling assembly 12 also includes a heat conduction medium, and the heat conduction medium adopts a heat conduction gel. The heat conduction gel is used to connect the flat plate heat pipe 123 with the heating element and the heat dissipation fin 122 on the main control board 25.

[0040] The specific working principle of the cooling component 12 is to use the flat heat pipe 123 to quickly conduct heat. When working, the first plate portion of the flat heat pipe 123 is in contact with the heating element (such as a microcontroller and a rechargeable lithium battery) on the main control board 25, and the second plate portion of the flat heat pipe 123 is in contact with the heat dissipation fin 122. Since the heat dissipation fin 122 is connected to the heat dissipation fan 121, the circulating water circuit 124 and other enhanced heat convection equipment, the heat dissipation fin 122 can be maintained at a relatively low temperature, so that the heat is quickly conducted from the main control board 25 and the power module along the flat heat pipe 123 to the end of the heat dissipation fin 122, and further dissipated to the outside of the shell 11, so as to achieve rapid cooling of the inside of the mesh shell 11, maintain it in a stable temperature range, and delay the service life of the equipment.

[0041] The heat dissipation power, appearance size, material and other parameters of the flat heat pipe 123 mentioned above can be selected according to the heat generation power of the heating components such as the main control board 25 and the power module.

[0042] The sealing assembly 13 isolates the interior of the housing 11 from the external environment (eg Figure 5 As shown), it plays the role of dustproof, waterproof, and pollution-proof. The sealing component 13 is composed of sealing structures distributed in various parts of the shell 11, including sealing structures existing in the opening position where the shell 11 is connected to the internal structure, such as the inner side of the heat dissipation fin 122, the fixed end of the oil pressure buffer of the buffer component 14, the inner side of the display 24, and the installation and disassembly positions of the side panels, top panels, and bottom panels of the shell 11. The sealing component 13 can select suitable sealing materials according to actual needs, such as polytetrafluoroethylene, silicone gaskets, etc. Regardless of the sealing material, all similar sealing structures are within the scope of the present invention.

[0043] The buffer assembly 14 is used to fix the main control board 25 into the accommodating cavity in the housing 11 (such as Figure 3 As shown in the figure, the buffer assembly 14 is composed of a plurality of oil pressure buffers. When the gateway receives a severe impact, the buffer assembly 14 can effectively absorb the impact and prevent the main control board 25 from being damaged. Among them, the plurality of oil pressure buffers are screwed and fixed to the bottom plate of the shell 11 through threads. The plurality of oil pressure buffers are adjustable devices. By adjusting the oil pressure buffers, the distance between the main control board 25 and the bottom plate can be adjusted, thereby achieving free contact (i.e., abutment) between the heating element on the main control board 25 and the flat heat pipe 123. In this case, the oil pressure buffer is in a slightly compressed state to ensure a good heat transfer effect.

[0044] The electromagnetic shielding layer 15 is located on the inner side of the shell 11 and the outer side of the main control board 25. The electromagnetic shielding layer 15 is generally made of metal with electromagnetic shielding function, such as iron, nickel-iron alloy, etc., and is evenly distributed on the inner side of the shell 11. It can be in a mesh structure or a parallel structure, so that a complete electromagnetic isolation space is formed inside the gateway body; because the electromagnetic shielding layer 15 isolates the electromagnetic signal, the module on the main control board 25 that needs to receive and transmit signals wirelessly will be carried out through an external antenna, and the external antenna is connected to the inside of the shell 11 through the external interface array 23.

[0045] In some embodiments, a display 24 is also included, and the display 24 is electrically connected to the main control board 25. The top plate of the shell 11 is provided with an opening for the display 24, and the display 24 is embedded in the opening of the display 24.

[0046] Specifically, Figure 1 and Figure 3 As shown, the display 24 is a touch screen, and the display 24 is electrically connected to the main control board 25 to combine the data acquisition status, data acquisition results and data acquisition unit operation status. In some embodiments, the display 24 main controller receives self-diagnosis results and alarm information, etc. The sealing assembly 13 also includes a display 24 opening seal, which is used to achieve sealing at the connection between the display 24 and the housing 11.

[0047] In some embodiments, a switch module 22 is further included. The switch module 22 is electrically connected to the main control board 25. A switch opening is opened on the top plate of the housing 11, and the switch module 22 is embedded in the switch opening.

[0048] Specifically, Figure 1 and Figure 3 As shown, the switch module 22 is used to control the start or shut down of each system and functional module on the main controller board, or to switch each system and functional module on the main control board 25. The switch module 22 also includes an indicator light, which indicates that it is electrically connected to the main control board 25. The indicator light of the switch module 22 is used to indicate the working status of the gateway body. The switch modules 22 all use concealed switches to prevent dust and water from entering. The sealing assembly 13 also includes a switch opening seal, which is used to seal the connection between the switch module 22 and the housing 11.

[0049] In some embodiments, the power module includes a plug-in power supply 211 and a rechargeable battery 212 , the plug-in power supply 211 is electrically connected to the rechargeable battery 212 , and the rechargeable battery 212 is electrically connected to the main control board 25 .

[0050] Specifically, Figure 1-Figure 3As shown, the power module includes a plug-in power supply 211 and a rechargeable lithium battery, wherein the plug-in power supply 211 can directly power the data acquisition gateway used on-site, and can charge the rechargeable lithium battery; the rechargeable lithium battery is used when the data acquisition gateway used on-site is away from the power supply, or it can maintain a working state after a short power outage, and supports emergency operations such as power-off resumption, data preservation, parameter preservation, and alarm after the data acquisition gateway used on-site is powered off.

[0051] In some embodiments, a solar energy component is further included. The solar energy component is disposed outside the right side panel of the housing 11 , and the solar cell panel 213 is electrically connected to the rechargeable battery 212 .

[0052] Specifically, Figure 1-Figure 3 As shown, the solar energy component includes a solar cell panel 213. By setting up the solar energy component, the data acquisition gateway used on-site can be powered by solar energy when used outside. At the same time, the rechargeable lithium battery is charged through the solar cell panel 213 to reduce the energy consumption of the equipment.

[0053] In some embodiments, the water inlet and the water outlet of the circulating water circuit 124 are respectively disposed at two ends of the heat dissipation fins 122 .

[0054] Specifically, Figure 4 As shown, the circulating water circuit 124 is evenly built into the heat sink fins 122 and evenly abuts against the heat sink fins 122. One end of the circulating water circuit 124 enters the water inlet and the other end is the water outlet. The pipes of the circulating water circuit 124 are made of heat-conducting material. The function of the circulating water circuit 124 is that when the gateway body is in a high-temperature and high-humidity industrial environment, the heat dissipation power of the heat sink fins 122 and the heat sink fan 121 will not be able to meet the heat dissipation requirements of the gateway body. Therefore, external cold water or other cooling media are required to assist the heat sink fins 122 and the main control board 25 and the power module to quickly cool down, to ensure that the main control board 25 and the power module can work normally under high temperature and high humidity conditions, to meet the complex and changeable industrial environment requirements; and when the data acquisition gateway used on-site is in a normal temperature working environment, the circulating water circuit 124 can be vacant.

[0055] In some embodiments, the sealing assembly 13 further includes a plugging member, which is used for the snap-fit ​​interface array 23 .

[0056] Specifically, the sealing component 13 also includes an external protective plugging piece of the interface array 23. When the external interface array 23 is not connected, the protective plugging piece should be used to seal each interface of the interface array 23. When connecting a data acquisition device, the sealing process should be performed after the connection is successful.

[0057] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the present invention.

Claims

1. A data acquisition gateway for on-site use, characterized in that: include: A housing, wherein the housing has a receiving cavity therein, and functional openings are provided on the housing, wherein the functional openings include an interface array opening, a power supply opening, a heat dissipation opening, and a buffer opening, wherein the interface array opening is provided on a front side plate of the housing, the power supply opening is provided on a rear side plate of the housing, the heat dissipation opening is provided on a left side plate of the housing, and the buffer opening is provided on a bottom plate of the housing; A main control panel, the main control panel being arranged in the accommodating cavity; A power module, the power module is arranged in the accommodating cavity, and the power module is electrically connected to the main control board; An interface array, wherein the interface array is embedded in the interface array opening and the interface array is electrically connected to the main control board; A cooling component, the cooling component includes a fan, a heat dissipation fin, a flat plate heat pipe, and a circulating water circuit, the flat plate heat pipe includes a first plate portion and a second plate portion perpendicular to each other, the first plate portion is arranged parallel to the main control board, and the first plate portion abuts against the main control board and the power module, the second plate portion is embedded in the heat dissipation opening and closes the heat dissipation opening, the second plate portion is parallel to the left side plate of the shell, the circulating water circuit is arranged in the heat dissipation fin, one side of the heat dissipation fin abuts against the second plate portion, and the other side of the heat dissipation fin is fixedly connected to the fan; A buffer assembly, the buffer assembly comprising a plurality of oil pressure buffers, the plurality of oil pressure buffers respectively extending from the bottom plate of the housing into the accommodating cavity, and the top ends of the plurality of oil pressure buffers respectively fixedly connected to the main control board; A sealing assembly, the sealing assembly comprising a plurality of sealing members, wherein the plurality of sealing members are respectively arranged at the functional openings; An electromagnetic shielding layer is evenly distributed along the inner wall of the shell.

2. The gateway according to claim 1, characterized in that: It also includes a display, which is electrically connected to the main control board. The top plate of the shell is provided with a display opening, and the display is embedded in the display opening.

3. The gateway according to claim 2, characterized in that: It also includes a switch module, which is electrically connected to the main control board. The top plate of the shell is provided with a switch opening, and the switch module is embedded in the switch opening. The switch module adopts.

4. The gateway according to claim 1, characterized in that: The power module comprises a direct-plug power supply and a rechargeable battery, wherein the direct-plug power supply is electrically connected to the rechargeable battery, and the rechargeable battery is electrically connected to the main control board.

5. The gateway according to claim 4, characterized in that: It also includes a solar energy component, which is arranged outside the right side plate of the shell, and the solar cell panel is electrically connected to the rechargeable battery.

6. The gateway according to claim 1, characterized in that: The water inlet and the water outlet of the circulating water circuit are respectively arranged at two ends of the heat dissipation fins.

7. The gateway according to claim 1, characterized in that: The sealing assembly also includes a blocking piece, which is used to snap onto the interface array.

8. The gateway according to claim 1, characterized in that: The main control board includes a central CPU, a network card drive controller, a Bluetooth drive controller, a level signal microprocessor, a network drive controller, a power control circuit, a camera drive controller and a memory.

9. The gateway according to claim 1, characterized in that: The shell comprises a structural layer and an anti-corrosion layer, and the anti-corrosion layer uniformly covers the outer surface of the structural layer.

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