Manufacturing method of matrix lamp group module type rigid-flexible combined board

Abstract

The invention discloses a manufacturing method of a matrix lamp group module type rigid-flexible combined board, which comprises the following steps of: sequentially manufacturing a surface circuit pattern and a solder resist windowing pattern on a rigid board, and taking the surface circuit pattern in the range of the solder resist windowing pattern as a welding circuit pattern; a flexible copper-clad plate is taken to manufacture a circuit pattern, and a circuit pattern core plate is formed; taking a first cover film to manufacture a windowing pattern, pasting the windowing pattern to the circuit pattern core board, and then manufacturing a hollow circuit pattern to form a film-pasted flexible board; a plurality of stainless steel reinforcements are manufactured on the film-pasted flexible plate to form a flexible unit plate; the welding circuit pattern and the hollowed-out windowing pattern are aligned, overlapped and welded to form a rigid-flex board; the rigid-flex printed circuit board is split into a plurality of modules and independently processed, so that the processing flow is shortened, and the processing difficulty is reduced; the flexible plate and the rigid plate are fixed through welding, and the flexible plate and the heat dissipation module are connected through magnetic attraction, so that when a local fault occurs, a relatively independent problem is formed, mutual influence is avoided, and the maintenance difficulty and cost are reduced.

Description

Technical Field

[0001] The present invention relates to the field of rigid-flexible circuit board manufacturing, and in particular to a method for manufacturing a matrix lamp group modular rigid-flexible circuit board. Background Art

[0002] Rigid-flex PCBs are widely used in power modules, automotive lighting systems and other fields because they have the characteristics of both rigid and flexible boards and can meet the needs of complex circuit design.

[0003] With the development of the intelligent connected car industry, car lights are also showing a multifunctional and interactive development trend. Therefore, some car light modules have set the matrix LED light group on the rigid-flexible board, using the bendability of the flexible board to realize the non-planar design of the light group, and matching the heat dissipation module to dissipate the large heat generated when the light group is working. The rigid board realizes the function control and adjusts the LED light group to achieve different display requirements.

[0004] The existing technology for making a rigid-flexible board for a vehicle light module is as follows: the core boards of each unit are pressed together into a board, and then the cover is removed to expose the flexible core board layer to form a rigid-flexible board. The heat dissipation requirement is achieved by burying a copper block; or the flexible board and the rigid board are pressed together to form a whole board, and then the cover is removed to expose the flexible core board layer, and finally the heat dissipation module is pasted to the back of the board corresponding to the light group to form a rigid-flexible board.

[0005] However, the above two existing production methods have the following problems:

[0006] (1) The rigid-flexible board is pressed and formed as a whole, and the heat dissipation component is pasted on the back of the flexible board, so that the heat dissipation component, the flexible board and the rigid board form a whole. As a result, when the lamp group module or the heat dissipation module fails, the entire board needs to be replaced, which makes maintenance difficult and the maintenance cost high;

[0007] (2) Embedding copper blocks on the circuit board to achieve heat dissipation has high processing costs and difficulty, and will increase the circuit board area, which is not conducive to installation and application;

[0008] (3) When the flexible board is used on a non-planar surface, the heat dissipation components need to be pasted to the surface of the flexible board to form a corresponding non-planar structure, which makes pasting more difficult and makes the application of rigid-flexible boards difficult.

[0009] Therefore, in order to solve the problems raised by the above background technology, it is necessary to provide a method for manufacturing a modular rigid-flexible board of a matrix lamp group. Summary of the invention

[0010] The present invention aims to solve the problem that the thick copper strong current-carrying rigid-flexible junction board in the prior art requires a thin board body and strong current-carrying performance, and proposes a method for manufacturing a matrix lamp group modular rigid-flexible junction board, the manufacturing method comprising the following steps:

[0011] S10: taking a rigid board and sequentially manufacturing a surface circuit pattern and a solder resist window pattern, wherein the surface circuit pattern within the range of the solder resist window pattern is a welding circuit pattern, and forming a rigid unit board;

[0012] S20: Take a flexible copper clad laminate to make a circuit pattern to form a circuit pattern core board; take a first covering film to make a window pattern to form a window covering film, attach the window covering film to the surface of the circuit pattern core board, and then make a hollow circuit pattern to form a film-attached flexible board; the window pattern corresponds to the area of ​​the hollow circuit pattern; make a number of stainless steel reinforcements on the surface of the film-attached flexible board, and arrange them into matrix reinforcements; take a second covering film to make a reinforcement window pattern corresponding to the number of stainless steel reinforcements, and attach it to the area of ​​the matrix reinforcement to form a flexible unit board;

[0013] S30: Aligning and overlapping the welding circuit pattern and the hollow window pattern to form the rigid-flexible board.

[0014] Furthermore, the film-coated flexible board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the window covering film; the window covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollow circuit pattern is produced on the circuit pattern core board in the window pattern area.

[0015] Furthermore, the film-coated flexible board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first covering film are taken to form two layers of the window covering film; the window covering film is attached to both sides of the circuit pattern core board, and then the hollow circuit pattern is produced on the circuit pattern core board in the window pattern area.

[0016] Furthermore, the film-coated flexible board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the window covering film; the window covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollow circuit pattern is produced on the circuit pattern core board in the area of ​​the window pattern.

[0017] Furthermore, the film-coated flexible board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first covering film are taken to form two layers of the window covering film; the two layers of the window covering film are respectively attached to the two sides of the circuit pattern core board, and then the hollow circuit pattern is produced on the circuit pattern core board in the window pattern area.

[0018] Furthermore, the single side of the stainless steel reinforcement is larger than the reinforced window pattern.

[0019] Furthermore, the rigid-flex board includes a heat dissipation module, the heat dissipation module is made of a magnet, and a single side of the magnet is provided with a plurality of protrusions corresponding to the plurality of stainless steel reinforcements.

[0020] Furthermore, the surface on which the plurality of protrusions are distributed is a non-planar structure.

[0021] Furthermore, the welding circuit pattern and the hollow circuit pattern are tooth shapes that match each other.

[0022] Furthermore, the making of the plurality of stainless steel reinforcements includes: adding an extension area to the periphery of the film-attached flexible board, making stainless steel reinforcements to the extension area, and the area of ​​the stainless steel reinforcements is larger than the stainless steel reinforcements.

[0023] Furthermore, the manufacturing of the welding circuit pattern includes: adding a rigid board extension area to the periphery of the area of ​​the welding circuit pattern, and manufacturing a reinforced welding pattern on the rigid board extension area; the manufacturing of the hollow circuit pattern includes: adding a flexible board extension area to the periphery of the area of ​​the hollow circuit pattern, and manufacturing a reinforced hollow pattern on the flexible board extension area; and aligning and overlapping the reinforced welding pattern and the reinforced hollow pattern for welding.

[0024] Furthermore, there are a plurality of welding circuit patterns, which are arranged into a welding circuit matrix pattern; there are a plurality of hollow circuit patterns, which are arranged into a hollow circuit matrix pattern; and the alignment and overlapping welding is to align and overlap the welding circuit matrix pattern with the hollow circuit matrix pattern.

[0025] The technical solution of the present invention shortens the processing flow and reduces the processing difficulty by splitting the rigid-flexible board into three independent modules: a flexible board, a rigid board and a heat dissipation module and processing them independently; by welding and fixing the flexible board and the rigid board, and magnetically connecting the flexible board and the heat dissipation module, the flexible board and the rigid board form a detachable structure. During the application process, when a local fault occurs, it can form a relatively independent problem without affecting each other, which is convenient for maintenance and replacement, and further reduces the cost of subsequent maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the process flow of a rigid-flexible circuit board according to an embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of the cross-sectional structure of a rigid unit plate according to an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of the cross-sectional structure of a circuit pattern core board according to an embodiment of the present invention;

[0030] Figure 4 is a schematic diagram of the cross-sectional structure of a film-attached flexible board according to an embodiment of the present invention;

[0031] Figure 5 is a schematic diagram of the cross-sectional structure of a flexible unit board according to an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of the cross-sectional structure of a film-attached flexible board according to an embodiment of the present invention;

[0033] Figure 7 A schematic diagram of the cross-sectional structure of another film-attached flexible board according to an embodiment of the present invention;

[0034] Figure 8 It is a schematic diagram of the planar structure of the stainless steel reinforcement according to the embodiment of the present invention;

[0035] Fig. 9 for Figure 8 AA cross-sectional structure schematic diagram;

[0036] Fig.10 Schematic diagram of the cross-sectional structure of a rigid-flex board according to an embodiment of the present invention;

[0037] Fig.11 A schematic plan view of mutually matching tooth shapes according to an embodiment of the present invention;

[0038] Fig.12 It is a schematic diagram of a planar structure with stainless steel reinforcement according to an embodiment of the present invention;

[0039] Fig.13 It is a schematic diagram of a planar structure with a reinforced welding pattern and a reinforced hollow pattern according to an embodiment of the present invention.

[0040] Description of Figure Numbers:

[0041] Label name Label name 10 Rigid unit board 3040A Enhanced hollow graphics 1010 Surface circuit graphics 3040B Hollow Line Matrix Graphics 1020 Solder mask opening pattern 40 Flexible unit board 1030 Welding circuit diagram 4010 Stainless steel reinforcement 1030A Enhanced welding pattern 4010A Stainless steel reinforcement 20 Circuit pattern core board 4020 Second cover film 2010 Line graphics 4030 Strengthen window graphics 30 Film flexible board 50 Rigid-Flex PCB 3010 First covering film 5010 Cooling module 3020 Window graphics 30A A film-mounted flexible board 3030 Window Covering Film 30B Another kind of film-coated flexible board 3040 Hollow line graphics / /

[0042] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0045] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] See also Figure 1 , Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0048] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0049] See also Figure 2 , Figure 2 It is a schematic diagram of the cross-sectional structure of a rigid unit plate according to an embodiment of the present invention.

[0050] Step S10:

[0051] A rigid board is used to sequentially manufacture a surface circuit pattern 1010 and a solder resist window pattern 1020. The surface circuit pattern within the range of the solder resist window pattern is a welding circuit pattern 1030 to form a rigid unit board 10. That is, a surface circuit pattern 1010 is manufactured on the rigid board, and then a solder resist layer is manufactured on the surface of the rigid board and a window is opened on the solder resist layer to form a solder resist window pattern 1020. A portion of the circuit pattern that is exposed is the solder resist circuit pattern 1030, which is used for subsequent welding with the flexible unit board 20, thereby providing a processing basis for subsequent processes.

[0052] Figure 3 A schematic diagram of the cross-sectional structure of a circuit pattern core board according to an embodiment of the present invention; Figure 4 is a schematic diagram of the cross-sectional structure of a film-attached flexible board according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of a flexible unit board according to an embodiment of the present invention.

[0053] Step S20:

[0054] A circuit pattern 2010 is made from a flexible copper clad laminate to form a circuit pattern core board 20; a first covering film 3010 is used to make a window pattern 3020 to form a window covering film 3030, and the window covering film 3030 is attached to the surface of the circuit pattern core board 20, and then a hollow circuit pattern 3040 is made to form a film-attached flexible board 30; the window pattern 3020 corresponds to the area of ​​the hollow circuit pattern 3040; a plurality of stainless steel reinforcements 4010 are made on the surface of the film-attached flexible board 30 and arranged as a matrix reinforcement; a second covering film 4020 is used to make a reinforced window pattern 4030 corresponding to the plurality of stainless steel reinforcements, and the reinforced window pattern 4030 is attached to the area of ​​the matrix reinforcement to form a flexible unit board 40.

[0055] See also Figure 4 In the present embodiment of forming the film-coated flexible board 30, the flexible copper clad board is a single-sided flexible copper clad board, a layer of the first covering film 3010 is taken to form a window covering film 3030, the window covering film 3030 is attached to the surface of the circuit pattern 2010 of the circuit pattern core board 20, and then a hollow circuit pattern 3040 is made on the circuit pattern core board 20 in the window pattern area. Since the single-sided copper clad board itself has a certain support, the circuit pattern 2010 can be directly made on its copper surface and then the window covering film 3010 can be attached, and then a laser is used to cut the window area corresponding to the window covering film 3010, and the insulating dielectric layer of the other areas except the hollow circuit pattern 3040 in the window area of ​​the single-sided flexible copper clad board is removed, so that the single-sided copper clad board forms a hollow circuit pattern 3040.

[0056] See also Figure 6 , Figure 6The figure is a schematic diagram of the cross-sectional structure of another film-attached flexible board according to an embodiment of the present invention.

[0057] In forming an embodiment of a film-coated flexible board 30A, the flexible copper clad board is a double-sided flexible copper clad board, and two layers of the first covering film 3010 are taken to form two layers of window covering film 3030; the window covering film 3030 is attached to the two sides of the circuit pattern core board 20, and then a hollow circuit pattern 3040 is made on the circuit pattern core board 20 in the window pattern area. Since the structure of the double-sided copper clad board is similar to that of the single-sided copper clad board, the processing method is also similar, except that an extra layer of window covering film 3030 needs to be attached, which will not be repeated.

[0058] It is worth mentioning that laser cutting is a non-contact processing with no stress impact and high positioning accuracy. Therefore, the cut section is delicate and smooth, and will not cause deformation to the circuit at the cutting edge. It can meet the processing requirements of high precision and complex shapes. In contrast, punching processing relies on stress impact to break the plate layer, with poor accuracy, burrs on the punched section, and easily causes deformation to the circuit pattern 2010 next to the punched section; therefore, the hollow circuit pattern 3040 of this embodiment is produced by laser cutting.

[0059] See also Figure 7 , Figure 7 The figure is a schematic diagram of the cross-sectional structure of a film-attached flexible board according to an embodiment of the present invention.

[0060] In an embodiment of forming another film-coated flexible board 30B, two layers of first covering films 3010 can be firstly taken to form two layers of window covering films 3020; a single layer of copper is taken, and a layer of window covering film 3010 is attached to one side of the single layer of copper, and then a circuit pattern 2010 and a hollow circuit pattern 3040 are made on the single layer of copper, and then another layer of window covering film 3010 is attached to the other side of the single layer of copper; since the single layer of copper has a certain degree of softness, a layer of window covering film 3010 is first attached to the single layer of copper to serve as a supporting layer, so as to facilitate the subsequent production of the circuit pattern 2010 and the hollow circuit pattern 3040.

[0061] In actual application processing, the thickness of the flexible circuit board is relatively thin. Therefore, based on the above production method, it is generally preferred to use a film-mounted flexible board 30 or a film-mounted flexible board 30A processing method, and use the insulating dielectric layer of the copper-clad board itself (generally a polyimide material) to provide support for the hollow circuit pattern 3040, avoiding the use of another film-mounted flexible board 30B processing method, which produces a problem of weak support strength of a single-layer copper; when the thickness of the single-layer copper is relatively thick (for example ≥70μm), the three processing methods have equivalent effects.

[0062] See also Figure 8 and Fig. 9 , Figure 8It is a schematic diagram of the planar structure of the stainless steel reinforcement according to the embodiment of the present invention; Fig. 9 for Figure 8 Schematic diagram of the AA cross-section structure.

[0063] In this embodiment, in order to match the non-planar design of the LED lamp group welded on the flexible board, the stainless steel reinforcement 4010 is designed to be several pieces, and a plurality of stainless steel reinforcements 4010 are used to replace a whole piece of stainless steel reinforcement 4010, so that the setting of the stainless steel reinforcement 4010 can better fit the non-planar structure of the lamp group. Furthermore, the stainless steel reinforcement 4010 is set as a matrix, and a single matrix corresponds one-to-one with the LED lamp beads in the lamp group to better target heat dissipation.

[0064] In this embodiment, one side of the stainless steel reinforcement 4010 is larger than the reinforced window pattern 4030, that is, a portion of the second covering film 4020 is pressed onto the stainless steel reinforcement 4010 to prevent the stainless steel reinforcement 4010 and the heat dissipation module from being pulled and damaged by magnetic attraction. Therefore, the second covering film 4020 mainly plays the role of protecting the stainless steel reinforcement 4010.

[0065] It is worth mentioning that the second covering film 4020 is attached to the surface of the first covering film 3010, and the first covering film 3010 is polyimide. Direct attachment may easily cause the problem of weak bonding. Therefore, before attaching the second covering film 4020, the first covering film 3010 must be subjected to plasma surface roughening treatment. Specifically, a dry film is attached to the surface area of ​​the first covering film 3010 that does not need to be attached with the second covering film 4020, and a dry film pattern is produced. Then, plasma treatment is performed, and the dry film is faded before the second covering film 4020 is attached.

[0066] See also Fig.10 , Fig.10 It is a schematic diagram of the cross-sectional structure of a rigid-flex board according to an embodiment of the present invention.

[0067] In this embodiment, the rigid-flexible board 50 includes a heat dissipation module 5010. The heat dissipation module 5010 is made of a magnet. A single side of the magnet is provided with a plurality of protrusions corresponding to a plurality of stainless steel reinforcements 4010, forming a magnetically attractive structure with the stainless steel reinforcements 4010. The processing is simple. Furthermore, when the rigid-flexible board 50 is used, if a problem occurs with the heat dissipation module 5010, it can be easily replaced, thereby reducing the maintenance cost.

[0068] It is worth mentioning that one side of the magnet is designed as a non-planar structure that matches the lamp group, and the other side of the magnet can use thermal conductive adhesive to adhere to more efficient heat dissipation components such as heat sinks and heat sinks to further improve the heat dissipation efficiency.

[0069] Please continue reading Fig.10 .

[0070] Step S30:

[0071] The welding circuit pattern 1030 and the hollow circuit pattern 3040 are aligned, overlapped and welded to form a rigid-flexible board 50 .

[0072] See also Fig.11 , Fig.11 It is a schematic plan view of mutually matching tooth shapes according to an embodiment of the present invention.

[0073] In the present embodiment, the welding circuit pattern 1030 and the hollow circuit pattern 3040 are tooth shapes that match each other, that is, by designing the hollow circuit pattern 3040 as a tooth-shaped structure, the welding circuit pattern 1030 and the hollow circuit pattern 3040 are aligned and overlapped to form mutually staggered tooth shapes, thereby increasing the contact surface between the welding circuit pattern 1030 and the hollow circuit pattern 3040, and then through the subsequent welding process, the stability of the welding of the rigid unit board 10 and the flexible unit board 40 is ensured.

[0074] See also Fig.12 , Fig.12 It is a schematic diagram of a planar structure with stainless steel reinforcement according to an embodiment of the present invention.

[0075] In this embodiment, making a number of stainless steel reinforcements 4010 includes: adding an expansion area to the periphery of the film-attached flexible board 30, making stainless steel reinforcements 4010A in the expansion area, the area of ​​the stainless steel reinforcements 4010A is larger than the stainless steel reinforcements 4010, and the stainless steel reinforcements 4010A are provided to further enhance the magnetic attraction, and the manufacturing method is the same as the stainless steel reinforcements 4010.

[0076] See also Fig.13 , Fig.13 It is a schematic diagram of a planar structure with a reinforced welding pattern and a reinforced hollow pattern according to an embodiment of the present invention.

[0077] In this embodiment, the welding circuit pattern 1030 is formed, including: adding a rigid board extension area to the periphery of the area of ​​the welding circuit pattern 1030, and making a reinforced welding pattern 1030A on the rigid board extension area; the hollow circuit pattern 3040 is formed, including: adding a flexible board extension area to the periphery of the area of ​​the hollow circuit pattern 3040, and making a reinforced hollow pattern 3040A on the flexible board extension area; the reinforced welding pattern 1030A and the reinforced hollow pattern 3040A are aligned and overlapped and welded, and the reinforced welding pattern 1030A is made while making the welding circuit pattern 1030, and by setting the reinforced welding pattern 1030A and the reinforced hollow pattern 3040A, after welding, the firmness of the welding between the flexible board and the rigid board is improved.

[0078] Please refer again Fig.13 .

[0079] Further, there are several welding circuit patterns 1030, and they are arranged into welding circuit matrix patterns 1030B; there are several hollow circuit patterns 3040, and they are arranged into hollow circuit matrix patterns 3040B; the alignment and superposition welding is to align and superpose welding the welding circuit matrix patterns 1030B and the hollow circuit matrix patterns 3040B one by one. In this embodiment, by designing the independent welding circuit patterns 1030 and hollow circuit patterns 3040 in the welding circuit matrix patterns 1030B and the hollow circuit matrix patterns 3040B as several and one-to-one corresponding ones, a plurality of welding points are formed, which are electrically connected to a plurality of LED lamp beads to meet the electrical connection requirements of the LED lamp group matrix. The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a matrix lamp module rigid-flexible board, characterized in that: The production method comprises the following steps: S10: taking a rigid board and sequentially manufacturing a surface circuit pattern and a solder resist window pattern, wherein the surface circuit pattern within the range of the solder resist window pattern is a welding circuit pattern, and forming a rigid unit board; S20: Take a flexible copper clad laminate to make a circuit pattern to form a circuit pattern core board; take a first covering film to make a window pattern to form a window covering film, attach the window covering film to the surface of the circuit pattern core board, and then make a hollow circuit pattern to form a film-attached flexible board; the window pattern corresponds to the area of ​​the hollow circuit pattern; make a number of stainless steel reinforcements on the surface of the film-attached flexible board, and arrange them into matrix reinforcements; take a second covering film to make a reinforcement window pattern corresponding to the number of stainless steel reinforcements, and attach it to the area of ​​the matrix reinforcement to form a flexible unit board; S30: Aligning and overlapping the welding circuit pattern and the hollow window pattern to form the rigid-flexible board.

2. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: The film-coated flexible board is formed as follows: the flexible copper-clad board is a single-sided flexible copper-clad board; a layer of the first covering film is taken to form the window covering film; the window covering film is attached to the surface of the circuit pattern core board where the circuit pattern is located, and then the hollow circuit pattern is produced on the circuit pattern core board in the area of ​​the window pattern.

3. The method for manufacturing a matrix light module rigid-flex board according to claim 1, characterized in that: The film-coated flexible board is formed as follows: the flexible copper-clad board is a double-sided flexible copper-clad board; two layers of the first covering film are taken to form two layers of the window covering film; the two layers of the window covering film are respectively attached to the two sides of the circuit pattern core board, and then the hollow circuit pattern is produced on the circuit pattern core board in the window pattern area.

4. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: The single side of the stainless steel reinforcement is larger than the reinforced window pattern.

5. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: The rigid-flex board comprises a heat dissipation module, the heat dissipation module is made of a magnet, and a single side of the magnet is provided with a plurality of protrusions corresponding to the plurality of stainless steel reinforcements.

6. The method for manufacturing a matrix light module rigid-flexible board according to claim 5, characterized in that: The surface on which the plurality of protrusions are distributed is a non-planar structure.

7. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: The welding circuit pattern and the hollow circuit pattern are tooth shapes that match each other.

8. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: The making of the plurality of stainless steel reinforcements comprises: adding an extension area to the periphery of the film-attached flexible board, making stainless steel reinforcements to the extension area, and the area of ​​the stainless steel reinforcements is larger than the stainless steel reinforcements.

9. The method for manufacturing a matrix light module rigid-flex board according to claim 1, characterized in that: The welding circuit pattern is formed, including: adding a rigid plate extension area to the periphery of the welding circuit pattern, and forming a reinforced welding pattern on the rigid plate extension area; Making the hollow circuit pattern, including: adding a flexible board extension area to the periphery of the hollow circuit pattern, and making a reinforced hollow pattern on the flexible board extension area; The reinforced welding pattern and the reinforced hollow pattern are aligned, overlapped and welded.

10. The method for manufacturing a matrix light module rigid-flexible board according to claim 1, characterized in that: There are a plurality of welding circuit patterns, which are arranged into a welding circuit matrix pattern; There are a plurality of hollow circuit patterns, which are arranged into a hollow circuit matrix pattern; The alignment and overlapping welding is to align and overlap the welding circuit matrix pattern with the hollow circuit matrix pattern.

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