Intelligent semiconductor part surface treatment device
By designing the intelligent semiconductor parts surface treatment device, using hydraulic rod to drive the grinding belt and flip shaft to clamp the parts, the problems of low grinding efficiency and inconvenient debris cleaning in the existing technology are solved, and efficient grinding and good cleaning are achieved Effect.
Patent Information
- Application Number
- CN202411684234.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-02-25
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing semiconductor parts processing devices are less efficient when handling larger parts and are difficult to effectively collect and clean debris generated during grinding.
An intelligent semiconductor parts surface treatment device is designed, and the grinding belt is driven by hydraulic rods to grind, and the clamping and cleaning of the parts are achieved by flipped shafts and inclined groove rods to collect and level the debris.
It improves the grinding efficiency of parts of different sizes, ensures the efficiency of the grinding process, and improves the maintenance and cleaning convenience of equipment through effective debris collection and cleaning.
Smart Images
Figure CN119501754A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor part processing, and in particular to an intelligent semiconductor part surface processing device. Background Art
[0002] The manufacturing process of semiconductor parts usually involves multiple steps, some of which do include grinding or polishing. The main purpose of grinding and polishing is to improve the surface finish to meet the high requirements of electronic devices for the surface properties of materials. Semiconductor parts usually need to be ground and polished during the manufacturing process to improve their surface quality and thus ensure their performance in electronic devices. This process is an indispensable part of semiconductor manufacturing.
[0003] The patent with announcement number CN114434270 semiconductor parts processing discloses an organic semiconductor surface treatment device which is easy to maintain and clean, and relates to the technical field of organic semiconductor surface treatment, including a workbench, hydraulic cylinders are fixedly installed on the upper surfaces of both sides of the workbench through mounting frames, and a protective component is arranged below the hydraulic cylinder, and the protective component includes a first protective cover and a second protective cover, the upper surfaces of the first protective cover and the second protective cover are connected by an adjusting component, a driving component is arranged through the inside of the second protective cover, and a cleaning mechanism is connected to one end of the driving component, and a product body is fixedly placed on the upper surface of the middle part of the workbench through a clamping component, and by arranging the adjusting component and the protective component, the application scope of the device can be improved, and the sealing of the device can be improved to avoid the splashing of debris during the processing process, and by arranging the first and second collecting components, the debris generated during the grinding process can be collected, which is convenient for later maintenance and cleaning, but this patent still has the problem of low efficiency in grinding larger parts. Summary of the invention
[0004] In view of the deficiencies in the prior art, the present invention provides an intelligent semiconductor component surface treatment device, which solves the problems raised in the above-mentioned background technology.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an intelligent semiconductor part surface treatment device, comprising a support frame, a side guard plate is fixedly connected to the outer side of the bottom end of the support frame, a top plate is fixedly connected to the top of the support frame, guide plates are fixedly connected to both sides of the top of the support frame, a grinding treatment mechanism is arranged below the top plate, a clamping mechanism is arranged below the grinding treatment mechanism, a cleaning and collecting mechanism is arranged below the clamping mechanism, both sides of the interior of the support frame are fixedly connected to table plates, and a conveyor belt is installed between the two table plates; The camming mechanism comprises a hydraulic rod, a bottom end of which is fixedly connected to a pressure plate, and two ends of the bottom surface of the pressure plate are fixedly connected to a vertical groove side plate, and each vertical groove side plate is fixedly connected to an extended vertical groove on one side away from the guide plate, and each vertical groove slide block is fixedly connected to a fixed shaft block on one side away from the extended vertical groove. Two tensioning rollers are rotatably connected between the two vertical groove side plates, and two belt adjusting rollers are rotatably connected between the two fixed shaft blocks, and a grinding belt is arranged on the outer side of the belt adjusting roller. The top surface of the pressure plate is rotatably connected to a threaded rod, and the outer side of the threaded rod is threadedly connected to an adjusting frame, and the front and rear side edges of the adjusting frame extend downwardly from an arc plate, and a return spring is arranged on the top surface of the vertical groove slide block, and the two ends of the return spring are respectively fixedly connected to the pressure plate and the vertical groove slide block, and the hydraulic rod is fixedly connected to the top plate. When the hydraulic rod on the side guard plate extends downwardly, the hydraulic The rod pushes the pressure plate and the connected vertical groove side plates to move downward. At this time, the belt adjusting roller connected to the fixed axis block below pushes the grinding belt close to the surface of the semiconductor part. When the hydraulic rod continues to press down, the belt adjusting roller located below is subjected to force and drives the vertical groove slider connected to the fixed axis block to move upward along the extended vertical groove and squeeze the reset spring, and the belt adjusting roller above the fixed axis block begins to contact the grinding belt. As the fixed axis block moves, the belt adjusting roller above the fixed axis block pushes the grinding belt, and the angle formed by the lower belt adjusting roller supporting the grinding belt gradually expands. When the lower belt adjusting roller is no longer driven by the grinding belt, the grinding belt area of the lower belt adjusting roller contacting the grinding belt is horizontal, so that the contact surface and friction between the upper belt adjusting roller and the grinding belt gradually increase, and the belt adjusting roller and the two tightening rollers tighten the grinding belt. Subsequently, the tightening roller is driven by the external motor connected to the tightening roller to drive the grinding belt to rotate, and then the belt adjusting roller is driven to rotate by the rotation of the grinding belt, and the semiconductor surface is polished by the tightened grinding belt.
[0006] The camming mechanism is a kind of mechanism that is used for the lifting of the piston rod and the piston rod of the piston rod respectively has the piston rod of the piston rod and the piston rod of the piston rod being fixedly connected with the piston rod of the piston rod and the piston rod of the piston rod being connected with the piston rod of the piston rod. When the lever is in the forward position, the spring will push the lever back and forth, and when the lever is in the forward position, the lever will be in the forward position ...
[0007] According to the above technical solution, the flip slot plate slides through the inner side of the through slot, the inclined slot is slidably connected to the inclined slot rod, a tension spring is arranged on the inner side of the inclined slot, and the two ends of the tension spring are respectively fixedly connected to the inclined slot and the inclined slot rod, the cleaning and collecting mechanism comprises a transverse slot rod, the bottom surface of the transverse slot rod is fixedly connected to a vertical connecting rod, the bottom end of the vertical connecting rod is fixedly connected to a spring baffle, a pressure folding plate is arranged under the table plate, a collection slot is arranged under the pressure folding plate, and is located on the side of the side guard plate on the left side. A hopper is fixedly connected, and two inclined square rods are fixedly connected to the top of the hopper. A square rod slider is slidably connected to the outer side of the inclined square rod. A scraper is fixedly connected between the two square rod sliders. An elastic sheet is fixedly connected to the side of each square rod slider, and the end of the elastic sheet away from the square rod slider is fixedly connected to the inclined square rod. The inclined slot rod is slidably connected to the horizontal slot rod. The vertical connecting rod slides from the top surface of the table to the bottom surface. An elastic spring is arranged on the outer side of the bottom end of the vertical connecting rod, and the two ends of the elastic spring are respectively connected to the spring baffle and the pressure folding plate The pressure folding plate is fixedly connected, the pressure folding plate is slidably connected to the vertical connecting rod, the collecting trough is fixedly connected to the supporting frame, when the inclined trough rod is pressed by the flip trough plate and moves downward along the inclined slide trough, the inclined trough rod drives the horizontal trough rod to push the vertical connecting rod downward through the through groove, so that the vertical connecting rod slides through the table plate, and the elastic spring connected to the spring baffle of the vertical connecting rod pulls the pressure folding plate to move downward, so that the pressure folding plate slides downward along the inner wall of the collecting trough, and the metal debris collected in the collecting trough is squeezed by the bottom surface of the pressure folding plate, and the metal debris is flattened, so that the flattened debris is evenly distributed in the collecting trough. In order to reduce the gap between the debris, the gap between the debris is reduced and the space is compressed. When the thickness of the debris in the collecting trough gradually increases, the vertical connecting rod passes through the pressure folding plate to pull the elastic spring, and the pressure folding plate no longer moves, while the vertical connecting rod pulls the spring to continue to move. At the same time, the polished debris particles on the conveyor belt fall into the hopper as the conveyor belt moves, and are then transmitted to the collecting trough through the hopper. When some debris sticks to the surface of the conveyor belt, the scraper is pushed to fit the conveyor belt through the square rod slider on the inclined square rod, so that the scraper is close to the conveyor belt under the elastic force of the elastic sheet.
[0008] The present invention provides an intelligent semiconductor part surface treatment device, which has the following beneficial effects: The present invention is provided with a hydraulic rod, a pressure plate, a vertical groove side plate, a threaded rod, an adjustment frame, a vertical groove slider, a fixed axis block, a tightening belt roller, a belt adjusting roller, a grinding belt, and an extended vertical groove. The tightening belt roller is driven by an external motor connected to the tightening belt roller to drive the grinding belt to rotate, and the belt adjusting roller is then driven by the rotation of the grinding belt to grind the semiconductor surface by the tightening grinding belt. At the same time, the grinding belt at the contact part of the two tightening belt rollers is used to grind the plate-shaped semiconductor parts. After the belt adjusting roller applies pressure, the structural area between the grinding belt and the parts is adjusted, so that adjustments are made for parts of different sizes, the grinding range and the adaptation effect are improved, and the processing efficiency is improved. The present invention is provided with a flip shaft rod, a flip slot plate, an inclined slot rod, a through slot, an inclined slide slot, a connecting rod, a pressure hinge block, a pressure guard plate, a support plate, a roller, a spring sheet, and a baffle. The support plate contacts the surface of the conveyor belt through the roller and slides with the pressure hinge block, so that the spring sheet connected to the baffle bar is stretched, and the semiconductor parts are clamped by the relative sliding of the pressure guard plate and the pressure hinge block, so as to prevent the semiconductor parts from being deformed and bulged due to excessive pressure and affecting the grinding effect. At the same time, the inclined flip slot plate can shield the grinding area to prevent the debris powder generated by grinding from being ejected from the outside of the conveyor belt for subsequent cleaning. The present invention is provided with a transverse groove rod, a vertical connecting rod, a pressure folding plate, a spring baffle, an inclined square rod, a square rod slider, a hopper, a collecting trough, a scraper, and an elastic sheet. The metal debris collected in the collecting trough is squeezed by the bottom surface of the pressure folding plate, and the metal debris is flattened, so that the flattened debris is evenly distributed in the collecting trough, so as to reduce the gap between the debris, and the space is compressed by reducing the gap between the debris. At the same time, the scraper is pushed to fit the conveyor belt by the square rod slider on the inclined square rod, and the scraper is tightly attached to the conveyor belt under the elastic force of the elastic sheet, so as to prevent the debris attached to the conveyor belt from affecting the subsequent swinging and smoothing of parts, and to avoid the uneven placement of parts affecting the grinding effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 It is a schematic diagram of the overall front three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the overall rear-view stereoscopic structure of the present invention; Figure 3 It is a structural schematic diagram of the overall grinding processing mechanism of the present invention; Figure 4 This is a schematic diagram of the connection structure of the integral pressure plate of the present invention; Figure 5 This is a schematic diagram of the connection structure of the integral vertical slot slider of the present invention; Figure 6 It is a structural schematic diagram of the overall clamping mechanism of the present invention; Figure 7 This is a schematic diagram of the integral support plate connection structure of the present invention; Figure 8 It is a structural schematic diagram of the overall cleaning and collecting mechanism of the present invention; Fig. 9 For the present invention as a whole Figure 8 Schematic diagram of the enlarged structure of A.
[0010] In the figure: 1, support frame; 2, side guard plate; 3, top plate; 4, guide plate; 5, grinding processing mechanism; 51, hydraulic rod; 52, pressure plate; 53, vertical slot side plate; 54, threaded rod; 55, adjustment frame; 56, vertical slot slider; 57, fixed axis block; 58, belt tightening roller; 59, belt adjusting roller; 510, grinding belt; 511, extended vertical slot; 6, clamping mechanism; 61, turning shaft rod; 62, turning slot plate; 63, inclined slot rod; 64, through Groove; 65, inclined slide; 66, connecting rod; 67, pressure hinge block; 68, pressure guard plate; 69, support plate; 610, roller; 611, spring sheet; 612, baffle; 7, cleaning and collecting mechanism; 71, horizontal groove rod; 72, vertical connecting rod; 73, pressure folding plate; 74, spring baffle; 75, inclined square rod; 76, square rod slider; 77, hopper; 78, collecting trough; 79, scraper; 710, elastic sheet; 8, conveyor belt; 9, table. DETAILED DESCRIPTION
[0011] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0012] See also Figure 1-9 , the embodiment of the present invention is: an intelligent semiconductor part surface treatment device, comprising a support frame 1, a side guard plate 2 is fixedly connected to the outer side of the bottom end of the support frame 1, a top plate 3 is fixedly connected to the top of the support frame 1, guide plates 4 are fixedly connected to both sides of the top of the support frame 1, a grinding processing mechanism 5 is arranged below the top plate 3, a clamping mechanism 6 is arranged below the grinding processing mechanism 5, a cleaning and collecting mechanism 7 is arranged below the clamping mechanism 6, both sides of the interior of the support frame 1 are fixedly connected to table plates 9, and a conveyor belt 8 is installed between the two table plates 9; The grinding processing mechanism 5 includes a hydraulic rod 51, the bottom end of the hydraulic rod 51 is fixedly connected to a pressure plate 52, both ends of the bottom surface of the pressure plate 52 are fixedly connected to vertical groove side plates 53, each vertical groove side plate 53 is fixedly connected to an extended vertical groove 511 on the side away from the guide plate 4, each extended vertical groove 511 is slidably connected to the inner side of a vertical groove slider 56, each vertical groove slider 56 is fixedly connected to a fixed axis block 57 on the side away from the extended vertical groove 511, two tightening rollers 58 are rotatably connected between the two vertical groove side plates 53, two belt adjusting rollers 59 are rotatably connected between the two fixed axis blocks 57, and a grinding belt 510 is arranged on the outer side of the belt adjusting roller 59, the top surface of the pressure plate 52 is rotatably connected to a threaded rod 54, the outer side of the threaded rod 54 is threadedly connected to an adjustment frame 55, and the front and rear sides of the adjustment frame 55 An arc-shaped plate extends downward from the edge, and a return spring is provided on the top surface of the vertical groove slider 56, and the two ends of the return spring are fixedly connected to the pressure plate 52 and the vertical groove slider 56 respectively. The hydraulic rod 51 is fixedly connected to the top plate 3, and is driven by an external motor connected to the tightening roller 58, so that the tightening roller 58 rotates to drive the grinding belt 510 to rotate, and then the grinding belt 510 rotates to drive the belt adjusting roller 59 to rotate, and the semiconductor surface is polished by tightening the grinding belt 510. At the same time, the grinding belt 510 at the contact part of the two tightening rollers 58 is used to polish the plate-like semiconductor parts, so that after the pressure is applied by the belt adjusting roller 59, the structural area between the grinding belt 510 and the parts is adjusted, so as to adjust for parts of different sizes, improve the grinding range and adaptation effect, and thus improve the processing efficiency.
[0013] The clamping mechanism 6 includes a flip shaft rod 61, the outer surface of the flip shaft rod 61 is rotatably connected to a flip slot plate 62, the inner side of the flip slot plate 62 is slidably connected to an inclined slot rod 63, the side of the inclined slot rod 63 is provided with a through slot 64, the side of each guide plate 4 is fixedly connected to two inclined slide grooves 65, the bottom surface of the inclined slot rod 63 is fixedly connected to a plurality of connecting rods 66, the bottom end of the connecting rod 66 is hingedly connected to a pressure hinge block 67, the side of the pressure hinge block 67 is slidably connected to a support plate 69, one end of the support plate 69 is fixedly connected to a pressure guard plate 68, the end of the support plate 69 away from the pressure guard plate 68 is fixedly connected to a stop bar 612, the side of the stop bar 612 is fixedly connected to a spring sheet 611, and the spring sheet 6 11 The end away from the baffle 612 is fixedly connected to the pressure hinge block 67, and the inner side of the support plate 69 is rotatably connected to two rollers 610. When the conveyor belt 8 operates to transport the equidistantly placed parts to the specified position, the conveyor belt 8 stops working, and the support plate 69 contacts the surface of the conveyor belt 8 through the rollers 610 and slides with the pressure hinge block 67, so that the spring sheet 611 connected to the baffle 612 is stretched, and the semiconductor parts are clamped by the relative sliding of the pressure guard plate 68 and the pressure hinge block 67 to prevent the semiconductor parts from being overly compressed, deformed and bulged to affect the grinding effect. At the same time, the inclined flip groove plate 62 can cover the grinding area to prevent the debris and powder generated by grinding from popping out of the outside of the conveyor belt 8 for subsequent cleaning.
[0014] The flip slot plate 62 slides through the inner side of the through slot 64, the inclined slot 65 is slidably connected to the inclined slot rod 63, a tension spring is provided on the inner side of the inclined slot 65, and the two ends of the tension spring are respectively fixedly connected to the inclined slot 65 and the inclined slot rod 63, the cleaning and collecting mechanism 7 includes a transverse slot rod 71, the bottom surface of the transverse slot rod 71 is fixedly connected to a vertical connecting rod 72, the bottom end of the vertical connecting rod 72 is fixedly connected to a spring baffle 74, a pressure folding plate 73 is provided below the table 9, and a collection slot 78 is provided below the pressure folding plate 73, which is located on the side of the left side guard plate 2 The surface is fixedly connected with a hopper 77, the top of the hopper 77 is fixedly connected with two inclined square rods 75, the outer side of the inclined square rod 75 is slidably connected with a square rod slider 76, a scraper 79 is fixedly connected between the two square rod sliders 76, each square rod slider 76 is fixedly connected with an elastic sheet 710 on the side, and the end of the elastic sheet 710 away from the square rod slider 76 is fixedly connected to the inclined square rod 75, the inclined groove rod 63 is slidably connected with the horizontal groove rod 71, the vertical connecting rod 72 slides from the top surface of the table 9 to the bottom surface, and an elastic spring is arranged on the outer side of the bottom end of the vertical connecting rod 72. The two ends of the elastic spring are respectively fixedly connected to the spring baffle 74 and the pressure folding plate 73, the pressure folding plate 73 is slidably connected to the vertical connecting rod 72, and the collecting groove 78 is fixedly connected to the support frame 1. The metal debris collected in the collecting groove 78 is squeezed by the bottom surface of the pressure folding plate 73 to flatten the metal debris and make the flattened debris evenly distributed in the collecting groove 78 so as to reduce the gap between the debris and compress the space. When the thickness of the debris in the collecting groove 78 gradually increases, the vertical connecting rod 72 passes through the pressure folding plate 73 to pull the elastic spring to be pulled, and the pressure folding plate 73 The vertical connecting rod 72 pulls the spring to continue to move. At the same time, the polished debris particles on the conveyor belt 8 fall into the hopper 77 as the conveyor belt 8 moves, and are then transferred to the collecting tank 78 through the hopper 77. When some debris sticks to the surface of the conveyor belt 8, the square rod slider 76 on the inclined square rod 75 pushes the scraper 79 to fit the conveyor belt 8, so that the scraper 79 is closely attached to the conveyor belt 8 under the elastic force of the elastic sheet 710, preventing the conveyor belt 8 from being attached with debris and affecting the subsequent swinging and smoothing of parts, and avoiding the uneven placement of parts affecting the polishing effect. Working principle: When the hydraulic rod 51 on the side guard plate 2 extends downward, the hydraulic rod 51 pushes the pressure plate 52 and the connected vertical groove side plate 53 to move downward. At this time, the belt adjusting roller 59 connected to the fixed axis block 57 below pushes the grinding belt 510 close to the surface of the semiconductor part. When the hydraulic rod 51 continues to press down, the belt adjusting roller 59 located below drives the vertical groove slider 56 connected to the fixed axis block 57 to move upward along the extended vertical groove 511 and squeeze the reset spring, and let the belt adjusting roller 59 above the fixed axis block 57 begin to contact the grinding belt 510. As the fixed axis block 57 moves, the belt adjusting roller 59 above the fixed axis block 57 pushes the grinding belt 510, and the angle formed by the lower belt adjusting roller 59 supporting the grinding belt 510 gradually expands. When the lower belt adjusting roller 59 is no longer driven by the grinding belt 510, the lower belt adjusting roller 59 is connected to the grinding belt 510. The contact area of the grinding belt 510 is horizontal, so that the contact surface and friction between the belt adjusting roller 59 and the grinding belt 510 are gradually increased, and the belt adjusting roller 59 and the two tightening rollers 58 tighten the grinding belt 510, and then the tightening roller 58 is driven by the external motor connected to the tightening roller 58 to drive the grinding belt 510 to rotate, and then the belt adjusting roller 59 is driven by the rotation of the grinding belt 510 to rotate, and the semiconductor surface is polished by the tightened grinding belt 510. At the same time, the plate-shaped semiconductor parts are polished by the grinding belt 510 at the contact part of the two tightening rollers 58, so that the structural area between the grinding belt 510 and the parts is adjusted after the belt adjusting roller 59 applies pressure, so as to adjust for parts of different sizes, improve the grinding range and adaptation effect, and thus improve the processing efficiency; When the conveyor belt 8 operates to transport the equidistantly placed parts to the specified position, the conveyor belt 8 stops working. When the pressure plate 52 moves downward, the flip shaft rod 61 connected to the pressure plate 52 moves with it, and the flip shaft rod 61 drives the connected flip slot plate 62 to move downward together. After the flip slot plate 62 contacts the adjusting frame 55, the flip slot plate 62 is flipped upward around the flip shaft rod 61 under the action of the inclined slot rod 63. When the flip slot plate 62 contacts the edge of the adjusting frame 55, the adjusting frame 55 pushes the flip slot plate 62 to press the inclined slot rod 63, so that the inclined slot rod 63 slides downward along the inclined slide groove 65, allowing the connecting rod 66 connected to the inclined slot rods 63 on both sides to approach each other. The connecting rod 66 pushes the pressure hinge block 67 at the connection to contact the surface of the conveyor belt 8. During this process, the two pressure hinge blocks 67 approach each other so that the pressure guard plate 68 connected to the support plate 69 clamps the semiconductor parts. As the pressure hinge block 67 continues to approach, the support plate 69 contacts the surface of the conveyor belt 8 through the roller 610 and slides with the pressure hinge block 67, so that the spring sheet 611 connected to the baffle 612 is stretched, and the semiconductor parts are clamped by the relative sliding of the pressure guard plate 68 and the pressure hinge block 67 to prevent the semiconductor parts from being overly compressed, deformed and bulged to affect the grinding effect. At the same time, the inclined flip groove plate 62 can cover the grinding area to prevent the debris powder generated by grinding from popping out of the outside of the conveyor belt 8 for subsequent cleaning; When the inclined slot rod 63 is pressed by the flip slot plate 62 and moves downward along the inclined slide slot 65, the inclined slot rod 63 drives the horizontal slot rod 71 to push the vertical connecting rod 72 downward through the through slot 64, so that the vertical connecting rod 72 slides through the table 9, and the elastic spring connected to the spring baffle 74 of the vertical connecting rod 72 pulls the pressure folding plate 73 downward, so that the pressure folding plate 73 slides downward along the inner wall of the collecting slot 78, and squeezes the metal debris collected in the collecting slot 78 through the bottom surface of the pressure folding plate 73, flattens the metal debris, and evenly distributes the flattened debris in the collecting slot 78, so as to reduce the gap between the debris, reduce the gap between the debris and compress the space, and when the debris in the collecting slot 78 is thick The degree gradually increases, the vertical connecting rod 72 passes through the pressure folding plate 73 to pull the elastic spring to be stretched, the pressure folding plate 73 no longer moves, and the vertical connecting rod 72 pulls the spring to continue to move. At the same time, the polished debris particles on the conveyor belt 8 fall into the hopper 77 as the conveyor belt 8 moves, and are then transmitted to the collecting trough 78 through the hopper 77. When some debris sticks to the surface of the conveyor belt 8, the square rod slider 76 on the inclined square rod 75 pushes the scraper 79 to fit the conveyor belt 8, so that the scraper 79 is close to the conveyor belt 8 under the elastic force of the elastic sheet 710, so as to prevent the conveyor belt 8 from being attached with debris affecting the subsequent swinging and smoothness of parts, and to avoid the uneven placement of parts affecting the polishing effect.
[0015] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. An intelligent semiconductor component surface treatment device, comprising a support frame (1), characterized in that: The outer side of the bottom end of the support frame (1) is fixedly connected to a side guard plate (2), the top of the support frame (1) is fixedly connected to a top plate (3), both sides of the top of the support frame (1) are fixedly connected to guide plates (4), a grinding and processing mechanism (5) is arranged below the top plate (3), a clamping mechanism (6) is arranged below the grinding and processing mechanism (5), a cleaning and collecting mechanism (7) is arranged below the clamping mechanism (6), both sides of the interior of the support frame (1) are fixedly connected to table plates (9), and a conveyor belt (8) is installed between the two table plates (9); The grinding processing mechanism (5) comprises a hydraulic rod (51), the bottom end of the hydraulic rod (51) is fixedly connected to a pressure plate (52), both ends of the bottom surface of the pressure plate (52) are fixedly connected to vertical groove side plates (53), the side of each vertical groove side plate (53) away from the guide plate (4) is fixedly connected to an extended vertical groove (511), the inner side of each extended vertical groove (511) is slidably connected to a vertical groove slider (56), the side of each vertical groove slider (56) away from the extended vertical groove (511) is fixedly connected to a fixed axis block (57), two tightening belt rollers (58) are rotatably connected between two vertical groove side plates (53), two belt adjusting rollers (59) are rotatably connected between two fixed axis blocks (57), and a grinding belt (510) is arranged on the outer side of each belt adjusting roller (59).
2. The intelligent semiconductor component surface treatment device according to claim 1, characterized in that: The top surface of the pressure plate (52) is rotatably connected to a threaded rod (54), the outer side of the threaded rod (54) is threadably connected to an adjustment frame (55), and the front and rear side edges of the adjustment frame (55) extend downward to form arc-shaped plates.
3. The intelligent semiconductor component surface treatment device according to claim 2, characterized in that: A return spring is provided on the top surface of the vertical slot slider (56), and two ends of the return spring are respectively fixedly connected to the pressure plate (52) and the vertical slot slider (56), and the hydraulic rod (51) is fixedly connected to the top plate (3).
4. The intelligent semiconductor component surface treatment device according to claim 3, characterized in that: The clamping mechanism (6) comprises a flip shaft rod (61), the outer surface of the flip shaft rod (61) is rotatably connected to a flip groove plate (62), the inner side of the flip groove plate (62) is slidably connected to an inclined groove rod (63), the side of the inclined groove rod (63) is provided with a through groove (64), the side of each guide plate (4) is fixedly connected to two inclined slide grooves (65), the bottom surface of the inclined groove rod (63) is fixedly connected to a plurality of connecting rods (66), the bottom end of each connecting rod (66) is hingedly connected to a pressure hinge block (6 7), the side of the pressure hinge block (67) is slidably connected to a support plate (69), one end of the support plate (69) is fixedly connected to a pressure guard plate (68), the end of the support plate (69) away from the pressure guard plate (68) is fixedly connected to a baffle (612), the side of the baffle (612) is fixedly connected to a spring sheet (611), the end of the spring sheet (611) away from the baffle (612) is fixedly connected to the pressure hinge block (67), and the inner side of the support plate (69) is rotatably connected to two rollers (610).
5. The intelligent semiconductor component surface treatment device according to claim 4, characterized in that: The flip slot plate (62) slides through the inner side of the through slot (64), the inclined slot (65) is slidably connected to the inclined slot rod (63), a tension spring is provided on the inner side of the inclined slot (65), and two ends of the tension spring are respectively fixedly connected to the inclined slot (65) and the inclined slot rod (63).
6. The intelligent semiconductor component surface treatment device according to claim 5, characterized in that: The cleaning and collecting mechanism (7) comprises a transverse groove rod (71), the bottom surface of the transverse groove rod (71) is fixedly connected to a vertical connecting rod (72), the bottom end of the vertical connecting rod (72) is fixedly connected to a spring baffle (74), and a pressure folding plate (73) is arranged below the platform (9), and a collecting groove (78) is arranged below the pressure folding plate (73).
7. The intelligent semiconductor component surface treatment device according to claim 6, characterized in that: A hopper (77) is fixedly connected to the side of the side guard plate (2) on the left side, two inclined square rods (75) are fixedly connected to the top of the hopper (77), a square rod slider (76) is slidably connected to the outer side of the inclined square rod (75), a scraper (79) is fixedly connected between the two square rod sliders (76), an elastic sheet (710) is fixedly connected to the side of each square rod slider (76), and one end of the elastic sheet (710) away from the square rod slider (76) is fixedly connected to the inclined square rod (75).
8. The intelligent semiconductor component surface treatment device according to claim 7, characterized in that: The inclined groove rod (63) is slidably connected to the horizontal groove rod (71); the vertical connecting rod (72) slides through the top surface of the table plate (9) to the bottom surface; an elastic spring is arranged on the outer side of the bottom end of the vertical connecting rod (72); and the two ends of the elastic spring are respectively fixedly connected to the spring baffle (74) and the pressure folding plate (73); the pressure folding plate (73) is slidably connected to the vertical connecting rod (72); and the collecting trough (78) is fixedly connected to the support frame (1).