Method for comprehensively recovering valuable components of waste circuit board

Abstract

The invention discloses a method for comprehensively recovering valuable components of a waste circuit board, which relates to the technical field of electronic solid waste recovery and comprises the following steps: disassembling the waste circuit board, extracting and reversely extracting a CPU (Central Processing Unit) obtained by disassembling so as to recover and prepare a gold-containing product, crushing and grading the disassembled resin main board to recycle metal powder and non-metal powder; according to the method, the electronic components are separated from the circuit board main substrate, the electronic components are smelted to recover metal, the CPU in the circuit board main substrate is disassembled, extracted and reversely extracted to recover gold, the circuit board main substrate is crushed and screened, and the copper-containing product and the glass fiber reinforced plastic composite material are recovered and prepared. The comprehensive recovery of valuable components is realized, non-metal components in the valuable components are also comprehensively recovered and utilized on the basis of recovering the valuable metals, and the purposes of component utilization in the whole process and no discharge of toxic and harmful substances are realized.

Description

Technical Field

[0001] The invention relates to the technical field of electronic solid waste recycling, and in particular to a method for comprehensive recycling of valuable components of waste circuit boards. Background Art

[0002] With the improvement of science and technology, the frequency of replacement of various electronic products is accelerating. In the past five years, the annual output of electronic solid waste in the world has exceeded 50 million tons, and the growth momentum is rapid. Electronic solid waste contains more heavy metals. Improper treatment will pollute the air, soil, water, etc., posing a huge threat to the environment. At the same time, electronic solid waste also contains a variety of valuable metals. For example, the content of copper, gold and other metals in waste circuit boards is much higher than that of traditional minerals. It is a secondary resource with great economic value, but its overall comprehensive utilization rate is less than 20% at present. It is urgent to improve the level of comprehensive utilization, reduce environmental pollution and create economic benefits.

[0003] Circuit boards are an indispensable core component of various electronic products. my country has long been the largest importer of electronic solid waste in the world, with more than 70% of electronic solid waste flowing into the country every year. Along with these electronic solid wastes, a large number of waste circuit boards are generated. At the same time, my country's annual output value of circuit boards ranks first in the world. A large number of circuit board scraps are generated in the production process, which have not been effectively recycled. These two aspects are the main sources of waste circuit boards in my country. At present, there are only 109 companies in my country with the qualifications for recycling and processing of electronic solid waste. A large amount of electronic solid waste still flows into illegal small workshops for violent dismantling, stacking and incineration, strong acid immersion, etc., causing serious environmental pollution and waste of resources.

[0004] The valuable metals in waste circuit boards are mainly copper and gold. The main processing techniques include physical sorting, pyrolysis, and wet processing. Among them, physical sorting mainly includes disassembly, mechanical crushing, etc., which can initially achieve the purpose of separating various electronic components and substrates as well as metals and non-metals on waste circuit boards. However, the metal powder separated by this method still contains a certain amount of non-metallic substances such as organic resins. It can usually only be used as a rough selection method to obtain intermediate products, and further purification is still required later. Pyrolysis mainly includes incineration, high-temperature pyrolysis, direct smelting, etc., which can burn out the combustible components in waste circuit boards and separate them from metals and glass fibers. Although the pyrolysis process is simple and efficient, the incineration process will produce It produces toxic and harmful gases, consumes a lot of energy, has a high initial investment cost, and a long recovery cycle for enterprises; wet treatment usually allows the target metal to enter the solution based on the different leaching conditions of different metals in the waste circuit boards in the acid solution, and then uses extraction, replacement, precipitation, electrolysis, resin adsorption and other means to extract and recover. Compared with other recovery processes, wet treatment has low energy consumption, good selectivity, and high recovery rate of valuable metals, but large reagent consumption, and requires supporting reagent treatment and water treatment systems. In addition, none of the above processes recovers non-metallic components in waste circuit boards. Therefore, the present invention proposes a method for comprehensive recovery of valuable components of waste circuit boards to solve the problems existing in the prior art. Summary of the invention

[0005] In view of the above problems, the purpose of the present invention is to propose a method for comprehensive recovery of valuable components in waste circuit boards, so as to solve the problems that the existing process for recovering valuable components in waste circuit boards pollutes the environment, consumes a lot of energy, has high costs, and cannot recover non-metallic components in waste circuit boards, and cannot fully recover valuable components.

[0006] In order to achieve the purpose of the present invention, the present invention is implemented by the following technical scheme: a method for comprehensive recovery of valuable components of waste circuit boards, comprising the following steps:

[0007] Step 1: Heat the welding points of the electronic components on the waste circuit board to loosen the electronic components on the waste circuit board, and then use a vibration device to vibrate the waste circuit board to separate the electronic components from the main circuit board substrate;

[0008] Step 2: Sorting the separated electronic components, melting the electronic components except the CPU and recovering the metals, and then crushing the separated circuit board main substrate using crushing equipment, and then crushing the obtained crushed materials using crushing equipment to obtain crushed materials;

[0009] Step 3: split the sorted CPU into a metal backplane and a copper-clad laminate, heat the copper-clad laminate to remove the wafers and capacitors on it, and then add the disassembled CPU components into aqua regia for acid leaching until the metal therein is completely dissolved to obtain gold-containing aqua regia;

[0010] Step 4: extracting the metal in the gold-containing aqua regia with an extractant, stripping the gold-containing organic phase obtained by the extraction with a stripping agent, and then precipitating and calcining the stripping solution obtained by the stripping to obtain a sponge gold product;

[0011] Step 5: Use sorting equipment to separate the crushed material into metal powder and non-metal powder, perform acid leaching, precipitation and filtration on the metal powder to obtain a copper-containing product, perform ball milling and acid leaching on the non-metal powder, and then add a curing agent for curing to obtain a fiberglass composite material.

[0012] A further improvement is that in step one, an electric heating gun is used to heat the welding points of the electronic components on the waste circuit board, the heating temperature of the welding points is 150-300°C, and the vibration equipment is selected from one of a vibrating screen or a jig.

[0013] A further improvement is that in step 2, an intelligent belt sorter or an intelligent robotic arm is used to sort the electronic components, and electronic components of different shapes including CPU, resistors, capacitors and memory sticks are sorted out, among which the CPU is taken out for subsequent processing, and the remaining electronic components are smelted.

[0014] A further improvement is that in the step 2, a shredder is used to crush the main substrate of the circuit board, and the crushed material is screened using a 1 cm screen. The crushing equipment used for the crushed material that passes the screen is selected from a hammer crusher or a universal crusher. The crushed material is screened using a 0.1-0.8 mm screen, and the material that passes the screen is the crushed material.

[0015] A further improvement is that in step three, the specific steps for splitting the CPU are: first, use a blade to insert the gap between the metal backplate and the copper clad laminate of the CPU, and tilt the blade to separate the metal backplate and the copper clad laminate, and then place the separated copper clad laminate at the outer flame position of the alcohol lamp and heat it for 1 to 3 minutes until the capacitor and wafer on the copper clad laminate fall off, thus completing the preliminary separation of different components on the CPU.

[0016] A further improvement is that in step 3, each disassembled CPU is acid-immersed using 50 mL of aqua regia at room temperature for 2 hours.

[0017] The further improvement is that in the step 4, the extractant is prepared by compounding dibutyl carbitol and methyl isobutyl ketone in a volume ratio of 1:2, the ratio O / A is controlled to be 1:5 during the extraction process, the concentration of the extractant is 40-100%, the extraction is carried out in a separatory funnel, and oscillates in a CHA-S digital air bath oscillator for 10-30 minutes, the oscillation frequency is set to 1000-2300 r / min, and the raffinate produced by the extraction is returned to the gold-containing aqua regia for reuse.

[0018] The further improvement is that in the step 4, the stripping agent is an oxalic acid solution with a concentration of 20 to 100 g / L, and the ratio O / A is controlled to be 1 to 15:1 during the stripping process. The stripping solution is first boiled and heated in a beaker for 30 to 120 minutes to produce a gold precipitate at the bottom of the beaker, and then the precipitated product is cooled, washed and dried in turn, and finally calcined to obtain a sponge gold product. The organic phase produced after stripping is returned to continue to be used as an extractant.

[0019] The further improvement is that in the step five, the sorting equipment is selected from one of a shaking table screening machine or a wind screening machine, and the specific steps of acid leaching, precipitation and filtering the metal powder are as follows: concentrated sulfuric acid and metal powder are added to a beaker at a liquid-to-solid ratio of 10:1 and heated to 230-260°C until the metal powder is completely dissolved to obtain a copper-containing solution, and then sodium sulfide is added to the copper-containing solution and reacted to generate a black copper sulfide precipitate, 5g of sodium sulfide is added to each liter of the copper-containing solution, and then the black copper sulfide precipitate is filtered out and heated to 230°C to obtain a copper-containing product.

[0020] The further improvement is that in the step five, the specific steps of preparing the glass fiber reinforced plastic composite material are: first, the non-metallic powder is ball-milled and activated by a ball mill, and the particle size of the non-metallic powder is controlled to be 60-200 meshes, and then the non-metallic powder after ball milling is acid-leached with nitric acid with a concentration of 8-15 mol / L at a liquid-solid ratio of 10:1 to remove metal impurities in the non-metallic powder, and then epoxy resin curing agent and amine curing agent are added to the non-metallic powder after acid leaching, the mixing mass ratio of the non-metallic powder, epoxy resin curing agent and amine curing agent is 10:1:1, and it is placed at room temperature for 7 days, and then cured at high temperature for 6 hours, and the obtained cured product is the glass fiber reinforced plastic composite material.

[0021] The beneficial effects of the present invention are as follows: the present invention separates the electronic components from the main substrate of the circuit board, and smelts the electronic components therein to recover metals, disassembles the CPU therein and performs extraction and stripping to recover gold, crushes and screens the main substrate of the circuit board therein, and recovers and prepares copper-containing products and glass fiber reinforced plastic composite materials, thereby realizing comprehensive recovery of valuable components. On the basis of recovering each valuable metal, the non-metallic components therein are also comprehensively recovered and utilized, thereby realizing the purpose of full-process component utilization without the discharge of toxic and harmful substances, and can solve the environmental pollution problem caused by the accumulation of a large number of waste circuit boards. At the same time, the valuable components recovered therefrom have economic value and can create economic benefits for enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a schematic flow chart of the method for comprehensive recovery of valuable components of waste circuit boards of the present invention. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] The present invention mainly takes waste circuit boards disassembled from electronic devices such as computers, mobile phones and control devices as the main objects, including substrates such as rigid boards, flexible boards, single-sided boards, multi-layer boards and various electronic components such as resistors and capacitors on the circuit boards. The main components include valuable metals such as copper, gold, tin, aluminum and non-metallic components such as glass fiber and plastic.

[0026] Embodiment 1

[0027] See also Figure 1 This embodiment provides a method for comprehensive recovery of valuable components of waste circuit boards, comprising the following steps:

[0028] S1. First, disassemble the waste circuit boards to be recycled from the waste equipment, and use an electric heating gun to heat the welding points of the electronic components on the disassembled waste circuit boards. The heating temperature of the welding points is 150°C, so that the electronic components on the waste circuit boards become loose due to the melting of solder;

[0029] S2, after the electronic components on the waste circuit board are loosened, the waste circuit board is placed in a jig for vibration treatment, and the vibration is used to separate the electronic components on the waste circuit board from the main substrate of the circuit board (i.e., the resin main board);

[0030] S3, using an intelligent belt sorter to sort the electronic components separated in S2, sorting out electronic components of different shapes including CPU, resistors, capacitors and memory sticks, taking out the CPU for subsequent processing after sorting, and smelting the remaining electronic components and recovering the metal;

[0031] The intelligent belt sorting machine used in this embodiment uses high-speed cameras and AI visual recognition technology to perform high-speed identification and sorting of electronic components conveyed by the belt. The intelligent belt sorting machine can process a large amount of materials in a short time and quickly identify different types of electronic components to achieve efficient sorting. Through precise visual recognition technology, the intelligent belt sorting machine can sort electronic components according to type, size, material, etc. with high precision, thereby improving the purity of recycled materials.

[0032] S4, putting the main circuit board substrate separated in S2 into a shredder, using the shear force of the shredder to shred the main circuit board substrate, and screening the obtained shredded material using a 1 cm sieve, and re-shredding the shredded material that does not pass the screening until the material is shredded to less than 1 cm;

[0033] S5, putting the shredded material in S4 into a hammer crusher for crushing, screening the obtained crushed material with a 0.1 mm sieve, re-crushing the crushed material that does not pass the screening, and the crushed material that passes the screening is the crushed material;

[0034] S6. The CPU sorted in S3 of this embodiment is mainly composed of gold and copper. The number of CPU pins varies according to different models, ranging from 980 to 1300. First, a blade is inserted into the gap between the metal back plate and the copper clad plate of the CPU. The metal back plate and the copper clad plate are separated by slightly applying force and tilting the blade. The front of the copper clad plate is metal pins, and the back is capacitors and wafers. The main component of the CPU wafer is single crystal silicon. Then, the separated copper clad plate is placed at the outer flame position of the alcohol lamp and heated for 1 minute until the capacitors and wafers on the copper clad plate fall off, thus completing the preliminary separation of different components on the CPU.

[0035] S7, adding each disassembled CPU component into aqua regia and acid leaching for 2 hours at room temperature until the metal therein is completely dissolved, so as to obtain aqua regia containing gold. In this embodiment, each disassembled CPU is acid leached with 50 mL of aqua regia;

[0036] S8, using dibutyl carbitol and methyl isobutyl ketone in a volume ratio of 1:2 to prepare an extractant, and then using the extractant in a separatory funnel to extract the metals in the gold-containing aqua regia prepared in S7, during the extraction process, the phase ratio O / A is controlled to be 1:5, the extractant concentration is 40%, the extraction solution is oscillated in a CHA-S digital air bath oscillator for 10 minutes, and the oscillation frequency is set to 1000r / min, and the raffinate produced by the extraction is returned to the gold-containing aqua regia for reuse, so as to achieve no waste acid discharge;

[0037] S9, using 20g / L oxalic acid solution as a stripping agent, stripping the gold-containing organic phase obtained by extraction in S8, controlling the phase ratio O / A=1:1 during the stripping process, first boiling and heating the stripping solution in a beaker for 30min to precipitate gold at the bottom of the beaker, i.e., generating gold precipitation, and then cooling, washing and drying the precipitated product in turn, and finally calcining it to obtain a sponge gold product with a purity of more than 99%, and the organic phase generated after stripping is returned to continue to be used as an extractant, so as to achieve no waste acid discharge;

[0038] S10. The main components of the 0.1 mm crushed material prepared in S5 of this embodiment are metal powder, glass fiber, resin and other non-metallic powders. The crushed material is sorted by using a shaking table screening machine or a wind screening machine to separate the metal powder and the non-metallic powder;

[0039] S11. The metal powder in S10 of this embodiment is mainly copper. Concentrated sulfuric acid and metal powder are added to a beaker at a liquid-to-solid ratio of 10:1 and heated to 230° C. After heating for 3 hours, the metal powder is completely dissolved (no obvious technical powder is left in the beaker), and a copper-containing solution is obtained;

[0040] S12, adding sodium sulfide to the copper-containing solution prepared in S11 and reacting to generate a black copper sulfide precipitate, adding 5 g of sodium sulfide per liter of the copper-containing solution, then filtering out the black copper sulfide precipitate and heating it to 230° C. to obtain a copper-containing product;

[0041] S13, using a ball mill to activate the non-metallic powder in S10, and controlling the particle size of the non-metallic powder to be 60-200 meshes, and then acid leaching the non-metallic powder after ball milling with 8 mol / L nitric acid at a liquid-solid ratio of 10:1 to remove metal impurities in the non-metallic powder, so that the metal removal rate reaches 98%;

[0042] S14. After the metal impurities are removed, epoxy resin curing agent and amine curing agent are added to the non-metallic powder. The mixing mass ratio of the non-metallic powder, epoxy resin curing agent and amine curing agent is 10:1:1. The mixture is placed at room temperature for seven days to form, and then cured at high temperature for 6 hours to obtain a glass fiber reinforced plastic composite material that meets the standards.

[0043] Embodiment 2

[0044] See also Figure 1 This embodiment provides a method for comprehensive recovery of valuable components of waste circuit boards, comprising the following steps:

[0045] S1. First, disassemble the waste circuit boards to be recycled from the waste equipment, and use an electric heating gun to heat the welding points of the electronic components on the disassembled waste circuit boards. The heating temperature of the welding points is 300°C, so that the electronic components on the waste circuit boards become loose due to the melting of solder;

[0046] S2, after the electronic components on the waste circuit board are loosened, the waste circuit board is placed in a jig for vibration treatment, and the electronic components on the waste circuit board are separated from the main circuit board substrate by vibration;

[0047] S3, using an intelligent robotic arm to sort the electronic components separated in S2, and sort out electronic components of different shapes including CPU, resistors, capacitors and memory sticks. After the sorting is completed, the CPU is taken out for subsequent processing, and the remaining electronic components are smelted and the metal is recovered;

[0048] The intelligent robot arm used in this embodiment simulates the arm movements of a human through a flexible mechanical structure and control system to grasp and sort electronic components. It can achieve fine manipulation of electronic components and reduce the damage rate through a precise control system and equipped with different end effectors, such as clamps and suction cups, to adapt to the sorting of electronic components of different shapes and sizes.

[0049] S4, putting the main circuit board substrate separated in S2 into a shredder, using the shear force of the shredder to shred the main circuit board substrate, and screening the obtained shredded material using a 1 cm sieve, and re-shredding the shredded material that does not pass the screening until the material is shredded to less than 1 cm;

[0050] S5, putting the shredded material in S4 into a universal crusher for crushing, screening the obtained crushed material with a 0.8 mm sieve, re-crushing the crushed material that does not pass the screening, and the crushed material that passes the screening is the crushed material;

[0051] S6. The CPU sorted in S3 of this embodiment is mainly composed of gold and copper. The number of CPU pins varies according to different models, ranging from 980 to 1300. First, a blade is inserted into the gap between the metal back plate and the copper clad plate of the CPU. The metal back plate and the copper clad plate are separated by slightly applying force and tilting the blade. The front of the copper clad plate is metal pins, and the back is capacitors and wafers. The main component of the CPU wafer is single crystal silicon. Then, the separated copper clad plate is placed at the outer flame position of an alcohol lamp and heated for 3 minutes until the capacitors and wafers on the copper clad plate fall off, thus completing the preliminary separation of different components on the CPU.

[0052] S7, adding each disassembled CPU component into aqua regia and acid leaching for 2 hours at room temperature until the metal therein is completely dissolved, so as to obtain aqua regia containing gold. In this embodiment, each disassembled CPU is acid leached with 50 mL of aqua regia;

[0053] S8, using dibutyl carbitol and methyl isobutyl ketone in a volume ratio of 1:2 to prepare an extractant, and then using the extractant in a separatory funnel to extract the metals in the gold-containing aqua regia prepared in S7, during the extraction process, the phase ratio O / A is controlled to be 1:5, the extractant concentration is 100%, the extraction solution is oscillated in a CHA-S digital display air bath oscillator for 30 minutes, and the oscillation frequency is set to 2300r / min, and the raffinate produced by the extraction is returned to the gold-containing aqua regia for reuse, so as to achieve no waste acid discharge;

[0054] S9, using 100g / L oxalic acid solution as a stripping agent, stripping the gold-containing organic phase obtained by extraction in S8, controlling the phase ratio O / A=15:1 during the stripping process, first boiling and heating the stripping solution in a beaker for 120min to precipitate gold at the bottom of the beaker, i.e., generating gold precipitation, and then cooling, washing and drying the precipitated product in turn, and finally calcining it to obtain a sponge gold product with a purity of more than 99%, and the organic phase generated after stripping is returned to continue to be used as an extractant, so as to achieve no waste acid discharge;

[0055] S10. The main components of the 0.8 mm crushed material prepared in S5 of this embodiment are metal powder, glass fiber, resin and other non-metallic powders. The crushed material is sorted by using a shaking table screening machine or a wind screening machine to separate the metal powder and the non-metallic powder;

[0056] S11. The metal powder in S10 of this embodiment is mainly copper. Concentrated sulfuric acid and metal powder are added to a beaker at a liquid-to-solid ratio of 10:1 and heated to 260° C. After heating for 3 hours, the metal powder is completely dissolved (no obvious technical powder is left in the beaker), and a copper-containing solution is obtained;

[0057] S12, adding sodium sulfide to the copper-containing solution prepared in S11 and reacting to generate a black copper sulfide precipitate, adding 5 g of sodium sulfide per liter of the copper-containing solution, then filtering out the black copper sulfide precipitate and heating it to 230° C. to obtain a copper-containing product;

[0058] S13, using a ball mill to activate the non-metallic powder in S10, and controlling the particle size of the non-metallic powder to be 60-200 meshes, and then acid leaching the non-metallic powder after ball milling with nitric acid having a concentration of 15 mol / L at a liquid-solid ratio of 10:1 to remove metal impurities in the non-metallic powder, so that the metal removal rate reaches 98%;

[0059] S14. After the metal impurities are removed, epoxy resin curing agent and amine curing agent are added to the non-metallic powder. The mixing mass ratio of the non-metallic powder, epoxy resin curing agent and amine curing agent is 10:1:1. The mixture is placed at room temperature for seven days to form, and then cured at high temperature for 6 hours to obtain a glass fiber reinforced plastic composite material that meets the standards.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for comprehensive recovery of valuable components from waste circuit boards, characterized in that: The following steps are involved: Step 1: Heat the welding points of the electronic components on the waste circuit board to loosen the electronic components on the waste circuit board, and then use a vibration device to vibrate the waste circuit board to separate the electronic components from the main circuit board substrate; Step 2: Sorting the separated electronic components, melting the electronic components except the CPU and recovering the metals, and then crushing the separated circuit board main substrate using crushing equipment, and then crushing the obtained crushed materials using crushing equipment to obtain crushed materials; Step 3: split the sorted CPU into a metal backplane and a copper-clad laminate, heat the copper-clad laminate to remove the wafers and capacitors on it, and then add the disassembled CPU components into aqua regia for acid leaching until the metal therein is completely dissolved to obtain gold-containing aqua regia; Step 4: extracting the metal in the gold-containing aqua regia with an extractant, stripping the gold-containing organic phase obtained by the extraction with a stripping agent, and then precipitating and calcining the stripping solution obtained by the stripping to obtain a sponge gold product; Step 5: Use sorting equipment to separate the crushed material into metal powder and non-metal powder, perform acid leaching, precipitation and filtration on the metal powder to obtain a copper-containing product, perform ball milling and acid leaching on the non-metal powder, and then add a curing agent for curing to obtain a fiberglass composite material.

2. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 1, an electric heating gun is used to heat the welding points of the electronic components on the waste circuit board, the heating temperature of the welding points is 150-300° C., and the vibration equipment is selected from a vibration screen or a jig.

3. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 2, an intelligent belt sorter or an intelligent robotic arm is used to sort the electronic components, and electronic components of different shapes including CPU, resistors, capacitors and memory sticks are sorted out, wherein the CPU is taken out for subsequent processing, and the remaining electronic components are smelted.

4. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 2, a shredder is used to shred the main substrate of the circuit board, and the shredded material is screened using a 1 cm sieve. The crushing equipment used for the shredded material is selected from a hammer crusher or a universal crusher. The shredded material is screened using a 0.1-0.8 mm sieve, and the material that passes the sieve is the shredded material.

5. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step three, the specific steps for splitting the CPU are: first use a blade to insert the gap between the metal back plate and the copper clad laminate of the CPU, and tilt the blade to separate the metal back plate and the copper clad laminate, and then place the separated copper clad laminate on the outer flame position of the alcohol lamp and heat it for 1 to 3 minutes until the capacitor and wafer on the copper clad laminate fall off, thus completing the preliminary separation of different components on the CPU.

6. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 3, each disassembled CPU was acid-leached using 50 mL of aqua regia at room temperature for 2 hours.

7. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 4, the extractant is prepared by compounding dibutyl carbitol and methyl isobutyl ketone in a volume ratio of 1:

2. During the extraction process, the ratio O / A is controlled to be 1:5, the concentration of the extractant is 40-100%, the extraction is carried out in a separatory funnel, and oscillates in a CHA-S digital air bath oscillator for 10-30 minutes, and the oscillation frequency is set to 1000-2300 r / min. The raffinate produced by the extraction is returned to the gold-containing aqua regia for reuse.

8. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 4, the stripping agent is an oxalic acid solution with a concentration of 20 to 100 g / L. During the stripping process, the ratio O / A is controlled to be 1 to 15:

1. The stripping solution is first boiled and heated in a beaker for 30 to 120 minutes to produce a gold precipitate at the bottom of the beaker. The precipitated product is then cooled, washed and dried in sequence, and finally calcined to obtain a sponge gold product. The organic phase produced after stripping is returned to continue to be used as an extractant.

9. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 5, the sorting equipment is selected from one of a shaking table screening machine or a wind screening machine, and the specific steps of acid leaching, precipitation and filtering the metal powder are as follows: adding concentrated sulfuric acid and metal powder to a beaker at a liquid-to-solid ratio of 10:1 and heating to 230-260°C until the metal powder is completely dissolved to obtain a copper-containing solution, and then adding sodium sulfide to the copper-containing solution and reacting to generate a black copper sulfide precipitate, adding 5g of sodium sulfide per liter of the copper-containing solution, and then filtering the black copper sulfide precipitate out and heating it to 230°C to obtain a copper-containing product.

10. The method for comprehensive recovery of valuable components from waste circuit boards according to claim 1, characterized in that: In the step 5, the specific steps of preparing the glass fiber reinforced plastic composite material are: firstly, the non-metallic powder is ball-milled and activated by a ball mill, and the particle size of the non-metallic powder is controlled to be 60-200 meshes, and then the non-metallic powder after ball milling is acid-leached with nitric acid with a concentration of 8-15 mol / L at a liquid-solid ratio of 10:1 to remove metal impurities in the non-metallic powder, and then epoxy resin curing agent and amine curing agent are added to the non-metallic powder after acid leaching, and the mixing mass ratio of the non-metallic powder, epoxy resin curing agent and amine curing agent is 10:1:1, and it is placed at room temperature for 7 days, and then cured at high temperature for 6 hours, and the obtained cured product is the glass fiber reinforced plastic composite material.

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