Cooling chamber and semiconductor process equipment

Abstract

The invention provides a cooling chamber which is applied to semiconductor process equipment. The cooling chamber includes: a cavity; the cooling assembly comprises a cooling part used for cooling the part to be cooled, and the cooling part is movably arranged in the cavity and can be switched between an avoiding position and a working position; at the working position, the cooling part is positioned above or below the to-be-cooled part; and in the avoiding position, the cooling part is located on the periphery of the to-be-cooled part, so that the to-be-cooled part can be conveyed into or out of the cavity. And the movable cooling part is used for cooling the to-be-cooled part. And when the cooling part moves to the working position, the cooling part is located above or below the to-be-cooled part, so that the cooling effect on the to-be-cooled part is improved. And when the cooling part moves to the avoiding position, the cooling part is located on the periphery of the to-be-cooled part, so that interference caused by movement of the to-be-cooled part is avoided. The invention also provides semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the field of battery technology, and in particular to a cooling chamber and semiconductor process equipment. Background Art

[0002] Heterojunction (HJT) solar cells are expected to become the next generation of battery technology due to their advantages such as fewer process steps and high cell quality. The process steps for preparing HJT cells include cleaning and texturing, amorphous silicon film deposition, conductive film deposition, and screen printing. Among them, amorphous silicon film deposition is made with the help of plasma enhanced chemical vapor deposition (PECVD) equipment. Common PECVD equipment layouts include cluster and chain structures.

[0003] In the HJT equipment production line, since the cost of PECVD equipment accounts for the main part of the production line equipment, in order to reduce the equipment cost, in recent years, manufacturers have increased the output of carriers to increase equipment capacity and reduce costs. Among them, the structure of laminated graphite boats is used to increase production capacity. The graphite boat uses upper and lower plates to form electrodes and generates plasma between layers, thereby meeting the chain equipment, greatly expanding the equipment capacity without increasing the floor space.

[0004] Since the process temperature of PECVD equipment is about 200℃, if the high temperature causes the graphite boat to be transferred out of the process chamber, it is easy to come into contact with the air and affect the performance of the battery cell. When a multi-layer carrier boat is used, the high temperature problem of the battery cell becomes more prominent. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a cooling chamber to cool a part to be cooled, thereby solving the problem of high temperature of the part to be cooled after process treatment.

[0006] In order to achieve the purpose of the present invention, a cooling chamber is provided, which is applied to semiconductor process equipment. The cooling chamber comprises: a cavity; a cooling assembly, comprising a cooling part for cooling a part to be cooled, the cooling part being movably arranged in the cavity and being able to switch between an avoidance position and a working position; wherein, in the working position, the cooling part is located above or below the part to be cooled; in the avoidance position, the cooling part is located at the periphery of the part to be cooled so that the part to be cooled can be transferred into or out of the cavity.

[0007] Furthermore, there are multiple parts to be cooled, and they are divided into multiple groups to be cooled according to their different heights in the cavity; every two adjacent groups to be cooled are spaced apart in the vertical direction; there are multiple cooling parts, and when the multiple cooling parts are all in the working position, there is at least one cooling part between every two adjacent groups to be cooled.

[0008] Furthermore, the multiple cooling parts are divided into multiple cooling groups in a first direction parallel to the horizontal plane, each cooling group has multiple cooling parts, and they are arranged at intervals in the vertical direction; the cooling parts in every two adjacent cooling groups are staggered in the vertical direction.

[0009] Furthermore, the part to be cooled can be transferred into or out of the cavity along a first direction; the cooling assembly can switch between an avoidance position and a working position along a second direction, the second direction is perpendicular to the first direction, and the second direction is parallel to a horizontal plane.

[0010] Furthermore, the cooling component also includes: a plurality of pipeline units, the number of the pipeline units is the same as the number of cooling groups, and they are connected one-to-one, each pipeline unit is used to transport cooling medium to the corresponding cooling group, so that each cooling part of the cooling group performs contact cooling or non-contact cooling on the cooling part through the cooling medium; a flow control unit, including a plurality of flow controllers, the number of the flow controllers is the same as the number of pipeline units, and they are connected one-to-one, each flow controller is used to control the flow of cooling medium transported by the corresponding pipeline unit to the cooling group.

[0011] Furthermore, each pipeline unit includes a first pipeline and multiple second pipelines, the number of the second pipelines is the same as the number of cooling parts in the cooling group, and are connected one-to-one; one end of the second pipeline is connected to the cooling part, the other end of the second pipeline is connected to the first pipeline, and the other end of the first pipeline is connected to the flow control unit; the second pipeline is arranged in the cavity, and the first pipeline passes through the cavity and extends outside the cavity.

[0012] Furthermore, it also includes: a plurality of bellows, the number of the bellows is the same as the number of the first pipes, and they are arranged one by one; wherein the bellows are arranged at the part of the first pipe located outside the cavity, and are used to seal the through hole formed on the cavity by the first pipe passing through the cavity.

[0013] Furthermore, the cooling assembly also includes: a driving unit connected to the multiple cooling parts, and the driving unit is used to drive the multiple cooling parts to move synchronously between the avoidance position and the working position.

[0014] Furthermore, it also includes: a transmission component, which is arranged on the inner wall of the cavity, and the transmission component is used to carry the part to be cooled and transfer the part to be cooled into or out of the cavity.

[0015] The present invention further provides a semiconductor process equipment, comprising a process chamber and the above-mentioned cooling chamber connected in sequence, wherein the cooling chamber is used to cool the part to be cooled removed from the process chamber.

[0016] The present invention has the following beneficial effects:

[0017] In the present application, a movable cooling unit is used to cool the part to be cooled. When the cooling unit moves to the working position, the cooling unit is located above or below the part to be cooled to improve the cooling effect on the part to be cooled. When the cooling unit moves to the avoidance position, the cooling unit is located outside the part to be cooled to avoid interfering with the movement of the part to be cooled.

[0018] Other objects and features of the present invention will become apparent by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 It is a structural schematic diagram of process equipment in the related technology.

[0021] Figure 2 It is a structural schematic diagram of a cooling part in a cooling chamber in an embodiment of the present invention at a working position.

[0022] Figure 3 It is a structural schematic diagram of a cooling part in a cooling chamber in an embodiment of the present invention at an avoidance position.

[0023] Figure 4 It is a structural schematic diagram of a part to be cooled in a cooling chamber according to an embodiment of the present invention.

[0024] Figure 5 It is a structural schematic diagram of a laminated graphite boat loaded with battery cells according to an embodiment of the present invention.

[0025] Figure 6 Schematic diagram of the structure of the pipeline unit of the cooling chamber according to the embodiment of the present invention.

[0026] as well as

[0027] Figure 7 It is a schematic structural diagram of a semiconductor process equipment according to an embodiment of the present invention.

[0028] Description of main component symbols:

[0029] 1. Process equipment; 2. Vacuum pump; 3. Vacuum pipeline; 4. Vacuum chamber; 5. Cooling water circuit;

[0030] 10. Cooling chamber;

[0031] 100, cavity;

[0032] 200, cooling assembly; 210, cooling group; 211, cooling unit; 220, pipeline unit;

[0033] 221, first pipeline; 222, second pipeline; 230, flow control unit; 240, drive unit; 201, first cooling group; 202, second cooling group; 203, third cooling group; 204, fourth cooling group;

[0034] 300, bellows;

[0035] 500, transmission component;

[0036] 600, temperature measurement component;

[0037] 710, vacuum pump; 720, vacuum pipeline;

[0038] 800, gas regulating plate;

[0039] 21. Battery cell; 22. Laminated graphite boat; 22a. Support plate; 22b. Upper electrode plate;

[0040] 22c, lower electrode plate; 22d, support column;

[0041] 30. Loading chamber; 40. Preheating chamber; 50. Process chamber; 60. Unloading chamber. DETAILED DESCRIPTION

[0042] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0043] Figure 1 It is a structural schematic diagram of the process equipment in the related technology. Figure 1 In the related art, when the process equipment 1 is used to cool the battery cells, a laminated graphite boat is generally used to load the battery cells, and the laminated graphite boat carries the battery cells into the vacuum chamber 4 of the process equipment 1. The vacuum chamber 4 is provided with a vacuum environment by a vacuum pump 2 and a vacuum pipeline 3. A cooling water channel 5 is also provided on the periphery of the vacuum chamber 4, and a cooling medium-water is passed through the cooling water channel 5, and the inner wall of the chamber of the vacuum chamber 4 is cooled by the cooling water channel 5. After the laminated graphite boat is sent into the vacuum chamber 4, the related art uses the cooled inner wall of the chamber to cool the battery cells on the laminated graphite boat so as to reduce the temperature of the battery cells on the laminated graphite boat.

[0044] However, since the cooling water channel 5 can only cool the inner wall of the chamber, there is a certain distance between the laminated graphite boat and the inner wall of the chamber, which will reduce the cooling effect of the inner wall of the chamber. In addition, in the vacuum environment of the vacuum chamber 4, due to the lack of heat exchange, the cooling speed of the battery cells on the laminated graphite boat is slow, which increases the cooling time of the battery cells and affects the process.

[0045] In response to the technical problem of poor cooling effect on the laminated graphite boat loaded with battery cells in the above-mentioned related technologies, the present application proposes a cooling chamber 10 to cool the laminated graphite boat 22. The purpose of cooling the battery cells 21 is achieved by cooling the laminated graphite boat 22, thereby solving the problem of high temperature of the laminated graphite boat 22 and the battery cells 21 after processing and improving the cooling effect.

[0046] The cooling chamber 10 of this embodiment is applied to semiconductor process equipment. Figure 2 2 is a schematic structural diagram of the cooling portion 211 in the cooling chamber 10 in the working position according to the embodiment of the present invention. Figure 3 2 is a schematic structural diagram of the cooling portion 211 in the cooling chamber 10 in the avoidance position according to the embodiment of the present invention. Figure 2 and Figure 3 The cooling chamber 10 includes a cavity 100 and a cooling assembly 200 .

[0047] The cavity 100 can be fixed on a frame (not shown in the figure), and the cavity 100 is used to provide a vacuum environment, and the cooling member is cooled in the vacuum environment provided by the cavity 100. Figure 2 and Figure 3 The cooling chamber 10 further includes a vacuum pump 710 disposed outside the cavity 100 and a vacuum pipeline 720 disposed between the vacuum pump 710 and the cavity 100. The vacuum pump 710 and the vacuum pipeline 720 are used to provide a vacuum environment to the cavity 100. It is understandable that other vacuum devices may be connected to the cavity 100 to provide a vacuum environment to the cavity 100.

[0048] The cooling assembly 200 includes a cooling portion 211. The cooling portion 211 is used to cool the part to be cooled.

[0049] The cooling part 211 is movably disposed in the cavity 100 and can be switched between the avoidance position and the working position. In other words, the cooling part 211 can be moved to the avoidance position, and the cooling part 211 can also be moved to the working position.

[0050] In the working position, the cooling part 211 is located above or below the part to be cooled. In the avoidance position, the cooling part 211 is located outside the part to be cooled so that the part to be cooled can be passed into or out of the cavity 100. It should be noted that in the working position, the cooling part 211 is used to cool the part to be cooled to achieve the cooling effect of the cooling part 211. In the avoidance position, the cooling part 211 stops cooling.

[0051] It should be noted that the laminated graphite boat 22 includes a plurality of support plates 22a spaced apart in the vertical direction, and the support plates 22a are used to place substrates. In some embodiments, the plurality of support plates 22a include an upper plate 22b and a lower plate 22c, and an electrode is formed between the upper plate 22b and the lower plate 22c, and plasma can be generated in the gap between the two, so that deposition can be performed on the substrate located in the gap. The laminated graphite boat 22 can not only meet the needs of chain equipment, but also greatly expand efficiency and production capacity without increasing the floor space. The laminated graphite boat 22 also includes a support column 22d for connecting the plurality of support plates 22a, and the support column 22d is arranged in the vertical direction to ensure that the plurality of support plates 22a are spaced apart.

[0052] The object to be cooled in this embodiment may be the battery cell 21, that is, the cooling unit 211 is located above the battery cell 21 (in the middle of the support plate 22a) when in the working position. Figure 3 , Figure 4 The cooling parts 211 are evenly distributed at intervals to cool the support plate 22a, thereby cooling the battery cells in the support plate 22a.

[0053] In this embodiment, the battery cell 21 is loaded and fed in by the laminated graphite boat 22. Since the battery cell 21 is in contact with the laminated graphite boat 22, the temperature change of the laminated graphite boat 22 will also affect the temperature change of the battery cell 21. That is, the cooling unit 211 cools the laminated graphite boat 22 to cool the battery cell 21, thereby solving the problem of high temperature of the laminated graphite boat 22 and the battery cell 21 after processing, and improving the cooling effect.

[0054] In this embodiment, a movable cooling unit 211 is used to cool the part to be cooled. When the cooling unit 211 moves to the working position, the cooling unit 211 is evenly arranged in the graphite boat, and the graphite boat is cooled to cool the battery cell. When the cooling unit 211 moves to the avoidance position, the cooling unit 211 is located at the periphery of the part to be cooled to avoid interference caused by the cooling assembly 200 on the movement of the part to be cooled (the movement of the part to be cooled refers to the transfer of the part to be cooled into or out of the cavity 100).

[0055] Figure 4 1 is a schematic diagram of the structure of the cooling member in the cooling chamber 10 according to the embodiment of the present invention. There are multiple cooling members, and they are arranged in the chamber 100 according to their height (height direction, i.e. Figure 4 Each adjacent group of cooling groups is divided into multiple groups in the vertical direction (the vertical direction is Figure 4 The interval setting is in the z direction.

[0056] There are multiple cooling parts 211, and when the multiple cooling parts 211 are all in the working position, there is at least one cooling part 211 between every two adjacent groups to be cooled, so as to ensure the cooling effect of each part to be cooled.

[0057] In some embodiments, the plurality of cooling parts 211 are divided into a plurality of cooling groups 210 in a first direction parallel to the horizontal plane (the y direction in the drawings), and each cooling group 210 includes a plurality of cooling parts 211, which are arranged at intervals in the vertical direction, that is, each cooling group 210 includes a plurality of cooling parts 211 arranged at intervals in the z direction. The cooling parts 211 in each two adjacent cooling groups 210 are staggered in the vertical direction (the z direction in the drawings).

[0058] The above embodiment is explained below by using a specific embodiment. It should be understood that the above embodiment is not specifically limited.

[0059] See also Figure 4 The plurality of cooling groups 210 include a first cooling group 201, a second cooling group 202, a third cooling group 203 and a fourth cooling group 204 arranged in sequence along a first direction (y direction in the drawing), and each group of cooling groups 210 includes three cooling parts 211 arranged in sequence in a vertical direction (z direction in the drawing). The plurality of cooling groups include 7 groups, namely, a first cooling group (located at the top), a second cooling group, a third cooling group, a fourth cooling group, a fifth cooling group, a sixth cooling group and a seventh cooling group arranged in a vertical direction downward.

[0060] The three cooling units 211 of the first cooling group 201 can be moved respectively between the first group to be cooled and the second group to be cooled, between the third group to be cooled and the fourth group to be cooled, and between the fifth group to be cooled and the sixth group to be cooled.

[0061] The three cooling units 211 of the second cooling group 202 can be moved respectively between the second group to be cooled and the third group to be cooled, between the fourth group to be cooled and the fifth group to be cooled, and between the sixth group to be cooled and the seventh cooling group.

[0062] The distribution of the cooling units 211 of the third cooling group 203 is the same as the distribution of the cooling units 211 of the second cooling group 202. The distribution of the cooling units 211 of the fourth cooling group 204 is the same as the distribution of the cooling units 211 of the first cooling group 201.

[0063] In the above specific embodiment, there is at least one cooling portion 211 between every two adjacent groups to be cooled, so as to ensure the cooling effect of each component to be cooled.

[0064] Specifically, the cooling member can be transferred into or out of the cavity 100 along the first direction (the y direction in the figure), that is, the cooling member can be moved into the cavity 100 along the positive direction of the y direction (indicated by the arrow), and the cooling member can be moved out of the cavity 100 along the reverse direction of the y direction. The cooling assembly 200 can switch between the avoidance position and the working position along the second direction (the x direction in the figure), that is, the cooling assembly 200 can be moved to the avoidance position along the positive direction of the x direction (indicated by the arrow), and the cooling assembly 200 can be moved to the working position along the reverse direction of the x direction. The second direction in the above specific embodiment is perpendicular to the first direction, and the second direction is parallel to the horizontal plane.

[0065] In some embodiments, the cooling assembly 200 further includes a plurality of pipe units 220 and a flow control unit 230 .

[0066] The number of the pipe units 220 is the same as the number of the cooling groups 210, and they are connected one by one. Each pipe unit 220 is used to transport cooling medium to the corresponding cooling group 210, so that each cooling part 211 of the cooling group 210 performs contact cooling or non-contact cooling on the cooling member through the cooling medium.

[0067] In some embodiments, the cooling medium may be liquid or gaseous. The liquid cooling medium may be water or other liquid capable of heat exchange. The cooling portion 211 may include a U-shaped tube, and the liquid cooling medium flows in the U-shaped tube. The U-shaped tube may be used to cool the space above or below the part to be cooled, so that the liquid cooling medium and the part to be cooled are non-contact cooled, and the distance between the two is small, thereby improving the cooling effect and shortening the cooling time.

[0068] In other embodiments, the gaseous cooling medium may be nitrogen or other gases capable of achieving heat exchange. The cooling portion 211 may be provided with a plurality of evenly distributed spray holes, so that the gaseous cooling medium is sprayed to the top or bottom of the part to be cooled by the spray holes, so that the gaseous cooling medium and the part to be cooled are contact-cooled, thereby improving the heat exchange efficiency and thus improving the cooling effect.

[0069] In order to solve the technical problem that the lack of heat exchange in the vacuum environment leads to a slow cooling speed of the battery cells 21 on the laminated graphite boat 22. In some embodiments, see Figure 2 and Figure 3 The cooling chamber 10 further includes a gas regulating plate 800, which is used to regulate the flow field of the gaseous cooling medium in the cavity 100 when the cooling medium is gas, so as to improve the fluidity of the gaseous cooling medium. The gas regulating plate 800 can be arranged in the cavity 100 and close to one side of the vacuum pump 710 to improve its effect.

[0070] The flow control unit 230 includes a plurality of flow controllers. The number of the flow controllers is the same as the number of the pipeline units 220, and the flow controllers are connected one by one. Each flow controller is used to control the flow of the cooling medium delivered by the corresponding pipeline unit 220 to the cooling group 210.

[0071] It can be understood that the cooling assembly 200 also includes a liquid source or a gas source for providing a cooling medium to the pipeline unit 220 .

[0072] Figure 6 2 is a schematic structural diagram of the pipeline unit 220 of the cooling chamber 10 according to an embodiment of the present invention. Figure 6 Each pipe unit 220 includes a first pipe 221 and a plurality of second pipes 222. The number of the second pipes 222 is the same as the number of the cooling units 211 in the cooling group 210, and they are connected one by one.

[0073] One end of the second pipe 222 is connected to the cooling unit 211, the other end of the second pipe 222 is connected to the first pipe 221, and the other end of the first pipe 221 is connected to the flow control unit 230. The second pipe 222 is disposed in the cavity 100, and the first pipe 221 passes through the cavity 100 and extends outside the cavity 100.

[0074] In some embodiments, see Figure 6 Each pipe unit 220 includes three second pipes 222 and one first pipe 221, wherein the second pipe 222 is L-shaped or "straight-shaped". Each cooling group 210 includes three cooling parts 211, and one end of each second pipe 222 away from the first pipe 221 is provided with a cooling part 211. Each pipe unit 220 also includes a four-way pipe joint for welding and connecting the three second pipes 222 and the one first pipe 221.

[0075] See also Figure 6 The cooling chamber 10 further includes a plurality of bellows 300. The number of the bellows 300 is the same as the number of the first pipes 221, and they are arranged one by one. The bellows 300 are arranged at the portion of the first pipe 221 outside the cavity 100, and are used to seal the through hole formed on the cavity 100 by the first pipe 221 passing through the cavity 100.

[0076] In some embodiments, the bellows 300 may be made of metal so as to be able to withstand vacuum pressure and improve the sealing effect.

[0077] See also Figure 2 and Figure 3 The cooling assembly 200 further includes a driving unit 240. The driving unit 240 is connected to the plurality of cooling parts 211, and the driving unit 240 is used to drive the plurality of cooling parts 211 to synchronously move between the avoidance position and the working position.

[0078] It can be understood that the driving unit 240 can provide power to the cooling portion 211 to move between the avoidance position and the working position.

[0079] In some embodiments, the driving unit 240 is fixedly connected to the outer wall of the cavity 100 and is located between the cavity 100 and the flow control unit 230. The driving unit 240 is used to drive the flow control unit 230 to move along the second direction, and then the flow control unit 230 drives the pipeline unit 220 to move along the second direction, and finally the plurality of cooling parts 211 move synchronously between the working position and the avoidance position along the second direction.

[0080] For details, see Figure 2 and Figure 3 When the driving unit 240 drives the flow control unit 230 to move along the positive direction of the x direction, the flow control unit will drive the pipeline unit 220 to move along the positive direction of the x direction, thereby causing the cooling unit 211 to move to the avoidance position along the positive direction of the x direction.

[0081] When the driving unit 240 drives the flow control unit 230 to move in the opposite direction of the x direction, the flow control unit drives the pipeline unit 220 to move in the opposite direction of the x direction, thereby moving the cooling part 211 in the opposite direction of the x direction to the working position.

[0082] In the above embodiment, the flow control unit 230 may be disposed on a slide rail (not shown in the figure) fixed to the outer wall of the cavity 100 so that it can move along the second direction under the drive of the driving unit 240 .

[0083] In the above embodiment, one end of the bellows 300 is fixedly connected to the outer wall of the cavity 100, and the other end is fixedly connected to the flow control unit 230, so that the bellows 300 can ensure the dynamic sealing of the cavity 100 when the pipeline unit 220 moves along the second direction. A sealing ring can also be provided at the connection between the two ends of the bellows 300 to further improve the sealing performance of the cavity 100.

[0084] Optionally, the driving unit 240 may include a cylinder, and an output shaft of the cylinder is connected to the flow control unit 230 .

[0085] Figure 5 FIG. 2 is a schematic structural diagram of a laminated graphite boat 22 loaded with battery cells 21 according to an embodiment of the present invention. Figure 4 and Figure 5 The cooling chamber 10 also includes a transmission component 500 .

[0086] The transmission assembly 500 is disposed on the inner wall of the chamber 100 . The transmission assembly 500 is used to carry the laminated graphite boat 22 and transfer the laminated graphite boat into or out of the chamber 100 .

[0087] In some embodiments, the transmission assembly 500 includes multiple rows of synchronously rotating transmission wheels, and each row of transmission wheels includes multiple rollers spaced apart along the second direction.

[0088] In some embodiments, the cooling chamber 10 is further provided with a film transmission port and a sealing valve provided at the film transmission port. The piece to be cooled can be passed into or out of the cavity 100 through the film transmission port. The sealing valve can seal or open the film transmission port.

[0089] In some embodiments, the cooling chamber 10 further includes a temperature measuring component 600 disposed outside the cavity 100 to measure the temperature of the battery cell 21 or the laminated graphite boat 22. Optionally, the temperature measuring component 600 may include an infrared thermometer, and a glass window is disposed on the cavity 100 corresponding to the infrared thermometer.

[0090] Figure 7 Schematic diagram of the structure of semiconductor process equipment according to an embodiment of the present invention. Figure 7 The semiconductor process equipment has a chain structure layout, and the semiconductor process equipment includes a process chamber 50 and the cooling chamber 10 of the above embodiment connected in sequence.

[0091] In some embodiments, the semiconductor process equipment may further include a loading chamber 30 , a preheating chamber 40 , and a unloading chamber 60 .

[0092] The graphite boat loaded with substrates such as silicon wafers is transferred to the preheating chamber 40 via the loading chamber 30 and then enters the process chamber 50 for processing. After the process is completed, the process flow of the battery cell is completed via the cooling chamber 10 and the unloading chamber 60.

[0093] Specifically, when the battery cell 21 needs to be cooled after the process, the following steps are included:

[0094] The interior of the cavity 100 is in a vacuum state, and the driving unit 240 drives the multiple cooling parts 211 to the avoidance position, and then the laminated graphite boat 22 carries the multiple battery cells 21 and moves from the film transfer port to the cavity 100. After closing the film transfer port, the vacuum pump 710 is used to evacuate the cavity 100 to a stable vacuum state (since the film transfer port is open, the vacuum state inside the cavity 100 will be destroyed, so it is necessary to provide a vacuum environment to the interior of the cavity 100 again after the film transfer port is closed). The driving unit 240 then drives the multiple cooling parts 211 to move from the avoidance position to the working position. After the multiple cooling parts 211 are in the working position, the flow control unit 230 controls the flow of the cooling gas flowing to the cooling part 211 through the pipeline unit 220, and each cooling part 211 provides high-purity nitrogen (cooling medium) to each layer of the laminated graphite boat 22 in an intermittent spraying manner, and each spraying lasts for 3 minutes, with an interval of 2 minutes. During the time when the spraying is stopped, an infrared thermometer is used to perform multi-point measurements on multiple different positions of the laminated graphite boat 22, and finally an average value is taken to obtain the measured temperature value of the laminated graphite boat 22. When the measured temperature value of the laminated graphite boat 22 is lower than the preset temperature value, the cooling unit 211 stops spraying the laminated graphite boat 22, wherein the preset temperature value can be 40 degrees Celsius or other temperature values, which can be specifically limited according to actual conditions. The driving unit 240 is used to move the multiple cooling units 211 from the working position to the avoidance position, and then the laminated graphite boat 22 is transferred out of the cavity 100, and the cooling is completed.

[0095] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0096] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0097] In the description of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0098] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0099] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A cooling chamber, characterized in that: Applied to semiconductor process equipment, the cooling chamber comprises: Cavity; A cooling assembly, comprising a cooling portion for cooling a part to be cooled, wherein the cooling portion is movably disposed in the cavity and can be switched between an avoidance position and a working position; Wherein, in the working position, the cooling part is located above or below the part to be cooled; In the avoidance position, the cooling portion is located at the periphery of the component to be cooled, so that the component to be cooled can be transferred into or out of the cavity.

2. The cooling chamber according to claim 1, characterized in that There are multiple parts to be cooled, and they are divided into multiple groups to be cooled according to their different heights in the cavity; each two adjacent groups to be cooled are spaced apart in the vertical direction; There are a plurality of cooling parts, and when the plurality of cooling parts are located at the working position, there is at least one cooling part between every two adjacent groups of the groups to be cooled.

3. The cooling chamber according to claim 2, characterized in that: The plurality of cooling parts are divided into a plurality of cooling groups in a first direction parallel to the horizontal plane, each cooling group has a plurality of cooling parts, and the cooling parts are arranged at intervals in the vertical direction; The cooling parts in every two adjacent cooling groups are staggered in the vertical direction.

4. The cooling chamber according to claim 3, characterized in that: The part to be cooled can be transferred into or out of the cavity along the first direction; The cooling assembly can switch between the avoidance position and the working position along a second direction, wherein the second direction is perpendicular to the first direction and parallel to a horizontal plane.

5. The cooling chamber according to claim 3, characterized in that: The cooling assembly also includes: A plurality of pipeline units, the number of the pipeline units is the same as the number of the cooling groups, and the pipeline units are connected one by one, and each pipeline unit is used to transport a cooling medium to the corresponding cooling group, so that each cooling part of the cooling group performs contact cooling or non-contact cooling on the part to be cooled through the cooling medium; A flow control unit includes a plurality of flow controllers, the number of which is the same as the number of the pipeline units and they are connected one-to-one, and each of the flow controllers is used to control the flow of the cooling medium delivered by the corresponding pipeline unit to the cooling group.

6. The cooling chamber according to claim 5, characterized in that Each of the pipeline units includes a first pipeline and a plurality of second pipelines, the number of the second pipelines is the same as the number of the cooling parts in the cooling group, and the second pipelines are connected one by one; One end of the second pipeline is connected to the cooling unit, the other end of the second pipeline is connected to the first pipeline, and the other end of the first pipeline is connected to the flow control unit; The second pipe is disposed in the cavity, and the first pipe passes through the cavity and extends outside the cavity.

7. The cooling chamber according to claim 6, characterized in that Also includes: A plurality of bellows, the number of the bellows is the same as the number of the first pipes, and the bellows are arranged in one-to-one correspondence; The bellows is arranged at the portion of the first pipe outside the cavity and is used to seal the through hole formed on the cavity by the first pipe passing through the cavity.

8. The cooling chamber according to claim 1, characterized in that The cooling assembly also includes: A driving unit is connected to the plurality of cooling parts, and is used to drive the plurality of cooling parts to move synchronously between the avoidance position and the working position.

9. The cooling chamber according to claim 1, characterized in that: Also includes: A transmission component is arranged on the inner wall of the cavity, and is used for carrying the part to be cooled and transferring the part to be cooled into or out of the cavity.

10. A semiconductor process equipment, characterized in that: The invention comprises a process chamber and a cooling chamber according to any one of claims 1 to 9 which are connected in sequence, and the cooling chamber is used for cooling the workpiece to be cooled which is removed from the process chamber.

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