Splicing panel

Abstract

The invention discloses a splicing panel. The splicing panel comprises at least two sub-display panels and a gate driving circuit, every two adjacent sub display panels are spliced in the first direction, each sub display panel comprises a substrate and a conductive terminal arranged on the substrate, and every two adjacent sub display panels are electrically connected through the corresponding conductive terminal; the grid driving circuits are arranged on the substrates of the sub display panels, the grid driving circuits are electrically connected with the conductive terminals, the multiple sub display panels spliced in the first direction are driven by one grid driving circuit, the grid driving circuits are located in the edge area of the spliced panel, and the grid driving circuits are electrically connected with the conductive terminals. Wherein the first direction is the direction of the row of the splicing panels. The splicing panel has the advantage that the problem that the continuity of display pictures of the splicing panel is not high can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a spliced ​​panel. Background Art

[0002] In the traditional solution, a gate driving circuit is set in the edge area of ​​the substrate of the sub-display panel of the splicing panel. When two adjacent sub-display panels are spliced, there is a gate driving circuit between the two adjacent sub-display panels, which makes the splicing area between the two adjacent sub-display panels of the splicing panel have a large black border, resulting in low continuity of the display screen of the splicing panel. Summary of the invention

[0003] The embodiments of the present application provide a spliced ​​panel to improve the problem of low continuity of displayed images of the spliced ​​panel.

[0004] In a first aspect, an embodiment of the present application provides a spliced ​​panel, comprising:

[0005] At least two sub-display panels, two adjacent sub-display panels are spliced ​​in a first direction, the sub-display panels include a substrate and a conductive terminal disposed on the substrate, and the two adjacent sub-display panels are electrically connected via the conductive terminal;

[0006] A gate driving circuit, wherein the gate driving circuit is electrically connected to the conductive terminal, and the plurality of sub-display panels spliced ​​along the first direction are driven by one gate driving circuit, and the gate driving circuit is located in an edge area of ​​the spliced ​​panel, wherein the first direction is the direction of the rows of the spliced ​​panel.

[0007] Furthermore, the sub-display panel includes:

[0008] A first metal layer;

[0009] The gate driving circuit includes a first wiring, and the first wiring and the conductive terminal are located in the first metal layer.

[0010] Furthermore, the sub-display panel includes:

[0011] A first metal layer;

[0012] a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate;

[0013] The gate driving circuit includes a second routing line, the second routing line is located in the first metal layer, the conductive terminal is located in the second metal layer, and the conductive terminal is electrically connected to the second routing line through a first via hole penetrating between the second metal layer and the first metal layer.

[0014] Furthermore, the sub-display panel includes:

[0015] A first metal layer;

[0016] a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate;

[0017] a third metal layer, the third metal layer being located on a side of the second metal layer away from the substrate;

[0018] The gate drive circuit includes a third routing line, the third routing line is located in the first metal layer, the conductive terminal is located in the third metal layer, and the conductive terminal is electrically connected to the third routing line through a second via hole and a third via hole that penetrates between the third metal layer and the first metal layer.

[0019] Furthermore, the sub-display panel includes:

[0020] A first metal layer;

[0021] a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate;

[0022] a third metal layer, the third metal layer being located on a side of the second metal layer away from the substrate;

[0023] a fourth metal layer, the fourth metal layer being located on a side of the third metal layer away from the substrate

[0024] The gate drive circuit includes a fourth routing line, the fourth routing line is located in the first metal layer, the conductive terminal is located in the fourth metal layer, and the conductive terminal is electrically connected to the fourth routing line through a fourth via, a fifth via, and a sixth via that penetrates between the fourth metal layer and the first metal layer.

[0025] Furthermore, the splicing panel also includes a connecting line, and the connecting line is electrically connected to two adjacent conductive terminals on two adjacent sub-display panels.

[0026] Furthermore, the splicing panel also includes a light-emitting device, an encapsulation adhesive layer and a cover plate, wherein the light-emitting device is arranged on the substrate, the encapsulation adhesive layer covers the light-emitting device, and the cover plate is arranged on the surface of the substrate away from the encapsulation adhesive layer, wherein the connecting line is arranged on the surface of the cover plate close to the substrate, and in the top view of the splicing panel, the connecting line at least partially overlaps with two adjacent conductive terminals on the two adjacent sub-display panels.

[0027] Furthermore, the thickness of the connecting wire is greater than the thickness of the packaging glue layer.

[0028] Further, the cover plate has a boss extending in the direction of the conductive terminal, wherein the connecting line is arranged on a surface of the boss close to the substrate, and the thickness of the boss is greater than the thickness of the packaging glue layer.

[0029] In a second aspect, an embodiment of the present application provides a spliced ​​panel, including:

[0030] at least three sub-display panels, two adjacent sub-display panels being spliced ​​in a first direction, the sub-display panels comprising a substrate and a conductive terminal disposed on the substrate, and the two adjacent sub-display panels being electrically connected via the conductive terminal;

[0031] A gate driving circuit, wherein the gate driving circuit is electrically connected to the conductive terminal, and the plurality of sub-display panels spliced ​​along the first direction are driven by two of the gate driving circuits, wherein one of the gate driving circuits is located at an edge region on one side of the spliced ​​panel, and the other gate driving circuit is located at an edge region on the other side of the spliced ​​panel, and the two gate driving circuits are arranged at intervals, wherein the first direction is the direction of the rows of the spliced ​​panel.

[0032] Beneficial effects of this application:

[0033] The present application provides a splicing panel, wherein the sub-display panel includes a substrate and a conductive terminal arranged on the substrate, and two adjacent sub-display panels are electrically connected through the conductive terminals; the gate driving circuit is electrically connected to the conductive terminals, and the multiple sub-display panels spliced ​​along the first direction are driven by one gate driving circuit, and the gate driving circuit is located in the edge area of ​​the splicing panel; compared with the traditional solution, the gate driving circuit between two adjacent sub-display panels of the splicing panel is cancelled, and the black border width of the splicing area between two adjacent sub-display panels of the splicing panel is reduced, thereby improving the continuity of the display screen of the splicing panel.

[0034] The present application provides a splicing panel, wherein the sub-display panel includes a substrate and a conductive terminal arranged on the substrate, and two adjacent sub-display panels are electrically connected through the conductive terminals; the gate driving circuit is electrically connected to the conductive terminal, and the multiple sub-display panels spliced ​​along the first direction are driven by the two gate driving circuits, wherein one of the gate driving circuits is located at an edge area on one side of the splicing panel, and the other gate driving circuit is located at an edge area on the other side of the splicing panel, and the two gate driving circuits are arranged at intervals; compared with the traditional scheme, the gate driving circuit between two adjacent sub-display panels of the splicing panel is cancelled, and the black border width of the splicing area between two adjacent sub-display panels of the splicing panel is reduced, thereby improving the continuity of the display screen of the splicing panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of a traditional spliced ​​panel;

[0036] Figure 2 is a schematic diagram of a spliced ​​panel of the first embodiment of the present application;

[0037] Figure 3 yes Figure 2 A cross-sectional view of the first structure of the spliced ​​panel at position A;

[0038] Figure 4 yes Figure 2 A cross-sectional view of the second structure of the spliced ​​panel at position A;

[0039] Figure 5 yes Figure 2 A cross-sectional view of the spliced ​​panel at position B corresponding to the first metal layer;

[0040] Figure 6 yes Figure 2 A cross-sectional view of the spliced ​​panel at position B corresponding to the second metal layer;

[0041] Figure 7 yes Figure 2 A cross-sectional view of the spliced ​​panel at position B corresponding to the third metal layer;

[0042] Figure 8 yes Figure 2 A cross-sectional view of the spliced ​​panel at position B corresponding to the fourth metal layer;

[0043] Fig. 9 is a schematic diagram of a spliced ​​panel according to a second embodiment of the present application;

[0044] Fig.10 It is a schematic diagram of the cover plate of the spliced ​​panel of the present application.

[0045] 100-sub-display panel, 110-substrate, 120-conductive terminal, 130-first metal layer, 131-first routing, 132-second routing, 133-third routing, 134-fourth routing, 140-second metal layer, 150-third metal layer, 160-fourth metal layer, 171-first via hole, 172-second via hole, 173-third via hole, 174-fourth via hole, 175-fifth via hole, 176-sixth via hole; 180-connecting line, 191-first insulating layer, 192-second insulating layer, 193-first organic flat layer, 194-first passivation layer, 195-second organic flat layer, 196-second passivation layer; 200-gate drive circuit; 300-light-emitting device; 400-encapsulation glue layer; 500-cover plate; 510-boss.

[0046] 10-sub display panel; 20-gate driving circuit. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the ideas of the present application and should not be regarded as limiting the scope of protection of the present application.

[0048] In addition, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise clearly defined.

[0049] refer to Figure 1 In the conventional solution, a gate driving circuit 20 is provided in the edge area of ​​the substrate of the sub-display panel 10 of the splicing panel. When two adjacent sub-display panels 10 are spliced, there is a gate driving circuit 20 between the two adjacent sub-display panels 10, so that a large black border exists in the splicing area between the two adjacent sub-display panels 10 of the splicing panel, resulting in low continuity of the display screen of the splicing panel.

[0050] The first embodiment of the present application provides a first spliced ​​panel, referring to Figure 2The splicing panel includes at least two sub-display panels 100 and a gate driving circuit 200; two adjacent sub-display panels 100 are spliced ​​in a first direction L, the sub-display panel 100 includes a substrate 110 and a conductive terminal 120 arranged on the substrate 110, and the two adjacent sub-display panels 100 are electrically connected through the conductive terminal 120; the gate driving circuit 200 is electrically connected to the conductive terminal 120, and the multiple sub-display panels 100 spliced ​​along the first direction L are driven by a gate driving circuit 200, and the gate driving circuit 200 is located at the edge area of ​​the splicing panel, wherein the first direction L is the direction of the row of the splicing panel.

[0051] By setting the sub-display panel 100 to include a substrate 110 and a conductive terminal 120 arranged on the substrate 110, two adjacent sub-display panels 100 are electrically connected through the conductive terminal 120; the gate driving circuit 200 is electrically connected to the conductive terminal 120, and the multiple sub-display panels 100 spliced ​​along the first direction L are driven by a gate driving circuit 200, and the gate driving circuit 200 is located at the edge area of ​​the spliced ​​panel; compared with the traditional solution, the gate driving circuit 200 between two adjacent sub-display panels 100 of the spliced ​​panel is cancelled, and the black border width of the splicing area between two adjacent sub-display panels 100 of the spliced ​​panel is reduced, thereby improving the continuity of the display screen of the spliced ​​panel.

[0052] In this embodiment, the material of the conductive terminal 120 is indium tin oxide.

[0053] In this embodiment, reference Figure 3 The splicing panel further includes a connection line 180, which is electrically connected to two adjacent conductive terminals 120 on two adjacent sub-display panels 100. The splicing panel further includes a connection line 180, which is electrically connected to two adjacent conductive terminals 120 on two adjacent sub-display panels 100.

[0054] In this embodiment, reference Figure 5 , the sub-display panel 100 includes a first metal layer 130, the gate driving circuit 200 includes a first wiring 131, and the first wiring 131 and the conductive terminal 120 are located in the first metal layer 130. By setting the sub-display panel 100 to include the first metal layer 130, the gate driving circuit 200 to include the first wiring 131, and the first wiring 131 and the conductive terminal 120 to be located in the first metal layer 130, it is not necessary to use a via to electrically connect the conductive terminal 120 and the first wiring 131, and the length of the signal transmission path between the conductive terminal 120 and the first wiring 131 can be minimized, thereby reducing the impedance of the signal transmission of two adjacent sub-display panels 100, thereby improving the stability of the signal transmission of the gate driving circuit 200.

[0055] In this embodiment, the sub-display panel 100 includes a thin film transistor, and the thin film transistor includes a gate, wherein the gate is located in the first metal layer.

[0056] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the first trace 131, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the first trace 131, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0057] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0058] In this embodiment, reference Figure 6 The sub-display panel 100 includes a first metal layer 130 and a second metal layer 140, and the second metal layer 140 is located on the side of the first metal layer 130 away from the substrate 110; the gate drive circuit 200 includes a second routing line 132, and the second routing line 132 is located in the first metal layer 130. The conductive terminal 120 is located in the second metal layer 140, and the conductive terminal 120 is electrically connected to the second routing line 132 through a first via 171 that passes through the second metal layer 140 and the first metal layer 130. By setting the gate drive circuit 200 to include a second routing line 132, the second routing line 132 is located in the first metal layer 130, and the conductive terminal 120 is located in the second metal layer 140. The conductive terminal 120 is electrically connected to the second routing line 132 through a first via hole 171 that passes through the second metal layer 140 and the first metal layer 130. On the one hand, the film layer between the conductive terminal 120 and the first metal layer 130 is retained, reducing the difficulty of preparing the sub-display panel 100. On the other hand, it can avoid that the resistance between the conductive terminal 120 and the second routing line 132 is too large, which leads to a reduction in the stability of signal transmission of the gate drive circuit 200.

[0059] In this embodiment, the sub-display panel 100 includes a thin film transistor, and the thin film transistor includes a gate, a source, and a drain, wherein the gate is located in the first metal layer, and the source and the drain are located in the second metal layer 140 .

[0060] In this embodiment, the thickness of the conductive terminal 120 is smaller than the thickness of the second metal layer 140 .

[0061] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the second trace 132, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the second trace 132, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0062] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0063] In this embodiment, reference Figure 7 The sub-display panel 100 includes a first metal layer 130, a second metal layer 140, and a third metal layer 150, the second metal layer 140 is located on the side of the first metal layer 130 away from the substrate 110; the third metal layer 150 is located on the side of the second metal layer 140 away from the substrate 110; the gate drive circuit 200 includes a third routing line 133, the third routing line 133 is located in the first metal layer 130, the conductive terminal 120 is located in the third metal layer 150, and the conductive terminal 120 is electrically connected to the third routing line 133 through a second via 172 and a third via 173 that pass through the third metal layer 150 and the first metal layer 130. By setting the conductive terminal 120 to be located in the third metal layer 150, the conductive terminal 120 is electrically connected to the third wiring 133 through the second via 172 and the third via 173 that pass through the third metal layer 150 and the first metal layer 130, thereby reducing the length of the signal transmission path between the conductive terminal 120 and the third wiring 133, thereby reducing the transmission impedance of the signal between two adjacent sub-display panels 100, thereby improving the stability of the signal transmission of the gate drive circuit 200.

[0064] In this embodiment, the thickness of the conductive terminal 120 is smaller than the thickness of the third metal layer 150 .

[0065] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the third trace 133, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the third trace, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0066] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0067] In this embodiment, reference Figure 8 The sub-display panel 100 includes a first metal layer 130, a second metal layer 140, a third metal layer 150 and a fourth metal layer 160; the second metal layer 140 is located on a side of the first metal layer 130 away from the substrate 110; the third metal layer 150 is located on a side of the second metal layer 140 away from the substrate 110; the fourth metal layer 160 is located on a side of the third metal layer 150 away from the substrate 110. The gate drive circuit 200 includes a fourth routing line 134, the fourth routing line 134 is located in the first metal layer 130, the conductive terminal 120 is located in the fourth metal layer 160, and the conductive terminal 120 is electrically connected to the fourth routing line 134 through a fourth via 174, a fifth via 175 and a sixth via 176 that pass through the fourth metal layer 160 and the first metal layer 130. By setting the gate driving circuit 200 to include a fourth routing line 134, the fourth routing line 134 is located in the first metal layer 130, the conductive terminal 120 is located in the fourth metal layer 160, and the conductive terminal 120 is electrically connected to the fourth routing line 134 through a fourth via 174, a fifth via 175 and a sixth via 176 that penetrate between the fourth metal layer 160 and the first metal layer 130, so that the preparation of the sub-display panel 100 does not require removing the film layer between the conductive terminal 120 and the first metal layer 130, thereby reducing the complexity of the process of the sub-display panel 100.

[0068] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the fourth trace 134, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the fourth trace 134, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0069] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0070] In this embodiment, reference Figure 5-Figure 8The sub-display panel 100 also includes a first insulating layer 191, a second insulating layer 192, a first organic planar layer 193, a first passivation layer 194, a second organic planar layer 195 and a second passivation layer 196, the first insulating layer 191 covers the gate insulating layer, the second insulating layer 192 is located on a surface of the first insulating layer 191 away from the substrate 110, the first organic planar layer 193 covers the second metal layer 140, the first passivation layer 194 is located on a surface of the first organic planar layer 193 away from the substrate 110, the second organic planar layer 195 covers the third metal layer 150, and the second passivation layer 196 is located on a surface of the second organic planar layer 195 away from the substrate 110.

[0071] In this embodiment, reference Figure 5-Figure 8 , the conductive terminals 120 of two adjacent sub-display panels 100 are in the same layer. Since the conductive terminals 120 can be set in the first metal layer 130, the second metal layer 140 or the third metal layer 150, when the conductive terminals 120 of two adjacent sub-display panels 100 are in different layers, it is difficult for the connecting wire 180 to directly connect with the conductive terminals 120 of the adjacent sub-display panels 100, resulting in an increased difficulty in splicing the sub-display panels 100 of the spliced ​​panel. Therefore, by setting the conductive terminals 120 of two adjacent sub-display panels 100 in the same layer, there is no need to additionally set the structure of the connecting wire 180 to match the conductive terminals 120 of the two adjacent sub-display panels 100 in the thickness direction of the spliced ​​panel, thereby reducing the difficulty in splicing the sub-display panels 100 of the spliced ​​panel.

[0072] In this embodiment, reference Figure 3 , Fig.10 The splicing panel also includes a light-emitting device 300, a packaging glue layer 400 and a cover plate 500, the light-emitting device 300 is arranged on the substrate 110, the packaging glue layer 400 covers the light-emitting device 300, and the cover plate 500 is arranged on the surface of the substrate 110 away from the packaging glue layer 400, wherein the connecting wire 180 is arranged on the surface of the cover plate 500 close to the substrate 110, and in the top view of the splicing panel, the connecting wire at least partially overlaps with the two adjacent conductive terminals on the two adjacent sub-display panels. The splicing panel is provided to also include a packaging glue layer 400 and a cover plate 500, wherein the packaging glue layer 400 covers the light-emitting device 300, and the cover plate 500 is arranged on the surface of the substrate 110 away from the packaging glue layer 400, wherein the connecting line 180 is arranged on the surface of the cover plate 500 close to the substrate 110. In the top view of the splicing panel, the connecting line at least partially overlaps with two adjacent conductive terminals on the two adjacent sub-display panels, which can increase the stability of the connection of the sub-display panels 100 of the splicing panel, and ensure that the driving signal of the gate driving circuit 200 can be more stably transmitted to the multiple sub-display panels 100 in the first direction L.

[0073] In this embodiment, the thickness of the connection wire 180 is greater than the thickness of the encapsulation glue layer 400. By setting the thickness of the connection wire 180 to be greater than the thickness of the encapsulation glue layer 400, when manufacturing the spliced ​​panel, the connection wire 180 can contact the conductive terminal 120 before the cover plate 500, thereby ensuring that the connection wire 180 can be more stably electrically connected to the terminals of the two sub-display panels 100.

[0074] In this embodiment, reference Figure 4 , Fig.10 , the cover plate 500 extends with a boss 510 toward the conductive terminal 120, wherein the connecting wire 180 is arranged on the surface of the boss 510 on the side close to the substrate 110, and the thickness of the boss 510 is greater than the thickness of the packaging glue layer 400. By providing the cover plate 500 with a boss 510 extending toward the conductive terminal 120, wherein the connecting wire 180 is arranged on the surface of the boss 510 on the side close to the substrate 110, and the thickness of the boss 510 is greater than the thickness of the packaging glue layer 400, when manufacturing the spliced ​​panel, the connecting wire 180 on the boss 510 can contact the conductive terminal 120 before the cover plate 500, thereby ensuring that the connecting wire 180 can be more stably electrically connected to the terminals of the two sub-display panels 100; and the thickness of the connecting wire 180 can be reduced, thereby avoiding the problem of the connecting wire 180 being broken due to excessive stress on the connecting wire 180.

[0075] In this embodiment, the conductive terminal 120 is located on the side of the substrate 110 away from the light-emitting surface of the splicing panel. By arranging the conductive terminal 120 on the side of the substrate 110 away from the light-emitting surface of the splicing panel, the material of the conductive terminal 120 does not need to use a transparent indium tin oxide material, thereby improving the substitutability of the material of the conductive terminal 120.

[0076] In a second aspect, the embodiment of the present application provides a second splicing panel, referring to Fig. 9 The second embodiment is similar to the first embodiment. The difference between the second embodiment and the first embodiment is that at least three sub-display panels 100 spliced ​​along the first direction L are driven by two gate driving circuits 200, one of the gate driving circuits 200 is located at an edge area on one side of the spliced ​​panel, and the other gate driving circuit 200 is located at an edge area on the other side of the spliced ​​panel, and the two gate driving circuits 200 are arranged at intervals, wherein the first direction L is the direction of the rows of the spliced ​​panel.

[0077] By setting the sub-display panel 100 to include a substrate 110 and a conductive terminal 120 disposed on the substrate 110, two adjacent sub-display panels 100 are electrically connected through the conductive terminal 120; the gate driving circuit 200 is electrically connected to the conductive terminal 120, and the plurality of sub-display panels 100 spliced ​​along the first direction L are driven by two gate driving circuits 200, one of the gate driving circuits 200 is located at an edge region on one side of the spliced ​​panel, and the other gate driving circuit 200 is located at an edge region on the other side of the spliced ​​panel, and the two gate driving circuits 200 are arranged at intervals; compared with the traditional solution, the adjacent sub-display panels are eliminated. The gate driving circuit 200 between the two sub-display panels 100 reduces the black border width of the splicing area between two adjacent sub-display panels 100 of the splicing panel, thereby improving the continuity of the display screen of the splicing panel; at the same time, since the multiple sub-display panels 100 spliced ​​along the first direction L are driven by two gate driving circuits 200, the number of gate driving circuits 200 is increased, which can improve the driving efficiency of the splicing panel on the one hand, and avoid driving abnormalities in the display panel far away from the gate driving circuit 200 due to the excessive number of sub-display panels 100 in the first direction L of the splicing panel on the other hand.

[0078] In this embodiment, two gate driving circuits 200 for driving the plurality of sub-display panels 100 are disposed opposite to each other.

[0079] In this embodiment, the material of the conductive terminal 120 is indium tin oxide.

[0080] In this embodiment, reference Figure 3 The splicing panel further includes a connection line 180, which is electrically connected to two adjacent conductive terminals 120 on two adjacent sub-display panels 100. The splicing panel further includes a connection line 180, which is electrically connected to two adjacent conductive terminals 120 on two adjacent sub-display panels 100.

[0081] In this embodiment, reference Figure 5 , the sub-display panel 100 includes a first metal layer 130, the gate driving circuit 200 includes a first wiring 131, and the first wiring 131 and the conductive terminal 120 are located in the first metal layer 130. By setting the sub-display panel 100 to include the first metal layer 130, the gate driving circuit 200 to include the first wiring 131, and the first wiring 131 and the conductive terminal 120 to be located in the first metal layer 130, it is not necessary to use a via to electrically connect the conductive terminal 120 and the first wiring 131, and the length of the signal transmission path between the conductive terminal 120 and the first wiring 131 can be minimized, thereby reducing the impedance of the signal transmission of two adjacent sub-display panels 100, thereby improving the stability of the signal transmission of the gate driving circuit 200.

[0082] In this embodiment, the sub-display panel 100 includes a thin film transistor, and the thin film transistor includes a gate, wherein the gate is located in the first metal layer.

[0083] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the first trace 131, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the first trace 131, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0084] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0085] In this embodiment, reference Figure 6 The sub-display panel 100 includes a first metal layer 130 and a second metal layer 140, and the second metal layer 140 is located on the side of the first metal layer 130 away from the substrate 110; the gate drive circuit 200 includes a second routing line 132, and the second routing line 132 is located in the first metal layer 130. The conductive terminal 120 is located in the second metal layer 140, and the conductive terminal 120 is electrically connected to the second routing line 132 through a first via 171 that passes through the second metal layer 140 and the first metal layer 130. By setting the gate drive circuit 200 to include a second routing line 132, the second routing line 132 is located in the first metal layer 130, and the conductive terminal 120 is located in the second metal layer 140. The conductive terminal 120 is electrically connected to the second routing line 132 through a first via hole 171 that passes through the second metal layer 140 and the first metal layer 130. On the one hand, the film layer between the conductive terminal 120 and the first metal layer 130 is retained, reducing the difficulty of preparing the sub-display panel 100. On the other hand, it can avoid that the resistance between the conductive terminal 120 and the second routing line 132 is too large, which leads to a reduction in the stability of signal transmission of the gate drive circuit 200.

[0086] In this embodiment, the sub-display panel 100 includes a thin film transistor, and the thin film transistor includes a gate, a source, and a drain, wherein the gate is located in the first metal layer, and the source and the drain are located in the second metal layer 140 .

[0087] In this embodiment, the thickness of the conductive terminal 120 is smaller than the thickness of the second metal layer 140 .

[0088] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the second trace 132, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the second trace 132, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0089] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0090] In this embodiment, reference Figure 7 The sub-display panel 100 includes a first metal layer 130, a second metal layer 140, and a third metal layer 150, the second metal layer 140 is located on the side of the first metal layer 130 away from the substrate 110; the third metal layer 150 is located on the side of the second metal layer 140 away from the substrate 110; the gate drive circuit 200 includes a third routing line 133, the third routing line 133 is located in the first metal layer 130, the conductive terminal 120 is located in the third metal layer 150, and the conductive terminal 120 is electrically connected to the third routing line 133 through a second via 172 and a third via 173 that pass through the third metal layer 150 and the first metal layer 130. By setting the conductive terminal 120 to be located in the third metal layer 150, the conductive terminal 120 is electrically connected to the third wiring 133 through the second via 172 and the third via 173 that pass through the third metal layer 150 and the first metal layer 130, thereby reducing the length of the signal transmission path between the conductive terminal 120 and the third wiring 133, thereby reducing the transmission impedance of the signal between two adjacent sub-display panels 100, thereby improving the stability of the signal transmission of the gate drive circuit 200.

[0091] In this embodiment, the thickness of the conductive terminal 120 is smaller than the thickness of the third metal layer 150 .

[0092] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the third trace 133, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the third trace, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0093] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0094] In this embodiment, reference Figure 8 The sub-display panel 100 includes a first metal layer 130, a second metal layer 140, a third metal layer 150 and a fourth metal layer 160; the second metal layer 140 is located on a side of the first metal layer 130 away from the substrate 110; the third metal layer 150 is located on a side of the second metal layer 140 away from the substrate 110; the fourth metal layer 160 is located on a side of the third metal layer 150 away from the substrate 110. The gate drive circuit 200 includes a fourth routing line 134, the fourth routing line 134 is located in the first metal layer 130, the conductive terminal 120 is located in the fourth metal layer 160, and the conductive terminal 120 is electrically connected to the fourth routing line 134 through a fourth via 174, a fifth via 175 and a sixth via 176 that pass through the fourth metal layer 160 and the first metal layer 130. By setting the gate driving circuit 200 to include a fourth routing line 134, the fourth routing line 134 is located in the first metal layer 130, the conductive terminal 120 is located in the fourth metal layer 160, and the conductive terminal 120 is electrically connected to the fourth routing line 134 through a fourth via 174, a fifth via 175 and a sixth via 176 that penetrate between the fourth metal layer 160 and the first metal layer 130, so that the preparation of the sub-display panel 100 does not require removing the film layer between the conductive terminal 120 and the first metal layer 130, thereby reducing the complexity of the process of the sub-display panel 100.

[0095] In this embodiment, in the top view of the splicing panel, the width of the conductive terminal 120 is greater than the width of the fourth trace 134, wherein the width direction of the conductive terminal 120 is the same as the second direction M of the splicing panel. By setting the width of the conductive terminal 120 to be greater than the width of the fourth trace 134, on the one hand, the contact area between the conductive terminal 120 and the connecting wire 180 is increased, thereby improving the stability of the connection between the conductive terminal 120 and the connecting wire 180, and on the other hand, the cross-sectional area of ​​the conductive terminal 120 is increased, thereby reducing the impedance of the conductive terminal 120.

[0096] In this embodiment, the width of the conductive terminal 120 is 10 um to 15 um. Preferably, the width of the conductive terminal 120 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.

[0097] In this embodiment, reference Figure 5-Figure 8The sub-display panel 100 also includes a first insulating layer 191, a second insulating layer 192, a first organic planar layer 193, a first passivation layer 194, a second organic planar layer 195 and a second passivation layer 196, the first insulating layer 191 covers the gate insulating layer, the second insulating layer 192 is located on a surface of the first insulating layer 191 away from the substrate 110, the first organic planar layer 193 covers the second metal layer 140, the first passivation layer 194 is located on a surface of the first organic planar layer 193 away from the substrate 110, the second organic planar layer 195 covers the third metal layer 150, and the second passivation layer 196 is located on a surface of the second organic planar layer 195 away from the substrate 110.

[0098] In this embodiment, reference Figure 5-Figure 8 , the conductive terminals 120 of two adjacent sub-display panels 100 are in the same layer. Since the conductive terminals 120 can be set in the first metal layer 130, the second metal layer 140 or the third metal layer 150, when the conductive terminals 120 of two adjacent sub-display panels 100 are in different layers, it is difficult for the connecting wire 180 to directly connect with the conductive terminals 120 of the adjacent sub-display panels 100, resulting in an increased difficulty in splicing the sub-display panels 100 of the spliced ​​panel. Therefore, by setting the conductive terminals 120 of two adjacent sub-display panels 100 in the same layer, there is no need to additionally set the structure of the connecting wire 180 to match the conductive terminals 120 of the two adjacent sub-display panels 100 in the thickness direction of the spliced ​​panel, thereby reducing the difficulty in splicing the sub-display panels 100 of the spliced ​​panel.

[0099] In this embodiment, reference Figure 3 , Fig.10 The splicing panel also includes a light-emitting device 300, a packaging glue layer 400 and a cover plate 500, the light-emitting device 300 is arranged on the substrate 110, the packaging glue layer 400 covers the light-emitting device 300, and the cover plate 500 is arranged on the surface of the substrate 110 away from the packaging glue layer 400, wherein the connecting wire 180 is arranged on the surface of the cover plate 500 close to the substrate 110, and in the top view of the splicing panel, the connecting wire at least partially overlaps with the two adjacent conductive terminals on the two adjacent sub-display panels. The splicing panel is provided to also include a packaging glue layer 400 and a cover plate 500, wherein the packaging glue layer 400 covers the light-emitting device 300, and the cover plate 500 is arranged on the surface of the substrate 110 away from the packaging glue layer 400, wherein the connecting line 180 is arranged on the surface of the cover plate 500 close to the substrate 110. In the top view of the splicing panel, the connecting line at least partially overlaps with two adjacent conductive terminals on the two adjacent sub-display panels, which can increase the stability of the connection of the sub-display panels 100 of the splicing panel, and ensure that the driving signal of the gate driving circuit 200 can be more stably transmitted to the multiple sub-display panels 100 in the first direction L.

[0100] In this embodiment, the thickness of the connection wire 180 is greater than the thickness of the encapsulation glue layer 400. By setting the thickness of the connection wire 180 to be greater than the thickness of the encapsulation glue layer 400, when manufacturing the spliced ​​panel, the connection wire 180 can contact the conductive terminal 120 before the cover plate 500, thereby ensuring that the connection wire 180 can be more stably electrically connected to the terminals of the two sub-display panels 100.

[0101] In this embodiment, reference Figure 4 , Fig.10 , the cover plate 500 extends with a boss 510 toward the conductive terminal 120, wherein the connecting wire 180 is arranged on the surface of the boss 510 on the side close to the substrate 110, and the thickness of the boss 510 is greater than the thickness of the packaging glue layer 400. By providing the cover plate 500 with a boss 510 extending toward the conductive terminal 120, wherein the connecting wire 180 is arranged on the surface of the boss 510 on the side close to the substrate 110, and the thickness of the boss 510 is greater than the thickness of the packaging glue layer 400, when manufacturing the spliced ​​panel, the connecting wire 180 on the boss 510 can contact the conductive terminal 120 before the cover plate 500, thereby ensuring that the connecting wire 180 can be more stably electrically connected to the terminals of the two sub-display panels 100; and the thickness of the connecting wire 180 can be reduced, thereby avoiding the problem of the connecting wire 180 being broken due to excessive stress on the connecting wire 180.

[0102] In this embodiment, the conductive terminal 120 is located on the side of the substrate 110 away from the light-emitting surface of the splicing panel. By arranging the conductive terminal 120 on the side of the substrate 110 away from the light-emitting surface of the splicing panel, the material of the conductive terminal 120 does not need to use a transparent indium tin oxide material, thereby improving the substitutability of the material of the conductive terminal 120.

[0103] The above is a detailed description of the specific implementation of the present application. The above implementation disclosed in the present application is only the preferred implementation of the present application. For ordinary technicians in this field, many modifications and improvements can be made without departing from the concept of the present application. These modifications and improvements all fall within the scope of protection defined by the claims of the present application.

Claims

1. A spliced ​​panel, characterized in that: include: At least two sub-display panels, two adjacent sub-display panels are spliced ​​in a first direction, the sub-display panels include a substrate and a conductive terminal provided on the substrate, and the two adjacent sub-display panels are electrically connected via the conductive terminal; A gate driving circuit, wherein the gate driving circuit is electrically connected to the conductive terminal, and the plurality of sub-display panels spliced ​​along the first direction are driven by one gate driving circuit, and the gate driving circuit is located in an edge area of ​​the spliced ​​panel, wherein the first direction is the direction of the rows of the spliced ​​panel.

2. The splicing panel according to claim 1, characterized in that: The sub-display panel comprises: A first metal layer; The gate driving circuit includes a first wiring, and the first wiring and the conductive terminal are located in the first metal layer.

3. The spliced ​​panel according to claim 1, characterized in that: The sub-display panel comprises: A first metal layer; a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate; The gate driving circuit includes a second routing line, the second routing line is located in the first metal layer, the conductive terminal is located in the second metal layer, and the conductive terminal is electrically connected to the second routing line through a first via hole penetrating between the second metal layer and the first metal layer.

4. The spliced ​​panel according to claim 1, characterized in that: The sub-display panel comprises: A first metal layer; a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate; a third metal layer, the third metal layer being located on a side of the second metal layer away from the substrate; The gate drive circuit includes a third routing line, the third routing line is located in the first metal layer, the conductive terminal is located in the third metal layer, and the conductive terminal is electrically connected to the third routing line through a second via hole and a third via hole that penetrates between the third metal layer and the first metal layer.

5. The spliced ​​panel according to claim 1, characterized in that: The sub-display panel comprises: A first metal layer; a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate; a third metal layer, the third metal layer being located on a side of the second metal layer away from the substrate; a fourth metal layer, the fourth metal layer being located on a side of the third metal layer away from the substrate; The gate drive circuit includes a fourth routing line, the fourth routing line is located in the first metal layer, the conductive terminal is located in the fourth metal layer, and the conductive terminal is electrically connected to the fourth routing line through a fourth via, a fifth via, and a sixth via that penetrates between the fourth metal layer and the first metal layer.

6. The spliced ​​panel according to any one of claims 1 to 5, characterized in that: The splicing panel further includes a connecting line, and the connecting line is electrically connected to two adjacent conductive terminals on two adjacent sub-display panels.

7. The spliced ​​panel according to claim 6, characterized in that: The splicing panel also includes a light-emitting device, an encapsulation adhesive layer and a cover plate, wherein the light-emitting device is arranged on the substrate, the encapsulation adhesive layer covers the light-emitting device, and the cover plate is arranged on the surface of the substrate away from the encapsulation adhesive layer, wherein the connecting line is arranged on the surface of the cover plate close to the substrate, and in the top view of the splicing panel, the connecting line at least partially overlaps with two adjacent conductive terminals on the two adjacent sub-display panels.

8. The spliced ​​panel according to claim 7, characterized in that: The thickness of the connecting wire is greater than the thickness of the packaging glue layer.

9. The spliced ​​panel according to claim 7, characterized in that: The cover plate has a boss extending in a direction toward the conductive terminal, wherein the connecting wire is arranged on a surface of the boss close to the substrate, and the thickness of the boss is greater than the thickness of the packaging glue layer.

10. A spliced ​​panel, characterized in that: include: at least three sub-display panels, two adjacent sub-display panels being spliced ​​in a first direction, the sub-display panels comprising a substrate and a conductive terminal disposed on the substrate, and the two adjacent sub-display panels being electrically connected via the conductive terminal; A gate driving circuit, wherein the gate driving circuit is electrically connected to the conductive terminal, and the plurality of sub-display panels spliced ​​along the first direction are driven by two of the gate driving circuits, wherein one of the gate driving circuits is located at an edge region on one side of the spliced ​​panel, and the other gate driving circuit is located at an edge region on the other side of the spliced ​​panel, and the two gate driving circuits are arranged at intervals, wherein the first direction is the direction of the rows of the spliced ​​panel.

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