Biochip packaging product

Abstract

The invention discloses a biochip packaging product, and belongs to the technical field of biochip packaging. Through the innovative biochip packaging technology, the preparation process is simplified, the complexity of operation is reduced, the problems of damage and uneven surface of the glass chip in the preparation process are avoided, the yield of packaged products is improved, the production cost is reduced, the overall height is reduced by using glass as a substrate material, and the compactness and portability of the products are improved; a gold element is attached to the surface of the chip, the chemical stability and good conductivity of gold are utilized, convenience is provided for covalent chemical binding of nucleic acid probes labeled with a special chemical method, antigen antibodies with protein properties and other substances through silver colloid coating, a reference electrode and a working electrode are connected with an external circuit through silver colloid, and the detection sensitivity is high. Stable electrical connection is formed, and the reliability of signal transmission is ensured; and the chip is packaged by the plastic packaging material, so that the chip is protected from being polluted by the external environment, and the durability and the stability are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of biochip packaging, and in particular relates to a biochip packaging product. Background Art

[0002] At present, biological gene chips are also called microarrays at home and abroad. The production technology mainly includes in-situ synthesis and post-synthesis cross-linking. The disadvantages of the in-situ synthesis method are time-consuming and complicated operation; the disadvantage of the post-synthesis cross-linking method is that the density of the probe is relatively low. One of the preparation forms is as follows: by opening holes on nylon and magnetic bead substrates to design circuits, and then spotting the synthesized probes (such as cDNA, genomic DNA, etc.) onto the biochip. Because the chip surface is exposed to the outside world during the test, it is affected by dust, particles, electromagnetic waves, etc. in the environment, which will cause inaccurate test results. There is also a type of biochip form PCR, whose reaction unit is generally composed of a chip body (substrate), a microheater and a temperature sensor, a reaction pool, and an upper cover. Since the system also integrates an electrochemical system for detecting the reaction product, this type of biochip has a complex structure and high production cost. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention significantly improves the preparation efficiency and product quality of biological gene chips through innovative biological chip packaging technology.

[0004] In order to achieve the above-mentioned purpose, the following technical scheme is adopted: The present invention provides a biochip packaging product, which is prepared by the following steps:

[0005] First, a glass chip or a silicon chip is provided;

[0006] Carving a window area on the glass chip or silicon chip by photoresist, and placing metal in the window area in a certain manner to form a metal layer;

[0007] removing the photoresist and retaining the surface metal layer;

[0008] coating silver paste on the reference electrode and solidifying the silver paste;

[0009] Mounting the glass chip or silicon chip on the material strip to perform wire bonding;

[0010] The middle area of ​​the glass chip or silicon chip is covered with a photoresist and then sealed with a plastic sealing material;

[0011] Removing the photoresist to expose the central electrode area of ​​the glass chip or silicon chip;

[0012] The copper pillars of the PCB board are combined with the copper pads of the material strip by bonding to achieve circuit connection.

[0013] Furthermore, the metal layer may be a gold layer.

[0014] Furthermore, the photoresist is removed by a stripping solution.

[0015] Furthermore, the silver paste may be AgCl paste.

[0016] Furthermore, the glass chip or silicon chip is mounted on the material strip by adhesive.

[0017] Furthermore, the adhesive includes epoxy resin glue.

[0018] Furthermore, the metal is placed in the window area in a certain manner to form a metal layer, including placing the metal in the window area by physical deposition to form a metal layer.

[0019] Furthermore, the copper pillar of the PCB board is combined with the copper pad of the material strip, including combining the copper pillar of the PCB board with the copper pad of the material strip by copper-copper bonding.

[0020] Furthermore, coating silver paste on the electrode and solidifying the silver paste includes coating silver paste on the working electrode or the reference electrode and solidifying the silver paste.

[0021] The beneficial effects of the present invention are:

[0022] (1) The present invention uses innovative biochip packaging technology to simplify the preparation process, reduce the complexity of the operation, and effectively avoid the damage and surface unevenness of the glass chip or silicon chip that may occur during the preparation process, thereby significantly improving the yield rate of the packaged product and reducing the production cost. The use of glass as the substrate material effectively reduces the overall height and improves the compactness and portability of the product;

[0023] (2) Attaching gold elements to the chip surface takes advantage of gold’s chemical stability and good electrical conductivity;

[0024] (3) By using silver colloid to coat the working electrode or the reference electrode, the silver colloid may be AgCl colloid. The coating of silver colloid facilitates the covalent chemical bonding with nucleic acid probes labeled by special chemical methods, antigens and antibodies of protein nature, and other substances. For example, the silver colloid electrode can adsorb certain special components in the protein, so that a potential difference appears between the working electrode and the reference electrode, thereby detecting the components of a substance in the solution to be tested, thereby enhancing the functionality and application range of the chip;

[0025] (4) Encapsulating the chip with plastic packaging materials not only protects the chip from pollution from the external environment, but also improves the durability and stability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a structure in which a window is carved out by photoresist and a metal layer is formed in the window area by physical deposition;

[0027] Figure 2 Schematic diagram of the structure after covering the reference electrode with silver glue;

[0028] Figure 3 It is a schematic diagram of the structure after the glass chip or silicon chip is mounted on the material strip through epoxy resin and the wire bonding operation is performed;

[0029] Figure 4 It is a schematic diagram of the structure after the middle area of ​​the glass chip or silicon chip is covered by photoresist and then plastic-sealed;

[0030] Figure 5 A schematic diagram of a structure for removing photoresist to expose the central electrode area of ​​a glass chip or a silicon chip;

[0031] Figure 6 It is a structural schematic diagram of the PCB board after bonding;

[0032] Figure 7 Schematic diagram of the top view of the reference electrode and the working electrode.

[0033] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0034] Legend: 1. Glass chip / silicon chip; 2. Metal layer; 3. Photoresist; 4. Silver glue; 5. Epoxy resin; 6. Material strip; 7. Lead; 8. Copper pad; 9. Packaging material; 10. PCB board; 11. Copper pillar; 12. Solder mask ink; 13. Reference electrode; 14. Working electrode. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Unless otherwise defined, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein may be applied to the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only and are not intended to limit the content of this application.

[0037] The experimental methods in the following examples are conventional methods unless otherwise specified, and the experimental materials used in the following examples are purchased from commercial channels unless otherwise specified.

[0038] Example

[0039] A biochip packaging product

[0040] The packaged product is prepared by the following steps:

[0041] First, a glass chip / silicon chip 1 is provided;

[0042] According to the attached Figure 1 , a window area is carved out by photoresist 3, which is a key step for the subsequent deposition of metal layer 2. This step usually involves sub-steps such as coating photoresist 3, soft baking, exposure, development and thermal curing to ensure the accurate transfer of the pattern. Then, the metal is placed on the chip surface in the window area by physical deposition to form a metal layer 2, thereby forming a conductive line or electrode. The physical deposition method includes evaporation or sputtering deposition of the metal layer 2. The metal layer 2 is a gold layer. Because gold has the characteristics of being not easy to oxidize, stable chemical properties and excellent electrical properties, the metallization process can form a conductive line or electrode, which is very important for realizing the electrical connection between the chip and the external circuit;

[0043] The photoresist 3 is removed by a degumming liquid while the surface metal layer 2 is retained. This step requires precise control to avoid damaging the metal layer 2. The degumming process can ensure that the photoresist 3 is completely removed and the damage to the chip surface is reduced;

[0044] According to the attached Figure 2 , coating silver glue 4 on the working electrode 14 or the reference electrode 13, wherein the silver glue 4 is AgCl glue, and solidifying the silver glue 4;

[0045] The structures of the reference electrode 13 and the working electrode 14 are as follows Figure 7 As shown;

[0046] According to the attached Figure 3 , the glass chip / silicon chip 1 is mounted on the material strip 6 by means of an adhesive 5, and then a wire bonding operation is performed, and the chip part is combined with the copper pad 8 of the material strip 6 by means of a lead 7 to achieve electrical connection, and the adhesive 5 is an epoxy resin glue with long-term stability;

[0047] The material strip 6 includes: a lead frame, a substrate or other material strips with a load-bearing function;

[0048] According to the attached Figure 4 , the middle area of ​​the glass chip / silicon chip is covered with a photoresist 3 and then sealed with a plastic sealing material 9 to protect the chip from the influence of the external environment;

[0049] According to the attached Figure 5 , removing the photoresist 3 to expose the central electrode area of ​​the glass chip / silicon chip in preparation for subsequent bonding. This step requires careful operation to avoid damaging the electrode;

[0050] According to the attached Figure 6 The copper column of the PCB board is combined with the copper pad of the material strip by bonding to achieve circuit connection. A solder resist ink 12 is also provided at the bottom of the PCB board 10. The copper pad 8 of the material strip 6 is copper-copper bonded with the copper column 11 of the PCB board 10 by copper-copper bonding to achieve circuit connection. The bonding technology of choice is copper-copper bonding. This bonding method has excellent conductivity and mechanical stability to ensure reliable connection between the PCB board 10 and the material strip 6.

[0051] How it works

[0052] By simplifying the preparation process, the complexity of the operation is reduced, and the breakage and surface unevenness problems that may occur in the glass chip / silicon chip 1 during the preparation process are effectively avoided, thereby significantly improving the yield rate of the packaged product and reducing production costs. Using glass as the base material effectively reduces the overall height and improves the compactness and portability of the product.

[0053] Gold elements are attached to the surface of the chip, taking advantage of gold's chemical stability and good conductivity.

[0054] By using silver glue coated on the working electrode or the reference electrode, the silver glue can be AgCl glue. The coating of silver glue facilitates the covalent chemical bonding with nucleic acid probes labeled by special chemical methods, antigen antibodies of protein properties and other substances. For example, the electrode coated with silver glue can adsorb certain special components in the protein, so that a potential difference appears between the working electrode and the reference electrode, thereby detecting the component of a substance in the solution to be tested, thereby enhancing the functionality and application range of the chip.

[0055] The chip is encapsulated by the plastic encapsulation material 9, which not only protects the chip from external environmental pollution, but also improves the durability and stability of the product. The plastic encapsulation material includes: plastic encapsulation material or silica gel, etc., as long as it is corrosion-resistant, high temperature-resistant, and solvent-resistant.

[0056] These innovative features work together to make the biochip packaging product of the present invention outstanding in terms of performance, cost and reliability, and have significant market competitiveness and application prospects.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0058] The present invention and its implementation methods are described above, which is not restrictive. The drawings are only one of the implementation methods of the present invention, and the actual application is not limited thereto. In short, if ordinary technicians in the field are inspired by it and design methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention, they should all fall within the protection scope of the present invention.

Claims

1. A biochip packaging product, characterized in that: Prepared by the following steps: First, a glass chip or a silicon chip is provided; Carving a window area on the glass chip or silicon chip by photoresist, and placing metal in the window area in a certain manner to form a metal layer; The photoresist is removed to retain the surface metal layer; Coating silver paste on the electrode and solidifying the silver paste; Mounting the glass chip or silicon chip on the material strip to perform wire bonding; The middle area of ​​the glass chip or silicon chip is covered with a photoresist and then sealed with a plastic sealing material; Removing the photoresist to expose the central electrode area of ​​the glass chip or silicon chip; The copper pillars of the PCB board are combined with the copper pads of the material strip by bonding to achieve circuit connection.

2. A biochip packaging product according to claim 1, characterized in that: The metal layer may be a gold layer.

3. The biochip packaging product according to claim 1, characterized in that: The photoresist is removed by a stripping solution.

4. The biochip packaging product according to claim 1, characterized in that: The silver paste may be AgCl paste.

5. The biochip packaging product according to claim 1, characterized in that: The glass chip or silicon chip is mounted on the material strip by adhesive.

6. The biochip packaging product according to claim 5, characterized in that: The adhesive includes epoxy resin glue.

7. The biochip packaging product according to claim 1, characterized in that: Placing metal in the window area in a certain manner to form a metal layer includes placing metal in the window area by physical deposition to form a metal layer.

8. The biochip packaging product according to claim 1, characterized in that: The copper pillar of the PCB board is combined with the copper pad of the material strip, including combining the copper pillar of the PCB board with the copper pad of the material strip by copper-copper bonding.

9. The biochip packaging product according to claim 1, characterized in that: Silver paste is coated on the electrode and solidified, including coating silver paste on the working electrode or the reference electrode and solidifying the silver paste.

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