Receiving-transmitting common-caliber multi-beam assembly suitable for brick-type phased-array antenna and antenna

Abstract

The invention relates to a transmitting-receiving common-caliber multi-beam assembly suitable for a brick-type phased-array antenna and an antenna, and the transmitting-receiving common-caliber multi-beam assembly comprises a chip layer which comprises a multi-beam receiving chip and a multi-beam transmitting chip; the wave beam layer comprises a receiving network layer used for forming a receiving network and a transmitting network layer used for forming a transmitting network, the wave beam layer at least forms two independent wave beams, and the number of the independent wave beams used for receiving and the number of the independent wave beams used for transmitting are both not less than 1; the control network layer is used for providing clock synchronization, data writing, data reading, data downloading and chip selection functions; and the transmitting-receiving common-aperture multi-beam assembly and another transmitting-receiving common-aperture multi-beam assembly are interconnected through a physical connector or electrical connection to realize standardized expansion. According to the invention, the integration complexity of a traditional brick-type phased-array antenna is reduced, and the expansibility of the traditional brick-type phased-array antenna is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to a transmitting and receiving co-aperture multi-beam component and antenna suitable for a brick-type phased array antenna. Background Art

[0002] A phased array antenna, also known as a phase-controlled array antenna, is an antenna that adjusts its radiation pattern by precisely controlling the feeding phase of each radiating element in the array.

[0003] In recent years, with the rapid development of satellite Internet communications and 5G technology, the demand for phased array antennas has been growing, especially in terms of adapting to the future application scenarios of seamless switching and aggregated transmission of Pan-SATELLITE, which requires phased array antennas to have multi-beam capabilities; at the same time, in order to meet the different aperture requirements in different scenarios in the future, the phased array architecture needs to have good scalability; in addition, considering the integrated design with different installation platforms, it is also necessary to meet the common aperture requirements. In response to the above needs, the design of new phased array antennas must be considered.

[0004] Phased array antennas are mainly divided into two structures: brick-type and tile-type. The placement direction of the components of the brick-type phased array antenna is perpendicular to the aperture of the phased array antenna, and the T / R component circuit adopts the longitudinal integration and transverse assembly (LITA) method. The brick-type structure is large in size and is packaged in a metal box. It is usually installed on the back of the heat sink to facilitate heat dissipation and is mostly used in high-power output scenarios. The tile-type phased array antenna places the components in a direction parallel to the aperture of the phased array antenna, and the face array circuit adopts the transverse integration and longitudinal assembly (TILA) method. The tile-type phased array adopts a layered structure to integrate chips or circuits on several parallel tiles. The radiating array element adopts an easy-to-conform microstrip patch antenna, which can achieve linear polarization or circular polarization. It has a higher degree of integration than the brick structure, a smaller size, and a lower cost. It is mostly used in ultra-small and conformal radars. Due to the limited heat dissipation measures of the tile structure, it is mainly used in low-power situations. The traditional tile-type phased array adopts a highly integrated chip and parallel layout with the antenna surface. It has the characteristics of low profile, light weight, and easy conformal integration with the platform. However, the common-aperture multi-beam antenna for transmission and reception has many layers, the multi-layer PCB processing technology is difficult, the design is complex, and the electromechanical thermal coupling is complex. The brick-type phased array antenna is the opposite. It is difficult to integrate, has a high profile, and is heavy.

[0005] Therefore, brick-type phased array antennas need to consider new multi-beam component designs. Summary of the invention

[0006] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a transmit-receive co-aperture multi-beam component and antenna suitable for a brick-type phased array antenna, which reduces the integration complexity of the brick-type phased array antenna and improves the scalability of the traditional brick-type phased array antenna.

[0007] To achieve the above-mentioned object of the invention, the present invention provides a transceiver co-aperture multi-beam component suitable for a brick-type phased array antenna, comprising:

[0008] A chip layer, the chip layer comprising a receiving multi-beam chip and a transmitting multi-beam chip;

[0009] A beam layer, wherein the beam layer includes a receiving network layer for forming a receiving network and a transmitting network layer for forming a transmitting network, wherein the beam layer forms at least two independent beams, and the number of the independent beams for receiving and the number of the independent beams for transmitting are both not less than one;

[0010] Control network layer for providing clock synchronization, data writing, data reading, data downloading, and chip selection functions;

[0011] The transmitting and receiving common-aperture multi-beam component is interconnected with another transmitting and receiving common-aperture multi-beam component through a physical connector or an electrical connection to achieve standardized expansion;

[0012] Any of the transmit-receive co-aperture multi-beam components and the co-aperture antenna array can be interconnected via a connector.

[0013] According to a technical solution of the present invention, any of the receiving network layers and the transmitting network layer are isolated by a shielded ground layer.

[0014] According to a technical solution of the present invention, the receiving full link of the transmitting and receiving co-aperture multi-beam assembly includes the receiving network and the receiving link, and the receiving network includes the following devices:

[0015] Band-stop filters, band-pass filters, power amplifiers, amplifiers, power dividers, temperature-compensated attenuators;

[0016] The receiving link includes a receiving multi-beam chip;

[0017] When the standing wave ratio is 2.0 and the connector loss is 0.5 dB, the receiving noise coefficient of the receiving link is 2.8 at normal temperature, and the receiving full link noise coefficient is 3.3 dB at normal temperature.

[0018] According to a technical solution of the present invention, the transmission full link of the transmitting and receiving co-aperture multi-beam assembly includes the transmission network and the transmission link, and the transmission network includes the following devices:

[0019] The power divider, the power amplifier and the bandpass filter;

[0020] The transmitting link includes a transmitting multi-beam chip;

[0021] When the input power of the transmission full link is 0 dBm, the output power is 15.5 dBm.

[0022] According to a technical solution of the present invention, the receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane.

[0023] According to a technical solution of the present invention, the transmit-receive co-aperture multi-beam assembly jointly controls the number of the independent beams through the power divider, combiner and multifunctional amplitude and phase control chip.

[0024] According to a technical solution of the present invention, the transmit-receive co-aperture multi-beam component is provided with a component wall microchannel for heat dissipation, and the internal heat of the transmit-receive co-aperture multi-beam component is dissipated through the component wall microchannel or a composite material with high thermal conductivity.

[0025] According to one invention of the present invention, there is provided an antenna including a transmit-receive co-aperture multi-beam assembly suitable for a brick-type phased array antenna as described above, wherein the antenna adopts a brick-type phased array architecture and comprises:

[0026] The transmit-receive co-aperture antenna layer includes a transmit-receive co-aperture antenna unit array surface, and the transmit-receive co-aperture antenna unit array surface includes a plurality of receiving antenna radiating units and a plurality of transmitting antenna radiating units;

[0027] The antenna uses multiple filters to ensure that the isolation between the transmit and receive channels meets the requirements of full-duplex communication.

[0028] The transmit-receive co-aperture multi-beam assembly is interconnected with the transmit-receive co-aperture antenna layer via a physical connector or an electrical connection.

[0029] According to a technical solution of the present invention, any of the receiving multi-beam chips is connected to at least one of the receiving antenna radiation units, and the receiving multi-beam chip includes at least one output synthetic beam port;

[0030] Any of the transmit multi-beam chips is connected to at least one of the transmit antenna radiation units, and the transmit multi-beam chip includes at least one input synthetic beam port.

[0031] According to a technical solution of the present invention, the interface between the transmit-receive co-aperture multi-beam component and the transmit-receive co-aperture antenna layer adopts a cross layout or a nested layout.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. A multi-beam component and antenna with a common aperture for transmission and reception is proposed based on a brick-type architecture of a phased array antenna, which can expand the number of multi-beams for transmission and reception of the antenna. The multi-beam component is integrated with the receiving network and the transmitting network to reduce the complexity of integration and avoid the problem of large span of vertical interconnection between layers of the traditional tile-type phased array antenna network and difficulty in process integration. The multi-beam component and antenna of the present invention are easy to expand, assemble and maintain, reducing the complexity of the multi-beam chip.

[0034] 2. The multi-beam assembly is interconnected with the antenna's transmit-receive co-aperture antenna layer through connectors, achieving flexible scalability of the feed interface connection of the brick-type phased array antenna.

[0035] 3. Based on the scalability of the present invention, microchannels in the component wall and a composite material with high thermal conductivity constituting the multi-beam component are provided to achieve heat dissipation.

[0036] 4. A shielding layer design is used between the receiving network layer and the transmitting network layer to improve the isolation of the beam network and reduce spatial crosstalk. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 The figure schematically shows the principle composition diagram of a multi-beam transceiver common aperture component provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0039] The description of the embodiments of this specification should be combined with the corresponding drawings, which should be considered as part of the complete specification. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated for simplification or convenience. Furthermore, the parts of each structure in the drawings will be described separately. It is worth noting that the elements not shown in the drawings or not described in words are in a form known to ordinary technicians in the relevant technical field.

[0040] The description of the embodiments herein and any reference to directions and orientations are only for the convenience of description and are not to be construed as any limitation on the scope of protection of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination, and the present invention is not particularly limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0041] like Figure 1As shown, the present invention proposes a transceiver co-aperture multi-beam component suitable for a brick-type phased array antenna and a brick-type phased array antenna,

[0042] The brick-type phased array antenna includes the following structures:

[0043] Transmit and receive co-aperture antenna layer and transmit and receive co-aperture multi-beam component.

[0044] The transmit-receive co-aperture multi-beam assembly is interconnected with the transmit-receive co-aperture antenna layer through a physical connector or an electrical connection.

[0045] The transmitting and receiving co-aperture multi-beam component is interconnected with another transmitting and receiving co-aperture multi-beam component through a physical connector or an electrical connection to achieve standardized expansion;

[0046] The interface between the transmit-receive co-aperture multi-beam component and the transmit-receive co-aperture antenna layer adopts a cross layout or a nested layout.

[0047] The brick-type phased array antenna uses multiple filters to ensure that the isolation between the transmit and receive channels meets the requirements of full-duplex communication.

[0048] Full-duplex means that the communication allows data to be transmitted in both directions simultaneously, that is, it can be received and sent at the same time.

[0049] The co-aperture multi-beam components for transmitting and receiving can be used alone or combined according to application requirements. In addition, the components can be configured as independent transmitting multi-beam components or independent receiving multi-beam components according to specific needs, and can be combined with the antenna layer to form a phased array antenna that meets various transmitting and receiving indicators, thereby improving the scalability of the phased array antenna based on the brick architecture.

[0050] The transmit-receive co-aperture antenna layer includes a transmit-receive co-aperture antenna unit array surface. The transmit-receive co-aperture antenna unit array surface includes a plurality of receive antenna radiating units and a plurality of transmit antenna radiating units forming an array. In actual applications, the number of receive antenna radiating units and transmit radiating units may not be completely matched.

[0051] Transmit and receive co-aperture multi-beam components, including:

[0052] Chip layer, beam layer and control network layer.

[0053] Chip layer, the chip layer includes a receiving multi-beam chip and a transmitting multi-beam chip;

[0054] The receiving multi-beam chip and the transmitting multi-beam chip may be separate chips or SOCs, or the receiving multi-beam chip and the transmitting multi-beam chip may be integrated into one SOC.

[0055] The receiving multi-beam chip and the transmitting multi-beam chip are soldered in the same circuit plane.

[0056] Any receiving multi-beam chip is connected to at least two receiving antenna radiation units, and the receiving multi-beam chip includes at least one output synthesis beam port;

[0057] Any transmitting multi-beam chip is connected to at least one transmitting antenna radiation unit, and the transmitting multi-beam chip includes at least one input synthesis beam port.

[0058] Beam layer: The beam layer includes a receiving network layer and a transmitting network layer. The beam layer forms at least two independent beams, and the number of receiving beams and transmitting beams is not less than one.

[0059] The transmit-receive co-aperture multi-beam component controls the number of independent beams through a power divider, a combiner and a multi-functional amplitude and phase control chip.

[0060] like Figure 1 As shown, the receiving network layer forms a receiving network, and the transmitting network layer forms a transmitting network. The receiving network and the transmitting network can also be integrated in the same layer.

[0061] Any receiving network layer and transmitting network layer are isolated by a shielding layer. When it is necessary to reduce weight or meet other requirements, the shielding layer may not be set according to the specific situation.

[0062] A shielding layer design is used between the receiving network layer and the transmitting network layer to improve the isolation of the beam network and reduce spatial crosstalk.

[0063] The receiving full link of the transceiver co-aperture multi-beam assembly includes the receiving network and the receiving link. The receiving network includes the following components:

[0064] Band-stop filter, band-pass filter, power amplifier, low-noise amplifier, power divider, temperature-compensated attenuator;

[0065] The receiving link includes a receiving multi-beam chip;

[0066] The multi-beam transceiver common aperture component full receiving link is realized by a multi-stage Wilkins bridge cascade connection of devices such as band-stop filter, low noise amplifier, power divider, receiving multi-beam chip, power amplifier and temperature-compensated attenuator to form at least one independent beam. Considering the joint loss of 0.5dB (transmission loss when the standing wave ratio is 2.0), the receiving link receiving noise coefficient is 2.8dB at normal temperature, and the receiving full link noise coefficient is 3.3dB at normal temperature.

[0067] The transmission link of the co-aperture multi-beam assembly includes the transmission network and the transmission link. The transmission network includes the following components:

[0068] Power dividers, power amplifiers and bandpass filters;

[0069] The transmitting link includes a transmitting multi-beam chip;

[0070] The multi-beam transceiver co-aperture component transmits the full link by using a multi-stage Wilkins bridge cascade to form at least one independent beam. When the input power of the transmit link is 0 dBm (decibel milliwatt), after passing through the receiving network using the multi-stage Wilkins bridge cascade, the output power is 15.5 dBm (decibel milliwatt). The full transmit link amplifies the signal and increases the input power to a higher output power level.

[0071] The present invention combines the receiving link and the transmitting link as Figure 1 shown.

[0072] The transmitting and receiving co-aperture multi-beam component is provided with a component wall microchannel for heat dissipation. The heat inside the component is dissipated through the component wall microchannel or a composite material with high thermal conductivity.

[0073] The traditional brick-type phased array antenna structure is large in size and is mostly used in high-power output scenarios, so a lot of heat is generated inside. The multi-beam component and antenna of the present invention emphasize scalability, so it is not suitable for traditional metal box packaging and heat dissipation backplane heat dissipation. Therefore, microchannels in the component wall and high thermal conductivity composite materials that constitute the multi-beam component are set to achieve heat dissipation.

[0074] The control network layer includes the clock network, data write network, data download network, and chip select network, which can also be a partial combination of the above networks. The networks can be isolated by shielding or not. The clock network provides the clock for the multi-beam component chip interface communication. The data write network provides data write for the multi-beam component chip interface communication. The data read network provides data readback function for the multi-beam component chip interface communication. The data download network provides data download control for the multi-beam component chip interface communication. The chip select network provides chip enable for the multi-beam component chip interface communication.

[0075] It should also be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0076] Finally, it should be noted that the above is a preferred embodiment of the present invention. It should be pointed out that although the preferred embodiment of the present invention has been described, for those skilled in the art, once the basic creative concept of the present invention is known, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. Therefore, the attached claims are intended to be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the embodiments of the present invention.

Claims

1. A transceiver co-aperture multi-beam assembly suitable for a brick-type phased array antenna, characterized in that: include: A chip layer, the chip layer comprising a receiving multi-beam chip and a transmitting multi-beam chip; A beam layer, wherein the beam layer includes a receiving network layer for forming a receiving network and a transmitting network layer for forming a transmitting network, wherein the beam layer forms at least two independent beams, and the number of the independent beams for receiving and the number of the independent beams for transmitting are both not less than one; Control network layer for providing clock synchronization, data writing, data reading, data downloading, and chip selection functions; The transmitting and receiving common-aperture multi-beam component is interconnected with another transmitting and receiving common-aperture multi-beam component through a physical connector or an electrical connection to achieve standardized expansion; Any of the transmit-receive co-aperture multi-beam components and the transmit-receive co-aperture antenna layer can be interconnected via a connector.

2. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 1, characterized in that: Any of the receiving network layers and the transmitting network layer are isolated from each other by a shielded ground layer.

3. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 1, characterized in that: The receiving full link of the transmitting and receiving co-aperture multi-beam assembly includes the receiving network and the receiving link, and the receiving network includes the following components: Band-stop filters, band-pass filters, power amplifiers, amplifiers, power dividers, temperature-compensated attenuators; The receiving link includes a receiving multi-beam chip; When the standing wave ratio is 2.0 and the connector loss is 0.5 dB, the receiving noise coefficient of the receiving link is 2.8 at normal temperature, and the receiving full link noise coefficient is 3.3 dB at normal temperature.

4. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 3, characterized in that: The transmission full link of the transmitting and receiving co-aperture multi-beam assembly includes the transmission network and the transmission link, and the transmission network includes the following devices: The power divider, the power amplifier and the bandpass filter; The transmitting link includes a transmitting multi-beam chip; When the input power of the transmission full link is 0 dBm, the output power is 15.5 dBm.

5. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 1, characterized in that: The receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane.

6. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 3, characterized in that: The transmitting and receiving common aperture multi-beam component jointly controls the number of the independent beams through the power divider, combiner and multifunctional amplitude and phase control chip.

7. The transmitting and receiving co-aperture multi-beam assembly suitable for a brick-type phased array antenna according to claim 1, characterized in that: The transmitting and receiving common-aperture multi-beam component is provided with a component wall microchannel for heat dissipation, and the internal heat of the transmitting and receiving common-aperture multi-beam component is dissipated through the component wall microchannel or a composite material with high thermal conductivity.

8. An antenna comprising a transmit-receive co-aperture multi-beam assembly suitable for a brick-type phased array antenna as claimed in any one of claims 1 to 7, wherein the antenna adopts a brick-type phased array architecture, and is characterized in that: include: The transmit-receive co-aperture antenna layer includes a transmit-receive co-aperture antenna unit array surface, and the transmit-receive co-aperture antenna unit array surface includes a plurality of receiving antenna radiating units and a plurality of transmitting antenna radiating units; The antenna uses multiple filters to ensure that the isolation between the transmit and receive channels meets the requirements of full-duplex communication. The transmit-receive co-aperture multi-beam assembly is interconnected with the transmit-receive co-aperture antenna layer via a physical connector or an electrical connection.

9. The antenna according to claim 8, characterized in that Any of the receiving multi-beam chips is connected to at least one of the receiving antenna radiation units, and the receiving multi-beam chip includes at least one output synthesis beam port; Any of the transmit multi-beam chips is connected to at least one of the transmit antenna radiation units, and the transmit multi-beam chip includes at least one input synthetic beam port.

10. The antenna according to claim 8, characterized in that The interface between the transmit-receive co-aperture multi-beam component and the transmit-receive co-aperture antenna layer adopts a cross layout or a nested layout.

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