Radio frequency module packaging method, radio frequency module packaging structure and radio frequency module

Abstract

The invention provides a radio frequency module packaging method, a radio frequency module packaging structure and a radio frequency module, and relates to the technical field of radio frequency modules.The packaging method comprises the steps that a metal supporting part is welded to a first bonding pad of a substrate, a second type device is welded to a second bonding pad, an isolation film layer and the substrate are provided with a cavity, and the height of the cavity is not smaller than that of the second type device; the second bonding pad is located in the cavity, so that the second type of device is accommodated in the cavity, and a gap between the second type of device and the substrate is not filled by the first plastic packaging film layer; the first type of device is welded to the metal supporting part, a second gap is formed between the first type of device and the first plastic packaging film layer, the second plastic packaging film layer covers the first packaging structure and the first type of device and fills the second gap, and therefore selective filling of the underfill device and the non-underfill device is achieved through the packaging method, and film breaking operation does not need to be conducted on the underfill radio frequency chip. Meanwhile, for the filter which cannot be underfilled, the packaging method can also arrange the filter at a lowered position, so that the performance of the filter can be ensured.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency modules, and in particular to a radio frequency module packaging method, a radio frequency module packaging structure and a radio frequency module. Background Art

[0002] With the promotion and popularization of 5G commercialization, the RF front end of electronic products has become more complex, requiring a large number of devices to meet the support requirements of global frequency bands, which has also led to an obvious trend of RF modularization of electronic products. RF module is a solution that integrates two or more discrete devices such as filters, RF switches, low-noise amplifiers, power amplifiers, duplexers and multiplexers into the same module, which can improve the integration of RF modules and make them further miniaturized.

[0003] However, for RF modules, their RF chips are easily affected by electrostatic breakdown, mechanical vibration, humidity, etc., so they usually need to be packaged. Packaging can encapsulate the RF chip in protective materials, provide a physical barrier for the RF chip, prevent the RF chip from being affected by the external environment, and also provide electromagnetic shielding and isolation, reduce electromagnetic coupling and interference inside the module, and increase the stability and reliability of the RF chip. It is an important part of the RF module preparation process.

[0004] During the specific packaging process, some chips of the RF module (such as RF switches, etc.) need to be bottom-filled to provide better protection and stability, while some chips (such as surface acoustic wave filters SAW, etc.) cannot be bottom-filled and need to retain the air cavity, which increases the difficulty of packaging the RF module and is not conducive to the high-integration modularization of the RF front-end of electronic products. Summary of the invention

[0005] In view of this, the present application provides a heat dissipation cover, and the solution is as follows:

[0006] A radio frequency module packaging method, the radio frequency module comprising a first type of device and a second type of device, the packaging method comprising:

[0007] Providing a substrate, forming pads on the substrate, the pads comprising at least one first pad and at least one second pad;

[0008] forming a metal support member on the first pad;

[0009] Soldering the second type of device to the second solder pad, with a first gap between the second type of device and the substrate;

[0010] A first packaging structure is formed on the surface of the substrate, the first packaging structure includes an isolation film layer and a first plastic film layer that are stacked, a cavity is provided between the isolation film layer and the substrate, the second pad is located in the cavity, and in a first direction, the height of the cavity is not less than the height of the second type of device, the metal support component is exposed on a side of the first packaging structure that is away from the substrate along the first direction; the first direction is perpendicular to the surface of the substrate;

[0011] Welding the first type of device to the metal support component, with a second gap between the first type of device and the first packaging structure;

[0012] A second packaging structure is formed, wherein the second packaging structure includes a second plastic packaging film layer, the second plastic packaging film layer fills the second gap and covers the first packaging structure and the first type of device in the first direction.

[0013] Optionally, the height of the cavity is equal to the height of the second type of device, and the shape of the cavity is the same as that of the second type of device, so that the portion of the isolation film layer corresponding to the cavity is attached to the second type of device.

[0014] Optionally, forming the first packaging structure includes:

[0015] The isolation film layer is formed on the surface of the substrate, the isolation film layer includes a first part and a second part, the first part covers the area of ​​the substrate except the second type of devices, the second part and the substrate have the cavity, and the first part and the second part are connected;

[0016] The first plastic film layer is formed on the side of the isolation film layer away from the substrate along the first direction, the side of the first plastic film layer away from the substrate along the first direction is flush with the top of the metal support component, and in the first direction, the thickness of the first plastic film layer is not less than the thickness of the first gap; if the height of the first plastic film layer is less than the height of the second type of device, the first plastic film layer covers the first part, and if the height of the first plastic film layer is greater than or equal to the height of the second type of device, the first plastic film layer covers the first part and the second part.

[0017] Optionally, forming the second packaging structure includes:

[0018] forming a second plastic film layer on a side of the first plastic film layer away from the substrate;

[0019] If the height of the first plastic film layer is less than the height of the second type of device, the second plastic film layer covers the first plastic film layer and the second portion, and the second plastic film layer also covers the second type of device and fills the second gap;

[0020] If the height of the first plastic film layer is greater than or equal to the height of the second type of device, the second plastic film layer covers the first plastic film layer, and the second plastic film layer also covers the second type of device and fills the second gap.

[0021] Optionally, the radio frequency module further includes a third type of device, the pad further includes at least one third pad, and the packaging method further includes:

[0022] The third type of device is welded to the third solder pad, the third type of device is attached to the surface of the substrate, and the first packaging structure also covers the third type of device.

[0023] Optionally, the radio frequency module further includes a fourth type of device, and the packaging method further includes:

[0024] The fourth type of device is welded to the metal support component, the fourth type of device is attached to a side of the first packaging structure away from the substrate along the first direction, and the second packaging structure also covers the fourth type of device.

[0025] Optionally, the packaging method further includes:

[0026] Before forming the pad, forming a groove on the substrate;

[0027] The forming of a pad on the substrate comprises:

[0028] The second pad is formed in the groove, and the first pad and the third pad are formed in a region outside the groove.

[0029] Optionally, the substrate has a groove, the groove includes a first groove and a second groove, and forming a pad on the substrate further includes:

[0030] The second pad is formed in the first groove, the third pad is formed in the second groove, and the first pad is formed in a region other than the groove.

[0031] A radio frequency module packaging structure, the radio frequency module includes a first type of device and a second type of device, and further includes:

[0032] A substrate having pads, wherein the pads include at least one first pad and at least one second pad;

[0033] A metal supporting component, wherein the metal supporting component is welded to the first welding pad;

[0034] The second type of device is soldered to the second solder pad, and a first gap is formed between the second type of device and the substrate;

[0035] A first packaging structure, wherein the first packaging structure comprises an isolation film layer and a first plastic film layer which are stacked, a cavity is provided between the isolation film layer and the substrate, the second pad is located in the cavity, and in a first direction, a height of the cavity is not less than a height of the second type of device, the metal support component is exposed on a side of the first packaging structure away from the substrate along the first direction; the first direction is perpendicular to a surface of the substrate;

[0036] The first type of device is welded to the metal support component, and a second gap is formed between the second type of device and the first packaging structure;

[0037] A second packaging structure, wherein the second packaging structure comprises a second plastic packaging film layer, the second plastic packaging film layer fills the second gap and covers the first packaging structure and the first type of device in the first direction.

[0038] Optionally, the height of the cavity is equal to the height of the second type of device, and the shape of the cavity is the same as that of the second type of device, so that the portion of the isolation film layer corresponding to the cavity is attached to the second type of device.

[0039] Optionally, the isolation film layer includes a first part and a second part, the first part covers the area of ​​the substrate except the second type of device, the second part and the substrate have the cavity between them, and the first part and the second part are connected;

[0040] A side of the first plastic film layer facing away from the substrate along the first direction is flush with the top of the metal support component, and a thickness of the first plastic film layer in the first direction is not less than a thickness of the first gap.

[0041] Optionally, the thickness of the first plastic film layer is smaller than the thickness of the second type of device, the second plastic film layer fills the second gap, and in the first direction the second plastic film layer covers the first plastic film layer, the second part and the second type of device.

[0042] Optionally, the height of the first plastic film layer is greater than or equal to the height of the second type of device, the second plastic film layer fills the second gap, and the second plastic film layer covers the first plastic film layer and the second type of device in the first direction.

[0043] Optionally, a third type of device is also included, the solder pad also includes at least one third solder pad, the third type of device is soldered to the third solder pad, and the third type of device is attached to the surface of the substrate, and the first packaging structure also covers the third type of device.

[0044] Optionally, a fourth type of device is further included, which is welded to the metal support component and attached to a side of the first packaging structure away from the substrate along the first direction, and the second packaging structure also covers the fourth type of device.

[0045] Optionally, the substrate has a groove, the second pad is located in the groove, and the first pad and the third pad are located in a region other than the groove.

[0046] Optionally, the substrate has a groove, the groove includes a first groove and a second groove, the second pad is located in the first groove, the third pad is located in the second groove, and the first pad is located in a region other than the groove.

[0047] Optionally, the metal support component is at least one of a metal wire arc, a metal column and a metal pier.

[0048] A radio frequency module comprises the packaging structure described in any one of the above embodiments.

[0049] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0050] The packaging method includes: providing a substrate having a first pad and a second pad; forming a metal support component on the first pad; the second type of device is welded to the second pad, there is a cavity between the isolation film layer of the first packaging structure and the substrate, the height of the cavity is not less than the height of the second type of device, and the second pad is located in the cavity, so the second type of device is accommodated in the cavity of the isolation film, so that the gap between the second type of device and the substrate can not be filled by the first plastic film layer of the first packaging structure; the metal support component is exposed to the first packaging structure, the first type of device is welded to the metal support component, and there is a second gap between the first packaging structure, and the second plastic film layer of the second packaging structure covers the first packaging structure, the first type of device and fills the second gap. It can be seen that the packaging method realizes the selective filling of the bottom-filled RF chip and the non-bottom-filled RF chip, and compared with the related technology, the packaging method does not need to break the film of the bottom-filled RF chip, which reduces the packaging difficulty, and also effectively solves the problems of film breaking failure and device damage.

[0051] Moreover, for the filter, the filter is a device that cannot be bottom-filled in the RF module, and the design position of the filter will also affect its performance. If the position of the filter is too high, the filtering performance will be reduced. As can be seen from the above, the packaging method packages the filter through the first packaging structure 200 located in the lower layer, so that the filter can be set at a lower position, which helps to ensure the performance of the filter and then the performance of the RF module. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments or descriptions of the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0053] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0054] Figure 1 A flowchart of a radio frequency module packaging method provided in this application;

[0055] Figure 2-Figure 7 A schematic diagram of the structure obtained by different steps of a radio frequency module packaging method provided in this application;

[0056] Figure 8 A schematic diagram of a radio frequency module packaging structure provided in this application;

[0057] Fig. 9 A schematic diagram of another RF module packaging structure provided in this application;

[0058] Fig.10 A schematic diagram of the structure of another radio frequency module packaging structure provided in this application;

[0059] Fig.11 A schematic diagram of the structure of another radio frequency module packaging structure provided in this application;

[0060] Fig.12 A schematic diagram of the structure of another radio frequency module packaging structure provided in this application;

[0061] Fig.13A schematic diagram of the structure of another radio frequency module packaging structure provided in this application;

[0062] Fig.14 A schematic diagram of the structure of a radio frequency module provided in this application;

[0063] Fig.15 A structural schematic diagram of another RF module packaging structure provided in the present application. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only embodiments of one area of ​​the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0065] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0066] As described in the background technology section, different chips in the RF module have different requirements for bottom filling, which increases the difficulty of packaging the RF module and is not conducive to the high-integration modularization of the RF front-end of electronic products.

[0067] For this problem, the related technology covers the surface of the chip with a film, and then breaks or removes the film in the designated area of ​​the bottom-filled chip, so that the bottom area of ​​the chip can be filled when the plastic encapsulation material is filled. Specifically, laser film removal is usually used to remove the surface film at the designated position of the bottom-filled chip through laser etching. The advantage of laser film removal is that it is easy to operate and has high control accuracy, but its disadvantages are also more prominent and the cost is high. And with the gradual improvement of the integration of RF modules, the process difficulty of laser film removal has also increased. The film removal may fail due to changes in various conditions, and it may also cause damage to RF devices.

[0068] Based on the above, the present application provides a packaging method for a radio frequency module, wherein the radio frequency module includes a first type device 1 and a second type device 2, such as Figure 1 As shown, Figure 1 A flowchart of a radio frequency module packaging method provided in the present application, the packaging method comprising:

[0069] S1: Figure 2As shown, a substrate 100 is provided, and pads 110 are formed on the substrate 100, and the pads 110 include at least one first pad 111 and at least one second pad 112. Specifically, the pads 110 are formed on the surface of the substrate 100, and there are multiple pads 110, including at least one first pad 111 and at least one second pad 112. It should be noted that forming pads on a substrate is a conventional technical means in this field and will not be described in detail here. It should also be noted that in this application, the surface of the substrate 100 specifically refers to the upper surface of the substrate 100, and the same explanation applies to other components. For example, the surface of the first packaging structure 200 described below also refers to the upper surface of the first packaging structure 200, that is, it refers to the side of the first packaging structure 200 facing away from the upper surface of the substrate 100.

[0070] S2: Figure 3 As shown, a metal support component 113 is formed on the first pad 111. Specifically, the metal support component 113 is welded on the side of the first pad 111 away from the surface of the substrate 100, and the metal support component 113 can be electrically connected to the first pad 111. It should be noted that the above-mentioned metal support component 113 can be at least one of a metal wire arc, a metal column and a metal pier. The metal wire arc can be manufactured by using a bumper device and a process method for forming a solder joint. The metal column and the metal pier can use a traditional metal casting structure or other pre-formed technology.

[0071] S3: Figure 4 As shown, the second type device 2 is welded to the second pad 112, and there is a gap between the second type device 2 and the substrate 100. Specifically, the second type device 2 is welded to the side of the second pad 112 away from the surface of the substrate 100, and the second type device 2 is not attached to the surface of the substrate 100, and there is a first gap A1 between the second type device 2 and the upper surface of the substrate 100. It should be noted that the second type device 2 is welded to the second pad 112, that is, the second type device 2 is electrically connected to the second pad 112, so that it can be electrically connected to other devices through the second pad 112.

[0072] S4: Figure 5As shown, a first packaging structure 200 is formed on the surface of the substrate 100. The first packaging structure 200 includes an isolation film layer 210 and a first plastic film layer 220 arranged in a stacked manner. A cavity 201 is provided between the isolation film layer 210 and the substrate 100. The second pad 112 is located in the cavity 201. In the first direction, the height of the cavity 201 is not less than the height of the second type device 2. The first direction is perpendicular to the surface of the substrate 100, that is, the second type device 2 is located in the cavity 201. In addition, the metal support component 113 is exposed on the side of the first packaging structure 200 away from the substrate 100 along the first direction, that is, the metal support component 113 is exposed on the surface of the first packaging structure 200. Specifically, the surface of the first packaging structure 200 is flush with the top of the metal support component 113, that is, the height of the first packaging structure 200 is the same as the height of the metal support component 113. The top of the metal support component 113 can be exposed on the upper surface of the first packaging structure 200.

[0073] S5: Figure 6 As shown, the first type device 1 is welded to the metal support component 113, and a second gap A2 is provided between the first type device 1 and the first packaging structure 200. Specifically, the first type device 1 is located on the side of the first packaging structure 200 away from the surface of the substrate 100 along the first direction, and is conductively connected to the metal support component 113, that is, the first type device 1 is located on the upper surface of the first plastic film layer 220, and is conductively connected to the metal support component 113, so that the first type device 1 can be electrically connected to the pad 111 through the metal support component 113, thereby realizing electrical connection with other devices.

[0074] S6: Figure 7 As shown, a second packaging structure 300 is formed, and the second packaging structure 300 includes a second plastic film layer 310, and the second plastic film layer 310 fills the second gap A2 between the first packaging structure 200 and the first type of device 1, and the second plastic film layer 310 also covers the first packaging structure 200 and the first type of device 1 in the first direction to complete the packaging of the RF module. It should be noted that the above-mentioned first plastic film layer 220 and the second plastic film layer 310 can be epoxy molding materials, and the isolation film layer 210 can be a film with physical strength that can meet the packaging isolation requirements. The present application does not limit the specific materials of the first plastic film layer 220, the second plastic film layer 310 and the isolation film layer 210, which depends on the specific situation.

[0075] As can be seen from the above, both the first type device 1 and the second type device 2 are non-surface mount devices, wherein when the second type device 2 is packaged, an isolation film 210 having a cavity 201 between the substrate 100 is first formed, the second pad 112 is located in the cavity 201, and the height of the cavity 201 is not less than the height of the second type device 2, so the second type device 2 is accommodated in the cavity 201 formed by the isolation film 210, so that when the first plastic film layer 220 is subsequently formed, the gap between the second type device 2 and the substrate 100 can be not filled with plastic packaging material. When the packaging method packages the first type device 1, the second plastic film layer 310 covers the first packaging structure 200, the first type device 1, and fills the gap between the first type device 1 and the first packaging structure 200. It can be seen that the RF module packaging method provided in the present application realizes the selective filling of bottom-filled devices and non-bottom devices, and compared with the related art, the packaging method does not need to perform a film breaking operation on the bottom-filled device, which reduces the packaging difficulty, and also effectively solves the problems of film breaking failure and device damage.

[0076] It should be noted that in the RF module, the filter is a device that cannot be filled at the bottom, and in the overall structure of the RF module, the arrangement position of the filter will also affect its performance. If the position of the filter is too high, it will cause the filtering performance to decrease. As can be seen from the above, when the RF module is packaged using this packaging method, the filter can be packaged by the first packaging structure 200 located in the lower layer, so that the filter can be set in a lowered position, which helps to ensure the performance of the filter and then the performance of the RF module. In addition, the first packaging structure 200 for packaging the filter is a multi-film layer packaging structure composed of an isolation film 210 and a first plastic film layer 220, which can effectively block the influence of the external environment on the filter, help to ensure the performance of the filter, and then ensure the performance of the RF module.

[0077] According to the above, in the present packaging method, the first packaging structure 200 and the second packaging structure 300 are stacked and arranged, so when designing the layout of the RF module, the device can be set in the lower layer and the upper layer respectively based on the requirements of the device bottom filling and non-bottom filling, which is convenient for the layout design of the RF module. In addition, for the RF module that has been packaged, the bottom filling and non-bottom filling devices can also be distinguished by the setting position of the device, which provides convenience for subsequent product maintenance and other work.

[0078] Based on the foregoing embodiments, in one embodiment of the present application, Figure 7As shown, the height of the cavity 201 is equal to the height of the second type device 2, and the shape of the cavity 201 is the same as the shape of the second type device 2, so that the portion of the isolation film layer 210 corresponding to the cavity 201 can be attached to the second type device 2, that is, the portion of the isolation film layer 210 and the substrate 100 with the cavity 201 can be attached to the second type device 2, so that the isolation film layer 210 can wrap the second type device 2, and wrap the first gap between the second type device 2 and the substrate 100, so as to avoid the subsequent first plastic film layer 220 filling the first gap. In addition, the cavity 201 wraps the second type device 2 and the first gap between the second type device 2 and the substrate 100, so that the preparation of the isolation film layer 210 can be specifically to attach a layer of isolation film on the substrate 100 and the second type device 2, so that the formation process of the isolation film layer 210 is relatively simple, and then the packaging method can be simplified while achieving selective bottom filling.

[0079] It should be understood that when the second type device 2 includes multiple devices, that is, when the RF module has multiple non-bottom-filled devices, the isolation film 210 correspondingly has multiple cavities 201 corresponding to the multiple second type devices 2, and the multiple second type devices 2 are respectively wrapped by the corresponding cavities 201.

[0080] Based on the foregoing embodiments, in one embodiment of the present application, forming a first encapsulation structure 300 includes:

[0081] like Figure 8 As shown, an isolation film layer 210 is formed on the surface of the substrate 100, and the isolation film layer 210 includes a first part 211 and a second part 212. The first part 211 covers the area of ​​the substrate 100 except the second type device 2, and the second part 212 has the above-mentioned cavity 201 between the substrate 100. The first part 211 and the second part 212 are connected to each other, that is, the isolation film layer 210 covers the surface of the substrate 100, and the part corresponding to the second type device 2 has the cavity 201, so that the isolation film layer 210 can wrap the second type device 2 and the first gap between the second type device 2 and the substrate 100, thereby preventing the subsequent first plastic film layer 220 from filling the first gap between the second type device 2 and the substrate 100. It should be noted that since the isolation film layer 210 is relatively thin, when the isolation film layer 210 is formed on the surface of the substrate 100, it will be pierced by the metal support component 113, thereby exposing the metal support component 113. However, it is also possible that the isolation film layer 210 is not pierced by the metal support component 113. However, since the preparation of the isolation film layer 210 includes vacuum adsorption, even if the isolation film layer 210 is not pierced by the metal support component 113, it will also adhere to the metal support component 113 and will not affect the subsequent packaging.

[0082] A first plastic film layer 220 is formed on the side of the isolation film layer 210 away from the surface of the substrate 100 along the first direction. The side of the first plastic film layer 220 away from the substrate 100 along the first direction is flush with the top of the metal support component 113. In the first direction, the height of the first plastic film layer 220 is not less than the height of the first gap, that is, the height of the first plastic film layer 220 can be greater than or equal to the height of the first gap. Specifically, Fig. 9 As shown, if the height of the first plastic film layer 220 is less than the height of the second type device 2, that is, the height of the first plastic film layer 220 is between the first gap and the height of the second type device 2, then the first plastic film layer 220 covers the first portion 211 of the isolation film layer 210, that is, at this time, the first plastic film layer 220 covers the isolation film layer 210 except for the portion corresponding to the second type device 2. Figure 7 As shown, if the height of the first plastic film layer 220 is greater than or equal to the height of the second type device 2, the first plastic film layer 220 covers the first part 211 and the second part 212, that is, if the height of the first plastic film layer 220 is greater than or equal to the height of the second type device 2, the first plastic film layer 220 covers the entire isolation film layer 210. It should be noted that forming the first plastic film layer 220 on the side of the isolation film layer 210 away from the substrate 100 along the first direction specifically includes filling the surface of the isolation film layer 210 with plastic material, then polishing the surface of the filled plastic material to make it smooth, and exposing the top of the metal support component 113.

[0083] Since the first plastic film layer 220 is used to encapsulate the second type device 2, if the thickness of the first plastic film layer 220 is too low, it may affect the encapsulation effect of the first encapsulation structure 200, but the thickness of the first plastic film layer 220 does not need to be too thick. Therefore, in the present application, the height of the first plastic film layer 220 can be greater than or equal to the height of the first gap, that is, the height of the first plastic film layer 220 can be equal to the height of the first gap, and can also be greater than the height of the first gap, so as to avoid the thickness of the first plastic film layer 220 being too low, which affects the encapsulation effect.

[0084] Based on the foregoing embodiments, in one embodiment of the present application, Figure 7 As shown, forming the second packaging structure includes:

[0085] The second plastic film layer 310 is formed on the side of the first plastic film layer 220 facing away from the substrate 100 . Specifically, the second plastic film layer 310 is formed on the surface of the first plastic film layer 220 .

[0086] like Fig. 9As shown, if the height of the first plastic film layer 220 is less than the height of the second type of device 2, the first plastic film layer 220 covers the first part 211 of the isolation film layer 210 and exposes the second part 212 of the isolation film layer 210. Correspondingly, the second plastic film layer 310 covers the first plastic film layer 220 and the second part 212 of the isolation film layer 210, and the second plastic film layer 310 also covers the second type of device 2 and fills the second gap.

[0087] like Figure 7 As shown, if the height of the first plastic film layer 220 is greater than or equal to the height of the second type device 2, the first plastic film layer 220 covers the entire isolation film layer 210, and accordingly, the second plastic film layer 310 covers the entire first plastic film layer 220, and the second plastic film layer 310 also covers the second type device 2 and fills the second gap.

[0088] Based on the foregoing embodiment, in one embodiment of the present application, the RF module further includes a third type device 3, the pad 110 located on the surface of the substrate 100 further includes a third pad 114, and the packaging method further includes:

[0089] S7: Fig.10 As shown, the third type device 3 is welded to the third pad 114, and the third type device 3 is attached to the surface of the substrate 100, and the first packaging structure 200 also covers the third type device 3. It should be noted that the third type device 3 is welded to the third pad 114 and attached to the surface of the substrate 100, at which time the third type device 3 can be covered by the first plastic film layer 220 of the first packaging structure 200, or the third type device 3 can be covered by the isolation film layer 210 of the first packaging structure 200.

[0090] Based on the foregoing embodiment, in one embodiment of the present application, the radio frequency module further includes a fourth type of device 4, and the packaging method further includes:

[0091] S8: Fig.11 As shown, the fourth type device 4 is welded to the metal support component 113 , the fourth type device 4 is attached to a side of the first packaging structure 200 away from the substrate 100 along the first direction, and the second packaging structure 300 also covers the fourth type device 4 .

[0092] From the above, it can be seen that when the RF module also includes surface-mount devices other than the first type device 1 and the second type device 2 (such as the third type device 3 and the fourth type device 4), the surface-mount devices can be packaged using the first packaging structure 200, or the surface-mount devices can be packaged using the second packaging structure 300, or the surface-mount devices can be packaged using the first packaging structure 200 and the second packaging structure 300, which is more practical.

[0093] Based on the foregoing embodiment, in one embodiment of the present application, the packaging method further includes:

[0094] S9: Fig.12 As shown, before forming the pad 110 , a groove 120 is formed on the substrate 100 .

[0095] Based on this, for step S1, forming a pad 100 on a substrate 100 includes:

[0096] The second pad 112 is formed in the groove 120, and the first pad 111 and the third pad 114 are formed in the area outside the groove of the substrate 100 (the third pad 114 is formed in the groove). Fig.12 not shown in the figure).

[0097] In another embodiment of the present application, Fig.13 As shown, the groove 120 includes a first groove 121 and a second groove 122. For step S1, forming the pad 100 on the substrate 100 includes:

[0098] The second pad 112 is formed in the first groove 121 , the third pad 114 is formed in the second groove 122 , and the first pad 111 is formed in a region other than the groove 120 .

[0099] Based on the above embodiments, it can be known that the packaging method provided in the present application includes grooving a substrate 100 to form a groove, and the second solder pad 112 is arranged in the groove, that is, the second type of device 2 is arranged in the groove, so that for the filter, the position of the filter in the overall structure of the RF module can be further lowered, which helps to further improve the performance of the filter.

[0100] Based on the above packaging method, the present application also provides a radio frequency module packaging structure, which is obtained by the packaging method described in any of the above embodiments. Figure 7 As shown, the radio frequency module includes a first type device 1 and a second type device 2, and also includes:

[0101] The substrate 100 has a pad 110 , and the pad 110 includes at least one first pad 111 and at least one second pad 112 .

[0102] The metal support component 113 is welded to the first pad 111. It should be noted that the metal support component 113 can be at least one of a metal wire arc, a metal column and a metal pier.

[0103] The second type device 2 is soldered to the second solder pad 112 , and a first gap A1 is defined between the second type device 2 and the substrate 100 .

[0104] The first packaging structure 200 includes an isolation film layer 210 and a first plastic film layer 220 arranged in a stacked manner, a cavity 201 is provided between the isolation film layer 210 and the substrate 100, the second pad 112 is located in the cavity 201, and in the first direction, the height of the cavity 201 is not less than the height of the second type device 2, the first direction is perpendicular to the surface of the substrate 100, that is, the second type device 2 is located in the cavity 201. And the metal support component 113 is exposed on the side of the first packaging structure 200 away from the substrate 100 along the first direction, specifically, the upper surface of the first packaging structure 200 is flush with the top of the metal support component 113, and the upper surface of the first packaging structure 200 exposes the metal support component 113.

[0105] The first type device 1 is welded to the metal support component 113 , and a second gap A2 is defined between the first type device 1 and the first packaging structure 200 .

[0106] The second packaging structure 300 includes a second plastic film layer 310, which fills the second gap A2 between the first packaging structure 200 and the first type of device 1, and the second plastic film layer 310 also covers the first packaging structure 200 and the first type of device 1 in the first direction to complete the packaging of the RF module.

[0107] As can be seen from the above, both the first type device 1 and the second type device 2 are non-surface mount devices. For the second type device 2, there is a cavity 201 between the isolation film 210 and the substrate 100, the second pad 112 is located in the cavity 201, and the height of the cavity 201 is not less than the height of the second type device 2, so the second type device 2 is accommodated in the cavity 201 formed by the isolation film 210, so that the first plastic film layer 220 will not fill the first gap between the second type device 2 and the substrate 100, that is, the gap between the second type device 2 and the substrate 100 can not be filled with plastic packaging material. For the first type device 1, the second plastic film layer 310 covers the first packaging structure 200, the first type device 1, and fills the gap between the first type device 1 and the first packaging structure 200. It can be seen that the RF module packaging structure provided in the present application realizes the selective filling of the bottom-filled device and the non-bottom device, and compared with the related art, the packaging structure does not need to perform a film breaking operation on the bottom-filled device, which reduces the packaging difficulty, and also effectively solves the problems of film breaking failure and device damage.

[0108] It should be noted that in the RF module, the filter is a device that cannot be bottom-filled, and in the overall structure of the RF module, if the position of the filter is too high, the filtering performance will be reduced. As can be seen from the above, the first packaging structure 200 located in the lower layer of the packaging structure encapsulates the filter, so that the filter can be set at a lower position, which helps to ensure the performance of the filter and then the performance of the RF module. In addition, the first packaging structure 200 for encapsulating the filter is a multi-film layer packaging structure composed of an isolation film 210 and a first plastic film layer 220, which can effectively block the influence of the external environment on the filter, help to ensure the performance of the filter, and then ensure the performance of the RF module.

[0109] According to the above, the first packaging structure 200 and the second packaging structure 300 in the present packaging structure are arranged in a stacked manner. Therefore, when designing the layout of the RF module, the components can be set in the lower layer and the upper layer respectively based on the requirements of the bottom filling and non-bottom filling, which is convenient for the layout design of the RF module. Moreover, for the RF module that has been packaged, the bottom filling and non-bottom filling components can also be distinguished by the setting position of the components, which provides convenience for subsequent product maintenance and other work.

[0110] Based on the aforementioned embodiments, in one embodiment of the present application, the height of the cavity 201 is equal to the height of the second type device 2, and the shape of the cavity 201 is the same as the shape of the second type device 2, so that the portion of the isolation film layer 210 corresponding to the cavity 201 can be attached to the second type device 2, that is, the portion of the isolation film layer 210 and the substrate 100 having the cavity 201 can be attached to the second type device 2, so that the isolation film layer 210 can wrap the second type device 2, and wrap the first gap between the second type device 2 and the substrate 100, which can avoid the subsequent first plastic film layer 220 filling the first gap.

[0111] It should be understood that when the second type device 2 includes multiple devices, that is, when the RF module has multiple non-bottom-filled devices, the isolation film 210 correspondingly has multiple cavities 201 corresponding to the multiple second type devices 2, and the multiple second type devices 2 are respectively wrapped by the corresponding cavities 201.

[0112] Based on the foregoing embodiments, in one embodiment of the present application, the isolation film layer 210 includes a first part 211 and a second part 212, the first part 211 covers the area of ​​the substrate 100 except the second type device 2, the second part 212 and the substrate 100 have the above-mentioned cavity 201, the first part 211 and the second part 212 are connected, that is, the isolation film layer 210 covers the surface of the substrate 100, and the part corresponding to the second type device 2 has the cavity 201, so that the isolation film layer 210 can include the second type device 2 and the first gap between the second type device 2 and the substrate 100, thereby avoiding the subsequent first plastic film layer 220 filling the first gap between the second type device 2 and the substrate 100.

[0113] The side of the first plastic film layer 220 away from the substrate 100 along the first direction is flush with the top of the metal support component 113, and in the first direction, the height of the first plastic film layer 220 is not lower than the height of the first gap, that is, the height of the first plastic film layer 220 is greater than or equal to the height of the first gap.

[0114] Based on the above, in one embodiment of the present application, Fig. 9 As shown, the height of the first plastic film layer 220 is less than the height of the second type device 2, that is, the height of the first plastic film layer 220 is between the first gap and the height of the second type device 2. At this time, the first plastic film layer 220 covers the first part 211 of the isolation film layer 210, that is, at this time, the first plastic film layer 220 covers the isolation film layer 210 except the part corresponding to the second type device 2.

[0115] In another embodiment of the present application, Figure 7 As shown, the height of the first plastic film layer 220 is greater than or equal to the height of the second type of device 2, and the first plastic film layer 220 covers the first part 211 and the second part 212. That is to say, if the height of the first plastic film layer 220 is greater than the height of the second type of device 2 covered by the first plastic film layer 220, the first plastic film layer 220 covers the entire isolation film layer 210.

[0116] From the above, it can be seen that the packaging structure can realize selective packaging of bottom-filled devices and non-bottom-filled devices, and its structure can have multiple deformations. Therefore, in actual applications, the packaging structure can be designed into different structures based on different application scenarios, and is highly practical.

[0117] Based on the foregoing embodiments, in one embodiment of the present application, Fig.10As shown, the packaging structure also includes a third type device 3, the third type device 3 is welded to the third pad 114, and the third type device 3 is attached to the surface of the substrate 100, and the first packaging structure 200 also covers the third type device 3. It should be noted that the third type device 3 is welded to the third pad 114 and attached to the surface of the substrate 100, at which time the third type device 3 can be covered by the first plastic film layer 220 of the first packaging structure 200, or the third type device 3 can be covered by the isolation film layer 210 of the first packaging structure 200.

[0118] Based on the foregoing embodiments, in one embodiment of the present application, Fig.11 As shown, the RF module also includes a fourth type device 4, which is welded to the metal support component 113, and is attached to a side of the first packaging structure 200 away from the substrate 100 along the first direction, and the second packaging structure 300 also covers the fourth type device 4.

[0119] From the above, it can be seen that when the RF module also includes surface-mount devices other than the first type device 1 and the second type device 2 (such as the third type device 3 and the fourth type device 4), the surface-mount devices can be packaged using the first packaging structure 200, or the surface-mount devices can be packaged using the second packaging structure 300, or the surface-mount devices can be packaged using the first packaging structure 200 and the second packaging structure 300, which is more practical.

[0120] Based on the foregoing embodiments, in one embodiment of the present application, Fig.12 As shown, the substrate 100 has a groove 120 , the second pad 112 is located in the groove 120 , and the first pad 111 and the third pad 114 are located in an area of ​​the substrate 100 except the groove 120 .

[0121] In another embodiment of the present application, Fig.13 As shown, the groove 120 includes a first groove 121 and a second groove 122 , the second pad 112 is located in the first groove 121 , the third pad 114 is located in the second groove 122 , and the first pad 111 is located in the area of ​​the substrate 100 except the groove 120 .

[0122] Based on the above embodiments, it can be known that the packaging method provided in the present application includes grooving a substrate 100 to form a groove, and the second solder pad 112 is arranged in the groove, that is, the second type of device 2 is arranged in the groove, so that for the filter, the position of the filter in the overall structure of the RF module can be further lowered, which helps to further improve the performance of the filter.

[0123] The present application also provides a radio frequency module, which includes the packaging structure described in any of the above embodiments. It should be understood that the radio frequency module also includes a shell and various necessary input / output ports.

[0124] Based on the above, in a specific embodiment of the present application, the RF module may be a DiFEM product, and its operating frequency band includes but is not limited to B40 and B41. Fig.14 As shown, Fig.14 A schematic diagram of the structure of a radio frequency module provided in the present application, the radio frequency module includes a substrate 100 inside a housing, a radio frequency switch (Switch) disposed on the substrate 100, filters (such as Filter 1 and Filter 2) disposed on the substrate, and various necessary input and output ports extending from the Switch to the outside of the housing (such as spare interface AUX 1, spare interface AUX 2, power port, antenna interface, etc.). Among them, Filter 1 and Filter 2 are devices that cannot be bottom-filled, corresponding to the second type of device 2 in the above embodiment, and Switch is a device that needs to be bottom-filled, corresponding to the first type of device 1 in the above embodiment.

[0125] Specifically, the substrate 100, the RF switch (Switch) disposed on the substrate 100, and the filter (such as Filter 1 and Filter 2) disposed on the substrate can constitute the packaging structure described in any of the above embodiments. Fig.15 As shown, Filter 1 and Filter 2 are welded to the second solder pad 112, and have a first gap between them and the substrate 100 respectively, two cavities 201 are provided between the isolation film 210 of the first packaging structure 200 and the substrate 100, Filter 1 and Filter 2 and the first gap are respectively wrapped by the two cavities 201, Switch is welded to the metal support component 113, and has a second gap between it and the first packaging structure 200, and the second packaging structure 300 covers the first packaging structure 200, Switch and the second gap.

[0126] It should be noted that the above-mentioned RF module can be other types of products, such as PAMiF, PAMiD, FEM, FEMiD, etc. Different types of RF modules can be packaged based on the packaging structure described in any of the above embodiments, and no further details will be given here.

[0127] In summary, the present application provides a radio frequency module packaging method, a radio frequency module packaging structure and a radio frequency module, the packaging method comprising: providing a substrate having a first pad and a second pad; forming a metal support component on the first pad; the second type of device is welded to the second pad, there is a cavity between the isolation film layer of the first packaging structure and the substrate, the height of the cavity is not less than the height of the second type of device, the second pad is located in the cavity, so the second type of device is accommodated in the cavity of the isolation film, so that the gap between the second type of device and the substrate can not be filled by the first plastic film layer of the first packaging structure; the metal support component is exposed to the first packaging structure, the first type of device is welded to the metal support component, and there is a second gap between the first packaging structure, and the second plastic film layer of the second packaging structure covers the first packaging structure, the first type of device and fills the second gap. It can be seen that the packaging method realizes the selective filling of the bottom-filled radio frequency chip and the non-bottom-filled radio frequency chip, and compared with the related art, the packaging method does not need to perform a film breaking operation on the bottom-filled radio frequency chip, which reduces the packaging difficulty, and also effectively solves the problems of film breaking failure and device damage.

[0128] Moreover, for the filter, the filter is a device that cannot be bottom-filled in the RF module, and the design position of the filter will also affect its performance. If the position of the filter is too high, the filtering performance will be reduced. As can be seen from the above, the packaging method packages the filter through the first packaging structure 200 located in the lower layer, so that the filter can be set at a lower position, which helps to ensure the performance of the filter and then the performance of the RF module.

[0129] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar areas between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method area description.

[0130] It should be noted that in the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0131] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0132] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A radio frequency module packaging method, characterized in that: The radio frequency module includes a first type of device and a second type of device, and the packaging method includes: Providing a substrate, forming pads on the substrate, the pads comprising at least one first pad and at least one second pad; forming a metal support member on the first pad; Soldering the second type of device to the second solder pad, with a first gap between the second type of device and the substrate; A first packaging structure is formed on the surface of the substrate, the first packaging structure includes an isolation film layer and a first plastic film layer that are stacked, a cavity is provided between the isolation film layer and the substrate, the second pad is located in the cavity, and in a first direction, the height of the cavity is not less than the height of the second type of device, the metal support component is exposed on a side of the first packaging structure that is away from the substrate along the first direction; the first direction is perpendicular to the surface of the substrate; Welding the first type of device to the metal support component, with a second gap between the first type of device and the first packaging structure; A second packaging structure is formed, wherein the second packaging structure includes a second plastic packaging film layer, the second plastic packaging film layer fills the second gap and covers the first packaging structure and the first type of device in the first direction.

2. The RF module packaging method according to claim 1, characterized in that: The height of the cavity is equal to the height of the second type of device, and the shape of the cavity is the same as the shape of the second type of device, so that the portion of the isolation film layer corresponding to the cavity is attached to the second type of device.

3. The RF module packaging method according to claim 1, characterized in that: The forming of the first packaging structure comprises: The isolation film layer is formed on the surface of the substrate, the isolation film layer includes a first part and a second part, the first part covers the area of ​​the substrate except the second type of devices, the second part and the substrate have the cavity, and the first part and the second part are connected; The first plastic film layer is formed on the side of the isolation film layer away from the substrate along the first direction, the side of the first plastic film layer away from the substrate along the first direction is flush with the top of the metal support component, and in the first direction, the thickness of the first plastic film layer is not less than the thickness of the first gap; if the height of the first plastic film layer is less than the height of the second type of device, the first plastic film layer covers the first part, and if the height of the first plastic film layer is greater than or equal to the height of the second type of device, the first plastic film layer covers the first part and the second part.

4. The RF module packaging method according to claim 3, characterized in that: The forming of the second packaging structure comprises: forming a second plastic film layer on a side of the first plastic film layer away from the substrate; If the height of the first plastic film layer is less than the height of the second type of device, the second plastic film layer covers the first plastic film layer and the second portion, and the second plastic film layer also covers the second type of device and fills the second gap; If the height of the first plastic film layer is greater than or equal to the height of the second type of device, the second plastic film layer covers the first plastic film layer, and the second plastic film layer also covers the second type of device and fills the second gap.

5. The RF module packaging method according to claim 1, characterized in that: The radio frequency module further includes a third type of device, the pad further includes at least one third pad, and the packaging method further includes: The third type of device is welded to the third solder pad, the third type of device is attached to the surface of the substrate, and the first packaging structure also covers the third type of device.

6. The RF module packaging method according to claim 1 or 5, characterized in that: The radio frequency module also includes a fourth type of device, and the packaging method further includes: The fourth type of device is welded to the metal support component, the fourth type of device is attached to a side of the first packaging structure away from the substrate along the first direction, and the second packaging structure also covers the fourth type of device.

7. The RF module packaging method according to claim 5, characterized in that: The packaging method also includes: Before forming the pad, forming a groove on the substrate; The forming of a pad on the substrate comprises: The second pad is formed in the groove, and the first pad and the third pad are formed in a region outside the groove.

8. The RF module packaging method according to claim 5, characterized in that: The substrate has a groove, the groove includes a first groove and a second groove, and forming a pad on the substrate further includes: The second pad is formed in the first groove, the third pad is formed in the second groove, and the first pad is formed in a region other than the groove.

9. A radio frequency module packaging structure, characterized in that: The RF module includes the first type of devices and the second type of devices, and also includes: A substrate having pads, wherein the pads include at least one first pad and at least one second pad; A metal supporting component, wherein the metal supporting component is welded to the first welding pad; The second type of device is soldered to the second solder pad, and a first gap is formed between the second type of device and the substrate; A first packaging structure, wherein the first packaging structure comprises an isolation film layer and a first plastic film layer which are stacked, a cavity is provided between the isolation film layer and the substrate, the second pad is located in the cavity, and in a first direction, a height of the cavity is not less than a height of the second type of device, the metal support component is exposed on a side of the first packaging structure away from the substrate along the first direction; the first direction is perpendicular to a surface of the substrate; The first type of device is welded to the metal support component, and a second gap is formed between the second type of device and the first packaging structure; A second packaging structure, wherein the second packaging structure comprises a second plastic packaging film layer, the second plastic packaging film layer fills the second gap and covers the first packaging structure and the first type of device in the first direction.

10. The radio frequency module packaging method according to claim 9, characterized in that: The height of the cavity is equal to the height of the second type of device, and the shape of the cavity is the same as the shape of the second type of device, so that the portion of the isolation film layer corresponding to the cavity is attached to the second type of device.

11. The radio frequency module packaging structure according to claim 9, characterized in that: The isolation film layer comprises a first part and a second part, the first part covers the area of ​​the substrate except the second type of devices, the second part and the substrate have the cavity, and the first part and the second part are connected; A side of the first plastic film layer facing away from the substrate along the first direction is flush with the top of the metal support component, and a thickness of the first plastic film layer in the first direction is not less than a thickness of the first gap.

12. The radio frequency module packaging structure according to claim 10, characterized in that: The thickness of the first plastic film layer is smaller than the thickness of the second type of device, the second plastic film layer fills the second gap, and in the first direction, the second plastic film layer covers the first plastic film layer, the second part and the second type of device.

13. The radio frequency module packaging structure according to claim 10, characterized in that: The height of the first plastic film layer is greater than or equal to the height of the second type of device, the second plastic film layer fills the second gap, and in the first direction, the second plastic film layer covers the first plastic film layer and the second type of device.

14. The radio frequency module packaging structure according to claim 9, characterized in that: It also includes a third type of device, and the pad also includes at least one third pad. The third type of device is welded to the third pad, and the third type of device is attached to the surface of the substrate. The first packaging structure also covers the third type of device.

15. The radio frequency module packaging structure according to claim 9 or 13, characterized in that: It also includes a fourth type of device, which is welded to the metal support component and attached to a side of the first packaging structure away from the substrate along the first direction, and the second packaging structure also covers the fourth type of device.

16. The radio frequency module packaging structure according to claim 13, characterized in that: The substrate has a groove, the second pad is located in the groove, and the first pad and the third pad are located in a region other than the groove.

17. The radio frequency module packaging structure according to claim 13, characterized in that: The substrate has a groove, the groove includes a first groove and a second groove, the second pad is located in the first groove, the third pad is located in the second groove, and the first pad is located in a region other than the groove.

18. The radio frequency module packaging structure according to claim 9, characterized in that: The metal support component is at least one of a metal wire arc, a metal column and a metal pier.

19. A radio frequency module, characterized in that: The packaging structure comprises any one of claims 9 to 18.

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