Serial-parallel conversion method and folding screen terminal

Abstract

The invention discloses a serial-parallel conversion method and a folding screen terminal. In order to reduce the number of cross-screen signal lines, the invention provides a serial-parallel conversion method which comprises the following steps: a processor sends parallel multi-path protocol signals to a first chip; the first chip is used for converting parallel multi-path protocol signals into serial SPI (Serial Peripheral Interface) signals; the serial SPI signals are sent to a second chip through a cross-screen signal line; the second chip converts the serial SPI signals into parallel multi-path protocol signals; the parallel multi-path protocol signals comprise an SPI signal, an I2C signal, an I2S signal and a GPIO signal; the first chip is located below the first screen, and the second chip is located below the second screen. The number of the cross-screen signal lines is small, cross-screen communication can be achieved through the same chip, and the comprehensive cost is reduced. The method is suitable for the communication field.

Description

Technical Field

[0001] The present invention relates to the field of communications, and in particular to a serial-to-parallel conversion method and a folding screen terminal. Background Art

[0002] Foldable screen terminals have many advantages, such as being small and portable, having a good gaming experience, and convenient split-screen operation. They can also be used as tablets after being unfolded. The biggest advantage of foldable screen terminals is the larger screen and wider viewing experience. Although the current terminals are too large to be operated with one hand, foldable screen terminals provide an excellent user experience in watching videos, playing games, and doing business.

[0003] However, the main problems facing foldable screen terminals at present are bulky size and heavy body. Therefore, they have not yet become mainstream products in the terminal consumer market. Foldable screen terminals on the market are usually equipped with two screens, and communication is required between the first screen and the second screen; the existing technology usually directly connects the multi-channel parallel signals between the first screen and the second screen through a hinge. This results in too many signal lines at the hinge, which are easy to damage, and the hinge needs to be made thicker, resulting in the terminal being too large and the body being too heavy, while reducing the space and weight of the battery.

[0004] In order to solve the shortcomings of the prior art, the present invention provides a serial-to-parallel conversion chip, which converts signals such as multiple serial peripheral interfaces (Serial Peripheral Interface, SPI), digital audio transmission interfaces (Integrated Interchip Sound, I2S), inter-chip interconnections (Inter-Integrated Circuit, I2C) and general purpose input / output ports (General Purpose Input / Output, GPIO) from parallel to serial, and outputs them to the opposite end screen.

[0005] By converting parallel signals into serial signals, the number of signal lines at the hinge can be reduced, thereby reducing the thickness of the folding hinge. The reduction in hinge thickness makes the terminal thinner and lighter, freeing up more space for the battery, thereby extending the battery life of the device. At the same time, reducing the number of signal lines at the hinge can also reduce the risk of terminal damage. Summary of the invention

[0006] In order to alleviate or partially alleviate the above technical problems, the solution of the present invention is as follows: A serial-to-parallel conversion method, wherein a processor sends parallel multi-channel protocol signals to a first chip; the first chip converts the parallel multi-channel protocol signals into serial SPI signals; the serial SPI signals are sent to a second chip via a cross-screen signal line; the second chip converts the serial SPI signals into parallel multi-channel protocol signals; wherein the parallel multi-channel protocol signals include: SPI signals, I2C signals, I2S signals and GPIO signals; the first chip is located under a first screen, and the second chip is located under a second screen.

[0007] Furthermore, the processor and the first chip are both located under the first screen.

[0008] Furthermore, the first chip and the second chip are the same.

[0009] Furthermore, when the processor sends parallel multi-channel protocol signals to the first chip, it also sends the same parallel multi-channel protocol signals to the first under-screen component; the first under-screen component includes: a sensor, a power management module, an audio module, an LED and an interrupt module.

[0010] Furthermore, after the second chip converts the serial SPI signal into a parallel multi-channel protocol signal, the converted parallel multi-channel protocol signal is sent to the second under-screen component; the second under-screen component includes: a sensor, a power management module, an audio module, an LED and an interrupt module.

[0011] Furthermore, for the first under-screen component and the second under-screen component, signals are sent in the following corresponding relationship: sending SPI signals to the sensor, sending I2C signals to the power management module, sending I2S signals to the audio module, and sending GPIO signals to the LED and interrupt module.

[0012] Furthermore, the first chip includes an edge detection module and a framing and sending module; the edge detection module collects parallel multi-channel protocol signals and then sends them to the framing and sending module; the framing and sending module converts the parallel multi-channel protocol signals into serial SPI signals and sends them to the second chip.

[0013] Furthermore, the second chip includes a receiving and de-framing module; the receiving and de-framing module disassembles the serial SPI signal into parallel multi-channel protocol signals, and then sends them to the second under-screen component.

[0014] A folding screen terminal, comprising a first screen, a second screen and a cross-screen signal line; wherein the first screen comprises a first under-screen component, the second screen comprises a second under-screen component, the first under-screen component comprises a processor and a first chip, and the second under-screen component comprises a second chip; the folding screen terminal realizes communication between the processor and the first under-screen component, and communication between the processor and the second under-screen component according to any one of the serial-to-parallel conversion methods described above.

[0015] Furthermore, the folding screen terminal includes a hinge.

[0016] The technical solution of the present invention has one or more of the following beneficial technical effects: (1) Reduce the number of cross-screen signal lines at the hinge; (2) Reducing the thickness of the folding hinge can free up more space for other components, such as batteries; (3) Reduce the possibility of damage to the phone due to the hinge.

[0017] In addition, other beneficial effects of the present invention will be mentioned in the specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall scheme of the present invention; Figure 2 is a schematic diagram of the structure of the first chip; Figure 3 is a schematic diagram of the structure of the second chip. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In order to clearly describe the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, words such as "first" and "second" are used to distinguish the same or similar items with substantially the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order.

[0021] Figure 1It is a schematic diagram of the overall solution of the present invention. The folding screen terminal includes a processor, a first screen, a second screen and a hinge. A plurality of first sub-screen components are arranged under the first screen, including a sensor, a power management module, an audio module, a first chip, a light emitting diode (LED) and an interrupt module. A plurality of second sub-screen components are arranged under the second screen, including a sensor, a power management module, an audio module, a second chip, an LED and an interrupt module.

[0022] Furthermore, the foldable screen terminal also includes a cross-screen signal line, which passes through the hinge and is used for communication.

[0023] Furthermore, the processor also belongs to the first under-screen component. The processor and the first chip are both located under the first screen.

[0024] According to the corresponding protocol specifications, the processor of the folding screen terminal can send SPI signals, I2C signals, I2S signals and GPIO signals to the first under-screen component. Specifically, SPI signals are sent to sensors, I2C signals are sent to the power management module, I2S signals are sent to the audio module, and GPIO signals are sent to the LED and interrupt module.

[0025] Furthermore, the processor also sends multiple parallel signals such as the same SPI signal, I2C signal, I2S signal and GPIO signal to the first chip.

[0026] Then, the first chip converts the received serial signal into a serial SPI signal, and transmits it to the second chip via the cross-screen signal line.

[0027] The second chip converts the received serial SPI signal into a parallel multi-channel protocol signal and transmits it to the second under-screen component. The parallel multi-channel protocol signal includes: SPI signal, I2C signal, I2S signal and GPIO signal. For example, the SPI signal is transmitted to the sensor, the I2C signal is transmitted to the power management module, the I2S signal is transmitted to the audio module, and the GPIO signal is transmitted to the LED and interrupt module.

[0028] Figure 2 The first chip includes an edge detection module, a framing and sending module, and a receiving and deframing module.

[0029] The first chip receives SPI signals, I2C signals, I2S signals and GPIO signals sent by the processor. According to the corresponding protocols, the edge detection module accurately collects the SPI signals, I2C signals, I2S signals and GPIO signals, and then sends them to the framing and sending module. The framing and sending module converts the parallel multi-channel protocol signals into a unified serial SPI signal, and then sends it to the second chip under the second screen.

[0030] At this time, the receiving and deframing module in the first chip is turned off.

[0031] Figure 3 The second chip receives the serial SPI signal transmitted through the cross-screen signal line, and according to the corresponding protocol specification, the serial SPI signal is disassembled into parallel multi-channel protocol signals through the receiving and deframing module, specifically SPI signal, I2C signal, I2S signal and GPIO signal, and then sent to the second under-screen components, including sensors, power management module, audio module, LED and interrupt module.

[0032] At this time, the edge detection module and the framing and sending module in the second chip are turned off.

[0033] Although some modules in the first chip and the second chip of the present invention are in a closed state, the two chips can use exactly the same circuit structure, which is beneficial to chip design and manufacturing and reduces chip development costs.

[0034] Table 1: Comparison of the effects of the prior art and the present invention

[0035] Table 1 shows the types and numbers of various interface signals in an example. The SPI protocol specifies four signals, and when the number of channels is 2, there are 8 pins in total. The I2S protocol itself specifies 4 signals, and when the number of channels is 1, there are 4 pins in total. The I2C protocol specifies two signals, and when the number of channels is 4, there are 8 pins in total. In addition, the number of GPIO pins is 24. Therefore, before adopting this solution, the total number of cross-screen signal lines at the hinge is 44, and after adopting the technical solution of the present invention, the number of cross-screen signal lines at the hinge can be reduced to 6, thereby greatly reducing the number of cross-screen signal lines.

[0036] In order to better illustrate the present invention, numerous specific details are provided in the above specific embodiments. It should be understood by those skilled in the art that the present invention can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present invention.

[0037] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A serial-to-parallel conversion method, characterized in that: The processor sends parallel multi-channel protocol signals to the first chip; The first chip converts parallel multi-channel protocol signals into serial SPI signals; Sending the serial SPI signal to the second chip via the cross-screen signal line; The second chip converts the serial SPI signal into a parallel multi-channel protocol signal; wherein, The parallel multi-path protocol signals include: SPI signals, I2C signals, I2S signals and GPIO signals; The first chip is located under the first screen, and the second chip is located under the second screen.

2. The serial-to-parallel conversion method according to claim 1, characterized in that: The processor and the first chip are both located under the first screen.

3. The serial-to-parallel conversion method according to claim 2, wherein: The first chip and the second chip are the same.

4. The serial-to-parallel conversion method according to claim 3, characterized in that: When the processor sends the parallel multi-channel protocol signal to the first chip, it also sends the same parallel multi-channel protocol signal to the first under-screen component; The first under-screen component includes: a sensor, a power management module, an audio module, an LED and an interrupt module.

5. The serial-to-parallel conversion method according to claim 4, characterized in that: The second chip converts the serial SPI signal into a parallel multi-channel protocol signal, and sends the converted parallel multi-channel protocol signal to the second under-screen component; The second under-screen component includes: a sensor, a power management module, an audio module, an LED and an interrupt module.

6. The serial-to-parallel conversion method according to claim 1, characterized in that: For the first under-screen component and the second under-screen component, signals are sent in the following corresponding relationship: Send SPI signals to sensors, send I2C signals to power management modules, send I2S signals to audio modules, and send GPIO signals to LEDs and interrupt modules.

7. The serial-to-parallel conversion method according to claim 6, characterized in that: The first chip includes an edge detection module and a framing and sending module; The edge detection module collects the parallel multi-channel protocol signals and then sends them to the framing and sending module; The framing and sending module converts the parallel multi-channel protocol signals into serial SPI signals and sends them to the second chip.

8. The serial-to-parallel conversion method according to claim 7, characterized in that: The second chip includes a receiving and de-framing module; The receiving and deframing module disassembles the serial SPI signal into parallel multi-channel protocol signals and then sends them to the second under-screen component.

9. A folding screen terminal, characterized in that: The folding screen terminal includes a first screen, a second screen and a cross-screen signal line; wherein, The first screen includes a first under-screen component, the second screen includes a second under-screen component, the first under-screen component includes a processor and a first chip, and the second under-screen component includes a second chip; The folding screen terminal realizes communication between the processor and the first under-screen component, and communication between the processor and the second under-screen component according to the serial-to-parallel conversion method according to any one of claims 1-8.

10. The foldable screen terminal according to claim 9, characterized in that: The folding screen terminal includes a hinge.

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