Heat dissipation device and electronic device

Abstract

The invention provides a heat dissipation device and an electronic device, the heat dissipation device comprises a circuit board, a heat source device and a liquid cooling plate, and the heat source device is fixedly installed on the circuit board; the liquid cooling plate comprises a first cover plate, a second cover plate and a middle plate clamped between the first cover plate and the second cover plate, the side, close to the first cover plate, of the middle plate is sunken to form a first containing space, the side, close to the second cover plate, of the middle plate is sunken to form a second containing space, and the liquid cooling plate further comprises a heat dissipation piece arranged in the first containing space. The first accommodating space is filled with phase change liquid; a liquid inlet hole and a liquid outlet hole which are communicated with the second accommodating space are formed in the middle plate; the liquid cooling plate further comprises a liquid inlet pipe and a liquid outlet pipe which are communicated with the second accommodating space through the liquid inlet hole and the liquid outlet hole; the second accommodating space is filled with cooling liquid; a receding hole isolated from the second containing space is formed in the second cover plate, and the heat source device penetrates through the receding hole to be attached to the middle plate. Compared with the prior art, the heat dissipation performance of the heat dissipation device is better.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] With the development of electronic and electrical technology and the improvement of user needs, various electronic products in daily life, scientific research and education have more and more functions and higher power, and the heating of electronic products has become more and more serious. Vapor Chamber (VC) is a thin heat dissipation component. Due to its divergent vapor path and good 2D surface thermal conductivity, it can be used in various electronic products and enhance the heat dissipation effect of the products. It is currently an ideal solution to solve the heat dissipation problems of various electronic products.

[0003] The heat spreader solution provided by the prior art is generally set between the heat source device and the metal shell of the product. After the heat of the heat source device is transferred to the heat spreader, the heat is dissipated through the heat conduction of the metal shell of the product. However, the heat spreader solution in the prior art relies on the passive heat dissipation of the metal shell of the product. For large chip modules with high heat generation, such as the heat source device module of a laptop computer, the passive heat dissipation effect based on the shell attachment is limited. When the laptop computer needs to run at high performance, performance problems may easily occur due to untimely heat dissipation, that is, the existing solution has poor heat dissipation effect.

[0004] Therefore, it is necessary to provide a new heat dissipation solution to solve the above problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation device and an electronic device with better heat dissipation effect.

[0006] In order to solve the above technical problems, the present invention provides a heat dissipation device, which includes a circuit board, a heat source device and a liquid cooling plate, wherein: The heat source device is fixedly mounted on the circuit board; The liquid cooling plate comprises a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further comprises a heat sink disposed in the first receiving space, and the first receiving space is filled with a phase-change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and a liquid inlet hole and a liquid outlet hole both of which are connected to the second receiving space are provided on the middle plate; the liquid cooling plate further comprises a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a cooling liquid; The second cover plate is provided with a clearance hole isolated from the second receiving space, and the heat source device passes through the clearance hole and fits with the middle plate.

[0007] Furthermore, the middle plate includes a recessed portion which is surrounded by the second cover plate to form the second receiving space, and a fitting portion which is fitted with the heat source device, wherein the fitting portion is recessed toward the surface of the heat source device away from the second cover plate to form a groove, and the groove includes a groove bottom surface which is fitted with the heat source device.

[0008] Furthermore, the heat source device includes a first device having a first thickness, and a second device having a second thickness smaller than the first thickness, the surface on which the first device is fixedly mounted on the circuit board and the surface on which the second device is fixedly mounted on the circuit board are located in the same horizontal plane, the bonding portion includes a protruding portion protruding from the bottom surface of the groove toward the heat source device, and the second device is bonded to the protruding portion.

[0009] Furthermore, the heat dissipation device also includes a plurality of support structures arranged at intervals in the second receiving space; the support structures arranged in the second receiving space are supported between the second cover plate and the recessed portion.

[0010] Furthermore, the second cover plate is provided with a first interface mounting position and a second interface mounting position respectively opposite to the liquid inlet hole and the liquid outlet hole; the liquid inlet pipe is clamped at the first interface mounting position and is connected with the liquid inlet hole to form a liquid inlet channel connecting the second containing space with the outside world; the liquid outlet pipe is clamped at the second interface mounting position and is connected with the liquid outlet hole to form a liquid outlet channel connecting the second containing space with the outside world.

[0011] Furthermore, the heat dissipation device also includes a fixing screw, a threaded hole and a fixing hole, the threaded hole is arranged on the second cover plate and the side close to the circuit board, the fixing hole passes through the circuit board and is opposite to the threaded hole, and the fixing screw passes through the fixing hole along the direction of the circuit board toward the liquid cooling plate and forms a threaded fixed connection with the threaded hole.

[0012] Furthermore, the liquid cooling plate includes a plurality of heat sinks arranged in an array, and the heat sinks are temperature averaging plates with a capillary structure.

[0013] The present invention further provides an electronic device, comprising the heat dissipation device as described above.

[0014] Compared with the related art, the heat dissipation device of the present invention comprises a circuit board, a heat source device and a liquid cooling plate, wherein the heat source device is fixedly mounted on the circuit board; the liquid cooling plate comprises a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further comprises a heat dissipation member arranged in the first receiving space, and the first receiving space is filled with a phase change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and a liquid inlet hole and a liquid outlet hole both of which are connected to the second receiving space are provided on the middle plate; the liquid cooling plate further comprises a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a coolant; a clearance hole isolated from the second receiving space is provided on the second cover plate, and the heat source device is fitted with the middle plate through the clearance hole. In the above structure, based on the structure of the middle plate, the temperature equalizing structure is embedded in the liquid cooling plate. Combined with the efficient thermal conductivity of the temperature equalizing structure and the rapid heat dissipation capability of the liquid cooling plate, the overall thermal conductivity of the circuit board is improved, which is more conducive to directly controlling the heat generation of the heat source devices on the circuit board. Compared with the related technology, the heat dissipation performance of the heat dissipation device of the present invention is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which: Figure 1 A schematic diagram of the three-dimensional structure of a heat dissipation device provided in an embodiment of the present invention; Figure 2 For along Figure 1 A cross-sectional view of the AA line in the three-dimensional structural schematic diagram of the heat dissipation device; Figure 3 A schematic diagram of the overall exploded structure of a heat dissipation device provided in an embodiment of the present invention; Figure 4 A schematic diagram of the exploded structure of a liquid cooling plate in a heat dissipation device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-4 As shown, an embodiment of the present invention provides a heat dissipation device 100, wherein the heat dissipation device 100 includes a circuit board 1, a liquid cooling plate 2 and a heat source device 3, wherein: The heat source device 3 is fixedly mounted on the circuit board 1 .

[0018] Please refer to Figure 4 The liquid cooling plate 2 includes a first cover plate 21, a second cover plate 23, and a middle plate 22 sandwiched between the first cover plate 21 and the second cover plate 23, wherein a side of the middle plate 22 close to the first cover plate 21 is recessed toward the second cover plate 23 to form a first receiving space 221, and the liquid cooling plate 2 also includes a heat sink 20 disposed in the first receiving space 221, and the first receiving space 221 is filled with a phase change liquid; a side of the middle plate 22 close to the second cover plate 23 is recessed toward the first cover plate 21 to form a second receiving space 222, and a liquid inlet hole 223 and a liquid outlet hole 224 are provided on the middle plate 22, both of which are connected to the second receiving space 222; the liquid cooling plate 2 also includes a liquid inlet pipe 24 connected to the second receiving space 222 through the liquid inlet hole 223, and a liquid outlet pipe 25 connected to the second receiving space 222 through the liquid outlet hole 224; the second receiving space 222 is filled with a cooling liquid. The second cover plate 23 is provided with a clearance hole 231 isolated from the second receiving space 222 , and the heat source device 3 passes through the clearance hole 231 and fits with the middle plate 22 .

[0019] The heat generated by the heat source device 3 is transferred to the first receiving space 221, and through the action of the heat sink 20 and the phase change liquid, the heat is evenly dispersed in the first receiving space 221, and then transferred to the second receiving space 222; the coolant in the second receiving space 222 circulates through the liquid inlet pipe 24 and the liquid outlet pipe 25, thereby achieving rapid heat dissipation.

[0020] In this embodiment, the heat sink 20 is a temperature-averaging plate with a capillary structure. Specifically, the liquid cooling plate 2 includes a plurality of heat sinks 20 arranged in an array, which further enhances the heat dissipation effect of the heat dissipation device 100 .

[0021] Generally, the liquid inlet pipe 24 and the liquid outlet pipe 25 are respectively connected to an external condensation pump to form a liquid cooling channel for transporting the coolant in the second containment space 222 back and forth. The coolant moves rapidly through the liquid cooling channel, and dissipates heat in combination with external heat sinks, fans and other devices, and returns to the second containment space 222, thereby maintaining a low temperature for the liquid cooling plate 2.

[0022] In the embodiment of the present invention, by directly contacting the heat source device 3 with the middle plate 22, the heat generated by it can be directly transferred to the first receiving space 221 through the middle plate 22, which has a better heat dissipation effect compared with the contact with the first cover plate 21 and the second cover plate 23.

[0023] Specifically, the middle plate 22 includes a recessed portion 225 which is surrounded by the second cover plate 23 to form the second receiving space 222, and a fitting portion 226 which fits the heat source device 3. The fitting portion 226 is recessed toward the surface of the heat source device 3 away from the second cover plate 23 to form a groove 2261. The groove 2261 includes a groove bottom surface 2262 which fits the heat source device 3. When the heat source device 3 is a device having a uniform thickness, the fitting of the heat source device 3 with the groove bottom surface 2262 can ensure that the heat is transferred to the first receiving space 221 to the greatest extent.

[0024] Further, the heat source device 3 includes a first device 31 having a first thickness, and a second device 32 having a second thickness less than the first thickness, the first device 31 is fixedly mounted on the surface of the circuit board 1 and the second device 32 is fixedly mounted on the surface of the circuit board 1 and is located at the same horizontal plane, the fitting portion 224 includes a protrusion 2263 protruding from the groove bottom surface 2262 toward the heat source device 3, and the second device 32 is fitted to the protrusion 2263. By providing the protrusion 2263, when the heat source device 3 includes devices of different thicknesses, it can also be closely fitted with the middle plate 22 to achieve a good heat dissipation effect.

[0025] The second cover plate 23 is provided with a first interface mounting position 232 and a second interface mounting position 233 which are respectively opposite to the liquid inlet hole 223 and the liquid outlet hole 224; the liquid inlet pipe 24 is clamped at the first interface mounting position 232 and communicates with the liquid inlet hole 223 to form a liquid inlet channel connecting the second receiving space 222 with the outside; the liquid outlet pipe 25 is clamped at the second interface mounting position 233 and communicates with the liquid outlet hole 224 to form a liquid outlet channel connecting the second receiving space 222 with the outside. The setting of the first interface mounting position 232 and the second interface mounting position 233 is conducive to the installation of the liquid inlet pipe 24 and the liquid outlet pipe 25.

[0026] The heat dissipation device 100 further includes a fixing screw 4, a threaded hole 5 and a fixing hole 6. The threaded hole 5 is arranged on the second cover plate 23 and on the side close to the circuit board 1. The fixing hole 6 is arranged through the circuit board 1 and is directly opposite to the threaded hole 5. The fixing screw 4 passes through the fixing hole 5 along the direction from the circuit board 1 to the liquid cooling plate 2 and forms a threaded fixed connection with the threaded hole 6. Preferably, for the plate-type liquid cooling plate 2, a combination structure of multiple sets of fixing screws 4, threaded holes 5 and fixing holes 6 can be designed to achieve stable fixation of the overall plate type, so that the surface of the liquid cooling plate 2 and the heat source device 3 have a certain contact surface pressure and fit more closely.

[0027] In the embodiment of the present invention, preferably, the liquid cooling plate 2 is made based on the ECP (Electrochemical Plating) process, which is a process for depositing metallic copper on a semiconductor substrate by an electrochemical method. The liquid cooling plate 2 in the embodiment of the present invention can be made of a high thermal conductivity material as a substrate through the ECP process. The substrate material can be copper, aluminum, stainless steel, titanium alloy, etc., all of which have good thermal conductivity.

[0028] The heat dissipation device 100 further includes a plurality of support structures 26 disposed at intervals in the second receiving space 222; the support structures 26 disposed in the second receiving space 222 are supported between the second cover plate 22 and the recessed portion 225. The design of the support structures 26 inside the second receiving space 222 is conducive to increasing the heat exchange area of ​​the middle plate 22, so as to improve the overall heat conduction and heat dissipation effect of the heat dissipation device 100.

[0029] An embodiment of the present invention further provides an electronic device, which includes the heat dissipation device 100 as described in the above embodiment. It can be understood that the electronic device designed based on the heat dissipation device 100 provided in the embodiment of the present invention, based on the embedded thermal conductive design of the temperature equalizing plate of the heat dissipation device 100, and the heat dissipation structure of the efficient liquid cooling plate, can achieve better heat dissipation performance, as described in the above embodiment, which will not be repeated here.

[0030] Compared with the related art, the heat dissipation device of the present invention comprises a circuit board, a heat source device and a liquid cooling plate, wherein the heat source device is fixedly mounted on the circuit board; the liquid cooling plate comprises a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further comprises a heat dissipation member arranged in the first receiving space, and the first receiving space is filled with a phase change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and a liquid inlet hole and a liquid outlet hole both of which are connected to the second receiving space are provided on the middle plate; the liquid cooling plate further comprises a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a coolant; a clearance hole isolated from the second receiving space is provided on the second cover plate, and the heat source device is fitted with the middle plate through the clearance hole. In the above structure, based on the structure of the middle plate, the temperature equalizing structure is embedded in the liquid cooling plate. Combined with the efficient thermal conductivity of the temperature equalizing structure and the rapid heat dissipation capability of the liquid cooling plate, the overall thermal conductivity of the circuit board is improved, which is more conducive to directly controlling the heat generation of the heat source devices on the circuit board. Compared with the related technology, the heat dissipation performance of the heat dissipation device of the present invention is better.

[0031] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. A heat dissipation device, comprising a circuit board, a heat source device and a liquid cooling plate, characterized in that: The heat source device is fixedly mounted on the circuit board; The liquid cooling plate comprises a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further comprises a heat sink disposed in the first receiving space, and the first receiving space is filled with a phase-change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and a liquid inlet hole and a liquid outlet hole both of which are connected to the second receiving space are provided on the middle plate; the liquid cooling plate further comprises a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a cooling liquid; The second cover plate is provided with a clearance hole isolated from the second receiving space, and the heat source device passes through the clearance hole and fits with the middle plate.

2. The heat dissipation device according to claim 1, characterized in that: The middle plate includes a recessed portion which is surrounded by the second cover plate to form the second receiving space, and a fitting portion which is fitted with the heat source device. The fitting portion is recessed toward the surface of the heat source device away from the second cover plate to form a groove, and the groove includes a groove bottom surface which is fitted with the heat source device.

3. The heat dissipation device according to claim 2, characterized in that: The heat source device includes a first device having a first thickness and a second device having a second thickness smaller than the first thickness. The surface on which the first device is fixedly mounted on the circuit board and the surface on which the second device is fixedly mounted on the circuit board are located in the same horizontal plane. The bonding portion includes a protruding portion protruding from the bottom surface of the groove toward the heat source device, and the second device is bonded to the protruding portion.

4. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device further comprises a plurality of support structures arranged at intervals in the second receiving space; the support structures arranged in the second receiving space are supported between the second cover plate and the recessed portion.

5. The heat dissipation device according to claim 1, characterized in that: The second cover plate is provided with a first interface mounting position and a second interface mounting position which are respectively opposite to the liquid inlet hole and the liquid outlet hole; the liquid inlet pipe is clamped at the first interface mounting position and is connected with the liquid inlet hole to form a liquid inlet channel connecting the second containing space with the outside world; the liquid outlet pipe is clamped at the second interface mounting position and is connected with the liquid outlet hole to form a liquid outlet channel connecting the second containing space with the outside world.

6. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a fixing screw, a threaded hole and a fixing hole. The threaded hole is arranged on the second cover plate and a side close to the circuit board. The fixing hole passes through the circuit board and is opposite to the threaded hole. The fixing screw passes through the fixing hole along the direction of the circuit board toward the liquid cooling plate and forms a threaded fixed connection with the threaded hole.

7. The heat dissipation device according to claim 1, characterized in that: The liquid cooling plate includes a plurality of heat sinks arranged in an array, and the heat sinks are temperature averaging plates with a capillary structure.

8. An electronic device, characterized in that: The electronic device comprises the heat dissipation device as claimed in claim 1.

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