High-frequency copper-clad plate manufacturing method and high-frequency copper-clad plate

Abstract

The invention relates to a high-frequency copper-clad plate manufacturing method and a high-frequency copper-clad plate. The manufacturing method comprises the following steps: coating a glass fabric with glue; baking to obtain a bonding sheet; performing shearing; a flexible net film is prepared, the flexible net film is made of an insulating material, one side of the flexible net film is arranged to be a glossy surface, the other side of the flexible net film is provided with microstructures, the microstructures are evenly distributed, the flexible net film further comprises a plurality of micro-mesh holes, and the micro-mesh holes and the microstructures are evenly distributed and arranged in a staggered mode; laminating and combining to obtain a to-be-laminated product; and performing hot pressing on the to-be-pressed product to obtain the high-frequency copper-clad plate. According to the application, the flexible net film is prepared, and the glass fabric can be supported and limited through the microstructure of the flexible net film, so that the flexible net film can be flatly laid so as to be uniformly distributed, and the high-frequency signal transmission performance of the glass fabric-based double-sided copper-clad plate is guaranteed; and meanwhile, the influence of the arrangement of the flexible net film on the structural stability of the glass fabric-based double-sided copper-clad plate is reduced through the micro-meshes of the flexible net film.

Description

Technical Field

[0001] The present application relates to the technical field, and in particular to a method for manufacturing a high-frequency copper clad laminate and a high-frequency copper clad laminate. Background Art

[0002] Copper Clad Laminate (CCL) is a plate-shaped material made by impregnating reinforcing materials with resin glue, covering one or both sides with copper foil, and hot pressing. It undertakes the three major functions of printed circuit board (PCB), namely, conductivity, insulation, and support. Taking glass fiber cloth-based double-sided copper clad laminate as an example, its main raw materials are copper foil, glass fiber cloth and resin, and glass fiber cloth and resin constitute the matrix layer of the copper clad laminate. High-frequency copper clad laminate is a type of PCB substrate material with high-speed signal and low-loss transmission characteristics applied at high frequencies, also known as low-loss copper clad laminate. In high-frequency copper clad laminates, the uniformity of the dielectric layer composition affects the uniformity and consistency of the dielectric properties when the high-frequency signal is transmitted inside it, that is, the output performance of the high-frequency signal will change with the unevenness of the dielectric layer composition structure. However, in the prior art, the glass fiber cloth of the glass fiber cloth-based double-sided copper clad laminate is usually difficult to achieve uniform distribution in the resin during the lamination process due to the certain fluidity of the resin, and thus it is difficult to ensure the high-frequency signal transmission performance of the high-frequency copper clad laminate. Summary of the invention

[0003] In order to improve the problem in the prior art that the glass fiber cloth of the glass fiber cloth-based double-sided copper clad laminate is usually difficult to achieve uniform distribution in the resin and difficult to ensure the performance of high-frequency signal transmission, the present application provides a method for manufacturing a high-frequency copper clad laminate and a high-frequency copper clad laminate.

[0004] In a first aspect, the present application provides a method for manufacturing a high-frequency copper clad laminate, characterized in that the method for manufacturing a high-frequency copper clad laminate comprises:

[0005] Applying glue on the glass fiber cloth, wherein the glue comprises brominated epoxy resin;

[0006] Baking the glass fiber cloth coated with the glue to make the glue semi-cured and obtain an adhesive sheet;

[0007] According to the size of the copper foil, the adhesive sheet is cut into corresponding sizes;

[0008] Prepare a flexible mesh, wherein the flexible mesh is made of an insulating material with a melting point greater than that of the brominated epoxy resin, one side of the flexible mesh is set as a glossy surface, and the other side is set with a microstructure, the microstructure is evenly distributed, and the flexible mesh also includes a plurality of micro-meshes, the micro-meshes are evenly distributed and staggered with the microstructure;

[0009] Laminating and assembling the copper foil, the flexible mesh, the adhesive sheet, the flexible mesh and the copper foil in the order of stacking to obtain a product to be laminated;

[0010] The product to be pressed is hot pressed so that the glue of the adhesive sheet is melted again to flow through the micro mesh to the copper foil, and the microstructure passes through the pores of the glass fiber cloth, so as to finally obtain a high-frequency copper clad laminate.

[0011] Optionally, preparing a flexible mesh film comprises:

[0012] preparing a mold for the flexible mesh;

[0013] The flexible mesh is cast into shape by a mold of the flexible mesh.

[0014] Optionally, preparing the mold of the flexible mesh includes:

[0015] Prepare a lower mold of the flexible mesh, wherein the lower mold is provided with a casting space having a configuration opposite to that of the flexible mesh;

[0016] An upper mold for preparing the flexible web film is provided with a glossy surface, and the upper mold abuts against the lower mold through the glossy surface.

[0017] Optionally, after the product to be laminated is hot-pressed so that the glue of the adhesive sheet is melted again to flow through the micro-mesh to the copper foil, and the microstructure passes through the pores of the glass fiber cloth to finally obtain a high-frequency copper clad laminate, the method for manufacturing a high-frequency copper clad laminate further includes:

[0018] The two sides of the high-frequency copper-clad laminate where the copper foil is located are heated separately.

[0019] Optionally, heating the two sides of the high-frequency copper clad laminate where the copper foil is located separately includes:

[0020] preparing a heating body corresponding to the size of the copper foil;

[0021] The heating body is placed face to face with the copper foil so as to heat the copper foil through the heating body.

[0022] Optionally, after the product to be laminated is hot-pressed so that the glue of the adhesive sheet is melted again to flow through the micro-mesh to the copper foil, and the microstructure passes through the pores of the glass fiber cloth to finally obtain a high-frequency copper clad laminate, the method for manufacturing a high-frequency copper clad laminate further includes:

[0023] The high-frequency copper-clad laminate is trimmed.

[0024] Optionally, the flexible mesh includes a trimming portion and a functional portion, the trimming portion is arranged in a frame shape, the functional portion is arranged in the frame of the trimming portion and is only partially connected to the trimming portion, and the microstructure and the micro mesh are both arranged on the functional portion;

[0025] The high-frequency copper-clad laminate is trimmed, including:

[0026] The high-frequency copper clad laminate is trimmed with the connection between the trimming portion and the functional portion as a boundary.

[0027] Optionally, the functional portion is connected to the trimming portion via a connecting portion, and the connecting portion is arranged on a side of the flexible web away from the glossy surface thereof.

[0028] Optionally, the connecting portion is configured to be in a strip or sheet shape, and a plurality of the connecting portions are provided, and the plurality of connecting portions are distributed at intervals within the frame of the trimming portion.

[0029] In a second aspect, the present application provides a high-frequency copper clad laminate, which is prepared by using any one of the high-frequency copper clad laminate manufacturing methods provided in the present application.

[0030] By preparing a flexible mesh, the present application can support and limit the glass fiber cloth through the microstructure of the flexible mesh during the "matching" and "hot pressing" processes, so that the flexible mesh can be laid flat and evenly distributed, thereby ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue in the matrix can contact the copper foil through the micro-mesh holes of the flexible mesh to achieve effective bonding, thereby reducing the influence of the setting of the flexible mesh on the structural stability of the glass fiber cloth-based double-sided copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a longitudinal cross-sectional view of a high-frequency copper-clad laminate prepared by the high-frequency copper-clad laminate manufacturing method provided in Example 1 of the present application.

[0032] Figure 2 It is a structural schematic diagram of the flexible mesh film of a high-frequency copper-clad laminate prepared by the high-frequency copper-clad laminate manufacturing method provided in Example 1 of the present application.

[0033] Figure 3 This is an axonometric diagram of a high-frequency copper-clad laminate prepared by the high-frequency copper-clad laminate manufacturing method provided in Example 1 of the present application, with the adhesive sheet hidden;

[0034] Figure 4 yes Figure 3 Enlarged view of part A in the middle.

[0035] Explanation of reference numerals: 100, copper foil; 200, flexible mesh; 210, trimming portion; 220, functional portion; 230, connecting portion; 300, adhesive sheet; 310, glass fiber cloth; 320, glue; 400, microstructure; 500, micromesh. DETAILED DESCRIPTION

[0036] The following is combined with Figure 1-4 This application is described in further detail.

[0037] Embodiment 1

[0038] Embodiment 1 of the present application provides a method for manufacturing a high-frequency copper-clad laminate. Figures 1 to 4 As shown, the method for manufacturing a high-frequency copper clad laminate includes the following steps:

[0039] S1, coating glue 320 on the glass fiber cloth 310, wherein the glue 320 includes brominated epoxy resin;

[0040] S2, baking the glass fiber cloth 310 coated with the glue 320 to make the glue 320 in a semi-cured state, and obtaining the adhesive sheet 300;

[0041] S3, cutting the adhesive sheet 300 into corresponding sizes according to the size of the copper foil 100;

[0042] S4, preparing a flexible mesh 200, the flexible mesh 200 is made of an insulating material, and its melting point is greater than that of brominated epoxy resin, one side of the flexible mesh 200 is set as a glossy surface, and the other side is provided with a microstructure 400, the microstructure 400 is evenly distributed, and the flexible mesh 200 also includes a plurality of micro meshes 500, the micro meshes 500 are evenly distributed, and are staggered with the microstructure 400;

[0043] S5, laminating and assembling the copper foil 100, the flexible web 200, the adhesive sheet 300, the flexible web 200 and the copper foil 100 in the order of lamination to obtain a product to be laminated;

[0044] S6. The laminated product is hot pressed to make the glue 320 of the adhesive sheet 300 melt again and flow through the micro mesh 500 to the copper foil 100, and at the same time make the micro structure 400 pass through the pores of the glass fiber cloth 310, so as to finally obtain a high-frequency copper clad laminate.

[0045] In this embodiment, for example, step S1 and step S2 can be referred to as "gluing". In step S1, it is necessary to ensure the uniformity of the glue 320 applied on the glass fiber cloth 310, and this step can be completed by a gluing machine. In step S2, the glass fiber cloth 310 coated with glue 320 can also be baked by a gluing machine to obtain the adhesive sheet 300. During baking, the fluidity of the glue 320 needs to be strictly controlled. The fluidity reflects the semi-curing index of the glue 320. If the fluidity is too large, the thickness of the glue 320 is easily uneven due to the "slide" phenomenon when the glue 320 contacts the copper foil 100; if the fluidity is too small, the bonding force of the glue 320 is not ideal. Before step S1 and step S2, glue 320 can also be prepared first. Glue 320 can be obtained by uniformly mixing raw materials such as brominated epoxy resin, curing agent, accelerator and solvent in a certain proportion. This process can be referred to as "mixing glue" or "pulping". Step S3 can be referred to as "slicing", that is, cutting the adhesive sheet 300 into a required size. It is not difficult to understand that steps S1 to S3 need to be performed in sequence.

[0046] Step S4 can be simply referred to as "film formation", which can be a parallel step with steps S1 to S3; in other words, step S4 can be performed at any position of steps S1 to S3, such as before step S1, or after step S3, or simultaneously with step S1, etc. It is not difficult to understand that the size of the flexible mesh film 200 prepared in step S4 also corresponds to the size of the copper foil 100. The material of the flexible mesh film 200 needs to meet the insulation characteristics to avoid the flexible mesh film 200 and the copper foil 100 being electrically connected to affect signal transmission.

[0047] like Figure 1 As shown, step S5 can be referred to as "sheeting", that is, stacking the various layers of structure in the required order to obtain the product to be pressed. In this embodiment, the stacking order is: copper foil 100, flexible web 200, adhesive sheet 300, flexible web 200 and copper foil 100. During "sheeting", the side where the glossy surface of the flexible web 200 is located is in contact with and attached to the copper foil 100, and the side where the microstructure 400 of the flexible web 200 is located is attached to the adhesive sheet 300.

[0048] like Figure 1 and Figure 2As shown, step S6 can be referred to as "hot pressing", which can be completed by a laminator. Through step S6, a high-frequency copper clad laminate can be finally prepared. In step S6, the laminator melts the semi-cured glue 320 again by heating and pressurizing the laminated product to make it flow under pressure. In this embodiment, the material of the flexible mesh 200 can be silicone rubber, PET (Polyethylene Terephthalat) or TPU (Thermoplastic Urethane). The melting point of silicone rubber is usually around 400°C, the melting point of PET is generally between 245-260°C, and the melting point of TPU is usually between 170-230°C; and the melting point of brominated epoxy resin is usually less than 150°C. During "hot pressing", by controlling the temperature of "hot pressing", the glue 320 can be melted again to prevent the flexible mesh 200 from being melted. In other words, the temperature during "hot pressing" can be between the melting point of the brominated epoxy resin and the melting point of the material of the flexible mesh 200. At this time, since the melting point of the material of the flexible mesh 200 is greater than that of the brominated epoxy resin, the melted glue 320 can be filled between the microstructures 400 and flow through the micromesh 500 to the copper foil 100. When the re-melted glue 320 is cooled and completely solidified, it can be bonded to the copper foil 100. At the same time, when the glue 320 is re-melted, the glass fiber cloth 310 is pressed on the microstructure 400. Since the microstructure 400 has a flexible characteristic, the microstructure 400 can produce a certain deformation and pass through the pores of the glass fiber cloth 310 to support and limit the glass fiber cloth 310, and the glass fiber cloth 310 can be laid flat on the flexible mesh 200. In order to facilitate the microstructure 400 to pass through the glass fiber cloth 310, the microstructure 400 can be set to a cone shape, such as a cylindrical shape, a triangular pyramid shape, a quadrangular pyramid shape, etc. Since the height difference of the glass fiber cloth 310 when distributed is less than the height that can be compressed when the microstructure 400 is deformed, which is much smaller than the height of the dielectric layer, the microstructure 400 can make the glass fiber cloth 310 evenly distributed between the two copper foils 100. In other words, the existing dielectric layer can be replaced by two layers of flexible mesh 200 and a layer of adhesive sheet 300, and the glass fiber cloth 310 in the adhesive sheet 300 is not easy to be unevenly distributed due to the flow of glue 320.

[0049] It can be understood that, by preparing the flexible mesh 200, the present application can support and limit the glass fiber cloth 310 through the microstructure 400 of the flexible mesh 200 during the "matching" and "hot pressing" processes, so that the flexible mesh 200 can be laid flat and evenly distributed, thereby ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue 320 in the matrix can be effectively bonded to the copper foil 100 through the micro-mesh 500 of the flexible mesh 200, thereby reducing the influence of the setting of the flexible mesh 200 on the structural stability of the glass fiber cloth-based double-sided copper clad laminate.

[0050] Specifically, preparing the flexible mesh 200 (i.e., step S4) includes the following steps:

[0051] S41, preparing a mold of the flexible mesh 200;

[0052] S42, casting the flexible mesh 200 through a mold of the flexible mesh 200.

[0053] In this embodiment, for example, step S41 selects a material with good high temperature resistance and high structural stability to prepare the mold of the flexible mesh 200, such as a metal material such as copper alloy and aluminum alloy. Step S42 can be to prepare the flexible mesh 200 by pouring the melted raw material into the mold of the flexible mesh 200, and step S42 can adopt a vacuum casting method to ensure the molding accuracy of the flexible mesh 200.

[0054] It can be understood that, by reasonably setting the preparation method of the flexible mesh 200, this embodiment facilitates mass production of the flexible mesh 200, while reducing the cost of preparation and processing, thereby ensuring smooth preparation of high-frequency copper clad laminates.

[0055] More specifically, preparing a mold of the flexible web 200 (i.e., step S41) includes the following steps:

[0056] S411, preparing a lower mold of the flexible mesh 200, wherein the lower mold is provided with a casting space having a configuration opposite to that of the flexible mesh 200;

[0057] S412, preparing an upper mold of the flexible web 200, wherein the upper mold is provided with a glossy surface, and the upper mold abuts against the lower mold through its glossy surface.

[0058] In this embodiment, it is exemplified that in step S411, the lower mold of the flexible web 200 can be prepared by an etching process, for example, a picture with a configuration opposite to that of the flexible web 200 is etched on one side of a copper alloy plate or an aluminum alloy plate to form a casting space for casting the flexible web 200. In step S412, the upper mold can be a machined copper alloy plate or an aluminum alloy plate, and during machining, the copper alloy plate or the aluminum alloy plate is machined to have a glossy surface with a small surface roughness, so that the upper mold and the lower mold abut against each other to close the casting space, thereby facilitating casting.

[0059] Of course, in some embodiments, the lower mold of the flexible mesh 200 can also be prepared by 3D printing or other methods.

[0060] It is understandable that this embodiment can easily ensure the processing accuracy of the mold of the flexible mesh 200 by reasonably setting the preparation method of the mold of the flexible mesh 200, thereby ensuring the molding accuracy of the flexible mesh 200 during the casting process of the flexible mesh 200.

[0061] Specifically, after the laminated product is hot-pressed so that the glue 320 of the adhesive sheet 300 is melted again to flow through the micro-mesh 500 to the copper foil 100, and the microstructure 400 passes through the pores of the glass fiber cloth 310, and finally a high-frequency copper clad laminate is obtained (i.e., step S6), the high-frequency copper clad laminate manufacturing method further includes the following steps:

[0062] S7, heating the two sides of the high-frequency copper clad laminate where the copper foil 100 is located separately.

[0063] In this embodiment, for example, step S7 can be referred to as "melting film". In step S7, the two sides of the high-frequency copper clad laminate where the copper foil 100 is located, that is, the two sides in the thickness direction of the high-frequency copper clad laminate, are heated separately, that is, the high-frequency copper clad laminate is heated from the side where the two copper foils 100 are away from each other. After the "hot pressing" is completed and the glue 320 is completely cured, through step S7, the side of the flexible mesh 200 attached to the copper foil 100 can be instantly heated and melted, and has a certain bonding force, and when the side of the flexible mesh 200 attached to the copper foil 100 is cooled, the flexible mesh 200 and the copper foil 100 can also form a certain bonding effect. It should be noted that when heating the side where the two copper foils 100 are away from each other, it is necessary to ensure that the heating time is short and the heating temperature is high to avoid the phenomenon of overall melting of the flexible mesh 200 and the glue 320.

[0064] It can be understood that, in this embodiment, by separately heating the two sides of the high-frequency copper clad laminate where the copper foil 100 is located, the structural stability of the high-frequency copper clad laminate can be further increased.

[0065] More specifically, the two sides of the high-frequency copper clad laminate where the copper foil 100 is located are heated separately (i.e., step S7), including the following steps:

[0066] S71, preparing a heating body corresponding to the size of the copper foil 100;

[0067] S72, placing the heating body and the copper foil 100 face to face, so as to heat the copper foil 100 through the heating body.

[0068] In this embodiment, it is exemplified that in step S71, the heating body can be a metal material that is resistant to high temperatures and has a high thermal conductivity, and can be set as a block. The heating body is provided with at least a contact surface corresponding to the size of the copper foil 100, and it can contact the copper foil 100 through the contact surface. In step S72, when the heating body is heated to a specified temperature, the contact surface of the heating body is attached to the copper foil 100, so that the copper foil 100 can be heated instantly alone.

[0069] It can be understood that, in this embodiment, by attaching a heating body corresponding to the size of the copper foil 100 to the copper foil 100 , it is easy to heat the two sides of the high-frequency copper clad laminate where the copper foil 100 is located separately.

[0070] Specifically, after the laminated product is hot-pressed so that the glue 320 of the adhesive sheet 300 melts again and flows through the micro-mesh 500 to the copper foil 100, and the microstructure 400 passes through the pores of the glass fiber cloth 310, and finally a high-frequency copper-clad laminate is obtained (i.e., step S6), the high-frequency copper-clad laminate manufacturing method further includes the following steps:

[0071] S8. Trim the edges of the high-frequency copper clad laminate.

[0072] like Figure 3 As shown, in this embodiment, the method for manufacturing a high-frequency copper clad laminate may include steps S1 to S6, and also include steps S7 and S8. Of course, in some embodiments, the method for manufacturing a high-frequency copper clad laminate may include steps S1 to S6, and only include step S8. Step S8 may be referred to as "cutting". In step S8, the edge of the high-frequency copper clad laminate may be cut according to actual needs so that the size of the high-frequency copper clad laminate meets the needs of use.

[0073] More specifically, the flexible mesh 200 includes a trimming portion 210 and a functional portion 220, the trimming portion 210 is arranged in a frame shape, the functional portion 220 is arranged in the frame of the trimming portion 210, and is only partially connected to the trimming portion 210, and the microstructure 400 and the micromesh 500 are both arranged on the functional portion 220;

[0074] The high-frequency copper-clad laminate is trimmed (i.e., step S8), comprising the following steps:

[0075] S81 , trimming the high-frequency copper clad laminate with the connection between the trimming portion 210 and the functional portion 220 as the boundary.

[0076] like Figure 2 and Figure 3 As shown, in this embodiment, the trimming portion 210 can be set as a rectangular frame, and the functional portion 220 is set in the rectangular frame of the trimming portion 210 and is spaced apart from the trimming portion 210. The trimming portion 210 and the functional portion 220 are only partially connected. In step S81, when trimming the high-frequency copper clad laminate, the cutting position is the connection between the trimming portion 210 and the functional portion 220.

[0077] It can be understood that, by reasonably setting the structure of the flexible mesh 200 and reasonably selecting the trimming position of the high-frequency copper clad laminate after the high-frequency copper clad laminate is prepared, this embodiment can ensure that only a small portion of the flexible mesh 200 exists on the outer edge of the high-frequency copper clad laminate, while having relatively more glue 320, thereby improving the structural stability of the high-frequency copper clad laminate.

[0078] More specifically, the functional portion 220 is connected to the trimming portion 210 via a connecting portion 230 , and the connecting portion 230 is disposed on a side of the flexible web 200 away from the glossy surface thereof.

[0079] like Figure 2 and Figure 3 As shown, in this embodiment, the thickness of the trimming portion 210 can be equal to the thickness of the functional portion 220 and greater than the thickness of the connecting portion 230. The connecting portion 230 can be arranged on the side of the flexible web 200 away from its glossy surface, that is, the side that does not contact the copper foil 100. When the glue 320 melts, it can also fill between the connecting portion 230 and the copper foil 100. When the high-frequency copper clad laminate is trimmed, the outer edge of the high-frequency copper clad laminate is directly in contact with the copper foil 100 by the glue 320.

[0080] It can be understood that, by further configuring the structure of the flexible mesh 200 in this embodiment, the structural stability of the outer edge of the high-frequency copper clad laminate can be particularly improved.

[0081] More specifically, the connection portion 230 is configured in a strip or sheet shape, and a plurality of the connection portions 230 are provided, and the plurality of connection portions 230 are distributed at intervals within the frame of the trimming portion 210 .

[0082] like Figure 2 and Figure 4As shown, in this embodiment, it is exemplified that a plurality of strips or sheets can be provided in both the length direction and the width direction of the trimming portion 210, and are arranged at equal intervals. When the flexible web 200 is removed from its mold, the trimming portion 210 and the functional portion 220 are not easily completely separated due to the presence of the plurality of connecting portions 230. During the "hot pressing" process, the melted glue 320 can pass through the interval between two adjacent connecting portions 230 and fill in between the connecting portion 230 and the copper foil 100.

[0083] It can be understood that this embodiment further reasonably arranges the structure of the flexible mesh 200, which not only facilitates the preparation and processing of the flexible mesh 200, but also makes it easy to fill the melted glue 320 in all the gaps of the flexible mesh 200 to ensure the structural stability of the outer edge of the high-frequency copper clad laminate.

[0084] Embodiment 2

[0085] Embodiment 2 of the present application provides a high-frequency copper clad laminate, and the high-frequency copper clad laminate is manufactured by using any one of the high-frequency copper clad laminate manufacturing methods provided in the present application.

[0086] By preparing the flexible mesh 200, the present application can support and limit the glass fiber cloth 310 through the microstructure 400 of the flexible mesh 200 during the "matching" and "hot pressing" processes, so that the flexible mesh 200 can be laid flat and evenly distributed, thereby ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue 320 in the matrix can contact the copper foil 100 through the micro-mesh 500 of the flexible mesh 200 to achieve effective bonding, thereby reducing the influence of the setting of the flexible mesh 200 on the structural stability of the glass fiber cloth-based double-sided copper clad laminate.

[0087] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing a high-frequency copper-clad laminate, characterized in that: The high-frequency copper-clad laminate manufacturing method comprises: Applying glue (320) on the glass fiber cloth (310), wherein the glue (320) includes brominated epoxy resin; The glass fiber cloth (310) coated with the glue (320) is baked so that the glue (320) is in a semi-cured state and an adhesive sheet (300) is obtained; According to the size of the copper foil (100), the adhesive sheet (300) is cut into a corresponding size; A flexible mesh (200) is prepared, wherein the flexible mesh (200) is made of an insulating material with a melting point greater than that of the brominated epoxy resin, one side of the flexible mesh (200) is set as a glossy surface, and the other side is provided with a microstructure (400), wherein the microstructure (400) is evenly distributed, and the flexible mesh (200) further comprises a plurality of micro-meshes (500), wherein the micro-meshes (500) are evenly distributed and are arranged in a staggered manner with respect to the microstructure (400); Laminating and assembling the copper foil (100), the flexible web (200), the adhesive sheet (300), the flexible web (200) and the copper foil (100) in the order of stacking to obtain a product to be laminated; The product to be pressed is subjected to hot pressing so that the glue (320) of the adhesive sheet (300) melts again and flows through the micro mesh (500) to the copper foil (100), and at the same time, the microstructure (400) passes through the pores of the glass fiber cloth (310), so as to finally obtain a high-frequency copper clad laminate.

2. The method for manufacturing a high-frequency copper-clad laminate according to claim 1, characterized in that: A method for preparing a flexible mesh film (200) includes: Preparing a mold for the flexible mesh (200); The flexible mesh (200) is cast into shape using a mold of the flexible mesh (200).

3. The method for manufacturing a high-frequency copper-clad laminate according to claim 2, characterized in that: The mold for preparing the flexible mesh (200) comprises: Preparing a lower mold of the flexible mesh (200), wherein the lower mold is provided with a casting space having a configuration opposite to that of the flexible mesh (200); An upper mold for preparing the flexible web film (200) is provided with a glossy surface, and the upper mold abuts against the lower mold through its glossy surface.

4. The method for manufacturing a high-frequency copper-clad laminate according to claim 1, characterized in that: After the product to be pressed is hot-pressed so that the glue (320) of the adhesive sheet (300) is melted again to flow through the micro-mesh (500) to the copper foil (100), and the microstructure (400) passes through the pores of the glass fiber cloth (310), and finally a high-frequency copper-clad laminate is obtained, the high-frequency copper-clad laminate manufacturing method further includes: The two sides of the high-frequency copper-clad laminate where the copper foil (100) is located are heated separately.

5. The method for manufacturing a high-frequency copper-clad laminate according to claim 4, characterized in that: The two sides of the high-frequency copper-clad laminate where the copper foil (100) is located are heated separately, comprising: preparing a heating body having a size corresponding to the copper foil (100); The heating body is placed face-to-face with the copper foil (100) so as to heat the copper foil (100) through the heating body.

6. The method for manufacturing a high-frequency copper-clad laminate according to claim 1 or 4, characterized in that: After the product to be pressed is hot-pressed so that the glue (320) of the adhesive sheet (300) is melted again to flow through the micro-mesh (500) to the copper foil (100), and the microstructure (400) passes through the pores of the glass fiber cloth (310), and finally a high-frequency copper-clad laminate is obtained, the high-frequency copper-clad laminate manufacturing method further includes: The high-frequency copper-clad laminate is trimmed.

7. The method for manufacturing a high-frequency copper-clad laminate according to claim 6, characterized in that: The flexible mesh (200) comprises a trimming portion (210) and a functional portion (220), the trimming portion (210) being arranged in a frame shape, the functional portion (220) being arranged in the frame of the trimming portion (210) and only partially connected to the trimming portion (210), and the microstructure (400) and the micromesh (500) being arranged on the functional portion (220); The high-frequency copper-clad laminate is trimmed, including: The high-frequency copper-clad laminate is trimmed with the connection between the trimming portion (210) and the functional portion (220) as the boundary.

8. The method for manufacturing a high-frequency copper-clad laminate according to claim 7, characterized in that: The functional portion (220) is connected to the trimming portion (210) via a connecting portion (230), and the connecting portion (230) is arranged on a side of the flexible web (200) away from its glossy surface.

9. The method for manufacturing a high-frequency copper-clad laminate according to claim 8, characterized in that: The connecting portion (230) is configured in a strip or sheet shape, and is provided in plurality, and the plurality of connecting portions (230) are distributed at intervals within the frame of the trimming portion (210).

10. A high frequency copper clad laminate, characterized in that: The high-frequency copper clad laminate is prepared by the high-frequency copper clad laminate manufacturing method according to any one of claims 1 to 9.

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