Semiconductor packaging welding quality detection method

Abstract

The invention provides a semiconductor packaging welding quality detection method, which is a method for detecting the semiconductor packaging welding quality according to a semiconductor packaging welding quality detection system. The method comprises the following steps: an IC bonding wire detection unit sends an excitation signal to a bonding wire through a BITS detection circuit and samples a reflection signal of the bonding wire to output a waveform detection signal; the IC bonding wire detection unit judges whether a control instruction sent by the upper computer is received or not according to the waveform detection signal; after a control instruction sent by the upper computer is received, voltage calibration is carried out on the bonding wire, and a calibration value is calculated; the ignition logic control unit starts an ignition process through the EFO control circuit and adjusts ignition parameters based on the calibration value; and after the ignition process is finished, detecting the bonding wire and outputting a detection result. According to the semiconductor packaging welding quality detection method provided by the invention, interference signals can be filtered out, and the detection precision and the production efficiency can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of wire bonding machines, and in particular relates to a semiconductor packaging welding quality detection method. Background Art

[0002] Wire bonders are indispensable equipment in semiconductor packaging processes. Their main function is to bond gold wires (or metal leads) to die (or chip holders). With the rapid development of the semiconductor industry, IC design is becoming more diversified and faster, and the accuracy requirements for wire bond integrity detection are also getting higher and higher.

[0003] At present, conventional wire bonding machines usually use hardware circuits for effective value conversion, convert the measured signal and interference noise into effective signals and filter them uniformly, and then perform logical judgment based on the filtered effective signals to monitor the welding process of each line of the IC in real time. For example, Chinese invention patents with publication numbers CN109975687A and CN116984708A disclose related IC bonding wire quality detection devices and methods. At the same time, Chinese invention patents with publication number CN1773786A introduce a logic control circuit based on a programmable logic device CPLD, which is used to realize self-monitoring of sparking balls.

[0004] However, the above-mentioned prior art generally designs the two logical function circuits of the ignition control system (EFO) and the IC bonding wire detection (BITS) separately. This design method has problems such as poor filtering effect, weak anti-interference ability, time-consuming process and difficulty in achieving high-precision detection. Summary of the invention

[0005] The present invention aims to solve the defects in the above-mentioned prior art and provide a semiconductor packaging welding quality detection method that can filter out interference signals and improve detection accuracy and production efficiency.

[0006] To achieve the above-mentioned purpose, the present invention provides a semiconductor package welding quality detection method, which is a method for detecting the semiconductor package welding quality according to a semiconductor package welding quality detection system, wherein the system comprises a semiconductor package welding quality detection device and a host computer, wherein the semiconductor package welding quality detection device comprises a main control chip, an EFO control circuit and a BITS detection circuit, wherein the main control chip comprises a communication unit connected to the host computer for communication, an ignition logic control unit connected to the EFO control circuit, and an IC bonding lead detection unit connected to the BITS detection circuit, wherein the method comprises the following steps: the IC bonding lead detection unit is connected to the host computer for communication An excitation signal is sent to the bonding wire through the BITS detection circuit and the reflection signal of the bonding wire is sampled to output a waveform detection signal; the IC bonding wire detection unit determines whether to receive the control instruction sent by the host computer according to the waveform detection signal; after receiving the control instruction sent by the host computer, the IC bonding wire detection unit performs voltage calibration on the bonding wire and calculates the calibration value; the ignition logic control unit starts the ignition process through the EFO control circuit, and adjusts the ignition parameters based on the calibration value; the IC bonding wire detection unit detects the bonding wire after the ignition process is completed and outputs the detection result.

[0007] In the present invention, the ignition logic control unit and the IC bonding wire detection unit are integrated in the main control chip. Compared with the technology in the prior art that separately designs the two logic function circuits of the ignition control system (EFO) and the IC bonding wire detection (BITS) for detection, the filtering effect, anti-interference ability, detection speed and detection accuracy can be improved.

[0008] In the semiconductor package welding quality detection method involved in the present invention, optionally, it also includes: the IC bonding lead detection unit sends the detection result to the host computer.

[0009] In the semiconductor packaging welding quality detection method involved in the present invention, optionally, the IC bonding lead detection unit includes a detection module, a waveform sending module, and a waveform sampling module. The detection module is configured to calculate the calibration value before ignition and detect the IC bonding lead after ignition. The waveform sending module is configured to send an excitation signal to the bonding lead, and the waveform sampling module is configured to collect the detection waveform signal reflected by the bonding lead.

[0010] In the semiconductor package welding quality detection method involved in the present invention, optionally, when the ignition process is started, the waveform sending module stops sending the excitation signal.

[0011] In the semiconductor packaging welding quality detection method involved in the present invention, optionally, the communication unit includes an SPI communication host module and an SPI communication slave module, the SPI communication slave module is configured to receive control instructions sent by a host computer, and the SPI communication host module is configured to send feedback instructions to the host computer, and the feedback instructions include the detection results.

[0012] In the semiconductor package welding quality detection method involved in the present invention, optionally, before sending the excitation signal to the bonding wire, it also includes: initializing the main control chip and loading the storage parameters in the memory.

[0013] In the semiconductor package welding quality detection method involved in the present invention, optionally, the main control chip also includes a synchronizer unit, and the synchronizer unit is configured to synchronize the signal input to the control chip.

[0014] In the semiconductor package welding quality detection method involved in the present invention, optionally, the main control chip also includes a filter unit, and the filter unit is configured to filter the signal input to the control chip.

[0015] In the semiconductor package welding quality detection method involved in the present invention, optionally, the main control chip also includes a connection unit, and the connection module is configured to be connected to the ignition logic control unit, the IC bonding lead detection unit and the communication unit respectively and perform data exchange.

[0016] In the semiconductor package welding quality detection method involved in the present invention, optionally, the BITS detection circuit includes a first digital / analog converter and a first amplifying circuit, the waveform sending module sends the excitation signal and transmits it to the bonding lead through the first digital / analog converter and the first amplifying circuit, and the waveform sampling module samples the detection waveform signal reflected by the bonding lead.

[0017] According to the present invention, a semiconductor package welding quality detection method can be provided to filter out interference signals and improve detection accuracy and production efficiency. The perfect integration of the ignition system and BITS detection greatly improves the working efficiency of the semiconductor package welding quality detection device and system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the description are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1It is a functional module diagram of the main control chip involved in the embodiment of the present invention.

[0020] Figure 2 It is a functional module diagram of Embodiment 1 of the semiconductor packaging welding quality system involved in the embodiment of the present invention.

[0021] Figure 3 It is a flow chart of a semiconductor packaging welding quality detection method involved in an embodiment of the present invention.

[0022] Figure 4 It is a functional module diagram of Embodiment 2 of the semiconductor packaging welding quality system involved in the embodiment of the present invention.

[0023] Figure 5 It is a flow chart of the ignition control logic involved in the embodiment of the present invention.

[0024] Figure 6 It is a flow chart of IC bonding wire detection involved in an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The first aspect of the present invention provides a semiconductor packaging welding quality detection method implemented by a semiconductor packaging welding quality detection system. The semiconductor packaging welding quality detection method can also be called an EFO (Electronic Flame-Off, electronic ignition system) and BITS (Bond Integrity Test System, bonding wire integrity detection system) integrated welding quality detection method based on FPGA (Field-Programmable Gate Array, field programmable gate array).

[0027] The second aspect of the present invention provides a main control chip. Preferably, the main control chip can be an FPGA chip. The FPGA chip has the advantage of parallel processing of data.

[0028] The third aspect of the present invention provides a semiconductor package welding quality detection device including the main control chip. The semiconductor package welding quality detection device can also be called an EFO and BITS integrated welding quality detection device based on FPGA.

[0029] A fourth aspect of the present invention provides a semiconductor package welding quality detection system comprising the semiconductor package welding quality detection device. The semiconductor package welding quality detection system can also be called an FPGA-based EFO and BITS integrated welding quality detection system.

[0030] EFO is used to form gold balls during wire bonding. BITS is used to inspect wire bonding quality.

[0031] In some embodiments, the bonding wires in the present invention may be gold wires, silver wires, copper wires, aluminum wires, etc.

[0032] The present invention aims to solve the defect in the above-mentioned prior art that the two logic function circuits of the ignition control system (EFO) and the IC bonding wire detection (BITS) are generally designed separately, and to provide a semiconductor packaging welding quality detection method that can filter out interference signals and improve detection accuracy and production efficiency.

[0033] Reference Figure 1 To achieve the above purpose, the present invention provides a main control chip 10. The main control chip 10 can be connected to the EFO control circuit 30, the BITS detection circuit 20 and the host computer 2 respectively.

[0034] In some embodiments, the main control chip 10 may include an ignition logic control unit 12, an IC bonding wire detection unit 11, and a communication unit 13. The main control chip 10 is connected to the EFO control circuit 30 through the ignition logic control unit 12. The main control chip 10 is connected to the BITS detection circuit 20 through the IC bonding wire detection unit 11. The main control chip 10 is connected to the host computer 2 through the communication unit 13.

[0035] In the present invention, the main control chip 10 integrates the ignition logic control unit 12 and the IC bonding wire detection unit 11. Compared with the technology of separately designing the two logic function circuits of the ignition control system (EFO) and the IC bonding wire detection (BITS) in the prior art, the filtering effect, anti-interference ability, detection speed and detection accuracy of the main control chip 10 can be improved. By integrating the ignition control system (EFO) and the IC bonding wire detection (BITS) on the same main control chip 10, a close combination of functions is achieved. This integration not only saves hardware resources, but also greatly improves the system response speed and efficiency. In particular, by utilizing the parallel processing characteristics of FPGA, multiple logical judgments are performed simultaneously during the ignition and detection process, which significantly improves the processing efficiency of the overall detection device 1.

[0036] Reference Figure 2The present invention provides a semiconductor package welding quality detection device 1 (hereinafter referred to as the detection device). The detection device 1 may include a main control chip 10, and an EFO control circuit 30 and a BITS detection circuit 20 respectively connected to the main control chip 10.

[0037] In some embodiments, the main control chip 10 may include an ignition logic control unit 12, an IC bonding wire detection unit 11 and a communication unit 10. The main control chip 10 is connected to the EFO control circuit 30 through the ignition logic control unit 12, the main control chip 10 is connected to the BITS detection circuit 20 through the IC bonding wire detection unit 11, and the main control chip 10 is connected to the host computer 2 through the communication unit 13.

[0038] In the present invention, since the ignition logic control unit 12 and the IC bonding lead detection unit 11 are integrated in the main control chip 10, when ignition and quality inspection are performed through the semiconductor packaging welding quality inspection device 1, compared with the technology of separately designing the two logical function circuits of the ignition control system (EFO) and the IC bonding lead detection (BITS) in the prior art, the filtering effect, anti-interference ability, detection speed and detection accuracy of the main control chip 10 can be improved.

[0039] The present invention provides a semiconductor packaging welding quality detection system (hereinafter referred to as the detection system). Figure 2 The detection system may include a semiconductor package welding quality detection device 1 and a host computer 2, and the semiconductor package welding quality detection device 1 may be communicatively connected with the host computer.

[0040] The present invention also provides a semiconductor package welding quality detection method (hereinafter referred to as the detection method), which can be a method for detecting the semiconductor package welding quality based on a semiconductor package welding quality detection system.

[0041] Reference Figure 3 In some embodiments, the detection method may include step S100, sending an excitation signal to the bonding wire 23 and sampling the reflection signal of the bonding wire 23 to output a waveform detection signal. Specifically, the IC bonding wire detection unit 11 may send an excitation signal to the bonding wire 23 through the BITS detection circuit 20 and sample the reflection signal of the bonding wire 23 to output a waveform detection signal.

[0042] In some embodiments, the detection method may include step S200, determining whether a control instruction sent by the host computer 2 is received according to the waveform detection signal. Specifically, the IC bonding wire detection unit 11 may determine whether a control instruction sent by the host computer 2 is received according to the waveform detection signal.

[0043] In some embodiments, the host computer 2 can send control instructions to the SPI communication slave module of the FPGA through the SPI protocol for protocol parsing, thereby extracting ignition parameters and detection parameters, etc.

[0044] In some embodiments, the detection method may include step S300, performing voltage calibration on the bonding wire and calculating the calibration value after receiving the control instruction sent by the host computer 2. Specifically, the IC bonding wire detection unit 11 may perform voltage calibration on the bonding wire 23 and calculate the calibration value after receiving the control instruction sent by the host computer 2.

[0045] In some embodiments, the detection method may include step S400, starting the ignition process and adjusting the ignition parameters based on the calibration value. Specifically, the ignition logic control unit 12 may start the ignition process through the EFO control circuit 30.

[0046] In some embodiments, the detection method may include step S500, detecting the bonding wire after the ignition process is completed and outputting the detection result. Specifically, the IC bonding wire detection unit 11 detects the bonding wire 23 after the ignition process is completed and outputs the detection result.

[0047] In some embodiments, the detection types may include one-weld detection, two-weld detection, short-tail detection, etc.

[0048] In the present invention, the parallel processing capability of the main control chip 10 is utilized to simultaneously perform relevant logical judgments during the ignition and BITS detection processes, and the ignition and bonding wire detections are performed successively and continuously. After the ignition process is completed, the detection state can be entered immediately, which reduces process interference, makes the timing connection more compact, and improves processing efficiency.

[0049] In some embodiments, in some embodiments, the detection method may further include: sending the detection result to the host computer 2. Specifically, the IC bonding wire detection unit 11 may send the detection result to the host computer 2.

[0050] In some embodiments, the SPI communication host module can send the detection result and the status information of the main control chip 10 to the host computer 2, or send an alarm message to the host computer 2 when the detection fails.

[0051] Reference Figure 4 In some embodiments, the IC bonding wire detection unit 11 may include a detection module 111, a waveform sending module 112, and a waveform sampling module 113. The detection module 111 may be configured to calculate the calibration value before sparking and detect the IC bonding wire after sparking. The waveform sending module 112 may be configured to send an excitation signal to the bonding wire. The waveform sampling module 113 may be configured to collect the detection waveform signal reflected by the bonding wire.

[0052] In some embodiments, when the ignition process is started, the waveform sending module 112 stops sending the excitation signal.

[0053] In some embodiments, the waveform sending module 112 may send an excitation signal of a specified frequency and a specified amplitude.

[0054] In some embodiments, the communication unit 113 may include an SPI communication master module and an SPI communication slave module. The SPI communication slave module may be configured to receive a control instruction sent by a host computer. The SPI communication master module may be configured to send a feedback instruction to the host computer. In some embodiments, the feedback instruction may include a detection result.

[0055] In some embodiments, the main control chip 10 may further include a synchronizer unit 14. The synchronizer unit 14 may be configured to synchronize the signal input to the control chip 10. The synchronizer unit 14 can synchronize the asynchronous signal input from the outside of the main control chip 10 to ensure the consistency and reliability of the data.

[0056] In some embodiments, the main control chip 10 may further include a filter unit 15. The filter unit 15 may be configured to filter the signal input to the control chip 10. The filter unit 15 can filter the signal input from the main control chip 10, effectively reduce noise interference, and improve signal quality. The present invention implements filtering and synchronization processing through software, which is more flexible and easy to adjust and optimize compared to hardware implementation.

[0057] In some embodiments, the main control chip 10 may further include a connection unit 16. The connection module 16 may be configured to be connected to the ignition logic control unit 12, the IC bonding wire detection unit 11 and the communication unit 13 respectively and to perform data exchange. The connection module 16 in the present invention can play a central control role, and can transmit the instructions sent by the host computer 2 to the ignition logic control unit 12 and the IC bonding wire detection unit 11 through SPI (Serial Peripheral Interface) communication, and can also monitor the status of the two modules at any time and transmit the status information to the host computer 2 in a timely manner.

[0058] In some embodiments, the BITS detection circuit 20 may include a first digital / analog converter 21 and a first amplifier circuit 22. The waveform sending module 112 may send the excitation signal to the bonding wire via the first digital / analog converter 21 and the first amplifier circuit 22. The waveform sampling module 113 may sample the detection waveform signal reflected by the bonding wire.

[0059] In some embodiments, before sending the excitation signal to the bonding wire 23 , the process further includes: initializing the main control chip 10 and loading the storage parameters in the memory.

[0060] In some embodiments, the ignition logic control unit, IC bonding wire detection unit, SPI communication host module, SPI communication slave module, synchronizer module, filter module and connection module in the FPGA can be initialized, and the ignition parameters and detection parameters can be loaded from the Flash.

[0061] In some embodiments, the IC bonding wire detection unit 11 may further include an enabling control module 115 , and the enabling control module 115 may be configured to process control instructions sent by the host computer 2 and send the control instructions to other modules.

[0062] In some embodiments, the control chip 10 may further include a PID adjustment control module 114 and a second digital / analog conversion output drive module 116. The PID adjustment control module 114 is used to dynamically adjust the sampling signal voltage of the external circuit to ensure detection accuracy. The use of the PID algorithm enables the system to respond quickly and stabilize at the optimal sampling voltage. The use of the PID algorithm to dynamically adjust the sampling signal voltage ensures that the best detection accuracy can be obtained under different working conditions.

[0063] In some embodiments, the BITS detection circuit 20 may include an analog / digital converter 26, a second amplifier circuit 25, a second digital / analog converter 27, and a detection current feedback circuit 24. The detection current feedback circuit 24 may detect the detection waveform signal, and send the detection waveform signal to the waveform sampling module 113 via the second amplifier circuit 25 and the analog / digital converter 26 in sequence, the waveform sampling module 113 may send the detection waveform signal to the PID adjustment control module 114, the PID adjustment control module 114 may send an adjustment signal to the second digital / analog conversion circuit 27 via the second digital / analog conversion output driver module 116, thereby adjusting the output voltage of the second amplifier circuit 25, so that the output voltage of the analog / digital conversion circuit 26 is maintained within a predetermined range.

[0064] In some embodiments, the detection device 1 may further include a memory, which may be connected to the main control chip 10. The memory may store detection parameters and operating parameters required by the main control chip 10. In some embodiments, the memory may be a Flash memory, a RAM memory, a ROM memory, etc.

[0065] In some embodiments, the EFO control circuit 30 may further include a negative high voltage control circuit 38, a negative high voltage high frequency transformer 39, a negative low voltage control circuit 36, a negative low voltage high frequency transformer 37, a third digital / analog converter, a constant current control circuit 35, a current sampling circuit 33, a detection feedback circuit 32, and an ignition discharge circuit 31. The EFO control circuit 30 may control the ignition of the bonding wire through the ignition discharge circuit 31. The EFO control circuit 30 may control the intensity of the ignition through the negative high voltage control circuit 38, the negative high voltage high frequency transformer 39, the negative low voltage control circuit 36, the negative low voltage high frequency transformer 37, the third digital / analog converter, and the constant current control circuit 35. The EFO control circuit 30 may sample the ignition intensity through the current sampling circuit 33 and the detection feedback circuit 32, thereby realizing dynamic adjustment of the ignition.

[0066] Reference Figure 5 The process of the ignition control logic of the present invention may include initializing the ignition logic control unit; starting the watchdog timer; judging whether the ignition command from the upper computer 2 is received, and returning to receive again if not; preparing to run the ignition parameters sent by the upper computer 2 if received; outputting the initial current instruction, enabling the current output, and enabling the low-voltage transformer output; judging whether the ignition rod is short-circuited, and if so, judging the ignition state as short-circuited, and turning off the current output and voltage output; if not, delaying 50 microseconds to wait for the low voltage to stabilize; starting ignition, enabling the high-voltage transformer output; judging whether the breakdown current is detected, and if not, restarting the ignition, at this time it can be judged whether the number of repeated ignitions has been used up, and if not, starting ignition and enabling the high-voltage transformer output, and if so, turning on the ignition The state is set to on, and the current output and voltage output are turned off; if the breakdown current is detected, the ignition is successful, the high voltage output is turned off, and a delay of 5 microseconds is used to prevent malfunction; check whether the air gap is blocked, if not, set the ignition state to on, and turn off the current output and voltage output; if yes, delay for a period of time to maintain the initial current; check whether the current is accidentally disconnected, if yes, set the ignition state to GLITCH (temporary problem), and turn off the current output and voltage output; if the current is not accidentally disconnected, output the burning ball current instruction step by step; judge whether the burning ball is over, if yes, set the ignition state to wait, and turn off the current output and voltage output; if no, judge whether the burning ball current disappears, if yes, set the ignition state to GLITCH, and turn off the current output and voltage output.

[0067] Reference Figure 6The process of IC bonding lead detection of the present invention may include: initializing the IC bonding lead detection unit; starting the watchdog timer; judging whether the calibration command of the upper computer 2 is received, if not, returning to receive again; if yes, preparing to run the calibration parameters; sampling the detection current of the IC bonding lead circuit, and calculating the calibration value according to the calibration parameters; judging whether the ignition completion signal of the ignition logic control unit is received, if not, returning to receive again; if yes, respectively detecting the first weld, the second weld, and the short wire tail according to the calibration value; judging whether the first weld detection is normal, if not, feeding back the error message of the first weld not sticking, and delaying for a period of time to wait for the next detection; if yes, judging whether the short tail detection is normal, if not, feeding back the error message of the short tail of the wire arc; if the short tail detection is normal, judging whether the second weld detection is normal, if not, feeding back the error message of the second weld not sticking; if yes, reporting the information of normal detection; delaying for a period of time and performing the next detection; receiving the calibration command of the upper computer again.

[0068] In practical applications, the present invention can adjust parameters and expand functions according to specific needs. For example, the ignition parameters and detection thresholds can be adjusted according to different types of IC products; more detection items can be added; and the system performance can be further improved by optimizing the data processing algorithm inside the FPGA.

[0069] In summary, the present invention provides an efficient, accurate and scalable semiconductor packaging welding quality detection method, which provides a new solution for the development of wire bonding machine technology.

[0070] According to the present invention, a main control chip, a semiconductor package welding quality detection device, a system and a method can be provided to filter out interference signals and improve detection accuracy and production efficiency. The perfect integration of the ignition system and BITS detection can greatly improve the working efficiency of the semiconductor package welding quality detection device and system.

[0071] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor package welding quality detection method is a method for detecting semiconductor package welding quality according to a semiconductor package welding quality detection system, wherein the system comprises a semiconductor package welding quality detection device and a host computer, wherein the semiconductor package welding quality detection device comprises a main control chip, an EFO control circuit and a BITS detection circuit, wherein the main control chip comprises a communication unit connected to the host computer, an ignition logic control unit connected to the EFO control circuit, and an IC bonding lead detection unit connected to the BITS detection circuit, wherein: The following steps are involved: The IC bonding wire detection unit sends an excitation signal to the bonding wire through the BITS detection circuit and samples the reflection signal of the bonding wire to output a waveform detection signal; The IC bonding wire detection unit determines whether to receive a control instruction sent by a host computer according to the waveform detection signal; The IC bonding wire detection unit performs voltage calibration on the bonding wire and calculates a calibration value after receiving the control instruction sent by the host computer; The ignition logic control unit starts the ignition process through the EFO control circuit and adjusts the ignition parameters based on the calibration value; The IC bonding wire detection unit detects the bonding wire after the ignition process is completed and outputs the detection result.

2. The semiconductor package welding quality detection method according to claim 1, characterized in that: Also includes: The IC bonding wire detection unit sends the detection result to the host computer.

3. The semiconductor package welding quality detection method according to claim 1, characterized in that: The IC bonding wire detection unit includes a detection module, a waveform sending module, and a waveform sampling module. The detection module is configured to calculate the calibration value before ignition and detect the IC bonding wire after ignition. The waveform sending module is configured to send an excitation signal to the bonding wire. The waveform sampling module is configured to collect the detection waveform signal reflected by the bonding wire.

4. The semiconductor package welding quality detection method according to claim 3, characterized in that: When the ignition process is started, the waveform sending module stops sending the excitation signal.

5. The semiconductor package welding quality detection method according to claim 1, characterized in that: The communication unit includes an SPI communication host module and an SPI communication slave module, the SPI communication slave module is configured to receive a control instruction sent by a host computer, and the SPI communication host module is configured to send a feedback instruction to the host computer, and the feedback instruction includes the detection result.

6. The semiconductor package welding quality detection method according to claim 1, characterized in that: Before sending the excitation signal to the bonding wire, the method further includes: initializing the main control chip and loading the storage parameters in the memory.

7. The semiconductor package welding quality detection method according to claim 1, characterized in that: The main control chip also includes a synchronizer unit, and the synchronizer unit is configured to synchronize the signal input to the control chip.

8. The semiconductor package welding quality detection method according to claim 1, characterized in that: The main control chip further includes a filter unit, and the filter unit is configured to perform filtering processing on the signal input to the control chip.

9. The semiconductor package welding quality detection method according to claim 1, characterized in that: The main control chip also includes a connection unit, and the connection module is configured to be connected with the ignition logic control unit, the IC bonding lead detection unit and the communication unit respectively and perform data exchange.

10. The semiconductor package welding quality detection method according to claim 3, characterized in that: The BITS detection circuit includes a first digital / analog converter and a first amplifier circuit. The waveform sending module sends the excitation signal to the bonding wire via the first digital / analog converter and the first amplifier circuit. The waveform sampling module samples the detection waveform signal reflected by the bonding wire.

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