Glass substrate chamfering method
By setting up optical ranging sensors on the side walls of the glass substrate, obtaining key point coordinates and formulating chamfering strategies, the problem of inconsistent size of the corners of the glass substrate is solved, online chamfering processing is achieved, product quality and production efficiency are improved, and cost and environmental impact are reduced.
Patent Information
- Application Number
- CN202411384893.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2044-09-30
AI Technical Summary
The existing glass substrate corner processing method has inconsistent corner size due to the position deviation of the glass during handling, which affects the production line feed rate and yield rate. At the same time, it is impossible to achieve online inspection of all products, resulting in waste of resources and environmental pollution.
By providing multiple optical ranging sensors on the side wall of the glass substrate, multiple key point coordinates of the corners of the glass substrate to be chamfered, and a chamfer strategy is formulated based on the pre-configured chamfered parameters to realize online chamfered processing of the corners of the glass substrate to be chamfered.
Online data analysis and chamfer processing of each glass substrate are realized, which improves product productivity and qualification rate, reduces production costs and resource waste, and protects the environment.
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Abstract
Description
Technical Field
[0001] The invention relates to the technical field of liquid crystal glass substrate processing, and in particular to a glass substrate chamfering method. Background Art
[0002] In the processing of glass substrates, the appearance size is an important quality item. The accuracy of the glass appearance size will affect the use of downstream users, and the size fluctuation will lead to the loss of user-side yield and utilization rate. However, the existing management methods often have some problems.
[0003] However, the existing corner processing method will cause poor consistency in the size of the glass corners due to the displacement of the glass during transportation. In severe cases, it will cause footsteps and fragments, which will affect the utilization rate and yield rate of the production line. At the same time, the inspection of appearance dimensions is mostly an offline extraction project, which will make it impossible to inspect and monitor all products. The glass after random inspection will be scrapped due to surface contamination. From the perspective of technical management, cost reduction and efficiency improvement, and environmental protection, developing a method that can realize online full inspection of glass substrates is an issue that needs to be solved urgently. Summary of the invention
[0004] In order to solve the technical problems existing in the above-mentioned background technology, the present invention provides a glass substrate chamfering method.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A glass substrate chamfering method, characterized by comprising:
[0007] The glass substrate to be processed is transported to a processing platform and fixed thereon, and the coordinates of a plurality of key points related to the corners to be chamfered of the glass substrate to be processed are obtained;
[0008] A chamfering strategy is formulated according to the coordinates of multiple key points and pre-configured chamfering parameters, and the corners of the glass substrate to be chamfered are chamfered according to the chamfering strategy.
[0009] Preferably, the coordinates of multiple key points related to the chamfered corners of the glass substrate to be processed are obtained as follows:
[0010] Collecting a first orientation distance between a preset first position and the first side wall to obtain coordinates of a first key point on the first side wall, and collecting a second orientation distance between a preset second position and the first side wall to obtain coordinates of a second key point on the first side wall;
[0011] Collecting a third orientation distance between a preset third position and the second side wall to obtain coordinates of a third key point on the second side wall, and collecting a fourth orientation distance between a preset fourth position and the second side wall to obtain coordinates of a fourth key point on the second side wall;
[0012] The multiple key point coordinates are specifically a first key point coordinate, a second key point coordinate, a third key point coordinate and a fourth key point coordinate, and the intersection between the first side wall and the second side wall is the corner to be chamfered.
[0013] Preferably, optical distance measuring sensors are arranged at the first position, the second position, the third position and the fourth position, the glass substrate fixed on the processing platform is arranged horizontally, and the light emitted by the four optical distance measuring sensors are arranged horizontally and at the same height.
[0014] Preferably, the light rays emitted by the four optical distance measuring sensors all pass through the horizontally arranged middle section of the glass substrate.
[0015] Preferably, formulating a chamfering strategy based on multiple key point coordinates and pre-configured chamfering parameters is specifically as follows: obtaining a coordinate set of the intersection area of the first side wall and the second side wall on the glass substrate according to the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates and the thickness of the glass substrate, obtaining a chamfering surface coordinate set according to the pre-configured chamfering parameters and the intersection area coordinate set, obtaining a coordinate set of the area to be ground according to the chamfering surface coordinate set and the intersection area coordinate set, and formulating a walking trajectory of the chamfering processing mechanism according to the coordinate set of the area to be ground. The chamfering strategy is the walking trajectory of the tool.
[0016] Preferably, chamfering the to-be-chamfered corner of the glass substrate according to the chamfering strategy specifically includes: adjusting the angle of a tool and grinding the to-be-grinded area on the glass substrate according to the moving trajectory of the tool.
[0017] Compared with the prior art, the beneficial effects of the present invention are:
[0018] Compared with the prior art, by arranging a plurality of optical distance measuring sensors on the side wall of the glass substrate to be processed, obtaining the coordinates of a plurality of key points after the offset, and then chamfering the corners of the glass substrate to be chamfered according to the preset chamfering parameters, data analysis can be performed on each glass substrate before processing, thereby effectively improving the utilization rate and qualified rate of the product, and achieving the purpose of cost reduction, efficiency improvement and environmental protection; secondly, this method can improve production efficiency while reducing production costs; finally, by combining detection and processing, all products can be detected and monitored, further improving the quality of the finished products of the glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of a glass substrate before processing in the glass substrate chamfering method proposed by the present invention;
[0020] Figure 2 It is a schematic structural diagram of a glass substrate after processing in the glass substrate chamfering method proposed by the present invention;
[0021] Figure 3 It is a schematic diagram of the structure of the glass substrate in the present invention in a deflected state and before processing;
[0022] Figure 4 It is a schematic diagram of the structure of the glass substrate in the present invention in an offset state and after processing;
[0023] Figure 5 For the present invention Figure 2 Schematic diagram of the enlarged structure at point C in the middle.
[0024] In the figure: 1-glass substrate, 2-first position, 3-second position, 4-third position, 5-fourth position, 6-optical distance measuring sensor, 7-corner to be chamfered. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] like Figure 1-Figure 5 As shown, this embodiment provides a glass substrate chamfering method, comprising:
[0027] The glass substrate 1 to be processed is transported to a processing platform and fixed thereon, and the coordinates of a plurality of key points related to the corners 7 to be chamfered of the glass substrate 1 to be processed are obtained;
[0028] A chamfering strategy is formulated according to the coordinates of a plurality of key points and pre-configured chamfering parameters, and the to-be-chamfered corner portion 7 of the glass substrate 1 is chamfered according to the chamfering strategy.
[0029] On the whole, after the glass substrate 1 to be processed is transported by the conveying mechanism and placed on the processing table for fixing, the coordinates of multiple key points related to the corner 7 to be chamfered of the glass substrate 1 to be processed are obtained by relevant equipment, and the coordinates of the multiple key points obtained and the pre-configured chamfering parameters are analyzed and processed to simulate a linear trajectory, and then the chamfering processing mechanism performs chamfering processing on the corner 7 to be chamfered of the glass substrate 1 according to the linear trajectory.
[0030] like Figure 1 , Figure 2 and Figure 5 As shown, in one embodiment, the coordinates of multiple key points related to the chamfered corner 7 of the glass substrate 1 to be processed are obtained as follows:
[0031] Collecting a first orientation distance between a preset first position 2 and the first side wall to obtain coordinates of a first key point on the first side wall, and collecting a second orientation distance between a preset second position 3 and the first side wall to obtain coordinates of a second key point on the first side wall;
[0032] Collecting a third orientation distance between a preset third position 4 and the second side wall to obtain coordinates of a third key point on the second side wall, and collecting a fourth orientation distance between a preset fourth position 5 and the second side wall to obtain coordinates of a fourth key point on the second side wall;
[0033] The multiple key point coordinates are specifically the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates, and the intersection between the first side wall and the second side wall is the corner portion 7 to be chamfered.
[0034] Specifically, the first orientation distance between the preset first position 2 and the first side wall, the second orientation distance between the preset second position 3 and the first side wall are collected through relevant equipment, and the first key point coordinates and the second key point coordinates on the first side wall are obtained according to preset parameters. At the same time, the third orientation distance between the preset third position 4 and the second side wall, the fourth orientation distance between the preset fourth position 5 and the second side wall are collected, and the third key point coordinates and the fourth key point coordinates on the second side wall are obtained according to preset parameters. The first side wall and the second side wall are adjacent two side walls on the glass substrate 1, and the intersection of the first side wall and the second side wall is the processing position of the corner 7 to be chamfered.
[0035] like Figure 1-Figure 4 As shown, in one embodiment, optical distance measuring sensors 6 are arranged at the first position 2, the second position 3, the third position 4 and the fourth position 5, the glass substrate 1 fixed on the processing platform is arranged horizontally, and the light emitted by the four optical distance measuring sensors 6 are arranged horizontally at the same height.
[0036] The relevant equipment is specifically an optical distance measuring sensor 6 arranged at the first position 2, the second position 3, the third position 4 and the fourth position 5 of the glass substrate 1, and the multiple optical distance measuring sensors 6 are fixed on the processing platform, and the multiple optical distance measuring sensors 6 are arranged at the same height on the same horizontal plane. When the glass substrate 1 is not offset, the distances between the detection ends of the optical distance measuring sensors 6 and the side walls corresponding to them are equal, and the chamfering processing mechanism can pass through. When the chamfering process is performed on the corner 7 to be chamfered of the glass substrate 1, it is only necessary to read the corresponding data of the first position 2, the second position 3, the third position 4 and the fourth position 5 to be measured, and obtain the data of the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates in turn, and then compare the obtained data with the preset data. After comparison, the relevant equipment sends a correction instruction to the chamfering processing mechanism and controls the chamfering processing mechanism to perform chamfering processing on the corner 7 to be chamfered according to the corrected linear trajectory.
[0037] Similarly, when chamfering the other three corners 7 to be chamfered on the glass substrate 1, it is only necessary to read the data of the corresponding first position 2, second position 3, third position 4 and fourth position 5 to be measured again, and obtain the data of the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates in turn, and then compare the obtained data with the preset data. After comparison, the relevant equipment sends a correction instruction to the chamfering processing mechanism and controls the chamfering processing mechanism to chamfer the corner 7 to be chamfered according to the corrected linear trajectory.
[0038] like Figure 3-Figure 4 As shown, in one embodiment, the light emitted by the four optical distance measuring sensors 6 all pass through the horizontally arranged middle section of the glass substrate 1 .
[0039] Specifically, the plane where the multiple optical ranging sensors 6 are located is on the same plane as the mid-section of the glass substrate 1, which can measure the uniformity of the glass and reduce the measurement error caused by edge effect or local non-uniformity, thereby making the data measured by the optical ranging sensor 6 more accurate. Secondly, it can also avoid the interference of the instability at the edge of the glass substrate 1 on the measurement result, thereby improving the accuracy and reliability of the measurement.
[0040] like Figure 3-Figure 4As shown, in one embodiment, formulating a chamfering strategy based on multiple key point coordinates and pre-configured chamfering parameters is specifically as follows: obtaining a coordinate set of the intersection area of the first side wall and the second side wall on the glass substrate 1 according to the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates and the thickness of the glass substrate 1, obtaining a chamfering surface coordinate set according to the pre-configured chamfering parameters and the intersection area coordinate set, obtaining a coordinate set of the area to be ground according to the chamfering surface coordinate set and the intersection area coordinate set, and formulating a walking trajectory of the chamfering processing mechanism according to the coordinate set of the area to be ground. The chamfering strategy is the walking trajectory of the tool.
[0041] The coordinate set of the intersection area of the first side wall and the second side wall adjacent to each other on the glass substrate 1 is obtained by using the acquired first key point coordinates, second key point coordinates, third key point coordinates, fourth key point coordinates and the thickness of the glass substrate 1, and then the chamfer surface coordinate set is obtained by using the pre-configured chamfering parameters and the intersection area coordinate set. Finally, the range of the area to be processed is obtained by using the intersection area coordinate set of the first side wall and the second side wall and the chamfer surface coordinate set. After determining the range of the area to be processed, the optical ranging sensor 6 formulates the walking trajectory of the chamfering processing mechanism according to the obtained information, and feeds back the information to the chamfering processing mechanism to control the chamfering processing mechanism to perform chamfering processing on the range of the area to be processed.
[0042] Similarly, when chamfering the other three corners 7 to be chamfered of the glass substrate 1, it is only necessary to obtain the range of the area to be processed at the corresponding chamfering position again. After determining the range of the area to be processed, the optical ranging sensor 6 formulates the walking trajectory of the chamfering processing mechanism based on the obtained information, and feeds back the information to the chamfering processing mechanism to control the chamfering processing mechanism to perform chamfering on the range of the area to be processed.
[0043] like Figure 3-Figure 5 As shown, in one embodiment, chamfering the to-be-chamfered corner 7 of the glass substrate 1 according to the chamfering strategy specifically includes: adjusting the tool angle and grinding the to-be-grinded area on the glass substrate 1 according to the tool's moving trajectory.
[0044] The chamfering mechanism is specifically a tool structure. When the position of the glass substrate 1 is offset, the tool determines the range of the area to be processed and adjusts the angle of the tool during the processing so that the tool performs chamfering processing on the area to be removed on the glass substrate 1 according to the walking trajectory obtained after sending the correction instruction.
[0045] Of course, it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, but also includes the same or similar structures that can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numerals in the claims should not be regarded as limiting the claims involved.
[0046] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
[0047] The techniques, shapes, and structural parts not described in detail in the present invention are all well-known techniques.
Claims
1. A glass substrate chamfering method, characterized in that: include: The glass substrate (1) to be processed is transported to a processing platform and fixed thereon, and the coordinates of a plurality of key points related to the corners (7) to be chamfered of the glass substrate (1) to be processed are obtained; A chamfering strategy is formulated according to the coordinates of a plurality of key points and pre-configured chamfering parameters, and the corner portion (7) to be chamfered of the glass substrate (1) is chamfered according to the chamfering strategy.
2. The glass substrate chamfering method according to claim 1, characterized in that: The coordinates of a plurality of key points related to the chamfered corners (7) of the glass substrate (1) to be processed are obtained specifically as follows: Collecting a first orientation distance between a preset first position (2) and the first side wall to obtain coordinates of a first key point on the first side wall, and collecting a second orientation distance between a preset second position (3) and the first side wall to obtain coordinates of a second key point on the first side wall; Collecting a third orientation distance between a preset third position (4) and the second side wall to obtain coordinates of a third key point on the second side wall, and collecting a fourth orientation distance between a preset fourth position (5) and the second side wall to obtain coordinates of a fourth key point on the second side wall; The multiple key point coordinates are specifically the first key point coordinates, the second key point coordinates, the third key point coordinates and the fourth key point coordinates, and the intersection between the first side wall and the second side wall is the corner portion to be chamfered (7).
3. The glass substrate chamfering method according to claim 1, characterized in that: Optical distance measuring sensors (6) are arranged at the first position (2), the second position (3), the third position (4) and the fourth position (5), the glass substrate (1) fixed on the processing platform is arranged horizontally, and the light emitted by the four optical distance measuring sensors (6) are arranged horizontally and at the same height.
4. The glass substrate chamfering method according to claim 3, characterized in that: The light rays emitted by the four optical distance measuring sensors (6) all pass through the horizontally arranged middle section of the glass substrate (1).
5. The glass substrate chamfering method according to claim 3, characterized in that: The chamfering strategy is formulated according to the coordinates of multiple key points and pre-configured chamfering parameters as follows: a coordinate set of the intersection area of the first side wall and the second side wall on the glass substrate (1) is obtained according to the coordinates of the first key point, the coordinates of the second key point, the coordinates of the third key point and the fourth key point and the thickness of the glass substrate (1); a chamfering surface coordinate set is obtained according to the pre-configured chamfering parameters and the intersection area coordinate set; a coordinate set of the area to be ground is obtained according to the chamfering surface coordinate set and the intersection area coordinate set; a travel trajectory of the chamfering processing mechanism is formulated according to the coordinate set of the area to be ground; the chamfering strategy is the travel trajectory of the tool.
6. The glass substrate chamfering method according to claim 5, characterized in that: Chamfering the corner portion (7) of the glass substrate (1) to be chamfered according to the chamfering strategy specifically includes: adjusting the angle of the tool and grinding the area to be ground on the glass substrate (1) according to the moving trajectory of the tool.
Citation Information
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