Light source device and system for semiconductor manufacturing and method and device for controlling light source device and system

Abstract

The invention discloses light source equipment and system for semiconductor manufacturing and a control method and device, and the light source equipment comprises a light source ring seat, a semiconductor light source group, a flow guide ring, a light guide cover, and a clean gas pipe joint. The semiconductor light source group is mounted on the light source ring seat; the light source ring seat is sleeved on the flow guide ring, and the light guide cover is fixed with the brim of the flow guide ring after surrounding the light source ring seat, so that a space cavity between the light guide cover and the light source ring seat forms a primary static pressure cavity; and the clean gas pipe joint is connected with the flow guide ring, so that clean gas enters the first-stage static pressure cavity through the flow guide hole of the flow guide ring and overflows after convection heat dissipation is carried out on the semiconductor light source group, and the light guide cover is cleaned. Therefore, the gas can clean scale, water vapor and surrounding water mist on the light guide cover in a self-cleaning manner along the laminar flow of the outer wall of the light guide cover, and self-cleaning of the light guide cover is realized, so that the working stability of a visual camera in a semiconductor wafer wet process is improved, and the stability and the accuracy of semiconductor manufacturing are further improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to light source equipment, systems, and control methods and devices used in semiconductor manufacturing. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the degree of automation in semiconductor product manufacturing has become higher and higher. Visual cameras and corresponding light source equipment are also increasingly used in the semiconductor manufacturing process.

[0003] In the wet process of semiconductor wafers, water vapor and water mist in the wet process environment will remain on the light source equipment. If they enter the interior of the light source equipment, they will affect the electrical insulation performance of the light source equipment. If the protective cover of the light source equipment is blocked and dried by the subsequent turbulent airflow, water marks will be left. The water marks will reduce the brightness and uniformity of the light field of the light source, thereby affecting the working stability of the visual camera. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a light source device, system and control method and device for semiconductor manufacturing. The technical problem to be solved by the present invention is achieved through the following technical solutions: The first aspect of the embodiment of the present invention provides a light source device for semiconductor manufacturing, characterized in that it includes: a light source ring seat 101, a semiconductor light source group 102, a guide ring 103, a light guide cover 104, and a clean air pipe joint 107; The semiconductor light source group 102 is mounted on the light source ring base 101; The light source ring seat 101 is mounted on the guide ring 103, and the light guide cover 104 surrounds the light source ring seat 101 and is fixed to the brim of the guide ring 103, so that the space between the light guide cover 104 and the light source ring seat 101 forms a first-level static pressure chamber; The clean gas pipe joint 107 is connected to the guide ring 103 , so that the clean gas enters the primary static pressure chamber through the guide hole of the guide ring 103 , dissipates heat from the semiconductor light source group 102 by convection, and then overflows to clean the light guide cover 104 .

[0005] A second aspect of an embodiment of the present invention provides a system for semiconductor manufacturing, comprising: a control device, an air outlet device, a light source control device, a visual camera, and the above-mentioned light source device; wherein, The light source control device is connected to the semiconductor light source group 102 in the light source device, and the air outlet device is connected to the clean air pipe joint 107 in the light source device; The control device is connected to the air outlet device and the light source control device, and is configured to control the air outlet device to input clean gas to the light source device when the visual camera and the light source device are in a semiconductor wet process environment, and to control the light source device to perform light emitting operation through the light source control device based on the image obtained through the visual camera.

[0006] A third aspect of an embodiment of the present invention provides a method for semiconductor manufacturing control, comprising: When the visual camera and the light source device are in a semiconductor wet process environment, controlling the air outlet device to input clean gas to the light source device; The image is acquired by the visual camera, and based on the image, the light source device is controlled by the light source control device to perform light emitting operation.

[0007] A fourth aspect of an embodiment of the present invention provides a device for semiconductor manufacturing control, the device comprising a processor and a memory storing program instructions, the processor being configured to execute the above-mentioned method for semiconductor control when executing the program instructions.

[0008] Beneficial effects of the present invention: In the light source equipment, the semiconductor light source group is installed on the light source ring seat. Not only, the guide ring and the light guide cover together form a protective cover of the light source ring seat, but also, by connecting the guide ring clean air pipe joint, the clean gas can enter the primary static pressure cavity between the light guide cover and the light source ring seat, and overflow after convective heat dissipation of the semiconductor light source group to clean the light guide cover. In this way, the gas can self-clean along the outer wall of the light guide cover in a laminar self-cleaning manner to clean the dirt, water vapor and surrounding water mist on the light guide cover, thereby realizing self-cleaning of the light guide cover, and then realizing self-cleaning of the light source equipment, thereby improving the working stability of the visual camera in the wet process of semiconductor wafers, and further improving the stability and accuracy of semiconductor manufacturing.

[0009] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0010] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic structural diagram of a light source device for semiconductor manufacturing provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a light source device for semiconductor manufacturing provided by an embodiment of the present invention; Figure 3 A schematic diagram of the architecture of a system for semiconductor manufacturing provided by an embodiment of the present invention; Figure 4 A flow chart of a semiconductor manufacturing control method provided by an embodiment of the present invention; Figure 5 A flow chart of a semiconductor manufacturing control method provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a semiconductor manufacturing control device provided by an embodiment of the present invention.

[0012] In the attached figure: 1. Light source equipment; 2. Light source controller; 3. Programmable controller PLC; 4. Visual camera; 5. Proportional servo valve; 6. Holding microflow valve; 7. Visual industrial computer; 8. Robotic arm; 9. Semiconductor wet process environment.

[0013] 101. Light source ring seat; 102. Semiconductor light source group; 103. Guide ring; 104. Laminar flow hood; 105. Diffuse reflection light guide ring; 106. Self-cleaning light guide hood; 107. Clean air pipe joint. DETAILED DESCRIPTION

[0014] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0015] With the development of science and technology, the degree of automation in semiconductor product manufacturing is getting higher and higher, and visual cameras and corresponding light source equipment are increasingly used in the semiconductor manufacturing process. In the semiconductor wafer wet process, due to the residual water vapor and water mist in the wet process environment on the light source equipment, the performance of the light source equipment may be affected, and the brightness and uniformity of the light field of the light source may be reduced due to water marks. Therefore, in the embodiment of the present invention, in the light source equipment, the semiconductor light source group is installed on the light source ring seat, not only the guide ring and the light guide cover together form a protective cover of the light source ring seat, but also, by connecting the guide ring clean air pipe joint, the clean gas can enter the first-level static pressure cavity between the light guide cover and the light source ring seat, and overflow after the semiconductor light source group convectively dissipates heat, and clean the light guide cover. In this way, the gas can clean the scale, water vapor and surrounding water mist on the light guide cover along the outer wall of the light guide cover, realize the self-cleaning of the light guide cover, and then realize the self-cleaning of the light source equipment, thereby improving the working stability of the visual camera in the semiconductor wafer wet process, and further improving the stability and accuracy of semiconductor manufacturing. Furthermore, a laminar flow hood can be further added to the guide ring to form a secondary static pressure chamber between the laminar flow hood and the light guide hood, so that the clean gas enters the primary static pressure chamber through the guide hole of the guide ring, and after convective heat dissipation of the semiconductor light source group, it is distributed to the secondary static pressure chamber through the flow channel of the guide ring distribution hole for mixed flow, and then overflows along the slit between the laminar flow hood and the light guide hood to form a laminar wind curtain gas to clean the light guide hood, further increasing the degree of self-cleaning and further ensuring the working stability of the visual camera in the semiconductor wafer wet process. In addition, in the embodiment of the present invention, the visual camera and the light source device can also be controlled by the control device, the air outlet device, the light source control device, etc., to realize the automatic control of the self-cleaning of the light source device in the semiconductor wafer wet process, further improving the stability and accuracy of semiconductor manufacturing.

[0016] like Figure 1 As shown, the first aspect of an embodiment of the present invention provides a light source device for semiconductor manufacturing, comprising: a light source ring seat 101, a semiconductor light source group 102, a guide ring 103, a light guide cover 104, and a clean air pipe joint 107; wherein, the semiconductor light source group 102 is installed on the light source ring seat 101; the light source ring seat 101 is sleeved on the guide ring 103, and the light guide cover 104 surrounds the light source ring seat 101 and is fixed to the brim of the guide ring 103, so that a primary static pressure cavity is formed between the light guide cover 104 and the light source ring seat 101; the clean air pipe joint 107 is connected to the guide ring 103, so that the clean gas enters the primary static pressure cavity through the guide hole of the guide ring 103, and overflows after convective heat dissipation of the semiconductor light source group 102, so as to clean the light guide cover 104.

[0017] Among them, the semiconductor light source group 102 is installed on the light source ring seat 101 and is installed on the guide ring 103 by screws. The light guide cover 104 covers the outside of the semiconductor light source group 102 of the light source ring seat 101 and is fixed to the guide ring 103. In this way, the space chamber between the light guide cover 104 and the light source ring seat 101 forms a first-level static pressure chamber. The semiconductor light source group 102 is in the first-level static pressure chamber, and the light guide cover 104 diffusely reflects and transmits to form a uniform external irradiation light field. In addition, the light source ring seat 101 conducts heat dissipation for the semiconductor light source group 102; the guide ring 103 and the light guide cover 104 form a protective cover structure to prevent water droplets from splashing and water fog from accumulating on the semiconductor light source group 102.

[0018] Since the clean air pipe joint 107 is connected to the guide ring 103, in this way, clean gas with a certain positive pressure can enter the guide ring 103 through the clean air pipe joint 107, and further mix the pressure between the light source ring seat 101 and the guide ring 103 through the guide ring 103, and distribute it to flow into the primary static pressure cavity between the light source ring seat 101 and the light guide cover 104 through the distribution groove of the light source ring seat 101. The static pressure airflow is mixed for the second time in the primary static pressure cavity for convective heat dissipation of the semiconductor light source group 102, and the light source ring seat 101 is conduction heat dissipation for the semiconductor light source group 102; the positive pressure gas is mixed and homogenized for the second time in the primary static pressure cavity of the light source, and the positive pressure gas overflows through the slit between the guide ring 103 and the light guide cover 104, so that the overflowing airflow can clean the scale, water vapor and surrounding water mist on the light guide cover along the outer wall of the light guide cover 104 to realize self-cleaning of the light guide cover.

[0019] In order to further enhance the self-cleaning power of the light guide cover and protect the light source, a laminar flow cover may be added outside the guide ring 103, such as Figure 1 As shown, the light source device may also include: a laminar flow hood 106; the laminar flow hood 106 covers the inner hole of the guide ring 103 and is fixedly connected to the guide ring 103, and forms a secondary static pressure chamber with the light guide hood 104; the clean air pipe joint 107 is connected to the guide ring 103 through the laminar flow hood 106, so that the clean gas with a certain positive pressure enters the primary static pressure chamber through the guide hole of the guide ring 103, and after convective heat dissipation of the semiconductor light source group 102, it is distributed to the secondary static pressure chamber through the flow distribution hole flow channel of the guide ring 103 for mixed flow, and then overflows along the slit between the laminar flow hood 106 and the light guide hood 104 to form a laminar wind curtain gas to clean the light guide hood 104.

[0020] like Figure 1 and Figure 2As shown, the clean air pipe joint 107 passes through the laminar flow hood 106 and is fixed on the guide ring 103. In this way, the guide ring 103, the laminar flow hood 106, and the self-cleaning light guide hood 104 form a protective cover structure, which is used to prevent water droplets from splashing and water mist from condensing and fouling on the light guide hood. The self-cleaning light guide hood 104 is fixed to the guide ring 103, and the laminar flow hood 106 is installed in the chamber between the guide ring 103 and the laminar flow hood 106 to form a secondary static pressure chamber.

[0021] Thus, the clean positive-pressure gas enters the light source device 1 from the clean air pipe joint 107 fixed on the guide ring 103, passes through the guide hole of the guide ring 103, is mixed and compressed once between the light source ring seat 101 and the guide ring 103, and is distributed to flow into the primary static pressure cavity between the light source ring seat 101 and the self-cleaning light guide cover 104 through the distribution groove of the light source ring seat 101. The static pressure airflow is mixed for a second time in the primary static pressure cavity for convective heat dissipation of the semiconductor light source group 102, and the light source ring seat 101 is for conduction heat dissipation of the semiconductor light source group 102.

[0022] In addition, the positive-pressure gas is homogenized by secondary mixed flow in the primary static pressure chamber of the light source, and the positive-pressure gas passes through the distribution hole flow channel of the guide ring 103 to distribute the airflow to the guide groove of the laminar flow hood 106 between the laminar flow hood 106 and the light guide hood 104. The secondary mixed flow flows to the laminar flow hood 106 and the light guide hood 104 to form a tertiary mixed flow in the secondary static pressure chamber, and the static-pressure airflow overflows along the slit between the laminar flow hood 106 and the light guide hood 104 with a low-flow laminar flow, forming a low-flow laminar air curtain gas, and the laminar air curtain gas cleans the scale, water vapor and surrounding water mist on the light guide hood along the outer wall of the light guide hood 104 through laminar self-cleaning to realize self-cleaning of the light guide hood.

[0023] Since the function of the light source device includes providing a bright and uniform light field, Figure 1 As shown, in some embodiments, the light source device may further include: a diffuse reflection light guide ring 105; the diffuse reflection light guide ring 105 is fixed to the inner hole of the guide ring 103, and the wind curtain for cleaning the light guide cover 104 flows to the end of the light guide cover 104 to clean the diffuse reflection light guide ring 105.

[0024] like Figure 1 and Figure 2As shown, the diffuse reflection light guide ring 105 fixes the inner hole of the guide ring 103, so that the semiconductor light source group 102 forms a uniform external irradiation light field in the primary static pressure cavity through diffuse reflection and transmission in the self-cleaning light guide cover 104, and the diffuse reflection light guide ring 105 acts as an external irradiation light field to strengthen the diffuse reflection reflector, further improving the effect of the light source device in forming the light field. In addition, the laminar air curtain gas flows along the outer wall of the light guide cover 104 to clean the dirt, water vapor and surrounding water mist on the light guide cover to achieve self-cleaning of the light guide cover, and the laminar air curtain on the outer wall of the light guide cover 104 flows to the end of the light guide cover, and the airflow hits the diffuse reflection light guide ring 105 and continues to clean along the wall. The cleaning airflow is mixed at the end of the diffuse reflection light guide ring 105 to form a local mixed flow air curtain, that is, the self-cleaning of the diffuse reflection light guide ring 105 is achieved.

[0025] It can be seen that in the embodiment of the present invention, in the light source device, the semiconductor light source group is installed on the light source ring seat, not only the guide ring and the light guide cover together form a protective cover of the light source ring seat, but also, by connecting the guide ring clean air pipe joint, the clean positive pressure gas can enter the primary static pressure cavity between the light guide cover and the light source ring seat, overflow after convective heat dissipation of the semiconductor light source group, and clean the light guide cover, and further, a laminar flow cover can be further added to the guide ring, so that a secondary static pressure cavity is formed between the laminar flow cover and the light guide cover, so that the clean positive pressure gas enters the primary static pressure cavity through the guide hole of the guide ring, and after convective heat dissipation of the semiconductor light source group, it is distributed to the secondary static pressure cavity through the flow channel of the guide ring distribution hole for mixed flow, and then overflows along the slit between the laminar flow cover and the light guide cover to form a laminar wind curtain gas to clean the light guide cover, thereby further increasing the degree of self-cleaning of the light guide cover, and further ensuring the working stability of the visual camera in the semiconductor wafer wet process.

[0026] Of course, if Figure 1 and Figure 2 As shown, the light source ring seat 101, the guide ring 103, the laminar flow cover 104, the diffuse reflection light guide ring 105, and the self-cleaning light guide cover 106 are cylindrical or annular, but the embodiment of the present invention is not limited thereto, and one or more of the light source ring seat, the guide ring, the laminar flow cover, the diffuse reflection light guide ring, and the self-cleaning light guide cover can also be square or other shapes, as long as the guide ring, the laminar flow cover, the self-cleaning light guide cover, etc. can form a protective cover for the semiconductor light source group, and a primary static pressure cavity can be formed between the guide ring and the laminar flow cover, and a secondary static pressure cavity can be formed between the laminar flow cover and the light guide cover. In this way, the clean gas can overflow along the slit between the laminar flow cover and the light guide cover to form a laminar wind curtain gas to clean the light guide cover, thereby realizing the self-cleaning of the light source equipment. The specifics are not listed one by one.

[0027] The light source device provided by the embodiment of the present invention can be applied to the semiconductor wafer manufacturing process, and with the development of science and technology, semiconductor products can be manufactured automatically. That is, the control device can control the visual camera, light source device and other equipment to manufacture semiconductor products. Therefore, the system for semiconductor manufacturing includes: a control device, an air outlet device, a light source control device, a visual camera, and the above-mentioned light source device. Among them, the light source control device is connected to the semiconductor light source group in the light source device, and the air outlet device is connected to the clean air pipe joint in the light source device; the control device is connected to the air outlet device and the light source control device, and is configured to control the air outlet device to input clean gas to the light source device when the visual camera and the light source device are in a semiconductor wet process environment, and control the light output brightness of the light source device through the light source control device according to the image obtained by the visual camera.

[0028] When the visual camera and the light source equipment enter the semiconductor wet process environment to work, the control device can control the air outlet device to output the minimum flow of positive pressure clean gas, and enter the light source device through the clean air pipe joint for self-cleaning. In addition, the control device can also control the light source device to form a bright and uniform light field. Therefore, the control device can control the light source device to start emitting light through the light source control device according to preset parameters. During the semiconductor manufacturing process, the control device can also obtain the image obtained by the visual camera in real time or at a fixed time, analyze the image, and perform brightness compensation according to the analysis results. According to the compensated parameters, the light source device is controlled by the light source control device to operate the light emission.

[0029] In some embodiments, the control device may also save the light source life cycle strategy of the light source device, so that the control device may also perform maintenance or replacement reminder processing on the light source device based on the image acquired by the visual camera and the saved light source life cycle strategy.

[0030] During the semiconductor manufacturing process, since it is necessary to move the visual camera and the light source equipment into or out of the semiconductor wet process environment, in some embodiments, the automated system for semiconductor manufacturing may also include: a robotic arm equipped with the visual camera and the light source equipment; in this way, the control device, which is connected to the robotic arm, is also configured to control the robotic arm to move the visual camera and the light source equipment into or out of the semiconductor wet process environment.

[0031] In the embodiment of the present invention, the control device may be a single industrial control device or two or more industrial control devices. For example, the control device may be a visual industrial control computer for image analysis and processing, and a programmable controller PLC for device control. Alternatively, the control device includes a first industrial control computer that can be connected to the network, a second industrial control computer that can perform image analysis and processing, and a third industrial control computer that can perform device control. The specific examples are not listed one by one.

[0032] In some embodiments, the air outlet device includes: a proportional servo valve and a micro-flow maintaining valve connected to the clean air pipe connector; and the control device, connected to the proportional servo valve and the micro-flow maintaining valve, is specifically configured as follows.

[0033] The following is an example of an automated manufacturing process of a system for semiconductor manufacturing provided by an embodiment of the present invention.

[0034] like Figure 3 As shown, the system for semiconductor manufacturing may include: a light source device 1, a light source controller 2, a programmable controller PLC 3, a visual camera 4, a proportional servo valve 5, a micro-flow valve 6, a visual industrial computer 7, and a robotic arm 8. Of course, the light source device may be as described above, for example Figure 1 Among them, the visual industrial computer 7 and the programmable controller PLC3 can form a control device, and the air outlet device can include: a proportional servo valve 5 and a micro-flow holding valve 6.

[0035] In this way, the robotic arm 8 moves the visual camera 4 and the self-cleaning light source 1 into the semiconductor wet process environment 9 for operation. The PLC can control the microfluidic valve 6 to be kept in a normally open state, and start the proportional servo valve 5 to control the minimum flow rate according to the self-cleaning flow parameters, thereby maintaining the laminar air curtain to prevent water mist from splashing and contaminating the light guide cover 104, thereby realizing self-cleaning of the light source equipment.

[0036] Moreover, the PLC can start the self-cleaning light source through the light source control device according to the saved visual light field brightness parameters to perform visual inspection. During the visual inspection process, the image collected by the visual camera 4 can be transmitted to the PLC, so that the visual industrial computer 7 analyzes the image, obtains the visual inspection result and sends it to the PLC, so that the PLC can determine the corresponding compensation brightness parameter according to the saved reference brightness value and the visual inspection result, and send the compensation brightness parameter to the light source control device, and control the light output brightness of the light source device through the light source control device. Among them, the visual camera 4 can collect images in real time or at a fixed time, so in the semiconductor manufacturing process, the closed-loop drive light source controller 2 can be realized to control the light source device 1 to output the set brightness. That is, in some embodiments, the control device includes: a visual industrial computer and a programmable controller PLC; the visual industrial computer is configured to obtain the current image collected by the visual camera, analyze the current image, obtain the current visual inspection result and send it to the PLC; the PLC is configured to determine the current compensation brightness parameter matching the current visual inspection result, and send the current compensation brightness parameter to the light source control device, and control the light output brightness of the light source device through the light source control device.

[0037] During the semiconductor manufacturing process, after completing the visual inspection, the visual camera 4 and the light source device 1 can be turned off, and the robotic arm 8 moves the visual camera 4 and the light source device 1 out of the semiconductor wet process environment 9. The PLC can close the proportional servo valve 5 to enter the holding condition, but control the microflow valve 6 to keep it open, keep the light source device 1 ventilated, and maintain the minimum self-cleaning of the self-cleaning light guide cover.

[0038] After the image obtained by the visual inspection is analyzed by the visual industrial computer, the corresponding current visual inspection result is obtained and reported to PLC 3. PLC 3 can perform light source life cycle strategy management, that is, in some embodiments, PLC is also configured to perform maintenance or replacement reminder processing on the light source equipment according to the current visual inspection result and the saved light source life cycle strategy. Among them, the light source life cycle strategy may include: the correspondence between the light source brightness or the light source usage time and the light source maintenance, the correspondence between the light source brightness, the light source usage time and the light source replacement, etc. One or more. In this way, according to the corresponding relationship in the light source life cycle strategy, it is possible to determine whether the light source needs to be repaired, whether the light source needs to be replaced, etc., and if necessary, a corresponding reminder can be made.

[0039] The self-cleaning flow parameters corresponding to the laminar air curtain of the light guide cover 104 of the light source device 1 can be obtained by remotely configuring the proportional servo valve 5, that is, the PLC can remotely obtain the corresponding self-cleaning flow parameters. Similarly, the visual light field brightness parameters in the semiconductor wet process environment 9, that is, the set brightness parameters, can also be obtained by remotely configuring the parameters of the light source controller 2; and the control device or PLC can also remotely obtain the corresponding visual light field brightness parameters; and the light source life cycle strategy can also be obtained by programming, and then maintenance prompts can be automatically generated according to the visual inspection results to achieve self-cleaning light source life cycle management.

[0040] It can be seen that in this embodiment, the control device composed of the visual industrial computer and the PLC can control the proportional servo valve and the micro-flow valve to achieve self-cleaning of the light source device, and can also drive the light source control device in a closed loop during the visual inspection process, so that the light source device can output a light field with stable and uniform brightness, further improving the stability and accuracy of the visual inspection. It can also manage the life cycle of the light source device, repair or replace the light source device in time, and further improve the intelligence and stability of semiconductor manufacturing.

[0041] System control equipment used in semiconductor manufacturing can control air outlet equipment and light source control equipment to achieve visual inspection, self-cleaning and life cycle management of light sources during semiconductor manufacturing. Figure 4 As shown, in some embodiments, a process for semiconductor manufacturing control may include: Step 401: When the visual camera and the light source device are in a semiconductor wet process environment, control the air outlet device to input clean gas into the light source device.

[0042] The visual camera and light source equipment are in a semiconductor wet process environment. The control device can control the air outlet device to output clean positive pressure gas with a minimum flow rate, and enter the light source equipment through the clean air pipe joint for self-cleaning.

[0043] Step 402: Acquire an image captured by a visual camera, and control a light source device to emit light through a light source control device according to the image.

[0044] The visual camera and the light source device are in a semiconductor wet process environment. After the control device can control the light source device to start emitting light according to preset parameters through the light source control device, in the semiconductor manufacturing process, the visual camera can also acquire images in real time or at a fixed time, analyze the images, and perform brightness compensation according to the analysis results. Then, according to the compensated parameters, the light source device is controlled by the light source control device to perform light emitting operation. That is, in some embodiments, acquiring an image through a visual camera and controlling the light source device to perform light emitting operation through the light source control device include: acquiring the current image captured by the visual camera, analyzing the current image, and obtaining the current visual detection result, and determining the current compensation brightness parameter that matches the current visual detection result, and sending the current compensation brightness parameter to the light source control device, and controlling the light output brightness of the light source device through the light source control device.

[0045] In some embodiments, the method for semiconductor manufacturing control may further include: controlling a robot arm to move a visual camera and a light source device into or out of a semiconductor wet process environment.

[0046] In some embodiments, controlling the air outlet device to input clean positive pressure gas to the light source device may include: controlling the air volume of the positive clean gas entering the light source device through a proportional servo valve, and controlling the micro-flow valve to be kept in a normally open state.

[0047] Of course, the self-cleaning flow parameters can be obtained through user input, network connection, or remote input. Then, based on the self-cleaning flow parameters, the air volume of the forward cleaning gas entering the light source device is controlled through the proportional servo valve, so that a low-flow laminar air curtain gas can be generated when entering the light source device for self-cleaning.

[0048] In some embodiments, it also includes: performing maintenance or replacement reminder processing on the light source equipment based on the current visual inspection results and the saved light source life cycle strategy.

[0049] Here, the light source life cycle strategy can also be obtained through user input, network connection, or remote input. In this way, based on the corresponding relationship in the light source life cycle strategy, it can be determined whether the current visual inspection result corresponds to a light source maintenance reminder or a light source update reminder. If so, corresponding reminder processing is performed, including: sound, light, graphics, text, voice, etc.

[0050] In some embodiments, the light source device may be Figure 1 As shown, the system used in semiconductor manufacturing can be as follows Figure 3 As shown, the semiconductor manufacturing control performed by the control device can be as follows Figure 5 As shown, it may specifically include: Step 501: The visual industrial control device in the control device controls the robotic arm to move the visual camera and the light source device into the semiconductor wet process environment.

[0051] Step 502: The PLC in the control device controls the micro-flow valve to be in a normally open state.

[0052] Step 503: Determine whether the visual camera and the light source device are in the set area of ​​the wet environment. If yes, execute step 504; otherwise, return to step 503.

[0053] Step 504: The PLC in the control device controls the proportional servo valve according to the self-cleaning flow parameters acquired remotely to generate positive cleaning gas, so that the positive cleaning gas enters the light source device for self-cleaning.

[0054] Step 505: The PLC in the control device controls the light source device to perform light emitting operation through the light source control device according to the operating parameters including the brightness value.

[0055] Steps 504 and 505 may be performed in any order and may be performed simultaneously.

[0056] Step 506: The visual industrial computer of the control device obtains the current image captured by the visual camera, performs current image analysis, obtains the current visual detection result and sends it to the PLC.

[0057] Step 507: The PLC of the control device supplements the brightness parameter value in the current visual detection result according to the saved brightness parameter value to obtain the current compensation brightness parameter, and controls the light output brightness of the light source device through the light source control device according to the operating parameters including the current compensation brightness parameter.

[0058] Step 508: Determine whether the visual inspection is completed. If yes, go to step 509; otherwise, return to step 506.

[0059] Step 509: The PLC of the control device controls the light source device to be turned off through the light source control device, and closes the proportional servo valve, keeping the micro-flow valve in a normally open state.

[0060] Step 510: The visual industrial computer controlling the equipment controls the robotic arm to move the visual camera and the light source equipment out of the semiconductor wet process environment.

[0061] Of course, in this embodiment, the PLC can also perform maintenance or replacement reminder processing on the light source equipment according to the current visual detection results and the saved light source life cycle strategy.

[0062] It can be seen that in this embodiment, the control device composed of the visual industrial computer and the PLC can control the proportional servo valve and the maintaining micro-flow valve to achieve self-cleaning of the light source equipment, and can also drive the light source control equipment in a closed loop during the visual inspection process, so that the light source equipment can output a light field with stable and uniform brightness, further improving the stability and accuracy of visual inspection.

[0063] According to the above-mentioned process of semiconductor manufacturing control, a device for semiconductor manufacturing control can be constructed. Figure 6 An embodiment of the present invention provides a device for semiconductor manufacturing control, which can be applied to a control device of a system for semiconductor manufacturing, such as Figure 6 As shown, the device 600 includes: a first control module 610 and a second control module 620 .

[0064] The first control module 610 is configured to control the air outlet device to input clean gas to the light source device when the visual camera and the light source device are in a semiconductor wet process environment.

[0065] The second control module 620 is configured to obtain the image captured by the visual camera, and control the light source device to emit light through the light source control device according to the image.

[0066] In some embodiments, the apparatus further comprises: The third control module is configured to control the robotic arm to move the visual camera and the light source device into or out of the semiconductor wet process environment.

[0067] In some embodiments, the first control module 610 is specifically configured to control the air volume of the forward cleaning gas entering the light source device through a proportional servo valve, and control the micro-flow valve to be kept in a normally open state.

[0068] In some embodiments, the second control module 620 is specifically configured to acquire the current image captured by the visual camera, perform current image analysis, obtain the current visual detection result, and determine the current compensation brightness parameters that match the current visual detection result, and send the current compensation brightness parameters to the light source control device, so as to control the light output brightness of the light source device through the light source control device.

[0069] In some embodiments, it also includes: The fourth control module is configured to perform maintenance or replacement reminder processing on the light source equipment according to the current visual inspection result and the saved light source life cycle strategy.

[0070] It can be seen that in the embodiment of the present invention, for semiconductor wet process, the device for semiconductor manufacturing control can control the air outlet device to achieve self-cleaning of the light source device, and can also drive the light source control device in a closed loop during the visual inspection process, so that the light source device can output a light field with stable and uniform brightness, further improving the stability and accuracy of the visual inspection. It can also perform life cycle management on the light source device, and timely repair or replace the light source device, further improving the intelligence and stability of semiconductor manufacturing.

[0071] Combination Figure 7 , an embodiment of the present invention provides a device 700 for semiconductor manufacturing control, comprising: The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for semiconductor manufacturing control of the above embodiment.

[0072] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0073] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes the functional application and data processing by running the program instructions / modules stored in the memory 1001, that is, the method for semiconductor manufacturing control in the above method embodiment is implemented.

[0074] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0075] An embodiment of the present invention provides a semiconductor manufacturing control device, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a semiconductor manufacturing control method when executing the program instructions.

[0076] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the method for semiconductor manufacturing control as described above.

[0077] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0078] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0079] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A light source device for semiconductor manufacturing, characterized in that: include: A light source ring seat (101), a semiconductor light source group (102), a guide ring (103), a light guide cover (104), and a clean air pipe joint (107); The semiconductor light source group (102) is mounted on the light source ring seat (101); The light source ring seat (101) is sleeved on the guide ring (103), and the light guide cover (104) surrounds the light source ring seat (101) and is fixed to the brim of the guide ring (103), so that a primary static pressure cavity is formed between the light guide cover (104) and the light source ring seat (101); The clean gas pipe joint (107) is connected to the guide ring (103), so that the clean gas enters the primary static pressure chamber through the guide hole of the guide ring (103), convectively dissipates heat from the semiconductor light source group (102), and then overflows to clean the light guide cover (104).

2. The light source device according to claim 1, characterized in that: Also includes: Laminar flow hood (106); The laminar flow cover (106) covers the inner hole of the guide ring (103) and is fixedly connected to the guide ring (103), and forms a secondary static pressure cavity between the laminar flow cover (106) and the light guide cover (104); The clean gas pipe joint (107) is connected to the guide ring (103) through the laminar flow hood (106), so that the clean gas enters the primary static pressure chamber through the guide hole of the guide ring (103), dissipates heat from the semiconductor light source group (102) by convection, and then flows through the distribution hole flow channel of the guide ring (103) to be distributed to the secondary static pressure chamber for mixed flow, and then overflows along the slit between the laminar flow hood (106) and the light guide hood (104), forming a laminar wind curtain gas to clean the light guide hood (104).

3. The light source device according to claim 1 or 2, characterized in that: Also includes: Diffuse reflection light guide ring (105); The diffuse reflection light guide ring (105) is fixed to the inner hole of the guide ring (103); after the wind curtain for cleaning the light guide cover (104) flows to the end of the light guide cover (104), the diffuse reflection light guide ring (105) is cleaned.

4. A system for semiconductor manufacturing, characterized in that: include: Control device, air outlet device, light source control device, visual camera, and light source device as described in claims 1-3; wherein, The light source control device is connected to the semiconductor light source group (102) in the light source device, and the air outlet device is connected to the clean air pipe joint (107) in the light source device; The control device is connected to the air outlet device and the light source control device, and is configured to control the air outlet device to input clean gas to the light source device when the visual camera and the light source device are in a semiconductor wet process environment, and to control the light source device to perform light emitting operation through the light source control device based on the image obtained through the visual camera.

5. The system according to claim 1, characterized in that Also includes: A robotic arm equipped with a visual camera and light source equipment; The control device is connected to the robotic arm and is also configured to control the robotic arm to move the visual camera and the light source device into or out of the semiconductor wet process environment.

6. The system according to claim 1, wherein: The air outlet device comprises: a proportional servo valve and a micro-flow maintaining valve connected to the clean air pipe joint (107); The control device is connected with the proportional servo valve and the micro-flow valve, and is specifically configured to control the air volume entering the light source device through the proportional servo valve, and control the micro-flow valve to be in a normally open state.

7. The system according to any one of claims 4 to 6, characterized in that: Control equipment includes: visual industrial computer and programmable controller PLC; The visual industrial computer is configured to obtain the current image captured by the visual camera, analyze the current image, obtain the current visual inspection result and send it to the PLC; The PLC is configured to determine a current compensation brightness parameter that matches a current visual detection result, and send the current compensation brightness parameter to a light source control device, so as to control the light output brightness of the light source device through the light source control device.

8. The system according to claim 7, characterized in that The PLC is also configured to provide maintenance or replacement reminders for the light source equipment based on the current visual inspection results and the saved light source life cycle strategy.

9. A method for semiconductor manufacturing control, characterized in that: The system for semiconductor manufacturing is as shown in claims 4-8, the method comprising: When the visual camera and the light source device are in a semiconductor wet process environment, controlling the air outlet device to input clean gas to the light source device; The image is acquired by the visual camera, and based on the image, the light source device is controlled by the light source control device to perform light emitting operation.

10. A device for semiconductor manufacturing control, the device comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for semiconductor manufacturing control according to claim 9 when executing the program instructions.

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