Temperature and vibration real-time monitoring system for heat distribution pipeline

Abstract

The invention discloses a heat distribution pipeline temperature and vibration real-time monitoring system, and relates to the technical field of heat distribution pipeline temperature and vibration real-time monitoring. The system comprises a data acquisition module, a data preprocessing module, a distributed optical fiber leakage monitoring host, a distributed optical fiber vibration monitoring host, a controller module, a data transmission module, a power supply module, an alarm module and a display module. A distributed optical fiber sensing technology is adopted, so that the system has the advantages of real-time monitoring, high precision, high reliability and the like; the temperature and vibration conditions of the heat distribution pipeline can be monitored in real time, potential safety hazards are found and treated in time, and urban heat supply safety is guaranteed; the key points of the temperature and vibration real-time monitoring system for the heat distribution pipeline are real-time monitoring and data analysis, GIS function, alarm and fault indication, unified management and report output, and system stability and adaptability. Key points are effectively combined, so that a powerful guarantee is provided for safe operation of the heat distribution pipeline.

Description

Technical Field

[0001] The invention relates to the technical field of temperature and vibration real-time monitoring, and in particular to a thermal pipeline temperature and vibration real-time monitoring system. Background Art

[0002] With the rapid development of urban construction, thermal pipelines are an important part of urban infrastructure, and their safe operation is of great significance to ensuring urban heating and residents' lives. However, since thermal pipelines are in a high-temperature, high-pressure working state for a long time, they are prone to leakage, thermal insulation performance decay, vibration and other problems, which pose a serious threat to urban heating safety and residents' lives.

[0003] Therefore, developing a system that can monitor the temperature and vibration of thermal pipelines in real time is of great significance for timely discovering and dealing with safety hazards of thermal pipelines and ensuring the safety of urban heating. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a real-time monitoring system for the temperature and vibration of a thermal pipeline in response to the problems in the background technology. The system adopts distributed optical fiber sensing technology and realizes real-time monitoring of the temperature and vibration along the pipeline through optical cables laid in parallel along the pipeline.

[0005] The present invention adopts the following technical solutions to solve the above technical problems:

[0006] The real-time monitoring system for temperature and vibration of a thermal pipeline is characterized by comprising a data acquisition module, a data preprocessing module, a distributed optical fiber leakage monitoring host, a distributed optical fiber vibration monitoring host, a controller module, a data transmission module, a power supply module, an alarm module, and a display module; the data acquisition module is connected to the controller module through the data preprocessing module, the data transmission module, the power supply module, the alarm module, and the display module are respectively connected to the controller module; the distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are respectively connected to the controller module;

[0007] The data acquisition module is used to collect temperature signals and vibration signals along the pipeline in real time through the composite sensing optical cable laid in parallel along the pipeline;

[0008] The data preprocessing module is used to preprocess the raw data received from the data acquisition module, including data cleaning, denoising, format conversion, etc., to ensure the accuracy of subsequent data analysis;

[0009] The distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are used to receive the pre-processed temperature signal and vibration signal respectively; the distributed optical fiber leakage monitoring host analyzes the temperature signal and monitors the temperature change along the pipeline, thereby discovering the leakage of the thermal pipeline, the decay of the thermal insulation performance, etc.; the distributed optical fiber vibration monitoring host analyzes the vibration signal and monitors the vibration along the pipeline, thereby discovering the vibration problem of the thermal pipeline;

[0010] The controller module is responsible for the operation control of the entire system, including the triggering of data acquisition, the scheduling of preprocessing programs, the monitoring of the host, and the data exchange with other modules;

[0011] Data transmission module, used to transmit processed data to the system monitoring center or user terminal by wired or wireless means to realize remote monitoring and data sharing;

[0012] The power supply module is used to provide a stable power supply for the entire system and ensure the normal operation of each module;

[0013] Alarm module: When the system detects an abnormal situation, including pipeline leakage or excessive vibration, the module will immediately trigger the alarm mechanism and notify the user or pipeline maintenance personnel through sound, light flash, and SMS;

[0014] The display module displays the system's operating status, monitoring data, and alarm information in real time through a screen or terminal device, making it convenient for users or maintenance personnel to operate and manage.

[0015] As a further preferred solution of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention, the data acquisition module includes temperature sensors and vibration sensors laid along the pipelines.

[0016] As a further preferred embodiment of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention, the data preprocessing module comprises a signal amplification circuit module, a filtering module and an analog-to-digital conversion module, and the data acquisition module is connected to the controller module via the signal amplification circuit module, the filtering module and the analog-to-digital conversion module in sequence.

[0017] As a further preferred embodiment of the real-time monitoring system for temperature and vibration of a thermal pipeline of the present invention, the signal amplification circuit module and the filtering module specifically include a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first operational amplifier, a second operational amplifier, and a third operational amplifier, wherein the signal input -IN terminal is connected to one end of the first resistor, the other end of the first resistor is respectively connected to one end of the first capacitor, one end of the third resistor and the negative power supply pin of the first operational amplifier, the other end of the first capacitor is respectively connected to the other end of the third resistor and the output pin of the first operational amplifier, the signal input +IN terminal is connected to one end of the second resistor, and the other end of the second resistor is respectively connected to the first capacitor, the third resistor and the negative power supply pin of the first operational amplifier, the first capacitor and the negative power supply pin of the first operational amplifier, the signal input +IN terminal is connected to one end of the second resistor, and the second end of the second resistor is respectively connected to the first capacitor, the third resistor and the negative power supply pin of the first operational amplifier, the first capacitor ... A positive power pin of an operational amplifier, one end of a fourth resistor, and one end of a second capacitor, the other end of the second capacitor is connected to the other end of the fourth resistor and grounded, the output pin of the first operational amplifier is connected to one end of the fifth resistor, the other end of the fifth resistor is connected to the positive power pin of the second operational amplifier, the negative power pin of the second operational amplifier is connected to the negative power pin of the third operational amplifier, the positive power pin of the third operational amplifier is respectively connected to one end of the eighth resistor and one end of the ninth resistor, the other end of the ninth resistor is grounded, the other end of the eighth resistor is respectively connected to one end of the seventh resistor and the output pin of the second operational amplifier, the other end of the seventh resistor is connected to one end of the fourth capacitor, the other end of the fourth capacitor is respectively connected to one end of the ninth resistor, the other end of the ninth resistor is connected to one end of the third capacitor, and the other end of the third capacitor is grounded.

[0018] As a further preferred embodiment of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention, the distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host include a GIS module for realizing GIS functions, including map rendering, coordinate conversion, and abnormal point marking.

[0019] As a further preferred solution of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention, the data transmission module includes an Ethernet interface card and a wireless communication module; the wireless communication module includes a Wi-Fi module and a 4G / 5G module.

[0020] As a further preferred embodiment of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention, the display module includes a user interface circuit for realizing the interaction between the user and the system; including a display interface circuit, a touch screen interface circuit, and a keyboard / mouse interface circuit; the user interface circuit receives data from the data processing circuit and presents it to the user in an easy-to-understand manner.

[0021] As a further preferred embodiment of the real-time monitoring system for temperature and vibration of a thermal pipeline of the present invention, the power supply module includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a first inductor L1, a second inductor L2, a first diode D1, a second diode D2, a third diode D3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a fifth electrolytic capacitor E5, a first switching power supply chip U1, a second switching power supply chip U2, a voltage stabilizing chip U3, a voltage input terminal, a first voltage output terminal, a second voltage output terminal, and a third voltage output terminal;

[0022] The voltage input terminal is connected to the positive electrode of the diode D1, and the negative electrode of the diode D1 is respectively connected to one end of the third capacitor C3, the positive electrode of the first electrolytic capacitor E1, one end of the first resistor R1, and the pin 6 of the first switching power supply U1;

[0023] The other end of the first resistor R1 is respectively connected to the pin 7 of the first switch power chip U1, the pin 8 of the first switch power chip U1 and the pin 1 of the first switch power chip U1;

[0024] Pin 2 of the first switch power chip U1 is connected to the cathode of the second diode D2 and one end of the first inductor L1 respectively;

[0025] The other end of the first inductor L1 is respectively connected to the positive electrode of the first electrolytic capacitor E1, one end of the first capacitor C1 and the first voltage output end;

[0026] The other end of the first capacitor C1 is respectively connected to the cathode of the first electrolytic capacitor E1, the anode of the second diode D2, one end of the fourth capacitor C4, the pin 4 of the first switching power chip U1, one end of the fifth resistor R5, the cathode of the third electrolytic capacitor E3 and the other end of the third capacitor C3;

[0027] The other end of the fourth capacitor C4 is connected to the pin 3 of the first switch power chip U1;

[0028] The other end of the fifth resistor R5 is respectively connected to the pin 5 of the first switch power chip U1 and one end of the third resistor R3;

[0029] The other end of the third resistor R3 is connected to the first voltage output end;

[0030] The other end of the third capacitor C3 is also connected to one end of the fifth capacitor C5, the positive electrode of the fourth electrolytic capacitor E4, one end of the second resistor R2, and the pin 6 of the second switch power chip U2;

[0031] The other end of the second resistor R2 is respectively connected to the pin 7 of the second switch power chip U2, the pin 8 of the second switch power chip U2 and the pin 1 of the second switch power chip U2;

[0032] Pin 2 of the second switch power chip U2 is connected to the cathode of the second diode D3 and one end of the second inductor L2 respectively;

[0033] The other end of the second inductor L2 is respectively connected to the positive electrode of the second electrolytic capacitor E2, one end of the second capacitor C2, the second voltage output end and the pin 3 of the voltage stabilizing chip U3;

[0034] The other end of the second capacitor C2 is respectively connected to the pin 1 of the voltage stabilizing chip U3, the negative electrode of the fifth capacitor E5, one end of the seventh capacitor C7, the negative electrode of the second electrolytic capacitor E2, the positive electrode of the third diode D3, one end of the sixth capacitor C6, the pin 4 of the second switching power chip U2, one end of the sixth resistor R6, the negative electrode of the fourth electrolytic capacitor E4 and the other end of the fifth capacitor C5;

[0035] The other end of the sixth capacitor C6 is connected to the pin 3 of the second switch power chip U2, the other end of the sixth resistor R6 is respectively connected to the pin 5 of the second switch power chip U2 and one end of the fourth resistor R4, and the other end of the fourth resistor R4 is connected to the second voltage output terminal;

[0036] The other end of the seventh capacitor C7 is respectively connected to the positive electrode of the electrolytic capacitor E5, the pin 2 of the voltage stabilizing chip U3, the pin 4 of the voltage stabilizing chip U3 and the third voltage output terminal.

[0037] Compared with the prior art, the present invention adopts the above technical solution and has the following technical effects:

[0038] 1. The real-time monitoring system for temperature and vibration of thermal pipelines of the present invention adopts distributed optical fiber sensing technology and has the advantages of real-time monitoring, high precision, high reliability, etc. The system can monitor the temperature and vibration of thermal pipelines in real time, timely discover and deal with potential safety hazards, and ensure the safety of urban heating. The system is also equipped with professional operation and maintenance technicians to ensure the stable operation and timely maintenance of the system. The key points of the real-time monitoring system for temperature and vibration of thermal pipelines are its real-time monitoring and data analysis, GIS function, alarm and fault indication, unified management and report output, and system stability and adaptability. The effective combination of key points will provide a strong guarantee for the safe operation of thermal pipelines.

[0039] 2. Real-time monitoring and data analysis: The system needs to be able to obtain temperature anomaly information and vibration anomaly signals along the pipeline in real time, and through powerful data analysis functions, capture pipeline leakage characteristics in real time to ensure a comprehensive understanding of the operating status of the thermal pipeline;

[0040] 3. GIS function: The system should be based on the B / S architecture concept and combined with cloud technology to realize the visualization of online monitoring of the pipe network; through the GIS function, the operation status of the entire thermal pipe network can be displayed on the map, and the geographical location information of abnormal points can be clearly indicated, so as to facilitate timely inspection and treatment by pipeline maintenance personnel;

[0041] 4. Alarm and fault indication: When the system detects abnormal temperature or vibration, it should promptly send out an alarm signal and locate and mark the location of the accident in GIS; this helps to quickly identify and handle potential safety issues and avoid major accidents;

[0042] 5. Unified management and report output: The system should manage the pipe network monitoring equipment information, monitoring data, alarm data, operation and maintenance data in a unified manner and form a unified report; this will help to conduct long-term data analysis and trend forecasting, and provide strong support for the safe operation of thermal pipelines;

[0043] 6. System stability and adaptability: Taking into account different meteorological conditions, such as extreme high temperature, low temperature, rainfall, etc., the system should have good stability and adaptability to ensure stable operation under various environmental conditions and provide continuous protection for the safe operation of thermal pipelines. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 It is a structural principle diagram of the real-time monitoring system for temperature and vibration of thermal pipelines of the present invention;

[0046] Figure 2 is a circuit diagram of a data preprocessing module of the present invention;

[0047] Figure 3 is a circuit schematic diagram of the power module of the present invention;

[0048] Figure 4 It is a schematic diagram of the installation of the composite sensing optical cable of the present invention. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The present invention provides a real-time monitoring system for temperature and vibration of thermal pipelines. The system adopts distributed optical fiber sensing technology and realizes real-time monitoring of temperature and vibration along the pipeline through optical cables laid in parallel along the pipeline. The system includes distributed optical fiber leakage monitoring host, distributed optical fiber vibration monitoring host, composite sensing optical cable and other equipment, and professional manufacturers are responsible for construction and commissioning.

[0051] Specifically, the distributed optical fiber leakage monitoring host monitors the temperature changes along the pipeline in real time by receiving the temperature signal transmitted by the composite sensing optical cable, thereby detecting leakage of the thermal pipeline, thermal insulation performance decay, etc. The distributed optical fiber vibration monitoring host monitors the vibration along the pipeline in real time by receiving the vibration signal transmitted by the composite sensing optical cable, thereby detecting vibration problems of the thermal pipeline.

[0052] Thermal pipeline temperature and vibration real-time monitoring system, such as Figure 1 As shown, it includes a data acquisition module, a data preprocessing module, a distributed optical fiber leakage monitoring host, a distributed optical fiber vibration monitoring host, a controller module, a data transmission module, a power supply module, an alarm module, and a display module; the data acquisition module is connected to the controller module through the data preprocessing module, and the data transmission module, the power supply module, the alarm module, and the display module are respectively connected to the controller module; the distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are respectively connected to the controller module;

[0053] The data acquisition module is used to collect temperature signals and vibration signals along the pipeline in real time through the composite sensing optical cable laid in parallel along the pipeline;

[0054] The data preprocessing module is used to preprocess the raw data received from the data acquisition module, including data cleaning, denoising, format conversion, etc., to ensure the accuracy of subsequent data analysis;

[0055] The distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are used to receive the pre-processed temperature signal and vibration signal respectively; the distributed optical fiber leakage monitoring host analyzes the temperature signal and monitors the temperature change along the pipeline, thereby discovering the leakage of the thermal pipeline, the decay of the thermal insulation performance, etc.; the distributed optical fiber vibration monitoring host analyzes the vibration signal and monitors the vibration along the pipeline, thereby discovering the vibration problem of the thermal pipeline;

[0056] The controller module is responsible for the operation control of the entire system, including the triggering of data acquisition, the scheduling of preprocessing programs, the monitoring of the host, and the data exchange with other modules;

[0057] Data transmission module, used to transmit processed data to the system monitoring center or user terminal by wired or wireless means to realize remote monitoring and data sharing;

[0058] The power supply module is used to provide a stable power supply for the entire system and ensure the normal operation of each module;

[0059] Alarm module: When the system detects an abnormal situation, including pipeline leakage or excessive vibration, the module will immediately trigger the alarm mechanism and notify the user or pipeline maintenance personnel through sound, light flash, and SMS;

[0060] The display module displays the system's operating status, monitoring data, and alarm information in real time through a screen or terminal device, making it convenient for users or maintenance personnel to operate and manage.

[0061] Preferably, the data acquisition module includes a temperature sensor and a vibration sensor laid along the pipeline.

[0062] Preferably, the data preprocessing module comprises a signal amplifying circuit module, a filtering module and an analog-to-digital conversion module, and the data acquisition module is connected to the controller module via the signal amplifying circuit module, the filtering module and the analog-to-digital conversion module in sequence.

[0063] like Figure 2As shown, the signal amplification circuit module and the filtering module specifically include a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first operational amplifier, a second operational amplifier, and a third operational amplifier, wherein the signal input -IN terminal is connected to one end of the first resistor, the other end of the first resistor is respectively connected to one end of the first capacitor, one end of the third resistor and the negative power supply pin of the first operational amplifier, the other end of the first capacitor is respectively connected to the other end of the third resistor and the output pin of the first operational amplifier, the signal input +IN terminal is connected to one end of the second resistor, and the other end of the second resistor is respectively connected to the positive power supply pin of the first operational amplifier, the positive power supply pin of the third resistor and the output pin of the first operational amplifier. One end of the fourth resistor and one end of the second capacitor, the other end of the second capacitor is connected to the other end of the fourth resistor and grounded, the output pin of the first operational amplifier is connected to one end of the fifth resistor, the other end of the fifth resistor is connected to the positive power pin of the second operational amplifier, the negative power pin of the second operational amplifier is connected to the negative power pin of the third operational amplifier, the positive power pin of the third operational amplifier is respectively connected to one end of the eighth resistor and one end of the ninth resistor, the other end of the ninth resistor is grounded, the other end of the eighth resistor is respectively connected to one end of the seventh resistor and the output pin of the second operational amplifier, the other end of the seventh resistor is connected to one end of the fourth capacitor, the other end of the fourth capacitor is respectively connected to one end of the ninth resistor, the other end of the ninth resistor is connected to one end of the third capacitor, and the other end of the third capacitor is grounded.

[0064] The signal amplification circuit module and the filtering module of the present invention amplify and filter the data taken and then input them into the signal conversion circuit, which greatly reduces the signal noise and signal loss in the measurement. The signal amplification circuit module part is an amplifier circuit composed of an OPA277 operational amplifier and a resistor and capacitor. The circuit is a typical differential amplifier circuit. At the same time, C3 and R6, C4 and R7 form a low-pass filter. The dual op amp bandpass filter is composed of two OPA277 operational amplifiers. The Q value and center frequency of the filter module bandpass filter of this design are adjustable. The resonant frequency of the circuit can be adjusted by adjusting R9, and the Q value of the circuit can be adjusted by adjusting R8. It is worth noting that the temperature sensor and the vibration sensor output the collected temperature and vibration signals to the signal processing circuit and then input them into AD7794 for digital-to-analog conversion, converting the analog signal into a digital signal, which is conducive to the long-distance wireless transmission of the signal. It is worth noting that the noise of the analog-to-digital converter AD7794 is only 40nV, and the power consumption current is only 400μA, which is particularly suitable for applications requiring low power consumption and high-precision measurement.

[0065] Preferably, the distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host include a GIS module for realizing GIS functions, including map rendering, coordinate conversion, and abnormal point marking.

[0066] Preferably, the data transmission module includes an Ethernet interface card and a wireless communication module; the wireless communication module includes a Wi-Fi module and a 4G / 5G module.

[0067] Preferably, the display module includes a user interface circuit, which is responsible for realizing the interaction between the user and the system; including a display interface circuit, a touch screen interface circuit, and a keyboard / mouse interface circuit; the user interface circuit will receive data from the data processing circuit and present it to the user in an easy-to-understand manner.

[0068] like Figure 3 As shown, the power supply module includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a first inductor L1, a second inductor L2, a first diode D1, a second diode D2, a third diode D3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a fifth electrolytic capacitor E5, a first switching power supply chip U1, a second switching power supply chip U2, a voltage stabilizing chip U3, a voltage input terminal, a first voltage output terminal, a second voltage output terminal, and a third voltage output terminal;

[0069] The voltage input terminal is connected to the positive electrode of the diode D1, and the negative electrode of the diode D1 is respectively connected to one end of the third capacitor C3, the positive electrode of the first electrolytic capacitor E1, one end of the first resistor R1, and the pin 6 of the first switching power supply U1;

[0070] The other end of the first resistor R1 is respectively connected to the pin 7 of the first switch power chip U1, the pin 8 of the first switch power chip U1 and the pin 1 of the first switch power chip U1;

[0071] Pin 2 of the first switch power chip U1 is connected to the cathode of the second diode D2 and one end of the first inductor L1 respectively;

[0072] The other end of the first inductor L1 is respectively connected to the positive electrode of the first electrolytic capacitor E1, one end of the first capacitor C1 and the first voltage output end;

[0073] The other end of the first capacitor C1 is respectively connected to the cathode of the first electrolytic capacitor E1, the anode of the second diode D2, one end of the fourth capacitor C4, the pin 4 of the first switching power chip U1, one end of the fifth resistor R5, the cathode of the third electrolytic capacitor E3 and the other end of the third capacitor C3;

[0074] The other end of the fourth capacitor C4 is connected to the pin 3 of the first switch power chip U1;

[0075] The other end of the fifth resistor R5 is respectively connected to the pin 5 of the first switch power chip U1 and one end of the third resistor R3;

[0076] The other end of the third resistor R3 is connected to the first voltage output end;

[0077] The other end of the third capacitor C3 is also connected to one end of the fifth capacitor C5, the positive electrode of the fourth electrolytic capacitor E4, one end of the second resistor R2, and the pin 6 of the second switch power chip U2;

[0078] The other end of the second resistor R2 is respectively connected to the pin 7 of the second switch power chip U2, the pin 8 of the second switch power chip U2 and the pin 1 of the second switch power chip U2;

[0079] Pin 2 of the second switch power chip U2 is connected to the cathode of the second diode D3 and one end of the second inductor L2 respectively;

[0080] The other end of the second inductor L2 is respectively connected to the positive electrode of the second electrolytic capacitor E2, one end of the second capacitor C2, the second voltage output end and the pin 3 of the voltage stabilizing chip U3;

[0081] The other end of the second capacitor C2 is respectively connected to the pin 1 of the voltage stabilizing chip U3, the negative electrode of the fifth capacitor E5, one end of the seventh capacitor C7, the negative electrode of the second electrolytic capacitor E2, the positive electrode of the third diode D3, one end of the sixth capacitor C6, the pin 4 of the second switching power chip U2, one end of the sixth resistor R6, the negative electrode of the fourth electrolytic capacitor E4 and the other end of the fifth capacitor C5;

[0082] The other end of the sixth capacitor C6 is connected to the pin 3 of the second switch power chip U2, the other end of the sixth resistor R6 is respectively connected to the pin 5 of the second switch power chip U2 and one end of the fourth resistor R4, and the other end of the fourth resistor R4 is connected to the second voltage output terminal;

[0083] The other end of the seventh capacitor C7 is respectively connected to the positive electrode of the electrolytic capacitor E5, the pin 2 of the voltage stabilizing chip U3, the pin 4 of the voltage stabilizing chip U3 and the third voltage output terminal.

[0084] Preferably, the voltage of the first voltage output terminal is +12V, the voltage of the second voltage output terminal is +5V, and the voltage of the third voltage output terminal is +3.3V.

[0085] This circuit is not only small in size, high in efficiency, precise in voltage regulation and low in interference, but can also convert the input voltage into +12V, +5V and +3.3V DC power through the first switching power supply, the second switching power supply and the voltage regulator chip, providing +12V, +5V and +3.3V DC voltages, and can provide power supply for multiple chips and circuits at the same time.

[0086] The chip models of the first switching power supply chip U1 and the second switching power supply are both MC33063.

[0087] MC33063 Chinese data pin function application circuit

[0088] MC34063A (MC33063) integrated circuit chip device introduction: The device itself contains the main functions required by the DC / DC converter monolithic control circuit and is inexpensive.

[0089] MC34063A (MC33063) Integrated Circuit Chip Device Introduction This device contains the main functions of the DC / DC converter in a single-chip control circuit and is inexpensive. It consists of a reference voltage generator with automatic temperature compensation function, a comparator, an oscillator with controllable duty cycle, an R-S trigger, and a high-current output switch circuit. This device can be used as the control core of a boost converter, a buck converter, and an inverter. The DC / DC converter formed by it uses only a small number of external components. It is mainly used in systems based on microprocessors (MPUs) or single-chip microcomputers (MCUs).

[0090] Main features of MC34063 integrated circuit: Input voltage range: 2.5~40V Output voltage adjustable range: 1.25~40V Output current up to: 1.5A Operating frequency: up to 100kHz Low quiescent current Short-circuit current limit Can realize step-up or step-down power converter.

[0091] The chip model of the voltage stabilizing chip U3 is ASM1117.

[0092] ASM1117 is a voltage regulator chip suitable for high-efficiency linear voltage regulators, switching power supply regulators, battery chargers, active small computer system interface terminals, notebook computer power management, and battery-powered instruments. Chip is a general term for semiconductor component products, or microcircuit, microchip, wafer, integrated circuit. In electronics, it is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of semiconductor wafers.

[0093] The third resistor R3, the fourth resistor R4, the fifth resistor R5 and the sixth resistor R6 are all voltage-dividing resistors, and the resistance of the third resistor R3 is 4.3 kilo-ohms, the resistance of the fourth resistor R4 is 3.6 kilo-ohms, and the resistance of the fifth resistor R5 is 5.1 kilo-ohms.

[0094] The resistance value of the first resistor R1 is 0.2 ohms, the resistance value of the fourth resistor R4 is 3.6 kilo-ohms, and the resistance value of the sixth resistor R6 is 1.2 kilo-ohms.

[0095] like Figure 4 FIG. 1 is a schematic diagram of the installation of the composite sensing optical cable of the present invention.

[0096] The real-time monitoring system for the temperature and vibration of thermal pipelines of the present invention adopts distributed optical fiber sensing technology and has the advantages of real-time monitoring, high precision, high reliability, etc. The system can monitor the temperature and vibration of thermal pipelines in real time, timely discover and deal with potential safety hazards, and ensure the safety of urban heating. The system is also equipped with professional operation and maintenance technicians to ensure the stable operation and timely maintenance of the system. The key points of the real-time monitoring system for the temperature and vibration of thermal pipelines are its real-time monitoring and data analysis, GIS function, alarm and fault indication, unified management and report output, and system stability and adaptability. The effective combination of key points will provide a strong guarantee for the safe operation of thermal pipelines.

[0097] Real-time monitoring and data analysis: The system needs to be able to obtain temperature anomaly information and vibration anomaly signals along the pipeline in real time, and through powerful data analysis functions, capture pipeline leakage characteristics in real time to ensure a comprehensive understanding of the operating status of the thermal pipeline;

[0098] GIS function: The system should be based on the B / S architecture concept and combined with cloud technology to realize the visualization of online monitoring of the pipe network; through the GIS function, the operation status of the entire thermal pipe network can be displayed on the map, and the geographical location information of abnormal points can be clearly indicated, so as to facilitate timely inspection and treatment by pipeline maintenance personnel;

[0099] Alarm and fault indication: When the system detects abnormal temperature or vibration, it should promptly send out an alarm signal and locate and mark the location of the accident in GIS; this helps to quickly identify and handle potential safety issues and avoid major accidents;

[0100] Unified management and report output: The system should manage the pipe network monitoring equipment information, monitoring data, alarm data, operation and maintenance data in a unified manner and form a unified report; this will help to conduct long-term data analysis and trend forecasting, and provide strong support for the safe operation of thermal pipelines;

[0101] System stability and adaptability: Taking into account different meteorological conditions, such as extreme high temperature, low temperature, rainfall, etc., the system should have good stability and adaptability to ensure stable operation under various environmental conditions and provide continuous protection for the safe operation of thermal pipelines.

[0102] In addition, the system is equipped with professional operation and maintenance technicians who are responsible for the operation, maintenance and upgrade of the system. The system can also generate completion data and drawings to facilitate users to install, program, debug and maintain.

[0103] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0104] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0105] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0106] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless defined as herein.

[0107] The above embodiments are only for explaining the technical idea of ​​the present invention, and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution according to the technical idea proposed by the present invention shall fall within the protection scope of the present invention. The above embodiments of the present invention are described in detail, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the field without departing from the purpose of the present invention.

Claims

1. Real-time monitoring system for temperature and vibration of thermal pipelines, characterized by: It comprises a data acquisition module, a data preprocessing module, a distributed optical fiber leakage monitoring host, a distributed optical fiber vibration monitoring host, a controller module, a data transmission module, a power supply module, an alarm module, and a display module; the data acquisition module is connected to the controller module through the data preprocessing module, and the data transmission module, the power supply module, the alarm module, and the display module are respectively connected to the controller module; the distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are respectively connected to the controller module; The data acquisition module is used to collect temperature signals and vibration signals along the pipeline in real time through the composite sensing optical cable laid in parallel along the pipeline; The data preprocessing module is used to preprocess the raw data received from the data acquisition module, including data cleaning, denoising, format conversion, etc., to ensure the accuracy of subsequent data analysis; The distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host are used to receive the pre-processed temperature signal and vibration signal respectively; the distributed optical fiber leakage monitoring host analyzes the temperature signal and monitors the temperature change along the pipeline, thereby discovering the leakage of the thermal pipeline, the decay of the thermal insulation performance, etc.; the distributed optical fiber vibration monitoring host analyzes the vibration signal and monitors the vibration along the pipeline, thereby discovering the vibration problem of the thermal pipeline; The controller module is responsible for the operation control of the entire system, including the triggering of data acquisition, the scheduling of preprocessing programs, the monitoring of the host, and the data exchange with other modules; Data transmission module, used to transmit processed data to the system monitoring center or user terminal by wired or wireless means to realize remote monitoring and data sharing; The power supply module is used to provide a stable power supply for the entire system and ensure the normal operation of each module; Alarm module: When the system detects an abnormal situation, including pipeline leakage or excessive vibration, the module will immediately trigger the alarm mechanism and notify the user or pipeline maintenance personnel through sound, light flash, and SMS; The display module displays the system's operating status, monitoring data, and alarm information in real time through a screen or terminal device, making it convenient for users or maintenance personnel to operate and manage.

2. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized in that: The data acquisition module includes a temperature sensor and a vibration sensor laid along the pipeline.

3. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized in that: The data preprocessing module comprises a signal amplifying circuit module, a filtering module and an analog-to-digital conversion module, and the data acquisition module is connected to the controller module via the signal amplifying circuit module, the filtering module and the analog-to-digital conversion module in sequence.

4. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 3 is characterized in that: The signal amplification circuit module and the filtering module specifically include a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first operational amplifier, a second operational amplifier, and a third operational amplifier, wherein the signal input -IN terminal is connected to one end of the first resistor, the other end of the first resistor is respectively connected to one end of the first capacitor, one end of the third resistor and the negative power supply pin of the first operational amplifier, the other end of the first capacitor is respectively connected to the other end of the third resistor and the output pin of the first operational amplifier, the signal input +IN terminal is connected to one end of the second resistor, and the other end of the second resistor is respectively connected to the positive power supply pin of the first operational amplifier, the positive power supply pin of the fourth resistor, and the positive power supply pin of the first operational amplifier. The output pin of the first operational amplifier is connected to one end of the fifth resistor, the other end of the fifth resistor is connected to the positive power pin of the second operational amplifier, the negative power pin of the second operational amplifier is connected to the negative power pin of the third operational amplifier, the positive power pin of the third operational amplifier is respectively connected to one end of the eighth resistor and one end of the ninth resistor, the other end of the ninth resistor is grounded, the other end of the eighth resistor is respectively connected to one end of the seventh resistor and the output pin of the second operational amplifier, the other end of the seventh resistor is connected to one end of the fourth capacitor, the other end of the fourth capacitor is respectively connected to one end of the ninth resistor, the other end of the ninth resistor is connected to one end of the third capacitor, and the other end of the third capacitor is grounded.

5. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized in that: The distributed optical fiber leakage monitoring host and the distributed optical fiber vibration monitoring host include a GIS module for realizing GIS functions, including map rendering, coordinate conversion, and abnormal point marking.

6. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized by: The data transmission module includes an Ethernet interface card and a wireless communication module; the wireless communication module includes a Wi-Fi module and a 4G / 5G module.

7. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized in that: The display module includes a user interface circuit, which is responsible for realizing the interaction between the user and the system; including a display interface circuit, a touch screen interface circuit, and a keyboard / mouse interface circuit; The user interface circuitry will receive the data from the data processing circuitry and present it to the user in an easily understandable manner.

8. The real-time monitoring system for temperature and vibration of thermal pipelines according to claim 1 is characterized by: The power supply module includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a first inductor L1, a second inductor L2, a first diode D1, a second diode D2, a third diode D3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a fifth electrolytic capacitor E5, a first switching power supply chip U1, a second switching power supply chip U2, a voltage stabilizing chip U3, a voltage input terminal, a first voltage output terminal, a second voltage output terminal, and a third voltage output terminal; The voltage input terminal is connected to the positive electrode of the diode D1, and the negative electrode of the diode D1 is respectively connected to one end of the third capacitor C3, the positive electrode of the first electrolytic capacitor E1, one end of the first resistor R1, and the pin 6 of the first switching power supply U1; The other end of the first resistor R1 is respectively connected to the pin 7 of the first switch power chip U1, the pin 8 of the first switch power chip U1 and the pin 1 of the first switch power chip U1; Pin 2 of the first switch power chip U1 is connected to the cathode of the second diode D2 and one end of the first inductor L1 respectively; The other end of the first inductor L1 is respectively connected to the positive electrode of the first electrolytic capacitor E1, one end of the first capacitor C1 and the first voltage output end; The other end of the first capacitor C1 is respectively connected to the cathode of the first electrolytic capacitor E1, the anode of the second diode D2, one end of the fourth capacitor C4, the pin 4 of the first switching power chip U1, one end of the fifth resistor R5, the cathode of the third electrolytic capacitor E3 and the other end of the third capacitor C3; The other end of the fourth capacitor C4 is connected to the pin 3 of the first switch power chip U1; The other end of the fifth resistor R5 is respectively connected to the pin 5 of the first switch power chip U1 and one end of the third resistor R3; The other end of the third resistor R3 is connected to the first voltage output end; The other end of the third capacitor C3 is also connected to one end of the fifth capacitor C5, the positive electrode of the fourth electrolytic capacitor E4, one end of the second resistor R2, and the pin 6 of the second switch power chip U2; The other end of the second resistor R2 is respectively connected to the pin 7 of the second switch power chip U2, the pin 8 of the second switch power chip U2 and the pin 1 of the second switch power chip U2; Pin 2 of the second switch power chip U2 is connected to the cathode of the second diode D3 and one end of the second inductor L2 respectively; The other end of the second inductor L2 is respectively connected to the positive electrode of the second electrolytic capacitor E2, one end of the second capacitor C2, the second voltage output end and the pin 3 of the voltage stabilizing chip U3; The other end of the second capacitor C2 is respectively connected to the pin 1 of the voltage stabilizing chip U3, the negative electrode of the fifth capacitor E5, one end of the seventh capacitor C7, the negative electrode of the second electrolytic capacitor E2, the positive electrode of the third diode D3, one end of the sixth capacitor C6, the pin 4 of the second switching power chip U2, one end of the sixth resistor R6, the negative electrode of the fourth electrolytic capacitor E4 and the other end of the fifth capacitor C5; The other end of the sixth capacitor C6 is connected to the pin 3 of the second switch power chip U2, the other end of the sixth resistor R6 is respectively connected to the pin 5 of the second switch power chip U2 and one end of the fourth resistor R4, and the other end of the fourth resistor R4 is connected to the second voltage output terminal; The other end of the seventh capacitor C7 is respectively connected to the positive electrode of the electrolytic capacitor E5, the pin 2 of the voltage stabilizing chip U3, the pin 4 of the voltage stabilizing chip U3 and the third voltage output terminal.

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