Array type flexible pressure sensor with rigid contacts and preparation method thereof

By designing an array structure with rigid contacts in a flexible pressure sensor, the problem of reducing measurement accuracy caused by bending and stretching of the sensing point is solved, and higher measurement accuracy and applicability are achieved.

CN119533720APending Publication Date: 2025-02-28BEIJING INST OF TECH
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Patent Information

Application Number
CN202411650864.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-19
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

Currently, the measurement accuracy of most flexible pressure sensors will be reduced due to bending and stretching of the sensor point.

Method used

An array-type flexible pressure sensor with rigid contacts is designed, which is made of a stack of multiple layers of materials, including a flexible base layer, an electrode array film layer, a pressure-sensitive array film layer, a second electrode array film layer and a rigid contact layer. The rigid contact layer contains a plurality of rigid gaskets, each gasket position covering multiple electrode units to avoid bending and stretching of the sensing point.

Benefits of technology

By adding rigid contacts, the sensor does not bending and stretch when measuring surface objects, avoiding output errors and ensuring measurement accuracy. At the same time, the high-density array design overcomes the problems of poor adaptability and accuracy of a single rigid pressure sensor being affected by the pressure area.

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Abstract

The invention provides an array type flexible pressure sensor with rigid contacts and a preparation method of the array type flexible pressure sensor. The sensor comprises a first flexible substrate layer, a first electrode array film layer, a pressure-sensitive array film layer, a second electrode array film layer, a second flexible substrate layer and a first rigid contact layer from bottom to top, the first rigid contact layer comprises a plurality of rigid gaskets, and each rigid gasket covers one or more electrode units. When the array type flexible pressure sensor measures a curved surface object, the sensing point where the rigid contact is located is not bent and stretched, so that the measurement accuracy of the sensor is ensured. When each rigid gasket covers a plurality of electrode units, the high-density array can overcome the defects that the adaptability is poor and the precision is influenced by the pressure area due to a single rigid pressure sensor. And the stress direction of the sensor can be calculated through different pressures of the sensing points, so that the pressure is corrected, and the mechanical precision of the sensor in use is ensured.
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Description

Technical Field

[0001] The present invention relates to the technical field of flexible sensors, and in particular to an array-type flexible pressure sensor with rigid contacts and a preparation method thereof. Background Art

[0002] With the continuous development of the Internet of Things and intelligent algorithms, the portability, integration and intelligence of electronic sensors are also constantly improving. Among them, wearable flexible sensors developed using flexible electronic devices have become a research hotspot. Unlike traditional sensors, flexible sensors have excellent stretching and bending properties, can fit with human skin for a long time, and realize long-term real-time detection of human motion status and physiological indicators. They are widely used in fields such as health indicator detection, bionic robot design, and aerospace.

[0003] As one of the main applications of flexible sensors, unlike rigid pressure sensors, flexible pressure sensors can achieve long-lasting pressure change detection with the advantages of easy stretching, easy bending and excellent biocompatibility, providing a convenient and intelligent technical path for the analysis of human physiological indicators. At present, flexible pressure sensors are roughly divided into three types: piezoresistive, piezoelectric and capacitive. With the continuous advancement of artificial intelligence technology, higher requirements are placed on the measurement accuracy, detection range and sensitivity of flexible pressure sensors in the fields of wearable medical testing, intelligent manufacturing, human-computer interaction, etc. Summary of the invention

[0004] In view of this, the present invention provides an array-type flexible pressure sensor with rigid contacts and a preparation method thereof, which can solve the problem that the measurement accuracy of most current flexible pressure sensors is reduced due to bending and stretching of the sensing points.

[0005] In order to solve the above technical problems, the present invention is implemented as follows.

[0006] An array-type flexible pressure sensor with rigid contacts, the sensor comprising, from bottom to top, a first flexible substrate layer, a first electrode array film layer, a pressure-sensitive array film layer, a second electrode array film layer, a second flexible substrate layer and a first rigid contact layer;

[0007] The first rigid contact layer includes a plurality of rigid gaskets, and each rigid gasket position covers an electrode unit in an m×n electrode array, where m and n are both positive integers.

[0008] Preferably, each rigid gasket position covers 2×2 electrode units.

[0009] Preferably, the first flexible substrate layer is further connected to a second rigid contact layer, and the rigid pads in the second rigid contact layer are located opposite to the rigid pads in the first rigid contact layer.

[0010] Preferably, adjacent electrode units in the first electrode array thin film layer are connected laterally, and adjacent electrode units in the second electrode array thin film layer are connected longitudinally; or, adjacent electrode units in the first electrode array thin film layer are connected longitudinally, and adjacent electrode units in the second electrode array thin film layer are connected laterally.

[0011] Preferably, the first flexible substrate layer and the second flexible substrate layer are made of polydimethylsiloxane flexible substrate; the first electrode array film layer and the second electrode array film layer are made of nanosilver conductive film; the pressure sensitive array film layer is made of carbon nanotube film; and the rigid gasket is made of polymethyl methacrylate material.

[0012] Preferably, the electrode unit is a square with a side length of 4 mm, and the width of the connecting wire between adjacent squares is 0.5 mm; the thickness of the polydimethylsiloxane flexible substrate is 1 mm; the thickness of the nanosilver conductive film is 100-150 nm; the thickness of the carbon nanotube film is 10-20 μm; the rigid gasket is square and 1 mm thick.

[0013] Preferably, the pressure F exerted on the rigid gasket and the angle θ with the normal line of the rigid gasket are:

[0014]

[0015] Among them, F i is the pressure measured by the ith electrode unit under the rigid gasket, S is the area of ​​a single electrode unit, and Δd is the maximum force (max) measured by each electrode unit under the rigid gasket. i ) and minimum force min(F i ) corresponds to the distance between the two electrode units.

[0016] The present invention also provides a method for preparing an array-type flexible pressure sensor with rigid contacts, which is used to prepare the array-type flexible pressure sensor with rigid contacts, and the method comprises:

[0017] Step 1: preparing a flexible substrate;

[0018] Step 2: Printing nanosilver material on a flexible substrate to obtain an electrode array thin film layer; connecting laterally adjacent electrode units in the electrode array thin film layer;

[0019] Two groups of flexible components having electrode arrays and flexible substrates are prepared by the method of step 1 and step 2, which are divided into a first flexible component and a second flexible component;

[0020] Step 3: preparing a carbon nanotube film on the electrode array film of the first flexible component to obtain a first flexible component having a pressure-sensitive array film layer;

[0021] Step 4: intersecting and aligning the first flexible component and the second flexible component and then drying them to obtain a flexible pressure sensor array;

[0022] Step 5: Adhere the rigid gasket to the pressure-sensitive points of the flexible pressure sensor array to obtain an array-type flexible pressure sensor with rigid contacts.

[0023] Preferably, the step 1 specifically comprises: mixing polydimethylsiloxane with a curing agent, placing the mixture in a vacuum environment for degassing, pouring the mixture into an aluminum alloy mold and heating and curing the mixture, and peeling the mixture from the mold to obtain a polydimethylsiloxane flexible substrate;

[0024] The step 2 specifically comprises: printing the nanosilver material on the polydimethylsiloxane flexible substrate by screen printing to form an array-shaped electrode film, further drying and curing the electrode film to fix the electrode film on the polydimethylsiloxane flexible substrate to obtain an electrode array film layer; connecting the electrode units adjacent to each other in the electrode array film layer;

[0025] The step 3 specifically comprises: printing the carbon nanotube solution on the electrode array film of the first flexible component by screen printing to form a carbon nanotube film, and further drying and curing the carbon nanotubes to fix the carbon nanotubes on the electrodes to obtain the first flexible component with a pressure-sensitive array film layer;

[0026] The step 5 specifically includes: using laser to process polymethyl methacrylate material with double-sided tape to obtain a rigid gasket, adhering it to the pressure-sensitive points of the flexible pressure sensor array, and obtaining an array-type flexible pressure sensor with rigid contacts.

[0027] Preferably, the curing agent in step 1 is aniline methyl triethoxysilane, and the added amount is 8-10% of the mass of polydimethylsiloxane; and the concentration of the carbon nanotube solution in step 3 is 6-10wt%.

[0028] Beneficial effects:

[0029] (1) The present invention adds rigid contacts to the array-type flexible pressure sensor. When the array-type flexible pressure sensor measures a curved surface object, the sensing point where the rigid contacts are located does not bend or stretch, thereby overcoming the output error caused by bending and stretching during actual use and ensuring the accuracy of the sensor measurement. In addition, the high-density array of array-type flexible pressure sensors with rigid contacts can overcome the shortcomings of poor adaptability and accuracy affected by the pressure area brought by a single rigid pressure sensor.

[0030] (2) In a preferred embodiment, the rigid gasket covers multiple sensing points (i.e., electrode units). The different pressures at each sensing point can be used to calculate the force direction of the sensor, and then the pressure calculation can be corrected, thereby ensuring the mechanical accuracy of the sensor during use.

[0031] (3) In a preferred embodiment, rigid contact layers are prepared on both sides of the array-type flexible pressure sensor so that the force can be better concentrated in the force-sensitive area.

[0032] (4) In a preferred embodiment, the carbon nanotube solution is deposited on the silver electrode by screen printing, so that the carbon nanotubes can be evenly distributed on the silver electrode to form a dense pressure-sensitive conductive layer, thereby ensuring the stability of the sensor. When there is no pressure, the pressure-sensitive conductive layer is relatively sparse and has low conductivity, which can maintain the ultra-high resistance of the sensor. When pressure is applied, the contact area between the pressure-sensitive conductive layer and the electrode increases, and the resistance of the sensor decreases, thereby ensuring the ultra-high sensitivity of the sensor.

[0033] (5) Both the polydimethylsiloxane substrate and the silver conductive electrode film are bendable materials with good ductility, while the carbon nanotube film with relatively poor ductility is sandwiched between the two electrode films, making the entire sensor system more flexible and able to withstand bending deformation.

[0034] (6) The connection directions of the electrode units in the two-layer electrode array thin film layer are perpendicular. Signals can be applied to the transverse electrodes in sequence and in a time-sharing manner, and the output signals can be collected on the longitudinal electrodes. In this way, the size signal values ​​of the cross-point sensor array can be measured, thereby reducing various interferences such as the poor bending sensitivity effect, the local force effect, and the lateral force interference effect.

[0035] (7) The preparation method and process of the present invention are simple, convenient, easy to control, and can be realized in industrial production.

[0036] (8) The array-type flexible pressure sensor with rigid contacts produced by the present invention has good flexibility and high sensitivity, can overcome the influence of bending and stretching, has high accuracy, and is suitable for use as an electronic skin pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The rigid contact bending diagram of the array-type flexible pressure sensor with rigid contacts and the flexible contact bending diagram of the common flexible sensor provided in the example of the present invention.

[0038] Figure 2 A cross-sectional view of an array-type flexible pressure sensor with rigid contacts provided in an example of the present invention.

[0039] Figure 3 A cross-sectional view of an array-type flexible pressure sensor with rigid contacts provided in an example of the present invention.

[0040] Figure 4 This is a comparison chart of different force modes of flexible contacts of ordinary flexible sensors.

[0041] Figure 5Different force direction diagrams of an array-type flexible pressure sensor with rigid contacts provided in an example of the present invention.

[0042] Figure 6 A flow chart for preparing an array-type flexible pressure sensor with rigid contacts provided in an example of the present invention.

[0043] Figure 7 An electrode reading circuit diagram of an array-type flexible pressure sensor with rigid contacts provided in an example of the present invention. DETAILED DESCRIPTION

[0044] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0045] The present invention provides an array type flexible pressure sensor with rigid contacts. The basic idea is to add rigid contacts on the contact surface based on the array type flexible pressure sensor. When the array type flexible pressure sensor measures a curved surface object, such as Figure 1 As shown in the figure, the sensing point where the rigid contact is located does not bend or stretch, while the flexible pressure sensor used in the prior art will bend at the sensitive point, and the measurement accuracy will be reduced due to the bending and stretching of the sensing point. Therefore, the solution of the present invention can overcome the output error caused by bending and stretching during actual use, and ensure the accuracy of sensor measurement. At the same time, the rigid contact can avoid stress concentration, such as Figure 4 As shown, pressure is applied evenly to the sensitive points.

[0046] Furthermore, rigid contact layers are prepared on both sides of the flexible pressure sensor to better concentrate the force on the force-sensitive area, further improving the accuracy of sensor measurement.

[0047] The array-type flexible pressure sensor of the present invention has a simple manufacturing process, has both rigid contacts and a flexible substrate, has good adaptability, and has high precision and sensitivity, and is suitable for use as an electronic skin pressure sensor.

[0048] Figure 2 and Figure 3 The cross-sectional view and the sectional view of the array-type flexible pressure sensor with rigid contacts provided by the examples of the present invention are shown respectively. As shown in the figure, the array-type flexible pressure sensor of the present invention is stacked by multiple layers of materials, including from bottom to top a first flexible substrate layer 1, a first electrode array film layer 2, a pressure-sensitive array film layer 3, a second electrode array film layer 4, a second flexible substrate layer 5 and a first rigid contact layer 6. Preferably, the first flexible substrate layer 1 is further connected to a second rigid contact layer 7, and the rigid gasket in the second rigid contact layer 7 is opposite to the rigid gasket in the first rigid contact layer.

[0049] Among them, the flexible base layer material is preferably polydimethylsiloxane; the electrode array film layer material is preferably nanosilver material; the pressure-sensitive array film layer material is preferably carbon nanotubes, and the contact resistance change of the array film pressure-sensitive layer is used as a signal of induced pressure. The rigid contact layer material adopts a rigid material, which is not easy to deform or deform when subjected to external force. In the present invention, the elastic modulus is used as a measure of the rigidity of an object, that is, stiffness. The stiffness of the flexible substrate PDMS (polydimethylsiloxane) is about 1MPa. In the present invention, the stiffness of the rigid gasket needs to reach the GPa level. High molecular polymers such as polyethylene, polypropylene, nylon, etc. can be used, and organic glass, metal, etc. can also be selected. Polymethyl methacrylate (PMMA) is preferred, and the stiffness is about 3GPa.

[0050] In the present invention, the first rigid contact layer includes a plurality of rigid pads, each of which covers m×n electrode units in the electrode array, where m and n are both positive integers. When m×n>1, each rigid contact covers the sensing point array, such as Figure 5 As shown in FIG. 1 , the same force F is applied to a rigid gasket. Since the direction is not perpendicular to the surface of the rigid gasket, the electrodes below receive different pressures. The different pressures at each sensing point can be used to calculate the force direction of the sensor, and then the pressure calculation can be corrected, thereby ensuring the mechanical accuracy of the sensor during use. In this preferred embodiment, Figure 2 and Figure 3 As shown, each rigid gasket position covers 2×2 electrode units, taking into account both the accuracy and the influence of the rigid gasket on the curvature.

[0051] The specific calculation of pressure is as follows: the pressure F on the rigid gasket and the angle θ between the pressure and the normal line of the rigid gasket can be calculated by the following formula:

[0052]

[0053] Among them, F i It is the pressure measured by the i-th electrode unit (piezoresistance element) under the rigid gasket.

[0054] The formula derivation process is as follows:

[0055] Calculate the force angle θ from the stress-strain relationship

[0056] σ=Eε

[0057]

[0058]

[0059] Calculating pressure from force vector decomposition

[0060]

[0061] Among them, σ is the stress of PDMS, E is the elastic modulus of PDMS, ε is the strain of PDMS, and F i is the force measured by the ith electrode unit, S is the area of ​​a single electrode unit, and Δd is max(F i ) and min(F i ) is determined by the actual array used and the stress conditions.

[0062] In a preferred embodiment, adjacent electrode units in the first electrode array thin film layer are connected laterally (eg Figure 3 The adjacent electrode units in the second electrode array thin film layer are connected longitudinally; or the adjacent electrode units in the first electrode array thin film layer are connected longitudinally (as shown in the third layer of the second electrode array thin film layer). Figure 2 The adjacent electrode units in the second electrode array thin film layer are connected laterally (as shown in the first layer of FIG. Figure 3 In this way, the connection directions of the electrode units in the two-layer electrode array thin film layer are perpendicular, and signals can be applied to the transverse electrodes in sequence and in time, and the output signals can be collected on the longitudinal electrodes. In this way, the size signal value of the cross-point sensor array can be measured, and various interferences such as the poor bending sensitivity effect, the local force effect, and the lateral force interference effect can be weakened.

[0063] In one example, the electrode unit is a square with a side length of 4 mm, the width of the connecting wire between adjacent squares is 0.5 mm; the thickness of the polydimethylsiloxane flexible substrate is 1 mm; the thickness of the nanosilver conductive film is 100-150 nm; the thickness of the carbon nanotube film is 10-20 μm; the rigid gasket is square and 1 mm thick.

[0064] The present invention also provides a method for preparing an array-type flexible pressure sensor with rigid contacts, such as Figure 6 As shown, the following steps are included:

[0065] Step 1: Preparing flexible substrate layers: a first flexible substrate layer and a second flexible substrate layer

[0066] In this embodiment, the material used for the flexible base layer is the polymer material polydimethylsiloxane, which is a polymer organic silicon compound that is non-toxic, hydrophobic and waterproof, an inert substance, non-flammable, transparent and highly elastic, and can ensure that the sensor has good flexibility and deformation ability.

[0067] The specific steps of preparing the flexible substrate layer are: fully mixing polydimethylsiloxane and a curing agent, placing the mixture in a vacuum environment for degassing, pouring the mixture into an aluminum alloy mold and heating and curing the mixture, and peeling the mixture from the mold to obtain a polydimethylsiloxane flexible substrate.

[0068] Preferably, the curing agent is aniline methyl triethoxysilane, and the addition amount is 8-10% of the mass of polydimethylsiloxane, preferably 10%. The heating curing temperature is 80-100°C, and the heating curing time is 2-3h. Preferably, the heating curing temperature is 90°C, and the heating curing time is 2.5h. The flexible substrate is 8cm long, 8cm wide, and 1mm thick.

[0069] Step 2: Preparing electrode array thin film layers: a first electrode array thin film layer and a second electrode array thin film layer

[0070] In this embodiment, the material used for the electrode array thin film layer is nanosilver material, which has excellent conductivity and stability and can improve the signal transmission performance of the electrode.

[0071] The specific steps of preparing the electrode layer are: printing the nanosilver material on the polydimethylsiloxane flexible substrate by screen printing to form an electrode film, and further drying and curing the electrode film to fix the electrode film on the substrate to obtain an electrode array film layer. The electrode units adjacent to each other in the horizontal direction and in the vertical direction in the electrode array film layer are connected.

[0072] Preferably, the thickness of the electrode film is 100-150 nm, preferably 120 nm. The electrode film array consists of 10×10 squares, each square has a side length of 4 mm, and the width of the connecting wire between adjacent squares is 0.5 mm. The drying temperature of this step is 130-150°C, and the drying time is 30-50 min; preferably, the drying temperature is 140°C, and the drying time is 40 min.

[0073] Two groups of flexible components having electrode arrays and flexible substrates are prepared in the manner of step 1 and step 2, which are divided into a first flexible component and a second flexible component.

[0074] Step 3: Preparing the pressure-sensitive layer

[0075] In this embodiment, the material used for the pressure-sensitive layer is carbon nanotubes, whose unique physical, chemical and electronic properties can make the sensor have the advantages of high sensitivity, excellent conductivity and fast response speed.

[0076] The specific steps of preparing the pressure-sensitive layer are as follows: the carbon nanotube solution is printed on the silver electrode film of the first flexible component by screen printing to form a carbon nanotube film, which is further dried and solidified to fix the carbon nanotubes on the electrode to obtain a pressure-sensitive film. At this time, the first flexible component has a pressure-sensitive array film layer.

[0077] Preferably, the concentration of the carbon nanotube solution is 6-10wt%, preferably 8wt%. The thickness of the carbon nanotube film is 10-20μm, preferably 15μm. The drying temperature is 300-320℃, and the drying time is 30-40min; preferably the drying temperature is 310℃, and the drying time is 35min.

[0078] Step 4: Prepare array-type flexible pressure sensors.

[0079] In this embodiment, the upper and lower electrode layers of the first flexible component and the second flexible component are intersected, aligned, and then dried to obtain a flexible pressure sensor array.

[0080] Preferably, the drying temperature is 350-370° C., and the drying time is 20-30 min; preferably, the drying temperature is 360° C., and the drying time is 25 min.

[0081] Step 5: Prepare the array-type flexible pressure sensor with rigid contacts

[0082] In this embodiment, laser processing is used to obtain a polymethyl methacrylate material with double-sided tape to obtain a rigid gasket, which is adhered to the pressure-sensitive points of the flexible pressure sensor array to obtain an array-type flexible pressure sensor with rigid contacts.

[0083] Preferably, the rigid gasket is square with a side length of 12 mm and a thickness of 1 mm, and one rigid gasket covers 4 pressure-sensitive points.

[0084] When the array-type flexible pressure sensor with rigid contacts prepared above is working, it can be used as follows Figure 7 The electrode reading circuit shown includes a microcontroller module, an FPGA (field programmable gate array) module, a DDS (direct digital frequency synthesis) module, a high-speed DAC (digital-to-analog converter) module, a high-speed ADC (analog-to-digital converter) module, a current-to-voltage conversion module, and an analog switch module connected to the two electrode array thin film layers.

[0085] Electrode signal reading method: Establish an AC impedance spectrum model for nanoresistance pressure sensing and construct a sensor readout method based on impedance spectrum. While ensuring the high sensitivity of the nanoresistance sensor, improve stability and further improve accuracy. Measure its impedance spectrum model and find the low-noise measurement frequency point, so that it can achieve the random error of its measurement while ensuring flexibility and wearability.

[0086] <0.5%. Different spectrum signals are generated by FPGA+DDS+DAC, and low-noise measurement is performed using digital phase lock. Various interferences (bending poor sensitivity effect, local force effect, lateral force interference effect, etc.) in the actual use of flexible sensors are optimized to reduce the above interferences, establish impedance models, and achieve highly stable measurements.

[0087] The array-type flexible pressure sensor with rigid contacts described in the example of the present invention uses polydimethylsiloxane material as a flexible substrate, nanosilver material as an electrode layer, carbon nanotube material as a pressure-sensitive layer, and polymethyl methacrylate as a rigid contact. Based on the piezoresistive principle, an array-type flexible pressure sensor with rigid contacts and a pressure measurement function is realized, so that the sensor has high sensitivity, high reliability and high stability, and can calculate the direction of force, overcome interference, and has high mechanical accuracy.

[0088] The embodiments described above are part of the embodiments of the present invention, but not all of them. The detailed description of the embodiments of the present invention is not intended to limit the scope of the invention claimed for protection, but only represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. An array-type flexible pressure sensor with rigid contacts, characterized in that: The sensor comprises, from bottom to top, a first flexible substrate layer, a first electrode array film layer, a pressure-sensitive array film layer, a second electrode array film layer, a second flexible substrate layer and a first rigid contact layer; The first rigid contact layer includes a plurality of rigid gaskets, and each rigid gasket position covers an electrode unit in an m×n electrode array, where m and n are both positive integers.

2. The array-type flexible pressure sensor according to claim 1, characterized in that: Each rigid gasket position covers 2×2 electrode units.

3. The array-type flexible pressure sensor according to claim 1, characterized in that: The first flexible substrate layer is further connected to the second rigid contact layer, and the rigid pads in the second rigid contact layer are located opposite to the rigid pads in the first rigid contact layer.

4. The array-type flexible pressure sensor according to claim 1, characterized in that: Adjacent electrode units in the first electrode array thin film layer are connected laterally, and adjacent electrode units in the second electrode array thin film layer are connected longitudinally; or, adjacent electrode units in the first electrode array thin film layer are connected longitudinally, and adjacent electrode units in the second electrode array thin film layer are connected laterally.

5. The array-type flexible pressure sensor according to any one of claims 1 to 4, characterized in that: The first flexible substrate layer and the second flexible substrate layer are made of polydimethylsiloxane flexible substrate; the first electrode array film layer and the second electrode array film layer are made of nanosilver conductive film; the pressure sensitive array film layer is made of carbon nanotube film; and the rigid gasket is made of polymethyl methacrylate material.

6. The array-type flexible pressure sensor according to any one of claims 5, characterized in that: The electrode unit is a square with a side length of 4mm, and the width of the connecting wire between adjacent squares is 0.5mm; the thickness of the polydimethylsiloxane flexible substrate is 1mm; the thickness of the nanosilver conductive film is 100-150nm; the thickness of the carbon nanotube film is 10-20μm; the rigid gasket is square and 1mm thick.

7. The array-type flexible pressure sensor according to claim 1, characterized in that: The pressure F on the rigid gasket and the angle θ with the normal line of the rigid gasket are: Among them, F i is the pressure measured by the ith electrode unit under the rigid gasket, S is the area of ​​a single electrode unit, and Δd is the maximum force (max) measured by each electrode unit under the rigid gasket. i ) and minimum force min(F i ) corresponds to the distance between the two electrode units.

8. A method for preparing an array-type flexible pressure sensor with rigid contacts, characterized in that: The method for preparing an array-type flexible pressure sensor with rigid contacts as claimed in any one of claims 1 to 6 comprises: Step 1: preparing a flexible substrate; Step 2: Printing nanosilver material on a flexible substrate to obtain an electrode array thin film layer; connecting laterally adjacent electrode units in the electrode array thin film layer; Two groups of flexible components having electrode arrays and flexible substrates are prepared by the method of step 1 and step 2, which are divided into a first flexible component and a second flexible component; Step 3: preparing a carbon nanotube film on the electrode array film of the first flexible component to obtain a first flexible component having a pressure-sensitive array film layer; Step 4: intersecting and aligning the first flexible component and the second flexible component and drying them to obtain a flexible pressure sensor array; Step 5: Adhere the rigid gasket to the pressure-sensitive points of the flexible pressure sensor array to obtain an array-type flexible pressure sensor with rigid contacts.

9. The preparation method according to claim 8, characterized in that: The step 1 specifically comprises: mixing polydimethylsiloxane with a curing agent, placing the mixture in a vacuum environment for degassing, pouring the mixture into an aluminum alloy mold and heating and curing the mixture, and peeling the mixture from the mold to obtain a polydimethylsiloxane flexible substrate; The step 2 specifically comprises: printing the nanosilver material on the polydimethylsiloxane flexible substrate by screen printing to form an electrode film in an array shape, and further drying and curing the electrode film to fix the electrode film on the polydimethylsiloxane flexible substrate to obtain an electrode array film layer; Laterally adjacent electrode units in the electrode array thin film layer are connected; The step 3 specifically comprises: printing the carbon nanotube solution on the electrode array film of the first flexible component by screen printing to form a carbon nanotube film, and further drying and curing the carbon nanotubes to fix the carbon nanotubes on the electrodes to obtain the first flexible component with a pressure-sensitive array film layer; The step 5 specifically includes: using laser to process polymethyl methacrylate material with double-sided tape to obtain a rigid gasket, adhering it to the pressure-sensitive points of the flexible pressure sensor array, and obtaining an array-type flexible pressure sensor with rigid contacts.

10. The preparation method according to claim 9, characterized in that: The curing agent in step 1 is aniline methyl triethoxysilane, and the added amount is 8-10% of the mass of polydimethylsiloxane; the concentration of the carbon nanotube solution in step 3 is 6-10wt%.

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