Thermal management integration module, test system and test method thereof, and vehicle
By designing a test system for thermal management integration modules, using thermal simulation modules and other devices to simulate the operating scenarios of heating devices, the problem of thermal management integration module performance testing in the existing technology is solved, and efficient performance evaluation and research and development acceleration is achieved.
Patent Information
- Application Number
- CN202411787456.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-02-28
AI Technical Summary
In the prior art, performance testing of the thermal management integration module needs to be carried out after the heating device is manufactured, extending the R&D cycle and reducing production efficiency.
Design a test system for thermal management integration modules, and simulate the heating conditions of the heating device in different operating scenarios through thermal simulation modules, heating devices, heat dissipation devices and data acquisition modules, so as to achieve a comprehensive performance evaluation of the thermal management integration module.
Without the need to actually connect the heating device, the thermal management integration module can be comprehensively evaluated, which improves the testing efficiency, lowers the testing threshold, and accelerates the R&D speed.
Smart Images

Figure CN119533966A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of vehicle thermal management, and in particular to a thermal management integrated module and a test system, a test method, and a vehicle thereof. Background Art
[0002] In related technologies, in order to evaluate the performance of the thermal management integrated module, it is first necessary to connect the power battery, motor and other heat-generating devices on the vehicle to the thermal management integrated module, simulate different operating scenarios, and obtain multiple data of the thermal management integrated module to comprehensively evaluate its performance. However, this test method can only perform performance testing after the heat-generating device is manufactured, which prolongs the R&D cycle of the thermal management integrated module and reduces production efficiency. Summary of the invention
[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a test system for a thermal management integrated module, which can simulate the heating conditions of a heating device in different operating scenarios, so that a comprehensive performance evaluation of the thermal management integrated module can be performed without actually connecting the heating device.
[0004] The present invention also provides a testing method, electronic equipment, a thermal management integrated module and a vehicle having the thermal management integrated module.
[0005] According to a first aspect of the present invention, a test system for a thermal management integrated module includes: a test station, a plurality of thermal simulation modules, a heating device, a heat dissipation device and a data acquisition module, wherein the test station is used to install a module under test, and the module under test is the thermal management integrated module; the plurality of thermal simulation modules are respectively connected to the module under test to construct a plurality of first circulation loops, wherein the first circulation loops are used for a first medium to flow, and the plurality of thermal simulation modules can transfer heat to the first medium; the heating device is loaded with a second medium, and the heating device is respectively connected to the plurality of thermal simulation modules to construct a plurality of second circulation loops, wherein the heating device can heat the second medium and transport the heated second medium to the plurality of thermal simulation modules through the plurality of second circulation loops to heat the plurality of thermal simulation modules; the heat dissipation device is connected to the test station, and the heat dissipation device is used to dissipate the heat of the first medium flowing through the module under test, so that the module under test can transport the first medium after heat dissipation to the plurality of thermal simulation modules; the data acquisition module is connected to the test station, and the data acquisition module is used to obtain the working condition information of the module under test.
[0006] The test system of the thermal management integrated module according to the embodiment of the present invention has at least the following beneficial effects: The embodiment of the present invention facilitates the installation of the module under test by configuring a test station; a heating device is provided and connected to multiple thermal simulation modules respectively to construct multiple second circulation loops, a second medium is heated by the heating device, and the heated second medium is transported to the multiple thermal simulation modules through the multiple second circulation loops, so that the multiple thermal simulation modules are heated to a preset temperature to simulate the heating state of the heating device during actual operation; and multiple thermal simulation modules are respectively connected to the module under test to construct multiple first circulation loops, the module under test is connected to a heat dissipation module for dissipating heat from the first medium flowing through the module under test, and the module under test is connected to a heat dissipation module for dissipating heat from the first medium flowing through the module under test through the first circulation loop. The module can transport the first medium after heat dissipation to multiple thermal simulation modules to achieve heat dissipation of multiple thermal simulation modules; then use the data acquisition module to collect the working condition information of the module under test in real time, thereby realizing a comprehensive evaluation of the module under test. Compared with the method that requires connecting to a heating device for testing, by simulating the heating conditions of the heating device in different operating scenarios, a comprehensive performance evaluation of the thermal management integrated module can be performed without actually connecting the heating device, which greatly improves the test efficiency of the thermal management integrated module, lowers the test threshold of the thermal management integrated module, and accelerates the research and development speed of the thermal management integrated module.
[0007] According to some embodiments of the present invention, a second valve body is provided between each thermal simulation module and the module under test, and the second valve body is configured to adjust an opening to control a flow rate and a flow velocity of the first medium flowing through the thermal simulation module. According to some embodiments of the present invention, the heating device is capable of delivering the second medium of the same temperature to each of the thermal simulation modules, and each of the thermal simulation modules is connected to a cooling device, which is used to cool the thermal simulation module to adjust the heat transferred from the thermal simulation module to the first medium. According to some embodiments of the present invention, each of the thermal simulation modules is provided with an input end and an output end, the input end is provided with a first temperature sensor, the first temperature sensor is used to detect the temperature value of the first medium flowing through the input end, the output end is provided with a second temperature sensor, the second temperature sensor is used to detect the temperature value of the first medium flowing through the output end, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one-to-one to a plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module.
[0008] According to some embodiments of the present invention, a flow meter is provided in each of the first circulation loops, and the flow meter is used to detect a flow value of the first medium in the first circulation loop.
[0009] According to some embodiments of the present invention, a check valve and a water pump are further provided in the second circulation loop, wherein the check valve is used to prevent the second medium from flowing back, and the water pump is used to drive the second medium to flow in the second circulation loop.
[0010] According to the test method of the thermal management integrated module of the second aspect of the present invention, the test system of the thermal management integrated module of the first aspect of the embodiment is applied, a second valve body is provided between each thermal simulation module and the module under test, the second valve body is configured to adjust the opening to control the flow rate and flow rate of the first medium flowing through the thermal simulation module, each thermal simulation module is provided with an input end and an output end, the input end is provided with a first temperature sensor, the first temperature sensor is used to detect the temperature value of the first medium flowing through the input end, the output end is provided with a second temperature sensor, the second temperature sensor is used to detect the temperature value of the first medium flowing through the output end, the test method comprises: Controlling the heating device to heat the second medium and conveying the second medium to each of the thermal simulation modules, so that the temperatures of the plurality of thermal simulation modules are raised to the same temperature value as the working temperature of the corresponding heating device, wherein the heating device at least includes an inverter, a power battery and a drive motor; According to a preset flow resistance reference model, controlling the second valve body so that the plurality of first circulation loops generate a flow resistance value that is the same as the flow resistance of the corresponding heating device under working conditions; Control at least two of the first circulation loops to be connected in series or in parallel; In a first preset time period, temperature changes of the first temperature sensor and the second temperature sensor are obtained to evaluate the heat dissipation capacity allocation performance of the module under test in the test station.
[0011] The test method of the thermal management integrated module according to the embodiment of the present invention has at least the following beneficial effects: The embodiment of the present invention controls the heating device to heat the second medium and transports the second medium to each thermal simulation module, so that the temperature of multiple thermal simulation modules is increased to the same temperature value as the working condition temperature of the corresponding heating device, thereby simulating the heating conditions of multiple heating devices during actual operation; according to the preset flow resistance reference model, the second valve body is controlled to make multiple first circulation loops produce the same flow resistance value as the working condition flow resistance of the corresponding heating device, so that the multiple first circulation loops can produce the same flow resistance value as the heating device when it is actually connected to the module under test, thereby realizing the simulation of the flow resistance of the first circulation loop; at least two first circulation loops are controlled to be connected in series or in parallel, so as to simulate the working condition scenario where different heating devices have mutual influence; within the first preset time period, the temperature change of the first temperature sensor and the second temperature sensor is obtained, so as to perform heat dissipation capacity allocation performance evaluation on the module under test in the test station, thereby reflecting the cooling capacity and stability of the module under test under different working condition scenarios.
[0012] According to some embodiments of the present invention, one of the plurality of thermal simulation modules is a first target thermal simulation module, the first circulation loop in which the first target thermal simulation module is located is a first target circulation loop, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one-to-one to the plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module, and the testing method further includes: Acquiring an initial temperature value of the first target thermal simulation module; Controlling the first valve body in the first target circulation loop to close; After a second preset time period, obtaining a current temperature value of the first target thermal simulation module; The thermal radiation sealing performance of the module under test in the test station is evaluated according to the initial temperature value and the current temperature value.
[0013] According to some embodiments of the present invention, one of the plurality of thermal simulation modules is a second target thermal simulation module, the first circulation loop in which the second target thermal simulation module is located is a second target circulation loop, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one-to-one to the plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module, each of the first circulation loops is provided with a flow meter, the flow meter is used to detect the flow rate value of the first medium in the first circulation loop, and the testing method further includes: adjusting the opening of the first valve body in the second target circulation loop; Acquiring a current flow value of the flow meter in the second target circulation loop; The medium flow distribution performance of the module under test in the test station is evaluated according to the current flow value and the preset flow reference value.
[0014] An electronic device according to an embodiment of the third aspect of the present invention includes: a processor and a memory, wherein the memory stores executable instructions of the processor; wherein the processor is configured to execute the steps of the test method of the thermal management integrated module as described in the embodiment of the second aspect by executing the executable instructions.
[0015] Since the electronic device adopts all the technical solutions of the test method of the thermal management integrated module of the second embodiment, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.
[0016] The thermal management integrated module according to the fourth aspect of the embodiment of the present invention is tested using the testing method for the thermal management integrated module described in the second aspect of the embodiment.
[0017] The thermal management integrated module according to the embodiment of the present invention has at least the following beneficial effects: The embodiment of the present invention is tested through the testing method of the thermal management integrated module of the second aspect of the embodiment, so that the module under test can be tested under conditions close to the actual working environment, thereby more accurately evaluating its heat dissipation performance and stability, which helps to optimize the debugging of the thermal management integrated module, thereby improving the overall performance of the thermal management integrated module; in addition, by shortening the testing cycle of the thermal management integrated module, the research and development of the thermal management integrated module is made more efficient, thereby improving its processing and manufacturing speed.
[0018] A vehicle according to an embodiment of the fifth aspect of the present invention comprises the thermal management integrated module described in the embodiment of the fourth aspect.
[0019] The thermal management integrated module according to the embodiment of the present invention has at least the following beneficial effects: The vehicle of the embodiment of the present invention adopts the thermal management integrated module of the fourth aspect of the embodiment, and by improving the overall performance of the thermal management integrated module, it achieves efficient management and precise heat dissipation of heat from various heating components of the vehicle, reduces the risk of performance degradation of the heating components due to overheating, and thereby improves the reliability and stability of the vehicle.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A schematic diagram of the structure of a test system for a thermal management integrated module according to an embodiment of the present invention; Figure 2 It is a schematic diagram of the local structure of the first thermal simulation module according to an embodiment of the present invention; Figure 3 A flowchart of a method for testing a thermal management integrated module according to an embodiment of the present invention; Figure 4 A flowchart of a method for testing a thermal management integrated module according to another embodiment of the present invention; Figure 5 The figure is a flow chart of the steps of a method for testing a thermal management integrated module according to another embodiment of the present invention.
[0022] Figure Number: Thermal management integrated module test system 1000; Test station 100; tested module 110; first circulation loop 120; second valve body 121; flow meter 122; A first thermal simulation module 200; an input terminal 201; an output terminal 202; a first temperature sensor 203; a second temperature sensor 204; a second thermal simulation module 210; a third thermal simulation module 220; and a fourth thermal simulation module 230; Heating device 300; second circulation loop 310; check valve 311; water pump 312; Heat dissipation device 400; Cooling device 500. DETAILED DESCRIPTION
[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0025] In the description of the present invention, "a plurality" means more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0027] Existing test methods generally adopt an "integrated" test strategy, which requires that key heat-generating devices on the vehicle (such as power batteries, motors, etc.) be physically connected to the thermal management integrated module. Subsequently, by simulating a variety of actual operating scenarios, such as high-speed driving, climbing, and long-term idling, the performance of the thermal management integrated module in these complex environments is deeply observed and analyzed. This test process can comprehensively collect key performance indicators of the thermal management integrated module, including but not limited to heat dissipation efficiency, temperature distribution, and energy consumption, providing data support for subsequent performance evaluation and optimization.
[0028] However, this testing strategy has a significant limitation: it is highly dependent on the R&D and manufacturing progress of the heating device. Specifically, the performance test of the thermal management integrated module must be carried out after the heating device is manufactured, which undoubtedly prolongs the R&D cycle of the entire product and adds additional R&D costs. More importantly, this test mode cannot effectively debug and calibrate the thermal management integrated module in the early stages of the design and development of the heating device. The performance parameters and heat output characteristics of the heating device often require multiple iterations and optimizations during the design and development process. If the thermal management integrated module cannot be pre-tested and debugged at this stage, once the heating device design is finalized, subsequent adjustments to the thermal management integrated module will become extremely difficult and costly.
[0029] To this end, some embodiments of the present invention provide a thermal management integrated module test system 1000, which is applied to the test of the thermal management integrated module of a vehicle, and can perform performance testing on the thermal management integrated module, thereby providing support for debugging and calibration of the thermal management integrated module. Figure 1 and Figure 2 A test system 1000 for a thermal management integrated module is shown.
[0030] Reference Figure 1As shown, in an embodiment of the present invention, a test system 1000 for a thermal management integrated module includes: a test station 100, a plurality of thermal simulation modules, a heating device 300, a heat dissipation device 400 and a data acquisition module. Among them, the test station 100 is connected to a plurality of thermal simulation modules through a pipeline, and the module under test 110, that is, the thermal management integrated module under test, is installed in the test station 100, thereby forming a plurality of first circulation loops 120 with the plurality of thermal simulation modules respectively. The first circulation loop 120 has a first medium, and the first medium is driven by a power device to flow in the first circulation loop 120. Based on this, the circulation of the first medium in the first circulation loop 120 realizes heat transfer between the module under test 110 and the thermal simulation module. In this embodiment, the first medium can be ethylene glycol, propylene glycol, diethylene glycol, etc.
[0031] It should be noted that, in the embodiment of the present invention, the test station 100 is suitable for the rapid installation of thermal management integrated modules of different specifications and sizes, thereby improving the efficiency of replacing the thermal management integrated modules. For example, the test station 100 can be a universal quick-install fixture built of aluminum, which can adjust its height and length for different thermal management integrated modules to adapt to the installation and fixing requirements of different thermal management integrated modules.
[0032] Continue to refer to Figure 1 As shown, in an embodiment of the present invention, the heating device 300 is provided with a medium box, in which a second medium is loaded. Specifically, the heating device 300 is connected to a plurality of thermal simulation modules through pipelines, respectively, so as to form a plurality of second circulation loops 310 with the plurality of thermal simulation modules. When the test system is running, the heating device 300 can heat the second medium, and transport the heated second medium to the plurality of thermal simulation modules through the plurality of second circulation loops 310 to heat the plurality of thermal simulation modules. It is understandable that the heating device 300 can transport the second medium of the same temperature to the plurality of thermal simulation modules, so as to simulate the working condition that the heat load generated by the plurality of thermal simulation modules is the same; the heating device 300 can also transport the second medium of different temperatures to the plurality of thermal simulation modules, so as to simulate the working condition that the heat load generated by the plurality of thermal simulation modules is different. In this embodiment, the second medium can be water, refrigeration oil, etc.
[0033] It is understandable that the heating components of the vehicle include inverters, power batteries, drive motors, distribution boxes and other components. Figure 1As shown, the following takes the first thermal simulation module 200 corresponding to the inverter, the second thermal simulation module 210 corresponding to the power battery, the third thermal simulation module 220 corresponding to the drive motor, and the fourth thermal simulation module 230 corresponding to the distribution box as an example for explanation. In this embodiment, the heating device 300 can heat the second medium to a temperature level corresponding to the actual operation of the inverter, and transport the heated second medium to the first thermal simulation module 200, so that the first thermal simulation module 200 is heated to a level that matches the heat load generated when the inverter is actually working, and then the first thermal simulation module 200 simulates the heating state of the inverter during actual operation. Similarly, the second thermal simulation module 210 simulates the heating state of the power battery during actual operation, the third thermal simulation module 220 simulates the heating state of the drive motor during actual operation, and the fourth thermal simulation module 230 simulates the heating state of the distribution box during actual operation.
[0034] Continue to refer to Figure 1 As shown, in an embodiment of the present invention, the heat dissipation device 400 is connected to the test station 100, which can dissipate heat for the first medium flowing through the module under test 110, and the first medium after heat dissipation continues to flow to the thermal simulation module through the first circulation loop 120, thereby realizing the cooling and heat dissipation of the thermal simulation module. In this process, the module under test 110 has the function of adjusting the allocation of heat dissipation resources, and can dynamically adjust the heat dissipation strategy according to the heating conditions of the first thermal simulation module 200, the second thermal simulation module 210, the third thermal simulation module 220 and the fourth thermal simulation module 230. For example, when the first thermal simulation module 200 is abnormally heated, the temperature of the first thermal simulation module 200 exceeds the normal range, so it needs to be cooled first. At this time, the module under test 110 can respond quickly and allocate more heat dissipation resources of the heat dissipation device 400 to the first medium in the first circulation loop 120 where the first thermal simulation module 200 is located, thereby ensuring that the first thermal simulation module 200 can obtain additional heat dissipation support, thereby effectively reducing the temperature of the first thermal simulation module 200.
[0035] Based on this, in an embodiment of the present invention, the data acquisition module is connected to the test station 100, and it can collect the operating condition information of the module under test 110. For example, when the test system is running, the data acquisition module can obtain in real time the heat dissipation resource allocation decision made by the module under test 110 based on the current operating conditions, including but not limited to data parameters such as the temperature, pressure and flow rate of the first medium in each first circulation loop 120, thereby providing data support for accurately evaluating the performance of the module under test 110.
[0036] It can be understood that the embodiment of the present invention facilitates the installation of the module under test 110 by configuring the test station 100; by setting a heating device 300 and connecting it to multiple thermal simulation modules respectively, a plurality of second circulation loops 310 are constructed, the second medium is heated by the heating device 300, and the heated second medium is transported to the multiple thermal simulation modules through the multiple second circulation loops 310, so that the multiple thermal simulation modules are heated to a preset temperature to simulate the heating state of the heating device during actual operation; and then the multiple thermal simulation modules are respectively connected to the module under test 110 to construct a plurality of first circulation loops 120, and the module under test 110 is connected to a heat dissipation module for dissipating heat from the first medium flowing through the module under test 110. Then, through the first circulation loop 120, the module under test 110 can transport the first medium after heat dissipation to multiple thermal simulation modules to achieve heat dissipation of multiple thermal simulation modules; and then use the data acquisition module to collect the working condition information of the module under test 110 in real time, thereby achieving a comprehensive evaluation of the module under test 110. Compared with the method that requires connecting to a heating device for testing, by simulating the heating conditions of the heating device in different operating scenarios, a comprehensive performance evaluation of the thermal management integrated module can be performed without actually connecting the heating device, which greatly improves the test efficiency of the thermal management integrated module, lowers the test threshold of the thermal management integrated module, and accelerates the research and development speed of the thermal management integrated module.
[0037] Reference Figure 2 As shown, in the embodiment of the present invention, a second valve body 121 is provided between each thermal simulation module and the module under test 110, and the second valve body 121 is configured to adjust the opening to control the flow rate and flow velocity of the first medium flowing through the thermal simulation module. It can be understood that the opening size of the second valve body 121 will directly affect the flow rate and flow velocity of the first medium flowing through the first circulation loop 120 where the second valve body 121 is located. Therefore, in this embodiment, by adjusting the opening size of the second valve body 121, the flow resistance generated in the first circulation loop 120 when the heating device is connected to the module under test 110 can be effectively simulated.
[0038] Continue to refer to Figure 2 As shown, in the embodiment of the present invention, the thermal simulation module can be a water-to-water heat exchanger, based on which, the second medium heated by the heating device 300 can exchange heat with the first medium, thereby heating the first medium, and transferring heat to the first medium through the second medium to simulate the heating state of the heating device during actual operation. In this embodiment, the heating device 300 can transport the second medium of the same temperature to each thermal simulation module, based on which, in order for each thermal simulation module to simulate the heating state of each different heating device, it is necessary to make the thermal simulation module reach the same temperature value as the corresponding heating device.
[0039] For this purpose, refer to Figure 2 As shown, in the embodiment of the present invention, each thermal simulation module is connected to a cooling device 500, and the cooling device 500 is used to cool the thermal simulation module to adjust the heat transferred from the thermal simulation module to the first medium. It can be understood that the normal operating temperature of the inverter is 40°C and the normal operating temperature of the power battery is 30°C.
[0040] In one example, the heating device 300 can heat the second medium to 40°C, and then transport the second medium to the first thermal simulation module 200 and the second thermal simulation module 210. The cooling device 500 connected to the second thermal simulation module 210 can cool the second medium from 40°C to 30°C, thereby simulating the heating condition of the inverter through the first thermal simulation module 200 and simulating the heating condition of the power battery through the second thermal simulation module 210.
[0041] In another example, the heating device 300 can heat the second medium to 50°C, and then transport the second medium to the first thermal simulation module 200 and the second thermal simulation module 210. The cooling device 500 connected to the first thermal simulation module 200 can cool the second medium from 50°C to 40°C, and the cooling device 500 connected to the second thermal simulation module 210 can cool the second medium from 40°C to 30°C, thereby simulating the heating condition of the inverter through the first thermal simulation module 200 and simulating the heating condition of the power battery through the second thermal simulation module 210.
[0042] Reference Figure 1 and Figure 2 As shown, in the embodiment of the present invention, each thermal simulation module is provided with an input end 201 and an output end 202. For the convenience of description, the first thermal simulation module 200 is taken as an example for description. The input end 201 of the first thermal simulation module 200 is provided with a first temperature sensor 203, and the first temperature sensor 203 is used to detect the temperature value of the first medium flowing through the input end 201. The output end 202 of the first thermal simulation module 200 is provided with a second temperature sensor 204, and the second temperature sensor 204 is used to detect the temperature value of the first medium flowing through the output end 202.
[0043] Reference Figure 2 As shown, in an embodiment of the present invention, the model under test is provided with a plurality of first valve bodies, and the plurality of first valve bodies correspond one-to-one to the plurality of first circulation loops 120. The first valve bodies are configured to adjust the opening according to the temperature value detected by the first temperature sensor 203 and the temperature value detected by the second sensor to control the flow rate of the first medium delivered to the corresponding thermal simulation module.
[0044] Continuing to take the abnormal heating of the first thermal simulation module 200 as an example, in order to enable the first thermal simulation module 200 to obtain additional heat dissipation support, the opening of the first valve body corresponding to the first circulation loop 120 where the first thermal simulation module 200 is located can be increased to increase the flow of the first medium of the first circulation loop 120, thereby allocating more heat dissipation resources of the heat dissipation device 400 to the first medium in the first circulation loop 120 where the first thermal simulation module 200 is located, thereby improving the heat dissipation efficiency of the first thermal simulation module 200. It can be understood that the embodiment of the present invention flexibly adjusts the flow of the first medium flowing to different first circulation loops 120 by controlling the opening of multiple first valve bodies, thereby realizing dynamic allocation of heat dissipation resources of the heat dissipation device 400.
[0045] Reference Figure 1 As shown, in the embodiment of the present invention, each first circulation loop 120 is provided with a flow meter 122, and the flow meter 122 is used to measure the flow value of the first medium in the first circulation loop 120. It can be understood that the detection result of the flow meter 122 can provide data support for the opening control of the first valve body, thereby achieving more accurate flow control.
[0046] Continue to refer to Figure 1 As shown, in the embodiment of the present invention, a check valve 311 and a water pump 312 are further provided in the second circulation loop 310. The check valve 311 is used to prevent the second medium from flowing back, ensuring that the second medium in the second circulation loop 310 flows unidirectionally in the loop, thereby improving the heating efficiency of the thermal simulation module, while the water pump 312 is used to drive the second medium to flow in the second circulation loop 310.
[0047] Some embodiments of the present invention provide a test method for a thermal management integrated module, and some embodiments of the present invention applied to the above embodiments provide a test system for a thermal management integrated module, specifically referring to Figure 3 and Figure 5 The figure shows the test method of the thermal management integrated module.
[0048] Reference Figure 3 As shown, in an embodiment of the present invention, a method for testing a thermal management integrated module includes: Step S601, controlling the heating device to heat the second medium, and delivering the second medium to each thermal simulation module, so that the multiple thermal simulation modules are heated to the same temperature value as the working temperature of the corresponding heating device, and the heating device at least includes an inverter, a power battery and a drive motor.
[0049] It can be understood that in the embodiment of the present invention, the second medium is heated by controlling the heating device and the second medium is transported to each thermal simulation module, so that the first thermal simulation module simulates the heating state of the inverter during actual operation, the second thermal simulation module simulates the heating state of the power battery during actual operation, the third thermal simulation module simulates the heating state of the drive motor during actual operation, and the fourth thermal simulation module simulates the heating state of the distribution box during actual operation.
[0050] Step S602: According to a preset flow rate and flow resistance reference model, the second valve body is controlled so that the plurality of first circulation loops generate flow resistance values that are the same as the flow resistance of the corresponding heating device under working conditions.
[0051] It should be noted that, in the embodiment of the present invention, the flow resistance reference model can be based on the flow resistance data generated by each heating device under different flow conditions in the first medium to construct a relationship curve between flow and resistance. Based on this, the present embodiment can obtain the corresponding flow resistance data from the flow resistance reference model according to the real-time flow value of the first medium in the first circulation loop, and control the opening of the second valve body according to the flow resistance data, so that the thermal simulation model can more accurately simulate the characteristics of the real heating device.
[0052] Step S603, controlling at least two first circulation loops to be connected in series or in parallel.
[0053] It is understandable that controlling at least two first circulation loops in series or in parallel can simulate different working conditions, thereby simulating working conditions where different heating devices have mutual influence. For example, this embodiment can control the first circulation loop where the first thermal simulation module is located to be connected in series with the first circulation loop where the second thermal simulation module is located, or can control the first circulation loop where the first thermal simulation module is located to be connected in parallel with the first circulation loop where the second thermal simulation module is located, and can also control the first circulation loop where the first thermal simulation module is located, the first circulation loop where the second thermal simulation module is located, the first circulation loop where the third thermal simulation module is located, and the first circulation loop where the fourth thermal simulation module is located to be connected in parallel, and this embodiment does not limit this. For example, taking a new energy vehicle as an example, when the kinetic energy recovery system is running and charging, the first circulation loop where the inverter and the power battery are located will be connected in series.
[0054] Step S604, obtaining temperature changes of the first temperature sensor and the second temperature sensor within a first preset time period, so as to evaluate the heat dissipation capacity allocation performance of the module under test in the test station.
[0055] It can be understood that in the embodiment of the present invention, after the test system has been running for a first preset time period, it can control the data acquisition module to obtain the temperature changes of the first temperature sensor and the second temperature sensor in each first circulation loop, so as to confirm the effectiveness of the heat dissipation resource allocation decision made by the module under test based on the current working conditions, and monitor the dynamic allocation of heat dissipation resources of the heat dissipation device by the module under test, so as to use this as a basis for judging the heat dissipation capacity allocation performance of the module under test.
[0056] Reference Figure 4 As shown, in an embodiment of the present invention, one of the multiple thermal simulation modules is a first target thermal simulation module, the first circulation loop in which the first target thermal simulation module is located is the first target circulation loop, and the test method of the thermal management integrated module further includes: Step S605: acquiring an initial temperature value of the first target thermal simulation module.
[0057] Step S606, controlling the first valve body in the first target circulation loop to close.
[0058] It can be understood that, in the embodiment of the present invention, controlling the closing of the first valve body in the first target circulation loop can block the measured module from blocking the flow of the first medium in the first target circulation loop, thereby causing the first target thermal simulation module to stop heat exchange with the measured module through the first target circulation loop.
[0059] Step S607: after a second preset time period, obtain the current temperature value of the first thermal simulation module.
[0060] Step S608: evaluating the thermal radiation sealing performance of the module under test in the test station according to the initial temperature value and the current temperature value.
[0061] It can be understood that in the embodiment of the present invention, when the heat exchange between the first target thermal simulation module and the module under test is blocked by closing the first valve body in the first target circulation loop, if the current temperature value is detected to be higher than the initial temperature value, it indicates that there is heat leakage in the module under test, that is, the heat of other thermal simulation modules is transferred to the first target thermal simulation module. Based on this, this embodiment can evaluate the thermal radiation sealing performance of the module under test by comparing the initial temperature value and the current temperature value.
[0062] Reference Figure 5 As shown, in an embodiment of the present invention, one of the multiple thermal simulation modules is a second target thermal simulation module, the first circulation loop in which the second target thermal simulation module is located is the second target circulation loop, and the test method of the thermal management integrated module further includes: Step S609, adjusting the opening of the first valve body in the second target circulation loop.
[0063] Step S610, obtaining the current flow value of the flow meter in the second target circulation loop.
[0064] Step S611, judging the medium flow distribution performance of the module under test in the test station according to the current flow value and the preset flow reference value.
[0065] It is understandable that, in the embodiment of the present invention, after adjusting the opening of the first valve body in the second target circulation loop, the accuracy of the flow distribution of the module under test can be verified by comparing the current flow value with the preset flow reference value. Specifically, in one example, when the opening of the first valve body is 50%, the expected flow reference value is 1L / s accordingly. If the current flow value actually detected is only 0.8 L / s, this indicates that the accuracy of the flow distribution of the module under test is poor.
[0066] Some embodiments of the present invention further provide an electronic device, comprising: a processor and a memory, wherein the memory stores executable instructions of the processor; wherein the processor is configured to execute the steps of the test method of the thermal management integrated module of the above embodiment by executing the executable instructions.
[0067] Since the electronic device adopts all the technical solutions of the test method of the thermal management integrated module of the above embodiment, it at least has all the beneficial effects brought by the technical solutions of the above embodiment, which will not be repeated here.
[0068] Some embodiments of the present invention further provide a thermal management integrated module, which is tested using the thermal management integrated module testing method of the above embodiment.
[0069] It can be understood that the thermal management integrated module of the embodiment of the present invention is tested by the testing method of the thermal management integrated module, so that the module under test can be tested under conditions close to the actual working environment, thereby more accurately evaluating its heat dissipation performance and stability, which helps to optimize the debugging of the thermal management integrated module, thereby improving the overall performance of the thermal management integrated module; in addition, by shortening the testing cycle of the thermal management integrated module, the research and development of the thermal management integrated module is made more efficient, thereby improving its processing and manufacturing speed.
[0070] Some embodiments of the present invention further provide a vehicle, including the thermal management integrated module of the above embodiment. Specifically, the vehicle can be a private car, such as a sedan, SUV, MPV or pickup truck. The vehicle can also be an operating vehicle, such as a van, bus, small truck or large trailer. The vehicle can be a gasoline vehicle or a new energy vehicle. When the vehicle is a new energy vehicle, it can be a hybrid vehicle or a pure electric vehicle.
[0071] It can be understood that the vehicle in the embodiment of the present invention adopts the thermal management integrated module of the above-mentioned embodiment, and by improving the overall performance of the thermal management integrated module, it realizes efficient management and precise heat dissipation of heat of various heating components of the vehicle, reduces the risk of performance degradation of the heating components due to overheating, and thus improves the reliability and stability of the vehicle.
[0072] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A test system for a thermal management integrated module, characterized in that: include: A test station, used for installing a module under test, wherein the module under test is the thermal management integrated module; A plurality of thermal simulation modules are respectively connected to the modules under test to construct a plurality of first circulation loops, wherein the first circulation loops are used for a first medium to flow, and the plurality of thermal simulation modules can transfer heat to the first medium; a heating device loaded with a second medium, the heating device being respectively connected to the plurality of the thermal simulation modules to construct a plurality of second circulation loops, the heating device being capable of heating the second medium, and conveying the heated second medium to the plurality of the thermal simulation modules through the plurality of the second circulation loops to heat the plurality of the thermal simulation modules; a heat dissipation device connected to the test station, the heat dissipation device being used to dissipate the heat of the first medium flowing through the module under test, so that the module under test can transport the first medium after heat dissipation to the plurality of thermal simulation modules; A data acquisition module is connected to the test station, and is used to acquire the working condition information of the module under test.
2. The test system for the thermal management integrated module according to claim 1, characterized in that: A second valve body is disposed between each of the thermal simulation modules and the module under test, and the second valve body is configured to adjust an opening to control a flow rate and a flow rate of the first medium flowing through the thermal simulation module.
3. The test system for the thermal management integrated module according to claim 2, characterized in that: The heating device can deliver the second medium of the same temperature to each of the thermal simulation modules. Each of the thermal simulation modules is connected to a cooling device for cooling the thermal simulation module to adjust the amount of heat transferred from the thermal simulation module to the first medium.
4. The test system for the thermal management integrated module according to claim 1 or 2, characterized in that: Each of the thermal simulation modules is provided with an input end and an output end, the input end is provided with a first temperature sensor, the first temperature sensor is used to detect the temperature value of the first medium flowing through the input end, the output end is provided with a second temperature sensor, the second temperature sensor is used to detect the temperature value of the first medium flowing through the output end, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one-to-one to a plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module.
5. The test system for the thermal management integrated module according to claim 2, characterized in that: A flow meter is provided in each of the first circulation loops, and the flow meter is used to detect the flow value of the first medium in the first circulation loop.
6. The test system for the thermal management integrated module according to claim 1, characterized in that: A check valve and a water pump are also provided in the second circulation loop. The check valve is used to prevent the second medium from flowing back, and the water pump is used to drive the second medium to flow in the second circulation loop.
7. A method for testing a thermal management integrated module, characterized in that: A test system for a thermal management integrated module according to any one of claims 1 to 6, wherein a second valve body is provided between each of the thermal simulation modules and the module under test, the second valve body being configured to adjust the opening to control the flow rate and flow velocity of the first medium flowing through the thermal simulation module, each of the thermal simulation modules being provided with an input end and an output end, the input end being provided with a first temperature sensor, the first temperature sensor being used to detect the temperature value of the first medium flowing through the input end, the output end being provided with a second temperature sensor, the second temperature sensor being used to detect the temperature value of the first medium flowing through the output end, and the test method comprising: Controlling the heating device to heat the second medium and conveying the second medium to each of the thermal simulation modules, so that the temperatures of the plurality of thermal simulation modules are raised to the same temperature value as the working temperature of the corresponding heating device, wherein the heating device at least includes an inverter, a power battery and a drive motor; According to a preset flow resistance reference model, controlling the second valve body so that the plurality of first circulation loops generate a flow resistance value that is the same as the flow resistance of the corresponding heating device under working conditions; Control at least two of the first circulation loops to be connected in series or in parallel; In a first preset time period, temperature changes of the first temperature sensor and the second temperature sensor are obtained to evaluate the heat dissipation capacity allocation performance of the module under test in the test station.
8. The method for testing a thermal management integrated module according to claim 7, characterized in that: One of the plurality of thermal simulation modules is a first target thermal simulation module, the first circulation loop in which the first target thermal simulation module is located is a first target circulation loop, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one-to-one to the plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module, and the testing method further includes: Acquiring an initial temperature value of the first target thermal simulation module; Controlling the first valve body in the first target circulation loop to close; After a second preset time period, obtaining a current temperature value of the first target thermal simulation module; The thermal radiation sealing performance of the module under test in the test station is evaluated according to the initial temperature value and the current temperature value.
9. The method for testing a thermal management integrated module according to claim 7 or 8, characterized in that: One of the plurality of thermal simulation modules is a second target thermal simulation module, the first circulation loop in which the second target thermal simulation module is located is a second target circulation loop, the module under test is provided with a plurality of first valve bodies, the plurality of first valve bodies correspond one to one to the plurality of first circulation loops, the first valve body is configured to adjust the opening according to the temperature value detected by the first temperature sensor and the temperature value detected by the second sensor, so as to control the flow rate of the first medium delivered to the corresponding thermal simulation module, each of the first circulation loops is provided with a flow meter, the flow meter is used to detect the flow rate value of the first medium in the first circulation loop, and the testing method further includes: adjusting the opening of the first valve body in the second target circulation loop; Acquiring a current flow value of the flow meter in the second target circulation loop; The medium flow distribution performance of the module under test in the test station is evaluated according to the current flow value and the preset flow reference value.
10. An electronic device, characterized in that: include: processor; a memory storing executable instructions of the processor; The processor is configured to perform the steps of the method for testing the thermal management integrated module according to claims 7 to 9 by executing the executable instructions.
11. A thermal management integrated module, characterized in that: The test is performed using the test method for the thermal management integrated module as described in any one of claims 7 to 9.
12. A vehicle, characterized in that: Comprising a thermal management integrated module as claimed in claim 11.
Citation Information
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