Gluing and developing equipment and control method thereof

Abstract

The invention provides gluing and developing equipment and a control method thereof. The gluing and developing equipment comprises a wafer box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer which are sequentially arranged in the horizontal direction, the gluing process layers in the first process module are sequentially stacked from bottom to top; a first through-wall type cooling unit is arranged between the first process module and the first interlayer process module; and / or a second through-wall type cooling unit is arranged between the second interlayer process module and the cleaning process layer; each of the first through-wall cooling unit and the second through-wall cooling unit comprises a first through-wall part and a cooling part; the first end of the first through-wall part is fixed, and the second end of the first through-wall part moves relative to the first end and is used for transmitting a wafer; and the cooling part is used for cooling and is in contact with the surface of the wafer so as to cool the wafer. The equipment is used for improving the production efficiency of the gluing and developing equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a glue coating and developing device and a control method thereof. Background Art

[0002] In the existing semiconductor photolithography process, the glue coating equipment, photolithography equipment and development equipment complete the photoresist coating process, photolithography process and development process respectively. With the improvement of semiconductor processing technology, the mainstream market integrates the glue coating and development process on the same equipment. At the same time, the production capacity of the glue coating and development equipment is required to be greater than the production capacity of the photolithography equipment. The production capacity of the glue coating and development equipment is determined by the bottleneck capacity of the process unit and the bottleneck of the robot. After the glue is coated on the surface of the wafer, it needs to be baked at high temperature, and the next process can be carried out after the wafer cools down.

[0003] In the prior art, the baked wafer needs to be sent to a cooling unit first, and the cooling unit refrigerates the wafer to cool it. After the wafer is cooled, the wafer is taken out of the cooling unit for the next process, which takes a long time to produce and has low production efficiency. Therefore, a new type of coating and developing equipment and its control method are urgently needed to improve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a glue coating and developing device, which is used to improve the production efficiency of the glue coating and developing device.

[0005] In the first aspect, the present invention provides a glue coating and developing device, comprising a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer arranged in sequence along the horizontal direction; the various glue coating process layers in the first process module are stacked in sequence from bottom to top; a first through-the-wall cooling unit is provided between the first process module and the first interlayer process module; and / or a second through-the-wall cooling unit is provided between the second interlayer process module and the cleaning process layer; the first through-the-wall cooling unit and the second through-the-wall cooling unit both include a first through-the-wall portion and a cooling portion; the first end of the first through-the-wall portion is fixed, and the second end of the first through-the-wall portion is movable relative to the first end for transferring wafers; the cooling portion is used for cooling and contacting with the surface of the wafer to cool the wafer.

[0006] The method of the present invention has the following beneficial effects: the present invention provides a first through-the-wall cooling unit between the process module and the first interlayer process module, thereby facilitating the cooling process while penetrating the wall, which can save the time for cooling the wafer and is beneficial to improving production efficiency; the present invention provides a second through-the-wall cooling unit between the second interlayer process module and the cleaning process layer, thereby saving the time for cooling the wafer after processing by the process module and is beneficial to improving production efficiency.

[0007] Optionally, it further includes a second process module, which is arranged between the first inter-layer process module and the second inter-layer process module, and the second process module and the first process module are arranged in duplex symmetry.

[0008] Optionally, the first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer, and the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer all include a heat treatment unit, and the heat treatment unit is used to bake wafers when in working state; when the first through-the-wall cooling unit is arranged between the first glue coating process layer and the first interlayer process module, it is used to transfer the wafers in the first interlayer process module to the first glue coating process layer, and cool the wafers at the same time; a first through-the-wall robot is also arranged between the first glue coating process layer and the first interlayer process module, which is used to transfer the wafers in the first glue coating process layer to the first interlayer process module; when the second through-the-wall cooling unit is arranged between the cleaning process layer and the second interlayer process module, it is used to transfer the wafers in the cleaning process layer to the second interlayer process module, and cool the wafers at the same time; a second through-the-wall robot is also arranged between the cleaning process layer and the second interlayer process module, which is used to transfer the wafers in the second interlayer process module to the cleaning process layer.

[0009] Optionally, it also includes a through-wall optical detection unit, which includes a second through-wall part, a light source and a camera; the first end of the second through-wall part is fixed, and the second end of the second through-wall part is movable relative to the first end, and is used to transmit the wafer; the light source is used to project light onto the surface of the wafer, and the camera is used to receive light reflected by the surface of the wafer.

[0010] Optionally, the through-the-wall optical inspection unit is disposed between the third glue coating process layer and the first interlayer process module, and is used to transfer the wafers in the third glue coating process layer to the first interlayer process module, and perform optical inspection on the wafers at the same time.

[0011] Optionally, it also includes a through-wall edge exposure unit, which includes a third through-wall part and an exposure part; the first end of the third through-wall part is fixed, and the second end of the third through-wall part is movable relative to the first end, and is used to transfer the wafer; the exposure part covers the edge of the wafer, and is used to expose the edge of the wafer for process.

[0012] Optionally, the through-wall edge exposure unit is arranged between the second glue coating process layer and the second interlayer process module, and is used to transfer the wafer in the second glue coating process layer to the second interlayer process module, and simultaneously expose the edge of the wafer; a third through-wall robot is also arranged between the second glue coating process layer and the first interlayer process module, and is used to transfer the wafer in the first interlayer process module to the second glue coating process layer.

[0013] Optionally, the wafer box module is provided with a wafer box robot for loading and transferring a wafer transfer box, and the wafer transfer box is used to load wafers; the first interlayer process module is provided with a first interlayer robot for transferring wafers within the first interlayer process module; the second interlayer process module is provided with a second interlayer robot for transferring wafers within the second interlayer process module; the first gluing process layer, the second gluing process layer, the third gluing process layer and the cleaning process layer are all provided with intra-layer robots for transferring wafers within the layer so that the wafers can undergo process processing.

[0014] Optionally, the first glue coating process layer, the second glue coating process layer, and the third glue coating process layer all include a liquid processing unit, and the liquid processing unit is used to perform glue coating on the wafer surface; the cleaning process layer includes a front washing process unit, which is used to clean the front side of the wafer; the second interlayer process module includes a back washing process unit, which is used to clean the back side of the wafer.

[0015] In the second aspect, the present invention provides a control method for a glue coating and developing device, comprising: S1, controlling a film box robot to place a film box taken out from a film box cache position onto a film box loading unit, and the film box loading unit opens a first wafer transfer box; controlling a wafer robot to transfer wafers in the first wafer transfer box to a wafer placement position of a first interlayer process module; S2, controlling the first interlayer robot to first place the wafers on a first through-the-wall cooling unit; the first through-the-wall cooling unit loads the wafers and then transfers the wafers to a first glue coating process layer, the intra-layer robot in the first glue coating process layer carries the wafers for a first processing and then places them into the first through-the-wall robot, and the first through-the-wall robot transfers the wafers back to the first interlayer process module; S3, controlling the first interlayer robot to place the wafers on a third through-the-wall robot, and the third through-the-wall robot loads the wafers and then transfers the wafers to a second glue coating process layer, and the second glue coating process layer receives the wafers from the first through-the-wall robot. The in-layer robot in the process layer carries the wafer for a second processing and then places it in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, controls the second interlayer robot to carry the wafer for back side cleaning first, and then transfers the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer to the second through-wall robot; S5, the second through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning and places the wafer in the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0016] Optionally, after the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, it also includes: S6, controlling the second interlayer robot to place the wafer on the second through-the-wall cooling unit into the fourth through-the-wall robot, and the fourth through-the-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then places it into the through-the-wall optical inspection unit, and the through-the-wall optical inspection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a top cross-sectional structure of a glue coating and developing device provided by the present invention;

[0018] Figure 2 A schematic diagram of a side cross-sectional structure of a glue coating and developing device provided by the present invention;

[0019] Figure 3 A schematic structural diagram of a first through-the-wall cooling unit provided by the present invention;

[0020] Figure 4 A schematic structural diagram of a through-the-wall optical detection unit provided by the present invention;

[0021] Figure 5 A schematic structural diagram of a through-the-wall edge exposure unit provided by the present invention;

[0022] Figure 6 A schematic flow chart of a control method for a glue coating and developing device provided by the present invention.

[0023] Numbers in the figure:

[0024] 1. Cassette module; 11. Cassette manipulator; 12. Wafer manipulator; 13. Cassette loading unit; 14. Wafer transfer box; 15. Cache position; 16. Overhead crane position; 17. Manual position; 2. First interlayer process module; 22. First interlayer manipulator; 301. First glue coating process layer; 302. Second glue coating process layer; 303. Third glue coating process layer; 31. First process module; 32. Second process module; 333. Third layer inner manipulator; 341. Liquid treatment unit; 342. Heat treatment unit; 4. Second interlayer process module; 41. Backwash process unit; 42 , second interlayer robot; 45, interface module; 5, cleaning process layer; 51, positive washing process unit; 52, cleaning robot; 6, through-wall edge exposure unit; 601, exposure unit; 602, third through-wall unit; 7, through-wall optical detection unit; 701, camera; 702, light source; 703, second through-wall unit; 801, cooling unit; 802, first through-wall unit; 81, first through-wall cooling unit; 82, second through-wall cooling unit; 91, first through-wall robot; 92, second through-wall robot; 93, third through-wall robot; 94, fourth through-wall robot. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0026] In view of the problems existing in the existing technology, such as Figure 1 As shown, the present invention provides a coating and developing device, comprising a film box module 1, a first interlayer process module 2, a first process module 31, a second interlayer process module 4 and a cleaning process layer 5 arranged along a first direction. Figure 2 As shown, the first glue coating process layer 301 , the second glue coating process layer 302 and the third glue coating process layer 303 in the first process module 31 are stacked in sequence from bottom to top.

[0027] Please refer to Figure 1Specifically, a first through-the-wall cooling unit 81 is provided between the first process module 31 and the first interlayer process module 2. In some other specific embodiments, a second through-the-wall cooling unit 82 is provided between the second interlayer process module 4 and the cleaning process layer 5. In some other specific embodiments, a first through-the-wall cooling unit 81 is provided between the first process module 31 and the first interlayer process module 2, and a second through-the-wall cooling unit 82 is provided between the second interlayer process module 4 and the cleaning process layer 5.

[0028] In some further specific embodiments, the number of the wafer box loading units 13 is 4, which are used to load 2 first wafer transfer boxes and 2 second wafer transfer boxes; the first wafer transfer box is used to load wafers that have not undergone the glue coating and development process, and the second wafer transfer box is used to load wafers that have undergone the glue coating and development process.

[0029] Exemplarily, the third coating process layer 303 of the first process module 31 includes three liquid treatment units 341 and three heat treatment units 342, two heat treatment units 342 are provided on the first direction side of the three liquid treatment units 341, and one heat treatment unit 342 is provided on the second direction side of the three liquid treatment units 341; the second direction is the opposite direction of the first direction.

[0030] It is worth noting that the second interlayer process module 4 and the cleaning process layer 5 together form an interface module 45, and the interface module 45 is used to connect with the exposure machine. Specifically, the second interlayer robot 42 is used to send the wafer into the backwash process unit 41. The interface module 45 is provided with an interface robot, which is used to send the wafer after the backwash process into the exposure machine for exposure process; the interface robot is also used to place the wafer after the exposure process into the wafer placement position of the second interlayer process module 4.

[0031] Specifically, the interface module 45 is further provided with an interface robot 53, which is used to carry the wafer through the refrigeration unit and then transfer it to the exposure machine. The interface robot 53 is also used to place the wafer at the wafer placement position of the second interlayer process module 4.

[0032] Please refer to Figure 2 In some embodiments, a second process module 32 is further included. The second process module 32 is arranged between the first interlayer process module 2 and the second interlayer process module 4. The second process module 32 and the first process module 31 are arranged in duplex symmetry.

[0033] In other examples, the number of the liquid processing units 341 and the heat treatment units 342 can be any positive integer, as long as the Nth coating layer of the first process module 31 and the Nth coating layer of the second process module 32 are symmetrically arranged, and N is any positive integer, which facilitates the robot in the Nth layer to synchronously take and place the wafers in the first process module 31 and the second process module 32, which is beneficial to improving production efficiency.

[0034] It is worth noting that the cassette module 1 further includes a cassette loading unit 13 and a wafer robot 12. The cassette loading unit 13 is used to load a wafer transfer box 14 and control the opening or closing of the wafer transfer box 14. Exemplarily, the wafer robot 12 is used to transfer the wafers in the wafer transfer box 14 to the wafer placement position of the first inter-layer process module 2. In other examples, the wafer robot 12 is used to transfer the wafers at the wafer placement position of the first inter-layer process module 2 to the wafer transfer box 14.

[0035] Specifically, a fourth through-the-wall robot 94 is provided between the third glue coating process layer 303 and the second interlayer process module 4 , and is used to transfer the wafer into the third glue coating process layer 303 .

[0036] It is worth noting that the first glue coating process layer 301, the second glue coating process layer 302, the third glue coating process layer 303 and the cleaning process layer 5 all include a heat treatment unit 342, and the heat treatment unit 342 is used to bake the wafer when in working state.

[0037] Please refer to Figure 2 Specifically, the first through-the-wall cooling unit 81 is disposed between the first glue coating process layer 301 and the first interlayer process module 2, and is used to transfer the wafers in the first interlayer process module 2 to the first glue coating process layer 301 and cool the wafers at the same time. A first through-the-wall robot 91 is also disposed between the first glue coating process layer 301 and the first interlayer process module 2, and is used to transfer the wafers in the first glue coating process layer 301 to the first interlayer process module 2.

[0038] In other specific embodiments, the second through-the-wall cooling unit 82 is arranged between the cleaning process layer 5 and the second interlayer process module 4, and is used to transfer the wafers in the cleaning process layer to the second interlayer process module 4 and cool the wafers at the same time; a second through-the-wall robot 92 is also arranged between the cleaning process layer 5 and the second interlayer process module 4, and is used to transfer the wafers in the second interlayer process module 4 to the cleaning process layer.

[0039] In some further specific embodiments, the wafer box module 1 is provided with a wafer box robot 11 for loading and transferring a wafer transfer box 14, and the wafer transfer box 14 is used to load wafers; the first interlayer process module 2 is provided with a first interlayer robot for transferring wafers within the first interlayer process module 2; the second interlayer process module 4 is provided with a second interlayer robot 42 for transferring wafers within the second interlayer process module 4; the first glue coating process layer 301, the second glue coating process layer 302, the third glue coating process layer 303 and the cleaning process layer 5 are all provided with intra-layer robots for transferring wafers within the layer so that the wafers can undergo process processing.

[0040] In some further specific embodiments, the first glue coating process layer 301, the second glue coating process layer 302, and the third glue coating process layer 303 all include a liquid processing unit 341, and the liquid processing unit 341 is used to perform glue coating on the surface of the wafer; the cleaning process layer 5 includes a front washing process unit 51, which is used to clean the front side of the wafer; the second interlayer process module 4 includes a back washing process unit 41, which is used to clean the back side of the wafer.

[0041] It is worth noting that a buffer position 15, a crane position 16 and a manual position 17 are also provided in the cassette module 1; the crane position 16 is used to load the wafer cassette 14 taken from the crane; the manual position 17 is used to load the wafer cassette 14 transported by manpower; the cassette manipulator 11 is used to take the wafer cassette 14 from the crane position 16 or the manual position 17. The buffer position 15 is provided between the wafer manipulator 12 and the cassette loading unit 13, and is used to buffer and place the wafer cassette 14.

[0042] like Figure 3 As shown, it is worth noting that the first through-the-wall cooling unit 81 and the second through-the-wall cooling unit 82 both include a first through-the-wall portion 802 and a cooling portion 801; the first end of the first through-the-wall portion 802 is fixed, and the second end of the first through-the-wall portion 802 is movable relative to the first end for transferring wafers; the cooling portion 801 is used for cooling and in contact with the surface of the wafer to cool the wafer.

[0043] like Figure 1As shown, specifically, the first glue coating process layer 301 is provided with a first layer inner manipulator; the second glue coating process layer 302 is provided with a second layer inner manipulator; the third glue coating process layer 303 is provided with a third layer inner manipulator 333; the cleaning process layer 5 is provided with a cleaning manipulator 52; exemplary, the third layer inner manipulator 333 is provided between the third glue coating process layer 303 of the first process module 31 and the third glue coating process layer 303 of the second process module 32. In other examples, the first process module 31 and the second process module 32 are both provided with N process layers, N is an arbitrary positive integer, and the Nth layer inner manipulator is provided between the Nth process layer of the first process module 31 and the Nth process layer of the second process module 32.

[0044] like Figure 4 As shown, in some embodiments, it also includes a through-wall optical detection unit 7, which includes a second through-wall portion 703, a light source 702 and a camera 701; the first end of the second through-wall portion 703 is fixed, and the second end of the second through-wall portion 703 is movable relative to the first end, and is used to transmit the wafer; the light source 702 is used to project light onto the surface of the wafer, and the camera 701 is used to receive light reflected by the surface of the wafer.

[0045] Specifically, the through-the-wall optical inspection unit 7 is disposed between the third glue coating process layer 303 and the first interlayer process module 2, and is used to transfer the wafers in the third glue coating process layer 303 to the first interlayer process module 2, and perform optical inspection on the wafers at the same time.

[0046] It is worth noting that the first through-the-wall cooling unit 81 or the through-the-wall optical detection unit 7 can also be arranged in the Mth process layer, where M is any positive integer; this embodiment can meet different process requirements.

[0047] like Figure 5 As shown, in some embodiments, a through-wall edge exposure unit 6 is also included, and the through-wall edge exposure unit 6 includes a third through-wall portion 602 and an exposure portion 601; the first end of the third through-wall portion 602 is fixed, and the second end of the third through-wall portion 602 is movable relative to the first end, and is used to transfer the wafer; the exposure portion 601 covers the edge of the wafer, and is used to expose the edge of the wafer for process.

[0048] Specifically, the through-wall edge exposure unit 6 is arranged between the second glue coating process layer 302 and the second interlayer process module 4, and is used to transfer the wafer in the second glue coating process layer 302 to the second interlayer process module 4, and simultaneously expose the edge of the wafer; a third through-wall robot 93 is also arranged between the second glue coating process layer 302 and the first interlayer process module 2, and is used to transfer the wafer in the first interlayer process module 2 to the second glue coating process layer 302.

[0049] like Figure 6 As shown, this embodiment uses a control method for glue coating and developing equipment, including: S1, controlling the film box robot to place the film box taken out from the film box cache position to the film box loading unit, and the film box loading unit opens the first wafer transfer box; controlling the wafer robot to transfer the wafer in the first wafer transfer box to the wafer placement position of the first inter-layer process module; S2, controlling the first inter-layer robot to first place the wafer in the first through-wall cooling unit; after the first through-wall cooling unit loads the wafer, it transfers the wafer to the first glue coating process layer, the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then puts it into the first through-wall robot, and the first through-wall robot transfers the wafer back to the first inter-layer process module; S3, controlling the first inter-layer robot to place the wafer in the third through-wall robot, and after the third through-wall robot loads the wafer, it transfers the wafer to the second glue coating process layer, and the second glue coating process The in-layer robot in the process layer carries the wafer for a second processing and then places it in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, controls the second interlayer robot to carry the wafer for back side cleaning first, and then transfers the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer to the second through-wall robot; S5, the second through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning and places the wafer in the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0050] Specifically, after the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, it also includes: S6, controlling the second interlayer robot to put the wafer on the second through-the-wall cooling unit into the fourth through-the-wall robot, and the fourth through-the-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then places it into the through-the-wall optical inspection unit, and the through-the-wall optical inspection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module.

[0051] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A coating and developing device, characterized in that: It includes a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer which are arranged in sequence in the horizontal direction; The various glue coating process layers in the first process module are stacked in sequence from bottom to top; A first through-the-wall cooling unit is provided between the first process module and the first interlayer process module; and / or a second through-the-wall cooling unit is provided between the second interlayer process module and the cleaning process layer; The first through-the-wall cooling unit and the second through-the-wall cooling unit both include a first through-the-wall portion and a cooling portion; the first end of the first through-the-wall portion is fixed, and the second end of the first through-the-wall portion is movable relative to the first end for transferring wafers; the cooling portion is used for cooling and contacting the surface of the wafer to cool the wafer.

2. The device according to claim 1, characterized in that It also includes a second process module, which is arranged between the first inter-layer process module and the second inter-layer process module, and the second process module and the first process module are arranged in duplex symmetry.

3. The device according to claim 1, characterized in that The first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer. The first glue coating process layer, the second glue coating process layer, the third glue coating process layer, and the cleaning process layer all include a heat treatment unit. When the heat treatment unit is in a working state, it is used to bake the wafer; When the first through-the-wall cooling unit is disposed between the first glue coating process layer and the first inter-layer process module, it is used to transfer the wafers in the first inter-layer process module to the first glue coating process layer and cool the wafers at the same time; A first through-the-wall robot is further provided between the first glue coating process layer and the first inter-layer process module, for transferring the wafers in the first glue coating process layer to the first inter-layer process module; When the second through-the-wall cooling unit is disposed between the cleaning process layer and the second interlayer process module, it is used to transfer the wafers in the cleaning process layer to the second interlayer process module and cool the wafers at the same time; A second through-the-wall robot is also provided between the cleaning process layer and the second inter-layer process module, for transferring the wafers in the second inter-layer process module to the cleaning process layer.

4. The device according to claim 3, characterized in that It also includes a through-wall optical detection unit, which includes a second through-wall part, a light source and a camera; the first end of the second through-wall part is fixed, and the second end of the second through-wall part is movable relative to the first end, and is used to transmit the wafer; the light source is used to project light onto the surface of the wafer, and the camera is used to receive light reflected by the surface of the wafer.

5. The device according to claim 4, characterized in that The through-the-wall optical detection unit is arranged between the third glue coating process layer and the first interlayer process module, and is used to transfer the wafers in the third glue coating process layer to the first interlayer process module, and perform optical detection on the wafers at the same time.

6. The device according to claim 3 or 4, characterized in that It also includes a through-wall edge exposure unit, which includes a third through-wall part and an exposure part; the first end of the third through-wall part is fixed, and the second end of the third through-wall part is movable relative to the first end, and is used to transfer the wafer; the exposure part covers the edge of the wafer, and is used to expose the edge of the wafer for process.

7. The device according to claim 6, characterized in that The through-the-wall edge exposure unit is disposed between the second glue coating process layer and the second interlayer process module, and is used to transfer the wafer in the second glue coating process layer to the second interlayer process module, and simultaneously perform edge exposure processing on the wafer; A third through-the-wall robot is also provided between the second glue coating process layer and the first interlayer process module, and is used to transfer the wafers in the first interlayer process module to the second glue coating process layer.

8. The device according to claim 3, characterized in that The wafer box module is provided with a wafer box manipulator for loading and transferring a wafer transfer box, and the wafer transfer box is used to load wafers; A first interlayer robot is provided in the first interlayer process module, and is used to transfer wafers in the first interlayer process module; A second interlayer robot is provided in the second interlayer process module, and is used for transferring wafers in the second interlayer process module; Intra-layer robots are provided in the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer for transferring wafers within the layer so that the wafers can be processed.

9. The device according to claim 3, characterized in that The first glue coating process layer, the second glue coating process layer, and the third glue coating process layer all include a liquid processing unit, which is used to perform glue coating on the wafer surface; the cleaning process layer includes a front cleaning process unit, which is used to clean the front side of the wafer; the second interlayer process module includes a back cleaning process unit, which is used to clean the back side of the wafer.

10. A control method for a coating and developing device, characterized in that: include: S1, control the cassette robot to place the cassette taken from the cassette buffer position onto the cassette loading unit, and the cassette loading unit opens the first wafer transfer box; Controlling the wafer robot to transfer the wafer in the first wafer transfer box to the wafer placement position of the first interlayer process module; S2, controlling the first interlayer robot to first place the wafer into the first through-wall cooling unit; after loading the wafer, the first through-wall cooling unit transfers the wafer into the first glue coating process layer, the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into the first through-wall robot, and the first through-wall robot transfers the wafer back to the first interlayer process module; S3, control the first interlayer robot to place the wafer on the third through-wall robot, the third through-wall robot transfers the wafer to the second glue coating process layer after loading the wafer, the intra-layer robot in the second glue coating process layer carries the wafer for a second processing and then places it on the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, control the second interlayer robot to first carry the wafer to perform backside cleaning, and then transfer the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine is processed, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer to the second through-wall robot; S5, the second through-the-wall robot transfers the wafer to the cleaning process layer, the intra-layer robot in the cleaning process layer carries the wafer for front cleaning, and places the wafer into the second through-the-wall cooling unit; the second through-the-wall cooling unit transfers the wafer back to the second inter-layer process module.

11. The method according to claim 10, characterized in that After the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, the method further includes: S6, control the second interlayer robot to put the wafer on the second through-wall cooling unit into the fourth through-wall robot, and the fourth through-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then places it into the through-wall optical inspection unit, and the through-wall optical inspection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module.

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