Computer auxiliary heat dissipation device

Abstract

The invention discloses a computer auxiliary heat dissipation device, and belongs to the field of computer heat dissipation. A computer auxiliary heat dissipation device comprises an energy storage box and further comprises a plurality of heat preservation partition plates which are fixedly connected into the energy storage box at equal intervals, and energy storage cavities are formed between every two adjacent heat preservation partition plates and between the heat preservation partition plates and the energy storage box. The heat dissipation box is fixedly arranged on the lower side of the energy storage box; the heat preservation layer is arranged on the inner walls of the energy storage box and the heat dissipation box; the heat conducting sheet is fixedly arranged on the lower side of the heat dissipation box; the heat dissipation cavity is arranged in the heat dissipation box, and the heat dissipation cavity is communicated with the energy storage cavity; according to the invention, the cold energy is stored to quickly cool the CPU which is heavier in working load and sharply heated, and the cooling can be realized without increasing the power of the refrigerating machine and the circulating pump, so that the noise is effectively reduced, and the cooling efficiency of the CPU is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of computer heat dissipation, and in particular to a computer-assisted heat dissipation device. Background Art

[0002] Computer-aided cooling device is a cooling device. Computer is one of the more common office equipment, and CPU is the brain of the entire computer. The speed at which it processes data directly determines the performance of the computer. CPU generates heat during operation, and the temperature of CPU directly determines its performance in processing data. Therefore, cooling device is a necessary device for CPU.

[0003] At present, auxiliary heat dissipation devices mostly use air cooling or water cooling for heat dissipation. On the one hand, dust may stick to the air-cooled heat dissipation fins, and finally affect its heat dissipation effect. When the CPU is under high load processing data for a period of time, the CPU heats up quickly. At this time, the air-cooled or water-cooled cooling fan needs to rotate quickly to complete the heat dissipation. Therefore, when the CPU is used at a high frequency in a short period of time, the heat dissipation will generate a large noise, and the use of fans to blow air flow to achieve heat dissipation may result in untimely heat dissipation. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a computer-assisted heat dissipation device that can overcome the above problems or at least partially solve the above problems.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A computer-aided heat dissipation device comprises: an energy storage box, and also comprises: a plurality of heat-insulating baffles, which are equidistantly fixedly connected in the energy storage box, and an energy storage cavity is provided between two adjacent heat-insulating baffles and between the heat-insulating baffle and the energy storage box; a heat dissipation box, which is fixedly arranged on the lower side of the energy storage box; a heat-insulating layer, which is arranged on the inner wall of the energy storage box and the heat-dissipating box; a heat-conducting sheet, which is fixedly arranged on the lower side of the heat-dissipating box; a heat dissipation cavity, which is arranged in the heat dissipating box, and the heat dissipation cavity is connected to the energy storage cavity; a through hole, which is opened on the heat-insulating baffle, and a one-way valve is arranged in the through hole; a device box; a controller, which is fixedly arranged in the device box; an exhaust pipe, which is arranged on the energy storage box, and the exhaust pipe is connected to the uppermost The energy storage cavity is connected; a first connecting pipe is arranged on the heat dissipation box, and the first connecting pipe is connected to the heat dissipation cavity; a second connecting pipe is arranged on the energy storage box, and the second connecting pipe is connected to the energy storage cavity at the lower end; a refrigeration cycle component is arranged in the equipment box, the first connecting pipe and the second connecting pipe are both connected to the exhaust end of the refrigeration cycle component, and the exhaust pipe is connected to the air inlet end of the refrigeration cycle component; a first temperature sensor is arranged in the energy storage cavity; a second temperature sensor is arranged in the heat dissipation cavity; a first flow control valve is arranged in the first connecting pipe; a second flow control valve is arranged in the second connecting pipe; a plurality of mounting feet are arranged at the lower end of the heat dissipation box.

[0007] In order to facilitate the provision of cold air, the refrigeration cycle assembly further includes a circulation pump and a refrigerator fixedly arranged in an equipment box, a connecting pipe is fixedly connected between the air inlet end of the refrigerator and the exhaust end of the circulation pump, the air exhaust end of the circulation pump is connected to the air exhaust pipe, the exhaust end of the refrigerator is fixedly connected to the exhaust pipe, and the first connecting pipe and the second connecting pipe are both connected to the exhaust pipe.

[0008] Preferably, solenoid valves are provided in both the air extraction pipe and the air exhaust pipe.

[0009] In order to increase the heat dissipation area, a plurality of heat dissipation fins are further fixedly connected in the heat dissipation box.

[0010] In order to absorb the heat of the heat dissipation fins, further, a serpentine tube is fixedly connected between the plurality of heat dissipation fins, and the serpentine tube is communicated with the first connecting tube.

[0011] In order to fully realize the heat exchange between the cold air and the heat dissipation fins, further, a plurality of air jets are arranged on the serpentine tube.

[0012] Preferably, a rotating shaft is rotatably arranged in the heat dissipation cavity, and a first fan blade is fixedly connected to the rotating shaft.

[0013] In order to facilitate turbulence of the gas in the heat dissipation cavity and the gas in the energy storage cavity, further, one end of the rotating shaft extends to the top of the energy storage box, and the rotating shaft is sealed and rotatably connected to the thermal insulation baffle, a second fan blade is arranged in the energy storage cavity, the second fan blade is coaxially arranged with the rotating shaft, and the second fan blade is fixedly connected to the rotating shaft.

[0014] In order to facilitate the uniform flow of gas in the heat dissipation cavity and the energy storage cavity and realize sufficient heat exchange, further, diverter frames are provided in the energy storage cavity and the heat dissipation cavity, one of the diverter frames is fixedly connected to the energy storage box, and the other diverter frames are fixedly arranged on the lower side of the thermal insulation baffle, and a plurality of diverter holes are distributed in a circular pattern on the diverter frame, and the diameter of the diverter holes of the diverter frame gradually increases from the middle to the surrounding areas.

[0015] In order to reduce the generation of noise, further, sound insulation cotton is arranged in the device box, and a plurality of heat dissipation holes are arranged on one side of the device box.

[0016] Compared with the prior art, the present invention provides a computer-assisted heat dissipation device, which has the following beneficial effects:

[0017] 1. The computer-aided heat dissipation device extracts the gas in the energy storage cavity at the uppermost end through the exhaust pipe by a circulating pump, and then transports it to the refrigerator through a connecting pipe for refrigeration and cooling. The refrigerated gas is discharged through an exhaust pipe. The controller controls the first flow control valve and the second flow control valve to open, so that the gas flow in the first connecting pipe is set to value one, and the gas flow in the second connecting pipe is set to value two, and enters the heat dissipation cavity to cool the heat conducting plate, thereby realizing CPU heat dissipation. Part of the cold air in the refrigerator enters the energy storage cavity and flows, and circulates to the refrigerator again for refrigeration, so that the gas temperature in multiple energy storage cavities is gradually reduced, realizing the storage of cold energy. When the CPU workload is large, its temperature rises rapidly. The temperature in the heat dissipation cavity is obtained in real time through the second temperature sensor, and the temperature of the CPU is obtained through the temperature sensor inside the CPU. When the temperature of the CPU reaches the set temperature 1, the controller controls the gas flow in the first connecting pipe to reach the maximum through the first flow control valve, and at the same time, the controller controls the gas flow in the second connecting pipe to reach the minimum through the second flow control valve. At this time, the cold energy stored in the energy storage cavity when the CPU load is small can quickly cool the CPU, and at this time, there is no need to increase the power of the refrigerator and the circulation pump to achieve cooling, thereby effectively reducing the noise.

[0018] 2. The computer-aided heat dissipation device conducts the heat of the heat conductive plate through the heat dissipation fins, and at the same time, the gas in the first connecting pipe enters the serpentine tube and is then ejected, and the cold air in the serpentine tube exchanges heat with the heat dissipation fins, thereby effectively cooling the heat dissipation fins. At the same time, the cold air ejected upward through multiple air jets cools the heat dissipation fins, thereby effectively improving the efficiency of cooling the CPU.

[0019] 3. In the computer-aided heat dissipation device, when the gas flow rate through the second connecting pipe is greater than the gas flow rate through the first connecting pipe, the amount of gas flowing through the second fan blade is greater than the amount of gas flowing through the first fan blade, thereby improving the efficiency of gas turbulence in the heat dissipation cavity, thereby effectively preventing local heat accumulation of gas in the heat dissipation cavity when the first connecting pipe has low air supply efficiency to the heat dissipation cavity, thereby effectively improving the heat dissipation efficiency of the CPU.

[0020] The parts not involved in the device are the same as the prior art or can be implemented by the prior art. The present invention stores cold energy to quickly cool down the CPU with a large workload and a rapidly rising temperature. The cooling can be achieved without increasing the power of the refrigerator and the circulating pump, thereby effectively reducing the noise generation and effectively improving the efficiency of cooling the CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a computer-aided heat dissipation device proposed by the present invention;

[0022] Figure 2 A cross-sectional schematic diagram of a computer-aided heat dissipation device proposed by the present invention;

[0023] Figure 3 A computer-aided heat dissipation device proposed by the present invention Figure 2 The enlarged schematic diagram of point A in the middle;

[0024] Figure 4 This is an enlarged schematic diagram of point B in 2 of a computer-aided heat dissipation device proposed by the present invention;

[0025] Figure 5 A schematic diagram of the structure of a device box in a computer-aided heat dissipation device proposed by the present invention;

[0026] Figure 6 A schematic diagram of the structure of a shunt frame in a computer-aided heat dissipation device proposed by the present invention;

[0027] Figure 7 A schematic diagram of the structure of a heat dissipation box in a computer-aided heat dissipation device proposed by the present invention;

[0028] Figure 8 A computer-aided heat dissipation device proposed by the present invention Figure 7Enlarged schematic diagram of point C in the middle.

[0029] In the figure: 1, energy storage box; 101, insulation layer; 102, insulation baffle; 103, energy storage chamber; 104, through hole; 105, one-way valve; 106, first temperature sensor; 2, heat dissipation box; 201, heat dissipation chamber; 202, heat conducting sheet; 203, heat dissipation fin; 204, second temperature sensor; 205, serpentine tube; 206, air jet; 207, mounting foot; 3, rotating shaft; 301, first fan blade; 3 02, second fan blade; 303, diverter frame; 304, diverter hole; 4, equipment box; 401, controller; 402, circulation pump; 403, refrigerator; 404, exhaust pipe; 405, connecting pipe; 406, exhaust pipe; 407, sound insulation cotton; 408, heat dissipation hole; 409, solenoid valve; 5, first connecting pipe; 501, second connecting pipe; 502, first flow control valve; 503, second flow control valve. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Example 1: Reference Figure 1-Figure 8A computer-aided heat dissipation device comprises: an energy storage box 1, and also comprises: a plurality of heat-insulating baffles 102, which are equidistantly fixedly connected in the energy storage box 1, and energy storage cavities 103 are arranged between two adjacent heat-insulating baffles 102 and between the heat-insulating baffles 102 and the energy storage box 1; a heat dissipation box 2, which is fixedly arranged on the lower side of the energy storage box 1; a heat-insulating layer 101, which is arranged on the inner wall of the energy storage box 1 and the heat-dissipating box 2; a heat-conducting sheet 202, which is fixedly arranged on the lower side of the heat dissipation box 2; a heat dissipation cavity 201, which is arranged in the heat dissipation box 2, and the heat dissipation cavity 201 is connected with the energy storage cavity 103; a through hole 104, which is opened on the heat-insulating baffle 102, and a one-way valve 105 is arranged in the through hole 104; a device box 4; a controller 401, which is fixedly arranged in the device box 4; an exhaust pipe 404, which is arranged on the energy storage box 1, and the exhaust pipe 404 is connected to the one-way valve 105 located at the energy storage box 1. The energy storage cavity 103 at the top is connected; the first connecting pipe 5 is arranged on the heat dissipation box 2, and the first connecting pipe 5 is connected to the heat dissipation cavity 201; the second connecting pipe 501 is arranged on the energy storage box 1, and the second connecting pipe 501 is connected to the energy storage cavity 103 at the bottom; the refrigeration cycle component is arranged in the equipment box 4, the first connecting pipe 5 and the second connecting pipe 501 are both connected to the exhaust end of the refrigeration cycle component, and the exhaust pipe 404 is connected to the air inlet end of the refrigeration cycle component; the first temperature sensor 106 is arranged in the energy storage cavity 103; the second temperature sensor 204 is arranged in the heat dissipation cavity 201; the first flow control valve 502 is arranged in the first connecting pipe 5; the second flow control valve 503 is arranged in the second connecting pipe 501; a plurality of mounting feet 207 are arranged at the lower end of the heat dissipation box 2.

[0032] The refrigeration cycle component includes a circulation pump 402 and a refrigerator 403 fixedly arranged in the equipment box 4, a connecting pipe 405 is fixedly connected between the air inlet end of the refrigerator 403 and the exhaust end of the circulation pump 402, the exhaust end of the circulation pump 402 is connected to the exhaust pipe 404, the exhaust end of the refrigerator 403 is fixedly connected to the exhaust pipe 406, and the first connecting pipe 5 and the second connecting pipe 501 are both connected to the exhaust pipe 406.

[0033] The exhaust pipe 404 , the exhaust pipe 406 , the first connecting pipe 5 and the second connecting pipe 501 are all heat-insulating pipes, and a certain amount of helium is pre-filled in the energy storage chamber 103 and the heat dissipation chamber 201 .

[0034] When the computer is turned on, the controller 401 controls the circulation pump 402 and the refrigerator 403 to start. The circulation pump 402 extracts the gas in the energy storage chamber 103 at the uppermost end through the exhaust pipe 404, and then transports it to the refrigerator 403 through the connecting pipe 405 for refrigeration and cooling. The refrigerated gas is discharged through the exhaust pipe 406. The controller 401 controls the first flow control valve 502 and the second flow control valve 503 to open, so that the gas flow in the first connecting pipe 5 is set to value one, and the gas flow in the second connecting pipe 501 is set to value two, and enters the heat dissipation chamber 201 to cool the heat conductive plate 202, thereby realizing CPU heat dissipation. Part of the cold air passes through the refrigerator 403 and enters the energy storage chamber 103 to flow, and circulates to the refrigerator 403 again for refrigeration, so that the gas temperature in multiple energy storage chambers 103 gradually decreases, realizing the storage of cold energy.

[0035] When the CPU workload is large, its temperature rises rapidly. The temperature in the heat dissipation chamber 201 is obtained in real time through the second temperature sensor 204, and the temperature of the CPU is obtained through the temperature sensor inside the CPU. When the temperature of the CPU reaches the set temperature 1, the controller 401 controls the gas flow in the first connecting pipe 5 to reach the maximum through the first flow control valve 502. At the same time, the controller 401 controls the gas flow in the second connecting pipe 501 to reach the minimum through the second flow control valve 503. At this time, the cold energy stored in the energy storage chamber 103 when the CPU load is small can quickly cool the CPU, and at this time, there is no need to increase the power of the refrigerator 403 and the circulation pump 402 to achieve cooling, thereby effectively reducing the generation of noise.

[0036] When the CPU temperature does not reach the set temperature 1, the controller 401 controls the gas flow in the first connecting pipe 5 to reach the set value 1 through the first flow control valve 502, and the second flow control valve 503 controls the gas flow in the second connecting pipe 501 to reach the set value 2.

[0037] The first flow control valve 502 controls the flow of gas from the first connecting pipe 5 into the heat dissipation chamber 201 , and the second flow control valve 503 controls the flow of gas in the second connecting pipe 501 into the energy storage chamber 103 .

[0038] When the first temperature sensor 106 detects that the temperature in the energy storage chamber 103 reaches a specified temperature, the controller 401 controls the refrigerator 403 to shut down.

[0039] When the second temperature sensor 204 detects that the temperature in the heat dissipation chamber 201 is lower than the set value, the controller 401 controls the gas through the second flow control valve 503 so that it no longer passes through the first connecting pipe 5. At this time, the controller 401 fully opens the second flow control valve 503 to allow the gas in the exhaust pipe 406 to completely pass through the second connecting pipe 501, thereby effectively preventing the temperature in the heat dissipation chamber 201 from being too low and affecting the CPU operation.

[0040] When the temperature sensor in the CPU detects that its temperature reaches the set temperature 2, the controller 401 controls the circulation pump 402 and the refrigerator 403 to improve the working efficiency and achieve stable temperature reduction.

[0041] The closed heat dissipation device is used to effectively prevent dust from affecting its heat dissipation effect, and the heat dissipation is more stable.

[0042] It should be noted that the device box 4 can be installed at a corner of the computer host or outside the host, but is not limited to being installed.

[0043] Solenoid valves 409 are provided in both the air extraction pipe 404 and the exhaust pipe 406 .

[0044] When the computer is shut down, the controller 401 controls the electromagnetic valves 409 in the air extraction pipe 404 and the exhaust pipe 406 to close, thereby effectively reducing the cold energy loss in the energy storage chamber 103 when the computer is shut down.

[0045] Example 2: Reference Figure 2 , Figure 7 and Figure 8 , a computer-aided heat dissipation device, which is basically the same as Example 1, and further, a plurality of heat dissipation fins 203 are fixedly connected in the heat dissipation box 2.

[0046] A serpentine tube 205 is fixedly connected between the plurality of heat dissipation fins 203 , and the serpentine tube 205 is communicated with the first connecting tube 5 .

[0047] The serpentine tube 205 is provided with a plurality of air injection ports 206 .

[0048] The heat of the heat conducting plate 202 is conducted through the heat dissipation fins 203, and the gas in the first connecting tube 5 enters the serpentine tube 205 and is then ejected. The cold air in the serpentine tube 205 exchanges heat with the heat dissipation fins 203, thereby effectively cooling the heat dissipation fins 203. At the same time, the cold air ejected upward through the multiple air jets 206 cools the heat dissipation fins 203, thereby effectively improving the efficiency of cooling the CPU.

[0049] Example 3: Reference Figure 2, a computer-aided heat dissipation device, which is basically the same as Example 1, and further, a rotating shaft 3 is rotatably arranged in the heat dissipation cavity 201, and a first fan blade 301 is fixedly connected to the rotating shaft 3.

[0050] One end of the rotating shaft 3 extends to the top of the energy storage box 1, and the rotating shaft 3 is sealed and rotatably connected to the heat preservation partition 102. A second fan blade 302 is arranged in the energy storage cavity 103, and the second fan blade 302 is coaxially arranged with the rotating shaft 3 and fixedly connected to the rotating shaft 3.

[0051] When the gas in the heat dissipation cavity 201 flows upward through the through hole 104, the gas blows the first fan blade 301 to rotate, causing the rotating shaft 3 to rotate. At the same time, when the gas in the lower energy storage cavity 103 flows upward, it will blow the second fan blade 302, and the wind blows to the first fan blade 301 and the second fan blade 302 to rotate the rotating shaft 3. The rotation of the first fan blade 301 causes turbulence in the gas in the heat dissipation cavity 201, thereby effectively preventing local heat accumulation in the heat dissipation cavity 201 from affecting the heat dissipation efficiency of the CPU.

[0052] When the gas flow through the second connecting tube 501 is greater than the gas flow through the first connecting tube 5, the amount of gas flowing through the second fan blade 302 is greater than the amount of gas flowing through the first fan blade 301, thereby improving the efficiency of gas turbulence in the heat dissipation cavity 201, thereby effectively preventing local heat accumulation of gas in the heat dissipation cavity 201 when the first connecting tube 5 has low air supply efficiency to the heat dissipation cavity 201, thereby effectively improving the heat dissipation efficiency of the CPU.

[0053] Example 4: Reference Figure 5 and Figure 6 A computer-aided heat dissipation device is basically the same as Example 1, and further, a shunt frame 303 is provided in the energy storage cavity 103 and the heat dissipation cavity 201, one of the shunt frames 303 is fixedly connected to the energy storage box 1, and the other shunt frames 303 are fixedly arranged on the lower side of the insulation partition 102, and a plurality of shunt holes 304 are distributed in a circular pattern on the shunt frame 303, and the diameter of the shunt holes 304 of the shunt frame 303 gradually increases from the middle to the surrounding areas.

[0054] When the gas in the heat dissipation cavity 201 flows into the energy storage cavity 103, the gas in the heat dissipation cavity 201 enters the diversion frame 303 through the diversion hole 304 on the diversion frame 303, and finally enters the energy storage cavity 103 through the through hole 104, so that the gas in the heat dissipation cavity 201 flows evenly into the energy storage cavity 103, thereby effectively preventing the accumulation of hot air and cold air in the heat dissipation cavity 201, and allowing the cold air and hot air in the heat dissipation cavity 201 to fully achieve heat exchange, thereby effectively improving the heat dissipation efficiency of the CPU.

[0055] When the gas in the lower energy storage chamber 103 flows into the upper energy storage chamber 103, the diverter frame 303 has the same effect, preventing the relatively high temperature gas from directly entering the exhaust pipe 404 along the middle of the energy storage chamber 103 for circulating refrigeration, thereby effectively preventing the relatively high temperature gas from entering the heat dissipation chamber 201 and affecting the heat dissipation effect on the CPU.

[0056] Specific reference Figure 6 The diameter of the diversion hole 304 close to the through hole 104 is smaller than the diameter of the diversion hole 304 far from the through hole 104. Since the gas flow rate near the through hole 104 is relatively large, the gas diversion is achieved by setting a relatively small number of diversion holes 304 with relatively small diameters, so that the gas can be diverted along the surface of the entire diversion frame 303.

[0057] Sound insulation cotton 407 is arranged in the device box 4, and a plurality of heat dissipation holes 408 are arranged on one side of the device box 4.

[0058] The noise generated by the refrigerator 403 and the circulation pump 402 in the equipment box 4 is reduced by providing the sound insulation cotton 407.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A computer-aided heat dissipation device, comprising: an energy storage box (1), characterized in that: Also includes: A plurality of heat-insulating baffles (102) are fixedly connected in the energy storage box (1) at equal intervals, and an energy storage cavity (103) is provided between two adjacent heat-insulating baffles (102) and between a heat-insulating baffle (102) and the energy storage box (1); A heat dissipation box (2) is fixedly arranged on the lower side of the energy storage box (1); A thermal insulation layer (101) is arranged on the inner walls of the energy storage box (1) and the heat dissipation box (2); A heat conducting sheet (202) fixedly arranged on the lower side of the heat dissipation box (2); A heat dissipation cavity (201) is arranged in the heat dissipation box (2), and the heat dissipation cavity (201) is connected to the energy storage cavity (103); A through hole (104) is provided on the heat-insulating baffle (102), and a one-way valve (105) is provided in the through hole (104); Equipment box (4); A controller (401) is fixedly arranged in the device box (4); An air extraction pipe (404) is arranged on the energy storage box (1), and the air extraction pipe (404) is connected to the energy storage chamber (103) located at the uppermost end; A first connecting pipe (5) is arranged on the heat dissipation box (2), and the first connecting pipe (5) is connected to the heat dissipation cavity (201); A second connecting tube (501) is arranged on the energy storage box (1), and the second connecting tube (501) is connected to the energy storage cavity (103) at the lower end; A refrigeration cycle component is arranged in the device box (4), the first connecting pipe (5) and the second connecting pipe (501) are both connected to the exhaust end of the refrigeration cycle component, and the exhaust pipe (404) is connected to the intake end of the refrigeration cycle component; A first temperature sensor (106) is arranged in the energy storage chamber (103); A second temperature sensor (204) is arranged in the heat dissipation cavity (201); A first flow control valve (502) is arranged in the first connecting pipe (5); A second flow control valve (503), arranged in the second connecting pipe (501); A plurality of mounting feet (207) are arranged at the lower end of the heat dissipation box (2).

2. A computer-aided heat dissipation device according to claim 1, characterized in that: The refrigeration cycle component comprises a circulation pump (402) and a refrigerator (403) fixedly arranged in the equipment box (4); a connecting pipe (405) is fixedly connected between the air inlet end of the refrigerator (403) and the exhaust end of the circulation pump (402); the air extraction end of the circulation pump (402) is connected to the air extraction pipe (404); the exhaust end of the refrigerator (403) is fixedly connected to the exhaust pipe (406); and the first connecting pipe (5) and the second connecting pipe (501) are both connected to the exhaust pipe (406).

3. A computer-assisted heat dissipation device according to claim 2, characterized in that: The air extraction pipe (404) and the exhaust pipe (406) are both provided with electromagnetic valves (409).

4. A computer-assisted heat dissipation device according to claim 1, characterized in that: A plurality of heat dissipation fins (203) are fixedly connected inside the heat dissipation box (2).

5. A computer-assisted heat dissipation device according to claim 4, characterized in that: A serpentine tube (205) is fixedly connected between the plurality of heat dissipation fins (203), and the serpentine tube (205) is in communication with the first connecting tube (5).

6. A computer-assisted heat dissipation device according to claim 5, characterized in that: The serpentine tube (205) is provided with a plurality of air injection ports (206).

7. The computer-assisted heat dissipation device according to claim 1, characterized in that: A rotating shaft (3) is rotatably arranged in the heat dissipation cavity (201), and a first fan blade (301) is fixedly connected to the rotating shaft (3).

8. The computer-assisted heat dissipation device according to claim 7, characterized in that: One end of the rotating shaft (3) extends to the top of the energy storage box (1), and the rotating shaft (3) is sealed and rotatably connected to the heat-insulating baffle (102); a second fan blade (302) is arranged in the energy storage cavity (103); the second fan blade (302) is coaxially arranged with the rotating shaft (3), and the second fan blade (302) is fixedly connected to the rotating shaft (3).

9. The computer-assisted heat dissipation device according to claim 1, characterized in that: A shunt frame (303) is provided in each of the energy storage cavity (103) and the heat dissipation cavity (201), wherein one of the shunt frames (303) is fixedly connected to the energy storage box (1), and the other shunt frames (303) are fixedly arranged on the lower side of the heat-insulating baffle (102), and the shunt frame (303) is provided with a plurality of shunt holes (304) distributed in a circumferential manner, and the diameters of the shunt holes (304) of the shunt frame (303) gradually increase from the middle to the surrounding areas.

10. The computer-aided heat dissipation device according to claim 1, characterized in that: Sound insulation cotton (407) is arranged in the device box (4), and a plurality of heat dissipation holes (408) are arranged on one side of the device box (4).

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