Electrothermal simulation processing method, device and equipment for printed circuit board and storage medium

Abstract

The invention provides a printed circuit board electric heating simulation processing method, device and equipment and a storage medium, and relates to the technical field of simulation processing, and the method comprises the steps: carrying out the current simulation of a printed circuit board, generating a printed circuit board grid model comprising a plurality of printed circuit board grid units, and collecting the current distribution data of the printed circuit board; calculating the heating power of each printed circuit board grid unit; establishing a printed circuit board grid model; mapping the printed circuit board grid units into the printed circuit board grid model, and calculating the equivalent heating power of each grid unit; building a printed circuit board thermal simulation model comprising a plurality of thermal grid units, and configuring the equivalent heating power as the target heating power of the thermal grid units; and carrying out thermal simulation analysis on the printed circuit board, and drawing a temperature distribution diagram of the printed circuit board. According to the invention, the precision and efficiency of electrothermal simulation processing can be improved, and the accurate temperature distribution condition of the printed circuit board can be obtained.

Description

Technical Field

[0001] The present invention relates to the field of simulation processing technology, and in particular to a method, device, equipment and storage medium for electrothermal simulation processing of a printed circuit board. Background Art

[0002] As electronic devices become more integrated and their functions more complex, PCB (Printed Circuit Board) is the core component of electronic devices, and thermal design issues are receiving more and more attention. In high-power density applications, the components and circuits inside the printed circuit board will generate a lot of heat. If the heat cannot be effectively dissipated, the performance of the electronic components will be reduced, the life will be shortened, and even overheating failure will occur. Therefore, thermal simulation technology for printed circuit boards has become a key link in electronic thermal design.

[0003] In the prior art, a simplified model is usually used to perform thermal simulation on a printed circuit board, and its heating area is set as a single heat source. However, the simplified model will ignore the difference in heating power in different areas, resulting in distorted simulation results and failure to accurately reflect the actual temperature distribution. Summary of the invention

[0004] The problem solved by the present invention is how to improve the thermal simulation accuracy of the printed circuit board area and obtain the accurate temperature distribution of the printed circuit board.

[0005] In order to solve the above problems, the present invention provides a method, device, equipment and storage medium for electrothermal simulation processing of a printed circuit board.

[0006] In a first aspect, the present invention provides a method for electrothermal simulation processing of a printed circuit board, which is used to perform electrothermal simulation processing on a printed circuit board in an electronic device, comprising:

[0007] Performing current simulation on the printed circuit board according to circuit design data of the printed circuit board, generating a grid model of the printed circuit board, and collecting current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board;

[0008] Calculate the heating power of each grid unit of the printed circuit board according to the current distribution data;

[0009] Establishing a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units;

[0010] Mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit;

[0011] Building a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, configuring the equivalent heating power as the target heating power of the thermal grid unit, and setting each of the thermal grid units as a heat source, to obtain a target thermal simulation model of the printed circuit board;

[0012] A printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model to obtain a printed circuit board thermal simulation result, and a temperature distribution diagram of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

[0013] Optionally, the current distribution data includes current data and resistance data of grid cells of the printed circuit board.

[0014] Optionally, calculating the heating power of each grid unit of the printed circuit board according to the current distribution data includes:

[0015] Calculating the current distribution data using the Joule heat formula to obtain the heating power of each grid unit of the printed circuit board;

[0016] The Joule heat calculation formula is:

[0017] P=I 2 R;

[0018] Wherein, P represents the heat generation power of the printed circuit board grid unit, I represents the current flowing through the printed circuit board grid unit, and R represents the resistance of the printed circuit board grid unit.

[0019] Optionally, mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit includes:

[0020] Discretizing each of the printed circuit board grid units to obtain a plurality of printed circuit board grid sub-units of equal volume;

[0021] Calculating the heating power of each of the printed circuit board grid sub-units based on the heating power of the printed circuit board grid unit;

[0022] Mapping the printed circuit board grid sub-unit to a corresponding position in the printed circuit board grid model to determine an equivalent mapping pair, wherein the equivalent mapping pair is used to characterize the corresponding relationship between the printed circuit board grid sub-unit and the grid sub-unit;

[0023] Based on the heat generation power of the grid sub-units of the printed circuit board, the equivalent heat generation power of each of the grid units is calculated according to the equivalent mapping pair.

[0024] Optionally, the printed circuit board grid unit is divided into N printed circuit board grid sub-units of equal volume after discretization processing, and the calculation formula for calculating the heating power of each printed circuit board grid sub-unit based on the heating power of the printed circuit board grid unit is:

[0025]

[0026] Among them, P a represents the heating power of the printed circuit board grid sub-unit, p represents the heating power of the printed circuit board grid unit, and N represents the number of printed circuit board grid sub-units into which each printed circuit board grid sub-unit is divided.

[0027] Optionally, the step of calculating the equivalent heating power of each grid unit according to the equivalent mapping pair based on the heating power of the grid subunit of the printed circuit board comprises:

[0028] Determine a printed circuit board grid sub-unit corresponding to each of the grid units based on the equivalent mapping pair, wherein the printed circuit board grid sub-unit corresponding to each of the grid units includes a first printed circuit board grid sub-unit and a second printed circuit board grid sub-unit, wherein the first printed circuit board grid sub-unit represents a printed circuit board grid sub-unit completely located in the grid unit, and the second printed circuit board grid sub-unit represents a printed circuit board grid sub-unit partially located in the grid unit;

[0029] Determining the heating power of the first printed circuit board grid subunit;

[0030] Based on the heat generation power of the second printed circuit board grid subunit, determining the actual heat generation power of the second printed circuit board grid subunit in the grid unit according to the volume proportion of the second printed circuit board grid subunit in the grid unit;

[0031] The equivalent heating power of each of the grid units is calculated based on the heating power of the first printed circuit board grid sub-unit and the actual heating power of the second printed circuit board grid sub-unit in the grid unit.

[0032] Optionally, the calculation formula of the equivalent heating power of the grid unit is:

[0033]

[0034] Among them, P W represents the equivalent heating power of the Wth grid unit, and the Wth grid unit corresponds to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, Pk represents the heat generation power of the kth grid subunit of the first printed circuit board, P m Represents the actual heat generation power of the mth grid sub-unit of the second printed circuit board in the grid unit.

[0035] In a second aspect, the present invention provides a printed circuit board electrothermal simulation processing device, which is used to execute the above-mentioned printed circuit board electrothermal simulation processing method, and is characterized by comprising:

[0036] An electrical simulation module, used to perform current simulation on the printed circuit board according to the circuit design data of the printed circuit board, generate a grid model of the printed circuit board, and collect current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board;

[0037] A heating power module, used for calculating the heating power of each grid unit of the printed circuit board according to the current distribution data;

[0038] A printed circuit board grid model module is used to establish a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units;

[0039] A mapping module, used to map the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculate the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit;

[0040] A thermal simulation model building module, used to build a thermal simulation model of a printed circuit board based on the printed circuit board grid model, wherein the thermal simulation model of the printed circuit board includes a plurality of thermal grid units corresponding to the grid units, the equivalent heating power is configured as a target heating power of the thermal grid unit, and each of the thermal grid units is set as a heat source to obtain a target thermal simulation model of the printed circuit board;

[0041] The thermal simulation module is used to perform thermal simulation analysis of the printed circuit board based on the target thermal simulation model of the printed circuit board, obtain the thermal simulation result of the printed circuit board, and draw a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the printed circuit board.

[0042] In a third aspect, the present invention provides an electronic device, including a memory and a processor;

[0043] The memory is used to store computer programs;

[0044] The processor is used to implement the printed circuit board electrothermal simulation processing method as described in the first invention when executing the computer program.

[0045] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the printed circuit board electrothermal simulation processing method as described in the first aspect is implemented.

[0046] Compared with the prior art, the present invention has the following beneficial effects: first, according to the circuit design data of the printed circuit board, the current simulation of the printed circuit board is performed to generate a printed circuit board grid model including a plurality of printed circuit board grid units, and the printed circuit board grid model can refine the current distribution of each area of ​​the printed circuit board, and provide a data basis for the subsequent calculation of the heating power; the heating power calculation based on the current distribution data can accurately describe the heating characteristics of each area, and improve the accuracy of the heat source processing; then, by introducing the grid model, the complex structure of the printed circuit board can be simplified, so that the heat source of each area can be processed independently, thereby avoiding the error caused by a single heat source; then, by accurately mapping the grid unit of the printed circuit board to the grid model, and calculating the equivalent heating power of each grid unit based on the heating power, it can be ensured that the heat source distribution of the grid model is consistent with the current distribution and heating of the actual printed circuit board; then, by establishing a thermal simulation model based on the grid model, the complex heating power distribution can be converted into a plurality of independent heat sources that can be simulated, and the corresponding equivalent heating power is allocated to each thermal grid unit, so that the thermal simulation can accurately reflect the temperature field change of the printed circuit board; finally, an accurate temperature distribution map of the printed circuit board is obtained through thermal simulation analysis. The present invention can improve the accuracy and efficiency of electrothermal simulation processing and obtain accurate temperature distribution of a printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A schematic diagram of a process flow of a printed circuit board electrothermal simulation processing method provided by an embodiment of the present invention;

[0048] Figure 2 A schematic flow chart of step S14 of a printed circuit board electrothermal simulation processing method provided by one embodiment of the present invention;

[0049] Figure 3 A schematic structural diagram of a printed circuit board electrothermal simulation processing device provided by one embodiment of the present invention;

[0050] Figure 4 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0051] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be interpreted as being limited to the embodiments described herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0052] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0053] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to"; the term "based on" means "based at least in part on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0054] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0055] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0056] In view of the problem that the simulation results in the existing technology are distorted and cannot accurately reflect the actual temperature distribution, the improvement of thermal simulation accuracy has become the focus of research. In traditional methods, the simulation accuracy is often reduced due to insufficient number of mesh divisions or excessive model simplification, especially when dealing with multi-layer printed circuit boards or complex circuit structures, heat source processing is particularly difficult. Existing thermal simulation methods cannot accurately reflect the heating characteristics of different components and regions, resulting in the temperature distribution of the printed circuit board area not matching the actual situation, affecting subsequent thermal design and optimization.

[0057] Reference Figure 1The present invention provides a method for electrothermal simulation processing of a printed circuit board, which is used for electrothermal simulation processing of a printed circuit board in an electronic device, comprising:

[0058] S11, performing current simulation on the printed circuit board according to the circuit design data of the printed circuit board, generating a grid model of the printed circuit board, and collecting current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board.

[0059] First, obtain the circuit design data of the printed circuit board, such as the conductor layout, component arrangement, number of layers, material properties, etc. of the PCB, and import the circuit design data of the printed circuit board into the electromagnetic simulation software. Set the voltage and current boundary conditions according to the actual circuit situation. Then, use the electromagnetic simulation software to simulate the current distribution of the PCB to obtain the current distribution data of different areas of the PCB. During the simulation process, the PCB area is gridded to generate multiple printed circuit board grid units. Each printed circuit board grid unit contains corresponding geometric data and current distribution data, which provides a data basis for the subsequent calculation of heating power. Among them, the shape of the printed circuit board grid unit can be a triangular prism, a cuboid, etc., which can be flexibly set according to actual needs, and there is no restriction here.

[0060] S12. Calculate the heating power of each grid unit of the printed circuit board according to the current distribution data.

[0061] Specifically, after the current simulation is completed, the heating power of each grid unit is calculated according to the Joule heat formula, and the resistance value of the grid unit of the printed circuit board can be calculated according to the material, resistivity and geometric size of each grid unit. The heating function of each grid unit of the printed circuit board can reflect the heat generated by the grid unit.

[0062] S13, establishing a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units.

[0063] In order to simplify the thermal simulation model and improve the simulation efficiency, the printed circuit board is simplified into a grid model. The grid model divides the PCB into multiple grid cells. The number of grid cells depends on the number of layers, area and simulation accuracy requirements of the PCB. Each grid cell represents a small area in the PCB and will be treated as a heat source in subsequent steps.

[0064] S14: Map the grid units of the printed circuit board to corresponding positions in the grid model of the printed circuit board, and calculate the equivalent heating power of each grid unit based on the heating power of the grid units of the printed circuit board.

[0065] Specifically, the equivalent heating power of each grid unit can be obtained by accumulating the heating power of all the printed circuit board grid units mapped inside it. If the printed circuit board grid unit spans multiple grid units, the heating power can be proportionally allocated according to the proportion of the printed circuit board grid unit in each grid unit, thereby ensuring that the heat source distribution during the printed circuit board thermal simulation is highly consistent with the actual heat source distribution.

[0066] S15. Building a printed circuit board thermal simulation model based on the printed circuit board grid model, wherein the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, configuring the equivalent heating power as the target heating power of the thermal grid unit, and setting each of the thermal grid units as a heat source to obtain a target thermal simulation model of the printed circuit board.

[0067] Among them, each grid unit corresponds one-to-one to the corresponding printed circuit board thermal grid unit, and the equivalent heating power is set as the heat source of each thermal grid unit. The target heating power of the thermal grid unit is the input parameter during thermal simulation to ensure that the thermal simulation results can reflect the heating characteristics of different areas in the PCB.

[0068] S16, performing a thermal simulation analysis of the printed circuit board based on the target thermal simulation model of the printed circuit board to obtain a thermal simulation result of the printed circuit board, and drawing a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the printed circuit board.

[0069] Compared with the prior art, the present invention has the following beneficial effects: first, according to the circuit design data of the printed circuit board, the current simulation of the printed circuit board is performed to generate a printed circuit board grid model including a plurality of printed circuit board grid units, and the printed circuit board grid model can refine the current distribution of each area of ​​the printed circuit board, and provide a data basis for the subsequent calculation of the heating power; the heating power calculation based on the current distribution data can accurately describe the heating characteristics of each area, and improve the accuracy of the heat source processing; then, by introducing the grid model, the complex structure of the printed circuit board can be simplified, so that the heat source of each area can be processed independently, thereby avoiding the error caused by a single heat source; then, by accurately mapping the grid unit of the printed circuit board to the grid model, and calculating the equivalent heating power of each grid unit based on the heating power, it can be ensured that the heat source distribution of the grid model is consistent with the current distribution and heating of the actual printed circuit board; then, by establishing a thermal simulation model based on the grid model, the complex heating power distribution can be converted into a plurality of independent heat sources that can be simulated, and the corresponding equivalent heating power is allocated to each thermal grid unit, so that the thermal simulation can accurately reflect the temperature field change of the printed circuit board; finally, an accurate temperature distribution map of the printed circuit board is obtained through thermal simulation analysis. The present invention can improve the accuracy and efficiency of electrothermal simulation processing and obtain accurate temperature distribution of a printed circuit board.

[0070] In one embodiment, the current distribution data includes current data and resistance data of grid cells of the printed circuit board.

[0071] Specifically, the resistance data of the grid cells of the printed circuit board can be obtained through the resistivity and the geometric shape of the grid cells of the printed circuit board.

[0072] In one embodiment, calculating the heating power of each grid unit of the printed circuit board according to the current distribution data includes:

[0073] Calculating the current distribution data using the Joule heat formula to obtain the heating power of each grid unit of the printed circuit board;

[0074] The Joule heat calculation formula is:

[0075] P=I 2 R;

[0076] Wherein, P represents the heat generation power of the printed circuit board grid unit, I represents the current flowing through the printed circuit board grid unit, and R represents the resistance of the printed circuit board grid unit.

[0077] This embodiment can accurately calculate the heat generation power of each grid unit of the printed circuit board by using the Joule heat formula, thereby ensuring the accuracy of the thermal simulation results and providing high-precision input data for subsequent thermal simulations.

[0078] Reference Figure 2 , mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit includes:

[0079] S141. Discretize each of the printed circuit board grid units to obtain a plurality of printed circuit board grid sub-units of equal volume.

[0080] In order to improve the accuracy of the grid unit equivalent heat generation power, the printed circuit board grid unit can be first divided into a plurality of printed circuit board grid sub-units. The discretization process can be subdivided into a plurality of printed circuit board grid sub-units of the same volume according to the geometric shape of each printed circuit board grid unit, so that the position and heat generation power distribution of each printed circuit board grid sub-unit are more accurate.

[0081] S142: Calculate the heating power of each of the printed circuit board grid sub-units based on the heating power of the printed circuit board grid unit.

[0082] Specifically, the printed circuit board grid unit is divided into N printed circuit board grid sub-units of equal volume after discretization processing, and the calculation formula for calculating the heating power of each printed circuit board grid sub-unit based on the heating power of the printed circuit board grid unit is:

[0083]

[0084] Among them, P a represents the heating power of the printed circuit board grid sub-unit, p represents the heating power of the printed circuit board grid unit, and N represents the number of printed circuit board grid sub-units into which each printed circuit board grid sub-unit is divided.

[0085] S143: Map the printed circuit board grid sub-unit to a corresponding position in the printed circuit board grid model, and determine an equivalent mapping pair, where the equivalent mapping pair is used to characterize the corresponding relationship between the printed circuit board grid sub-unit and the grid sub-unit.

[0086] According to the spatial coordinates of each printed circuit board grid sub-unit, it is mapped to the grid unit covering the area, and a mapping pair relationship, i.e., an equivalent mapping pair, is determined therewith. If a printed circuit board grid sub-unit spans multiple grid units, its heating power is allocated to the corresponding grid unit according to the volume ratio of the overlapping part. This embodiment can improve the accuracy of the heating power mapping between the printed circuit board grid sub-unit and the grid unit.

[0087] S144. Based on the heat generation power of the grid sub-units of the printed circuit board, calculate the equivalent heat generation power of each of the grid units according to the equivalent mapping pair.

[0088] Specifically, based on the heat generation power of the grid subunit of the printed circuit board, calculating the equivalent heat generation power of each grid unit according to the equivalent mapping pair includes:

[0089] Determine a printed circuit board grid sub-unit corresponding to each of the grid units based on the equivalent mapping pair, wherein the printed circuit board grid sub-unit corresponding to each of the grid units includes a first printed circuit board grid sub-unit and a second printed circuit board grid sub-unit, wherein the first printed circuit board grid sub-unit represents a printed circuit board grid sub-unit completely located in the grid unit, and the second printed circuit board grid sub-unit represents a printed circuit board grid sub-unit partially located in the grid unit;

[0090] Determining the heating power of the first printed circuit board grid subunit;

[0091] Based on the heat generation power of the second printed circuit board grid subunit, determining the actual heat generation power of the second printed circuit board grid subunit in the grid unit according to the volume proportion of the second printed circuit board grid subunit in the grid unit;

[0092] The equivalent heating power of each of the grid units is calculated based on the heating power of the first printed circuit board grid sub-unit and the actual heating power of the second printed circuit board grid sub-unit in the grid unit.

[0093] This embodiment accurately distributes the heating power of the grid sub-units of the printed circuit board to the grid units through precise mapping and heating power distribution mechanism, especially finely distributes the partially overlapping grid sub-units of the printed circuit board according to the volume ratio, which can ensure that the equivalent heating power of the grid unit is highly consistent with the actual current distribution and heating conditions, thereby improving the accuracy and effectiveness of the electrothermal simulation.

[0094] In one embodiment, the calculation formula of the equivalent heating power of the grid unit is:

[0095]

[0096] Among them, P W represents the equivalent heating power of the Wth grid unit, and the Wth grid unit corresponds to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, P k represents the heat generation power of the kth grid subunit of the first printed circuit board, P m Represents the actual heat generation power of the mth grid sub-unit of the second printed circuit board in the grid unit.

[0097] This embodiment can effectively improve the calculation efficiency of the simulation while ensuring the accuracy of the heat power distribution.

[0098] Reference Figure 3 The present invention provides a printed circuit board electrothermal simulation processing device 30, which is used to execute the above-mentioned printed circuit board electrothermal simulation processing method, and is characterized by comprising:

[0099] The electrical simulation module 31 is used to perform current simulation on the printed circuit board according to the circuit design data of the printed circuit board, generate a grid model of the printed circuit board, and collect current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board;

[0100] A heating power module 32, used for calculating the heating power of each grid unit of the printed circuit board according to the current distribution data;

[0101] A printed circuit board grid model module 33 is used to establish a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units;

[0102] A mapping module 34, configured to map the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculate an equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit;

[0103] A thermal simulation model building module 35 is used to build a thermal simulation model of a printed circuit board based on the printed circuit board grid model, wherein the thermal simulation model of the printed circuit board includes a plurality of thermal grid units corresponding to the grid units, configures the equivalent heating power as a target heating power of the thermal grid unit, and sets each of the thermal grid units as a heat source, thereby obtaining a target thermal simulation model of the printed circuit board;

[0104] The thermal simulation module 36 is used to perform thermal simulation analysis of the printed circuit board based on the target thermal simulation model of the printed circuit board, obtain a thermal simulation result of the printed circuit board, and draw a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the printed circuit board.

[0105] Compared with the prior art, the beneficial effects of the present invention are as follows: first, the electrical simulation module 31 performs current simulation on the printed circuit board according to the circuit design data of the printed circuit board, and generates a printed circuit board grid model including a plurality of printed circuit board grid units. The printed circuit board grid model can refine the current distribution of each area of ​​the printed circuit board, and provide a data basis for the subsequent calculation of the heating power; the heating power calculation performed by the heating power module 32 based on the current distribution data can accurately describe the heating characteristics of each area, and improve the accuracy of heat source processing; then, the printed circuit board grid model module 33 can simplify the complex structure of the printed circuit board by introducing the grid model, so that the heat source of each area can be processed independently, thereby Avoid the error caused by a single heat source; then, the mapping module 34 accurately maps the grid unit of the printed circuit board to the grid model, and calculates the equivalent heating power of each grid unit based on the heating power, which can ensure that the heat source distribution of the grid model is consistent with the current distribution and heating conditions of the actual printed circuit board; then, the thermal simulation model building module 35 can transform the complex heating power distribution into multiple independent heat sources that can be simulated by establishing a thermal simulation model based on the grid model, and allocate the corresponding equivalent heating power to each thermal grid unit, so that the thermal simulation can accurately reflect the temperature field changes of the printed circuit board; finally, the thermal simulation module 36 obtains an accurate temperature distribution map of the printed circuit board through thermal simulation analysis. The present invention can improve the accuracy and efficiency of electrothermal simulation processing and obtain accurate temperature distribution of the printed circuit board.

[0106] Reference Figure 4, the present invention provides an electronic device 40, including a memory 41 and a processor 42;

[0107] The memory 41 is used to store computer programs;

[0108] The processor 42 is used to implement the above-mentioned printed circuit board electrothermal simulation processing method when executing the computer program.

[0109] In other words, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; and the processor 42 is configured to perform the following operations when executing the computer program:

[0110] Performing current simulation on the printed circuit board according to circuit design data of the printed circuit board, generating a grid model of the printed circuit board, and collecting current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board;

[0111] Calculate the heating power of each grid unit of the printed circuit board according to the current distribution data;

[0112] Establishing a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units;

[0113] Mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit;

[0114] Building a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, configuring the equivalent heating power as the target heating power of the thermal grid unit, and setting each of the thermal grid units as a heat source, to obtain a target thermal simulation model of the printed circuit board;

[0115] A printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model to obtain a printed circuit board thermal simulation result, and a temperature distribution diagram of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

[0116] The present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned printed circuit board electrothermal simulation processing method is implemented.

[0117] In other words, a non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor performs the following operations:

[0118] In other words, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; and the processor 42 is configured to perform the following operations when executing the computer program:

[0119] Performing current simulation on the printed circuit board according to circuit design data of the printed circuit board, generating a grid model of the printed circuit board, and collecting current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board;

[0120] Calculate the heating power of each grid unit of the printed circuit board according to the current distribution data;

[0121] Establishing a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units;

[0122] Mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit;

[0123] Building a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, configuring the equivalent heating power as the target heating power of the thermal grid unit, and setting each of the thermal grid units as a heat source, to obtain a target thermal simulation model of the printed circuit board;

[0124] A printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model to obtain a printed circuit board thermal simulation result, and a temperature distribution diagram of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

[0125] An electronic device 40 that can be used as a server or client of the present invention will now be described, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device 40 is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device 40 can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0126] The electronic device 40 includes a computing unit, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) or a computer program loaded from a storage unit into a random access memory (RAM). In the RAM, various programs and data required for the operation of the device can also be stored. The computing unit, ROM, and RAM are connected to each other via a bus. An input / output (I / O) interface is also connected to the bus.

[0127] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc. In the present application, the unit described as a separate component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, it may be located in one place, or it may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment of the present invention. In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0128] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. A method for electrothermal simulation processing of a printed circuit board, used for electrothermal simulation processing of a printed circuit board in an electronic device, characterized in that: include: Performing current simulation on the printed circuit board according to circuit design data of the printed circuit board, generating a grid model of the printed circuit board, and collecting current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board; Calculate the heating power of each grid unit of the printed circuit board according to the current distribution data; Establishing a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units; Mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit; Building a printed circuit board thermal simulation model based on the printed circuit board grid model, the printed circuit board thermal simulation model includes a plurality of thermal grid units corresponding to the grid units, configuring the equivalent heating power as the target heating power of the thermal grid unit, and setting each of the thermal grid units as a heat source, to obtain a target thermal simulation model of the printed circuit board; A printed circuit board thermal simulation analysis is performed based on the printed circuit board target thermal simulation model to obtain a printed circuit board thermal simulation result, and a temperature distribution diagram of the printed circuit board is drawn according to the printed circuit board thermal simulation result.

2. The method for electrothermal simulation processing of a printed circuit board according to claim 1, characterized in that: The current distribution data includes current data and resistance data of the grid cells of the printed circuit board.

3. The method for electrothermal simulation processing of a printed circuit board according to claim 2, characterized in that: The step of calculating the heating power of each grid unit of the printed circuit board according to the current distribution data comprises: Calculating the current distribution data using the Joule heat formula to obtain the heating power of each grid unit of the printed circuit board; The Joule heat calculation formula is: P=I 2 R; Wherein, P represents the heat generation power of the printed circuit board grid unit, I represents the current flowing through the printed circuit board grid unit, and R represents the resistance of the printed circuit board grid unit.

4. The method for electrothermal simulation processing of a printed circuit board according to claim 1, characterized in that: Mapping the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculating the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit includes: Discretizing each of the printed circuit board grid units to obtain a plurality of printed circuit board grid sub-units of equal volume; Calculating the heating power of each of the printed circuit board grid sub-units based on the heating power of the printed circuit board grid unit; Mapping the printed circuit board grid sub-unit to a corresponding position in the printed circuit board grid model to determine an equivalent mapping pair, wherein the equivalent mapping pair is used to characterize the corresponding relationship between the printed circuit board grid sub-unit and the grid sub-unit; Based on the heat generation power of the grid sub-units of the printed circuit board, the equivalent heat generation power of each of the grid units is calculated according to the equivalent mapping pair.

5. The method for electrothermal simulation processing of a printed circuit board according to claim 4, characterized in that: The printed circuit board grid unit is divided into N printed circuit board grid sub-units of equal volume after discretization processing, and the calculation formula for calculating the heating power of each printed circuit board grid sub-unit based on the heating power of the printed circuit board grid unit is: Among them, P a represents the heating power of the printed circuit board grid sub-unit, p represents the heating power of the printed circuit board grid unit, and N represents the number of printed circuit board grid sub-units into which each printed circuit board grid sub-unit is divided.

6. The method for electrothermal simulation processing of a printed circuit board according to claim 4, characterized in that: The step of calculating the equivalent heating power of each grid unit based on the heating power of the grid subunit of the printed circuit board according to the equivalent mapping pair comprises: Determine a printed circuit board grid sub-unit corresponding to each of the grid units based on the equivalent mapping pair, wherein the printed circuit board grid sub-unit corresponding to each of the grid units includes a first printed circuit board grid sub-unit and a second printed circuit board grid sub-unit, wherein the first printed circuit board grid sub-unit represents a printed circuit board grid sub-unit completely located in the grid unit, and the second printed circuit board grid sub-unit represents a printed circuit board grid sub-unit partially located in the grid unit; Determining the heating power of the first printed circuit board grid subunit; Based on the heat generation power of the second printed circuit board grid subunit, determining the actual heat generation power of the second printed circuit board grid subunit in the grid unit according to the volume proportion of the second printed circuit board grid subunit in the grid unit; The equivalent heating power of each of the grid units is calculated based on the heating power of the first printed circuit board grid sub-unit and the actual heating power of the second printed circuit board grid sub-unit in the grid unit.

7. The method for electrothermal simulation processing of a printed circuit board according to claim 6, characterized in that: The calculation formula of the equivalent heating power of the grid unit is: Among them, P W represents the equivalent heating power of the Wth grid unit, and the Wth grid unit corresponds to i first printed circuit board grid sub-units and l second printed circuit board grid sub-units, P k represents the heat generation power of the kth grid subunit of the first printed circuit board, P m Represents the actual heat generation power of the mth grid sub-unit of the second printed circuit board in the grid unit.

8. A printed circuit board electrothermal simulation processing device, used to execute the printed circuit board electrothermal simulation processing method according to any one of claims 1 to 7, characterized in that: include: An electrical simulation module, used to perform current simulation on the printed circuit board according to the circuit design data of the printed circuit board, generate a grid model of the printed circuit board, and collect current distribution data of the printed circuit board, wherein the grid model of the printed circuit board includes a plurality of grid units of the printed circuit board; A heating power module, used for calculating the heating power of each grid unit of the printed circuit board according to the current distribution data; A printed circuit board grid model module is used to establish a printed circuit board grid model, wherein the printed circuit board grid model includes a plurality of grid units; A mapping module, used to map the printed circuit board grid unit to a corresponding position in the printed circuit board grid model, and calculate the equivalent heating power of each grid unit based on the heating power of the printed circuit board grid unit; A thermal simulation model building module is used to build a thermal simulation model of a printed circuit board based on the printed circuit board grid model, wherein the thermal simulation model of the printed circuit board includes a plurality of thermal grid units corresponding to the grid units, the equivalent heating power is configured as a target heating power of the thermal grid unit, and each of the thermal grid units is set as a heat source to obtain a target thermal simulation model of the printed circuit board; The thermal simulation module is used to perform thermal simulation analysis of the printed circuit board based on the target thermal simulation model of the printed circuit board, obtain the thermal simulation result of the printed circuit board, and draw a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the printed circuit board.

9. An electronic device, characterized in that: including memory and processor; The memory is used to store computer programs; The processor is used to implement the electrothermal simulation processing method for a printed circuit board as claimed in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the printed circuit board electrothermal simulation processing method according to any one of claims 1 to 7 is implemented.

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