Component carrier and package

Abstract

The invention relates to a component carrier wherein the component carrier comprises a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component arranged in and / or on the stack, the component comprising at least one electrically conductive surface, at least one of the electrically conductive surfaces is connected to an electrically conductive connection element, the connection element extending from the electrically conductive surface away from the stack, the connection element is configured to be connected to at least one external component to be mounted on the component carrier and wherein the connection element is made of a heterogeneous conductive structure, and wherein the connection element is configured to be connected to the external component when at least one connection surface provided in or on the external component to be mounted on the component carrier faces the electrically conductive surface of the component, the heterogeneous conductive structure is arranged to permanently compensate for relative movement between the electrically conductive surface of the component and the connecting surface of the external component. The invention also relates to a package using such a component carrier.

Description

Technical Field

[0001] The invention relates to a component carrier and a package.

[0002] The invention relates to a component carrier, comprising: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure; a component arranged in and / or on the stack, the component comprising at least one electrically conductive surface, for example in the form of a pad, for establishing an electrical connection, the at least one electrically conductive surface being connected to an electrically conductive connecting element, the connecting element extending from the electrically conductive surface away from the stack and being configured to be connected to the external component when the at least one connecting surface arranged in or on an external component to be mounted on the component carrier faces the electrically conductive surface of the component. Background Art

[0003] The package on which the invention is based may comprise: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure; a component arranged in and / or on the stack, the component comprising at least one electrically conductive surface; and at least one external component comprising at least one connection surface. In particular, the component and the at least one external component are electrically connected to each other via at least one connection element in such a way that at least one electrically conductive surface of the component and at least one connection surface of the external component face each other.

[0004] For example, as proposed in CN 114334682 A, the connection between the carrier or package and the external components can be achieved by nanowires and conductive intermediate materials arranged on two opposite islands of two package structures (ie, flip chips on a substrate).

[0005] CN 114582744 A also discloses the feature of connecting the chip package via nanowires arranged on pillars placed opposite to each other.

[0006] On other types of carriers or packages, at least one external component may be mounted or arranged on / in the carrier and the at least one external component is directly or indirectly connected to another component in an electrically conductive manner. Measures for ensuring a secure connection under changing environmental conditions, in particular changing temperature conditions where different connected components have different expansions, during manufacturing and in use are very complex and expensive. Despite all these efforts, the known arrangements provided on a component carrier that is directly or indirectly connected to another component result in quality and reliability problems related to the alignment between the component and the component carrier and between the component connections in all orthogonal directions. In particular, the mismatch in coefficient of thermal expansion (CTE) between components and the mismatch in coefficient of thermal expansion (CTE) relative to the carrier at the position where one component is installed can cause mechanical stress in the connection between the carrier and the components and between the components; in an exemplary embodiment where the component arranged in and / or on the stack is a bridge connected to at least two external components, the mismatch in coefficient of thermal expansion (CTE) between the bridge and the carrier at the position of one or two external components in the assembled external components can cause heterogeneous expansion / displacement of the connection area (i.e., the electrically conductive surface of the bridge, the connection surface of the external component, and other areas on the carrier to which the external components are connected), thereby negatively affecting the stress of the connection between the external component and the bridge and between the external component and the carrier, increasing the risk of these connections breaking and / or failing over time during assembly and / or in the assembled state. Summary of the invention

[0007] The object of the present invention is to overcome the disadvantages of the prior art and to provide an improved component carrier and an improved package which in particular enable a reliable and stable connection between component and component carrier, independently of the environmental conditions, and which is simple and inexpensive to install, but reliable. In particular, the direct connection between components should be improved when the component is a bridge connecting two components or a component having a component and a carrier structure, because when installing or integrating the component, in particular even for difficult arrangements, at least one part of the component is exposed to mechanical stresses caused by a carrier having different physical properties, such as CTE.

[0008] In order to provide an enhanced component carrier, the invention proposes that the connecting element is made of a heterogeneous conductive structure, which is arranged to permanently compensate for relative movements between the connecting surface of the external component and the component carrier and the electrically conductive surface of the component. The term "permanently compensate for relative movements between two surfaces" means that during assembly of the component or in the assembled state of the component, mismatches in the alignment between the two surfaces and / or between different expansion rates during temperature changes of the material of the component and / or of the carrier structure carrying the at least one component are compensated in the planar direction of the component carrier (in the xy direction) and / or in the thickness direction of the component carrier (in the z direction) by the structure and / or inherent properties of the heterogeneous conductive structure. With the arrangement according to the invention, it is possible on the one hand to balance mechanical stresses and to compensate for differences related to geometric processes (e.g. production-related errors) in the x-, y- and z-axes. While mechanical stresses may be caused by CTE mismatches between components, external components and the stack providing the components (see above), geometric errors may occur for a variety of reasons; for example, components arranged in and / or on the stack may be tilted (e.g., a planar extension of the component and / or a bottom / upper surface of the component is not parallel relative to a planar main extension / one external surface) due to a non-constant vertical distribution of electrically conductive layer structures (along the component carrier thickness) below the component, resulting in a tilting of the component, leading to a misalignment of the component along the vertical direction (z-direction) of the component carrier. In particular, due to a dense distribution of electrically conductive layer structures (i.e., conductive traces, pads, etc.) in areas where the components are partially vertically overlapped, the adjacent and neighboring electrically insulating layer structure material (i.e., dielectric material) accumulates in a different manner relative to areas with a coarser distribution of (corresponding) electrically conductive layer structures, resulting in the surface of the component being supported differently in different areas, thereby leading to a tilted assembled component. According to experimental tests, when the electrically insulating layer structure comprises a resin material, preferably a filler is distributed in the electrically insulating layer structure, more preferably an inorganic filler / non-fibrous filler (especially a spherical filler), and / or when the amount of the electrically conductive layer structure below a portion of the components vertically overlapped (i.e., in terms of volume / weight per unit) is higher than the corresponding amount of the electrically conductive layer structure that vertically overlaps another portion of the same component; preferably, the resulting inclination of the component is between 0.05° and 10°. Due to the inclination of the component and / or the incorrect assembly of the external component with the component, the external component (i.e., its lower surface and / or its flat main extension) may preferably be tilted relative to the assembled component during and in the assembled state; according to one embodiment, the component and the external component may produce a vertical distance difference of 0.1μm to 10μm between two opposite planar ends.Additionally or alternatively, the misalignment between the component and the external component is preferably along a planar direction (xy plane of the component carrier); the misalignment may occur due to incorrect placement of one component relative to another component and / or due to tolerances between the electrically conductive surface of the component and the connection surface of the external component; such misalignment may occur during assembly between the component and the other component or in the assembled (operating) state, for example due to temperature changes; the planar misalignment may be a value between 0.1 μm and 10 μm along the planar (xy) direction. The heterogeneous conductive structure according to the invention is configured to compensate for these types of geometric errors, in particular to compensate for geometric errors in the ranges mentioned above.

[0009] An external component is understood to be a second component which can be arranged on a component carrier but is separated from the layer structure of the component carrier before assembly. In the use (assembly) position of the component carrier, the second (external) component is arranged to be preferably permanently electrically and / or mechanically connected to a first component which is arranged on the component carrier and which can be integrated in the layer structure of the component carrier.

[0010] Preferably, the connecting element is elastically deformable or at least temporarily deformable, wherein the deformation is at least one of compression, elongation, shearing or bending. In this way, a safe connection can be guaranteed during manufacture and during operation under changing environmental conditions, in particular under changing temperature conditions and in an operating position.

[0011] A first embodiment of the invention is characterized in that the heterostructure of the connection element comprises a solid electrically conductive material with voids inside. This can bring the advantage of ensuring a reliable physical and electrical connection while reducing the mass of the component carrier and the deformability provided by the heterostructure of the connection element itself.

[0012] The interstices can advantageously contain a gas, in particular air, or can be at least partially evacuated, the interstices preferably being at least partially connected to one another, thereby defining air channels. This can bring about the advantage of adjusting physical properties, such as the ductility / flexibility of the heterostructure.

[0013] According to another embodiment of the invention, if the voids include fillers, the voids are preferably at least partially sealed from each other. The fillers may include or consist of resins and / or elastomeric materials and / or liquids. This may bring the advantage of having a variety of materials to adjust the performance / behavior of the heterostructure. The fillers may also be electrically conductive. The sealing between the voids has the advantage of resulting in a different / more controllable deformability / elasticity of the connecting element, due to the fact that fillers with specific deformability / elastic properties do not have the possibility of expanding to other spaces than the space defined by the corresponding void. Then, it is entirely reasonable to use conductive fillers, appropriately combining deformability and conductive properties.

[0014] Another embodiment of the invention is characterized in that part of the void is open to the outside of the solid material, thereby affecting the size of the outer roughness and / or surface area of ​​the connection element. This can bring the advantage of ensuring a reliable connection to the heterostructure (via other materials, possibly an underfill to protect the heterostructure from harsh environments), for example by defining the deformability of the outer part of the connection element through its rough / serrated outer surface defined by the exposed void.

[0015] A further embodiment of the invention is characterized in that the heterostructure comprises a plurality of electrically conductive nanowires, the plurality of electrically conductive nanowires being spaced apart from each other, the plurality of electrically conductive nanowires being connected to the electrically conductive surface, and the plurality of electrically conductive nanowires extending away from the stack. This may bring about the advantage of enhancing the flexibility of the heterostructure. In addition, since the plurality of nanowires can produce a reliable electrical connection even in the event of a breakage of a few nanowires, a redundant connection may be achieved.

[0016] Preferably, each of the plurality of nanowires is connected to and / or bonded to and / or integrally bonded to the electrically conductive surface. This may bring the advantage of providing a reliable connection while still having flexible (physical) properties.

[0017] A further embodiment of the invention is characterized in that the heterostructure comprises an electrically conductive porous material which is connected to the electrically conductive surface. This can bring the advantage of enlarging the surface area of ​​the heterostructure and thus ensuring a reliable connection to the electrically conductive surface, the porosity defining the deformability of the connection element while ensuring appropriate conduction characteristics provided by the remaining conductive material.

[0018] According to a further embodiment of the invention, the heterostructure may comprise a liquid metal structure connected to the electrically conductive surface. This may bring the advantage of high flexibility, since liquids are known to be easily deformable substances.

[0019] Another embodiment of the present invention shows a heterostructure comprising a solder bump with rubber particles inside. This combination of (visco)elastic rubber and solder material can provide good physical and electrical connections while having flexible properties.

[0020] The component may be at least partially exposed outside the stack, thereby providing an easy-to-manufacture way to establish a reliable connection. Preferred is an arrangement in which the stack comprises at least one exposed electrically conductive surface, the at least one exposed electrically conductive surface being on a major surface on which the component is exposed, the at least one exposed electrically conductive surface being connected to an external conductive structure extending from the at least one exposed electrically conductive surface, and the external conductive structure being configured such that a surface located at a higher vertical height than the vertical height at which the at least one exposed electrically conductive surface is located is exposed. This may bring the advantage of simplifying the connection process while ensuring a reliable connection during operation, in particular due to the fact that the external conductive structure may compensate for different heights (i.e. in the z-direction) exemplarily caused by the presence of the connection element, resulting in easier assembly of the external component or other components on a flatter / constant surface / level.

[0021] Most preferably, according to a further embodiment, a damping structure is arranged between the component and the stack. This allows a simpler and easier to manufacture arrangement than known solutions with micro-socket arrays of complex and expensive shapes. Furthermore, the damping structure confers an additional possible final displacement of the component relative to the component carrier, thereby improving mismatch compensation in terms of CTE and tolerances.

[0022] According to another embodiment of the invention, the component is at least partially embedded in the stack, in particular the component only exposes at least a portion of the connecting element. This can bring the advantage of providing mechanical protection for at least two (side) walls while providing exposed connecting elements to be connected.

[0023] According to another embodiment of the present invention, the component is configured to be connected to at least two external components, in particular a component providing a bridging function. This can increase the flexibility of the design of the component carrier. In particular, the bridging function can provide a short local distance, which enables fast signal transmission between the corresponding at least two components (e.g., between a high bandwidth memory (HBM) and a processing component (CPU, GPU, etc.)), or establishes fast communication between chiplets. All quality and reliability issues related to the alignment in all orthogonal directions between the component with bridging function and the external component and / or the mismatch in the coefficient of thermal expansion (CTE) between the bridge and the connected components, in particular the mechanical stresses on the connection (see above) can be omitted and a reliable and stable connection between the external component and the component with bridging function can be achieved regardless of the environmental conditions and by a simple and inexpensive but reliable arrangement; additionally and / or alternatively, assuming a position extending inclined relative to the plane of the component carrier, in the case where the stack presents a non-planar external surface (for example because the external surface comprises an electrically insulating layer structure having a resin material, preferably a filler distributed in the electrically insulating layer structure, more preferably an inorganic filler / non-fibrous filler (in particular a spherical filler)), the external component can be assembled on the bridge on one side and on the non-planar surface of the stack on the other side; the inclination may be unpredictable and / or the inclination may be improved due to the final inclination of the bridge itself (see above). Any mismatch in alignment between the contact surfaces on the bridge and the external component and / or different expansion rates of the materials during temperature changes can be compensated along the planar direction of the component carrier (along the xy direction) and / or along the thickness direction of the component carrier (along the z direction) by the structure and / or inherent properties of the heterogeneous conductive structure connecting the bridge component and the external component.

[0024] The present invention as explained in the previous paragraphs can overcome the disadvantages of the prior art by a connection in which the damping effect is obtained by the size (nanowires) and / or the material (other alternatives) of the contacting protruding elements.

[0025] The object of the present application can also be achieved by a package, characterized in that the connecting element is made of a heterogeneous conductive structure, which is arranged to permanently compensate for the relative movement of the electrically conductive surface of the component with the component carrier and the connecting surface of the external component. The term "permanently compensate for the relative movement between the two surfaces" means that during the assembly of the component or in the assembled state, the mismatch of the alignment between the two surfaces and / or the different expansion rates of the material of the component and / or the carrier structure carrying the at least one component during temperature changes are compensated in the plane direction of the component carrier (in the xy direction) and / or in the thickness direction of the component carrier (in the z direction) by the structure and / or inherent properties of the heterogeneous conductive structure.

[0026] Preferably, the connecting element is elastically deformable or at least temporarily deformable, wherein the deformation is at least one of compression, elongation, shearing or bending. In this way, a safe connection can be guaranteed during manufacture and in use under changing environmental conditions, particularly under changing temperature conditions.

[0027] According to a first embodiment of the package according to the invention, the heterostructure of the connection element comprises a solid electrically conductive material with voids inside. This can bring the advantage of ensuring a reliable physical and electrical connection while reducing the mass of the component carrier and thus also the mass of the entire package, wherein the deformability is provided by the heterostructure of the connection element itself.

[0028] Advantageously, the interstices of the component carrier within the package can contain a gas, in particular air, or can be at least partially evacuated, in particular the interstices are preferably at least partially connected to one another, thereby defining air channels. This can bring about the advantage that physical properties, such as the ductility / flexibility of the heterostructure, can be adjusted.

[0029] A further embodiment is characterized in that the interstices of the component carrier within the package comprise a filler, in particular the interstices are preferably at least partially sealed from one another. The filler may comprise or consist of a resin and / or an elastomeric material and / or a liquid. This may bring the advantage of having a variety of material tools to adjust the properties / behavior of the heterogeneous structure.

[0030] Another embodiment of the invention is characterized in that parts of the interstices of the component carrier within the package are open to the outside of the solid material, thereby influencing the size of the outer roughness and / or surface area of ​​the connecting element. This can have the advantage of ensuring a reliable connection to the heterogeneous structure (via the other material), for example by defining the deformability of the outer part of the connecting element through its rough / serrated outer surface defined by the exposed interstices.

[0031] A further embodiment of the invention is characterized in that the heterostructure of the package comprises a plurality of electrically conductive nanowires, the plurality of electrically conductive nanowires being spaced apart from each other, the plurality of electrically conductive nanowires being connected to the electrically conductive surface, and the plurality of electrically conductive nanowires extending away from the stack. This may bring about the advantage of enhancing the flexibility of the heterostructure. In addition, since the plurality of nanowires can produce a reliable electrical connection even in the event of a breakage of a few nanowires, a redundant connection may be achieved.

[0032] In this embodiment, it is advantageous if each of the plurality of nanowires in the package is connected to and / or bonded to and / or integrally bonded to an electrically conductive surface. This may bring the advantage of providing a reliable connection while still having flexible (physical) properties.

[0033] A further embodiment of the invention is characterized in that the heterostructure of the package comprises an electrically conductive porous material connected to the electrically conductive surface. This can bring the advantage of enlarging the surface area of ​​the heterostructure and thus ensuring a reliable connection to the electrically conductive surface, the porosity defining the deformability of the connection element while ensuring appropriate conduction characteristics provided by the remaining conductive material.

[0034] Yet another embodiment of the present invention provides a heterostructure within a package, the heterostructure comprising a liquid metal structure connected to an electrically conductive surface. This may bring the advantage of high flexibility, since liquids are known to be easily deformable substances.

[0035] Another embodiment of the invention is characterized in that the heterostructure of the package comprises a solder bump with rubber particles inside. This combination of (visco)elastic rubber and solder material can provide a good physical and electrical connection while having flexible properties.

[0036] According to the invention, a further embodiment of the package is characterized in that the connecting element comprises two elements, a first element, which is connected to at least one electrically conductive surface; and a second element, which is connected to at least one connection surface, the two elements being connected to each other, thereby providing an electrical connection between at least one electrically conductive surface of the component and at least one connection surface of the external component. This can bring the advantage that a connection is established between the two respective components, which connection can compensate for relative movements between the components during or after the manufacturing process. In addition, the compensation is distributed to the two elements, thereby alleviating the final (mechanical) stress generated by using only one element.

[0037] Preferably, the two elements in the package are connected to each other by their mutual front contact, preferably, the front contact is provided by the end of each element opposite to the end contacting / associated with at least one electrically conductive surface of the package or at least one connection surface of the external component. For the front contact, it means that it is arranged along the stack thickness and / or mounting direction of the component and the external component; due to the reduction of the distance between the component and the external component during / after the connection, the front contact may cause deformation of the two elements at the contacting parts (such as deformation of the nanowires or porous parts included in the conductive element); according to a preferred embodiment of the present invention, the front contact may cause one of the two elements to be partially inserted into the interior of the opposite element, and vice versa (for example, the nanowire included in one element is inserted into the space between the nanowires included in the opposite element).

[0038] According to one embodiment, the mutual frontal connection will involve only a partial (frontal) portion / surface of the elements involved (i.e. only a portion of the nanowires comprised in one of the two elements interacts with the opposing connecting element), or only a portion of the porous material interacts with the opposing element. This may bring the advantage of ensuring a highly reliable connection during and after the manufacturing process, even in case of imperfect alignment of the elements and / or different heights of the relevant coupling of said elements, for example due to vertical misalignment of components and / or external components, respectively.

[0039] Another embodiment according to the invention is characterized in that the two elements in the package are connected to each other by at least partial entanglement of the nanowires of the first element with the nanowires of the second element. This may bring the advantage of ensuring a permanent connection between the respective components.

[0040] A further embodiment is characterized in that, within the package, the connection element and / or the first element and / or the second element is deformed at the contact portion with the corresponding at least one electrically conductive surface or at least one connection surface or the first element or the second element opposite. This can bring the advantage of ensuring that the physical connection and / or the electrical connection is not broken due to the deformation while maintaining the rigidity and compact structure of the remaining connection elements.

[0041] Preferably, at least one electrically conductive surface of a component within the package and at least one connection surface of an external component are individually connected to each other by a connection element. This can keep the lateral distance between components short and ensure fast data or current connection.

[0042] In another embodiment, the connecting element and / or the first element and / or the second element in the package are at least partially covered by a protective material. As the components are not affected by the environment, the long life performance can be improved.

[0043] A further embodiment of the invention is characterized in that an underfill structure is provided within the package between the component and external components. This may bring the advantage that the connection is protected from environmental influences (eg air oxidation).

[0044] Another embodiment is characterized in that the stack in the package comprises at least one exposed electrically conductive surface, the at least one exposed electrically conductive surface is on a main surface on which the component is exposed, the at least one exposed electrically conductive surface is connected to an external conductive structure, the external conductive structure extends from the at least one exposed electrically conductive surface, and the external conductive structure is configured so that a surface at a higher vertical height than the vertical height at which the at least one exposed electrically conductive surface is located is exposed. This can bring the advantage that a reliable physical or electrical connection is ensured even at different levels in the thickness direction of the stack.

[0045] Preferably, the damping structure is arranged between the components and the stack in the package. This can further compensate for the relative movement between the components and the stack and can enhance the integrity of the package.

[0046] Furthermore, an arrangement of the package is advantageous in which the component is at least partially embedded in the stack, in particular the component only exposes at least a portion of the connection element. This can bring the advantage of providing mechanical protection for at least two (side) walls while providing exposed connection elements to be connected.

[0047] The component within the package is preferably configured to be connected to at least two external components, and most preferably it can have a bridging function. This can increase the flexibility of the design of the component carrier. In particular, the bridging function can provide a short local distance, which enables fast signal transmission between the corresponding at least two components. All quality and reliability issues related to the alignment in all orthogonal directions between the component with the bridging function and the external components and / or the mismatch of the coefficient of thermal expansion (CTE) between the bridge and the connected components, in particular the mechanical stress on the connection can be omitted, and a reliable and stable connection between the external component and the component with the bridging function can be achieved regardless of the environmental conditions and through a simple and inexpensive but reliable arrangement. In addition, the CTE mismatch of the surrounding component carrier and the component can cause a lot of mechanical stress. Since the component is placed directly on or in the component carrier, the component is subjected to a different level of mechanical stress from the external component, which is compensated by the conductive connecting element according to the present invention. Any mismatch in the alignment between the contact surfaces on the bridge and the external component and / or different expansion rates of the materials during temperature changes can be compensated along the planar direction of the component carrier (along the xy direction) and / or along the thickness direction of the component carrier (along the z direction) by the structure and / or inherent properties of the heterogeneous conductive structure connecting the bridge component and the external component.

[0048] The component carrier may also be configured as one of a printed circuit board and a substrate (in particular an IC substrate). In the context of the present application, the term "printed circuit board (PCB)" may particularly denote a component carrier (which may be plate-shaped (i.e. planar), three-dimensionally curved (e.g. when manufactured using 3D printing) or it may have any other shape) formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying heat energy, accompanied if necessary by supplying heat energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of metal (e.g. copper), while the electrically insulating layer structures may include resin and / or glass fibers, i.e. so-called prepregs or FR4 materials. The individual electrically conductive layer structures may be connected to each other in a desired manner by forming through holes through the laminate, for example by laser drilling or mechanical drilling, and by filling these through holes with an electrically conductive material (in particular copper) to form vias as through-hole connections. In addition to one or more components that can be embedded in a printed circuit board, the printed circuit board is typically configured to accommodate one or more components on one surface or two opposite surfaces of a plate-shaped printed circuit board. The one or more components may be connected to the respective major surfaces by soldering.The dielectric portion of the PCB may include a resin with reinforcing fibers, such as glass fibers.

[0049] In the context of the present application, the term "substrate" may particularly denote a small component carrier having approximately the same size as the components (particularly electronic components) to be mounted on the small component carrier. More particularly, a substrate may be understood as a carrier for electrical connectors or power grids, and a component carrier for connectors arranged laterally and / or vertically, which are comparable to a printed circuit board (PCB) but have a relatively high density. The transverse connectors are, for example, conductive paths, while the vertical connections may be, for example, drilled holes. These transverse connectors and / or vertical connectors are arranged in the substrate and may be used to provide electrical and / or mechanical connections between accommodated components or non-accommodated components (e.g. bare wafers), in particular IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may be composed of a resin having reinforcing spherical members (e.g. glass spherical members).

[0050] At least one electrically insulating layer structure may comprise at least one of the following: a resin (such as a reinforced or non-reinforced resin, for example an epoxy resin or a bismaleimide-triazine resin, more specifically FR-4 or FR-5), a cyanate ester, a polyphenylene derivative, a glass (particularly glass fiber, multilayer glass, glass-like materials), a prepreg material, a polyimide, a polyamide, a liquid crystal polymer (LCP), an epoxy-based build-up film, polytetrafluoroethylene (Teflon), a ceramic and a metal oxide. Reinforcement materials (meshes, fibers or spheres) made of, for example, glass (multilayer glass) may also be used. Although prepregs or FR4 are generally preferred, other materials may also be used. For high frequency applications, high frequency materials, such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins may be implemented as an electrically insulating layer structure in the component carrier.

[0051] The at least one electrically conductive layer structure may include at least one of the following: copper, aluminum, nickel, silver, gold, palladium and tungsten. Although copper is generally preferred, other materials or coated variations thereof, in particular coated with superconducting materials such as graphene, are also possible. The conductive layer may form electrical or electronic components, conductive traces, vias, etc.

[0052] The at least one component may be selected from at least one of the following: a non-electrically conductive inlay, an electrically conductive inlay (e.g. a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a photoconductive element (e.g. an optical waveguide or optical conductor connector), an electronic component or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g. a DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface component, a voltage converter (e.g. a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a soft magnetic element (in particular a ferromagnetic element, an antiferromagnetic element or a ferrimagnetic element, such as a ferrite core) or may be a paramagnetic element. However, the component can also be another component carrier, for example in a board-in-board construction. The component can be surface-mounted on the component carrier and / or can be embedded in the interior of the component carrier. Furthermore, other components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0053] In an embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a composite of multilayer structures that are stacked, in particular stacked in parallel, and connected together by applying pressure (if necessary with heating). The component carrier can be configured to carry further electrical and / or electronic components, such as resistors, capacitors, diodes, transistors or integrated circuits.

[0054] In the context of the present application, the term "liquid metal structure" may particularly denote any device or composition based on a metal and being liquid or pasty at or close to the temperature of use of the component, device or apparatus, in which the liquid metal structure is employed. For example, mercury is a stable liquid elemental metal at room temperature, while cesium, gallium and rubidium have melting points slightly above room temperature. In addition to this, eutectic alloys may be used, whose alloy melting points are lower than the melting points of any of the constituent metals. Such alloys may be mercury-based alloys or gallium-based alloys. If desired, a deformable shell may be provided around the liquid or pasty metal structure.

[0055] In the context of the present application, the term "main surface" of the body may particularly denote one of the two opposite largest surfaces of the body or one of the opposite outermost surfaces of the body. The main surfaces may be connected by a circumferential sidewall. The thickness of the body may be defined by the distance between the two opposite main surfaces.

[0056] In the context of the present application, the term "heterostructure" may particularly denote a structure composed of distinguishable parts composed of different materials, ultimately in different states of aggregation (solid, liquid, gaseous), resulting in a heterogeneous physical body. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Embodiments of the present invention will now be described with reference to the accompanying drawings. The present invention is not limited to the embodiments shown or described.

[0058] Figure 1 A prior art arrangement is shown.

[0059] Figure 2 A schematic side view of a first embodiment of a package according to the invention with a component carrier is shown.

[0060] Figure 3 A schematic side view of a second embodiment of a package according to the invention with a component carrier is shown.

[0061] Figure 4 A schematic side view of a third embodiment of a package according to the invention with a component carrier is shown.

[0062] Figure 5A schematic side view of a fourth embodiment of a package according to the invention with a component carrier is shown.

[0063] Figure 6 A schematic side view of a fifth embodiment of a package according to the invention with a component carrier is shown.

[0064] Figure 7 A schematic side view of a sixth embodiment of a package according to the invention with a component carrier is shown.

[0065] Figure 8 A schematic side view of a seventh embodiment of a package according to the invention with a component carrier is shown.

[0066] Fig. 9 A schematic side view of an eighth embodiment of a package according to the invention with a component carrier is shown.

[0067] Fig.10 A schematic side view of a ninth embodiment of a package according to the invention with a component carrier is shown.

[0068] Fig.11 A schematic side view of a tenth embodiment of a package according to the invention with a component carrier is shown.

[0069] Fig.12 A schematic side view of an eleventh embodiment of a package according to the invention with a component carrier is shown.

[0070] Fig.13 By tilting the outer component relative to the component carrier, a similar Fig.12 Schematic side view of an embodiment of .

[0071] Fig.14 By misaligning the outer component with respect to the component carrier in the x-direction and / or in the y-direction, a similar arrangement is shown. Figure 3 Schematic diagram of an implementation method.

[0072] Fig.15 A similar arrangement is shown by the encapsulation not completely filling the recess in the component carrier. Figure 4 Schematic diagram of an implementation method.

[0073] Fig.16 A micrograph of entangled nanowires is shown. DETAILED DESCRIPTION

[0074] Figure 1A package according to the prior art is shown. A circuit board 1 is provided with solder balls 2 on one surface thereof. A package substrate 3 is mounted on and electrically connected via the solder balls 2, and the package substrate 3 provides two recesses into which bridges 4 are buried and positioned for electrically connecting top mounted components. These bridges 4 are in principle tiny silicon slices with very high milling layers, which connect, for example, a transceiver wafer 5 and at least one further chip 6 to another package substrate, for example a package substrate in an IC package. The electrically conductive connection is achieved by solder bumps 7. Standard package traces 8 are provided in the package substrate 3, and a package cover 9 covers and protects the above mentioned elements.

[0075] The present invention now proposes a newly designed component carrier, a first embodiment of which is Figure 2 Schematically shown in . The component carrier comprises a stack 10, which comprises a plurality of electrically conductive layer structures 11 and at least one electrically insulating layer structure 12. The plurality of electrically conductive structures can be electrically connected by conventional means such as laser or mechanical vias (not shown). In addition, a component 13 is arranged in a recess in the stack 10 and / or on a surface of the stack 10, in particular the component 13 is arranged on the surface of the insulating layer structure 12. In this example, the electrically insulating layer structure 12 is located / sandwiched between two electrically conductive layer structures 11, in particular the electrically insulating layer structure 12 has direct contact with each of the two electrically conductive layer structures 11.

[0076] The component 13 comprises at least one electrically conductive surface 14, such as a pad or any other electrically conductive surface portion of the component 13, at least one of which is connected to an electrically conductive connecting element 15, which extends from the electrically conductive surface 14 away from the stack 10, i.e. also away from the surface of the electrically insulating layer structure 12. The electrically conductive surface 14 can be a part of a wider conductive surface or can be a pad, optionally with a metal bump connected to the pad. In this example, the component 13 is positioned so that the exposed surface of the component 13 is not at the same level as the exposed surface of the stack 10 with respect to the stack thickness direction, but at least one of the exposed surfaces of the component 13 is at the same level as the exposed surface of the stack 10. Figure 5 and Figure 6 In the embodiment of the present invention, the exposed surface of the component 13 is an electrically conductive surface 14, which is defined by the level of the electrically conductive layer structure 11. In particular, the exposed surface of the component 13 is intended to be located below the level of the stack in the direction of the stack thickness with respect to the exposed surface. Alternatively, the exposed surface of the component 13 is at the same level as the exposed surface of the stack 10, or the exposed surface of the component 13 protrudes beyond the exposed surface of the stack in the direction of the stack thickness.

[0077] The connecting element 15 is configured to be connected to the external component 16, 17 to be mounted on the component carrier when at least one connecting surface 18, 19 provided in / on the external component 16, 17 faces the electrically conductive surface 14. In this position, the electrically conductive structure 20 on the external component 16, 17 will also face the surface of the stack 10, in particular the electrically conductive structure 20 on the external component 16, 17 faces the electrically conductive layer structure 11 of the stack 10. The structure 20 and the structure 11 can be electrically connected by welding, sintering, the structure 20 and the structure 11 can be connected via metal (copper pillars) or in any other suitable way, in Figure 2 2 and 3. In the figure, the solder bumps 29 are indicated. As an alternative (not shown), solder material is also provided in the connecting element 15 to further strengthen the electrical connection.

[0078] When "at least one connection surface 18, 19 provided in / on the external component 16, 17 faces the electrically conductive surface 14", this means that, seen from a front view of one of the main surfaces perpendicular to the main surfaces of the component carrier, the two surfaces at least partially overlap, which means that along the thickness direction of the stack (z-direction), a portion of the two surfaces overlap each other, preferably a large portion of the two surfaces overlap each other; in other words, at least a portion between the at least one connection surface 18, 19 provided in / on the external component 16, 17 and the electrically conductive surface 14 of the component 13 is aligned along the thickness direction of the stack (z-direction), so that they can be electrically connected by means of an electrically conductive connecting element, which preferably extends along a vertical direction (perpendicular to one of the main surfaces of the component carrier). In addition, the external components 16, 17 can have connection pads or other electrically conductive structures on their sides other than those facing the component 13 or the stack 10, respectively, for example at the opposite position of the connection surface.

[0079] After completing the electrical and mechanical connections between the stack 10 and the external components 16, 17, a package including these elements 10, 16, 17 is at least partially formed. The final package may also have a heat removal structure (not shown) on top of the external components. Most preferably, the explanations above and below regarding the electrical connection element 15 and its specific construction and design also apply to the connection element 22 of the external components 16, 17.

[0080] It should be mentioned that Figures 2 to 10 , Fig.14 and Fig.15 Shown - for the sake of clarity of the graphical representation of all details, in particular of the connecting parts of the connecting elements - is a package comprising the above-described structure in a partially "exploded" state, ie the connecting elements 15, 22 are not yet in physical and electrical contact.

[0081] from Figure 2 It can also be gathered that each connection element 15 is made of a heterogeneous conductive structure arranged to permanently compensate for relative movements of said electrically conductive surface 14 of component 13 of stack 10 with component carriers and said connection surfaces 18 , 19 of external components 16 , 17 .

[0082] Alternatively, at least one connecting element 15 is made of a heterogeneous conductive structure, while the remaining connecting elements 15 can be standard solder balls. A mixture of different kinds of heterogeneous structures is possible, for example a group of connecting elements 15 consisting of nanowires and porous structures, a group of solder balls with rubber particles and nanowires, etc. is also possible.

[0083] With these features, reliable connection of the component 13 to the external components 16, 17, preferably reliable connection of the bridge to the external components 16, 17, can be ensured even in the case of slight planar misalignment (relaxed to xy and / or z-tolerances), and also compensate for mismatches in coefficient of thermal expansion (CTE). In addition, there is a direct connection between the component 13 of the stack 10 and the external components 16, 17 without the need for embedding components. At least soldering material can be avoided, and the reliability of the ICS to chip interconnection can be potentially increased, as well as redundant connections between the component 13 and the external components 16, 17.

[0084] The connecting elements 15, 22 may be permanently or at least temporarily deformable, wherein the deformation is at least one of compression, elongation, shearing or bending. Figures 2 to 6 A first preferred set of embodiments of the invention is depicted, which can be achieved by a heterostructure comprising a plurality of electrically conductive nanowires 23, 24, which are preferably spaced apart from each other and extend away from the stack 10 or the external components 16, 17, respectively. The nanowires 23 of the component 13 are connected to the electrically conductive surface 14 via terminal discs 25, and the nanowires 24 of the external components 16, 17 are connected to the electrically conductive surfaces 18, 19 of these external components 16, 17 via terminal discs 26. In addition to the above explained manner, each of the plurality of nanowires 23, 24 can be connected to the electrically conductive surface 14, 18, 19 and / or bonded to the electrically conductive surface 14, 18, 19 and / or integrated with the electrically conductive surface 14, 18, 19. The advantage of the nanowires is that redundant connections are provided, ensuring electrical connection even if some of the nanowires are damaged. The connection between the external components 16 , 17 and the stack 10 itself, in particular the connection to the electrically conductive structure 11 , may be provided in a known manner by means of solder balls 29 .

[0085] Most preferably, a damping structure 27 is provided between the component 13 and the stack 10, the damping structure 27 being, for example, an insulating material, preferably comprising a sponge structure. This allows damped displacement of the component 13 and the external components 16, 17 connected to the component 13 relative to the stack 10. A free space may be provided between the side walls of the component 13 and the stack 10. This may have the advantage that the damping structure 27 may expand into the free space and / or the damping structure 27 may compensate for misalignments between the components, external components and component carriers as described above and / or within the values ​​described above. Alternatively, no free space is provided and the damping structure 27 compensates for stresses (pressure or shear) internally.

[0086] Figure 3 Another embodiment of the packaging of the stacked parts according to the present invention is shown. Figure 2 In the embodiment, the component 13 is at least partially embedded in the stack 10, in particular only at least a portion of the connecting element 15 is exposed, but Figure 3 The component 13 is at least partially exposed outside the stack 10.

[0087] Figure 3 It is further shown that all electrical connections between the stack 10 and the external parts 16, 17 can be realized by means of connection elements 15 and connection elements 22, respectively, comprising heterostructures 23, 24, arranged with the greatest possible compensation. The front ends of the heterostructures, for example the nanowires 23 of the connection elements 15 of the stack 10, can be at different levels along the thickness of the stack relative to the connection elements 15 of the parts 13 of the stack 10, despite the fact that they can even be mounted on copper pillars 34 inserted between pads 38 and the nanowires 23 or any other heterostructure, for example between pads 38 and porous materials, solder balls with rubber particles, etc. Other embodiments (not shown) provide for the ends of all the connection elements 15, 22 of the stack 10 and its parts 13, arranged in one and the same plane along the thickness of the stack, wherein the length of the copper pillars 34 compensates for the differences in the lengths of the various heterostructures, to produce the same final level of the exposed ends of the nanowires 23, for example. As will be appreciated, all of the above explanations regarding the length, stacking and positioning of the leading ends of the connecting elements apply in a similar manner to the outer parts 16 , 17 .

[0088] Figure 31 shows another possible embodiment of the arrangement of the component 13 relative to the stack 10. In this possible arrangement, wherein the stack 10 comprises at least one exposed electrically conductive surface 11, 14, at least one exposed electrically conductive surface 11, 14 having a pillar structure such as, for example, a copper pillar 34 on a major surface, wherein the component 13 is exposed, at least one of the exposed electrically conductive surfaces connected to the external conductive structures 22, 24 is at the same level as the electrically conductive surface structure of the component 13 in the stack thickness direction.

[0089] Figure 4 A further embodiment is shown in which the exposed side of the component 13 is coated with an encapsulation 28 to protect the component 13. In the embodiment shown, the component 13 is inserted into a recess 39 provided in the stack 10. Thus, the material of the encapsulation 28 is provided in the recess 39, covering the component 13 and preferably also at least partially covering one surface of the connecting element 15. The material of the encapsulation 28 preferably completely fills the recess in the stack 10, and the component 13 is inserted in the stack 10, wherein the upper surface of the encapsulation 28 is preferably flush with one surface (preferably the outer surface) of the surface of the electrically insulating structure 12 of the stack 10. Alternatively, the component may be only partially inserted into the recess or the component may be provided externally relative to the stack 10; depending on the position of the component relative to the stack and the actual need to protect (part of the component), the encapsulation may be exposed relative to the stack 10 and / or the encapsulation may partially or completely fill the recess; in a preferred embodiment in which the encapsulation partially fills the recess, a stepped portion corresponding to the edge of the recess (see Fig.15 ) can emerge from the encapsulation. According to this embodiment, the adhesion of the final dielectric material, such as the underfill, is improved. The encapsulation 28 preferably comprises an electrically insulating material. Furthermore, the encapsulation 28 may comprise a filling material. In an embodiment, the encapsulation 28 may also surround the contact element, preferably the encapsulation 28 may also abut the contact element and / or at least partially penetrate into / enter the contact element; preferably, according to Figure 4 In the embodiment shown, the encapsulation material is in contact with the sidewall of at least a certain amount of one end of the nanowires 23, the degree of which depends on the size of the nanowires and their distance and the properties of the encapsulation material, such as the viscosity of the liquid form. Alternatively, the sidewalls of the nanowires may be free of an encapsulation 28. In addition, the encapsulation 28 is preferably in direct contact with the damping structure 27, and both the encapsulation 28 and the damping structure 27 may be made of the same material, although materials having different purposes and different optimization tasks will have advantages.

[0090] An additional electrically conductive structure (not shown) may be provided at the bottom of the recess in the electrically insulating structure 12 of the stack, below the damping structure 27. The component 13 may also be electrically connected to such additional electrically conductive structure, which may be a copper layer.

[0091] also, Figure 4 It is shown that all other electrically conductive connections between the stack 10 and the external components 16, 17 can be provided by known solder connections, which include solder bumps 29 between the electrically conductive layer structure 11 of the stack 10 and the conductive layer structure 20 of the external components 16, 17. Likewise, other embodiments can be provided with at least one further connection structure between the components, as already explained above.

[0092] Figure 5 A solution with solder bumps 29 is shown even for such an arrangement, in which the component 13 is at least partially exposed and above the surface of the stack 10. As a further feature, in the area of ​​the component 13, the pad density of the outer components 16, 17 is higher and the pad size is smaller, thereby forming a bridge for the outer components 16, 17.

[0093] Although Figures 2 to 5 The embodiments of the present invention all show connecting elements, each connecting element comprising two elements, one element being arranged at least partially face-to-face with each other so as to achieve mutual face-to-face contact, Figure 6 An embodiment is shown in which the connecting element 15 belonging to the stack 10 having the explained heterogeneous structure is provided only on one component (such as Figure 7 in the embodiment); in other words, each connecting element comprises only one element which interacts with the conductive surface of the opposing component during or after the connection of the two components; in the embodiment shown, the nanowire 23 bonded to the electrically conductive surface 14 of the component 13 is in abutting contact with, for example, pad-shaped connecting surfaces 18, 19 of the external components 16, 17.

[0094] Figure 6, another possible embodiment of the arrangement of the component 13 relative to the stack 10 is shown. In this possible arrangement, in which the stack 10 comprises at least one exposed electrically conductive surface 11, at least one exposed electrically conductive surface 11 being on a main surface of an electrically insulating structure 12, the component 13 is exposed on the main surface of the electrically insulating structure 12. The component 13 comprises at least one electrically conductive surface 14, at least one of which faces the external components 16, 17 and is connected to an electrically conductive connecting element 15, which extends from said electrically conductive surface 14 away from the stack 10, i.e. also away from the surface of the electrically insulating layer structure 12. In this example, the component 13 is positioned so that the exposed surface of the component 13 is not at the same level as the exposed surface of the stack 10 with respect to the stack thickness direction, and the exposed surface of the component 13 is at Figure 5 and Figure 6 In the embodiment of the present invention, the exposed surface 14 is an electrically conductive surface, which is defined by the level of the conductive layer structure 11. In particular, the exposed surface of the component 13 is intended to be below the level of the stack thickness direction of the exposed surface stack. Alternatively, the exposed surface of the component 13 is at the same level as the exposed surface of the stack, or the exposed surface of the component 13 protrudes to the exposed surface of the stack in the direction of the stack thickness. Preferably, solder balls 21 can be placed in the heterostructure to further strengthen the connection between the stack 10 and the external components 16, 17.

[0095] Figure 7 Shown is another embodiment of the present invention, wherein another possible version of connecting element 15.These connecting elements are stacked by solid electrically conductive materials such as solder bumps 29 with voids inside, and these voids are preferably filled with rubber particles 30, which can have the same size as the voids and / or preferably also have the same size as the voids. Moreover, other fillers for the voids in the solid material are also possible, and other fillers include resins and / or elastomeric materials and / or liquids or are composed of resins and / or elastomeric materials and / or liquids. The voids are preferably at least partially sealed to each other. Such voids in metals may limit conductivity (still compared to pure copper, rather than compared to solder). Other embodiments can provide voids containing gas, particularly air, or can be at least partially evacuated, and the voids are preferably at least partially connected to each other to define air channels. In each case with or without fillers, the voids or at least a portion of the voids can be open to the outside of the solid material, thereby affecting the size of the external roughness and / or surface area of ​​the connecting elements 15, 22.

[0096] The solder bumps 29 may have different sizes for the connecting elements 15 of the component 13 and the connecting elements 35 of the stack 10 itself, to compensate for the differences in the solder bumps 29, e.g. Figure 7A possible thickness difference is shown in the embodiment shown, in which the surface of the component 13 is located above the level of the electrically conductive structure 11 of the stack 10, as seen in the thickness direction of the stack. Figure 3 If the height difference is compensated by using copper pillars 34 as shown in the figure, all solder bumps 29 of the packages of the components 10, 16, 17 can have the same size. The same size of all solder bumps 29 is also possible for the components 13 embedded in the recesses of the upper surface of the stack 10, wherein all electrically conductive structures 11, 25 and components 13 of the stack 10 are arranged in the same plane seen in the thickness direction of the stack.

[0097] Figure 8 , wherein the heterostructure of the connecting elements 15, 22 comprises an electrically conductive porous material 31 disposed on top of a copper pillar 34 and connected to an electrically conductive surface 14, such as a pad (not shown) or any other electrically conductive surface portion of the component 13. This porous material 31 is also used in Fig. 9 1, wherein the porous material 31 is directly coupled to a small pad on the surface of the component 13. In this embodiment, an extended version for protecting the component 13 by the encapsulation material is shown. Not only is the component 13 itself covered and the recesses in the stack 10 filled with the material of the encapsulation 28, but at least part of the surface of the stack 10, preferably the non-electrically conductive area of ​​the stack 10, is covered by a layer 32 of the encapsulation material.

[0098] It has also to be mentioned that the copper pillar 34 or each other pillar structure in each arrangement and on each component or layer structure may be embedded in the component 13 or in any other component or layer structure.

[0099] The heterostructure may include a liquid metal structure connected to an electrically conductive surface. Fig.10 As shown in the exemplary embodiment of FIG. 3 , the liquid metal portion 33 is disposed on top of the copper pillar 34 .

[0100] The present invention as explained in the previous paragraphs can overcome the disadvantages of the prior art by a connection in which the damping effect is obtained by the size (nanowires) and / or the material (other alternatives) of the contacting protruding elements.

[0101] As already follows from the above description, the connection element arrangement of the complete package 10, 16, 17 of the component carrier stack 10 and the at least two external components 16, 17 comprises two further elements, a first element 15, which is connected to at least one electrically conductive surface 14 of the component 13, and a second element 22, which is connected to at least one connection surface of the external components 16, 17. The two elements 15, 22 are connected to each other, thereby providing an electrical connection between the at least one electrically conductive surface 14 of the component 13 and the at least one connection surface of the external components 16, 17. Preferably, the two elements 15, 22 are connected to each other at the respective front end portion, as Figure 2 It can be clearly seen in.

[0102] Another embodiment according to the invention comprises two elements 15, 22 connected to each other by at least partial entanglement of the nanowires 23 of the first element 15 with the nanowires 24 of the second element 22, such as Fig.16 shown in the micrographs.

[0103] A further embodiment comprises a connecting element 15 and / or a first element and / or a second element which is deformed at a contact portion with the respective at least one electrically conductive surface 14, 18, 19 or at least one connecting surface or the first element or the second element opposite. Preferably, the at least one electrically conductive surface 14 of the component 13 and the at least one connecting surface 18, 19 of the external component 16, 17 are connected to each other individually by means of the connecting element 15, 22.

[0104] According to another embodiment of the present invention, the connecting elements 15, 22 and / or the first element and / or the second element can advantageously be at least partially covered by a protective material, and / or a bottom filling structure 36 can be arranged between the component 13 and at least one of the external components 16, 17, preferably the bottom filling structure 36 can be arranged between the entire stack 10 and all external components 16, 17.

[0105] Fig.11 An embodiment with a package 10 , 16 , 17 including a complete underfill between the components is shown by way of example.

[0106] Another embodiment is characterized in that the stack includes at least one exposed electrically conductive surface, the at least one exposed electrically conductive surface is on a major surface, the component is exposed on the major surface, the at least one exposed electrically conductive surface is connected to an external conductive structure, the external conductive structure extends from the at least one exposed electrically conductive surface, and the external conductive structure is configured to expose a surface that is located at a higher vertical height than the vertical height at which the at least one exposed electrically conductive surface is located.

[0107] The enclosures 10, 16, 17 may also be further protected by a top mounted rigid cover (not shown) located at the sides of the stack 10 and the outer components 16, 17, or alternatively the enclosures 10, 16, 17 may also be protected by a rigid cover such as Fig.12 The overmold structure 37 is further protected by the overmold structure 37 shown. The overmold structure 37 can be made of the same material as the underfill structure 36, and can be made into an integral structure combining the underfill structure 36 and the overmold structure 37. Additional embodiments can include surface treatment with materials such as tin or gold or solder resist, as an alternative to the overmold structure 37 or the cover, respectively, or in combination therewith.

[0108] Fig.13 An embodiment is shown, which even with Fig.12 , but according to the invention it may also represent an example of a package with a misalignment between component 13 and the connected external component 16; in particular, component 13 and external component 16 may be misaligned with each other along the vertical direction of the component carrier (z direction), preferably resulting in one component being tilted relative to the other, for example having an upper surface of component 13 tilted (not parallel) relative to a bottom surface of external component 16 and / or having their overall planar extensions tilted relative to each other; in the embodiment shown, in which component 13 is connected to two external components 16, 17 (i.e. having a bridging function), the lateral extensions of the external components and / or their respective electrically conductive surfaces 14 and connecting surfaces 18, 19 may be tilted relative to each other; for all these types of misalignment, the connection between the component and the external component may be affected during its assembly and / or in the assembled state (for example, due to examples of different CETs of the materials used for the layers / components, such misalignments may occur or increase). Compensation for this misalignment is provided by the respective connecting elements 15 which, due to their own heterogeneous structure, allow connection to the respective front parts and / or conducting surfaces and / or compensation for eventual movements between the components in the assembled (operating) state, even if they are misaligned with each other, for example movements caused by temperature changes over time.

[0109] Fig.14 Shows Fig.13An alternative or complementary further kind of misalignment shown in , which can affect the connection between the component 13 and the external components 16, 17 and / or can affect the integrity of each: the misalignment is preferably along a planar direction (xy plane of the component carrier). The misalignment may occur due to a wrong placement of one component relative to the other and / or due to tolerances between the electrically conductive surface 14 of the component and the connection surface 18, 19 of the external component; such misalignment may occur during assembly between the component 13 and the further components 16, 17 or in the assembled (operating) state, for example due to temperature changes. Such misalignment can be very effectively compensated with a connecting element 15, 22, 35 having at least one of the disclosed heterostructures, for example the nanowires 23, 24 shown allowing connection of at least one portion of the connecting element (i.e. a portion of the nanowire).

[0110] Fig.15 An embodiment of a package having a stack 10 with a recess 39 for accommodating a component 13, a damping structure 27 and an encapsulation 28 is shown, similar to Figure 4 The embodiment described in Fig.15 In the embodiment, the encapsulation portion 28 does not completely fill the recess 39, resulting in a step-shaped portion corresponding to the edge of the recess between the upper surface of the encapsulation portion 28 and the upper surface of the stack 10 - such as Fig.15 This edge can be used as an additional gripping element for the final bottom fill / insulating material disposed between component 13 and external components 16 , 17 , thereby improving the contact surface of the bottom fill / insulating material with the stack 10 .

[0111] Reference numerals list

[0112] 1 Circuit Board

[0113] 2 Package Ball

[0114] 3 Package substrate

[0115] 4 Bridge

[0116] 5 Chips

[0117] 6 Chip

[0118] 7 Solder Bumps

[0119] 8 traces

[0120] 9 Package cover

[0121] 10 stacked pieces

[0122] 11 Electrically conductive structures

[0123] 12 Electrical insulation structure

[0124] 13 Components

[0125] 14 Conductive Surface

[0126] 15 Connecting elements

[0127] 16 External parts

[0128] 17 External parts

[0129] 18 Conductive surface

[0130] 19 Conductive Surface

[0131] 20 Electrically conductive structures

[0132] 21 Solder Bumps

[0133] 22 Connecting elements

[0134] 23 Nanowires

[0135] 24 Nanowires

[0136] 25 pads

[0137] 26 pads

[0138] 27 Damping structure

[0139] 28 Packaging Department

[0140] 29 Solder Bumps

[0141] 30 Rubber Granules

[0142] 31. Porous Materials

[0143] 32 Encapsulation layer

[0144] 33 Liquid Metal

[0145] 34 Copper Column

[0146] 35 Connecting elements

[0147] 36 Bottom filling structure

[0148] 37 Overmolded Structure

[0149] 38 pads

[0150] 39 recess.

Claims

1. A component carrier, wherein: The component carrier comprises: A stack (10) comprising a plurality of electrically conductive layer structures (11) and at least one electrically insulating layer structure (12), A component (13) arranged in and / or on the stack (10), the component (13) comprising at least one electrically conductive surface (14), the at least one electrically conductive surface (14) being connected to an electrically conductive connecting element (15), the connecting element (15) extending from the electrically conductive surface (14) away from the stack (10) and being configured to be connected to the external component (16, 17) when at least one connecting surface (18, 19) arranged in or on at least one external component (16, 17) to be mounted on the component carrier faces the electrically conductive surface (14) of the component (13), Therein, the connection element (15) is made of a heterogeneous conductive structure (23, 29, 31, 33) which is arranged to permanently compensate for relative movements between the electrically conductive surface (14) of the component (13) and the connection surface (18, 19) of the external component (16, 17).

2. The component carrier according to claim 1, wherein: The heterogeneous conductive structure of the connecting element (15) comprises a solid electrically conductive material having voids therein.

3. The component carrier according to claim 1 or 2, wherein: The heterogeneous conductive structure comprises a plurality of electrically conductive nanowires (23), the plurality of electrically conductive nanowires (23) being spaced apart from one another, the plurality of electrically conductive nanowires (23) being connected to the electrically conductive surface (14), and the plurality of electrically conductive nanowires (23) extending away from the stack (10), preferably, the plurality of electrically conductive nanowires (23) being connected to the electrically conductive surface (14) in such a manner that each of the plurality of electrically conductive nanowires (23) is connected to the electrically conductive surface (14) and / or bonded to the electrically conductive surface (14) and / or integrally combined with the electrically conductive surface (14).

4. The component carrier according to any one of claims 1 to 3, wherein: The heterogeneous conductive structure comprises an electrically conductive porous material (31) connected to the electrically conductive surface (14).

5. The component carrier according to any one of claims 1 to 3, wherein: The heterogeneous conductive structure comprises a liquid metal structure (33) connected to the electrically conductive surface (14).

6. The component carrier according to any one of claims 1 to 3, wherein: The heterogeneous conductive structure includes a solder bump (29) having rubber particles (30) therein.

7. The component carrier according to any one of claims 1 to 6, wherein: The stack (10) includes at least one exposed electrically conductive surface on a major surface where the component (13) is exposed, the at least one exposed electrically conductive surface being connected to an external conductive structure extending from the at least one exposed electrically conductive surface, and the external conductive structure being configured to expose a surface located at a higher vertical height than the at least one exposed electrically conductive surface.

8. The component carrier according to claim 1 or 2, wherein: A damping structure (27) is provided between the component (13) and the stack (10).

9. A package, wherein: The package comprises: A stack (10) comprising a plurality of electrically conductive layer structures (11) and at least one electrically insulating layer structure (12), a component (13) arranged in the stack (10) and / or on the stack (10), the component (13) comprising at least one electrically conductive surface (14), at least one external part (16, 17), said external part (16, 17) comprising at least one connection surface (18, 19), At least the component (13) and the at least one external component (16, 17) are electrically connected to each other by at least one connecting element (15, 22, 35) in such a way that the at least one electrically conductive surface (14) of the component (13) and the at least one connecting surface (18, 19) of the external component (16, 17) face each other, Therein, at least one connection element (15, 22, 35) is made of a heterogeneous conductive structure (23, 29, 31, 33) which is arranged to permanently compensate for relative movements between the electrically conductive surface (14) of the component (13) and the connection surface (18, 19) of the external component (16, 17).

10. The package according to claim 9, wherein: The connection element comprises two elements, namely a first element (23) connected to the at least one electrically conductive surface (14) of the component (13) and a second element (24) connected to the at least one connecting surface (18, 19) of the external component (16, 17), the two elements (23, 24) being connected to each other so as to provide an electrical connection between the at least one electrically conductive surface (14) of the component (13) and the at least one connecting surface (18, 19) of the external component (16, 17).

11. The package according to claim 10, wherein: The two elements (23, 24) are connected to each other by their mutual frontal contact, preferably, the frontal contact being provided by an end of each element (23, 24), the end of each element (23, 24) providing the frontal contact being opposite to the end in contact / associated with the at least one electrically conductive surface (14) of the component (13) or with the at least one connecting surface (18, 19) of the external component (16, 17).

12. The package according to claim 11, wherein: The heterogeneous conductive structure comprises a plurality of electrically conductive nanowires (23, 24) spaced apart from each other, wherein a group of the electrically conductive nanowires (23, 24) and another group of the electrically conductive nanowires (23, 24) opposite to the group of the electrically conductive nanowires (23, 24) are connected to each other by at least partial entanglement of the opposite group of electrically conductive nanowires, the group of the electrically conductive nanowires is connected to the electrically conductive surface (14) of the stack (10), and the other group of the electrically conductive nanowires is connected to the electrically conductive surface (18, 19) of the external component (16, 17), and the group of the electrically conductive nanowires (23, 24) extends away from the stack (10).

13. The package according to any one of claims 9 to 12, wherein: The connecting element (15, 22, 35) and / or the first element and / or the second element are deformed at a contact portion with a corresponding at least one electrically conductive surface (14, 18, 19) or at least one connecting surface or the first element or the second element opposite.

14. The package according to any one of claims 9 to 13, wherein: The connecting element (15, 22, 35) and / or the first element and / or the second element are at least partially covered by a protective material (36, 37).

15. The package according to any one of claims 9 to 14, wherein: The component (13) is configured to be connected to at least two external components (16, 17).

16. The package according to claim 15, wherein: The component (13) has a bridging function.

Images