Method and system for automatically controlling manufacturing process of automobile USB interface and USB interface

Abstract

The invention relates to an automatic control method and system for the manufacturing process of an automobile USB interface and the USB interface, and relates to the field of automobile parts, and the method comprises the steps that a preset clamping device is controlled to install a light guide ring at the light guide ring installation position of a light-emitting ring so as to assemble a light-emitting ring assembly; the clamping device is controlled to install the light-emitting ring assembly at the light-emitting ring assembly installation position of the circuit board assembly, and whether the notch feature of the light guide ring preset on the light-emitting ring assembly is overlapped with the position of the LED lamp or not is determined; when and only when the circuit board assembly and the base are overlapped, a pin preset on the circuit board assembly is controlled to be inserted into the position of a rear cover hole in the base, and a preset pressing device is controlled to mount the base on the shell; and performing aging treatment on the assembled USB interface by using a preset aging treatment method, and then performing performance test on the aged USB interface by using a preset performance test method. By means of the method, the quality of the produced USB interface is high, and the production efficiency of the USB interface is improved in the automatic production process.

Description

Technical Field

[0001] The present invention relates to the field of automobile parts, and in particular to an automatic control method and system for the manufacturing process of an automobile USB interface and a USB interface. Background Art

[0002] The car USB port is an indispensable element in modern car design, and its most common use is to charge electronic devices such as mobile phones and tablets.

[0003] The automotive USB interface is an independent electronic module, usually produced by auto parts manufacturers and installed during the automotive assembly process. In order to ensure that the USB interface can be used normally when the car is running, the USB interface needs to strictly follow the process flow during the entire production and testing process. Traditional assembly line workers have many omissions and cannot meet the high quality and high efficiency requirements of automotive safety, which needs to be improved. Summary of the invention

[0004] In order to improve the production quality and efficiency of an automotive USB interface, the present invention provides an automatic control method and system for the manufacturing process of an automotive USB interface and a USB interface.

[0005] In a first aspect, the present invention provides a method for automatically controlling the manufacturing process of an automotive USB interface, which adopts the following technical solution: A method for automatically controlling the manufacturing process of a car USB interface, comprising: Acquire the luminous ring image, the circuit board component image, the housing image, and the base image; Determine the light guide ring installation position on the light guide ring for installation of the preset light guide ring according to the light guide ring image recognition; Controlling a preset clamping device to install the light guide ring at the light guide ring installation position of the light ring to assemble into a light ring assembly; Determine, based on the circuit board component image recognition, a light-emitting ring component installation position on the circuit board component for installation of the light-emitting ring component; Determine the position of the LED lamp based on the circuit board component image and the preset LED lamp feature recognition; Control the clamping device to install the light-emitting ring assembly at the light-emitting ring assembly installation position of the circuit board assembly, and determine whether the light guide ring notch feature preset on the light-emitting ring assembly overlaps with the LED lamp position; If and only if the two overlap, the position of the inner groove is determined according to the shell image; Controlling the clamping device to install the assembled circuit board assembly in the inner slot position, and determining the rear cover hole position according to the base image and preset hole feature recognition; Control the pins preset on the circuit board assembly to be inserted into the rear cover hole position on the base, and control the preset pressing device to install the base on the housing; The assembled USB interface is aged using a preset aging method, and then the performance of the aged USB interface is tested using a preset performance test method.

[0006] By adopting the above technical solution, the light-emitting ring component is first assembled and installed on the circuit board component, so that the light-emitting ring component can better transmit the light of the LED lamp, and then the circuit board component, the shell and the base are installed. After the installation is completed, the whole is aged and the performance is tested. Through the above steps, the quality of the USB interface produced is higher, and the automated production process improves the production efficiency of the USB interface.

[0007] Optional aging treatment methods include: Acquiring the inner cavity image information of the preset aging device; Identify and determine a placement area in the inner cavity of the aging device for placing the USB interface based on the inner cavity image information; Determine the arrangement position of each USB interface according to the placement position area and the preset arrangement method; Controlling the clamping device to place the USB interface at the arrangement position, and starting the aging device to heat the USB interface within a preset specified temperature range; After a preset heating time, the USB interface is taken out, and a preset cooling device is controlled to cool the USB interface.

[0008] Optional performance testing methods include: Start the preset test bench, control the test bench to test the preset qualified samples, and determine whether the test results are qualified; Based on the qualified test results of the qualified samples, the control test bench tests the preset defective samples to determine whether the test results are unqualified; Based on the test result of the defective sample being unqualified, the model information of the product to be tested is obtained; When the model information is consistent with the preset reference detection model, the preset positioning fixture is controlled to position the product to be inspected, and the test bench is controlled to test the product to be inspected; If and only if the test result of the product to be inspected is qualified, the preset dotting device is controlled to perform dotting marks at the preset dotting positions of the product to be inspected.

[0009] Optionally, during the performance test, it is necessary to determine whether the LED light is on or off from the Type-C port of the USB interface. The determination method includes: Controlling the clamping device to immerse the USB interface into a preset fixed position in the insulating water so that the light is refracted from the preset Type-C port through the insulating water, and obtaining light image information at the Type-C port; Determine the light brightness value according to the light image information; When the light brightness value is greater than the preset reference brightness value, the current test is completed and the next test is continued after drying; When the light brightness value is not greater than the reference brightness value, the backlight abnormality type is determined according to the light brightness value, and the backlight abnormality type includes weak light and loss of light; Based on weak light, the brightness difference is determined according to the light brightness value and the reference brightness value, and the gap width value between the light guide ring notch feature and the LED lamp position is determined according to the brightness difference; According to the gap width value, a preset pressing device is matched to press the circuit board assembly onto the housing with a pressing force value; Controlling the clamping device to apply force to the circuit board assembly with the clamping force, and obtaining the light brightness value again; Based on the fact that the light brightness value is consistent with the reference brightness value, it is defined that the connection buckle between the shell and the base is abnormal, and the buckle is processed using the buckle abnormality processing method.

[0010] By adopting the above technical solution, the USB interface is placed in insulating water. The insulating water is non-conductive and therefore will not cause a short circuit and damage during the USB interface test. The insulating water can conduct and refract light, so that the light of the LED lamp can be emitted from the Type-c port, so that the system can observe the light, thereby determining whether there is an abnormality in the USB interface, and the test efficiency is high.

[0011] Optionally, the buckle processing method includes: Obtain buckle image information at the connection buckle; Determining whether the connecting buckle is cracked according to the buckle image information and the preset reference buckle features; Based on the connection buckle not being cracked, determining the buckle width of the buckle portion for locking preset on the connection buckle according to the buckle image information; Determine the width adjustment value according to the fastening width and the preset reference width; Controlling a preset heat welding device to heat the buckle part, and controlling a clamping device to stretch the buckle part according to the width adjustment value, and controlling the clamping device to immerse the USB interface into insulating water after stretching; Based on the cracking of the connecting buckle, the cracking position and cracking contour of the connecting buckle are determined according to the buckle image information and the preset cracking characteristics; The heat welding device is controlled to heat the cracked position of the connecting buckle along the cracked contour to fuse the cracked part, and after heating, the clamping device is controlled to immerse the USB interface into insulating water.

[0012] By adopting the above technical solution, when there is an abnormality in the buckle, the buckle is heated by a heat welding device. The system can change the width of the buckle or fuse the cracked part of the buckle by heating. After completing the above operation, it can be directly cooled by insulating water, which is more convenient.

[0013] Optionally, after the connection buckle is cracked, there is a risk of breakage. Methods for handling the breakage of the connection buckle include: Determine the buckle groove profile and buckle groove depth according to the buckle image information and preset buckle groove features; Control the clamping device to lift the USB interface until the height at which the insulating water leaks out is equal to the depth of the buckle groove so that there is no insulating water in the buckle groove where the connection buckle is broken; Match the preset blocking ring according to the buckle groove contour; The control blocking ring is inserted into the buckle groove, and the control hot welding device is used to melt the broken buckle and inject it into the blocking ring of the buckle groove to connect with the broken connecting buckle. After the connection, the USB interface is placed in insulating water for cooling.

[0014] Optionally, also include: Based on the inconsistency between the light brightness value and the reference brightness value, the light guide ring is defined to be tilted, and the light transmission path is determined according to the light image information and the preset light characteristics; Determine the light guide ring offset direction and light guide ring offset distance according to the light transmission path and the preset reference transmission path; Determining the vibration position of the preset vibration device in the insulating water according to the deviation direction of the light guide ring; Matching the vibration time of the vibration device according to the offset distance of the light guide ring; The vibration device is controlled to vibrate at the vibration position of the insulating water with a preset reference vibration parameter according to the vibration time so as to transmit the vibration to the light guide ring through the insulating water and drive the light guide ring to reset.

[0015] By adopting the above technical solution, when the light guide ring in the luminous ring assembly is tilted during arrangement, the position of the light guide ring can be adjusted by the vibration of the insulating water during testing, and whether the light guide ring is adjusted into place can be determined by the match between the light transmission path and the reference transmission path. The above method does not require disassembly of the USB interface and is relatively convenient.

[0016] Optionally, if the backlight abnormality type is light loss, it may be caused by a pin abnormality. The methods for handling the pin abnormality include: Get the pin image information at the back cover hole position; Determine the top position of each pin according to the pin image information and the preset reference pin; Connect the top position of each pin to obtain a top position line, and determine whether the top position line is a straight line; If the top position connection line is not a straight line, determine the coincident straight line containing the most top positions according to the top position of each pin, and determine the offset top positions that do not fall on the coincident straight line according to the coincident straight line; Determine the offset distance based on the offset top position and the coincident straight line; The clamping device is controlled according to the offset distance to correct the pin corresponding to the offset top position.

[0017] In a second aspect, the present application provides an automatic control system for the manufacturing process of a car USB interface, which adopts the following technical solution: A manufacturing process automatic control system for a car USB interface, applied to a manufacturing process automatic control method for a car USB interface, comprising: An acquisition module is used to acquire the luminous ring image, the circuit board component image, the shell image, the base image, the inner cavity image information of the aging device, the model information of the product to be inspected, the light image information at the Type-C port, the buckle image information at the connection buckle, and the pin image information at the back cover hole position; A memory for storing a program of an automatic control method for a manufacturing process of a USB interface for an automobile; The program in the processor and the memory can be loaded and executed by the processor to realize the automatic control method of the manufacturing process of the automobile USB interface.

[0018] In a third aspect, the present application provides a USB interface, which adopts the following technical solution: A USB interface is manufactured using an automatic control method for the manufacturing process of an automotive USB interface. The USB interface comprises a shell, a circuit board assembly and a base. The circuit board assembly is installed in an inner cavity of the shell. The base is snap-fitted with the shell to cover the circuit board assembly.

[0019] In summary, the present application includes at least one of the following beneficial technical effects: The automatic control method for the manufacturing process of the automotive USB interface is to assemble and install the light ring component on the circuit board component so that the light ring component can better transmit the light of the LED lamp, and then install the circuit board component, the housing and the base. After the installation is completed, the overall aging and performance test are performed. Through the above steps, the quality of the produced USB interface is high, and the automated production process improves the production efficiency of the USB interface. By placing the USB interface in insulating water, the insulating water is non-conductive and therefore will not cause a short circuit and damage during the USB interface test. In addition, the insulating water can conduct and refract the light, so that the light of the LED lamp can be emitted from the Type-C port, so that the system can observe the light and determine whether there is an abnormality in the USB interface, and the test efficiency is high. When the light guide ring in the luminous ring assembly is tilted during arrangement, the position of the light guide ring can be adjusted by the vibration of the insulating water during testing, and whether the light guide ring is adjusted into place can be determined by the match between the light transmission path and the reference transmission path. The above method does not require disassembly of the USB interface and is relatively convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is an exploded diagram of a car USB interface according to an embodiment of the present invention; Figure 2 It is a method flow chart of the automatic control method of the manufacturing process of the automotive USB interface according to an embodiment of the present invention; Figure 3 is a method flow chart of an aging treatment method according to an embodiment of the present invention; Figure 4 is a method flow chart of a performance testing method according to an embodiment of the present invention; Figure 5 It is a flow chart of a method for determining the on / off status of an LED lamp according to an embodiment of the present invention.

[0021] The names of the parts indicated by the numerical labels in the above figures are as follows: 1. Shell; 2. Circuit board assembly; 3. Base; 4. Type-c port; 5. Light guide ring; 6. Light ring; 7. LED light; 8. Pin; 9. Back cover hole. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] The embodiment of the present application discloses a method for automatically controlling the manufacturing process of an automotive USB interface.

[0024] Reference Figure 1 The car USB interface includes a shell 1, a circuit board assembly 2 and a base 3. The circuit board assembly 2 is installed in the inner cavity of the shell 1, and the base 3 is snap-fitted with the shell 1 to cover the circuit board assembly 2. The circuit board assembly 2 has a Type-c port 4 for connecting a power supply, and the Type-c port 4 is circumferentially provided with a light ring assembly, which is composed of a light guide ring 5 and a light ring 6, and the light ring 6 is used for the installation of the light guide ring 5. The circuit board assembly 2 has an LED lamp 7, which corresponds to the light ring assembly, and the light ring assembly can conduct the light generated by the LED lamp 7. The circuit board assembly 2 has a pin 8, and the base 3 has a rear cover hole 9, and the pin 8 extends from the rear cover hole 9.

[0025] Reference Figure 2The automatic control method for manufacturing process of automotive USB interface includes the following steps: Step S100: Acquire the luminous ring image, the circuit board component image, the housing image and the base image.

[0026] The luminous ring image refers to an image of the luminous ring 6 obtained by photographing the luminous ring 6 at a specific position on the production workbench. Similarly, the circuit board assembly image is an image of the circuit board assembly 2, the housing image is an image of the housing 1, and the base image is an image of the base 3. A camera is provided on the production workbench, and the camera can obtain the above-mentioned luminous ring image, circuit board assembly image, housing image, and base image, and save them to the system.

[0027] Step S101: determining a light guide ring installation position on the light guide ring 6 for installing a preset light guide ring 5 according to light guide ring image recognition.

[0028] When producing a USB interface, it is necessary to first assemble the light guide ring 5 and the light ring 6. The light guide ring installation position is the position on the light ring 6 where the light guide ring 5 is installed. By performing image recognition analysis on the light ring image, the light guide ring installation position can be found from the light ring image.

[0029] Step S102: Control a preset clamping device to install the light guide ring 5 at the light guide ring installation position of the light ring 6 to assemble into a light ring assembly.

[0030] The clamping device is arranged on the production workbench and is used for clamping and installing parts.

[0031] When the installation position of the light guide ring is determined, the clamping device can clamp the light guide ring 5 to the installation position of the light guide ring installed on the light guide ring 6, so as to assemble and form a light guide ring assembly for use in subsequent processes.

[0032] Step S103: determining the light ring assembly installation position on the circuit board assembly 2 for installing the light ring assembly according to the circuit board assembly image recognition.

[0033] After the light ring assembly is assembled, it needs to be installed on the circuit board assembly 2 to transmit the light of the LED lamp 7. Therefore, when installing the light ring assembly on the circuit board assembly 2, it is necessary to first determine the installation position of the light ring assembly.

[0034] The installation position of the light ring component can be obtained by performing image recognition analysis on the circuit board component image. The light ring component is mounted on the Type-c port 4, so the system first determines the characteristic position of the Type-c port 4 to determine the installation position of the light ring component.

[0035] Step S104: determining the position of the LED lamp 7 according to the circuit board component image and the preset features of the LED lamp 7.

[0036] After the light ring assembly is installed on the circuit board assembly 2, the light guide ring gap feature needs to overlap with the LED lamp 7 to transmit light, so the position of the LED lamp 7 on the circuit board needs to be determined. The position of the LED lamp 7 refers to the position of the LED lamp 7 on the circuit board assembly 2. The position of the LED lamp 7 is determined by identifying and analyzing the circuit board assembly image and finding the LED lamp 7 therein.

[0037] Step S105: Control the clamping device to install the light ring assembly at the light ring assembly installation position of the circuit board assembly 2, and determine whether the light guide ring notch feature preset on the light ring assembly overlaps with the position of the LED lamp 7.

[0038] Determine whether the notch feature of the light guide ring overlaps with the position of the LED lamp 7 to ensure that the light-emitting ring assembly can transmit light normally.

[0039] Step S106: When and only when the two overlap, determine the inner groove position according to the shell image.

[0040] If the light guide ring gap feature does not overlap with the position of the LED lamp 7, it will be processed in the subsequent test process and will not be described in detail here.

[0041] The inner groove position refers to the position in the housing 1 for installing the circuit board assembly 2. After ensuring that the notch feature of the light guide ring overlaps with the position of the LED lamp 7, the system will insert the circuit board assembly 2 into the inner groove position of the housing 1 through the clamping device. The inner groove position can be determined by image recognition analysis of the housing image.

[0042] Step S107: Control the clamping device to install the assembled circuit board assembly 2 at the inner groove position, and determine the rear cover hole position according to the base image and preset hole feature recognition.

[0043] The rear cover hole position refers to the position on the base 3 for the pin 8 on the circuit board assembly 2 to be inserted. After the circuit board assembly 2 is installed into the housing 1, the system needs to install the base 3 on the housing 1. The rear cover hole position can be obtained by image recognition analysis of the base image and the hole feature. The hole feature is a database containing the shape image of the rear cover hole 9, which will not be described here.

[0044] Step S108 : controlling the pins 8 preset on the circuit board assembly 2 to be inserted into the rear cover holes on the base 3 , and controlling the preset pressing device to install the base 3 on the housing 1 .

[0045] After determining the position of the rear cover hole, the system controls the clamping device to install the base 3 on the shell 1, and allows the pin 8 to be inserted into the rear cover hole. The shell 1 and the base 3 are pressed together by the pressing device so that the two can be snapped together.

[0046] Step S109: performing aging treatment on the assembled USB interface using a preset aging treatment method, and then performing a performance test on the aged USB interface using a preset performance test method.

[0047] After the USB interface is assembled, the system will first perform an aging process on the USB interface, and then perform a performance test after the aging process is completed. The aging process method and the performance test method are not described in detail here, and will be described in detail in the subsequent embodiments.

[0048] Reference Figure 3 The aging treatment method includes the following steps: Step S200: Acquire the inner cavity image information of the preset aging device.

[0049] The inner cavity image information refers to the image of the inside of the aging device obtained by the camera. By determining the internal situation of the aging device, the USB interface can be placed in the aging device for processing.

[0050] Step S201: identifying and determining a placement area in the inner cavity of the aging device for placing a USB interface based on the inner cavity image information.

[0051] The placement location area refers to the location in the aging device for placing the USB interface. There is a fixed location in the aging device for placing the USB interface, and the fixed location is a flat and wide area in the aging device to avoid overlapping of the USB interfaces and affecting the aging results. The placement location area can be obtained by performing image recognition analysis on the inner cavity image information.

[0052] Step S202: determining the arrangement position of each USB interface according to the placement position area and a preset arrangement method.

[0053] The preset arrangement method is a method designed by technicians for determining the placement of USB interfaces during aging treatment in an aging device. The USB interfaces are arranged in an array at a preset spacing, which will not be described in detail here.

[0054] The arrangement position refers to the placement position of the USB interface when the aging process is performed in the aging device. The points arranged in the array can be obtained according to the arrangement method in the placement position area, and these points are the arrangement position of each USB interface.

[0055] Step S203: Control the clamping device to place the USB interface at the arrangement position, and start the aging device to heat the USB interface within a preset specified temperature range.

[0056] After the USB interface is placed in the aging device according to the arrangement position, the system controls the aging device to heat the USB interface. The specified temperature range is the temperature set by the technician for the aging device to perform aging treatment on the USB interface, which will not be described in detail here.

[0057] Step S204: After a preset heating time, the USB interface is removed, and a preset cooling device is controlled to cool the USB interface.

[0058] The cooling device is used to cool down the USB interface after aging. After the USB interface is aged, the temperature is high. At this time, the system controls the cooling device to cool down the USB interface. The cooling device is the same as the aging device, which is also a box. The system puts the USB interface into the cooling device for cooling. The heating time is the aging heating time of the USB interface set by the technician, which will not be repeated here.

[0059] Reference Figure 4 , the performance testing method includes the following steps: Step S300: Start a preset test bench, control the test bench to test preset qualified samples, and determine whether the test results are qualified.

[0060] In this embodiment, in order to ensure that the performance of the test bench itself is intact, the test bench needs to be tested first.

[0061] The qualified samples are USB interface samples that can function properly. The qualified samples are tested first by controlling the test bench. If the test results are qualified, it means that the test bench can test USB interfaces with good performance.

[0062] Step S301: Based on the qualified test results of the qualified samples, the test bench is controlled to test the preset defective samples to determine whether the test results are unqualified.

[0063] The defective samples were USB interfaces with quality issues.

[0064] When the test bench tests the qualified samples and the test results are qualified, the system controls the test bench to test the defective samples to ensure that the test bench will not test the defective products as qualified products.

[0065] Step S302: Based on the test result of the defective sample being unqualified, the model information of the product to be tested is obtained.

[0066] When the test result of the defective sample is unqualified, it means that the test bench can test the USB interface normally.

[0067] The model information of the product to be tested refers to the category model of the current USB interface. The test methods and parameters of each model of USB interface are not universal and need to be tested in a targeted manner. There is a label QR code on the USB interface. By scanning the label QR code, the system can obtain the model information of the current USB interface to be tested from the label QR code.

[0068] Step S303: When the model information is consistent with the preset reference detection model, the preset positioning fixture is controlled to position the product to be inspected, and the test bench is controlled to test the product to be inspected.

[0069] The benchmark test model is the model of the USB interface currently being tested set by the technician. The product to be tested needs to be consistent with the set benchmark test model before it can be tested, otherwise the test result is invalid, which will not be elaborated here.

[0070] The positioning fixture is used to position the USB interface to ensure normal testing of the USB interface.

[0071] When the model information is consistent with the benchmark test model, the system controls the positioning fixture to position the USB interface and then starts the test process.

[0072] Step S304: If and only if the test result of the product to be inspected is qualified, control the preset dotting device to perform dotting marks at the preset dotting positions of the product to be inspected.

[0073] When the test is completed and the test result is qualified, the system controls the dotting device to dot the USB interface as a mark to indicate that the USB interface is a qualified product.

[0074] If the test result is unqualified, the system will identify and analyze the reason why the USB interface is unqualified. The analysis method will not be described in detail here, but will be described in detail in subsequent embodiments.

[0075] Reference Figure 5 During the performance test, it is necessary to determine the on / off status of the LED light 7 from the Type-c port 4 of the USB interface, and the determination method includes the following steps: Step S400: Control the clamping device to immerse the USB interface into a preset fixed position in the insulating water so that the light can be refracted from the preset Type-c port 4 through the insulating water, and obtain the light image information at the Type-c port 4.

[0076] In this embodiment, in order to facilitate the observation of the light emitted from the Type-c port 4, the USB interface is placed in a container filled with insulating water. The insulating water does not conduct electricity to ensure that the USB interface can be powered on and operated, and the insulating water can serve as a medium for light conduction, so that the light in the Type-c port 4 is transmitted to the insulating water.

[0077] The fixed position is a fixed position of the USB interface set by a technician when the USB interface is tested in insulating water. The fixed position is immersed in insulating water and will not be described in detail here.

[0078] The light image information refers to the light image at the Type-c port 4 obtained by the camera. Due to the existence of the insulating water medium, the light emitted from the Type-c port 4 can be transmitted to the insulating water and a real-life image of the light appears. The light image information is obtained by collecting the real-life image of the light through the camera.

[0079] Step S401: determining the light brightness value according to the light image information.

[0080] The light brightness value refers to the brightness of the light emitted from the Type-c port 4. The light brightness value can be determined by the brightness of the light in the light image information. The brighter the light in the light image information, the greater the light brightness value.

[0081] Step S4021: When the light brightness value is greater than the preset reference brightness value, the current test is completed and the next test is continued after drying.

[0082] The reference brightness value is the brightness value of the light emitted from the Type-C port when the light-emitting ring component normally transmits the light of LED lamp 7. The reference brightness value is used to measure whether the light-emitting ring component in the USB interface is abnormal, which will not be elaborated here.

[0083] If the light brightness value is greater than the reference brightness value, it means that the USB interface is normal.

[0084] Step S4022: When the light brightness value is not greater than the reference brightness value, the backlight abnormality type is determined according to the light brightness value, and the backlight abnormality type includes weak light and loss of light.

[0085] If the light brightness value is not greater than the reference brightness value, it means that there is an abnormality in the USB interface. At this time, there are two types of backlight abnormalities, one is weak light, which is weak light, and the other is no light, which is loss of light. The two situations correspond to different abnormal conditions of the USB interface, and the system can perform targeted processing according to different situations.

[0086] Step S40221: Based on weak light, determine the brightness difference according to the light brightness value and the reference brightness value, and determine the gap width value between the light guide ring notch feature and the position of the LED lamp 7 according to the brightness difference.

[0087] In the case of weak light, there may be a gap between the light-emitting ring assembly and the LED lamp 7, that is, the circuit board assembly 2 is not pressed tightly in the housing 1, or the light-emitting ring assembly may be tilted, and it cannot well transmit the light of the LED lamp 7. In this embodiment, the case where there is a gap between the light-emitting ring assembly and the LED lamp 7 is first analyzed. If the above situation does not exist, the light-emitting ring assembly is tilted.

[0088] The gap width value refers to the gap width between the light ring assembly and the LED light 7. The gap width value is proportional to the brightness difference. The larger the brightness difference, the larger the gap width value. The brightness difference is obtained by calculating the difference between the reference brightness value and the light brightness value, and then the gap width value is matched according to the brightness difference.

[0089] Step S40222: Matching a preset pressing force value of the pressing device to press the circuit board assembly 2 against the housing 1 according to the gap width value.

[0090] The clamping force value is the magnitude of the force applied by the clamping device when the circuit board is pressed against the housing 1. The clamping force value is proportional to the gap width value. The larger the gap width value, the larger the clamping force value.

[0091] Step S40223: Control the clamping device to apply force to the circuit board assembly 2 with the clamping force, and obtain the light brightness value again.

[0092] In this embodiment, the circuit board assembly 2 is first pressed by the pressing device to determine whether the weak light is caused by the gap between the light ring assembly and the LED lamp 7. After the pressing device presses the circuit board assembly 2, the light brightness value is re-determined.

[0093] Step S40224: Based on the light brightness value being consistent with the reference brightness value, it is defined that the connection buckle between the shell 1 and the base 3 is abnormal, and the buckle is processed using the buckle abnormality processing method.

[0094] If the light brightness value is inconsistent with the reference brightness value at this time, it means that it is not because there is a gap between the light ring component and the LED lamp 7, but it may be that the light ring component is offset. The processing method at this time will not be described here, and will be described in detail in subsequent embodiments.

[0095] If the light brightness value is consistent with the reference brightness value, it is determined that there is a gap between the light ring assembly and the LED lamp 7. The problem causing the gap may be an abnormality in the connecting buckle connecting the shell 1 and the base 3. The connecting buckle position needs to be inspected and tested. The method for handling the abnormal buckle is not described here and will be introduced in detail in subsequent embodiments.

[0096] The buckle processing method includes the following steps: Step S500: Acquire buckle image information of the connection buckle.

[0097] The buckle image information refers to the image of the base 3 of the USB interface at the buckle position obtained by the camera.

[0098] Step S501: determining whether the connecting buckle is cracked according to the buckle image information and preset reference buckle features.

[0099] The reference buckle characteristics refer to a standard buckle without any abnormalities.

[0100] By comparing and analyzing the buckle image information and the reference buckle features, it is possible to determine whether the buckle on the USB interface to be tested is cracked.

[0101] Step S5021: Based on the fact that the connection buckle is not cracked, determine the buckle width of the buckle portion for locking that is preset on the connection buckle according to the buckle image information.

[0102] If the connection buckle is not cracked, the reason why the connection buckle cannot firmly connect the base 3 and the shell 1 may be that the width of the buckling portion of the connection buckle is narrow, making it easy for the connection buckle to fall out after buckling.

[0103] The buckle width refers to the width value of the buckle portion on the connecting buckle. By identifying the buckle portion of the connecting buckle in the buckle image information, the width of the buckle portion in the buckle image information can be determined, and then the buckle width is determined according to the actual preset image ratio.

[0104] Step S50211: Determine a width adjustment value according to the engagement width and a preset reference width.

[0105] The reference width is the standard width of the buckle portion of the connecting buckle, which will not be described in detail here.

[0106] The width adjustment value refers to the amount of adjustment required to adjust the width of the snap-fit ​​portion to the reference width. The width adjustment value is the difference between the reference width and the snap-fit ​​width.

[0107] Step S50212: Control the preset heat welding device to heat the buckling part, and control the clamping device to stretch the buckling part according to the width adjustment value, and control the clamping device to immerse the USB interface into insulating water after stretching.

[0108] The heat welding device is used to heat the parts, and can perform heating welding as well as melting.

[0109] The buckle part is heated by the hot welding device to soften the buckle part, and then the system controls the clamping device to stretch the buckle part. The stretching parameter is the width adjustment value, so that the width of the buckle part is adjusted to the reference width value. After the stretching is completed, the USB interface is immersed in insulating water to cool it quickly.

[0110] Step S5022: Based on the cracking of the connecting buckle, determine the cracking position and cracking contour of the connecting buckle according to the buckle image information and preset cracking features.

[0111] If the connection buckle is cracked, the system needs to be processed to fix the crack.

[0112] Cracks refer to cracks in the fastening part, which makes the fastening part shake and cannot be fastened normally. Crack position refers to the position of the crack gap on the connecting buckle. Crack profile refers to the profile of the crack gap on the connecting buckle.

[0113] By identifying and analyzing the crack features at the connection buckle position in the buckle image information, the crack position and crack contour of the crack features on the connection buckle can be determined.

[0114] Step S50221: Control the heat welding device to heat the cracked position of the connecting buckle along the cracked contour to fuse the cracked portion, and after heating, control the clamping device to immerse the USB interface in insulating water.

[0115] In case the connecting buckle is cracked, the system controls the heat welding device to heat along the crack contour so that the crack contour is re-fused.

[0116] After the connection buckle is cracked, there is a risk of breaking. The treatment method for the connection buckle breaking includes the following steps: Step S600: determining the buckle groove profile and buckle groove depth according to the buckle image information and preset buckle groove features.

[0117] When the buckling portion of the connecting buckle is broken, only the buckle groove without the buckling portion is left at the connecting buckle when the base 3 and the shell 1 are assembled.

[0118] By performing image recognition analysis on the buckle groove features in the buckle image information, the buckle groove contour of the buckle groove features and its depth in the buckle image information can be determined, and then the buckle groove depth can be determined according to the actual image ratio.

[0119] Step S601: Control the clamping device to lift the USB interface to a height where the insulating water leaks out, which is equal to the depth of the buckle groove, so that there is no insulating water in the buckle groove where the connecting buckle is broken.

[0120] After determining the depth of the snap groove, the system controls the clamping device to lift the USB interface so that the snap groove is exposed to the water surface. The height of the USB interface exposed to the water surface is the depth of the snap groove, so that there is no insulating water in the snap groove, which facilitates operation inside the snap groove.

[0121] Step S602: matching a preset blocking ring according to the buckle groove profile.

[0122] The blocking ring is arranged in the buckle groove and fits with the inner wall of the buckle groove, so that the inner wall of the buckle groove is not affected when the system is processed in the buckle groove.

[0123] The shape of the blocking ring is consistent with the profile of the buckle groove, and a matching blocking ring can be selected according to the profile of the buckle groove.

[0124] Step S603: Control the blocking ring to be inserted into the buckle groove, control the hot welding device to melt the broken buckle and inject it into the blocking ring of the buckle groove to connect with the broken connecting buckle, and after the connection, put the USB interface into the insulating water for cooling.

[0125] In this embodiment, the system controls the hot welding device to melt the broken and fallen buckle part and inject it into the buckle groove. Since the blocking ring is inserted into the buckle groove in advance, the liquid after the buckle part is melted will not connect with the inner wall of the buckle groove. After the liquid after the buckle part is melted is injected into the buckle groove, it is immersed in insulating water as a whole to cool quickly to form a new buckle part, and then the blocking ring is taken out.

[0126] The processing method for obtaining the light brightness value for the second time and determining that the light brightness value is inconsistent with the reference brightness value includes the following steps: Step S700: Based on the inconsistency between the light brightness value and the reference brightness value, the light guide ring 5 is defined to be tilted, and the light transmission path is determined according to the light image information and the preset light characteristics.

[0127] In step S40224, by comparing the reacquired light brightness value with the reference brightness value, if the two are inconsistent, it means that pressing the circuit board assembly 2 into the housing 1 has no effect, and it may be that the light guide ring 5 is tilted during installation, so that the light guide ring 5 cannot guide light well and can only transmit part of the light, resulting in weak light. And because the light guide ring 5 is tilted, the light transmitted and emitted from the Type-c port 4 is offset.

[0128] The light transmission path refers to the propagation path of light emitted from the Type-c port 4. The light transmission path can be obtained by identifying and analyzing light features from light image information.

[0129] Step S701: determining the light guide ring offset direction and light guide ring offset distance according to the light transmission path and the preset reference transmission path.

[0130] The reference transmission path refers to the standard propagation path of light emitted from the Type-C port 4 when the light guide ring 5 is installed normally, which will not be elaborated here.

[0131] Since the light guide ring 5 is offset during installation, the light transmission path deviates from the reference transmission path. Therefore, the deviation between the light transmission path and the reference transmission path corresponds to the offset parameter of the light guide ring 5 .

[0132] By analyzing the light transmission path and the reference transmission path, the deviation angle between the two paths is proportional to the light guide ring offset distance, and the offset direction between the two paths is related to the light guide ring offset direction. The light guide ring offset direction refers to the offset direction between the light guide ring 5 with the deviation and the normal light guide ring installation position. The light guide ring offset distance refers to the distance between the light guide ring 5 with the deviation and the normal light guide ring installation position.

[0133] Step S702: determining the vibration position of the preset vibration device in the insulating water according to the offset direction of the light guide ring.

[0134] In this embodiment, the system vibrates the insulating water through a vibration device without removing the USB device, and the insulating water transmits the vibration to the light guide ring 5 to reset the light guide ring 5.

[0135] The vibration position refers to the working position of the vibration device in the insulating water. Vibrating at the vibration position can transmit the vibration to the light guide ring 5, so that the light guide ring 5 moves in the opposite direction of the light guide ring offset direction. The vibration position is related to the light guide ring offset direction and is on a straight line.

[0136] Step S703: matching the vibration time of the vibration device according to the light guide ring offset distance.

[0137] The vibration time refers to the working time of the vibration device. After the vibration device vibrates for the vibration time, the light guide ring 5 can move back to the normal position. The vibration time is proportional to the offset distance of the light guide ring. The longer the offset distance of the light guide ring is, the longer the vibration time is.

[0138] Step S704: Control the vibration device to vibrate at the vibration position of the insulating water with preset reference vibration parameters according to the vibration time so as to transmit the vibration to the light guide ring 5 through the insulating water and drive the light guide ring 5 to reset.

[0139] The reference vibration parameters include the vibration intensity of the vibration device, which is a standard parameter set by a technician. The insulating water is vibrated by the vibration intensity, and the waves generated by the vibration can move the light guide ring 5, which will not be elaborated here.

[0140] During the vibration process, the vibration device continuously compares the light transmission path with the reference transmission path. If the two are consistent, it indicates that the light guide ring 5 is reset.

[0141] If the backlight abnormality type is light loss, it may be that pin 8 is abnormal. The solution for pin 8 abnormality includes the following steps: In this embodiment, if no light is emitted from the Type-c port 4, it means that there is no current in the circuit board assembly 2. The possible reason at this time may be that the pin 8 in the circuit board assembly 2 is tilted when inserted into the rear cover hole 9, making it impossible to supply power normally.

[0142] Step S800: Obtain the pin image information at the rear cover hole position.

[0143] The plug pin image information refers to the image of the plug pin 8 in the rear cover hole 9 obtained by the camera.

[0144] Step S801: determining the top position of each pin 8 according to the pin image information and the preset reference pin 8.

[0145] The top position refers to the position of the top portion of the pin 8 in the rear cover hole 9. By performing image recognition on the reference pin 8 in the pin image information, the position of the top portion of each pin 8 in the rear cover hole 9 can be determined.

[0146] Step S802: Connect the top positions of each pin 8 to obtain a top position line, and determine whether the top position line is a straight line.

[0147] After obtaining the top positions of all the pins 8, all the top positions are connected. If the top position connection line is a straight line, it means that the pins 8 are not tilted and all the pins 8 are good. If the top position connection line is not a straight line, it means that there are tilted pins 8, so that the top position connection line has an inflection point.

[0148] Step S803: If the top position line is not a straight line, determine the coincident line containing the most top positions according to the top position of each pin 8, and determine the offset top positions that do not fall on the coincident line according to the coincident line.

[0149] In the case where the top position connection line is not a straight line, the system can analyze the top position of each pin 8 to obtain a straight line containing the most top positions, which is a coincidence line formed by connecting the top positions of all normal pins 8. The top positions that are not on the coincidence line are offset top positions, that is, the top positions of the pins 8 that are tilted.

[0150] Step S804: Determine the offset distance according to the offset top position and the coincident straight line.

[0151] The offset distance is the distance between the top position where the tilt occurs and the coincident straight line.

[0152] After the tilted insertion pin 8 is determined, the deviation distance of the tip position of the tilted insertion pin 8 can be determined based on the offset tip position and the coincident straight line.

[0153] Step S805: Control the clamping device to correct the pin 8 corresponding to the offset top position according to the offset distance.

[0154] The deviated pin 8 is corrected by the clamping device so that the offset top position coincides with the coincidence straight line, indicating that the tilted pin 8 is reset.

[0155] Based on the same inventive concept, an embodiment of the present invention provides an automatic control system for the manufacturing process of an automotive USB interface.

[0156] A manufacturing process automatic control system for a car USB interface, applied to a manufacturing process automatic control method for a car USB interface, comprising: The acquisition module is used to obtain the luminous ring image, the circuit board component image, the shell image, the base image, the inner cavity image information of the aging device, the model information of the product to be inspected, the light image information at the Type-c port 4, the buckle image information at the connection buckle, and the pin image information at the back cover hole position.

[0157] The memory is used to store a program of an automatic control method for a manufacturing process of a car USB interface.

[0158] The program in the processor and the memory can be loaded and executed by the processor to realize the automatic control method of the manufacturing process of the automobile USB interface.

[0159] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for automatically controlling the manufacturing process of a car USB interface, characterized in that: include: Acquire the luminous ring image, the circuit board component image, the housing image, and the base image; Determining a light guide ring installation position on the light guide ring (6) for installing a preset light guide ring (5) according to the light guide ring image recognition; Controlling a preset clamping device to install the light guide ring (5) at the light guide ring installation position of the light-emitting ring (6) to assemble the light-emitting ring assembly; Determining a light-emitting ring component installation position on the circuit board component (2) for installing the light-emitting ring component according to circuit board component image recognition; Determining the position of the LED light (7) based on the circuit board component image and preset LED light (7) feature recognition; Controlling the clamping device to install the light-emitting ring component at the light-emitting ring component installation position of the circuit board component (2), and determining whether the light guide ring notch feature preset on the light-emitting ring component overlaps with the position of the LED lamp (7); If and only if the two overlap, the position of the inner groove is determined according to the shell image; Controlling the clamping device to install the assembled circuit board component (2) at the inner groove position, and determining the rear cover hole position according to the base image and preset hole feature recognition; Controlling the insertion pin (8) preset on the circuit board assembly (2) to be inserted into the rear cover hole position on the base (3), and controlling the preset pressing device to install the base (3) on the housing (1); The assembled USB interface is aged using a preset aging method, and then the performance of the aged USB interface is tested using a preset performance test method.

2. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 1, characterized in that: Aging treatment methods include: Acquiring the inner cavity image information of the preset aging device; Identify and determine a placement area in the inner cavity of the aging device for placing the USB interface based on the inner cavity image information; Determine the arrangement position of each USB interface according to the placement position area and the preset arrangement method; Controlling the clamping device to place the USB interface at the arrangement position, and starting the aging device to heat the USB interface within a preset specified temperature range; After a preset heating time, the USB interface is taken out, and a preset cooling device is controlled to cool the USB interface.

3. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 2, characterized in that: Performance testing methods include: Start the preset test bench, control the test bench to test the preset qualified samples, and determine whether the test results are qualified; Based on the qualified test results of the qualified samples, the control test bench tests the preset defective samples to determine whether the test results are unqualified; Based on the test result of the defective sample being unqualified, the model information of the product to be tested is obtained; When the model information is consistent with the preset reference detection model, the preset positioning fixture is controlled to position the product to be inspected, and the test bench is controlled to test the product to be inspected; If and only if the test result of the product to be inspected is qualified, the preset dotting device is controlled to perform dotting marks at the preset dotting positions of the product to be inspected.

4. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 3, characterized in that: During the performance test, it is necessary to determine whether the LED light (7) is on or off through the Type-C port (4) of the USB interface. The determination method includes: Controlling the clamping device to immerse the USB interface into a preset fixed position in the insulating water so that light is refracted from a preset Type-C port (4) through the insulating water, and obtaining light image information at the Type-C port (4); Determine the light brightness value according to the light image information; When the light brightness value is greater than the preset reference brightness value, the current test is completed and the next test is continued after drying; When the light brightness value is not greater than the reference brightness value, the backlight abnormality type is determined according to the light brightness value, and the backlight abnormality type includes weak light and loss of light; Based on weak light, determining a brightness difference according to a light brightness value and a reference brightness value, and determining a gap width value between a notch feature of the light guide ring and a position of the LED lamp (7) according to the brightness difference; Matching a preset clamping force value of the clamping device to the gap width value to press the circuit board assembly (2) onto the housing (1); Controlling the pressing device to apply force to the circuit board assembly (2) with a pressing force, and obtaining the light brightness value again; Based on the light brightness value being consistent with the reference brightness value, it is defined that the connection buckle between the shell (1) and the base (3) is abnormal, and the buckle is processed using a buckle abnormality processing method.

5. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 4, characterized in that: Snap-on processing methods include: Obtain buckle image information at the connection buckle; Determining whether the connecting buckle is cracked according to the buckle image information and the preset reference buckle features; Based on the connection buckle not being cracked, determining the buckle width of the buckle portion for locking preset on the connection buckle according to the buckle image information; Determine the width adjustment value according to the fastening width and the preset reference width; Controlling a preset heat welding device to heat the buckle part, and controlling a clamping device to stretch the buckle part according to the width adjustment value, and controlling the clamping device to immerse the USB interface into insulating water after stretching; Based on the cracking of the connecting buckle, the cracking position and cracking contour of the connecting buckle are determined according to the buckle image information and the preset cracking characteristics; The heat welding device is controlled to heat the cracked position of the connecting buckle along the cracked contour to fuse the cracked part, and after heating, the clamping device is controlled to immerse the USB interface into insulating water.

6. According to the method for automatically controlling the manufacturing process of the automotive USB interface of claim 5, after the connecting buckle is cracked, there is a risk of breaking, and the method for handling the breaking of the connecting buckle comprises: Determine the buckle groove profile and buckle groove depth according to the buckle image information and preset buckle groove features; Control the clamping device to lift the USB interface until the height at which the insulating water leaks out is equal to the depth of the buckle groove so that there is no insulating water in the buckle groove where the connection buckle is broken; Match the preset blocking ring according to the buckle groove contour; The control blocking ring is inserted into the buckle groove, and the control hot welding device is used to melt the broken buckle and inject it into the blocking ring of the buckle groove to connect with the broken connecting buckle. After the connection, the USB interface is placed in insulating water for cooling.

7. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 4, characterized in that: Also includes: Based on the inconsistency between the light brightness value and the reference brightness value, the light guide ring (5) is defined to be tilted, and the light transmission path is determined according to the light image information and the preset light characteristics; Determine the light guide ring offset direction and light guide ring offset distance according to the light transmission path and the preset reference transmission path; Determining the vibration position of the preset vibration device in the insulating water according to the deviation direction of the light guide ring; Matching the vibration time of the vibration device according to the offset distance of the light guide ring; The vibration device is controlled according to the vibration time to vibrate at the vibration position of the insulating water with a preset reference vibration parameter so as to transmit the vibration to the light guide ring (5) through the insulating water and drive the light guide ring (5) to reset.

8. The method for automatically controlling the manufacturing process of the automotive USB interface according to claim 4, characterized in that: The backlight abnormality type is loss of light and there is a pin abnormality. The solutions for the pin abnormality include: Get the pin image information at the back cover hole position; Determining the top position of each insertion pin (8) according to the insertion pin image information and a preset reference insertion pin (8); Connecting the top positions of each pin (8) to obtain a top position line, and determining whether the top position line is a straight line; If the top position connection line is not a straight line, determine the coincidence line containing the most top positions according to the top position of each pin (8), and determine the offset top positions that do not fall on the coincidence line according to the coincidence line; Determine the offset distance based on the offset top position and the coincident straight line; The clamping device is controlled according to the offset distance to correct the pin (8) corresponding to the offset top position.

9. An automatic control system for the manufacturing process of a car USB interface, applied to the automatic control method for the manufacturing process of a car USB interface as claimed in any one of claims 1 to 8, characterized in that: include: An acquisition module, used to acquire an image of a luminous ring, an image of a circuit board assembly, an image of a housing, an image of a base, image information of an inner cavity of an aging device, model information of a product to be inspected, image information of light at a Type-C port (4), image information of a buckle at a connection buckle, and image information of a pin at a hole position of a rear cover; A memory for storing a program of an automatic control method for a manufacturing process of a USB interface for an automobile; The program in the processor and the memory can be loaded and executed by the processor to realize the automatic control method of the manufacturing process of the automobile USB interface.

10. A USB interface manufactured by applying the manufacturing process automatic control method of a vehicle USB interface according to any one of claims 1 to 8, characterized in that: The USB interface comprises a housing (1), a circuit board assembly (2) and a base (3); the circuit board assembly (2) is installed in the inner cavity of the housing (1); the base (3) is snap-fitted with the housing (1) to cover the circuit board assembly (2).

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