PCB with crimping hole ring and crimping hole ring manufacturing method

Abstract

The invention discloses a PCB with a crimping hole ring and a crimping hole ring manufacturing method, relates to the technical field of PCBs, can solve the problem that the binding force of the crimping hole ring in a deep control groove is insufficient, and greatly improves the reliability of the crimping hole ring in the deep control groove. In the punched through holes and the mother board, the blind grooves formed in the through holes and subjected to mechanical depth-controlled milling are formed to the area of the core board base material layer of the second core board layer in the area of the through holes in a mechanical depth-controlled milling mode, and then the remaining core board base material layer of the second core board layer is ablated in a laser depth-controlled milling mode; the core board substrate layer of the third core board layer is exposed, then a layer of copper is plated on the top surface copper layer, the bottom surface copper layer, the blind groove and the through hole in a copper deposition electroplating mode, manufacturing of a hole wall copper layer and a copper base of a copper ring is completed, and the top surface copper layer and the bottom surface copper layer are thickened. And finally, in the alkaline etching step, the copper layer on the side wall and the bottom of the blind groove is cleaned through etching.

Description

Technical Field

[0001] The invention relates to the technical field of PCBs, and in particular to a PCB board with a crimping hole ring and a method for manufacturing the crimping hole ring. Background Art

[0002] In PCB (printed circuit board) design, for high-level and thick PCB boards, the problem of insufficient device pin length often occurs. In order to complete the installation of the device, it is necessary to perform controlled depth milling in the device installation area to meet the pin length requirements. At the same time, an annular ring needs to be made in the controlled depth milling groove to achieve the purpose of device crimping.

[0003] At present, the industry mainly uses mechanical controlled depth milling to achieve controlled depth groove processing. Since the current controlled depth groove processing method is to directly produce it through mechanical controlled depth milling, and the depth control of mechanical depth control can only be controlled between Ln-1 and Ln, it cannot be accurately controlled to a certain copper layer; that is, the hole ring can only be directly electroplated + patterned etched at the substrate position from Ln-1 to Ln. Since the electroplating is directly performed on the substrate, the bonding strength between the plating layer and the substrate is insufficient, which is prone to quality risks such as hole ring delamination and shedding. Summary of the invention

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art, and to provide a PCB board with a crimping hole ring and a method for manufacturing the crimping hole ring, which can solve the problem of insufficient bonding force of the crimping hole ring in the depth controlled groove and greatly improve the reliability of the crimping hole ring in the depth controlled groove.

[0005] According to a first aspect of the present invention, there is provided a PCB board with a crimping hole ring, comprising a motherboard, the motherboard being formed by laminating a top copper layer, a plurality of core board layers and a bottom copper layer stacked in sequence, the core board layer comprising a core board substrate layer and a core board copper layer; a blind groove, the blind groove being opened on the motherboard, the blind groove being grooved to the upper surface of the core board copper layer in one of the plurality of core board layers; and a plurality of through holes, the through holes being opened at the bottom of the blind groove, the through holes penetrating the motherboard from the bottom of the blind groove.

[0006] Beneficial effect: A PCB board with a crimping hole ring, in which a blind groove is grooved to the upper surface of the core board copper layer, and the core board copper layer is used as the basis for crimping ring control, which can solve the problem of insufficient bonding force of the crimping hole ring in the controlled depth groove and greatly improve the reliability of the crimping hole ring in the controlled depth groove.

[0007] According to the PCB board with a crimping hole ring described in the first aspect of the present invention, the hole wall of the through hole is provided with a hole wall copper layer.

[0008] According to the PCB board with a crimping hole ring described in the first aspect of the present invention, a copper ring is provided around the through hole at one end close to the bottom of the blind groove.

[0009] According to the PCB board with a crimping hole ring described in the first aspect of the present invention, the hole wall copper layer is connected to the copper ring.

[0010] According to the PCB board with a crimping hole ring described in the first aspect of the present invention, the thickness of the hole wall copper layer, the copper ring, the top copper layer and the bottom copper layer is greater than the core board copper layer.

[0011] According to the PCB board with a crimping hole ring described in the first aspect of the present invention, the thickness of the core board copper layer at the bottom of the blind groove is greater than 35 microns.

[0012] According to a second aspect of the present invention, a method for manufacturing a crimping hole ring is provided, comprising a PCB board with a crimping hole ring according to the first aspect, comprising the following steps:

[0013] Drilling: Drill through holes on the motherboard, and the through holes penetrate the motherboard;

[0014] Mechanical controlled depth milling groove: The through hole position on the motherboard is processed by mechanical controlled depth milling to the core board substrate layer area in one of the several core board layers;

[0015] Laser controlled depth milling: laser milling is used to completely ablate the remaining core board substrate layer where the mechanical controlled depth milling has not yet completed the core board layer;

[0016] Copper electroplating: a layer of copper is plated on the top copper layer, bottom copper layer, blind slot and through hole;

[0017] Alkaline etching: Clean the copper layer on the sidewalls and bottom of the blind trench by etching.

[0018] According to a method for manufacturing a crimping hole ring described in the second aspect of the present invention, in the alkaline etching step, the copper layer at the bottom of the blind groove located around the through hole is retained to form a copper ring.

[0019] The present invention has at least the following beneficial effects: by laser controlled depth milling and laser controlled depth milling, the crimping hole ring in the deep groove can be directly made on the specified copper layer, thereby solving the problem of insufficient bonding force of the crimping hole ring in the controlled depth groove and greatly improving the reliability of the crimping hole ring in the controlled depth groove.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0022] Figure 1 This is a schematic diagram of the motherboard structure after the mechanical depth-controlled groove milling step according to a preferred embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the motherboard structure after the laser depth-controlled groove milling step in a preferred embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the motherboard structure after the copper electroplating step in a preferred embodiment of the present invention;

[0025] Figure 4 Schematic diagram of the motherboard structure after the alkaline etching step according to a preferred embodiment of the present invention.

[0026] Reference numerals: motherboard 10 , top copper layer 11 , core board layer 12 , core board substrate layer 121 , core board copper layer 122 , bottom copper layer 13 , blind groove 20 , through hole 30 , hole wall copper layer 31 , copper ring 32 . DETAILED DESCRIPTION

[0027] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] Reference Figures 1 to 4A PCB board with a crimping hole ring includes a motherboard 10, a blind groove 20 and a plurality of through holes 30. The motherboard 10 is formed by laminating a top copper layer 11, a plurality of core board layers 12 and a bottom copper layer 13 stacked in sequence. The core board layer 12 includes a core board substrate layer 121 and a core board copper layer 122. The blind groove 20 is provided on the motherboard 10. The blind groove 20 is grooved to the upper surface of the core board copper layer 122 in one of the plurality of core board layers 12. The through hole 30 is provided at the bottom of the blind groove 20. The through hole 30 passes through the motherboard 10 from the bottom of the blind groove 20.

[0032] It should be noted that in the embodiment of the present invention, the through hole 30 is opened on the upper surface of the core copper layer 122 in the third core layer 12, and the crimping hole is directly made on the core copper layer 122, which can greatly improve the reliability of the crimping hole ring in the controlled depth groove.

[0033] It should be noted that the third core board layer 12 and the fourth core board layer 12 in the text are both calculated from the core board layer 12 bonded to the top copper layer 11 as the first layer.

[0034] Reference Figure 4 The through hole 30 has a hole wall copper layer 31 disposed on the hole wall.

[0035] It can be understood that the hole wall copper layer 31 can connect the core copper layers 122 of multiple core layers 12 .

[0036] Reference Figure 4 A copper ring 32 is provided around the through hole 30 near one end of the bottom of the blind groove 20 .

[0037] Reference Figures 1 to 4 , the hole wall copper layer 31 is connected to the copper ring 32.

[0038] It is worth noting that, in the embodiment of the present invention, the thickness of the hole wall copper layer 31 , the copper ring 32 , the top copper layer 11 and the bottom copper layer 13 is greater than that of the core copper layer 122 .

[0039] It can be understood that in the embodiment of the present invention, the thickness of the hole wall copper layer 31, the copper ring 32, the top copper layer 11 and the bottom copper layer 13 are thicker, which can improve the reliability of the crimped hole ring, increase the product yield and enhance market competitiveness.

[0040] It can be understood that in order to reduce the risk of laser burning through the core copper layer 122 of the third core layer 12, it is necessary to appropriately increase the thickness of the core copper layer 122 at the bottom of the blind groove 20. In an embodiment of the present invention, the thickness of the core copper layer 122 at the bottom of the blind groove 20 is greater than 35 microns.

[0041] A method for manufacturing a crimping hole ring includes a PCB board with a crimping hole ring according to the first aspect, and comprises the following steps:

[0042] Drilling: drilling a through hole 30 on the motherboard 10, wherein the through hole 30 passes through the motherboard 10;

[0043] Mechanical controlled depth milling groove: The through hole 30 on the motherboard 10 is processed by mechanical controlled depth milling to the core board substrate layer 121 area in one of the core board layers 12;

[0044] Laser controlled depth milling: laser milling is used to completely ablate the remaining core board substrate layer 121 of the core board layer 12 that has not been processed by mechanical controlled depth milling.

[0045] Copper electroplating: a layer of copper is plated on the top copper layer 11, the bottom copper layer 13, the blind groove 20 and the through hole 30;

[0046] Alkaline etching: The copper layer on the sidewall and bottom of the blind trench 20 is cleaned by etching.

[0047] Furthermore, in the alkaline etching step, the copper layer at the bottom of the blind groove 20 and around the through hole 30 is retained to form a copper ring 32 .

[0048] It can be understood that in the embodiment of the present invention, when punching the through hole 30 and the motherboard 10, a blind groove 20 is first opened in the area of ​​the through hole 30 by mechanically controlled depth milling, and the depth of the blind groove by mechanically controlled depth milling is opened to the core substrate layer 121 area of ​​the second core layer 12, and then the remaining core substrate layer 121 of the second core layer 12 is ablated by laser controlled depth milling to expose the core substrate layer 121 of the third core layer 12, and then a layer of copper is plated on the top copper layer 11, the bottom copper layer 13, the blind groove 20 and the through hole 30 by copper electroplating to complete the production of the copper base of the hole wall copper layer 31 and the copper ring 32, and the top copper layer 11 and the bottom copper layer 13 are thickened. Finally, in the alkaline etching step, the copper layer on the sidewall and bottom of the blind groove 20 is cleaned by etching, but the copper layer at the bottom of the blind groove 20 located around the through hole 30 is retained to form a copper ring 32, and the thickened top copper layer 11 and bottom copper layer 13 are retained.

[0049] It should be noted that, in the embodiment of the present invention, the above steps are used to achieve the crimping hole ring in the depth controlled groove directly on the specified copper layer, solve the problem of insufficient bonding force of the crimping hole ring in the depth controlled groove, and greatly improve the reliability of the crimping hole ring in the depth controlled groove.

[0050] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A PCB board with a crimping hole ring, characterized in that: include: A motherboard, wherein the motherboard is formed by laminating a top copper layer, a plurality of core board layers and a bottom copper layer stacked in sequence, wherein the core board layer includes a core board substrate layer and a core board copper layer; A blind groove, wherein the blind groove is formed on the motherboard, and the blind groove is grooved to the upper surface of the core board copper layer in one of the core board layers; A plurality of through holes are provided at the bottom of the blind groove, and the through holes penetrate the motherboard from the bottom of the blind groove.

2. The PCB board with crimping hole ring according to claim 1 is characterized in that: The through hole wall is provided with a hole wall copper layer.

3. The PCB board with a crimping hole ring according to claim 2 is characterized in that: A copper ring is arranged around the through hole at one end of the through hole close to the bottom of the blind groove.

4. The PCB board with a crimping hole ring according to claim 3 is characterized in that: The hole wall copper layer is connected to the copper ring.

5. A PCB board with a crimping hole ring according to claim 4, characterized in that: The thickness of the hole wall copper layer, the copper ring, the top copper layer and the bottom copper layer is greater than that of the core board copper layer.

6. A PCB board with a crimping hole ring according to claim 1, characterized in that: The thickness of the core board copper layer at the bottom of the blind groove is greater than 35 microns.

7. A method for making a crimping hole ring, characterized in that: A PCB board with a crimping hole ring according to any one of claims 1 to 6, further comprising: The following steps are involved: Drilling: Drill through holes on the motherboard, and the through holes penetrate the motherboard; Mechanical controlled depth milling groove: the through hole position on the motherboard is processed by mechanical controlled depth milling to the core board substrate layer area in one of the plurality of core board layers; Laser controlled depth milling: laser milling is used to completely ablate the remaining core board substrate layer where the mechanical controlled depth milling has not yet completed the core board layer; Copper electroplating: a layer of copper is plated on the top copper layer, bottom copper layer, blind slot and through hole; Alkaline etching: Clean the copper layer on the sidewalls and bottom of the blind trench by etching.

8. A method for manufacturing a crimping hole ring according to claim 7, characterized in that: In the alkaline etching step, the copper layer at the bottom of the blind trench and the periphery of the through hole is retained to form a copper ring.

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