PCB production line

Abstract

The invention discloses a PCB (printed circuit board) production line, which comprises a pressing mechanism, a drilling mechanism, a hole metallization mechanism, an outer layer circuit manufacturing mechanism, an outer layer coating and printing mechanism and a detection and packaging mechanism, and further comprises a negative pressure adsorption mechanism used for deoiling and cleaning a substrate, and the negative pressure adsorption mechanism comprises a belt conveyor used for conveying the substrate, the base frame is arranged at the position close to the belt conveyor, a mechanical arm is installed outside the belt conveyor, and the two ends of the middle of the base frame are each provided with a semicircular sealing cover used for covering the base plate. The negative pressure adsorption mechanism is arranged in the inner layer circuit manufacturing step of the PCB production line, oil stains in a substrate can seep out in the mode that two semi-circular body sealing covers which are mutually closed are matched with air exhaust to generate negative pressure, then rotating soft bristles and a sponge body are used for cleaning dust and adsorbing the oil stains, and therefore the service life of the circuit board is prolonged, and the service life of the circuit board is prolonged. The surface of the substrate can be ensured to be clean and tidy, and the overall quality of the PCB is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board production, in particular to a PCB board production line. Background Art

[0002] PCB is a board that forms electrical connections between electronic components by patterning conductive copper foil on the surface of insulating materials (such as glass fiber, epoxy resin, etc.). It is an indispensable and important component in modern electronic devices. It is mainly composed of substrate, copper foil, pad, solder mask and silk screen layer. PCB is mainly used to provide electrical connections, support components, and optimize spatial layout. It is widely used in various electronic devices, such as communication equipment, medical equipment, industrial control and automation, automotive electronics, home appliances, computers and servers, and Internet of Things devices.

[0003] A PCB board production line refers to a series of orderly arranged production equipment and process steps. Through automated and semi-automated methods, the designed circuit pattern is transferred to an insulating substrate to form a circuit board with conductive function. The production line is not only responsible for the manufacture of PCB boards, but also undertakes subsequent processes such as quality inspection and packaging to ensure the quality and performance of the final product. Existing PCB board production lines generally consist of inner layer circuit production, lamination, drilling, hole metallization, outer layer circuit production, outer layer protection, and final inspection and packaging steps. In the inner layer circuit production step, there is generally a lack of a process for degreasing and cleaning the substrate, which cannot ensure that the substrate surface is clean and tidy, and is likely to reduce the overall quality of the PCB board. For this reason, a PCB board production line is provided. Summary of the invention

[0004] The object of the present invention is to provide a PCB board production line to solve the problem raised in the above-mentioned background technology that in the inner layer circuit production step, there is generally a lack of a process for degreasing and cleaning the substrate, which cannot ensure that the board surface of the substrate is clean and tidy, and easily reduces the overall quality of the PCB board.

[0005] To achieve the above object, the specific technical scheme of the present invention is as follows: A PCB board production line, including a pressing mechanism, a drilling mechanism, a hole metallization mechanism, an outer layer circuit making mechanism, an outer layer coating and printing mechanism, and a detection and packaging mechanism, and also includes: A negative pressure adsorption mechanism for degreasing and cleaning a substrate, the negative pressure adsorption mechanism comprising a belt conveyor for conveying the substrate, and a base frame arranged near the belt conveyor, a mechanical arm is installed on the outside of the belt conveyor, and semicircular covers for covering the substrate are arranged at both ends of the middle of the base frame.

[0006] Preferably, the base frame is designed in a U-shaped structure, a threaded sleeve is fixedly provided in the middle of the upper surface of the semicircular cover, a threaded rod is provided in the middle of the threaded sleeve through threaded engagement, the upper end of the threaded rod passes through the base frame and extends to the top of the base frame, the threaded rod and the base frame are rotatably arranged through bearings, the end of the threaded rod is elastically provided with a rubber plug through an extrusion spring, guide rods are fixedly provided on both sides of the upper surface of the semicircular cover, and the guide rods are slidably arranged with the base frame.

[0007] Preferably, a rubber ring is fixedly provided in the middle of the bottom end of the semicircular cover, a cross bar is rotatably provided in the middle of the semicircular cover, rubber rings are provided on the inner walls at both ends of the cross bar, a gear is fixedly provided in the middle of one end of the cross bar, the two gears have the same structure, and the two gears are meshed for transmission, and the other end of one of the cross bars is connected and assembled to the output end of the external second driving member through a coupling.

[0008] Preferably, a first semicircular cover is fixedly provided on one side of the outer surface of the middle part of the cross bar, and a second semicircular cover is fixedly provided on one side of the outer surface of the middle part of the cross bar, the outer surface of the first semicircular cover is provided with a sponge for absorbing oil stains on the surface of the substrate, and the outer surface of the second semicircular cover is provided with soft bristles for cleaning dust particles on the surface of the substrate, and the outer surface of one of the semicircular covers is provided with an air suction pipe, and the end of the air suction pipe is connected to the air inlet end of an external vacuum pump.

[0009] Preferably, the negative pressure adsorption mechanism also includes an axis frame fixedly arranged in the middle of one side of the outer surface of the base frame, and a driving shaft is rotatably arranged in the middle of the axis frame through a bearing. The outer end of the driving shaft is connected and assembled with the output end of the external first driving member through a coupling, and the driving shaft and the threaded rod are transmitted through a belt drive assembly.

[0010] Preferably, the negative pressure adsorption mechanism also includes a rotary feeding mechanism for conveying the substrate, the rotary feeding mechanism includes a driving rod, the driving rod and the base frame are rotatably arranged through a bearing, the outer end of the driving rod is connected and assembled with the output end of the external driving member through a coupling, a plurality of support rods arranged in a ring shape with equal intervals are fixedly arranged on the outer surface of the middle part of the driving rod, a PCB board support for supporting the substrate is fixedly arranged in the middle part of the end of the support rod, a slope is provided on the inner surface of the PCB board support, a plate support for supporting the substrate is provided on the lower surface of the PCB board support, and the plate support and the PCB board support are integrally formed.

[0011] Preferably, the rotary feeding mechanism also includes an external time relay and a central processing unit, the time relay is used to control the intermittent rotation of the first drive member, the second drive member and the third drive member, the central processing unit is used to receive and send electrical signals, and the time relay, the central processing unit, the first drive member, the second drive member and the third drive member are electrically connected.

[0012] Compared with the prior art, the present invention has the following beneficial effects: The present invention arranges a negative pressure adsorption mechanism in the inner layer circuit manufacturing step of a PCB board production line, utilizes two mutually closed semicircular covers, and cooperates with the method of vacuuming to generate negative pressure, so that oil stains in a substrate can seep out, and then utilizes rotating soft bristles and a sponge body to clean dust and adsorb oil stains, thereby ensuring that the board surface of the substrate is clean and tidy, and improving the overall quality of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the negative pressure adsorption mechanism of the present invention; Figure 3 It is a structural schematic diagram of the rotary feeding mechanism of the present invention; Figure 4 It is a partial side sectional view of the semicircular cover of the present invention; Figure 5 Schematic diagram of the PCB support structure of the present invention Figure 1 ; Figure 6 Schematic diagram of the PCB support structure of the present invention Figure 2 .

[0014] In the figure: 100, belt conveyor; 200, pressing mechanism; 300, drilling mechanism; 400, hole metallization mechanism; 500, outer layer circuit making mechanism; 600, outer layer coating printing mechanism; 700, detection and packaging mechanism; 800, negative pressure adsorption mechanism; 801, base frame; 802, first driving member; 803, belt transmission assembly; 804, semicircular cover; 805, driving shaft; 806, shaft frame; 807, extrusion spring; 808, rubber plug; 809, thread Sleeve; 810, guide rod; 811, threaded rod; 812, gear; 813, first semicircular body sleeve; 814, second semicircular body sleeve; 815, soft bristles; 816, rubber ring; 817, second driving member; 818, cross bar; 819, suction pipe; 820, sponge; 821, rubber ring; 900, rotary feeding mechanism; 901, third driving member; 902, driving rod; 903, support rod; 904, PCB board support; 905, ramp; 906, board support. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] See also Figure 1-Figure 6 The present invention provides a technical solution: a PCB board production line, including a pressing mechanism 200, a drilling mechanism 300, a hole metallization mechanism 400, an outer layer circuit making mechanism 500, an outer layer coating printing mechanism 600 and a detection packaging mechanism 700, the pressing mechanism 200 is used for browning, laminating, pressing, shooting, gong edge, and edge grinding of the substrate, the drilling mechanism 300 is used for drilling and deburring the substrate, the hole metallization mechanism 400 is used for depositing a thin chemical copper layer on the insulating hole wall as a base conductive layer for subsequent electroplating of copper, the outer layer circuit making mechanism 500 is used for electroplating copper on the circuit pattern after exposure and development, thickening the circuit, and removing dry The film is used to etch away the unprotected copper layer, and the tin layer is peeled off to form the final outer layer circuit. The outer layer coating printing mechanism 600 is used to coat a layer of photosensitive solder mask ink on the board, and a solder mask layer is formed by exposure and development to protect the circuit from being soldered, and is used to print text and mark symbols on the board to facilitate subsequent assembly and maintenance. The inspection and packaging mechanism 700 is used to ensure the quality of the PCB board, which includes AOI inspection, flying probe test, etc. to ensure that there are no defects such as short circuit and open circuit, and is used to vacuum-pack the qualified PCB boards for shipment and delivery. As a prior art, it is not described here. The equipment also includes: a negative pressure adsorption mechanism 800 for degreasing and cleaning the substrate.

[0017] Specifically, the negative pressure adsorption mechanism 800 includes a belt conveyor 100 for conveying substrates, and a base frame 801 arranged near the belt conveyor 100. The base frame 801 is designed in a U-shaped structure. A mechanical arm is installed on the outside of the belt conveyor 100 for grabbing and placing the substrates. Both ends of the middle part of the base frame 801 are provided with semicircular covers 804 for covering the substrates. A threaded sleeve 809 is fixedly provided in the middle of the upper surface of the semicircular cover 804. A threaded rod 811 is provided in the middle of the threaded sleeve 809 through threaded engagement, which is used to cooperate with the threaded sleeve 809 to lift the semicircular cover 804. The upper surface of the threaded rod 811 is provided with a threaded sleeve 809. The end passes through the base frame 801 and extends to the top of the base frame 801. The threaded rod 811 and the base frame 801 are rotatably arranged through the bearing. The end of the threaded rod 811 is elastically provided with a rubber plug 808 through an extrusion spring 807. Guide rods 810 are fixedly arranged on both sides of the upper surface of the semicircular cover 804 for positioning the semicircular cover 804 during lifting. The guide rod 810 and the base frame 801 are slidably arranged. A rubber ring 816 is fixedly arranged in the middle of the bottom end of the semicircular cover 804 for increasing the sealing of the joint. A cross bar 818 is rotatably arranged in the middle of the semicircular cover 804. Rubber rings 821 are arranged on the inner walls of both ends of the cross bar 818. The cross bar 818 is A gear 812 is fixedly provided in the middle of the end, and the two gears 812 have the same structure, and the two gears 812 are meshed for transmission. The other end of one of the cross bars 818 is connected and assembled with the output end of the external second driving member 817 through a coupling. A first semicircular sleeve 813 is fixedly provided on one side of the outer surface of the middle part of the cross bar 818, and a second semicircular sleeve 814 is fixedly provided on one side of the outer surface of the middle part of the cross bar 818. The outer surface of the first semicircular sleeve 813 is provided with a sponge 820 for absorbing oil stains on the surface of the substrate, and the outer surface of the second semicircular sleeve 814 is provided with soft bristles 815 for cleaning dust particles on the surface of the substrate. One of the semicircular cover The outer surface of 804 is provided with an air suction pipe 819, and the end of the air suction pipe 819 is connected to the air inlet end of an external vacuum pump. When in use, when the two semicircular covers 804 are merged with each other, the second driving member 817 during operation will drive the cross bar 818 to rotate, and the two cross bars 818 can be synchronously rotated in opposite directions by means of the two gears 812. The substrate is first cleaned by the soft bristles 815, and then the oil stains are adsorbed by the sponge 820. During this period, the air inside the semicircular cover 804 can be extracted by the external vacuum pump in cooperation with the air suction pipe 819 to form a negative pressure, so that the oil inside the substrate can seep out for easy adsorption.

[0018] Furthermore, the negative pressure adsorption mechanism 800 also includes a shaft frame 806 fixedly arranged in the middle of one side of the outer surface of the base frame 801, and a driving shaft 805 is rotatably arranged in the middle of the shaft frame 806 through a bearing, and the outer end of the driving shaft 805 is connected and assembled with the output end of the external first driving member 802 through a coupling, and the driving shaft 805 and the threaded rod 811 are transmitted through a belt transmission assembly 803, and the first driving member 802 is electrically connected to an external frequency converter for controlling the forward and reverse rotation of the output shaft of the first driving member 802. Further, the negative pressure adsorption mechanism 800 also includes a rotating feeding mechanism 900 for conveying the substrate. Specifically, the rotating feeding mechanism 900 includes a driving rod 902, and the driving rod 902 is rotatably arranged with the base frame 801 through a bearing, and the outer end of the driving rod 902 is connected and assembled with the output end of the external driving member through a coupling, and the outer surface of the middle of the driving rod 902 is fixedly arranged There are multiple support rods 903 arranged in a ring shape with equal intervals. A PCB board support 904 for supporting the substrate is fixedly arranged in the middle of the end of the support rod 903. The substrate is placed inside the PCB board support 904. The inner surface of the PCB board support 904 is provided with a slope 905 for centering the PCB board support 904. The lower surface of the PCB board support 904 is provided with a plate support 906 for supporting the substrate. The plate support 906 and the PCB board support 904 are integrally formed. The rotary feeding mechanism 900 also includes an external time relay and a central processing unit. The time relay is used to control the intermittent rotation of the first drive member 802, the second drive member 817 and the third drive member 901. The central processing unit is used to receive and send electrical signals. The time relay, the central processing unit, the first drive member 802, the second drive member 817, and the third drive member 901 are electrically connected.

[0019] According to the above, the present invention sets a negative pressure adsorption mechanism 800 in the inner layer circuit manufacturing step of the PCB board production line, utilizes two semicircular covers 804 closed to each other, and cooperates with the method of vacuuming to generate negative pressure, so that the oil stains in the substrate can seep out, and then utilizes the rotating soft bristles 815 and the sponge 820 to clean the dust and absorb the oil stains, which can ensure that the board surface of the substrate is clean and tidy, and improve the overall quality of the PCB board.

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A PCB production line, comprising a pressing mechanism (200), a drilling mechanism (300), a hole metallization mechanism (400), an outer layer circuit making mechanism (500), an outer layer coating and printing mechanism (600), and a detection and packaging mechanism (700), characterized in that: Also includes: A negative pressure adsorption mechanism (800) for degreasing and cleaning a substrate, the negative pressure adsorption mechanism (800) comprising a belt conveyor (100) for conveying the substrate, and a base frame (801) arranged near the belt conveyor (100), a mechanical arm being installed outside the belt conveyor (100), and semicircular covers (804) for covering the substrate being arranged at both ends of the middle of the base frame (801).

2. A PCB board production line according to claim 1, characterized in that: The base frame (801) is designed in a U-shaped structure. A threaded sleeve (809) is fixedly provided in the middle of the upper surface of the semicircular cover (804). A threaded rod (811) is provided in the middle of the threaded sleeve (809) through threaded engagement. The upper end of the threaded rod (811) passes through the base frame (801) and extends to the top of the base frame (801). The threaded rod (811) and the base frame (801) are rotatably provided via a bearing. A rubber plug (808) is elastically provided at the end of the threaded rod (811) via an extrusion spring (807). Guide rods (810) are fixedly provided on both sides of the upper surface of the semicircular cover (804). The guide rods (810) and the base frame (801) are slidably provided.

3. A PCB board production line according to claim 1, characterized in that: A rubber ring (816) is fixedly arranged in the middle of the bottom end of the semicircular cover (804), a cross bar (818) is rotatably arranged in the middle of the semicircular cover (804), inner walls at both ends of the cross bar (818) are provided with rubber rings (821), a gear (812) is fixedly arranged in the middle of one end of the cross bar (818), the two gears (812) have the same structure, and the two gears (812) are meshed for transmission, and the other end of one of the cross bars (818) is connected and assembled with the output end of the external second driving member (817) through a coupling.

4. A PCB board production line according to claim 3, characterized in that: A first semicircular sleeve (813) is fixedly provided on one side of the outer surface of the middle part of the cross bar (818), and a second semicircular sleeve (814) is fixedly provided on one side of the outer surface of the middle part of the cross bar (818), the outer surface of the first semicircular sleeve (813) is provided with a sponge (820) for absorbing oil stains on the surface of the substrate, and the outer surface of the second semicircular sleeve (814) is provided with soft bristles (815) for cleaning dust particles on the surface of the substrate, and the outer surface of one of the semicircular covers (804) is provided with an air suction pipe (819), and the end of the air suction pipe (819) is connected to the air inlet end of an external vacuum pump.

5. A PCB board production line according to claim 1, characterized in that: The negative pressure adsorption mechanism (800) further comprises an axis frame (806) fixedly arranged in the middle of one side of the outer surface of the base frame (801), a driving shaft (805) being rotatably arranged in the middle of the axis frame (806) via a bearing, an outer end of the driving shaft (805) being connected and assembled with an output end of an external first driving member (802) via a coupling, and transmission is transmitted between the driving shaft (805) and the threaded rod (811) via a belt transmission assembly (803).

6. A PCB board production line according to claim 1, characterized in that: The negative pressure adsorption mechanism (800) further comprises a rotary feeding mechanism (900) for conveying the substrate, the rotary feeding mechanism (900) comprising a driving rod (902), the driving rod (902) and the base frame (801) being rotatably arranged via a bearing, the outer end of the driving rod (902) being connected and assembled with the output end of the external driving member via a coupling, a plurality of support rods (903) being fixedly arranged at equal intervals in a ring shape on the outer surface of the middle part of the driving rod (902), a PCB board support (904) for carrying the substrate being fixedly arranged at the middle part of the end of the support rod (903), a slope (905) being provided on the inner surface of the PCB board support (904), a plate support (906) for supporting the substrate being provided on the lower surface of the PCB board support (904), and the plate support (906) and the PCB board support (904) being integrally formed.

7. A PCB board production line according to claim 6, characterized in that: The rotary feeding mechanism (900) further comprises an external time relay and a central processing unit, wherein the time relay is used to control the intermittent rotation of the first driving member (802), the second driving member (817) and the third driving member (901), and the central processing unit is used to receive and send electrical signals, and the time relay, the central processing unit, the first driving member (802), the second driving member (817) and the third driving member (901) are electrically connected.

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