Laminated frame and manufacturing method thereof

Abstract

The invention relates to a laminated frame and a manufacturing method thereof, and the manufacturing method comprises the steps: providing a first frame layer which comprises an upper surface and a lower surface which are opposite, and the first frame layer is provided with a plurality of discrete alignment holes which penetrate through the upper surface and the lower surface; a second frame layer is provided, the thickness of the second frame layer is smaller than that of the first frame layer, the second frame layer is transparent, the second frame layer comprises an upper surface and a lower surface which are opposite, a plurality of discrete alignment blocks are arranged on the upper surface and the lower surface of the second frame layer or in the second frame layer, and the alignment blocks are non-transparent; the lower surface of the second frame layer is pressed on the upper surface of the first frame layer to form the laminated frame, the alignment blocks are located above the corresponding alignment holes, and the alignment blocks are used as alignment marks when the laminated frame is cut along the upper surface of the second frame layer or the lower surface of the first frame layer. The recognition precision of the alignment mark is improved, and the risk of cutting deviation during cutting is prevented.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging, and in particular to a laminate frame and a manufacturing method thereof. Background Art

[0002] Ultrasonic transducers are used to convert electrical energy into ultrasonic energy, or vice versa. Their working principle is to convert high-frequency electrical signals into mechanical vibrations through the piezoelectric effect of piezoelectric ceramics, thereby generating ultrasonic waves. Ultrasonic transducers are widely used in medical, industrial, and communications fields. In the medical field, ultrasonic transducers are often used in ultrasonic medical imaging equipment to generate ultrasonic images for diagnosis. In the industrial field, ultrasonic transducers are used in ultrasonic cleaning, welding, cutting and other processes. In the field of communications, ultrasonic transducers are used in ultrasonic sensors to detect distance, liquid level and other information.

[0003] Ultrasonic transducers are applied to laminated frames during the packaging process to meet the specific functional requirements of ultrasonic transducers. The existing laminated frames usually include a PCB layer and a conductive thin layer located on the PCB layer. The PCB layer is thick and non-conductive. As the main body of the frame, the conductive thin layer is thin. Metal wires are sandwiched in the conductive thin layer to be responsible for electrical connection. The existing laminated frame is formed by laminating the conductive thin layer on the surface of the PCB layer. After the laminated frame is formed, a stamping process is required to form a number of alignment holes in the laminated frame. The alignment holes are used as alignment marks during cutting so that the cutting equipment can obtain the position information of the area to be cut. Due to the insufficient rigidity of the laminated frame, when the alignment holes are formed by the stamping process, deformation will occur around the alignment holes. The centers of the alignment holes are not in a straight line, and burrs are easily generated on the hole walls of the alignment holes, which reduces the position accuracy of the alignment holes and makes the grayscale difference between the alignment holes and the laminated frame smaller. Therefore, the cutting machine cannot accurately and effectively identify the alignment holes, which reduces the recognition accuracy of the alignment holes and thus there is a risk of cutting deviation. Summary of the invention

[0004] The technical problem to be solved by the present application is to provide a laminated frame and a method for manufacturing the same, so as to prevent defects such as deformation and burrs of the alignment mark, improve the recognition accuracy of the alignment mark, and prevent the risk of off-cutting during cutting.

[0005] To this end, an embodiment of the present application provides a method for manufacturing a laminated frame, comprising: Providing a first frame layer, the first frame layer comprising an upper surface and a lower surface opposite to each other, the first frame layer having a plurality of discrete alignment holes penetrating the upper surface and the lower surface of the first frame layer; Providing a second frame layer, wherein the thickness of the second frame layer is less than that of the first frame layer, and the second frame layer is transparent, the second frame layer comprises an upper surface and a lower surface opposite to each other, and the upper surface, the lower surface or the second frame layer of the second frame layer has a plurality of discrete alignment blocks, the alignment blocks are opaque, and the positions of the alignment blocks correspond to the positions of the alignment holes; The lower surface of the second frame layer is pressed onto the upper surface of the first frame layer to form a laminated frame. The alignment block is located above the corresponding alignment hole. The alignment block is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer or the lower surface of the first frame layer.

[0006] In an optional embodiment, the first frame layer and the second frame layer both include a middle area and an edge area surrounding the middle area, the alignment hole is located in the edge area of ​​the first frame layer, and the alignment block is located in the edge area of ​​the second frame layer.

[0007] In an optional embodiment, it also includes: forming a first positioning hole in the edge area of ​​the first frame layer and penetrating the upper surface and the lower surface of the edge area; forming a second positioning hole in the edge area of ​​the second frame layer and penetrating the upper surface and the lower surface of the edge area, the positions of the second positioning hole and the first positioning hole correspond to each other, and when the pressing is performed, the second positioning hole in the second frame layer is located directly above the first positioning hole in the first frame layer.

[0008] In an optional embodiment, the alignment hole, the first positioning hole and the second positioning hole are formed by a stamping process or an etching process.

[0009] In an optional embodiment, the material of the first frame layer is an opaque PCB substrate material, and the material of the second frame layer is a transparent epoxy resin, polyethylene resin or polypropylene resin.

[0010] In an optional embodiment, the alignment block is made of an opaque metal material.

[0011] In an optional embodiment, when the alignment block is located on the upper surface or the lower surface of the second frame layer, the alignment block is formed by an electroplating process.

[0012] In an optional embodiment, a conductive metal wire is sandwiched in the second frame layer. While the conductive metal wire is sandwiched in the second frame layer, the alignment block is sandwiched in the second frame layer, and the thickness of the alignment block is the same as the thickness of the conductive metal wire.

[0013] In an optional embodiment, the main area of ​​the first frame layer includes a supporting body and a first hollow area located in or around the supporting body, the cutting path of the first frame layer includes a connecting rib and a second hollow area, and the connecting rib connects adjacent supporting bodies; a semiconductor chip is mounted on the lower surface of the supporting body of the first frame layer of the laminated frame, and a conductive metal wire in the second frame layer passes through the first hollow area to be electrically connected to the semiconductor chip.

[0014] In an optional embodiment, when cutting, the cutting equipment identifies the alignment block as an alignment mark from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer, and obtains the position of the cutting path based on the alignment mark; after obtaining the position of the cutting path, the laminated frame is cut along the cutting path from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer to obtain a number of discrete packaging structures.

[0015] Another embodiment of the present application further provides a laminated frame, comprising: A first frame layer, the first frame layer comprising an upper surface and a lower surface opposite to each other, the first frame layer having a plurality of discrete alignment holes penetrating the upper surface and the lower surface of the first frame layer; A second frame layer, wherein the thickness of the second frame layer is less than that of the first frame layer, and the second frame layer is transparent, the second frame layer comprises an upper surface and a lower surface opposite to each other, and the upper surface, the lower surface or the second frame layer of the second frame layer comprises a plurality of discrete alignment blocks, the alignment blocks are opaque, and the positions of the alignment blocks correspond to the positions of the alignment holes; The lower surface of the second frame layer is pressed onto the upper surface of the first frame layer, and the alignment block is located above the corresponding alignment hole. The alignment block is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer or the lower surface of the first frame layer.

[0016] In an optional embodiment, the first frame layer and the second frame layer both include a middle area and an edge area surrounding the middle area, the alignment hole is located in the edge area of ​​the first frame layer, and the alignment block is located in the edge area of ​​the second frame layer.

[0017] In an optional embodiment, it also includes: a first positioning hole located in the edge area of ​​the first frame layer and penetrating the upper surface and the lower surface of the edge area; a second positioning hole located in the edge area of ​​the second frame layer and penetrating the upper surface and the lower surface of the edge area, and the second positioning hole in the second frame layer is located directly above the first positioning hole in the first frame layer.

[0018] In an optional embodiment, the material of the first frame layer is an opaque PCB substrate material, the material of the second frame layer is a transparent epoxy resin, polyethylene resin or polypropylene resin; and the material of the alignment block is an opaque metal material.

[0019] In an optional embodiment, a conductive metal wire is sandwiched in the second frame layer, and the alignment block is sandwiched in the second frame layer, and the thickness of the alignment block is the same as the thickness of the conductive metal wire.

[0020] In an optional embodiment, the middle area of ​​the first frame layer and the second frame layer each includes a plurality of discrete main body areas and cutting paths located between the main body areas, the main body area of ​​the first frame layer includes a supporting body and a first hollow area located in or around the supporting body, the cutting paths of the first frame layer include connecting ribs and a second hollow area, and the connecting ribs connect adjacent supporting bodies; and also include: a semiconductor chip mounted on the lower surface of the supporting body of the first frame layer of the laminated frame, and a conductive metal wire in the second frame layer passes through the first hollow area to be electrically connected to the semiconductor chip.

[0021] In an optional embodiment, the cutting device identifies the alignment block as an alignment mark from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer, and obtains the position of the cutting path based on the alignment mark.

[0022] In an optional embodiment, the semiconductor chip includes an ultrasonic transducer.

[0023] The advantages of the technical solution of this application are: The laminated frame and its manufacturing method mentioned above in the present application, in one embodiment, the manufacturing method includes: providing a first frame layer, the first frame layer includes relative upper and lower surfaces, and the first frame layer has a plurality of discrete alignment holes that penetrate the upper and lower surfaces of the first frame layer; providing a second frame layer, the thickness of the second frame layer is less than the thickness of the first frame layer, and the second frame layer is transparent, the second frame layer includes relative upper and lower surfaces, the upper surface, the lower surface or the second frame layer of the second frame layer has a plurality of discrete alignment blocks, the alignment blocks are opaque, and the positions of the alignment blocks correspond to the positions of the alignment holes; pressing the lower surface of the second frame layer onto the upper surface of the first frame layer to form a laminated frame, the alignment blocks are located above the corresponding alignment holes, and the alignment blocks are used as alignment marks when cutting the laminated frame along the upper surface of the second frame layer or the lower surface of the first frame layer. The aforementioned manufacturing method of the present application, firstly, since the alignment holes in the first frame layer and the upper surface, lower surface or alignment blocks in the second frame layer can be completed by independent processes, the formed positioning holes and alignment blocks can have higher position accuracy and better side wall morphology, especially when the alignment blocks are formed by the electroplating process, the position accuracy of the formed alignment blocks can be higher and the side wall morphology can be better. Therefore, when the alignment blocks are used as alignment marks, deformation, burrs and the problem that the centers of the alignment marks are no longer in a straight line can be prevented, thereby improving the position accuracy of the alignment marks and enabling the alignment marks to maintain better side wall morphology. In addition, the second frame layer is thinner, the thickness of the second frame layer is smaller than the thickness of the first frame layer, and the second frame layer is transparent, and the alignment block and the first frame layer are opaque. Therefore, after the second frame layer is pressed onto the upper surface of the first frame layer to form a laminated frame, when the alignment mark is detected and identified before cutting (optical detection), the alignment block in the obtained detection image has a larger grayscale difference relative to the second frame layer (or the grayscale of the alignment block in the detection image can be improved), and the alignment hole also has a larger grayscale difference relative to the second frame layer, thereby improving the accuracy of detection and identification of the alignment mark. Furthermore, since the alignment holes in the first frame layer can expose the transparent second frame layer and the corresponding alignment blocks, when cutting from the direction of the upper surface of the second frame layer, the detection light of the cutting machine can detect the upper surface, lower surface or the alignment blocks in the transparent second frame layer from the direction of the upper surface of the second frame layer as alignment marks; when cutting from the direction of the lower surface of the first frame layer, the detection light of the cutting machine can pass through the alignment holes from the direction of the lower surface of the first frame layer to detect the upper surface, lower surface or the alignment blocks in the transparent second frame layer as alignment marks, thereby satisfying the requirement of cutting the laminated frame from different surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1-Figure 12 It is a structural schematic diagram of the formation process of the laminated frame in some embodiments of the present application. DETAILED DESCRIPTION

[0025] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present application in detail, for the sake of convenience, the schematic diagrams will not be partially enlarged according to the general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0026] In the specific implementation manner of the present application, a method for manufacturing a laminated frame is first provided, and the manufacturing direction is described in detail below with reference to the accompanying drawings.

[0027] refer to Figure 1 and Figure 2 ,in Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along the cutting line AB direction provides a first frame layer 101, wherein the first frame layer 101 includes an upper surface and a lower surface relative to each other, and the first frame layer 101 has a plurality of discrete alignment holes 104 penetrating the upper surface and the lower surface of the first frame layer.

[0028] The first frame layer 101 is used as one of the layers in the laminated frame formed subsequently and as the main structure of the laminated frame. The first frame layer 101 is non-conductive and opaque. In one embodiment, the material of the first frame layer 101 is a PCB substrate material. In a specific embodiment, the PCB substrate material can be a phenolic paper-based material (an insulating laminated material with phenolic resin as a binder and wood pulp fiber paper as a reinforcing material), or an epoxy glass fiber cloth-based material (a type of board with epoxy resin as a binder and electronic grade glass fiber cloth as a reinforcing material), polyimide (PI), fluoroplastic (PTFE), or ceramic material.

[0029] The first frame layer 101 has a plurality of separate alignment holes 104 that penetrate the upper surface and the lower surface of the first frame layer. Figure 7 , Figure 8 or Fig. 9) After being pressed onto the upper surface of the first frame layer 101, the alignment hole 104 in the first frame layer 101 can expose the second frame layer 201 and the alignment block 204 located on the upper surface, lower surface or in the second frame layer 201, so that when cutting is performed along the lower surface direction of the first frame layer 101, the detection light of the cutting equipment passing through the alignment hole 104 can identify the alignment block 204 as an alignment mark, and the alignment mark is used to identify the cutting position before or during cutting.

[0030] In one embodiment, each alignment mark may include a plurality of adjacent alignment blocks 204 , and the number of the corresponding alignment holes 104 is multiple, specifically, two, three, four or more than four.

[0031] In one embodiment, the first frame layer 101 includes a middle area 12 and an edge area 11 surrounding the middle area 12, and the alignment holes 104 are located in the edge area 11 of the first frame layer 101, so that the alignment holes 104 do not occupy the area of ​​the middle area 12 of the first frame layer 101, and are conducive to the layout of the alignment holes 104.

[0032] In one embodiment, the middle region 12 of the first frame layer 101 includes a plurality of separate main body regions 13 and cutting paths between the main body regions 13, and the second frame layer 201 (refer to Figure 7 , Figure 8 or Fig. 9 ) also includes a plurality of discrete main areas 202 and cutting roads 203 located between the main areas 202. After the second frame layer 201 is subsequently pressed onto the upper surface of the first frame layer 101, the main area 13 in the first frame layer 101 corresponds to the main area 202 in the second frame layer 201 (correspondence means that the main area 13 in the first frame layer 101 and the main area 202 in the second frame layer 201 are the same in size and shape, and the main area 13 in the first frame layer 101 is located directly below the main area 202 in the second frame layer 201), and the cutting roads in the first frame layer 101 correspond to the cutting roads 203 in the second frame layer 201 (correspondence means that the cutting roads in the first frame layer 101 and the cutting roads 203 in the second frame layer 201 are the same in size and shape, and the cutting roads in the first frame layer 101 are located directly below the cutting roads 203 in the second frame layer 201). Subsequently, a semiconductor chip is mounted on the lower surface of the main area 13 of the first frame layer 101 in the formed laminated frame; after mounting the semiconductor chip, the laminated frame can be divided along the cutting path 203 of the second frame layer 201 and the cutting path of the first frame layer 101 to form a number of discrete packaging structures, thereby improving the formation efficiency of the packaging structure.

[0033] In one embodiment, continue to refer to Figure 1 , the main area 13 of the first frame layer 101 includes a support body 102 and a first hollow area 112 located in or around the support body 102. In a specific embodiment, the support body 102 is in the shape of an "I". The cutting path of the first frame layer 101 includes a connecting rib 103 and a second hollow area 111, and the connecting rib 103 connects adjacent support bodies 102. After the layer frame is subsequently formed, a semiconductor chip is mounted on the lower surface of the support body 102 of the first frame layer 101 of the laminated frame. The main area 13 of the first frame layer 101 has a support body 102 and a first hollow area 112. It should be noted that in other embodiments, the support body 102 and the first hollow area 112 of the main area 13 of the first frame layer 101 can be other shapes.

[0034] In one embodiment, continue to refer to Figure 1 , further comprising: forming a first positioning hole 105 in the edge region 11 of the first frame layer 101, which penetrates the upper surface and the lower surface of the edge region 11, and the first positioning hole 105 is connected to the subsequent second frame layer 201 (reference Figure 3 ) is formed in the edge area 21 of the first frame layer 101 (when pressing, the second positioning hole 205 in the second frame layer 201 is located directly above the first positioning hole 105 in the first frame layer 101) to improve the position accuracy of the second frame layer 201 when pressing on the upper surface of the first frame layer 101. In a specific embodiment, the alignment hole 104 and the first positioning hole 105 can be formed by a stamping process or an etching process, and the etching process can include a chemical etching process or a laser etching process.

[0035] Next reference Figure 3 and Figure 4 ,in Figure 4 for Figure 3 A schematic cross-sectional structure diagram along the cutting line AB direction provides a second frame layer 201, and the thickness of the second frame layer 201 is less than that of the first frame layer 101 (refer to Figure 1 and Figure 2 ) thickness, and the second frame layer 201 is transparent, the second frame layer 201 includes an upper surface and a lower surface relative to each other, the upper surface of the second frame layer 201 has a plurality of discrete alignment blocks 204, the alignment blocks 204 are opaque, and the positions of the alignment blocks 204 are aligned with the alignment holes 104 (reference Figure 1 and Figure 2 ) position.

[0036] The second frame layer 201 is subsequently used as a part of the lamination frame, and the second frame layer 201 is used as an electrical connection layer of the lamination frame. In one embodiment, the second frame layer 201 is sandwiched with a conductive metal wire (not shown in the figure), and the conductive metal wire is used to electrically connect with the semiconductor chip mounted on the subsequent lamination frame. In a specific embodiment, the material of the conductive metal wire is one or more of copper, nickel, gold and silver.

[0037] In the present application, since the positioning holes 104 in the first frame layer 101 and the upper surface, lower surface or alignment blocks 204 in the second frame layer 201 are completed through independent processes, the formed positioning holes 104 and alignment blocks 204 can have higher positioning accuracy and better side wall morphology. In particular, when the alignment blocks 204 are formed through an electroplating process, the formed alignment blocks 204 can have higher positioning accuracy and better side wall morphology. Therefore, when the alignment blocks 204 are used as alignment marks, deformation, burrs and the problem that the centers of the alignment marks are no longer in a straight line can be prevented, thereby improving the positioning accuracy of the alignment marks and enabling the alignment marks to maintain better side wall morphology. Furthermore, the thickness of the second frame layer 201 is relatively thin, which is less than the thickness of the first frame layer 101, and the second frame layer 201 is transparent, while the alignment block 204 and the first frame layer 101 are opaque, so that the second frame layer 201 is subsequently pressed onto the upper surface of the first frame layer 101 to form a laminated frame (refer to Figure 7 , Figure 8 or Fig. 9 ), when the alignment mark is detected and identified before cutting (optical detection), the alignment block 204 in the obtained detection image has a larger grayscale difference with respect to the second frame layer 201 (or the grayscale of the alignment block 204 in the detection image can be improved), and the alignment hole 104 also has a larger grayscale difference with respect to the second frame layer 201, thereby improving the accuracy of detection and identification of the alignment mark. Furthermore, after the shelf frame is subsequently formed, since the alignment holes 104 in the first frame layer 101 can expose the transparent second frame layer 201 and the corresponding alignment blocks 204, when cutting from the direction of the upper surface of the second frame layer 201, the detection light of the cutting machine can detect the upper surface, lower surface or the transparent second frame layer 201 The alignment block 204 in the transparent second frame layer is used as an alignment mark from the direction of the upper surface of the second frame layer 201; when cutting from the direction of the lower surface of the first frame layer 101, the detection light of the cutting machine can pass through the alignment holes 104 from the direction of the lower surface of the first frame layer 101 to detect the upper surface, lower surface or the transparent second frame layer The alignment block 204 in the transparent second frame layer is used as an alignment mark, which satisfies the requirement of cutting the laminated frame from different surfaces.

[0038] In one embodiment, the material of the second frame layer 201 is transparent epoxy resin, polyethylene resin or polypropylene resin. The material of the alignment block 204 is an opaque metal material, specifically, one or more of copper tungsten, nickel, gold or silver.

[0039] In one embodiment, the second frame layer 201 includes a middle area 22 and an edge area 21 surrounding the middle area 22 , and the alignment block 204 is located in the edge area 21 of the second frame layer 201 , so that the alignment block 204 does not occupy the area of ​​the middle area 22 , and is conducive to the layout of the alignment block 204 .

[0040] In one embodiment, the alignment block 204 includes a plurality of separate main body areas 202 and cutting paths 203 between the main body areas 202. The main body areas 202 and the cutting paths 203 are both solid areas. After the second frame layer 201 is pressed onto the upper surface of the first frame layer 101 (refer to Figure 7 , Figure 8 or Fig. 9 ), the main area 13 in the first frame layer 101 corresponds to the main area 202 in the second frame layer 201, and the cutting road in the first frame layer 101 corresponds to the cutting road 203 in the second frame layer 201.

[0041] In one embodiment, continue to refer to Figure 3 and Figure 4 A plurality of discrete alignment blocks 204 are formed on the upper surface of the second frame layer 201, and the width of the alignment blocks 204 is smaller than the width of the alignment holes 104. The alignment blocks 204 may be formed by electroplating.

[0042] In another embodiment, reference Figure 3 and Figure 5 ,in Figure 5 for Figure 3 The schematic cross-sectional structure diagram along the cutting line AB shows that a plurality of discrete alignment blocks 204 are formed in the second frame layer 201. The second frame layer material covers the upper and lower surfaces and the side surfaces of the alignment blocks. The width of the alignment blocks 204 is smaller than the width of the alignment holes 104. When a conductive metal wire (not shown in the figure) is sandwiched in the second frame layer 201, the alignment blocks are sandwiched in the second frame layer 201 at the same time as the conductive metal wire. The thickness and material of the alignment blocks 204 are the same as those of the conductive metal wire.

[0043] In another embodiment, reference Figure 3 and Figure 6 ,in Figure 6 for Figure 3The schematic cross-sectional structure diagram along the cutting line AB shows that a plurality of discrete alignment blocks 204 are formed on the lower surface of the second frame layer 201. The length and width of the alignment blocks 204 are smaller than the width of the alignment holes 104 in the first frame layer 101. When the lower surface of the second frame layer 201 is subsequently pressed onto the upper surface of the first frame layer 101, the alignment blocks 204 extend into the corresponding alignment holes 104. The alignment blocks 204 may be formed by electroplating.

[0044] In one embodiment, continue to refer to Figure 3 A second positioning hole 205 is formed in the edge region 21 of the second frame layer 201, penetrating the upper surface and the lower surface of the edge region 21. The second positioning hole 205 and the first positioning hole 105 (reference Figure 1 ), when the pressing is performed, the second positioning hole 205 in the second frame layer 201 is located directly above the first positioning hole 105 in the first frame layer 101, thereby improving the position accuracy when the second frame layer 201 is pressed on the upper surface of the first frame layer 101. In one embodiment, the second positioning hole 205 is formed by a stamping process or an etching process.

[0045] refer to Figure 7 , the lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101 to form a laminated frame, and the alignment block 204 is located above the corresponding alignment hole 104, and the alignment block 204 is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer 201 or the lower surface of the first frame layer 101.

[0046] In one embodiment, when the lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101, an adhesive (not shown in the figure) is formed in advance on the lower surface of the second frame layer 201 or the upper surface of the first frame layer 101, and the lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101 through the adhesive. In one embodiment, the laminated structure may be heated during the pressing process, and may be cooled and solidified after a period of time.

[0047] In another embodiment, reference Figure 8 When a plurality of discrete alignment blocks 204 are formed in the second frame layer 201 , the lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101 to form a laminated frame, and the alignment blocks 204 are located above the corresponding alignment holes 104 .

[0048] In another embodiment, reference Fig. 9When a plurality of discrete alignment blocks 204 are formed on the lower surface of the second frame layer 201 , the lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101 to form a laminated frame, and the alignment blocks 204 are located above the corresponding alignment holes 104 and partially extend into the corresponding alignment holes 104 .

[0049] In one embodiment, reference Fig.10 , further comprising: mounting a semiconductor chip 301 on the lower surface of the main body area 13 of the first frame layer 101 of the laminated frame. In a specific embodiment, the semiconductor chip 301 is mounted on the lower surface of the supporting body 102, and the conductive metal wire 210 in the second frame layer 201 passes through the first hollow area 112 and is electrically connected to the semiconductor chip 301. In a specific embodiment, the semiconductor chip 301 is an ultrasonic transducer. In other embodiments, the semiconductor chip 301 can be a semiconductor chip with other functions, such as a logic chip, a memory chip, or a sensor with other functions (such as a sound sensor, etc.).

[0050] In one embodiment, after the semiconductor chip 301 is mounted, the laminate frame can be cut. Fig.11 and Fig.12 The cutting device can be cut from the upper surface of the second frame layer 201 (reference Fig.11 ) or the lower surface direction of the first frame layer 101 (reference Fig.12 ) for cutting. Before cutting, the cutting device first identifies the alignment block 204 as an alignment mark, and obtains the position of the cutting path (the cutting path in the second frame layer 201 or the cutting path in the first frame layer) based on the alignment mark. When the cutting device identifies the alignment block 204, the alignment block 204 can be identified from the upper surface direction of the second frame layer 201 or the lower surface direction of the first frame layer 101; after obtaining the position of the cutting path, the alignment block 204 can be identified from the upper surface direction of the second frame layer 201 (reference Fig.11 ) or the lower surface direction of the first frame layer 101 (reference Fig.12 ) cutting the laminate frame along the cutting path to obtain a plurality of discrete packaging structures.

[0051] An embodiment of the present application also provides a laminated frame, referring to Figure 7 , Figure 8 or Fig. 9 , and combined with reference Figure 1 and Figure 3 ,include: A first frame layer 101, wherein the first frame layer 101 comprises an upper surface and a lower surface opposite to each other, and the first frame layer 101 has a plurality of discrete alignment holes 104 penetrating the upper surface and the lower surface of the first frame layer; The second frame layer 201 has a thickness less than that of the first frame layer 101, and the second frame layer 201 is transparent. The second frame layer 201 includes an upper surface and a lower surface opposite to each other. The upper surface of the second frame layer 201 (refer to Figure 7 ), lower surface (reference Fig. 9 ) or in the second frame layer (reference Figure 8 ) having a plurality of discrete alignment blocks 204, the alignment blocks 204 are opaque, and the positions of the alignment blocks 204 correspond to the positions of the alignment holes 104; The lower surface of the second frame layer 201 is pressed onto the upper surface of the first frame layer 101, and the alignment block 204 is located above the corresponding alignment hole 104. The alignment block 204 is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer 201 or the lower surface of the first frame layer 101.

[0052] In one embodiment, the first frame layer 101 and the second frame layer 201 both include a middle area and an edge area surrounding the middle area, the alignment hole 104 is located in the edge area 11 of the first frame layer 101 , and the alignment block 204 is located in the edge area 21 of the second frame layer 201 .

[0053] In one embodiment, the first frame layer 101 further includes: a first positioning hole 105 (see FIG. 1 ) located in the edge region 11 of the first frame layer 101 and penetrating the upper surface and the lower surface of the edge region. Figure 1 ); a second positioning hole 205 (reference Figure 3 ), the second positioning hole 205 in the second frame layer 201 is located directly above the first positioning hole 105 in the first frame layer 101.

[0054] In one embodiment, the material of the first frame layer 101 is an opaque PCB substrate material, the material of the second frame layer 201 is a transparent epoxy resin, polyethylene resin or polypropylene resin; the material of the alignment block 204 is an opaque metal material.

[0055] In one embodiment, a conductive metal wire (not shown in the figure) is sandwiched in the second frame layer 201, and the alignment block 204 is located in the second frame layer 201. The alignment block 204 is sandwiched in the second frame layer 201, and the thickness of the alignment block 204 is the same as the thickness of the conductive metal wire.

[0056] In one embodiment, the middle area 12 of the first frame layer 101 includes a plurality of discrete main body areas 13 and cutting paths between the main body areas 13, the middle area 22 of the second frame layer 201 includes a plurality of discrete main body areas 202 and cutting paths 203 between the main body areas 202, the main body area 12 of the first frame layer 101 includes a support body 102 and a first hollow area 112 located in or around the support body 102, the cutting paths of the first frame layer 101 include connecting ribs 103 and second hollow areas 111, the connecting ribs 103 connect adjacent support bodies 102, in a specific embodiment, the support body 102 is in the shape of an "I"; further comprising: a semiconductor chip 301 (reference Fig.10 ), the conductive metal wire 210 in the second frame layer 201 passes through the first hollow area 112 and is electrically connected to the semiconductor chip 301.

[0057] In one embodiment, the cutting device identifies the alignment block 204 as an alignment mark from the upper surface direction of the second frame layer 201 or the lower surface direction of the first frame layer 101, and obtains the position of the cutting path based on the alignment mark.

[0058] In one embodiment, the semiconductor chip includes an ultrasonic transducer.

[0059] Although the present application has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field can use the methods and technical contents disclosed above to make possible changes and modifications to the technical solution of the present application without departing from the spirit and scope of the present application. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are within the protection scope of the technical solution of the present application.

Claims

1. A method for manufacturing a laminated frame, characterized in that: include: Providing a first frame layer, the first frame layer comprising an upper surface and a lower surface opposite to each other, the first frame layer having a plurality of discrete alignment holes penetrating the upper surface and the lower surface of the first frame layer; Providing a second frame layer, wherein the thickness of the second frame layer is less than that of the first frame layer, and the second frame layer is transparent, the second frame layer comprises an upper surface and a lower surface opposite to each other, and the upper surface, the lower surface or the second frame layer of the second frame layer has a plurality of discrete alignment blocks, the alignment blocks are opaque, and the positions of the alignment blocks correspond to the positions of the alignment holes; The lower surface of the second frame layer is pressed onto the upper surface of the first frame layer to form a laminated frame. The alignment block is located above the corresponding alignment hole. The alignment block is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer or the lower surface of the first frame layer.

2. The method for manufacturing a laminated frame according to claim 1, characterized in that: The first frame layer and the second frame layer both include a middle area and an edge area surrounding the middle area. The alignment hole is located in the edge area of ​​the first frame layer, and the alignment block is located in the edge area of ​​the second frame layer.

3. The method for manufacturing a laminated frame according to claim 2, characterized in that: Also includes: forming a first positioning hole in the edge region of the first frame layer, penetrating through the upper surface and the lower surface of the edge region; A second positioning hole is formed in the edge area of ​​the second frame layer, penetrating the upper surface and the lower surface of the edge area. The positions of the second positioning hole and the first positioning hole correspond to each other. During the pressing, the second positioning hole in the second frame layer is located directly above the first positioning hole in the first frame layer.

4. The method for manufacturing a laminated frame according to claim 2, characterized in that: The alignment hole, the first positioning hole and the second positioning hole are formed by a stamping process or an etching process.

5. The method for manufacturing a laminated frame according to claim 2, characterized in that: The material of the first frame layer is an opaque PCB substrate material, and the material of the second frame layer is a transparent epoxy resin, polyethylene resin or polypropylene resin.

6. The method for manufacturing a laminated frame according to claim 5, characterized in that: The alignment block is made of an opaque metal material.

7. The method for manufacturing a laminated frame according to claim 6, characterized in that: When the alignment block is located on the upper surface or the lower surface of the second frame layer, the alignment block is formed by an electroplating process.

8. The method for manufacturing a laminated frame according to claim 6, characterized in that: The second frame layer is sandwiched with a conductive metal wire. When the conductive metal wire is sandwiched in the second frame layer, the alignment block is sandwiched in the second frame layer. The thickness of the alignment block is the same as that of the conductive metal wire.

9. The method for manufacturing a laminated frame according to claim 8, characterized in that: The middle areas of the first frame layer and the second frame layer each include a number of discrete main body areas and cutting paths between the main body areas, the main body area of ​​the first frame layer includes a supporting body and a first hollow area in or around the supporting body, the cutting paths of the first frame layer include connecting ribs and a second hollow area, and the connecting ribs connect adjacent supporting bodies; a semiconductor chip is mounted on the lower surface of the supporting body of the first frame layer of the laminated frame, and a conductive metal wire in the second frame layer passes through the first hollow area to be electrically connected to the semiconductor chip.

10. The method for manufacturing a laminated frame according to claim 9, characterized in that: When cutting, the cutting equipment identifies the alignment block as an alignment mark from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer, and obtains the position of the cutting path based on the alignment mark; after obtaining the position of the cutting path, the laminated frame is cut along the cutting path from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer to obtain several discrete packaging structures.

11. A laminated frame, characterized in that: include: A first frame layer, the first frame layer comprising an upper surface and a lower surface opposite to each other, the first frame layer having a plurality of discrete alignment holes penetrating the upper surface and the lower surface of the first frame layer; A second frame layer, wherein the thickness of the second frame layer is less than that of the first frame layer, and the second frame layer is transparent, the second frame layer comprises an upper surface and a lower surface opposite to each other, and the upper surface, the lower surface or the second frame layer of the second frame layer comprises a plurality of discrete alignment blocks, the alignment blocks are opaque, and the positions of the alignment blocks correspond to the positions of the alignment holes; The lower surface of the second frame layer is pressed onto the upper surface of the first frame layer, and the alignment block is located above the corresponding alignment hole. The alignment block is used as an alignment mark when cutting the laminated frame along the upper surface of the second frame layer or the lower surface of the first frame layer.

12. The laminate frame according to claim 11, characterized in that The first frame layer and the second frame layer both include a middle area and an edge area surrounding the middle area. The alignment hole is located in the edge area of ​​the first frame layer, and the alignment block is located in the edge area of ​​the second frame layer.

13. The laminate frame according to claim 12, characterized in that Also includes: A first positioning hole located in the edge region of the first frame layer and penetrating through the upper surface and the lower surface of the edge region; A second positioning hole is located in the edge region of the second frame layer and penetrates through the upper surface and the lower surface of the edge region, and the second positioning hole in the second frame layer is located directly above the first positioning hole in the first frame layer.

14. The laminate frame according to claim 12, characterized in that The material of the first frame layer is an opaque PCB substrate material, the material of the second frame layer is a transparent epoxy resin, polyethylene resin or polypropylene resin; the material of the alignment block is an opaque metal material.

15. The laminate frame according to claim 14, characterized in that The second frame layer contains a conductive metal wire, the second frame layer contains the alignment block, and the thickness of the alignment block is the same as that of the conductive metal wire.

16. The laminate frame according to claim 14, characterized in that The middle areas of the first frame layer and the second frame layer each include a number of discrete main body areas and cutting paths located between the main body areas, the main body area of ​​the first frame layer includes a supporting body and a first hollow area located in or around the supporting body, the cutting paths of the first frame layer include connecting ribs and a second hollow area, the connecting ribs connecting adjacent supporting bodies; and also include: a semiconductor chip mounted on the lower surface of the supporting body of the first frame layer of the laminated frame, and a conductive metal wire in the second frame layer passes through the first hollow area to be electrically connected to the semiconductor chip.

17. The laminate frame according to claim 16, characterized in that The cutting device identifies the alignment block as an alignment mark from the upper surface direction of the second frame layer or the lower surface direction of the first frame layer, and obtains the position of the cutting path based on the alignment mark.

18. The laminate frame according to claim 17, characterized in that The semiconductor chip includes an ultrasonic transducer.

19. The laminate frame according to claim 16, characterized in that The support body is in an "I" shape.

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