Camera module

Abstract

A camera module according to an embodiment includes: a base; and a filter unit disposed on the base, in which: the base includes a first frame including an insulating material and a second frame inserted into the first frame and including a metal material; and the filter unit is disposed on the second frame of the base.

Description

Technical Field

[0001] Embodiments relate to a camera module and an optical device including the camera module. Background Art

[0002] Recently, ultra-small camera modules have been developed. In addition, ultra-small camera modules are widely used in small electronic products such as smart phones, laptop computers, and game consoles.

[0003] That is, most mobile electronic devices including smart phones are equipped with a camera device for obtaining an image from an object. In this case, in order to be easy to carry, the mobile electronic devices are gradually becoming smaller.

[0004] These camera modules generally include a lens into which light is incident, an image sensor that captures the light incident through the lens, and a plurality of components for transmitting and receiving electrical signals of images obtained from the image sensor to an electronic device equipped with the camera module. In addition, the image sensor and the plurality of components are generally mounted on a printed circuit board and connected to an external electronic device.

[0005] In this case, in the case where the camera module is applied to the electronic device as described above, an impact may be frequently applied to the camera module during use. In addition, the camera module may cause slight shaking during the shooting operation due to the user's hand shaking, etc. Therefore, the camera module is equipped with an optical image stabilization function.

[0006] On the other hand, the camera module as described above includes a filter mounting portion, referred to as an inner base, a holder, or a sensor base, disposed between the lens module and the image sensor.

[0007] However, the filter mounting portion according to the conventional technology is a portion manufactured by using resin injection molding. Therefore, there is a limitation in reducing the thickness of the filter mounting portion according to the conventional technology. In addition, due to the limitation of the minimum thickness of the filter mounting portion, there is a limitation in reducing the FBL (flange back focus), which is the vertical distance between the lens and the image sensor. For example, the portion manufactured by injection molding has a problem of deterioration of extractability from the mold as the thickness decreases. In addition, the portion manufactured by injection molding has a problem of deformation during extraction from the mold as the thickness decreases. Therefore, the filter mounting portion according to the conventional technology must have a thickness of a certain level or greater.

[0008] In addition, the size of the sensor increases as the resolution of the camera module increases, and the size of the filter also increases as the size of the sensor increases. In addition, in the case of the filter mounting part manufactured by injection according to the conventional technology, there is a limit to increasing the size due to flatness and warpage problems.

[0009] Therefore, a new structure of the filter mounting portion is required to maintain a certain level of flatness even if the thickness is reduced, and to maintain a certain level of rigidity even if the size in the horizontal direction is increased.

[0010] (Patent Document 1) KR 10-2015-0030906A Summary of the invention

[0011] Technical issues

[0012] The embodiment provides a camera module including a base of a new structure and an optical apparatus including the camera module.

[0013] In addition, the embodiment provides a camera module capable of reducing the thickness of a base and an optical apparatus including the same.

[0014] In addition, the embodiment provides a camera module capable of ensuring the rigidity of a base and an optical apparatus including the same.

[0015] In addition, the embodiment provides a camera module capable of improving flatness of a base and flatness of an optical filter, and an optical apparatus including the same.

[0016] In addition, the embodiment provides a camera module capable of reducing FBL, which is a distance between a lens and a sensor, and an optical apparatus including the same.

[0017] The technical problems to be solved by the proposed embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art to which the proposed embodiments belong based on the following description.

[0018] Technical Solution

[0019] A camera module according to an embodiment includes: a base; and a filter unit, which is disposed on the base; wherein the base includes: a first frame, the first frame including an insulating material; and a second frame, the second frame is inserted into the first frame and includes a metal material, and the filter unit is disposed on the second frame of the base.

[0020] In addition, the second frame is coupled to the first frame by an insertion injection method.

[0021] In addition, the first frame includes a first opening, and the second frame includes a second opening overlapping the first opening along the optical axis, and the second frame is inserted into an inner surface of the first opening of the first frame.

[0022] In addition, the area of ​​the second opening is smaller than the area of ​​the first opening and the area of ​​the filter unit.

[0023] In addition, the first frame includes a receiving portion into which the second frame is inserted, wherein the receiving portion includes: a recessed portion formed in an outward direction from an inner surface of the first frame; and a hole portion penetrating the inner and outer surfaces of the first frame.

[0024] In addition, the first frame includes a partition wall portion that divides the receiving portion into a plurality of areas, and the partition wall portion penetrates the second frame inserted into the receiving portion.

[0025] In addition, the camera module also includes a reinforcement plate; a circuit board, which is disposed on the reinforcement plate and includes a cavity; a sensor, which is disposed on an upper surface of the reinforcement plate that vertically overlaps with the cavity of the circuit board and is disposed in the cavity of the circuit board; and a connecting member, which is connected between a terminal of the sensor and a pad of the circuit board, and the uppermost end of the connecting member is positioned to be higher than the upper surface of the circuit board.

[0026] In addition, the first frame includes a first part and a second part, the first part is positioned above the second frame based on a position where the second frame is inserted, the second part is positioned below the second frame based on the position, and the second frame is spaced apart from the uppermost end of the connecting member in the optical axis direction by the second part of the first frame.

[0027] In addition, the thickness of the second portion of the first frame satisfies the range of 150 μm to 250 μm.

[0028] In addition, the base includes a through hole penetrating the first frame and the second frame.

[0029] In addition, the thickness of the second frame satisfies the range of 95 μm to 160 μm.

[0030] In addition, the total thickness of the base including the first frame and the second frame satisfies the range of 350 μm to 550 μm.

[0031] In addition, the second frame includes a non-magnetic metal material.

[0032] In addition, the camera module further includes an adhesive portion disposed between the circuit board and a lower surface of the first frame of the base.

[0033] Effects of the Invention

[0034] The camera module of the embodiment includes a base on which a filter unit is installed. At this time, the base includes a plurality of frames made of different materials. For example, the base includes a first frame made of a first material and a second frame made of a second material. At this time, the first material includes an insulating material. In addition, the second material includes a metal material different from the first material. The second frame is used as a mounting portion on the base for mounting the filter unit. Therefore, by making the mounting portion on which the filter unit is mounted be made of a metal material, the embodiment can stably mount the filter unit on the base. In addition, the embodiment can improve the flatness of the filter unit mounted on the base.

[0035] At the same time, due to the demand for high resolution, the size of the sensor increases, and the size of the filter unit also increases accordingly. At this time, there is a limit to the size of the filter unit that can be installed on the mounting portion injected with the insulating material of the comparative example. In contrast, the embodiment has a second frame corresponding to the mounting portion formed by the metal material. Therefore, the embodiment can provide a base that can respond to the increase in the size of the filter unit. In addition, compared with the comparative example, the embodiment can increase the size of the filter unit that can be installed while maintaining the flatness of the filter unit.

[0036] In addition, compared with the comparative example, the embodiment can reduce the thickness of the second frame. Specifically, since the comparative example must consider the non-molding problem during the injection process, the mounting portion must have a certain thickness or greater. Different from this, the embodiment does not have to consider the non-molding problem of the second frame corresponding to the mounting portion. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the second frame corresponding to the mounting portion. That is, the embodiment can reduce the thickness of the second frame while maintaining the flatness of the filter unit. Therefore, the embodiment can reduce the FBL (flange back focus) to correspond to the reduction in the thickness of the second frame. Therefore, the embodiment can reduce the overall thickness or volume of the camera module.

[0037] In addition, the embodiment allows the first frame to be injected while the second frame is inserted. Therefore, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding thereto. For example, the comparative example needs to consider the injectability and extractability issues. Therefore, the comparative example has limitations on the reduction of the total thickness of the base. Alternatively, the embodiment performs injection while the second frame is inserted. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding to the thickness of the first frame. Therefore, the embodiment can reduce the FBL (flange back focus). In addition, the embodiment can reduce the total thickness or volume of the camera module.

[0038] Meanwhile, the second frame in the embodiment includes a black coating. The coating prevents light passing through the lens and the filter from being reflected by the second frame. Therefore, the embodiment can improve the image quality of the camera module.

[0039] In addition, the second frame in the embodiment is formed of a non-magnetic material. Therefore, the embodiment can solve the problem that the operating characteristics of the sensor drive device are degraded by the second frame. For example, when the second frame includes a magnetic material, magnetic interference may occur in the interaction between the coil and the magnet of the sensor drive device. In addition, the operating characteristics of the sensor drive device may be degraded by magnetic interference. Different from this, the second frame in the embodiment includes a non-magnetic material. Therefore, the embodiment can achieve the effect of maintaining the flatness of the filter unit and reducing the FBL without affecting the operating characteristics of the sensor drive device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a perspective view of a camera module according to an embodiment.

[0041] Figure 2 is an exploded perspective view of a camera module according to an embodiment.

[0042] Figure 3 It is taken along the line A-A' Figure 1 Cross-sectional view of the camera module.

[0043] Figure 4 yes Figure 3 A magnified view of a local area.

[0044] Figure 5 is an exploded perspective view of an optical filter module according to an embodiment.

[0045] Figure 6 is a plan view of an optical filter module according to an embodiment.

[0046] Figure 7 is an exploded perspective view of a base according to an embodiment.

[0047] Figure 8 is an enlarged view of a partial area of ​​a base according to an embodiment.

[0048] Fig. 9 is a first enlarged view of a partial area of ​​a first frame of a base according to an embodiment.

[0049] Fig.10 is a second enlarged view of a partial area of ​​the first frame of the base according to an embodiment.

[0050] Fig.11 is a cross-sectional view of the optical filter module according to the embodiment, taken along line AA′.

[0051] Fig.12 is a combined view of an optical filter module and a circuit board according to an embodiment.

[0052] Fig.13 is a perspective view of a portable terminal according to an embodiment.

[0053] Fig.14 yes Fig.13 A configuration diagram of a portable terminal shown in FIG. DETAILED DESCRIPTION

[0054] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0055] However, the spirit and scope of the present disclosure are not limited to parts of the described embodiments and may be implemented in various other forms, and one or more elements of the elements of the embodiments may be selectively combined and replaced within the spirit and scope of the present disclosure.

[0056] In addition, unless explicitly defined and described otherwise, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure may be interpreted as having the same meaning as that commonly understood by ordinary technicians in the field to which the present invention belongs, and those terms such as those defined in commonly used dictionaries may be interpreted as having a meaning consistent with their meaning in the context of the relevant technology.

[0057] In addition, the terms used in the embodiments of the present disclosure are used to describe the embodiments and are not intended to limit the present disclosure. In the present application document, unless otherwise specified in a phrase, a singular form may also include a plural form, and when described as "at least one (or more) of A (and), B, and C", at least one combination of all combinations that can be combined in A, B, and C may be included.

[0058] In addition, when describing the elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a) and (b) may be used. These terms are only used to distinguish an element from other elements, and the terms are not limited to the essence, order or sequence of the elements. In addition, when an element is described as being "connected", "coupled" or "contacted" to another element, not only the situation that the element is directly "connected", "coupled" or "contacted" to other elements may be included, but also the situation that the element is "connected", "coupled" or "contacted" by another element between the element and other elements may be included.

[0059] In addition, when described as being formed or arranged "on (above)" or "under (below)" of each element, "on (above)" or "under (below)" may include not only a case where two elements are directly connected to each other, but also a case where one or more other elements are formed or arranged between the two elements. In addition, when expressed as "on (above)" or "under (below)", based on one element, not only an upward direction but also a downward direction may be included.

[0060] Hereinafter, an optical axis direction used may be defined as an optical axis direction of a lens coupled to a camera actuator and a camera module, and a vertical direction may be defined as a direction perpendicular to the optical axis.

[0061] The auto focus function used below may be defined as a function of automatically focusing on a subject by moving a lens in an optical axis direction according to a distance of the subject so that a clear image of the subject can be obtained on an image sensor.

[0062] Meanwhile, the auto focus may correspond to AF. In addition, closed loop auto focus (CLAF) control may be defined as real-time feedback (reaction) control of the position of the lens by sensing the distance between the image sensor and the lens to improve the accuracy of focus control.

[0063] In addition, before describing the embodiments of the present invention, the first direction may refer to the x-axis direction illustrated in the drawings, and the second direction may be a direction different from the first direction. For example, the second direction may refer to the y-axis direction illustrated in the drawings and a direction perpendicular to the first direction. In addition, the third direction may be a direction different from the first direction and the second direction. For example, the third direction may refer to the z-axis direction illustrated in the drawings and a direction perpendicular to the first direction and the second direction. Here, the third direction may refer to the optical axis direction.

[0064] Hereinafter, a camera module and an optical apparatus including the same according to an embodiment will be described in detail.

[0065] Figure 1 is a perspective view of a camera module according to an embodiment, Figure 2 is an exploded perspective view of a camera module according to an embodiment, Figure 3 It is taken along the line A-A' Figure 1 A cross-sectional view of a camera module, and Figure 4 yes Figure 3 A magnified view of a local area.

[0066] Reference Figures 1 to 4, a camera module 100 according to an embodiment may include a lens 110 , a lens barrel 120 , a lens driving device 130 , a filter unit 140 , a base 150 , a circuit board 160 , a reinforcing plate 170 , a sensor 180 , and an adhesive portion 190 .

[0067] Here, the camera module 100 can be represented as being replaced by a camera or a photographic device. In addition, the base 150 can be represented as being replaced by a retainer, a sensor base, an inner base, a filter mounting portion, or a filter seating portion. In addition, the lens driving device 130 can be referred to as an actuator for driving the lens 110 or the lens barrel 120.

[0068] The lens 110 or the lens barrel 120 may be coupled to the lens driving device 130. For example, the lens 110 or the lens barrel 120 may be mounted on the lens driving device 130.

[0069] For example, the lens 110 may be mounted in the lens barrel 120. In addition, the lens barrel 120 may be mounted on the lens driving device 130.

[0070] In this case, the lens driving device 130 includes a bobbin (not shown). In addition, the lens barrel 120 may be coupled to the bobbin of the lens driving device 130 .

[0071] Adhesive portion 190 can be arranged between the outer surface of lens barrel 120 and the inner surface of the coil frame of lens driving device 130. In addition, lens barrel 120 can be connected to the coil frame of lens driving device 130 by adhesive portion 190. In this case, lens barrel 120 can move together with the coil frame corresponding to the moving part of lens driving device 130. As will be described later, lens driving device 130 includes a fixed part with a fixed position and a moving part moving relative to the fixed part. In addition, the coil frame is included in the moving part of lens driving device 130. In this case, lens barrel 120 is connected to the coil frame of the moving part of lens driving device 130. Therefore, when the moving part of lens driving device 130 moves, lens barrel 120 can move together with the moving part.

[0072] That is, the lens driving device 130 may drive the lens barrel 120 coupled with the lens 110 .

[0073] The lens 110 may be an optical system in which three or more lenses are stacked. The lens 110 may be an optical system in which five or more lenses are stacked. The lens 110 may be an optical system in which eight or more lenses are stacked. In this case, although the lens 110 is shown in the drawings as including eight lenses, the embodiment is not limited thereto. For example, the lens 110 may have a stacking structure of less than 8 pieces, or alternatively, may have a stacking structure of 9 or more pieces.

[0074] The lens 110 may include a lens made of a plastic material. The lens 110 according to an embodiment of the present invention may include a first lens unit made of a plastic material and a second lens unit made of a glass material. In addition, the number of lenses in the first lens unit made of a plastic material may be greater than the number of lenses in the second lens unit made of a glass material. For example, the number of lenses in the first lens unit made of a plastic material may be two or more.

[0075] In an embodiment, the lens 110 may be stacked by a plastic lens and / or a glass lens. Here, the coefficient of thermal expansion (CTE) of the plastic material is five times or more higher than the coefficient of thermal expansion (CTE) of the glass material, and the change value of the refractive index (|dN / Dt|) as a function of temperature may be ten times or more higher than the change value of the refractive index of the plastic material. Here, dN is the change value of the refractive index of the lens, and dT is the change value of the temperature.

[0076] In addition, the camera module 100 may be any one of a camera module for auto focus (AF) and a camera module for optical image stabilizer (OIS). The camera module for AF refers to a camera module that can only perform an auto focus function. The camera module for OIS refers to a camera module that performs both an auto focus function and an OIS function.

[0077] For example, the lens driving device 130 may be a lens driving device for AF or a lens driving device for OIS. Here, the meanings of "for AF" and "for OIS" may be the same as those described in the camera module for AF and the camera module for OIS.

[0078] For example, the lens driving device 130 of the camera module 100 may be a lens driving device for OIS.

[0079] The lens driving device 130 may include a housing 131 and a bobbin 132 disposed in the housing 131 and coupled to the lens barrel 120 .

[0080] In addition, although not specifically shown in the drawings, the lens driving device 130 may include a first coil (not shown) coupled to the coil bobbin 132. In addition, the lens driving device 130 may include a magnet (not shown) coupled to the housing 131 and opposite to the first coil.

[0081] In addition, the lens driving device 130 may include at least one upper elastic member (not shown) coupled to the upper portion of the housing 131 and the upper portion of the bobbin 132. In addition, the lens driving device 130 may include at least one lower elastic member (not shown) coupled to the lower portion of the housing 131 and the lower portion of the bobbin 132.

[0082] In addition, the lens driving device 130 may include a second coil (not shown) disposed below the coil frame 132 or the housing 131. In addition, the lens driving device 130 may include a drive substrate (not shown) disposed below the second coil. In addition, the lens driving device 130 may include a frame portion (not shown) disposed below the drive substrate.

[0083] Meanwhile, the bobbin 132 may also be referred to as a holder to which the lens barrel 120 is coupled.

[0084] In addition, the lens driving apparatus 130 may include a cover member 133 coupled to the frame portion and providing a space for accommodating components of the lens driving apparatus 130 together with the frame portion.

[0085] In addition, the lens driving device 130 may further include a supporting member (not shown) that supports the housing 131 relative to the frame portion while electrically connecting the driving substrate to the upper elastic member. Each of the first coil and the second coil may be electrically connected to the driving substrate, and may receive a driving signal (driving current) from the driving substrate.

[0086] For example, the upper elastic member may include a plurality of upper springs. In addition, the supporting member may include a supporting member connected to the upper spring of the upper elastic member. In addition, the first coil may be electrically connected to the drive substrate through the upper spring and the supporting member. The drive substrate may include a plurality of terminals. The first coil and / or the second coil may be electrically connected to some of the plurality of terminals.

[0087] The lens driving device 130 according to the embodiment can move the coil frame 132 and the lens barrel 120 coupled to the coil frame 132 in the optical axis direction by the electromagnetic force caused by the interaction between the first coil and the magnet. In addition, the positions of the lens barrel 120 and the lens 110 coupled to the lens barrel 120 in the optical axis direction can be controlled by the electromagnetic force. Therefore, AF driving can be achieved.

[0088] In addition, in the lens driving device 130, the housing 131 can be moved in a direction perpendicular to the optical axis direction by the electromagnetic force caused by the interaction between the second coil and the magnet. Therefore, hand shake correction or OIS driving can be achieved.

[0089] In addition, the lens driving device 130 of the camera module 100 may include a position sensor unit (not shown) for AF feedback driving. The position sensor unit may include a sensing magnet (not shown) disposed on the coil frame 132 and an AF position sensor (e.g., a Hall sensor, not shown) disposed on the housing 131.

[0090] In addition, the lens driving device 130 may further include a sensor substrate (not shown) disposed on the housing 131 or / and the frame, and the AF position sensor is disposed or mounted on the sensor substrate. In another embodiment, the AF position sensor may be disposed on the coil frame 132, and the sensing magnet may be disposed on the housing 131. In addition, the lens driving device 130 may further include a balancing magnet (not shown) disposed on the coil frame 132 corresponding to the sensing magnet.

[0091] The AF position sensor detects the magnetic field strength of the sensing magnet according to the movement of the coil frame 132. In addition, the AF position sensor can generate an output signal according to the detection result. The AF position sensor can be electrically connected to the drive substrate through the upper elastic member (or the lower elastic member) and / or the supporting member. The drive substrate can provide a drive signal to the AF position sensor. In addition, the drive substrate can receive the output signal of the AF position sensor.

[0092] In another embodiment, the lens driving device 130 may be an AF lens driving device, and the AF lens driving device may include a shell 131, a coil frame 132 disposed inside the shell 131, a coil disposed in the coil frame 132, a magnet disposed in the shell 131, at least one elastic member connected to the coil frame 132 and the shell 131, and a frame portion disposed below the coil frame (or / and the shell).

[0093] For example, the elastic member may include the upper elastic member and the lower elastic member described above.

[0094] A driving signal (eg, a driving current) may be provided to the coil. In addition, based on the provided driving signal, the coil frame 132 may move in the optical axis direction by an electromagnetic force due to interaction between the coil and the magnet.

[0095] In another embodiment, the coil may be disposed in the housing, and the magnet may be disposed in the coil former 132 .

[0096] In addition, for AF feedback drive, the AF lens drive device may further include a sensing magnet disposed on the coil frame 132, an AF position sensor (e.g., a Hall sensor) disposed on the housing 131, and a sensor substrate, the AF position sensor being disposed on the sensor substrate and the sensor substrate being disposed or mounted on the housing or / and the frame. In another embodiment, the AF position sensor may be disposed on the coil frame 132, and the sensing magnet may be disposed on the housing 131.

[0097] A camera module according to another embodiment may include a housing coupled to the lens or the lens barrel 120 instead of the housing. Figure 1 The lens driving device 130. In addition, the housing may be coupled or attached to the upper surface of the base 150. At this time, the housing may be attached or fixed to the base 150 and may not move. For example, the housing may be attached to the base 150, and the position of the housing may be fixed.

[0098] The circuit board may be electrically connected to the coil and the AF position sensor. In addition, a driving signal may be provided to each of the coil and the AF position sensor through the circuit board, and an output signal of the AF position sensor may be transferred to the circuit board.

[0099] The base 150 may be disposed under the lens driving device 130 .

[0100] The filter unit 140 may be mounted on the base 150. To this end, the base 150 may be provided with a mounting portion on which the filter unit 140 is mounted. That is, the base 150 may include a window, wherein the area where the filter unit 140 is provided is open. Therefore, the mounting portion of the base 150 may also be referred to as a window.

[0101] At this time, an adhesive portion (not shown) may be applied between the base 150 and the filter unit 140. For example, the adhesive portion may be provided between a mounting portion (described later) of the base 150 and the filter unit 140. The adhesive portion may be epoxy resin, a thermosetting adhesive, an ultraviolet curing adhesive, or the like.

[0102] The filter unit 140 may be mounted on the base 150. To this end, the base 150 may include a plurality of frames.

[0103] At this time, the fact that the base 150 includes a plurality of frames does not mean that the base 150 includes a plurality of different parts. The plurality of frames may be parts constituting the base 150 classified by material.

[0104] As will be described later, the base 150 in the embodiment may be an injection molded product injected by insert injection or double injection. Therefore, the base 150 may include a first frame 151 and a second frame 152 inserted into the first frame 151. In addition, the material constituting the first frame 151 may be different from the material constituting the second frame 152. For example, the first frame 151 may include an insulating material. For example, the first frame 151 may be formed of a resin. For example, the first frame 151 may be formed of plastic. The second frame 152 includes a material different from the first frame 151. Preferably, the second frame 152 may include a metal material. More preferably, the second frame 152 may include a non-magnetic metal material.

[0105] In addition, the second frame 152 may be formed of a metal material and may be inserted into the first frame 151. The second frame 152 may have a function of improving the rigidity of the first frame 151 and the rigidity of the base 150. In addition, the second frame 152 may have a function of improving the flatness of the first frame 151 and the flatness of the base 150.

[0106] Specifically, the second frame 152 is inserted into the first frame 151. The second frame 152 may be a mounting portion where the filter unit 140 is mounted. For example, the second frame 152 may be a window.

[0107] In an embodiment, the base 150 includes a first frame 151 made of an insulating material and a second frame 152 made of a metal material and inserted into the first frame 151. In addition, the second frame 152 may have a function of reducing the minimum injectable thickness of the first frame 151. In addition, the second frame 152 may reduce the minimum thickness of the mounting portion (or window) required for mounting and / or supporting the filter unit 140. For example, when the mounting portion is formed by an injection molded product of an insulating material, the mounting portion must have a first thickness for mounting and / or supporting the filter unit 140. On the contrary, when the mounting portion is formed by a second frame 152 formed of a metal material, such as an embodiment, the second frame 152 may have a second thickness less than the first thickness for mounting and / or supporting the filter unit 140. Therefore, the embodiment can reduce the thickness of the mounting portion. In addition, the total thickness of the first frame 151 formed by injection molding can be reduced by the second frame 152. Therefore, the embodiment can reduce the entire thickness of the base 150. Therefore, embodiments may maintain the flatness of the base 150 to improve the warping characteristics of the filter unit 140. In addition, embodiments may reduce the thickness of the base 150, thereby reducing FBL (Flange Back Focus), which is the distance between the lens 110 and the sensor 180.

[0108] The embodiment provides a base 150 integrally formed by dual injection molding of the first frame 151 and the second frame 152. In addition, the second frame 152 is inserted into the first frame 151, and effects such as improvement in flatness, improvement in warpage characteristics, thickness reduction, and FBL reduction of the base 150 can be achieved.

[0109] That is, the first frame 151 includes an opening vertically overlapped with the filter unit 140. In addition, the second frame 152 may be a protrusion protruding from an inner surface of the opening of the first frame 151 toward the opening.

[0110] In addition, the second frame 152 as a protrusion may be used as a mounting portion to which the filter unit 140 is mounted.

[0111] At this time, the second frame 152 may also have an opening corresponding to the opening of the first frame 151. However, the area of ​​the opening of the second frame 152 may be smaller than the area of ​​the opening of the first frame 151. Therefore, a portion of the opening of the first frame 151 may be covered by the second frame 152. For example, the opening of the first frame 151 includes a first area overlapping with the opening of the second frame 152 along the optical axis and a second area overlapping with the opening of the second frame 152 along the optical axis.

[0112] The second frame 152 may prevent the lower end portion of the lens 110 or the lens barrel 120 from directly contacting or colliding with the filter unit 140 while allowing the filter unit 140 to be mounted.

[0113] At this time, the first frame 151 may have a shape protruding in the optical axis direction from the upper surface of the second frame 152. For example, the first frame 151 may include a first portion 151a protruding in the optical axis direction along the side surface of the filter unit 140 mounted on the second frame 152. For example, the first portion 151a of the first frame 151 may be disposed around the side surface of the filter unit 140 mounted on the second frame 152 so as to surround the side surface of the filter unit 140.

[0114] In addition, the inner surface of the first portion 151a of the first frame 151 may be disposed to face the side surface of the filter unit 140. At this time, the outer surface of the filter unit 140 may be spaced apart from the inner surface of the first portion 151a of the first frame 151 by a certain distance. This may ensure a process tolerance that allows the filter unit 140 to be easily mounted on the second frame 152.

[0115] The upper surface of the first frame 151 may be positioned higher than the upper surface of the filter unit 140 in the optical axis direction. This may prevent the lens 110 or the lens barrel 120 from contacting the filter unit 140 when the lens driving device 130 or the lens barrel 120 moves toward the filter unit 140 by the lens driving device 130 or an external impact.

[0116] Meanwhile, the shapes of the first frame 151 and the second frame 152 when viewed from above may correspond to the shape of the filter unit 140, but are not limited thereto. For example, the planar shape of at least one of the first frame 151 and the second frame 152 may be different from the planar shape of the filter unit 140.

[0117] Meanwhile, the base 150 may include an incident portion corresponding to the opening of the first frame 151 and the opening of the second frame 152. The incident portion may allow light passing through the filter unit 140 to be incident on the sensor 180. The opening and the incident portion may penetrate the base 150 in the optical axis direction. Therefore, the opening and the incident portion may also be referred to as a through hole.

[0118] The opening may penetrate the center of the base 150. At this time, the area of ​​the opening formed in the first frame 151 may be larger than the area of ​​the filter unit 140. In addition, the area of ​​the opening formed in the second frame 152 may be smaller than the area of ​​the filter unit 140. Therefore, the filter unit 140 may be positioned in the opening of the first frame 151 while being mounted to the second frame 152.

[0119] The filter unit 140 may be disposed on the base 150. Preferably, the filter unit 140 may be mounted on the second frame 152 of the base 150.

[0120] The filter unit 140 may block light of a specific frequency band from passing through the lens 110 accommodated in the lens barrel 120. For example, the filter unit 140 may block light of a specific frequency band from being incident on the sensor 180.

[0121] For example, the filter unit 140 may be an infrared filter, but is not limited thereto. The filter unit 140 may be disposed parallel to a direction (eg, an xy plane direction) perpendicular to the optical axis (OA).

[0122] The circuit board 160 may be disposed below the base 150 . That is, the base 150 may be attached or coupled to the circuit board 160 .

[0123] To this end, the adhesive portion 145 may be disposed between the base 150 and the circuit board 160. In addition, the adhesive portion 145 may stably fix the base 150 on the circuit board 160.

[0124] Meanwhile, the circuit board 160 may include a cavity C that overlaps with the opening of the base 150 in the vertical direction or along the optical axis. The cavity C may mean a through hole that penetrates the circuit board 160. For example, the circuit board 160 may include a cavity C in which an area that overlaps with the opening of the filter unit 140 or the base 150 on the optical axis is open. In addition, the cavity C may penetrate the upper surface of the circuit board 160 and the lower surface opposite to the upper surface of the circuit board 160.

[0125] The camera module 100 of the embodiment includes a sensor 180. The sensor 180 may also be referred to as an image sensor.

[0126] The sensor 180 may be disposed in the cavity C of the circuit board 160. For example, the sensor 180 may overlap the cavity C of the circuit board 160 in the optical axis direction.

[0127] The camera module 100 according to the embodiment may include a reinforcement plate 170 .

[0128] The reinforcement plate 170 may be attached to a lower surface of the circuit board 160 .

[0129] The reinforcing plate 170 may include an overlapping region overlapping the cavity C of the circuit board 160 on the optical axis.

[0130] In addition, the sensor 180 may be attached to the upper surface of the overlapped region of the reinforcing plate 170. For example, the sensor 180 may be attached to the upper surface of the overlapped region of the reinforcing plate 170 while being disposed in the cavity C of the circuit board 160.

[0131] That is, in recent years, the resolution required for the camera module is increasing. In addition, as the resolution increases, the size of the sensor 180 increases. In this case, when the sensor 180 is disposed on the circuit board 160, it may be difficult to maintain the flatness of the sensor 180 whose size is gradually increasing. In addition, when the sensor 180 is disposed on the circuit board 160, the heat dissipation characteristics of the sensor 180 may be deteriorated.

[0132] Therefore, in an embodiment, the reinforcing plate 170 is attached to the lower surface of the circuit board 160. In addition, in an embodiment, the sensor 180 may be attached to the reinforcing plate 170 instead of the circuit board 160.

[0133] For example, the sensor 180 of the embodiment may be directly attached to the reinforcing plate 170. Here, directly attached may mean that the sensor 180 is directly disposed on an adhesive portion (described later) disposed on the reinforcing plate 170.

[0134] Meanwhile, when the sensor 180 is disposed on the reinforcing plate 170, the sensor 180 may be exposed through the cavity C of the circuit board 160. In addition, the terminal 181 of the sensor 180 may be electrically connected to the pad 162 of the circuit board 160. For example, the sensor 180 may be electrically connected to the circuit board 160 through a connecting member W (e.g., a wire).

[0135] The reinforcing plate 170 may be a plate-shaped member having a thickness and hardness of a predetermined level or higher. Therefore, the reinforcing plate 170 may stably support the sensor 180. In addition, the reinforcing plate 170 may prevent the sensor 180 from being damaged by an external impact. For example, the reinforcing plate 170 may protect the sensor 180 from an external impact. In addition, the reinforcing plate 170 may dissipate the heat generated by the sensor 180. Therefore, the reinforcing plate 170 may perform a heat dissipation function of dissipating the heat generated by the sensor 180 to the outside, while improving the flatness of the sensor 180.

[0136] To this end, the reinforcing plate 170 may include a metal material having high thermal conductivity. For example, the reinforcing plate 170 may be SUS. However, the embodiment is not limited thereto. The reinforcing plate 170 may be formed of aluminum having high thermal conductivity other than SUS. In addition, as another example, the reinforcing plate 170 may include glass, plastic, or synthetic resin.

[0137] The reinforcing plate 170 may be connected to a ground member (not shown) of the circuit board 160. For example, the reinforcing plate 170 may be electrically connected to a ground pattern (not shown) of the circuit board 160. Therefore, the reinforcing plate 170 may function as a ground member for protecting the camera module from electrostatic discharge (ESD).

[0138] The light passing through the optical filter unit 140 may be incident on the sensor 180. The sensor 180 may be a portion in which an image included in the light incident through the optical filter unit 140 is formed.

[0139] The circuit board 160 may convert an image formed on the sensor 180 into an electrical signal and transmit the electrical signal to an external device. To this end, the circuit board 160 may include various circuit parts, component parts, control parts, etc. In addition, the circuit board 160 may include a component part or a pattern part electrically connected to the sensor 180. The pattern part may include a pad 162. The detailed configuration of the circuit board 160 will be described below.

[0140] Meanwhile, the sensor 180 may receive an image included in the incident light and convert the received image into an electrical signal. For example, the sensor 180 may be a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), etc. However, the embodiment is not limited thereto, and the sensor 180 may be implemented by other devices that perform functions similar to those of the CCD or CMOS.

[0141] The filter unit 140 and the sensor 180 may face each other in the optical axis OA direction.

[0142] Meanwhile, the filter unit 140 may include a filter 141 having a blocking member 142 formed on an upper surface thereof. The blocking member 142 may be replaced with a "shielding unit".

[0143] The blocking member 142 may be disposed at an edge region of the upper surface of the optical filter 141. The blocking member 142 may block a portion of the light passing through the lens 110. For example, the blocking member 142 may block the light incident to the edge region of the upper surface of the optical filter 141 among the light passing through the lens 110. For example, the blocking member 142 may block the light passing through the lens 110 from passing through the edge region of the upper surface of the optical filter 141. The blocking member 142 may be coupled or attached to the upper surface of the optical filter 141.

[0144] For example, the filter 141 may have a rectangular planar shape. In addition, the blocking member 142 may be formed symmetrically with the filter 141 along each side of the upper surface of the filter 141. The blocking member 142 may be formed to have a predetermined width at an edge region of the upper surface of the filter 141.

[0145] The blocking member 142 may be formed of an opaque material. For example, the blocking member 142 may be an adhesive material applied to the opaque material of the filter 141, but is not limited thereto. For example, the blocking member 142 may be a film formed of an opaque material attached to the upper surface of the filter unit 140.

[0146] The filter 141 and the sensor 180 may be disposed to face each other in the optical axis direction. In addition, the blocking member 142 may include at least a portion overlapping the pad 162 and / or the connection member W disposed on the circuit board 160 in the optical axis direction.

[0147] Meanwhile, the connection member W and the pad 162 may be formed of a conductive material. For example, the connection member W and the pad 162 may be formed of gold (Au), silver (Ag), copper (Cu), a copper alloy, etc. Meanwhile, the conductive material constituting the connection member W and the pad 162 has the property of reflecting light. Therefore, the light passing through the filter 141 may be reflected by the pad 162 and / or the connection member W of the circuit board 160. In addition, due to the reflected light, a transient flare phenomenon may occur. In addition, the flare phenomenon may distort the image formed by the sensor 180 or reduce its image quality.

[0148] In this case, a portion of the blocking member 142 of the filter unit 140 overlaps with the pad 162 and / or the connecting member W in the optical axis direction. Thus, the light that is guided to the pad 162 and / or the connecting member W of the circuit board 160 among the light that passes through the lens 110 can be blocked. In an embodiment, a flare phenomenon can be prevented by blocking the light. Therefore, the embodiment can prevent the image formed by the sensor 180 from being distorted. In addition, the embodiment can improve the quality of the image obtained by the sensor 180.

[0149] Meanwhile, a motion sensor (not shown) may be mounted or provided on the circuit board 160. The motion sensor may be electrically connected to a control device (not shown) through a pattern portion provided on the circuit board 160.

[0150] The motion sensor may obtain rotation speed information about the motion of the camera module 100. The motion sensor may be a two-axis or three-axis gyro sensor. The motion sensor may be an angular velocity sensor. The control element may be mounted or disposed on the circuit board 160.

[0151] The circuit board 160 may be electrically connected to the lens driving device 130. For example, the circuit board 160 may be electrically connected to a driving board of the lens driving device 130.

[0152] For example, the circuit board 160 may supply a driving signal to the first coil and the second coil of the lens driving device 130. In addition, the circuit board 160 may supply a driving signal to the AF position sensor (or the OIS position sensor). In addition, the circuit board 160 may receive an output signal of the AF position sensor (or the OIS position sensor).

[0153] Meanwhile, the camera module 100 includes a connector 190 .

[0154] The connector 190 may be disposed on the circuit board 160. For example, the connector 190 may be electrically connected to the circuit board 160. The connector 190 may include a port electrically connected to an external device.

[0155] Meanwhile, the camera module 100 of the embodiment may include a plurality of adhesive portions disposed between different components. The adhesive portions may provide adhesive force between different components. For example, the adhesive portions may attach or fix one component to another component.

[0156] For example, the camera module 100 may include an adhesive portion 175 disposed between a lower surface of the sensor 180 and an upper surface of the reinforcing plate 170. The sensor 180 may be attached or fixed to the reinforcing plate 170 through the adhesive portion 175.

[0157] The reinforcing plate 170 may be divided into a plurality of regions.

[0158] The reinforcing plate 170 may include a first region and a second region. The first region of the reinforcing plate 170 may be a region overlapping the sensor 180 and / or the cavity C of the circuit board 160 in the optical axis direction.

[0159] The second region of the reinforcing plate 170 may be a region that does not overlap the sensor 180 and the cavity C in the optical axis direction.

[0160] In addition, the adhesive portion 175 may be provided on the first area of ​​the reinforcing plate 170. That is, the first area of ​​the reinforcing plate 170 may be a sensor attachment area to which the sensor 180 is attached through the adhesive portion 175. The adhesive portion 175 may be any one of epoxy resin, thermosetting adhesive, ultraviolet curing adhesive, and adhesive film, but is not limited thereto.

[0161] Meanwhile, the adhesive portion 165 may be disposed on the second region of the reinforcing plate 170. The adhesive portion 165 may attach or fix the reinforcing plate 170 to the circuit board 160. The region of the adhesive portion 165 may correspond to the region of the circuit board 160.

[0162] Meanwhile, the circuit board 160 may include an insulating layer 161 , a pad 162 , and a protective layer 163 .

[0163] The insulating layer includes a prepreg (PPG). The insulating layer 161 can be formed by impregnating a fiber layer in the form of a fabric sheet, such as a glass fabric woven with glass yarn, with an epoxy resin and then performing hot pressing. However, the embodiment is not limited thereto, and the insulating layer 110 may include a fiber layer in the form of a fabric sheet woven with carbon fiber yarn. The insulating layer 161 may include a resin and a reinforcing member disposed in the resin. The resin may be an epoxy resin, but is not limited thereto. The resin is not particularly limited to an epoxy resin, and for example, one or more epoxy groups may be included in the molecule, or alternatively, two or more epoxy groups may be included, or alternatively, four or more epoxy groups may be included. In addition, the resin 110 may include a naphthyl group, for example, an aromatic amine type, but is not limited thereto. For example, resin can include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, alkylphenol novolac type epoxy resin, biphenyl type epoxy resin, aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, phenol and the epoxy resin of the condensation product of aromatic aldehyde with phenolic hydroxyl group, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, isocyanuric acid triglycidyl ester, rubber modified epoxy resin, phosphorus epoxy resin etc., and naphthyl epoxy resin, bisphenol A type epoxy resin and phenol novolac epoxy resin, cresol novolac epoxy resin, rubber modified epoxy resin and phosphorus epoxy resin. In addition, reinforcing member can include glass fiber, carbon fiber, aramid fiber (for example, aramid-based organic material), nylon, silica-based inorganic material or titanium dioxide-based inorganic material. The reinforcing members may be arranged in the resin so as to cross each other in the planar direction.

[0164] Meanwhile, the reinforcing member may use glass fiber, carbon fiber, aramid fiber (eg, aramid-based organic material), nylon, silica-based inorganic material, or titanium-based inorganic material.

[0165] A pattern portion may be disposed on the insulating layer 161. For example, the pattern portion may include a pad 162 electrically connected to the sensor 180 through a connection member W. In this case, although the drawings show that only a pad electrically connected to the sensor 180 is disposed on the insulating layer 161, the embodiment is not limited thereto.

[0166] In addition, a protective layer 163 is disposed on the insulating layer 161. The protective layer 163 may be disposed not only on the upper surface of the insulating layer 161 but also on the upper surface of the pattern portion. The protective layer 163 may play a role in protecting the upper surface of the insulating layer 161 and the upper surface of the pattern portion.

[0167] The protective layer 163 may include an opening area that vertically overlaps the upper surface of the pad 162 electrically connected to the sensor 180 in the pattern portion. In addition, the pad 162 may be exposed through the opening area of ​​the protective layer 163. Therefore, embodiments may electrically connect the upper surface of the exposed pad 162 and the terminal 181 of the sensor 180 through the connecting member W.

[0168] The protection layer 163 may be a solder resist, but is not limited thereto.

[0169] Meanwhile, in the embodiment, the pad 162 of the circuit board 160 and the terminal 181 of the sensor 180 are electrically connected through the connection member W.

[0170] The upper surface of the sensor 180 or the upper surface of the terminal 181 is positioned lower than the upper surface of the circuit board 160. In addition, the uppermost end of the connection member W is positioned higher than the upper surface of the circuit board 160. For example, the uppermost end of the connection member W is positioned higher than the upper surface of the protective layer 163.

[0171] Preferably, the connection member W may be positioned higher than the upper surface of the circuit board 160 by a predetermined protrusion height t1.

[0172] Therefore, the base 150 of the embodiment provides a mounting portion for mounting the filter unit 140 while being spaced apart by the protruding height (t1) of the connection member W. That is, the second portion 151b of the first frame 151 of the base 150 may protrude downward from the first portion 151a of the first frame 151. In addition, the embodiment may allow a certain distance to be spaced apart along the optical axis by the second portion 151b of the base 150 between the uppermost end of the connection member W and the second frame 152 or between the uppermost end of the connection member W and the filter unit 140. This will be described in more detail below.

[0173] At the same time, the embodiment can be screw-free connected to the lens barrel 120 and the coil frame 132 of the lens driving device 130. That is, since a high-performance camera module is required to connect the lens barrel 120 and the coil frame 132, the present embodiment uses a screw-free connection method that can minimize the error range of optical axis alignment.

[0174] The screwless connection method may refer to a method of fixing the lens barrel 120 to the bobbin 132 using the adhesive portion 190 while inserting the lens barrel 120 into the hollow portion of the bobbin 132 from the upper side or the lower side.

[0175] That is, bonding part 190 can be arranged between the inner surface of coil frame 132 and the outer surface of lens barrel 120. Bonding part 190 can firmly fix lens barrel 120 to coil frame 132. Bonding part 190 can include thermosetting epoxy or UV epoxy. When bonding part 190 is realized with thermosetting epoxy, bonding part 190 can be cured in an oven, and different from this, bonding part 190 can be cured by directly applying heat to bonding part 190. In addition, when bonding part 190 is realized with UV epoxy, embodiments can cure bonding part 190 by applying ultraviolet rays.

[0176] In addition, bonding part 190 can be realized with epoxy resin mixed with heat curing and ultraviolet curing. For example, bonding part 190 can be epoxy resin that can not only heat cure but also ultraviolet cure. Meanwhile, bonding part 190 of embodiment is not limited to epoxy resin, and any adhesive material that can fix lens barrel 120 to coil frame 132 can be replaceable.

[0177] Hereinafter, the optical filter module will be described in detail.

[0178] The optical filter module may include a base 150 and an optical filter unit 140 coupled to the base 150. For example, the optical filter module may refer to a configuration in which the optical filter unit 140 is coupled to the base 150.

[0179] Figure 5 is an exploded perspective view of an optical filter module according to an embodiment, Figure 6 is a plan view of an optical filter module according to an embodiment, Figure 7 is an exploded perspective view of a base according to an embodiment, Figure 8 is an enlarged view of a partial area of ​​a base according to an embodiment, Fig. 9 is a first enlarged view of a partial area of ​​a first frame of a base according to an embodiment, Fig.10 is a second enlarged view of a partial area of ​​the first frame of the base according to an embodiment, Fig.11 is a cross-sectional view of the optical filter module according to the embodiment taken along line AA′, and Fig.12 is a combined view of a filter module and a circuit board according to an embodiment. In addition, Figure 6 (a) is a plan view of the filter module viewed from above (eg, where a lens is provided), and Figure 6 (b) is a plan view of the filter module viewed from below (eg, where a sensor is provided).

[0180] Reference Figures 5 to 12 , the optical filter module includes an optical filter unit 140 and a base 150 on which the optical filter unit 140 is mounted.

[0181] The filter unit 140 includes a filter 141 and a blocking member 142 disposed on one surface of the filter 141 .

[0182] The filter 141 may include an upper surface facing the lens 110 and a lower surface facing the sensor 180 .

[0183] In addition, the blocking member 142 may be disposed on the upper surface of the optical filter 141. The blocking member 142 may be partially disposed on the upper surface of the optical filter 141. Preferably, the blocking member 142 may be selectively disposed in an edge region of the upper surface of the optical filter 141. For example, the blocking member 142 may include an opening (not shown) that opens a central region of the upper surface of the optical filter 141. For example, the blocking member 142 may open an area of ​​the upper surface of the optical filter 141 that overlaps with the sensor 180 on the optical axis. The blocking member 142 may be attached to or coupled to the upper surface of the optical filter 141. The blocking member 142 may be formed by applying an opaque material to the upper surface of the optical filter 141. The blocking member 142 may be formed by attaching an opaque film to the upper surface of the optical filter 141.

[0184] The base 150 is disposed below the filter unit 140. The base 150 includes a mounting portion on which the filter unit 140 is disposed or mounted.

[0185] Before explaining the embodiment of the present invention, a comparative example (prior art) will be explained as follows. The base in the comparative example is an injection molded product made using resin. That is, the base in the comparative example includes only an insulating material such as resin.

[0186] The base of the comparative example is an injection product made of resin. That is, the base of the prior art includes only insulating materials, such as resin. In this case, the base of the comparative example includes a mounting portion such as a window in which the filter unit is mounted, a first protrusion protruding downward from the lower surface of the mounting portion, and a second protrusion protruding upward from the upper surface of the mounting portion. The first protrusion of the base of the prior art separates the mounting portion of the base from the circuit board at a predetermined interval. For example, a connecting member (wire) electrically connecting the sensor and the circuit board protrudes a predetermined protrusion height (t1) from the upper surface of the circuit board toward the lens 110. Therefore, the first protrusion is formed to have a predetermined thickness so that the filter unit mounted on the mounting portion does not contact the connecting member. In this case, the protrusion height (t1) exceeds 150μm. For example, the protrusion height (t1) exceeds 170μm. Therefore, the thickness of the first protrusion of the base of the comparative example exceeds 150μm. For example, the thickness of the first protrusion of the base of the comparative example exceeds 170μm.

[0187] Meanwhile, the mounting portion of the base of the comparative example has a predetermined thickness. In this case, the thickness of the mounting portion can be determined by the size of the filter. The thickness of the mounting portion of the comparative example is about 180 μm. In recent years, the size of sensors is increasing, and therefore, the size of filters is also increasing. In addition, when the thickness of the above-mentioned mounting portion must be 180 μm or more, large-sized filters can be stably mounted. For example, when the thickness of the above-mentioned mounting portion must be 180 μm or more, the flatness of the filter can be maintained (or the warpage performance can be improved). This is because the base of the comparative example is an injection product of an insulating material, and therefore, the mounting portion is also an injection product formed of an insulating material. In addition, if the thickness of the mounting portion of the comparative example is less than 180 μm, injection defects such as non-molding of the mounting portion may occur in the process of manufacturing the base by injection. In addition, if the thickness of the mounting portion of the comparative example is less than 180 μm, injection defects in which burrs appear during injection may occur in the process of manufacturing the base by injection. Therefore, the mounting portion of the comparative example has a thickness of at least 180 μm.

[0188] Meanwhile, the second protrusion of the base of the comparative example has a predetermined thickness. The thickness of the second protrusion is determined by the injection performance of the base manufactured by injection. For example, if the total thickness of the base including the second protrusion becomes thinner, the extractability may deteriorate during the extraction of the injection product from the injection mold. For example, if the total thickness of the base including the second protrusion becomes thinner, deformation may occur during the extraction of the injection product from the injection mold. Therefore, the total thickness of the base of the comparative example is 720 μm. For example, if the total thickness of the base is less than 720 μm, injection defects such as reduced extractability and deformation may occur. Therefore, the thickness of the second protrusion is 390 μm.

[0189] As described above, in the comparative example, the base is manufactured using only an insulating material such as a resin. Therefore, because injection defects must be considered in the comparative example, there is a limit to reducing the total thickness of the base and the thickness of the window. In addition, by using a base injected with an insulating material, it may not be possible to stably mount a larger filter unit. For example, in the comparative example, there is a limit to increasing the width of the base in response to an increase in the size of the sensor and the filter unit.

[0190] Meanwhile, in the comparative example, as described above, the FBL corresponding to the optical axis distance between the sensor and the lens increases due to the thickness of each portion of the base. For example, in the comparative example, due to the limitation of the minimum thickness of each of the first protrusion, the mounting portion, and the second protrusion, the FBL (flange back focus) has a minimum level of 1.1.

[0191] In this case, since the thickness of the first protrusion in the prior art is determined by the protruding height (t1) of the connecting member, it may be difficult to reduce the thickness of the first protrusion in the prior art. However, under the condition of improving the injection defect or improving the warping characteristics of the filter, the thickness of the mounting portion and the thickness of the second protrusion (for example, the total thickness of the base) can be reduced.

[0192] Therefore, unlike the comparative example, the embodiment reduces the thickness of the mounting portion, the thickness of the second protrusion, and further reduces the total thickness of the base by changing the material constituting the base 150. Thus, the embodiment reduces FBL (Flange Back Focus) compared to the comparative example.

[0193] To this end, as briefly described above, base 150 is formed from a variety of materials.

[0194] Specifically, the base 150 includes a first frame 151 and a second frame 152. The first frame 151 may be formed of the same material as the base of the comparative example. For example, the first frame 151 may be formed of an insulating material.

[0195] The second frame 152 includes a material different from the first frame 151 or the base of the comparative example. Preferably, the second frame 152 includes a metal material. The second frame 152 ensures the rigidity of the base 150 while maintaining the flatness of the filter unit 140 mounted on the base 150. To this end, the second frame 152 may be formed of a metal material having a certain rigidity.

[0196] At this time, the first frame 151 and the second frame 152 may not be separately manufactured through separate processes and then combined, but may be manufactured as a single unit through double injection or insert injection.

[0197] To briefly explain the manufacturing method, in an embodiment, the second frame 152 is provided in an injection mold. In an embodiment, in a state where the second frame 152 is provided, an insulating material is injected into the upper and lower portions of the second frame 152, thereby forming the first frame 151 covering the second frame 152. Therefore, the second frame 152 can be inserted into the first frame 151.

[0198] At this time, the second frame 152 can perform the function of the mounting portion of the base of the comparative example. That is, in the embodiment, the mounting portion on which the filter unit 140 is fixed is formed of a metal material. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the mounting portion. For example, the thickness of the second frame 152 in the embodiment can be less than the thickness of the mounting portion of the comparative example. In addition, the embodiment can respond to the increase in the size of the filter by applying the second frame 152.

[0199] The structures of the first frame 151 and the second frame 152 will be described in detail as follows. Hereinafter, the structure of each frame will be described in a state in which the second frame 152 is separated from the first frame 151.

[0200] The first frame 151 is formed of an insulating material. The first frame 151 may have a planar shape corresponding to the shape of the filter unit 140. For example, the planar shape of the first frame 151 may have a square ring shape, but is not limited thereto. For example, the first frame 151 may have a circular ring shape corresponding to the shape of the lens 110.

[0201] The first frame 151 may be divided into a plurality of parts in the optical axis direction. For example, the first frame 151 may be divided into a first part 151a and a second part 151b in the optical axis direction.

[0202] The first portion 151a may refer to a portion of the first frame 151 positioned adjacent to the lens 110. In addition, the second portion 151b may refer to a portion of the first frame 151 positioned adjacent to the sensor 180. For example, the first portion 151a may be referred to as a first-first frame covering an upper portion of the second frame 152. For example, the second portion 151b may be referred to as a first-second frame covering a lower portion of the second frame 152. In addition, the second portion 151b may be referred to as a protrusion protruding downward from the first portion 151a. In addition, the second portion 151b may be referred to as a separation portion, which spaces the second frame 152 upward relative to the circuit board 160 corresponding to the protruding height (t1) of the connecting member W.

[0203] In addition, the second portion 151b may be referred to as a receiving portion or a recessed portion that accommodates the protruding portion of the connection member W. Therefore, the thickness of the second portion 151b may correspond to the protruding height (t1) of the connection member W. For example, the thickness (T2) of the second portion 151b may satisfy the range of 150 μm to 250 μm. If the thickness (T2) of the second portion 151b is less than 150 μm, physical or electrical reliability problems may occur in the operating environment of the camera module. For example, if the thickness (T2) of the second portion 151b is less than 150 μm, a problem may occur that the filter unit 140 disposed on the second frame 152 contacts the connection member W. In addition, if the filter unit 140 contacts the connection member W, an electrical short circuit may occur between the sensor 180 and the circuit substrate 160. In addition, if the thickness (T2) of the second portion 151b exceeds 250 μm, the total thickness (T1) of the base 150 may be increased by the thickness of the second portion 151b. In addition, if the total thickness ( T1 ) of the base 150 increases, the FBL (Flange Back Focus) of the camera module according to the embodiment may increase.

[0204] The first portion 151a of the first frame 151 is positioned on the second portion 151b. The first portion 151a of the first frame 151 may protect the filter unit 140 mounted on the second frame 152. For example, the first portion 151a of the first frame 151 may protrude a certain height from the upper surface of the second frame 152. The first portion 151a of the first frame 151 may be disposed to surround the periphery of the filter unit 140 mounted on the second frame 152. For example, the first portion 151a of the first frame 151 may be disposed to surround the side surface of the second frame 152 at a position spaced apart from the side surface of the second frame 152 by a predetermined distance.

[0205] Meanwhile, the second portion 151b may be formed with a predetermined width on the lower surface of the first portion 151a. For example, the width of the second portion 151b may have a range of 350 μm to 700 μm. If the width of the second portion 151b is less than 350 μm, the rigidity of the base 150 may be degraded. If the width of the second portion 151b is less than 350 μm, the injection performance may be degraded. For example, if the width of the second portion 151b is less than 350 μm, the opening area may exist in at least a portion of the second portion 151b where the insulating material is not filled during the injection process. If the width of the second portion 151b exceeds 700 μm, the area of ​​the base 150 may be increased by the width of the second portion 151b. Therefore, the volume of the camera module may increase. Therefore, the embodiment sets the width of the second portion 151b to 350 μm to 700 μm.

[0206] Meanwhile, the first frame 151 may include a first opening 151-1. The first opening 151-1 of the first frame 151 may overlap with the filter unit 140 along the optical axis. At this time, the area of ​​the first opening 151-1 of the first frame 151 may be greater than the area of ​​the filter unit 140. For example, the first opening 151-1 of the first frame 151 may include a first region overlapping with the filter unit 140 along the optical axis. For example, the first opening 151-1 of the first frame 151 may include a second region overlapping with the second frame 152 along the optical axis and not overlapping with the filter unit 140 along the optical axis.

[0207] The first frame 151 may include a receiving portion 151-4. The receiving portion 151-4 may be formed from the inner surface of the first opening 151-1 of the first frame 151 toward the outside. The receiving portion 151-4 may be formed between the first portion 151a and the second portion 151b of the first frame 151. The receiving portion 151-4 may be said to be an insertion groove or an insertion hole into which the second frame 152 is inserted.

[0208] The receiving portion 151-4 may be divided into a plurality of parts. For example, the receiving portion 151-4 may include a recessed portion 151-4a in a groove shape that is recessed in an outward direction from the inner surface of the first frame 151. In addition, at least a portion of the second frame 152 may be inserted into the recessed portion 151-4a of the receiving portion 151-4 of the first frame 151.

[0209] In addition, the receiving portion 151-4 may include a hole portion 151-4b connected to the concave portion 151-4a. The hole portion 151-4b may have a hole shape that penetrates the inner and outer surfaces of the first frame 151. At least a portion of the second frame 152 is disposed in the hole portion 151-4b of the receiving portion 151-4. Therefore, at least a portion of the second frame 152 may be exposed toward the outer surface of the first frame 151. The hole portion 151-4b may be formed in the process of manufacturing the base 150 including the first frame 151 and the second frame 152 by double injection or insert injection. For example, the embodiment may manufacture a plurality of bases at the same time. For example, the embodiment may perform a process of injecting an insulating material to inject a first frame in a state where a plurality of second frames connected to each other are prepared. In addition, the hole portion 151-4b may be a portion where the second frames of different bases are connected to each other during the injection process. In addition, the hole portion 151-4b may be a hole for separating (e.g., cutting) the second frames of different bases from each other after the injection process is completed.

[0210] The first frame 151 includes a partition wall portion 151-5. The partition wall portion 151-5 may be formed in the receiving portion 151-4 of the first frame 151. For example, the partition wall portion 151-5 may be disposed between the upper surface and the lower surface of the receiving portion 151-4 of the first frame 151. The partition wall portion 151-5 may divide the receiving portion 151-4 of the first frame 151 into a plurality of regions. The partition wall portion 151-5 may have a function of improving the rigidity of the first frame 151. In addition, the partition wall portion 151-5 may improve the bonding strength of the first frame 151 and the second frame 152. For example, at least a portion of the partition wall portion 151-5 may penetrate the second frame 152. In addition, at least a portion of the second frame 152 may be bonded to the partition wall portion 151-5. Therefore, the bonding strength may be increased by injection molding the first frame 151 and the second frame 152.

[0211] The first frame 151 may include a through hole 151-2. The through hole 151-2 may penetrate the upper surface and the lower surface of the first frame 151. For example, the through hole 151-2 may penetrate the first part 151a and the second part 151b of the first frame 151. For example, the through hole 151-2 may be connected to the receiving part 151-4 of the first frame 151. The through hole 151-2 may be a vent hole for improving reliability during an injection process or a bonding process. For example, the through hole 151-2 may remove gas during an injection process for manufacturing a base 150 including the first frame 151 and the second frame 152. Therefore, the embodiment may improve the injectability and extractability of the base 150. In addition, the through hole 151-2 may remove gas during the process of bonding or fixing the base 150 to the circuit board 160. Therefore, the embodiment may improve the bonding strength between the circuit board 160 and the base 150.

[0212] The first frame 151 may include a recess 151-3. The recess 151-3 may be formed in the first portion 151a of the first frame 151. For example, the recess 151-3 may also be referred to as a through hole that penetrates the first portion 151a of the first frame 151. The recess 151-3 is formed in the first portion 151a of the first frame 151, but not in the second portion 151b. The recess 151-3 may be an injection hole for injecting insulating material during insertion injection or dual injection. In addition, the recess 151-3 may also be used as a gas passage hole for removing gas during insertion injection or dual injection. In addition, the recess 151-3 may be communicated with the receiving portion 151-4. Therefore, at least a portion of the second frame 152 inserted into the receiving portion 151-4 may be exposed to the upper side of the base 150 through the recess 151-3.

[0213] The second frame 152 is received in the receiving portion 151-4 of the first frame 151. For example, the second frame 152 may be double-injected or insert-injected to be received in the receiving portion 151-4 of the first frame 151.

[0214] The second frame 152 may have a shape corresponding to the first frame 151. For example, the planar shape of the second frame 152 may correspond to the planar shape of the first frame 151. For example, the planar shape of the second frame 152 may be a square shape. However, the embodiment is not limited thereto, and the planar shape of the second frame 152 may have a circular shape, etc.

[0215] The second frame 152 may include a second opening 152-1. The second opening 152-1 may overlap the first opening 151-1 of the first frame 151 along the optical axis. The second opening 152-1 may overlap the lens 110 along the optical axis. The second opening 152-1 may overlap the sensor 180 along the optical axis. The second opening 151-1 may overlap the filter unit 140 along the optical axis.

[0216] At this time, the area of ​​the second opening 152-1 of the second frame 152 may be smaller than the area of ​​the first opening 151-1 of the first frame 151. In addition, the area of ​​the second opening 152-1 of the second frame 152 may be smaller than the area of ​​the filter unit 140. Therefore, a portion of the filter unit 140 may overlap with the second opening 152-1 of the second frame 152 along the optical axis. In addition, the remaining portion of the filter unit 140 may overlap with the second frame 152 along the optical axis. That is, at least a portion of the filter 141 of the filter unit 140 may overlap with the second opening 152-1 of the second frame 152 along the optical axis while being mounted on the upper surface of the second frame 152.

[0217] The second frame 152 may include a plurality of through holes.

[0218] For example, the second frame 152 may include a first through hole 152 - 2 and a second through hole 152 - 3 .

[0219] The first through-hole 152 - 2 and the second through-hole 152 - 3 of the second frame 152 may penetrate the upper and lower surfaces of the second frame 152 .

[0220] At this time, the first through hole 152 - 2 and the second through hole 152 - 3 may have different shapes or opening areas.

[0221] For example, the first through hole 152-2 may not be connected to the outer surface of the second frame 152. Therefore, the first through hole 152-2 may penetrate the second frame 152 at a position spaced a certain distance from the outer surface of the second frame 152.

[0222] The second through hole 152-3 may be connected to the outer surface of the second frame 152. For example, the second through hole 152-3 may also be referred to as a concave portion that is concave inward from the outer surface of the second frame 152.

[0223] One of the first through hole 152-2 and the second through hole 152-3 may overlap with the through hole 151-2 of the first frame 151 along the optical axis. Therefore, at least one of the first through hole 152-2 and the second through hole 152-3 of the second frame 152 may function as an air passage hole through which air passes.

[0224] In addition, the other of the first through hole 152-2 and the second through hole 152-3 may be a hole through which the partition wall portion 151-5 of the first frame 151 passes. For example, the partition wall portion 151-5 of the first frame 151 may pass through the first through hole 152-2 or the second through hole 152-3 of the second frame 152.

[0225] Meanwhile, the embodiment is not limited thereto, and at least one of the first through holes 152-2 may overlap with the through hole 151-2 of the first frame 151 along the optical axis, and at least another of the first through holes 152-2 may overlap with the partition wall portion 151-5 along the optical axis. Correspondingly, at least one of the second through holes 152-3 may overlap with the through hole 151-2 of the first frame 151 along the optical axis, and at least another of the second through holes 152-3 may overlap with the partition wall portion 151-5 along the optical axis.

[0226] The second frame 152 may have a certain thickness ( T3 ). For example, the second frame 152 may have a thickness capable of stably mounting the filter unit 140 while maintaining the flatness of the filter unit 140 .

[0227] At this time, the mounting portion of the comparative example is formed by injection molding of an insulating material. Therefore, the thickness of the mounting portion of the comparative example exceeds 180 μm.

[0228] In contrast, the embodiment uses double injection or insertion injection so that the mounting portion of the filter unit 140 is formed of a metal material. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the second frame 152 corresponding to the mounting portion. For example, the thickness (T3) of the second frame 152 in the embodiment can be 160 μm or less. For example, the thickness (T3) of the second frame 152 in the embodiment can be 150 μm or less. For example, the thickness (T3) of the second frame 152 in the embodiment can be 140 μm or less. For example, the thickness (T3) of the second frame 152 in the embodiment can be 130 μm or less. For example, the thickness (T3) of the second frame 152 in the embodiment can be 120 μm or less. For example, the thickness (T3) of the second frame 152 in the embodiment can be 110 μm or less.

[0229] Preferably, the thickness (T3) of the second frame 152 in the embodiment may satisfy the range of 95 μm to 160 μm. For example, the thickness (T3) of the second frame 152 in the embodiment may satisfy the range of 98 μm to 155 μm. For example, the thickness (T3) of the second frame 152 in the embodiment may satisfy the range of 100 μm to 150 μm.

[0230] If the thickness (T3) of the second frame 152 is less than 95 μm, the rigidity of the base 150 may be deteriorated. In addition, if the thickness (T3) of the second frame 152 is less than 95 μm, the injectability or extractability during the injection process may be deteriorated due to the reduction of the total thickness (T1) of the first frame 151. In addition, if the thickness (T3) of the second frame 152 is less than 95 μm, the flatness of the filter unit 140 mounted on the second frame 152 may be reduced.

[0231] In addition, if the thickness ( T3 ) of the second frame 152 exceeds 160 μm, the FBL (Flange Back Focus) may increase in response to the increase in the thickness of the second frame 152 .

[0232] Meanwhile, the embodiment may reduce the overall thickness ( T1 ) of the base 150 by injecting the base 150 to have a structure including the second frame 152 , as compared to the comparative example.

[0233] For example, the embodiment can reduce the thickness of the first portion 151a of the first frame 151 corresponding to the second protrusion of the comparative example. That is, in the embodiment, since the injection process is performed with the second frame 152 inserted, there is no problem of injectability or extractability even if the thickness of the first frame 151 is reduced compared to the comparative example. Therefore, the embodiment can reduce the thickness of the first frame 151, especially the thickness of the first portion 151a of the first frame 151.

[0234] Therefore, the total thickness (T1) of the base 150 in the embodiment may have a range of 350 μm to 550 μm. That is, the total thickness of the base in the comparative example is about 720 μm. In addition, the embodiment may reduce the total thickness (T1) of the base 150 to 48% to 76% of the thickness of the base in the comparative example. Therefore, the embodiment may reduce the FBL (flange back focus). In addition, the embodiment may reduce the total thickness or volume of the camera module.

[0235] Specifically, when the base 150 including the first frame 151 and the second frame 152 is applied in the embodiment, the FBL (Flange Back Focus) may be reduced to a level of 0.95.

[0236] Meanwhile, the second frame 152 may include a coating (not shown). For example, the second frame 152 is formed of a metal material. In addition, at least a portion of the second frame 152 may not overlap with the blocking member 142 of the filter unit 140 on the optical axis. Therefore, the problem of light passing through the lens 110 and the filter unit 140 being reflected at the second frame 152 may occur. In addition, when light is reflected by the second frame 152, a flare phenomenon may occur. Therefore, the second frame 152 includes a coating to prevent reflection of light. For example, the second frame 152 may include a blackening coating, but is not limited thereto. For example, the material of the coating applied to the second frame 152 may include any material having a performance of suppressing light reflection.

[0237] Meanwhile, the second frame 152 includes a metal material and thus may affect the operation of the lens driving device of the embodiment. For example, the second frame 152 may cause magnetic interference. For example, the second frame 152 may cause interference in the interaction of the coil or magnet of the lens driving device.

[0238] Therefore, the second frame 152 in the embodiment may be formed of a non-magnetic metal material. However, the embodiment is not limited thereto, and the second frame 152 may be formed of a metal material having a magnetic value that does not cause magnetic interference.

[0239] The camera module of the embodiment includes a base on which a filter unit is installed. At this time, the base includes a plurality of frames made of different materials. For example, the base includes a first frame made of a first material and a second frame made of a second material. At this time, the first material includes an insulating material. In addition, the second material includes a metal material different from the first material. The second frame is used as a mounting portion on the base for mounting the filter unit. Therefore, by making the mounting portion on which the filter unit is mounted be made of a metal material, the embodiment can stably mount the filter unit on the base. In addition, the embodiment can improve the flatness of the filter unit mounted on the base.

[0240] At the same time, due to the demand for high resolution, the size of the sensor increases, and the size of the filter unit also increases accordingly. At this time, there is a limit to the size of the filter unit that can be installed on the mounting part of the insulating material injected with the comparative example. Different from this, the embodiment has a second frame corresponding to the mounting part formed by the metal material. Therefore, the embodiment can provide a base that can respond to the increase in the size of the filter unit. In addition, compared with the comparative example, the embodiment can increase the size of the filter unit that can be installed while maintaining the flatness of the filter unit.

[0241] In addition, compared with the comparative example, the embodiment can reduce the thickness of the second frame. Specifically, since the comparative example must consider the non-molding problem during the injection process, the mounting portion must have a certain thickness or greater. Different from this, the embodiment does not have to consider the non-molding problem of the second frame corresponding to the mounting portion. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the second frame corresponding to the mounting portion. That is, the embodiment can reduce the thickness of the second frame while maintaining the flatness of the filter unit. Therefore, the embodiment can reduce the FBL (flange back focus) to correspond to the reduction in the thickness of the second frame. Therefore, the embodiment can reduce the overall thickness or volume of the camera module.

[0242] In addition, the embodiment allows the first frame to be injected while the second frame is inserted. Therefore, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding thereto. For example, the comparative example needs to consider the injectability and extractability issues. Therefore, the comparative example has limitations on the reduction of the total thickness of the base. Alternatively, the embodiment performs injection while the second frame is inserted. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding to the thickness of the first frame. Therefore, the embodiment can reduce the FBL (flange back focus). In addition, the embodiment can reduce the total thickness or volume of the camera module.

[0243] Meanwhile, the second frame in the embodiment includes a black coating. The coating prevents light passing through the lens and the filter from being reflected by the second frame. Therefore, the embodiment can improve the image quality of the camera module.

[0244] Fig.13 is a perspective view of a portable terminal 200A according to an embodiment, and Fig.14 yes Fig.13 A configuration diagram of a portable terminal shown in FIG.

[0245] Reference Fig.13 and Fig.14 The portable terminal (200A, hereinafter referred to as “terminal”) may include a main body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a control unit 780 and a power supply unit 790.

[0246] Fig.13 The body 850 shown in FIG. 8 is in the form of a bar, but is not limited thereto, and may have various structures such as a sliding type, a folding type, a swing type, a rotation type in which two or more sub-bodies are coupled to be movable relative to each other.

[0247] The body 850 may include a shell (housing, housing, cover, etc.) forming the exterior. For example, the body 850 may be divided into a front shell 851 and a rear shell 852. Various electronic components of the terminal may be embedded in a space formed between the front shell 851 and the rear shell 852.

[0248] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and a network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless network module 713, a short-range communication module 714, and a location information module 715.

[0249] The A / V (audio / video) input unit 720 is used to input an audio signal or a video signal, and may include a camera 721 , a microphone 722 , and the like.

[0250] The camera 721 may include Figure 1 A camera module of the illustrated embodiment.

[0251] The sensing unit can detect the current state of the terminal 200A, such as the open / closed state of the terminal 200A, the position of the terminal 200A, the presence or absence of user contact, the orientation of the terminal 200A, the acceleration / deceleration of the terminal 200A, etc. In addition, a sensing signal for controlling the operation of the terminal 200A is generated. For example, when the terminal 200A is in the form of a slide phone, it can be sensed whether the slide phone is opened or closed. In addition, the sensing unit is responsible for sensing functions related to whether the power supply unit 790 is powered, whether the interface unit 770 is coupled to an external device, etc.

[0252] The input / output unit 750 is used to generate input or output related to vision, hearing or touch. The input / output unit 750 can generate input data for operation control of the terminal 200A, and can also display information processed by the terminal 200A.

[0253] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 may generate input data in response to a keyboard input.

[0254] The display module 751 may include a plurality of pixels whose colors change according to the electrical signal. For example, the display module 751 may include at least one of a liquid crystal display, a thin film transistor liquid crystal display, an organic light emitting diode, a flexible display, and a three-dimensional display (3D display).

[0255] The sound output module 752 may output audio data received from the wireless communication unit 710 ; or audio data stored in the memory unit 760 in call signal reception, call mode, recording mode, voice recognition mode, broadcast reception mode, or the like.

[0256] The touch screen panel 753 may convert a change in capacitance generated by a user's touch on a specific area of ​​the touch screen into an electric input signal.

[0257] The memory unit 760 may store programs for processing and control of the controller 780, and may temporarily store input / output data (e.g., phonebook, messages, audio, still images, photos, videos, etc.). For example, the memory unit 760 may store images captured by the camera 721, such as photos or dynamic pictures.

[0258] The interface unit 770 is used as a path for connecting to an external device connected to the terminal 200A. The interface unit 770 receives data from the external device, receives power and sends the power to each component inside the terminal 200A, or sends the data of the terminal 200A to the external device. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device with an identification module, and an audio I / O (input / output) port, a video I / O (input / output) port, and a headset port, etc.

[0259] The controller (controller, 780) can control the overall operation of the terminal 200A. For example, the controller 780 can perform related control and processing for voice calls, data communications, video calls, etc.

[0260] The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the controller 180 or may be implemented separately from the controller 780.

[0261] The controller 780 may perform a pattern recognition process capable of recognizing a handwriting input or a picture drawing input performed on the touch screen as characters and images, respectively.

[0262] The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power required for the operation of each component.

[0263] The camera module of the embodiment includes a base on which a filter unit is installed. At this time, the base includes a plurality of frames made of different materials. For example, the base includes a first frame made of a first material and a second frame made of a second material. At this time, the first material includes an insulating material. In addition, the second material includes a metal material different from the first material. The second frame is used as a mounting portion on the base for mounting the filter unit. Therefore, by making the mounting portion on which the filter unit is mounted be made of a metal material, the embodiment can stably mount the filter unit on the base. In addition, the embodiment can improve the flatness of the filter unit mounted on the base.

[0264] At the same time, due to the demand for high resolution, the size of the sensor increases, and the size of the filter unit also increases accordingly. At this time, there is a limit to the size of the filter unit that can be installed on the mounting part of the insulating material injected with the comparative example. Different from this, the embodiment has a second frame corresponding to the mounting part formed by the metal material. Therefore, the embodiment can provide a base that can respond to the increase in the size of the filter unit. In addition, compared with the comparative example, the embodiment can increase the size of the filter unit that can be installed while maintaining the flatness of the filter unit.

[0265] In addition, compared with the comparative example, the embodiment can reduce the thickness of the second frame. Specifically, since the comparative example must consider the non-molding problem during the injection process, the mounting portion must have a certain thickness or greater. Different from this, the embodiment does not have to consider the non-molding problem of the second frame corresponding to the mounting portion. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the second frame corresponding to the mounting portion. That is, the embodiment can reduce the thickness of the second frame while maintaining the flatness of the filter unit. Therefore, the embodiment can reduce the FBL (flange back focus) to correspond to the reduction in the thickness of the second frame. Therefore, the embodiment can reduce the overall thickness or volume of the camera module.

[0266] In addition, the embodiment allows the first frame to be injected while the second frame is inserted. Therefore, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding thereto. For example, the comparative example needs to consider the injectability and extractability issues. Therefore, the comparative example has limitations on the reduction of the total thickness of the substrate. Alternatively, the embodiment performs injection while the second frame is inserted. Therefore, compared with the comparative example, the embodiment can reduce the thickness of the first frame and the total thickness of the base corresponding to the thickness of the first frame. Therefore, the embodiment can reduce the FBL (flange back focus). In addition, the embodiment can reduce the total thickness or volume of the camera module.

[0267] Meanwhile, the second frame in the embodiment includes a black coating. The coating prevents light passing through the lens and the filter from being reflected by the second frame. Therefore, the embodiment can improve the image quality of the camera module.

[0268] In addition, the second frame in the embodiment is formed of a non-magnetic material. Therefore, the embodiment can solve the problem that the operating characteristics of the sensor drive device are degraded by the second frame. For example, when the second frame includes a magnetic material, magnetic interference may occur in the interaction between the coil and the magnet of the sensor drive device. In addition, the operating characteristics of the sensor drive device may be degraded by magnetic interference. Different from this, the second frame in the embodiment includes a non-magnetic material. Therefore, the embodiment can achieve the effect of maintaining the flatness of the filter unit and reducing the FBL without affecting the operating characteristics of the sensor drive device.

[0269] Although the embodiments of the present invention have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that the present invention may be implemented in other specific forms without modifying the technical spirit and basic features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative and not restrictive in all aspects.

Claims

1. A camera module, comprising: base; as well as a filter unit, the filter unit being disposed on the base; Wherein, the base comprises: a first frame comprising an insulating material; and a second frame, the second frame being inserted into the first frame and comprising a metal material, Wherein, the filter unit is arranged on the second frame of the base.

2. The camera module according to claim 1, wherein: The second frame is coupled to the first frame by an insertion injection method.

3. The camera module according to claim 1, wherein: The first frame includes a first opening, and The second frame includes a second opening overlapping the first opening along the optical axis, and the second frame is inserted into an inner surface of the first opening of the first frame.

4. The camera module according to claim 3, wherein: An area of ​​the second opening is smaller than an area of ​​the first opening and an area of ​​the filter unit.

5. The camera module according to claim 3, wherein: The first frame includes a receiving portion into which the second frame is inserted, Wherein, the receiving part comprises: a concave portion formed in an outward direction from an inner surface of the first frame; and A hole portion penetrates the inner surface and the outer surface of the first frame.

6. The camera module according to claim 5, wherein: The first frame includes a partition wall portion that divides the receiving portion into a plurality of areas, and wherein the partition wall portion penetrates the second frame inserted into the receiving portion.

7. The camera module according to any one of claims 1 to 6, further comprising: Reinforcement plate; a circuit board disposed on the reinforcing plate and comprising a cavity; a sensor disposed on an upper surface of the reinforcing plate vertically overlapping the cavity of the circuit board and disposed in the cavity of the circuit board; as well as a connecting member connected between a terminal of the sensor and a pad of the circuit board, and Wherein, the uppermost end of the connecting member is positioned higher than the upper surface of the circuit board.

8. The camera module according to claim 7, wherein: The first frame includes a first portion and a second portion, the first portion is positioned above the second frame based on a position of being inserted into the second frame, the second portion is positioned below the second frame based on the position, and The second frame is spaced apart from the uppermost end of the connecting member in the optical axis direction by the second portion of the first frame.

9. The camera module according to claim 8, wherein: The thickness of the second portion of the first frame satisfies the range of 150 μm to 250 μm.

10. The camera module according to any one of claims 1 to 6, wherein: The base includes a through hole penetrating the first frame and the second frame.

Images