Array laser increase-measurement-decrease multi-field collaborative composite manufacturing system

Abstract

The invention provides an array laser increase-measurement-reduction multi-field collaborative composite manufacturing system which comprises a forming chamber, a forming cylinder, a powder supply cylinder, a powder laying mechanism, a cooling system and an atmosphere system and further comprises an array laser area printing module, an array laser area measurement module, an array laser area measurement module and an array laser area measurement module. The defect detection image field module is used for carrying out defect monitoring on each sintered and formed layer and identifying defect types and defect positions; the femtosecond laser defect removal material reduction module can scan a femtosecond laser beam at a defect position through a material reduction scanning galvanometer according to the defect, the defect type and the defect position detected by the defect detection image field module, and performs defect in-situ removal according to the defect type, so that the integration of laser material increase, defect detection and defect material reduction removal is realized; and high-efficiency and high-quality component manufacturing is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of laser additive manufacturing, and in particular to an array laser addition-measurement-reduction multi-field collaborative composite manufacturing system. Background Art

[0002] Laser additive manufacturing often has a variety of manufacturing problems such as metallurgical defects and poor molding quality, which affect the structural performance of components. Integrating laser additive, defect detection and defect removal functions to achieve online closed-loop defect removal can improve component forming quality. Developing integrated equipment with regional printing, online monitoring and defect reduction, additive and subtractive process coordination and control, and realizing integrated intelligent control of the entire manufacturing process are important guarantees for high-quality and efficient printing of key components. Summary of the invention

[0003] In view of the defects and shortcomings of the additive and subtractive composite manufacturing systems in the prior art, the purpose of the present invention is to provide a composite manufacturing system that integrates regional additive / online detection / femtosecond defect removal, to achieve the integrated integration of laser additive, defect detection and defect subtractive removal, and the coordination and control of additive and subtractive processes, to provide a reliable implementation plan for high-efficiency regional printing, online defect detection and closed-loop in-situ repair.

[0004] According to the first aspect of the present invention, an array laser addition-measurement-reduction multi-field collaborative composite manufacturing system is proposed, comprising a molding chamber, a molding cylinder, a powder supply cylinder, a powder spreading mechanism and an atmosphere system, characterized in that it also includes:

[0005] The array laser area printing module has an array laser scanning optical system composed of an additive laser and an additive scanning galvanometer, which is installed above the molding chamber. The laser beam is scanned in the molding chamber by the additive scanning galvanometer to sinter the powder laid in the sintering area on the substrate surface of the molding cylinder.

[0006] The defect detection imaging module has four cameras, which are respectively arranged in the molding chamber and located at four upper corners, and are used to monitor defects of each layer of sintering molding and identify defect types and defect locations;

[0007] The femtosecond laser defect removal subtractive module has a femtosecond laser optical system consisting of a femtosecond laser and a subtractive scanning galvanometer, and is installed above the molding chamber. According to the defects detected by the defect detection image field module and the defect type and defect position, the femtosecond laser beam is scanned at the defect position through the subtractive scanning galvanometer, and in-situ defect removal processing is performed according to the defect type;

[0008] The array laser area printing module adopts a galvanometer splicing method to splice the additive scanning galvanometers distributed in a 3*2 array. The sintering of each layer adopts a splicing partition scanning, and six laser beams are scanned in partitions to perform powder sintering molding.

[0009] The femtosecond laser beam emitted by the femtosecond laser of the femtosecond laser defect removal subtractive module enters the subtractive scanning galvanometer via a coupled optical path, and the middle pair of additive scanning galvanometers distributed in the 3*2 array constitute the subtractive scanning galvanometer, realizing scanning galvanometer multiplexing.

[0010] As an optional embodiment, in the array laser scanning optical system, the size of the overlapping area of ​​the six laser beam partition scanning is adjustable.

[0011] As an optional embodiment, for the sintering forming of each layer, the overlapping range thereof is adjustable within the overlapping area.

[0012] As an optional embodiment, the laser beams output by six additive scanning galvanometers that are spliced ​​and distributed in a 3*2 arrangement are formed, and the laser spot formed on the substrate surface fully covers the entire sintering area.

[0013] As an optional embodiment, the middle pair of additive scanning galvanometers multiplexed by the femtosecond laser and the additive laser are only used by one laser in regional additive processing or femtosecond defect removal.

[0014] As an optional embodiment, the additive laser of the array laser area printing module includes two first lasers and six second lasers, and the coupling optical path includes a first coupling optical path and a second coupling optical path; the power of the first laser is greater than the power of the second laser;

[0015] The two first lasers respectively couple the laser beams emitted by the first lasers to a pair of additive scanning galvanometers in the middle of the 3*2 array distribution via the first coupling optical path and the second coupling optical path, thereby forming two fast scanning filling optical paths;

[0016] The six second lasers correspond to additive scanning galvanometers distributed in a 3*2 array and connected through a shaping optical path, respectively, to form six-path area contour fine scanning optical paths.

[0017] As an optional embodiment, the femtosecond laser defect removal subtractive module includes two femtosecond lasers, which respectively couple the laser beams emitted by the femtosecond lasers to a pair of additive scanning galvanometers in the middle of a 3*2 array distribution via a first coupling optical path and a second coupling optical path, thereby forming two femtosecond laser defect removal optical paths.

[0018] As an optional embodiment, the image fields of the four cameras fully cover the interior of the forming chamber, so as to scan and image each layer located in the additive processing area and the subtractive processing area, and monitor the printing quality of each layer.

[0019] As an optional embodiment, according to the defects detected by the defect detection image field module, the defect type and the defect position, a femtosecond laser beam is scanned at the defect position by a subtractive scanning galvanometer, and an in-situ defect removal process is performed according to the defect type, including:

[0020] For the defects and defect locations identified by imaging of any layer, according to the identified defect type, the femtosecond laser beam is scanned at the defect location through a subtractive scanning galvanometer to perform in-situ defect removal processing, where:

[0021] If the defect is identified as a bulge / protrusion defect, the bulge / protrusion is removed by a femtosecond laser beam, and imaging detection is performed again after the defect removal process, so that the bulge / protrusion defect is effectively removed;

[0022] If the defect is identified as a concave defect, a femtosecond laser beam is used for repair, including smooth transition processing of a predetermined area around the concave defect and rescanning and sintering of the concave defect area, and imaging detection is performed again after the defect repair process, so that the concave defect is effectively repaired.

[0023] As an optional embodiment, the judgment criterion for the effective removal of the bulge / protrusion defect is that: the size of the bulge / protrusion position is smaller than a set size threshold;

[0024] The judgment criterion for whether the concave defect is effectively repaired is that the curvature change of the edge of the concave position is less than a set curvature threshold.

[0025] The array laser area printing module of the present invention adopts an array design, for example, a 3*2 distribution, and the six scanning galvanometers are divided in terms of function and layout:

[0026] Two of the scanning galvanometers are connected to high-power lasers to form a filling optical path for rapid scanning and filling of large areas;

[0027] The six scanning galvanometers are connected to six low-power lasers through corresponding shaping optical paths, forming six corresponding laser beam partition scans for fine scanning of the regional contour;

[0028] The two scanning galvanometers arranged in the middle are multiplexed scanning lenses, which are respectively connected to two femtosecond lasers through the coupling optical paths on both sides (the first coupling optical path and the second coupling optical path) for in-situ removal of defects.

[0029] This design can not only improve printing accuracy, but also significantly improve printing efficiency.

[0030] The array laser addition-detection-subtraction multi-field collaborative composite manufacturing system of the above embodiment of the present invention integrates the molding chamber, molding cylinder, powder supply cylinder, powder spreading mechanism, cooling system and atmosphere system with the array laser area printing module, defect detection image field module and femtosecond laser defect removal subtractive module to realize modular collaborative manufacturing of area additive / defect detection / defect removal subtractive, improve the flexibility of the equipment, and each module can respond and switch quickly as needed to improve manufacturing efficiency.

[0031] It should be understood that all combinations of the aforementioned concepts and the additional concepts described in more detail below can be considered as part of the inventive subject matter of the present disclosure as long as such concepts are not mutually inconsistent. In addition, all combinations of the claimed subject matter are considered as part of the inventive subject matter of the present disclosure.

[0032] The foregoing and other aspects, embodiments and features of the present invention can be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the present invention, such as the features and / or beneficial effects of the exemplary embodiments, will be apparent from the following description or learned from the practice of the specific embodiments according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are not intended to be drawn to scale. In the accompanying drawings, each identical or nearly identical component shown in each figure may be represented by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the present invention will now be described by way of example and with reference to the accompanying drawings.

[0034] Figure 1 1 is an overall schematic diagram of an array laser add-measure-subtract multi-field collaborative composite manufacturing system according to an embodiment of the present invention.

[0035] Figure 2 Schematic diagram of an array layout of an array laser area printing module according to an embodiment of the present invention.

[0036] Figure 3 4 is a top view of an array layout of an array laser area printing module according to an embodiment of the present invention.

[0037] Figure 4 Schematic diagram of the area printing optics of the array laser area printing module according to an embodiment of the present invention.

[0038] Figure 5 Schematic diagram of the coverage area of ​​six laser beam partition scanning of the array laser area printing module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to better understand the technical content of the present invention, specific embodiments are given and described as follows in conjunction with the accompanying drawings.

[0040] Various aspects of the present invention are described in this disclosure with reference to the accompanying drawings, in which many illustrative embodiments are shown. The embodiments of the present disclosure are not necessarily intended to include all aspects of the present invention. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed by the present invention are not limited to any implementation. In addition, some aspects disclosed by the present invention can be used alone or in any appropriate combination with other aspects disclosed by the present invention.

[0041] {Example 1}

[0042] Combination Figure 1 to Figure 4 As shown, the array laser additive-measurement-reduction multi-field collaborative composite manufacturing system according to an embodiment of the present invention includes a molding chamber, a molding cylinder, a powder supply cylinder, a powder spreading mechanism, a cooling system and an atmosphere system. The powder spreading mechanism is arranged in the molding chamber, the powder supply cylinder is used to supply powder for additive printing to the molding cylinder, and the powder spreading mechanism spreads the powder and evenly spreads the powder on the substrate surface of the molding cylinder.

[0043] It should be understood that the forming chamber, the forming cylinder, the powder supply cylinder, and the powder spreading mechanism are installed on the main frame to form the main machine of the equipment. The main machine of the equipment is also equipped with an optical path system located above the forming chamber, an atmosphere system connected to the gas path of the forming chamber, a water cooling system for heat dissipation, a powder supply system for supplying powder, a mounting frame for placing the laser assembly, and an electrical control cabinet and other supporting modules, which can be implemented using existing commercial modules.

[0044] In an embodiment of the present invention, the above-mentioned equipment main body and its supporting modules such as the forming chamber, forming cylinder, powder supply cylinder, powder spreading mechanism, atmosphere system, water cooling system, powder supply system, mounting frame and electrical control cabinet can be designed and configured using the existing powder spreading additive manufacturing method.

[0045] In the multi-field collaborative composite manufacturing system design of the embodiment of the present invention, it also includes an array laser area printing module, a defect detection image field module and a femtosecond laser defect removal subtractive module, which are used as main processing modules to realize the sintering molding of powder, defect detection of printing layer and in-situ removal of defects by femtosecond laser, so as to realize the collaborative control of additive and subtractive processing technology and defect detection, and realize high-efficiency, high-quality area printing, integrated and intelligent component manufacturing of online defect detection and closed-loop in-situ repair.

[0046] As an optional embodiment, combining Figure 2-4As shown, the array laser area printing module has an array laser scanning optical system composed of an additive laser and an additive scanning galvanometer, which is installed above the molding chamber. The laser beam is scanned in sections in the molding chamber through the additive scanning galvanometer to sinter and mold the powder spread in the sintering area on the substrate surface of the molding cylinder.

[0047] In an embodiment of the present invention, the powder spreading system is designed to be capable of single / bidirectional powder spreading, is compatible with rigid and soft scrapers, and can adopt a bottom-top powder spreading method to ensure uniform and stable supply of powder.

[0048] For the sintering printing process of each layer, after receiving the printing control instruction, the powder supply cylinder supplies powder to the substrate surface of the forming cylinder according to the preset amount of powder required for printing each layer, and the powder spreading mechanism performs unidirectional or bidirectional powder spreading to evenly spread the powder on the substrate surface of the forming cylinder, and then uses the array laser area printing module to perform multi-laser partition scanning and sintering molding.

[0049] In an embodiment of the present invention, Figure 2-4 As shown, the array laser area printing module adopts the galvanometer splicing and partition scanning method to splice the additive scanning galvanometers distributed in a 3*2 array. The sintering of each layer adopts the splicing method, and six laser beams are scanned in partitions to perform powder sintering molding. Thus, the laser beams output by the six additive scanning galvanometers distributed in a 3*2 splicing distribution are formed, and the laser spot formed on the substrate surface fully covers the entire sintering area.

[0050] The defect detection image field module has four cameras, which are respectively arranged inside the molding chamber and located at the four upper corners. It is used to monitor the defects of each layer of sintering molding and identify the defect type and defect location.

[0051] The image fields of the four cameras fully cover the interior of the forming chamber, so as to scan and image each layer in the additive processing area and the subtractive processing area and monitor the printing quality of each layer.

[0052] In combination with the aforementioned sintering printing process, after each layer is sintered and formed, real-time imaging and defect detection are performed through the defect detection image field module. In an optional embodiment, the defect detection image field module detects and identifies defects on the surface of each layer based on a computer vision detection algorithm, including convex / bulge type defects and concave type defects.

[0053] As an optional embodiment, for each layer of the sintered printed surface, different reflected light intensities and directions will be generated according to the shape and reflection characteristics of the surface. For example, a flat surface and a defective surface (such as convexities and concavities) reflect light differently, which provides a basis for defect identification.

[0054] There are different visual features in the image for convex / bulge type defects and concave type defects. For convex / bulge type defects, the image shows an increase in the height of the local area, showing a difference from the surrounding normal printing surface, such as bright spots or bright areas (because the convex part may reflect light at different angles, resulting in brightness changes). Concave type defects are the opposite, appearing as dark spots or dark areas in the image. This is because the reflection angle of the light in the concave part changes, which reduces the reflected light and has a certain change in surface curvature. Defects are identified and extracted by extracting these brightness, texture, shape and other features.

[0055] As an optional embodiment, the defect detection algorithm used in the present invention can be implemented using an existing algorithm, for example, based on the image captured by the camera, a gradient operator and a neural network model are used to extract the feature information of the image (such as edge features, shape features, etc.), and the feature information is used to judge and identify defects. For example, a threshold-based method can be used to judge whether there is a defect based on a pre-set grayscale threshold, shape parameter threshold, etc. For example, when the grayscale value of a certain area is higher than the grayscale value of the normal surface to a certain extent and the area reaches a certain size, it is judged as a convex / bulge type defect; when the grayscale value is lower than the normal surface and meets the shape characteristics of the concave, it is judged as a concave type defect. At the same time, based on the feature information, quantitative indicators such as the size, depth or height of the defect area can be further determined.

[0056] In another embodiment, a machine learning algorithm can also be used to input the extracted feature vector into a trained defect recognition network model. The defect recognition network model classifies the defect according to the learned pattern and outputs the defect type (convex / bulge type or concave type) and defect degree (such as quantitative indicators such as the size, depth or height of the defect area).

[0057] The identification of defect positions can be achieved based on the coordinate positioning method. The actual physical position of the defect on the print layer surface is determined by the relationship between the two-dimensional coordinate system of the print layer surface and the actual size of the print layer surface, combined with the position of the defect in the image pixel coordinate system.

[0058] As an optional example, the defect location identification process based on coordinate positioning includes:

[0059] First, in the image acquisition stage, a two-dimensional coordinate system is established for the surface of the printed layer, for example, with a fixed point (such as a corner) of the substrate as the origin, and determined by the mapping relationship between the camera imaging principle and the actual position of the printed layer. For example, there is a certain proportional relationship between the pixel coordinates of the camera and the actual physical size of the printed layer. Assuming that the pixel resolution of the camera is m*n and the actual size of the printed layer is x*y, the actual length and width corresponding to each pixel can be calculated accordingly;

[0060] Then, for the defects identified from the image, the actual physical position of the defect on the surface of the printed layer can be further calculated based on the position of the defect in the image pixel coordinate system through the above proportional relationship. For example, the pixel coordinates of the defect in the image are (i, j), the actual length corresponding to each pixel is a, and the width is b, then the actual position coordinates of the defect on the surface of the printed layer are (a*i, b*j).

[0061] In another embodiment, defect location identification can also be based on feature point positioning method or deep learning network model for detection output.

[0062] In an embodiment of the present invention, a femtosecond laser defect removal subtractive module has a femtosecond laser optical system composed of a femtosecond laser and a subtractive scanning galvanometer, which is installed above the molding chamber. According to the defects detected by the defect detection image field module and the defect type and defect position, the femtosecond laser beam is scanned at the defect position through the subtractive scanning galvanometer, and in-situ defect removal processing is performed according to the defect type.

[0063] Combination Figure 2-4 As shown, the femtosecond laser beam emitted by the femtosecond laser of the femtosecond laser defect removal subtractive module enters the subtractive scanning galvanometer via a coupled optical path, and the middle pair of additive scanning galvanometers distributed in the 3*2 array constitute the subtractive scanning galvanometer, realizing scanning galvanometer multiplexing.

[0064] In an embodiment of the present invention, for the defects and defect positions identified by imaging of any layer, according to the identified defect type, the femtosecond laser defect removal subtractive module scans the femtosecond laser beam at the defect position through a subtractive scanning galvanometer to achieve in-situ defect removal subtractive processing.

[0065] After the in-situ defect removal subtractive processing is completed and tested to be qualified, the forming cylinder is moved down one layer according to the additive manufacturing slice model, and the powder printing process is carried out again.

[0066] As an optional embodiment, in the array laser scanning optical system, the size of the overlapping area of ​​the six laser beams scanning by the partitions is adjustable. For the sintering of each layer, the overlapping range is adjustable within the overlapping area.

[0067] Combination Figure 2-4 As shown, the additive laser of the array laser area printing module includes two first lasers and six second lasers, and the coupling optical path includes a first coupling optical path and a second coupling optical path; the power of the first laser is greater than the power of the second laser;

[0068] The two first lasers respectively couple the laser beams emitted by the first lasers to a pair of additive scanning galvanometers in the middle of the 3*2 array distribution via the first coupling optical path and the second coupling optical path, thereby forming two fast scanning filling optical paths;

[0069] The six second lasers are respectively connected to the additive scanning galvanometers distributed in a 3*2 array through their own shaping optical paths, forming six-path area contour fine scanning optical paths.

[0070] It should be understood that the aforementioned shaping optical path is used to shape the laser beam sent through the optical fiber, including, for example, collimation, beam expansion, and beam homogenization of the laser beam, outputting a collimated laser beam with uniform light intensity distribution, coupling it to the corresponding additive scanning galvanometer, and performing beam deflection scanning through the additive scanning galvanometer to achieve powder sintering. The shaping optical path design can be implemented using existing optical path designs, but is not limited to shaping and adjusting the spot size, morphology, and light intensity distribution of the laser beam.

[0071] Combination Figure 2-4 As shown, as an optional embodiment, the femtosecond laser defect removal subtractive module includes two femtosecond lasers, which respectively couple the laser beams emitted by the femtosecond lasers to a middle pair of additive scanning galvanometers distributed in a 3*2 array (entering through their corresponding shaping optical paths) via a first coupling optical path and a second coupling optical path, respectively, to form two femtosecond laser defect removal optical paths.

[0072] It should be understood that in the design of the present invention, the middle pair of additive scanning galvanometers multiplexed by the femtosecond laser and the additive laser are only used by one laser in regional additive processing or femtosecond defect removal.

[0073] As shown in the accompanying drawings, the array laser area printing module of the present invention adopts an array design, for example, six scanning lenses distributed in 3*2, and six scanning galvanometers are divided in terms of function and layout:

[0074] The two scanning galvanometers in the middle are connected to the high-power laser through the first / second coupling optical path to form a filling optical path for fast scanning and filling of large areas;

[0075] The six scanning galvanometers are connected to six low-power lasers through corresponding shaping optical paths, forming six corresponding laser beam partition scans for fine scanning of the regional contour;

[0076] The two scanning galvanometers arranged in the middle constitute a multiplexed scanning galvanometer, which are respectively connected to two femtosecond lasers through coupling optical paths on both sides (the first coupling optical path and the second coupling optical path) for in-situ removal of defects.

[0077] Combination Figure 3 , Figure 4 , Figure 5 As shown, the filling optical path, the contouring optical path (used for fine scanning of area contours) and the femtosecond subtractive optical path (used for in-situ removal of defects) are exemplified.

[0078] Femtosecond subtractive optical path:

[0079] Femtosecond subtractive optical path 1: femtosecond laser A → coupling optical path AC → common dynamic focusing AC;

[0080] Femtosecond subtractive optical path 2: femtosecond laser B → coupling optical path BD → common dynamic focus BD.

[0081] Filling the light path:

[0082] Filling optical path 1: AM laser C (high power, such as 3000W) → coupling optical path AC → common dynamic focusing AC;

[0083] Filling optical path 2: AM laser D (high power, such as 3000W) → coupling optical path BD → common dynamic focus BD.

[0084] Outline light path:

[0085] Outline optical path 1: AM laser E (low power, such as 500W) → single-mode dynamic focus E;

[0086] Outline optical path 2: AM laser F (low power, such as 500W) → single-mode dynamic focus F;

[0087] Outline optical path 3: AM laser G (low power, such as 500W) → single-mode dynamic focus G;

[0088] Outline optical path 4: AM laser H (low power, such as 500W) → single-mode dynamic focus H;

[0089] Outline optical path 5: AM laser P (low power, such as 500W) → coupling optical path AC → common dynamic focusing AC;

[0090] Outline optical path 6: AM laser Q (low power, such as 500W) → coupling optical path BD → common dynamic focus BD.

[0091] Therefore, the first coupling optical path and the second coupling optical path, which are arranged on two symmetrical sides of the scanning galvanometer distributed in the 3*2 array, both adopt a three-input and one-output optical path design.

[0092] For the first coupling optical path, it receives laser beam inputs from femtosecond laser A and two additive lasers (i.e., high-power AM laser C and low-power AM laser P), and outputs to the common dynamic focus AC (i.e., the combined optical path of shaping optical path + scanning galvanometer).

[0093] For the second coupling optical path, it receives laser beam inputs from femtosecond laser B and two additive lasers (i.e., high-power AM laser D and low-power AM laser Q), and outputs to the common dynamic focus BD (i.e., the combined optical path of shaping optical path + scanning galvanometer).

[0094] Furthermore, for the first coupling optical path / the second coupling optical path, optical path switching and coupling output are implemented inside the first coupling optical path / the second coupling optical path, allowing one optical path to be coupled and output at any time.

[0095] As an optional embodiment, two femtosecond lasers, two high-power lasers, and six low-power lasers can be installed in the mounting frame of the laser assembly and connected to each other through optical fibers to guide the laser beam into the optical path system above the forming chamber.

[0096] like Figure 2 , Figure 3 In the example shown, two femtosecond lasers are mounted on the top of the molding chamber through an array-optimized distribution of the workspace, and another two high-power lasers and six low-power lasers are mounted in a mounting frame, each of which is optically connected via an optical fiber.

[0097] As an optional embodiment, according to the defects detected by the defect detection image field module, the defect type and the defect position, a femtosecond laser beam is scanned at the defect position by a subtractive scanning galvanometer, and an in-situ defect removal process is performed according to the defect type, including:

[0098] For the defects and defect locations identified by imaging of any layer, according to the identified defect type, the femtosecond laser beam is scanned at the defect location through a subtractive scanning galvanometer to perform in-situ defect removal processing, where:

[0099] If the defect is identified as a bulge / protrusion defect, the bulge / protrusion is removed by a femtosecond laser beam, and imaging detection is performed again after the defect removal process, so that the bulge / protrusion defect is effectively removed;

[0100] If the defect is identified as a concave defect, a femtosecond laser beam is used for repair, including smooth transition processing of a predetermined area around the concave defect and rescanning and sintering of the concave defect area, and imaging detection is performed again after the defect repair process, so that the concave defect is effectively repaired.

[0101] As an optional embodiment, the judgment criterion for the effective removal of the bulge / protrusion defect is that: the size of the bulge / protrusion position is smaller than a set size threshold;

[0102] The judgment criterion for whether the concave defect is effectively repaired is that the curvature change of the edge of the concave position is less than a set curvature threshold.

[0103] The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system of the above embodiment of the present invention adopts high-precision scanning galvanometer and six-galvanometer splicing technology to achieve full coverage of the entire sintering area by the laser spot, and each layer of sintering adopts splicing, six lasers implement partition scanning, and the size of the overlap area is adjustable to achieve high-precision and high-efficiency sintering. Each layer of sintering is monitored in real time by multiple cameras to identify possible defects and defect types and locations. The defects are efficiently removed and repaired by coupling the femtosecond laser to the multiplexed scanning galvanometer in a targeted manner, and the quality of the sintered layer is improved through closed-loop control of online defect detection and in-situ defect removal by femtosecond laser.

[0104] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. An array laser increase-measurement-reduction multi-field collaborative composite manufacturing system, comprising a molding chamber, a molding cylinder, a powder supply cylinder, a powder spreading mechanism and an atmosphere system, characterized in that: Also includes: The array laser area printing module has an array laser scanning optical system composed of an additive laser and an additive scanning galvanometer, which is installed above the molding chamber. The laser beam is scanned in the molding chamber by the additive scanning galvanometer to sinter the powder laid in the sintering area on the substrate surface of the molding cylinder. The defect detection imaging module has four cameras, which are respectively arranged in the molding chamber and located at four upper corners, and are used to monitor defects of each layer of sintering molding and identify defect types and defect locations; The femtosecond laser defect removal subtractive module has a femtosecond laser optical system consisting of a femtosecond laser and a subtractive scanning galvanometer, and is installed above the molding chamber. According to the defects detected by the defect detection image field module and the defect type and defect position, the femtosecond laser beam is scanned at the defect position through the subtractive scanning galvanometer, and in-situ defect removal processing is performed according to the defect type; The array laser area printing module adopts a galvanometer splicing method to splice the additive scanning galvanometers distributed in a 3*2 array. The sintering of each layer adopts a splicing partition scanning, and six laser beams are scanned in partitions to perform powder sintering molding. The femtosecond laser beam emitted by the femtosecond laser of the femtosecond laser defect removal subtractive module enters the subtractive scanning galvanometer via a coupled optical path, and the middle pair of additive scanning galvanometers distributed in the 3*2 array constitute the subtractive scanning galvanometer, realizing scanning galvanometer multiplexing.

2. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 1 is characterized in that: In the array laser scanning optical system, the size of the overlapping area of ​​the six laser beam partition scanning is adjustable.

3. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 2 is characterized in that: For the sintering forming of each layer, the overlap range is adjustable within the overlap area.

4. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 1, characterized in that: The laser beams output by six additive scanning galvanometers in a 3*2 spliced ​​distribution form a laser spot on the substrate surface that fully covers the entire sintering area.

5. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 1, characterized in that: The middle pair of additive scanning galvanometers multiplexed by the femtosecond laser and the additive laser are only used by one laser in regional additive processing or femtosecond defect removal.

6. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to any one of claims 1 to 5, characterized in that: The additive laser of the array laser area printing module includes two first lasers and six second lasers, and the coupling optical path includes a first coupling optical path and a second coupling optical path; the power of the first laser is greater than the power of the second laser; The two first lasers respectively couple the laser beams emitted by the first lasers to a pair of additive scanning galvanometers in the middle of the 3*2 array distribution via the first coupling optical path and the second coupling optical path, thereby forming two fast scanning filling optical paths; The six second lasers correspond to additive scanning galvanometers distributed in a 3*2 array and connected through a shaping optical path, respectively, to form six-path area contour fine scanning optical paths.

7. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 6 is characterized in that: The femtosecond laser defect removal subtractive module includes two femtosecond lasers, which respectively couple the laser beams emitted by the femtosecond lasers to a pair of additive scanning galvanometers in the middle of a 3*2 array distribution via a first coupling optical path and a second coupling optical path, thereby forming two femtosecond laser defect removal optical paths.

8. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 1, characterized in that: The image fields of the four cameras fully cover the interior of the forming chamber, so as to scan and image each layer located in the additive processing area and the subtractive processing area, and monitor the printing quality of each layer.

9. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 1, characterized in that: According to the defects detected by the defect detection image field module, as well as the defect type and defect location, the femtosecond laser beam is scanned at the defect location through the subtractive scanning galvanometer, and in-situ defect removal processing is performed according to the defect type, including: For the defects and defect locations identified by imaging of any layer, according to the identified defect type, the femtosecond laser beam is scanned at the defect location through a subtractive scanning galvanometer to perform in-situ defect removal processing, where: If the defect is identified as a bulge / protrusion defect, the bulge / protrusion is removed by a femtosecond laser beam, and imaging detection is performed again after the defect removal process, so that the bulge / protrusion defect is effectively removed; If the defect is identified as a concave defect, a femtosecond laser beam is used for repair, including smooth transition processing of a predetermined area around the concave defect and rescanning and sintering of the concave defect area, and imaging detection is performed again after the defect repair process, so that the concave defect is effectively repaired.

10. The array laser increase-measurement-reduction multi-field collaborative composite manufacturing system according to claim 9, characterized in that: The criterion for determining whether the bulge / protrusion defect is effectively removed is that the size of the bulge / protrusion position is smaller than a set size threshold; The judgment criterion for whether the concave defect is effectively repaired is that the curvature change of the edge of the concave position is less than a set curvature threshold.

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