Circuit board electroplating method and circuit board

Abstract

The invention discloses a circuit board electroplating method and a circuit board, and aims to solve the problem of inconsistent electroplating uniformity caused by high current density of a platinum titanium mesh and a partial region of an electroplating plate due to an electroplating fringe effect in an electroplating process of an existing electroplating method, so that the platinum titanium mesh is optimized into a door shape; the problem that the local current of a platinum titanium mesh is too high is solved, a main lead in an electroplating plate is optimized and cut, so that the current in the electroplating plate is rearranged, the problem that the electroplating uniformity of the electroplating plate is inconsistent due to the fact that the current density of a partial region on the electroplating plate is high is solved, the electroplating time and the electroplating current are optimized, and the electroplating uniformity of the electroplating plate is improved. And the density of electroplating current in the electroplating process is controlled, so that the electroplating uniformity is ensured.

Description

Technical Field

[0001] The invention relates to the field of circuit board electroplating, and in particular to a circuit board electroplating method and a circuit board. Background Art

[0002] The Power Management Integrated Circuit (PMIC) in the package substrate is an indispensable key component in today's electronic devices. The characteristic of PMIC products is that the electroplating area is large. During the electroplating process, the electroplating edge effect often occurs, resulting in poor electroplating uniformity and some functional impacts. Therefore, an electroplating method is urgently needed to improve the problem of uneven electroplating. Summary of the invention

[0003] The embodiments of the present invention provide a circuit board electroplating method and a circuit board, so as to solve the problem that the electroplating edge effect occurs during the electroplating process of the circuit board, resulting in poor electroplating uniformity.

[0004] A first aspect of the present application provides a circuit board electroplating method, comprising: The electroplating plate is vertically immersed in the electroplating solution of the electroplating tank; Gate-shaped platinum titanium meshes are placed on the left and right sides of the electroplating plate, the electroplating plate and the gate-shaped platinum titanium mesh on the left side are separated into a first compartment, and the electroplating plate and the gate-shaped platinum titanium mesh on the right side are separated into a second compartment; Evenly divide the main lead wire in the electroplating board by using a cutting technique, so as to divide the main lead wire in the electroplating board into two; The electroplating solution in the first interval and the second interval is driven by using an optimized current within an optimized time to electroplate the electroplating board after the main lead is segmented.

[0005] Optionally, gate-shaped platinum titanium meshes are placed on the left and right sides of the electroplating plate, the electroplating plate and the gate-shaped platinum titanium mesh on the left are separated into a first compartment, and the electroplating plate and the gate-shaped platinum titanium mesh on the right are separated into a second compartment, including: Fix the electroplating plate between the gate-shaped platinum titanium mesh on the left and right sides; The electroplating plate and the gate-shaped platinum titanium meshes on the left and right sides form a first compartment and a second compartment.

[0006] Optionally, the circuit board electroplating method further includes: The gate-shaped platinum titanium meshes on the left and right sides of the electroplating plate are set as anodes, and the electroplating plate is set as cathode; Connect the anode to the positive electrode of the power supply, and connect the cathode to the negative electrode of the power supply; An electroplating layer is formed on the plate surface of the electroplating plate through an electrochemical reaction.

[0007] Optionally, the gate-shaped platinum-titanium mesh is cut from a rectangular platinum-titanium mesh.

[0008] Optionally, the optimized time is that each electroplating time is greater than 300 seconds.

[0009] Optionally, the optimized current is less than 0.15 ASD for each electroplating.

[0010] Optionally, the volumes of the electroplating solution in the first compartment and the second compartment are the same.

[0011] Optionally, the first interval and the second interval use the same electroplating current each time to electroplate the electroplating plate through an electrochemical reaction.

[0012] Optionally, the flow rates of the electroplating solution in the first interval and the second interval are the same.

[0013] Optionally, the step of connecting the anode to a positive electrode of a power supply and the cathode to a negative electrode of a power supply comprises: Connect an external power source to the electroplating tank; The anode is connected to the positive electrode of the external power supply, and the cathode is connected to the negative electrode of the external power supply.

[0014] A second aspect of the present application provides a circuit board, which is prepared by the above-mentioned circuit board electroplating method.

[0015] The above-mentioned circuit board electroplating method and circuit board are as follows: the electroplating board is vertically immersed in the plating solution of the electroplating pool; a gate-shaped platinum titanium mesh is placed on the left and right sides of the electroplating board, a first compartment is formed between the electroplating board and the left gate-shaped platinum titanium mesh, and a second compartment is formed between the electroplating board and the right gate-shaped platinum titanium mesh, wherein the gate-shaped platinum titanium mesh can reduce the discharge effect of the main power lead at the edge of the electroplating board; the main lead in the electroplating board is evenly divided by cutting technology, and the main lead in the electroplating board is divided into two to weaken the edge effect of the local position of the current on the electroplating board during the electroplating process; the electroplating solution in the first compartment and the second compartment is driven by the optimized current within the optimized time to electroplate the electroplating board after the main lead is divided. The present application optimizes the platinum-titanium mesh into a gate shape, reduces the problem of excessive local current in the platinum-titanium mesh, optimizes the main leads in the electroplating plate, and cuts the main leads to rearrange the current in the electroplating plate, thereby reducing the high current density in some areas of the electroplating plate, which leads to inconsistent electroplating uniformity of the electroplating plate, and optimizes the electroplating time and electroplating current, controls the density of the electroplating current during the electroplating process, and thus ensures electroplating uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0017] Figure 1 is a flow chart of a circuit board electroplating method in one embodiment of the present invention; Figure 2 is an optimized schematic diagram of a circuit board electroplating method in one embodiment of the present invention; Figure 3 is an optimized schematic diagram of a circuit board electroplating method in one embodiment of the present invention; DETAILED DESCRIPTION The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] In one embodiment of the present invention, a circuit board electroplating method is provided. The circuit board electroplating method comprises placing a plating board in a plating tank, placing a platinum-titanium mesh on the left and right sides of the plating board, isolating a first interval on the left side of the plating board, and isolating a second interval on the right side of the plating board, wherein the platinum-titanium mesh and the plating board on the left and right sides are both fixed in the plating tank, and the space between the platinum-titanium mesh and the plating board is filled with an electroplating solution, wherein the platinum-titanium mesh in the plating tank is an anode connected to the positive electrode of a power supply, and the plating board is a cathode connected to the negative electrode of a power supply, so as to form an electrochemical reaction in the plating tank and electroplate the plating board.

[0019] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0020] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]", depending on the context.

[0022] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0023] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0024] It should be understood that the order of execution of the steps in the following embodiments does not imply a precedence of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0025] Before describing the circuit board electroplating method provided by the present invention, in order to facilitate the understanding and description of the embodiments of the present invention, the concepts, terminology and related relationships involved in the present invention are first introduced.

[0026] Electroplating refers to the process of plating a thin layer of metal or alloy on the plated plate using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of the plated plate.

[0027] Electroplating refers to the process of using the principle of electrolysis to form a uniform, dense, and well-bonded metal or alloy deposition layer on the surface of the board. The formed deposition layer can be connected to the chip and the packaging substrate through wire bonding and welding to achieve power and signal transmission.

[0028] Electroplating uniformity refers to the uniformity of electroplating distribution on the electroplating board, that is, the uniformity of the coating thickness on the electroplating board.

[0029] Electroplating current density refers to the physical quantity of the current strength and flow direction at a certain point in the circuit, which is equal to the amount of electricity passing through a certain unit area per unit time. Current density is an important parameter in electroplating operations, which directly affects the properties, distribution and current efficiency of the coating.

[0030] Edge effect, the edge effect that exists in the electroplating process is mainly caused by uneven current distribution. During the electroplating process, the current tends to concentrate at the edges and tips of the plate. This phenomenon is called tip effect or edge effect. Specifically, the electric lines gather more at the edges and tips of the workpiece or plate, resulting in a larger current density in these areas, which increases the thickness of the coating in these areas. Sometimes the edge of the coating may even thicken, grow burrs or burn. This phenomenon not only affects the quality of electroplating, but may also cause uneven coating, thereby affecting the overall performance and appearance of the product.

[0031] The above briefly introduces the terms or concepts such as electroplating, electroplated board and electroplating uniformity involved in the present invention, which is convenient for explaining the subsequent circuit board electroplating process and the corresponding circuit board electroplating method. The circuit board electroplating method mentioned below will utilize the above-mentioned terms or concepts.

[0032] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.

[0033] In one embodiment, if Figure 1 As shown, a circuit board electroplating method is provided, which is applied in Figure 1 The following steps are used as an example: S10: vertically immerse the electroplating plate in the electroplating solution of the electroplating tank.

[0034] S20: Placing gate-shaped platinum titanium meshes on the left and right sides of the electroplating plate, wherein the electroplating plate and the gate-shaped platinum titanium mesh on the left are separated into a first compartment, and the electroplating plate and the gate-shaped platinum titanium mesh on the right are separated into a second compartment.

[0035] Specifically, the plating plate is placed in an electroplating pool containing an electroplating solution, and gate-shaped platinum-titanium meshes are placed on both sides of the electroplating plate. The gate-shaped platinum-titanium meshes and the plating plate are used to isolate a first interval and a second interval in the plating pool. The first interval is isolated by the gate-shaped titanium mesh on the left side and the plating plate, and the second interval is isolated by the gate-shaped titanium mesh on the right side and the plating plate.

[0036] It should be noted that if Figure 2 As shown, the platinum titanium mesh before optimization is rectangular. In this application, the rectangular platinum titanium mesh is cut using cutting technology to form a gate-shaped platinum titanium mesh with a gap of about 1 mm in the middle, so as to make the anode during the electroplating process, thereby reducing the electroplating edge effect.

[0037] In the general circuit board electroplating process, a whole rectangular platinum-titanium mesh is used to plate the plate, which results in a higher current density in the edge area of ​​the plated plate during the electroplating process, causing the edge of the coating to thicken and the current to be unevenly distributed, thereby making the electroplating uniformity worse. In order to solve this problem, the present application optimizes the platinum-titanium mesh, changing the platinum-titanium mesh from the original rectangle to a gate shape, wherein the gate-shaped platinum-titanium mesh is obtained by cutting the rectangular platinum-titanium mesh.

[0038] Optionally, in one embodiment, since the gate-shaped platinum-titanium mesh is at the same position on the left and right sides of the plating plate, the volume of the plating solution in the first compartment isolated by the platinum-titanium mesh and the plating plate on the left and the first compartment isolated by the platinum-titanium mesh and the plating plate on the right are the same.

[0039] In this embodiment, the electroplating plate is vertically immersed in the electroplating solution of the electroplating tank, and gate-shaped platinum titanium meshes are placed on the left and right sides of the electroplating plate to isolate the first compartment and the second compartment. Since the positions of the left and right gate-shaped platinum titanium meshes are the same as the positions of the electroplating plates, the volumes of the solutions filled in the first compartment and the second compartment are the same. During the electroplating process, under the condition that the volumes of the electroplating plates on both sides of the electroplating plate are the same, that is, the electroplating plate and the left and right platinum titanium meshes are kept at the same distance, the left and right sides of the electroplating plate are electroplated simultaneously using the same current, so that the current on the left and right sides can be evenly distributed during the electroplating process, thereby obtaining uniform electroplating of the electroplating plate during the electroplating process.

[0040] S30: using a cutting technique to evenly divide the main leads in the electroplating board, dividing the main leads in the electroplating board into two, so as to weaken the edge effect of the local position of the current on the electroplating board during the electroplating process.

[0041] Specifically, Figure 3 As shown, before optimization, the electroplating board is divided into four areas by two intersecting main leads. The present application uses cutting technology to cut the two main leads on the electroplating board, dividing the two main leads into two. The two main leads become four main leads after cutting. The four main leads after cutting can each be responsible for one area, completing the rearrangement of the lead lines of the electroplating board. After the lead lines are rearranged, the current on the electroplating board can be rearranged as a whole during electroplating to ensure uniform current distribution on the electroplating board.

[0042] It should be noted that during the electroplating process, the leads gathered on the electroplating board will also cause the current density in some areas of the electroplating board to be higher, resulting in edge effects, causing the edge of the coating to thicken, and the current to be unevenly distributed, thereby making the electroplating uniformity worse. In order to solve this problem, the present application optimizes the design of the main leads in the electroplating board, cuts the solid main leads in the electroplating board, and divides the main leads in the electroplating board into two. The electroplating board after the main leads are cut, and the current in the electroplating board can be rearranged, so as to reduce the edge effect of the local position of the current on the electroplating board during the electroplating process, and improve the electroplating uniformity of the electroplating board after electroplating. The main leads are high-frequency transmission wires on the electroplating board, which can quickly transmit current, signals, etc. to the specified location. The leads on the electroplating board are used to ensure that the electroplating plate or the electroplating part can work normally, and transmit current, signals, etc. to the specified location through the leads.

[0043] In this embodiment, the main leads in the plating board are evenly divided by using cutting technology, and the main leads in the plating board are divided into two, so as to complete the rearrangement of the lead lines of the plating board, weaken the edge effect of the local position of the current on the plating board during the electroplating process, and ensure the uniform distribution of current on the plating board.

[0044] S40: driving the electroplating solution in the first interval and the second interval multiple times using the optimized current within the optimized time to electroplate the electroplating board after the main leads are segmented.

[0045] Specifically, in the existing electroplating methods, a short time and a large current, i.e., an electroplating time of less than 300 seconds and a current greater than 0.15ASD, are generally used to electroplate the electroplated plate. Therefore, there is usually a problem of the current time being too short and the current being too large. There is no way to adjust the current in time during the electroplating process, resulting in poor electroplating uniformity. In order to solve this problem, the present application optimizes the electroplating time and the electroplating current during the electroplating process, increases the electroplating time and weakens the electroplating current, and applies multiple currents to the electroplated plate to ensure that the current density can be adjusted in time during the electroplating process to avoid the problem of excessive local current, thereby ensuring consistent electroplating uniformity of the electroplated plate during the electroplating process.

[0046] It is worth noting that the present application uses an optimized current to drive the plating solution according to the optimized plating time, and electroplates the plating plate after the main lead is split. Among them, the optimized time is to convert the electroplating time from the original current time of less than 300 seconds each time to a current time greater than 300 seconds, and the optimized current refers to the electroplating current from the original current greater than 0.15ASD each time to the current less than 0.15ASD each time. In the electroplating process, electroplating can be performed multiple times according to the electroplating situation. For example, in the electroplating process, the present application can use a current of 0.1ASD, electroplating for 500 seconds each time, and the electroplating time is increased by at least 200 seconds compared with the electroplating time less than 300 seconds before optimization, and the current is weakened by at least 0.05ASD before optimization. In the electroplating process, electroplating can be performed at least once according to the electroplating situation. The examples in this embodiment are for illustration only and are not limited in any way.

[0047] In this embodiment, the electroplating liquid in the first interval and the second interval is driven multiple times with an optimized current within an optimized time to electroplate the electroplating plate after the main lead is segmented. This application reduces the current, increases the electroplating time and the number of electroplating times to reasonably control the electroplating current density during the electroplating process, avoids excessive current density concentration, and ensures the uniformity of the electroplating.

[0048] Optionally, in one embodiment, the same plating current and plating time are used on both sides of the plating plate to ensure that the flow rate of the plating solution on the left and right sides of the plating plate is the same, thereby ensuring the uniformity of plating on the plating plate.

[0049] In this embodiment, since the existing electroplating method will have an electroplating edge effect during the electroplating process, which causes the problem of high current density in some areas of the platinum titanium mesh and the electroplating board, resulting in inconsistent electroplating uniformity, the present application optimizes the platinum titanium mesh into a gate type to reduce the problem of excessive local current in the platinum titanium mesh, optimizes the main leads in the electroplating board, and cuts the main leads to rearrange the current in the electroplating board, thereby reducing the problem of inconsistent electroplating uniformity of the electroplating board caused by high current density in some areas of the electroplating board, and optimizes the electroplating time and electroplating current to control the density of the electroplating current during the electroplating process, thereby ensuring electroplating uniformity.

[0050] In one embodiment, the circuit board electroplating method further includes the following steps: S50: setting the gate-shaped platinum titanium meshes on the left and right sides of the electroplating plate as anodes, and setting the electroplating plate as cathode; S60: connecting the anode to the positive electrode of a power source, and connecting the cathode to the negative electrode of a power source; S70: forming an electroplating layer on the surface of the electroplating plate through an electrochemical reaction.

[0051] Specifically, the electroplating plate is placed vertically in the electroplating solution, and a gate-shaped platinum-titanium mesh is placed at the same distance on the left and right sides of the electroplating plate, wherein the gate-shaped platinum-titanium mesh is the anode and the electroplating plate is the cathode. The positive pole of the power supply is connected to the platinum-titanium mesh, and the negative pole of the power supply is connected to the electroplating plate. The electroplating plate is electroplated according to the electrochemical reaction to form a uniform electroplating layer on the electroplating plate, wherein the power supply is an external power supply.

[0052] The above-mentioned circuit board electroplating method and circuit board are as follows: the electroplating board is vertically immersed in the plating solution of the electroplating pool; a gate-shaped platinum titanium mesh is placed on the left and right sides of the electroplating board, a first compartment is formed between the electroplating board and the left gate-shaped platinum titanium mesh, and a second compartment is formed between the electroplating board and the right gate-shaped platinum titanium mesh, wherein the gate-shaped platinum titanium mesh can reduce the discharge effect of the main power lead at the edge of the electroplating board; the main lead in the electroplating board is evenly divided by cutting technology, and the main lead in the electroplating board is divided into two to weaken the edge effect of the local position of the current on the electroplating board during the electroplating process; the electroplating solution in the first compartment and the second compartment is driven by the optimized current within the optimized time to electroplate the electroplating board after the main lead is divided. The present application changes the platinum titanium mesh from a rectangular shape to a gate shape to reduce the discharge effect of the main power lead at the tip of the edge of the plate, cuts the main lead on the electroplating board to weaken the edge effect of the local position of the current on the electroplating board, and electroplates the electroplating board according to the preset electroplating time and electroplating current after the above steps, ultimately achieving the improvement of electroplating uniformity and the problem of gold surface discoloration.

[0053] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0054] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A circuit board electroplating method, characterized in that: include: The electroplating plate is vertically immersed in the electroplating solution of the electroplating tank; Gate-shaped platinum titanium meshes are placed on the left and right sides of the electroplating plate, the electroplating plate and the gate-shaped platinum titanium mesh on the left side are separated into a first compartment, and the electroplating plate and the gate-shaped platinum titanium mesh on the right side are separated into a second compartment; Using cutting technology to evenly divide the main lead of the electroplating board into two, wherein the main lead of the electroplating board is a lead embedded in the electroplating board; The electroplating solution in the first interval and the second interval is driven by using an optimized current within an optimized time to electroplate the electroplating board after the main lead is segmented.

2. The circuit board electroplating method according to claim 1, characterized in that: include: The gate-shaped platinum titanium meshes on the left and right sides of the electroplating plate are set as anodes, and the electroplating plate is set as cathode; Connect the anode to the positive electrode of the power supply, and connect the cathode to the negative electrode of the power supply; An electroplating layer is formed on the plate surface of the electroplating plate through an electrochemical reaction.

3. The circuit board electroplating method according to claim 1, characterized in that: The gate-shaped platinum-titanium mesh is obtained by cutting a rectangular platinum-titanium mesh.

4. The circuit board electroplating method according to claim 1, characterized in that: The optimized time is that each electroplating time is greater than 300 seconds.

5. The circuit board electroplating method according to claim 1, characterized in that: The optimized current is that the electroplating current is less than 0.15 ASD each time.

6. The circuit board electroplating method according to claim 1, characterized in that: The volumes of the electroplating solution in the first compartment and the second compartment are the same.

7. The circuit board electroplating method according to claim 1, characterized in that: The first interval and the second interval use the same plating current each time to electroplate the plating board through electrochemical reaction.

8. The circuit board electroplating method according to claim 1, characterized in that: The flow rates of the electroplating solution in the first interval and the second interval are the same.

9. The circuit board electroplating method according to claim 2, characterized in that: The anode is connected to the positive electrode of the power supply, and the cathode is connected to the negative electrode of the power supply; comprising: Connect an external power source to the electroplating tank; The anode is connected to the positive electrode of the external power supply, and the cathode is connected to the negative electrode of the external power supply.

10. A circuit board, characterized in that: The circuit board is prepared by the circuit board electroplating method as described in claims 1 to 9.

Images