Heat dissipation mechanism and electronic water pump

Abstract

The embodiment of the invention provides a heat dissipation mechanism and an electronic water pump, and relates to the field of water pump structures. The heat dissipation mechanism comprises a soaking block and a heat pipe; wherein the soaking block is connected to the bottom end of the heat pipe, a first inner cavity is formed in the soaking block, a second inner cavity is formed in the heat pipe, the first inner cavity is communicated with the second inner cavity, the bottom face of the soaking block is used for installing a controller, and the heat pipe is used for being arranged on the inner side of a rotor in a penetrating mode. In the working process, on one hand, the soaking block can be in contact with the controller to dissipate heat of the controller and increase the heat transfer area, on the other hand, heat can be absorbed by a medium in the first inner cavity, the medium after heat absorption is vaporized and flows towards the top end of the second inner cavity, and the medium is liquefied under the cooling effect of liquid on the outer side of the heat pipe in the flowing process; and the heat flows back to the first inner cavity to absorb heat again while being transferred out, so that the heat dissipation effect on the controller is greatly improved, and the negative influence on the working performance of the electronic water pump due to overheating of the controller is prevented.

Description

Technical Field

[0001] The invention relates to the field of water pump structures, and in particular to a heat dissipation mechanism and an electronic water pump. Background Art

[0002] In existing electronic water pumps, the cooling method of internal circulation of coolant is mostly adopted. Since the outlet pressure of the water pump is greater than the inlet pressure, the coolant will flow into the rear bearing seat through the gap between the rotor and the shaft to achieve alternating hot and cold. However, due to the limitation of the internal structure layout of the water pump, the coolant flow rate transmitted from the controller to the rear bearing seat is very limited, so the cooling effect of the controller is not good. This heat dissipation efficiency is not high, so a new controller heat dissipation structure is needed. Summary of the invention

[0003] The present invention provides a heat dissipation mechanism, which can improve the heat dissipation effect of a controller, thereby avoiding overheating of the controller and preventing negative impact on the working performance of an electronic water pump.

[0004] The embodiments of the present invention can be implemented as follows: An embodiment of the present invention provides a heat dissipation mechanism, which includes: Heat sinks and heat pipes; Among them, the top surface of the heat equalizing block is connected to the bottom end of the heat pipe, a first inner cavity is formed in the heat equalizing block, a second inner cavity is formed in the heat pipe, the first inner cavity is communicated with the second inner cavity, the bottom surface of the heat equalizing block is used to install the controller, and the heat pipe is used to pass through the inner side of the rotor.

[0005] Optionally, the outer wall of the heat pipe is spaced apart from the inner wall of the rotor and forms a cooling channel.

[0006] Optionally, a bearing is provided on an outer wall of the heat pipe, and the bearing is away from the heat equalizing block relative to the rotor.

[0007] Optionally, a positioning groove is provided on the heat equalizing block, the positioning groove is communicated with the first inner cavity, and the bottom end of the heat pipe is accommodated in the positioning groove.

[0008] Optionally, a first step is formed in the positioning groove, and a second step is formed at the bottom end of the heat pipe, and the first step matches the second step.

[0009] Optionally, a boss is formed on one side of the heat equalizing block close to the heat pipe, and the positioning groove is opened on the boss.

[0010] Optionally, the boss is conical, and the outer diameter of the boss gradually decreases in a direction away from the controller.

[0011] Optionally, a sealing groove is provided on the outer side wall of the heat equalizing block, and the sealing groove is used to accommodate a sealing member.

[0012] An embodiment of the present invention further provides an electronic water pump, comprising: Controller, rotor, impeller and the heat dissipation mechanism; The controller is installed on the bottom surface of the heat equalizing block, the rotor is sleeved on the outside of the heat pipe, the impeller is spaced apart at the top of the heat pipe, and the rotor is connected to the impeller.

[0013] Optionally, the electronic water pump further comprises a shielding sleeve and a stator, wherein the shielding sleeve is simultaneously sleeved on the outside of the heat equalizing block and the rotor, the stator is located on the outside of the shielding sleeve, and the bottom end of the shielding sleeve is sealed with the heat equalizing block.

[0014] The beneficial effects of the heat dissipation mechanism and the electronic water pump of the embodiment of the present invention include, for example: The heat dissipation mechanism includes a heat equalizing block and a heat pipe; wherein the heat equalizing block is connected to the bottom end of the heat pipe, a first inner cavity is formed in the heat equalizing block, a second inner cavity is formed in the heat pipe, the first inner cavity is connected to the second inner cavity, the bottom surface of the heat equalizing block is used to install the controller, and the heat pipe is used to pass through the inner side of the rotor. During operation, when the temperature of the controller rises, the heat equalizing block can contact the controller on the one hand to dissipate the heat of the controller, and on the other hand, the heat can be absorbed by the medium in the first inner cavity. The medium after absorbing heat vaporizes and flows toward the top of the second inner cavity. During the flow process, it is cooled by the liquid outside the heat pipe and liquefied again. While transferring heat, it flows back to the first inner cavity to absorb heat again, thereby greatly improving the heat dissipation effect of the controller and preventing the controller from overheating and negatively affecting the working performance of the electronic water pump.

[0015] The electronic water pump includes a controller, a rotor, an impeller and a heat dissipation mechanism; wherein the controller is installed on the bottom surface of the heat equalization block, the rotor is sleeved on the outside of the heat pipe, the impeller is spaced and arranged at the top of the heat pipe, and the rotor is connected to the impeller. The electronic water pump has all the functions of the heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A cross-sectional schematic diagram of an electronic water pump provided in an embodiment of the present invention; Figure 2is a cross-sectional schematic diagram of a heat dissipation mechanism provided in an embodiment of the present invention; Figure 3 It is a cross-sectional schematic diagram of a heat equalizing block provided in an embodiment of the present invention; Figure 4 It is a schematic cross-sectional view of a heat pipe provided in an embodiment of the present invention.

[0018] Icons: 100-heat dissipation mechanism; 110-heat equalizing block; 111-first inner cavity; 112-sealing groove; 113-positioning groove; 114-first step; 115-boss; 120-heat pipe; 121-second inner cavity; 122-second step; 123-third step; 200-controller; 300-rotor; 350-cooling channel; 400-bearing; 500-seal; 600-impeller; 700-shielding sleeve; 800-stator; 1000-electronic water pump. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0024] The terms "comprises," "comprising," or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0025] Unless otherwise clearly specified and limited, the terms "disposed", "connected" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0027] As mentioned in the background technology, the existing electronic water pumps mostly adopt the cooling method of internal circulation of coolant. Since the outlet pressure of the water pump is greater than the inlet pressure, the coolant will flow into the rear bearing seat through the gap between the rotor and the shaft to achieve alternating hot and cold. However, due to the limitation of the internal structure layout of the water pump, the coolant flow rate transmitted from the controller to the rear bearing seat is very limited, so the cooling effect of the controller is not good. This heat dissipation efficiency is not high, so a new controller heat dissipation structure is needed.

[0028] Please refer to Figure 1 and Figure 2 The heat dissipation mechanism 100 and the electronic water pump 1000 provided in the embodiment of the present invention can solve the above-mentioned problems, which will be described in detail below.

[0029] The heat dissipation mechanism 100 includes a heat equalizing block 110 and a heat pipe 120; wherein the heat equalizing block 110 is connected to the bottom end of the heat pipe 120, a first inner cavity 111 is formed in the heat equalizing block 110, a second inner cavity 121 is formed in the heat pipe 120, the first inner cavity 111 is connected to the second inner cavity 121, the bottom surface of the heat equalizing block 110 is used to install the controller 200, and the heat pipe 120 is used to pass through the inner side of the rotor 300.

[0030] During operation, when the temperature of the controller 200 rises, the heat equalizing block 110 can, on the one hand, contact the controller 200 to dissipate the heat of the controller 200, and on the other hand, the heat can be absorbed by the medium in the first inner cavity 111. The medium after absorbing heat vaporizes and flows toward the top of the second inner cavity 121. During the flow, it is cooled by the liquid on the outside of the heat pipe 120 and reliquefied. While transferring heat, it flows back to the first inner cavity 111 to absorb heat again, thereby greatly improving the heat dissipation effect of the controller 200 and preventing the controller 200 from overheating and negatively affecting the working performance of the electronic water pump 1000.

[0031] It is worth noting that, in the actual assembly state, the heat block 110 can be in direct contact with the controller 200 or in indirect contact with the controller 200 , thereby achieving a heat dissipation effect on the controller 200 .

[0032] It should be noted that the heat pipe 120 and the heat equalizing block 110 contain a low-boiling-point heat-conducting medium, which is liquid under normal conditions and is caused to flow back to the first inner cavity 111 by gravity or the capillary action of the internal tube wall; when the controller 200 generates heat, the heat-conducting medium absorbs a certain amount of heat and then vaporizes, and then flows from the first inner cavity 111 toward the top of the second inner cavity 121. Because liquid flows when the electronic water pump 1000 is working, the flowing liquid on the outside of the heat pipe 120 will take away the heat of the vaporized heat-conducting medium to cool it down. The cooled heat-conducting medium will reliquefy and flow back to the first inner cavity 111, and thus circulate to achieve a good heat dissipation effect for the controller 200.

[0033] It is worth noting that during the manufacturing process, before adding the heat-conducting medium to the first inner cavity 111 and the second inner cavity 121, a vacuum treatment is required, the main function of which is to reduce the boiling point of the medium. The purpose is to adjust the boiling point through the vacuum degree. In addition, the use of different media can also achieve the effect of adjusting the boiling point.

[0034] In this embodiment, the heat block 110 is in a plate-like structure, and the plate surface of the heat block 110 close to the controller 200 has a sufficient contact area with the controller 200, thereby achieving rapid heat conduction to the controller 200, so that the heat of the controller 200 can be dissipated by the heat block 110.

[0035] Furthermore, the heat pipe 120 is in the shape of a straight cylinder, and the extension direction of the heat pipe 120 is perpendicular to the plate surface of the heat equalizing block 110; of course, in other embodiments of the present invention, the heat pipe 120 may also be in the shape of a curved cylinder, and the extension direction of the heat pipe 120 may also be at an acute angle to the plate surface of the heat equalizing block 110, etc. There is no limitation on the specific shape of the heat pipe 120 and its relative position to the heat equalizing block 110, but it is necessary to ensure that the setting of the heat pipe 120 will not interfere with the rotation of the rotor 300.

[0036] refer to Figure 1 The outer wall of the heat pipe 120 is spaced apart from the inner wall of the rotor 300 and forms a cooling channel 350 .

[0037] During operation, the heat pipe 120 is disposed inside the rotor 300, so that the heat-conducting medium in the heat pipe 120 can take away the heat of the rotor 300 to a certain extent, and improve the heat dissipation effect of the rotor 300. The cooling channel 350 facilitates the flow of the liquid transmitted by the electronic water pump 1000, and further facilitates the rapid discharge of heat from the rotor 300 and the heat pipe 120 when the liquid flows.

[0038] Furthermore, the rotor 300 rotates circumferentially when in operation, while the heat pipe 120 is stationary in the circumferential direction when in operation, so that the two move relative to each other to drive the liquid between them to flow, thereby taking away more heat and achieving a better heat dissipation effect. refer to Figure 1 In order to improve the structural stability of the heat pipe 120, avoid the heat pipe 120 from tilting and squeezing the cooling channel 350 after long-term use, avoid affecting the cooling effect and avoid interfering with the rotation of the rotor 300; the outer wall of the heat pipe 120 can be provided with a bearing 400, the bearing 400 is away from the heat equalizing block 110 relative to the rotor 300, and the bearing 400 and the heat pipe 120 are in clearance fit. In addition, the bearing 400 is located on the heat pipe 120 closer to the top of the heat pipe 120, and the heat pipe 120 and the rotor 300 can be rotated relative to each other through the bearing 400, thereby improving the support performance of the two, improving the rigidity of the overall structure, and avoiding the deflection of the heat pipe 120.

[0039] refer to Figure 2-Figure 4 In order to ensure the relative position of the heat pipe 120 and the rotor 300 , a third step 123 may be formed on the heat pipe 120 , and the third step 123 cooperates with the rotor 300 or the bearing 400 .

[0040] Specifically, the outer diameter of the portion of the heat pipe 120 located on the top side of the third step 123 (i.e., the portion relatively close to the impeller 600) is smaller, while the outer diameter of the portion of the heat pipe 120 located on the bottom side of the third step 123 (i.e., the portion relatively far from the impeller 600) is larger.

[0041] At the same time, in order to improve the relative position stability of the heat equalizing block 110 and the heat pipe 120, a positioning groove 113 can be provided on the heat equalizing block 110, the positioning groove 113 is connected to the first inner cavity 111, and the end of the heat pipe 120 is accommodated in the positioning groove 113. Specifically, the positioning groove 113 is provided at the center of one side of the heat equalizing block 110 close to the heat pipe 120, and after the heat pipe 120 is connected, the central axis of the heat pipe 120 can be made to coincide with the central axis of the heat equalizing block 110.

[0042] Furthermore, in order to facilitate accurate positioning of the axial positions of the heat equalizing block 110 and the heat pipe 120, a first step 114 may be formed in the positioning groove 113, and a second step 122 may be formed at the bottom end of the heat pipe 120, and the second step 122 cooperates with the first step 114. Specifically, the step surface of the first step 114 abuts against the step surface of the second step 122, which can also be understood as the second step 122 abuts against the inner side of the first step 114. Furthermore, in the embodiment of the present invention, the heat pipe 120 as a whole presents a structure that is thick in the middle and thin at both ends.

[0043] refer to Figure 2-Figure 4 In order to further improve the connection reliability between the heat equalizing block 110 and the heat pipe 120 , a boss 115 may be formed on one side of the heat equalizing block 110 close to the heat pipe 120 , and the positioning groove 113 is opened on the boss 115 .

[0044] When the end of the heat pipe 120 is accommodated in the positioning groove 113, the heat pipe 120 is in a shape in which one end is inserted into the boss 115. The boss 115 can increase the accommodation depth of the end of the heat pipe 120, thereby preventing the heat pipe 120 from being easily tilted due to the surrounding liquid flow.

[0045] In this embodiment, the boss 115 is conical, and the outer diameter of the boss 115 gradually decreases in the direction away from the controller 200. By limiting the shape of the boss 115, when the connecting position between the first inner cavity 111 and the second inner cavity 121 is located on the inner side of the boss 115, the boss 115 can absorb heat and dissipate heat to the surroundings at the same time, thereby promoting the heat dissipation effect of the connecting position of the two inner cavities.

[0046] Of course, in other embodiments of the present invention, the boss 115 may also be cylindrical, prismatic, or disc-shaped, and the specific shape of the boss 115 is not limited.

[0047] refer to Figure 1-Figure 3 In order to prevent the liquid transmitted by the electronic water pump 1000 from contacting the controller 200 and causing damage to the controller 200, a sealing groove 112 can be opened on the outer wall of the heat equalizing block 110, and the sealing groove 112 is used to accommodate the sealing member 500. The electronic water pump 1000 also includes a shielding sleeve 700, which is sleeved on the outer side of the heat equalizing block 110, and the sealing member 500 seals the gap between the shielding sleeve 700 and the heat equalizing block 110.

[0048] Specifically, the sealing groove 112 is annularly opened on the heat equalizing block 110, and the sealing member 500 is ring-shaped and sleeved on the sealing groove 112, while abutting against the shielding sleeve 700, thereby sealing the shielding sleeve 700 and the heat equalizing block 110, thereby preventing the liquid in the shielding sleeve 700 from flowing over the heat equalizing block 110 toward the controller 200 and causing damage to the controller 200.

[0049] refer to Figure 1 and Figure 2 , an embodiment of the present invention further provides an electronic water pump 1000, which includes a controller 200, a rotor 300, an impeller 600 and a heat dissipation mechanism 100; The controller 200 is installed on the bottom surface of the heat equalizing block 110 , the rotor 300 is sleeved on the outside of the heat pipe 120 , the impeller 600 is spaced apart at the top of the heat pipe 120 , and the rotor 300 is connected to the impeller 600 .

[0050] During operation, the rotor 300 is connected to the impeller 600, so that the rotor 300 and the impeller 600 can rotate synchronously, so that the impeller 600 can drive its own rotation through the rotation of the rotor 300 and then drive the liquid to flow to achieve the transmission effect. In the prior art, a rotating shaft is usually set at the position of the heat pipe 120, and the rotating shaft drives the rotor 300 to rotate. In this embodiment, the impeller 600 drives the rotor 300 to rotate, which, on the one hand, ensures the stability of the rotational motion of the rotor 300, and on the other hand, connects the rotor 300 and the impeller 600, thereby improving the overall structural strength of the two, further improving the service life of the two, and thus improving the durability of the electronic water pump 1000.

[0051] It is worth noting that because the impeller 600 rotates, the heat pipe 120 does not rotate. By spacing the two apart, there is no rotation interference and liquid can flow in easily to take away the heat of the heat-conducting medium in the heat pipe 120, thereby cooling the heat-conducting medium.

[0052] refer to Figure 1 The sub-water pump also includes a shielding sleeve 700 and a stator 800. The shielding sleeve 700 is simultaneously sleeved on the outside of the heat equalizing block 110 and the rotor 300. The stator 800 is located on the outside of the shielding sleeve 700. The bottom end of the shielding sleeve 700 is sealed with the heat equalizing block 110.

[0053] In use, the shielding sleeve 700 is mainly used to separate the rotor 300 and the stator 800, the rotor 300 is located inside the shielding sleeve 700, and the stator 800 is located outside the shielding sleeve 700. A seal 500 is provided between the bottom end of the shielding sleeve 700 and the heat-sinking block 110, and the seal 500 ensures a sealing effect, thereby preventing the liquid from passing over the heat-sinking block 110 and causing interference and damage to the controller 200.

[0054] In summary, the heat dissipation mechanism 100 and the electronic water pump 1000 provided by the embodiments of the present invention have at least the following advantages: (1) When the controller 200 generates heat, the heat dissipation mechanism 100 can, on the one hand, contact the controller 200 through the heat equalizing block 110 to dissipate heat from the controller 200; on the other hand, the heat can be absorbed by the medium in the first inner cavity 111. The medium after absorbing heat vaporizes and flows toward the top of the second inner cavity 121. During the flow, the medium is cooled by the liquid on the outside of the heat pipe 120 and liquefied again. While transferring heat, it flows back to the first inner cavity 111 to absorb heat, thereby greatly improving the heat dissipation effect on the controller 200 and preventing the controller 200 from overheating and having a negative impact on the working performance of the electronic water pump 1000.

[0055] (2) The heat dissipation mechanism 100 allows the heat pipe 120 to be arranged on the inner side of the rotor 300, so that the heat exchange medium in the heat pipe 120 can not only take away the heat of the controller 200, but also absorb the heat of the rotor 300 when the rotor 300 is overheated, thereby improving the heat dissipation effect of the rotor 300; and the heat pipe 120 and the rotor 300 are spaced apart to form a cooling channel 350, so that the liquid transmitted by the electronic water pump 1000 can flow into the cooling channel 350 and take away the heat of the heat transfer medium, thereby allowing the heat to be quickly discharged.

[0056] (3) The heat dissipation mechanism 100 is connected to the impeller 600 through the rotor 300 so that the two rotate synchronously. On the one hand, the stability of the rotational motion of the rotor 300 is ensured. On the other hand, the rotor 300 and the impeller 600 are connected, thereby improving the overall structural strength of the two and further increasing the service life of the two, thereby improving the durability of the electronic water pump 1000.

[0057] (4) The heat dissipation mechanism 100 can also dissipate heat for structures with heat generating elements such as electronic expansion valves and IGBTs (Insulated Gate Bipolar Transistors).

[0058] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation mechanism, characterized in that: include: A heat equalizing block (110) and a heat pipe (120); The heat equalizing block (110) is connected to the bottom end of the heat pipe (120), a first inner cavity (111) is formed in the heat equalizing block (110), a second inner cavity (121) is formed in the heat pipe (120), the first inner cavity (111) is communicated with the second inner cavity (121), the bottom surface of the heat equalizing block (110) is used for installing the controller (200), and the heat pipe (120) is used for passing through the inner side of the rotor (300).

2. The heat dissipation mechanism according to claim 1, characterized in that: The outer wall of the heat pipe (120) is spaced apart from the inner wall of the rotor (300) and forms a cooling flow channel (350).

3. The heat dissipation mechanism according to claim 2, characterized in that: The outer wall of the heat pipe (120) is sleeved with a bearing (400), and the bearing (400) is located away from the heat equalizing block (110) relative to the rotor (300).

4. The heat dissipation mechanism according to any one of claims 1 to 3, characterized in that: A positioning groove (113) is provided on the heat equalizing block (110), the positioning groove (113) is in communication with the first inner cavity (111), and the bottom end of the heat pipe (120) is accommodated in the positioning groove (113).

5. The heat dissipation mechanism according to claim 4, characterized in that: A first step (114) is formed in the positioning groove (113), a second step (122) is formed at the bottom end of the heat pipe (120), and the first step (114) matches the second step (122).

6. The heat dissipation mechanism according to claim 4, characterized in that: A boss (115) is formed on one side of the heat equalizing block (110) close to the heat pipe (120), and the positioning groove (113) is provided on the boss (115).

7. The heat dissipation mechanism according to claim 6, characterized in that: The boss (115) is conical, and the outer diameter of the boss (115) gradually decreases in a direction away from the controller (200).

8. The heat dissipation mechanism according to any one of claims 1 to 3, characterized in that: The outer side wall of the heat equalizing block (110) is provided with a sealing groove (112), and the sealing groove (112) is used to accommodate a sealing member (500).

9. An electronic water pump, characterized in that: include: A controller (200), a rotor (300), an impeller (600), and a heat dissipation mechanism according to any one of claims 1 to 8; The controller (200) is installed on the bottom surface of the heat equalizing block (110), the rotor (300) is sleeved on the outside of the heat pipe (120), the impeller (600) is arranged at intervals on the top of the heat pipe (120), and the rotor (300) is connected to the impeller (600).

10. The electronic water pump according to claim 9, characterized in that: The electronic water pump (1000) further comprises a shielding sleeve (700) and a stator (800); the shielding sleeve (700) is simultaneously sleeved on the outside of the heat equalizing block (110) and the rotor (300); the stator (800) is located on the outside of the shielding sleeve (700); and the bottom end of the shielding sleeve (700) is sealed and matched with the heat equalizing block (110).

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