Pipeline assembly for semiconducting equipment

Abstract

The present invention relates to a pipe assembly for a semiconductor device, comprising: a pipe body comprising an inner wall and an outer wall for introducing a reaction gas; the housing is arranged on the outer wall of the pipeline body in a covering mode, a sealing cavity is formed between the housing and the outer wall, and the sealing cavity is used for being filled with heat preservation gas; the heating module surrounds the outer wall of the pipeline main body; the temperature control module is in circuit connection with the heating module and is used for controlling the heating power of the heating module; and the power supply is in circuit connection with the heating module and the temperature control module. By integrating the heating module and the temperature control module, accurate control over the temperature of the pipeline body is achieved, meanwhile, a gas heat preservation layer is formed through heat preservation gas, heat loss is effectively reduced, and the energy utilization efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a pipeline component used for semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing process, it is crucial to maintain the temperature of the reaction gas in the pipeline, because it directly affects the efficiency and quality of the deposition and etching processes. Particles attached to the inner wall of the pipeline will seriously affect the reaction effect, so effective temperature control and cleanliness maintenance methods are required.

[0003] At present, the common method is to blow purge gas into the pipeline through a hot air blower to maintain the cleanliness of the inside of the pipeline and the temperature of the reaction gas. However, this method has some limitations, such as the large size of the hot air blower, large power loss, and it may be difficult to accurately control the temperature inside the pipeline. Therefore, it is particularly important to develop a small and low-power pipeline component to maintain the pipeline temperature. Summary of the invention

[0004] The present invention aims to provide an improved pipe assembly for temperature control and cleanliness maintenance of reaction gases in semiconductor manufacturing processes. The assembly is designed to address deficiencies in the prior art, such as the volume and power of the hot air blower, and the accuracy of temperature control in the pipe. By adopting innovative structural design and material selection, the pipe assembly of the present invention can achieve accurate control of the temperature of the reaction gas while reducing the adhesion of particles on the inner wall of the pipe, thereby improving the overall efficiency and output quality of the semiconductor manufacturing process.

[0005] The present invention provides a pipeline assembly for semiconductor equipment, comprising:

[0006] A pipeline body, comprising an inner wall and an outer wall, for introducing reaction gas;

[0007] A cover shell is disposed outside the pipeline body and is sealed with the outer wall, a sealed cavity is formed between the cover shell and the outer wall, and the sealed cavity is used to fill the heat preservation gas;

[0008] A heating module surrounds the outer wall of the pipeline body;

[0009] A temperature control module, which is connected to the heating module circuit and is used to control the heating power of the heating module;

[0010] A power supply is circuit-connected to the heating module and the temperature control module.

[0011] Furthermore, the heating module is an induction heating coil.

[0012] Furthermore, the temperature control module includes:

[0013] A frequency control unit, connected to the power supply, for controlling the frequency and power of the power supply;

[0014] A temperature detection unit, which is arranged on the outer wall of the pipeline body, is used to detect the temperature of the outer wall in real time and transmit the detected temperature to the frequency control unit, and the frequency control unit controls the frequency of the power supply according to the temperature;

[0015] Communication interface, connected with external devices, used to transmit power frequency, power and temperature to external devices.

[0016] Furthermore, the frequency control unit controls the power supply frequency to range from 50 Hz to 1000 Hz.

[0017] Furthermore, a through hole penetrating the inner wall and the outer wall of the pipe body is provided on the surface of the pipe body, and the sealing cavity is communicated with the interior of the pipe body through the through hole.

[0018] Furthermore, the through hole is arranged on the surface of the pipe body located inside the sealing cavity.

[0019] Furthermore, the outside of the cover is wrapped with heat insulation material.

[0020] Furthermore, the cover shell is connected to a device for providing heat-insulating gas via a ferrule joint.

[0021] Furthermore, the heat-insulating gas is nitrogen or an inert gas.

[0022] The present invention has the following beneficial effects:

[0023] 1. Accurately control the temperature of the pipeline body through the temperature control module;

[0024] 2. Use heat preservation gas to form a gas insulation layer to reduce heat loss and improve energy utilization efficiency;

[0025] 3. The circuit connection between the heating module and the temperature control module realizes automatic adjustment, reduces manual intervention and improves operational safety;

[0026] 4. The heating module is set inside the cover, reducing the occupied volume;

[0027] 5. The design of the communication interface facilitates connection with external devices to achieve real-time monitoring and recording of data. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the connection between the pipeline body and the cover shell of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the pipeline assembly of the present invention. DETAILED DESCRIPTION

[0030] The following is a further detailed description of a pipe assembly for semiconductor equipment proposed by the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any modification of the structure, change in the proportional relationship or adjustment of the size, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0031] In the semiconductor field, gases enter the reaction chamber through pipes, and the temperature and cleanliness of the pipes need to be strictly controlled. If the temperature is too low, the pipes will absorb gases and produce chemical reactions to generate or absorb particulate matter. It is usually necessary to maintain a certain temperature inside the pipes and purge and clean them at an appropriate temperature. At present, the main way to maintain the temperature of the pipes is through active heating and insulation. The traditional hot air gun purge pipes have high power loss and are large in size.

[0032] In order to solve this problem, the present invention proposes a pipeline assembly for semiconductor equipment, such as Figure 1 and 2As shown, the pipeline assembly includes a pipeline body 11, a cover 12, a heating module 13, a temperature control module 14 and a power supply (not shown in the figure). The pipeline body 11 includes an inner wall and an outer wall, which are used to pass the reaction gas. The cover 12 is arranged outside the pipeline body 11 and welded to the outer wall of the pipeline body 11. There is a sealed cavity 101 between the cover 12 and the outer wall, and the sealed cavity 101 is used to fill the insulation gas. The heating module 13 is arranged around the outer wall of the pipeline body 11 to heat the pipeline body 11 and the insulation gas in the sealed cavity 101. The insulation gas forms a gas insulation layer to keep the pipeline body 11 warm. The temperature control module 14 is connected to the heating module 13 through a circuit to control the heating power and frequency of the heating module 13; the temperature control module 14 can adjust the output power and frequency of the heating module 13 according to the real-time temperature value of the pipeline body 11. When the temperature value exceeds the set value, the power and frequency output of the heating module 13 are reduced. On the contrary, when the temperature value is lower than the set value, the power and frequency output of the heating module 13 are increased. The set value is generally in the range of 100°C-150°C, and can be higher or lower according to different processes. The power supply is connected to the heating module 13 and the temperature control module 14 in a circuit to provide power to the heating module 13 and the temperature control module 14. The power supply can be 220V AC.

[0033] Optionally, the heating module 13 is an induction heating coil, which enters the sealed cavity 101 through the hole on the surface of the cover shell 12 and is wound on the surface of the pipe body 11. The holes between the heating coil and the surface of the cover shell 12 are filled with high-temperature sealant to meet the sealing requirements. The pipe body 11 can be made of metal material, and a magnetic field is generated by alternating current, thereby generating eddy currents on the pipe body to achieve heating. In this example, the temperature control module 14 includes: a frequency control unit and a temperature detection unit. The frequency control unit is connected to the power supply and is used to control the frequency of the power supply, wherein the frequency range can be 50Hz to 1000Hz. The temperature detection unit can be a thermal resistor 102 arranged on the outer wall of the pipe body, which is used to detect the temperature of the outer wall in real time and transmit the detected temperature to the frequency control unit. The frequency control unit controls the frequency of the power supply according to the temperature. When the temperature value exceeds the set value, the frequency is reduced so that the heating module 13 outputs low power. On the contrary, when the temperature value is lower than the set value, the frequency is increased so that the heating module 13 outputs high power. The temperature control module 14 also has a communication interface for connecting an external device, and can transmit the power frequency and the detected temperature to the external device. The external device can be a cleaning system host device, and the pipeline assembly can be a part of the cleaning system host device. The surface temperature of the pipeline body 11 and the power supply frequency, output power, current and other electrical information of the induction heating coil 13 can be transmitted to the host device through the communication interface, which is convenient for the host device to record and display.

[0034] Furthermore, in this embodiment, if Figure 1 As shown, the surface of the pipeline body 11 is provided with a through hole 104 penetrating the inner wall and the outer wall thereof, and the sealed cavity 101 is connected with the interior of the pipeline body 11 through the through hole 104. The through hole 104 is provided on the surface of the pipeline body 11 located inside the sealed cavity 101. The heat-insulating gas can enter the interior of the pipeline body 11 through the through hole 104. On the one hand, the heat-insulating gas can protect and clean the inner wall of the pipeline body 11, and on the other hand, the heated heat-insulating gas can heat the reaction gas in the pipeline body 11, thereby maintaining the internal temperature of the pipeline body 11 in a stable range.

[0035] Furthermore, the exterior of the housing 12 is wrapped with heat insulating material to reduce heat loss and improve the heat generation efficiency of electric energy.

[0036] like Figure 2As shown, the housing 12 is connected to the heat preservation gas through a ferrule joint 103, and the ferrule joint 103 is arranged on the outer surface of the housing 12. The ferrule joint 103 can be easily connected and is applicable to various types of gas supply tanks. The heat preservation gas can be selected as nitrogen or inert gas with stable chemical properties. Furthermore, the ferrule joint 103 can also be replaced with other connection methods, such as pipe welding, plug-in, flange, etc.

[0037] In summary, the present invention realizes precise control of the temperature of the pipeline body by integrating the heating module and the temperature control module, and at the same time uses the heat preservation gas to form a gas insulation layer, which effectively reduces heat loss and improves energy utilization efficiency. In addition, the design of the communication interface and the diversified connection methods make the pipeline assembly more intelligent and flexible, and suitable for a variety of semiconductor devices.

[0038] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A pipe assembly for semiconductor equipment, characterized in that: include: A pipeline body, comprising an inner wall and an outer wall, for introducing reaction gas; A cover shell is disposed outside the pipeline body and is sealed with the outer wall, a sealed cavity is formed between the cover shell and the outer wall, and the sealed cavity is used to fill the heat preservation gas; A heating module surrounds the outer wall of the pipeline body; A temperature control module, which is connected to the heating module circuit and is used to control the heating power of the heating module; A power supply is circuit-connected to the heating module and the temperature control module.

2. The pipe assembly for semiconductor equipment according to claim 1, characterized in that: The heating module is an induction heating coil.

3. The pipe assembly for semiconductor equipment according to claim 2, characterized in that: The temperature control module comprises: A frequency control unit, connected to the power supply, for controlling the frequency and power of the power supply; A temperature detection unit, which is arranged on the outer wall of the pipeline body, is used to detect the temperature of the outer wall in real time and transmit the detected temperature to the frequency control unit, and the frequency control unit controls the frequency of the power supply according to the temperature; The communication interface is used to connect external devices and transmit the power frequency and temperature to the external devices.

4. The pipe assembly for semiconductor equipment according to claim 3, characterized in that: The frequency control unit controls the power supply frequency to range from 50 Hz to 1000 Hz.

5. The pipe assembly for semiconductor equipment according to claim 1, characterized in that: The pipeline body is provided with a through hole penetrating the inner wall and the outer wall thereof, and the sealing cavity is communicated with the interior of the pipeline body through the through hole.

6. The pipe assembly for semiconductor equipment according to claim 5, characterized in that: The through hole is arranged on the surface of the pipe body located inside the sealing cavity.

7. The pipeline assembly for semiconductor equipment according to claim 1, characterized in that: The outside of the cover is wrapped with heat insulation material.

8. The pipeline assembly for semiconductor equipment according to claim 1, characterized in that: The cover shell is connected to a device for providing heat-insulating gas through a ferrule joint.

9. The pipeline assembly for semiconductor equipment according to claim 1, characterized in that: The heat-insulating gas is nitrogen or an inert gas.

Images