Heat exchange single body and heat exchange device

Abstract

The invention relates to the technical field of heat exchange, particularly provides a heat exchange single body and a heat exchange device, and aims to solve the problem of how to improve the heat exchange efficiency of a heat exchanger. In order to achieve the purpose, the heat exchange single body comprises a current-carrying shell, a heat exchanger, a heat exchanger and a heat exchanger, a channel allowing fluid to pass through is formed in the current-carrying shell, and the current-carrying shell is made of a conductive material; the conductive structure is arranged on the outer surface of the current-carrying shell; and the first wire and the second wire are both connected with the current-carrying shell, the first wire is used for being connected with a power supply, and the second wire is used for being grounded, so that the conductive structure and the current-carrying shell form an electric conduction loop, and an electric field is formed around the conductive structure in a power-on state. The liquid film on the gas-liquid interface in the heat exchange process is disturbed through the electric field force so as to change the movement path of liquid drops or bubbles, the heat exchange efficiency can be remarkably improved, and therefore the application requirement of a high-efficiency heat exchange occasion can be met.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and specifically provides a heat exchange monomer and a heat exchange device. Background Art

[0002] As a device for heat exchange between hot and cold fluids, heat exchangers can be used directly or indirectly in engineering applications for the purpose of heat transfer. For example, shell and tube heat exchangers are widely used in energy and power, chemical production, transportation, and electronic products due to their simple structure and mature technology.

[0003] For heat exchangers, how to improve their heat transfer efficiency has always been a key research direction in this field. At present, it is generally adopted to set microstructures (such as micro grooves, rib arrays, porous medium layers) on the surface of the heat exchanger or spray metal particles to increase the area of ​​the heat exchange surface, thereby improving the heat transfer efficiency. However, when using the above methods, the improvement of heat transfer efficiency is restricted by the specific shape and size of the surface structure of the heat exchanger, and its effect on enhancing heat transfer is still limited. In other related technologies, the method of changing the wettability of the heat exchange surface is adopted, but this method also cannot significantly improve the heat transfer efficiency. Therefore, the above methods are difficult to meet the heat dissipation needs of some applications that require efficient heat exchange.

[0004] Accordingly, the art needs a new technical solution to solve the above problems. Summary of the invention

[0005] The present application aims to solve the above technical problem, that is, to solve the problem of how to improve the heat exchange efficiency of the heat exchanger.

[0006] In a first aspect, the present application provides a heat exchange monomer, comprising:

[0007] A current-carrying shell, wherein a channel for the fluid to pass through is formed inside the current-carrying shell, and the current-carrying shell is made of a conductive material;

[0008] A conductive structure, which is disposed on the outer surface of the current-carrying housing;

[0009] A first wire and a second wire are both connected to the current-carrying shell, the first wire is used to connect to a power source, and the second wire is used to be grounded, so that the conductive structure and the current-carrying shell form an electrical conduction loop, thereby forming an electric field around the conductive structure when powered on.

[0010] In a technical solution of the above heat exchange unit, the current-carrying shell is a tubular structure, and the conductive structure includes a plurality of conductive columns arranged in an array along the outer surface of the current-carrying shell.

[0011] In a technical solution of the above heat exchange unit, the cross-sectional area of ​​the conductive column gradually decreases in the radial outward direction of the current-carrying shell.

[0012] In a technical solution of the above heat exchange unit, the spacing between adjacent conductive pillars along the circumferential direction of the current-carrying shell is 0.5-1 mm; and / or

[0013] In the axial direction of the current-carrying housing, the spacing between adjacent conductive pillars is 1-2 mm.

[0014] In a technical solution of the above heat exchange unit, the current-carrying shell is a tubular structure, and the conductive structure includes a plurality of conductive ribs spaced apart along the circumferential direction of the current-carrying shell, and each of the conductive ribs extends along the axial direction of the current-carrying shell.

[0015] In a technical solution of the above heat exchange unit, in the circumferential direction of the current-carrying shell, the spacing between adjacent conductive ribs is 5-10 mm.

[0016] In a technical solution of the above heat exchange unit, the current-carrying shell is a tubular structure, and the conductive structure includes a conductive belt extending in a spiral shape along the outer surface of the current-carrying shell.

[0017] In a technical solution of the above heat exchange unit, the helix angle of the conductive tape is 30°-70°.

[0018] In a technical solution of the above heat exchange unit, the conductive structure is a flexible structure.

[0019] In a second aspect, the present application provides a heat exchange device, comprising:

[0020] A plurality of heat exchange monomers as described in any one of the first aspects, wherein the plurality of heat exchange monomers are connected in series or in parallel;

[0021] A liquid storage device is connected with the heat exchange monomer through a pipeline system to form a circulation loop.

[0022] As described above, when the above technical solution is adopted, during heat exchange, in the process of gas condensing into droplets around the conductive structure, or in the process of liquid boiling around the conductive structure to generate bubbles, due to the existence of the gas-liquid interface, the dielectric constant and density of the gaseous or liquid fluid suddenly change. After the first wire is connected to the external power supply to form an electric field around the conductive structure, the above gas-liquid interface moves under the action of Maxwell stress, thereby causing the liquid film initially formed at the gas-liquid interface to produce liquid suction and then pseudo-droplet condensation during the gas condensation process, accelerating the formation of droplets while causing large droplets formed by condensation to fall off quickly under the action of gravity. During the boiling process of the liquid, the liquid film close to the heat exchange surface is disturbed to promote the generation of bubbles, and at the same time, the bubbles are moved under the action of the above Maxwell stress to split into multiple small bubbles, which are more likely to overcome their own gravity and float upward and then detach from the heat exchange surface.

[0023] It can be seen that the present application arranges a conductive structure on the outer surface of the heat exchange unit, and forms an electric field around the conductive structure when connected to an external power supply, so that during the heat exchange process, the electric field force is used to disturb the liquid film at the gas-liquid interface to promote the formation of droplets or the generation of bubbles, thereby improving the heat exchange efficiency between the fluid around the heat exchange unit and the heat exchanger. Compared with the traditional method of processing microstructures, metal particles, etc. on the surface of the heat exchanger, the conductive structure of the present application is less affected by its own volume and structural characteristics. Moreover, the present application relies on the electric field force to disturb the liquid film at the gas-liquid interface during the heat exchange process to change the movement path of droplets or bubbles. Compared with the method of increasing the heat exchange surface, the heat exchange efficiency can be significantly improved, thereby meeting the application requirements of high-efficiency heat exchange occasions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, in which:

[0025] Figure 1 is a schematic diagram of a heat exchange unit according to the first embodiment of the present application;

[0026] Figure 2 yes Figure 1 A partial enlarged view of the outer surface of the heat exchange unit;

[0027] Figure 3 is a schematic diagram of a heat exchange unit according to a second embodiment of the present application;

[0028] Figure 4 yes Figure 3 A partial enlarged view of the outer surface of the heat exchange unit;

[0029] Figure 5 is a schematic diagram of a heat exchange unit according to a third embodiment of the present application;

[0030] Figure 6 yes Figure 5 A partial enlarged view of the outer surface of the heat exchange unit.

[0031] In the figures, the reference numerals refer to the following:

[0032] 1. Current-carrying shell; 2. Conductive structure; 21. Conductive column; 22. Conductive rib; 23. Conductive belt; 3. First conductor; 4. Second conductor. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not used to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0034] It should be noted that in the description of this application, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description, and does not indicate or imply that the relevant devices or components must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on this application. In addition, the ordinal numbers "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0035] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In order to facilitate understanding of the technical solution of the present application, a brief introduction to the heat exchanger and its working principle is first given. The heat exchanger is used in the field of heat exchange, and has two application scenarios. The first is to be used as a condenser (applied to phase change cooling systems, or air conditioning systems, etc., which require gas-liquid circulation). At this time, the heat exchanger needs to condense the gas (air or gaseous working fluid) in the surrounding space into liquid. The gas forms droplets and adheres to the surface of the heat exchanger during the heat exchange process with the fluid in the heat exchanger. Under the action of gravity, the droplets gradually fall off the surface of the heat exchanger, thereby realizing a two-phase circulation. The second is to be used as a heater (commonly seen in pool boiling heat exchange in the chemical industry). At this time, the heat exchanger is surrounded by liquid. During the circulation of the high-temperature fluid in the internal flow channel of the heat exchanger, the liquid around the heat exchanger is heated to make the liquid boil. When the liquid boils, bubbles are generated and adhere to the surface of the heat exchanger. Under the action of buoyancy, the bubbles gradually fall off the surface of the heat exchanger, thereby realizing a two-phase circulation.

[0037] In order to improve the heat exchange efficiency of the heat exchanger, in some related technologies, microstructures (such as micro grooves, rib arrays, porous medium layers) are set on the surface of the heat exchanger, or metal particles are sprayed to increase the area of ​​the heat exchange surface, thereby improving the heat exchange efficiency. In the above method, on the one hand, the efficiency improvement of the heat exchanger depends on the processing size or shape of its surface structure. For example, when a porous medium is used, the heat exchange efficiency depends on the porosity of the porous medium and the total surface area of ​​the porous medium layer. When a rib array, metal particles, etc. are used, the heat exchange efficiency is also affected by its size. Therefore, the above method is greatly affected by processing and it is difficult to meet the design concept of lightweight and compact heat exchangers. On the other hand, the above method of increasing the heat exchange efficiency by increasing the heat exchange area is restricted by various factors such as the actual application space and the size requirements of the heat exchanger, resulting in limited effect on enhancing heat exchange and difficulty in meeting the needs of some occasions that require efficient heat exchange.

[0038] In other related technologies, a wettability coating is added to the surface of the heat exchanger to change the hydrophilicity of the heat exchanger surface, thereby assisting droplets or bubbles to separate from the heat exchange surface during the heat exchange process. However, in the long-term use of the heat exchanger, the connection stability between the wettability coating and the heat exchanger body will be affected, and the two may be relatively separated, resulting in partial failure of the wettability coating. Moreover, the addition of a wettability coating will also increase the thermal resistance between the heat exchanger and the exchange fluid to a certain extent, and the material and thickness of the coating are required to be high. Therefore, this method does not play an obvious auxiliary role in heat exchange.

[0039] Reference Figure 1, is a heat exchange monomer according to an embodiment of the present application. It should be noted that the heat exchange monomer described in the present application refers to one of the heat exchange units of the heat exchange device, for example, it can be one of the heat exchange tubes of the heat exchange device, or one of the heat exchange plates, or other smallest units with special shapes, etc. The heat exchange device can include one or more heat exchange monomers.

[0040] This application takes a shell and tube heat exchanger as an example for illustrative explanation. Accordingly, the heat exchange unit includes a current-carrying shell 1 in the form of a tubular structure, a conductive structure 2 arranged on the outer surface of the current-carrying shell 1, and a first wire 3 and a second wire 4 arranged at both ends of the current-carrying shell 1.

[0041] Among them, the current-carrying shell 1 is made of a conductive material. For example, in some embodiments of the present application, the current-carrying shell 1 is a copper tube. The copper tube not only has good conductivity, but also has good thermal conductivity, which can simultaneously meet the electrical and thermal conductivity requirements of the current-carrying shell 1. The conductive structure 2 is arranged along the outer surface of the current-carrying shell 1. The conductive structure 2 can be a plurality of monomer structures arranged in a matrix on the outer surface of the current-carrying shell 1, or a continuous metal wire, metal sheet and other structures. The present application does not limit its specific structural form. The first wire 3 and the second wire 4 are both fixedly connected to the current-carrying shell 1. The first wire 3 is used to connect an external power supply, and the second wire 4 is used for grounding, so that the conductive structure 2 and the current-carrying shell 1 can form a closed electrical conduction loop, and an electric field can be formed around the conductive structure 2 after the external power supply is turned on.

[0042] During heat exchange, in the process of gas condensing into droplets around the conductive structure 2, or in the process of liquid boiling around the conductive structure 2 to generate bubbles, due to the existence of the gas-liquid interface, the dielectric constant and density of the gaseous or liquid fluid suddenly change. After the first wire 3 is connected to the external power supply to form an electric field around the conductive structure 2, the gas-liquid interface moves under the action of Maxwell stress, thereby causing the liquid film initially formed at the gas-liquid interface to produce liquid suction and then pseudo-droplet condensation during the gas condensation process, accelerating the formation of droplets while causing large droplets formed by condensation to fall off quickly under the action of gravity. During the boiling process of the liquid, the liquid film close to the heat exchange surface is disturbed to promote the generation of bubbles, and the bubbles are moved under the action of the above-mentioned Maxwell stress to split into multiple small bubbles, which are more likely to overcome their own gravity and float upward and then detach from the heat exchange surface.

[0043] As mentioned above, the present application sets a conductive structure 2 on the outer surface of the heat exchange unit, and forms an electric field around the conductive structure 2 when connected to an external power supply, so that during the heat exchange process, the electric field force is relied on to disturb the liquid film at the gas-liquid interface to promote the formation of droplets or the generation of bubbles, thereby improving the heat exchange efficiency between the fluid around the heat exchange unit and the heat exchanger. Compared with the traditional method of processing microstructures, metal particles, etc. on the surface of the heat exchanger, the conductive structure 2 of the present application is less affected by its own volume and structural characteristics. Moreover, the present application relies on the electric field force to disturb the liquid film at the gas-liquid interface during the heat exchange process to change the movement path of droplets or bubbles. Compared with the method of increasing the heat exchange surface, the heat exchange efficiency can be significantly improved, thereby meeting the application requirements of high-efficiency heat exchange occasions.

[0044] Reference Figure 1 In one implementation of the present application, the conductive structure 2 includes a plurality of conductive columns 21 arranged in an array along the outer surface of the current-carrying shell 1, and each conductive column 21 is independent of each other. The cross-section of the conductive column 21 can be circular, rectangular, polygonal or other special-shaped structures, and the present application does not impose any restrictions on this.

[0045] After the first wire 3 is connected to the external power supply, the charge will be concentrated at the end of each conductive column 21, and a relatively dense charge area will be formed around the top of each conductive column 21. Under the action of the electric field force formed at the top of the conductive column 21, the dipole energy in the liquid heat exchange fluid near the conductive column 21 is lower than that in the state without an electric field. At this time, the dipoles in the liquid fluid are easily attracted to the high-density electric field area where the conductive column 21 is located. It can be seen that when the heat exchange monomer is used as a heating component for pool boiling heat exchange, the liquid film in the boiling process is first more likely to move toward the conductive column 21 to form relatively large bubbles, and then the above-mentioned large bubbles are punctured by the top of the conductive column 21 to become multiple small bubbles. The adhesion between the small bubbles and the heat exchange surface and their own gravity are reduced, so that it is easier to move upward and leave the heat exchange surface. Similarly, when the heat exchange unit acts as a condensation component to condense the surrounding gaseous fluid, the liquid film formed by the condensation of the gaseous fluid is more likely to move toward the conductive column 21, and then be punctured by the conductive column 21 to transform the film-like condensation into pseudo-droplet-like condensation, thereby quickly falling off from the heat exchange surface under the action of gravity.

[0046] Optionally, as an implementation method, the cross-sectional area of ​​the conductive column 21 gradually decreases in the radial outward direction of the current-carrying housing 1, so as to be conical. In this way, the top of the conductive column 21 is a spike, and charges are more likely to accumulate at this position, forming a high-density charge area, thereby enhancing the attraction to the liquid film. On the other hand, the spike is also more likely to puncture the liquid film, thereby further improving the heat exchange efficiency.

[0047] Reference Figure 2In the circumferential direction of the current-carrying housing 1 , the spacing W1 between any adjacent conductive pillars 21 is 0.5-1 mm, and / or, in the axial direction of the current-carrying housing 1 , the spacing W2 between any adjacent conductive pillars 21 is 1-2 mm.

[0048] Reference Figure 3 , is a heat exchange unit according to another embodiment of the present application, the conductive structure 2 includes a plurality of conductive ribs 22 arranged at intervals along the circumferential direction of the current-carrying housing 1, and each conductive rib 22 extends along the axial direction of the current-carrying housing 1. The conductive rib 22 can be fixedly connected to the current-carrying housing 1 at both ends thereof, or can be fixedly connected to the outer surface of the current-carrying housing 1 as a whole, and the present application does not limit this.

[0049] Reference Figure 4 ,for Figure 3 A partial enlarged view of the surface of the heat exchange unit in the middle, optionally, the spacing between any two adjacent conductive ribs 22 is equal, and along the circumferential direction of the current-carrying shell 1, the spacing W3 between adjacent conductive ribs 22 is 5-10mm.

[0050] Reference Figure 5 , is a heat exchange unit according to another embodiment of the present application, the conductive structure 2 includes a plurality of conductive strips 23 extending in a spiral shape along the outer surface of the current-carrying housing 1. Each conductive strip 23 can be fixedly connected to the current-carrying housing 1 through its two ends, or can be fixedly connected to the outer surface of the current-carrying housing 1 as a whole, and the present application does not limit this.

[0051] Reference Figure 6 ,for Figure 5 A partial enlarged view of the surface of the heat exchange unit in the middle, optionally, the spacing between any adjacent conductive strips 23 is the same, and the spacing W4 is 5-10 mm. The helical angle β of the spiral conductive strip 23 is 30-70°.

[0052] As above, in Figure 3 and Figure 5In the illustrated embodiment, the conductive ribs 22 and the spiral conductive belt 23 are both continuous structures with a certain length extending along the outer surface of the current-carrying shell 1. Each conductive rib 22 or conductive belt 23 forms a relatively stable electric field. The complex electric field formed by multiple conductive ribs 22 or multiple conductive belts 23 generates an attractive force on the gas-liquid interface around them. Specifically, when the heat exchange unit is used as a heating component for pool boiling heat exchange, the electric field force generated by the conductive ribs 22 or conductive belts 23 will disturb the liquid close to the heat exchange surface, so that the liquid quickly generates larger bubbles when it approaches the phase change temperature. Then, the larger bubbles move under the action of the electric field force and contact and collide with the conductive ribs 22 or conductive belts 23 to split into small bubbles. The adhesion between the small bubbles and the heat exchange surface and their own gravity are reduced, so that they are more likely to move upward and leave the heat exchange surface. Similarly, when the heat exchange unit acts as a condensation component to condense the surrounding gaseous fluid, the electric field force disturbs the unstable gas-liquid interface and destroys the liquid film. After the continuous liquid film ruptures, pseudo-droplet condensation is formed under the action of the electric field force, thereby accelerating the shedding of the liquid film or droplets.

[0053] In addition, it should be noted that when the conductive structure 2 adopts the above-mentioned continuous conductive ribs 22 or conductive belts 23, the electric field force presents a state equivalent to a uniform and stable state. Regardless of whether it is a condensation process or a boiling process, the form presented in the intermediate process of the phase change of the fluid is a liquid film, and the liquid film is thicker in the initial stage. However, due to the disturbance of the electric field force, the thinning speed of the liquid film will be accelerated. Therefore, the rapid decrease in the thickness of the liquid film can reduce the thermal resistance between the heat exchange surface and the surrounding fluid, thereby improving the heat exchange efficiency.

[0054] As for the above-mentioned conductive structure 2 of the present application, it can be connected to the current-carrying housing 1 by welding or sintering.

[0055] This application takes the sintering of the conductive structure 2 and the current-carrying shell 1 as an example for illustrative explanation. Regardless of which form the conductive structure 2 is in the above embodiments, in specific processing, the current-carrying shell 1 and the conductive structure 2 can be processed separately first, and then the conductive structure 2 and the outer surface of the current-carrying shell 1 are sintered. In some implementations, the sintering temperature is 800℃-1000℃, the sintering time is 2h-4h, and after the sintering is completed, the current-carrying shell 1 and the conductive structure 2 are naturally cooled and solidified.

[0056] In the actual processing process, the annular clamping tool can be used as a carrier of the conductive structure 2. The conductive structure 2 is installed and fixed along the inner side of the clamping tool and then sleeved on the outer side of the current-carrying shell 1 to fix the conductive structure 2 relative to the current-carrying shell 1, and then the sintering process is performed.

[0057] In some embodiments, the conductive structure 2 of the present application is a flexible structure, for example, it is a flexible metal wire in structure form. When the conductive structure 2 is a flexible structure, the conductive structure 2 will be deformed when affected by external force during the heat exchange process, thereby changing the distribution of the electric field and enhancing the disturbance effect on the liquid film around the heat exchange surface. In particular, when the heat exchange monomer is used for pool boiling heat exchange, the surrounding heat exchange fluid will cause a certain collision force on the conductive structure 2 during the process of boiling and generating bubbles, causing the conductive structure 2 to deform.

[0058] In addition, during the process of deformation under force, the conductive structure 2 may swing back and forth in a small range due to the influence of inertia. At this time, the conductive structure 2 will also directly cause mechanical force on the liquid film, puncturing or breaking the liquid film, thereby promoting the condensation of droplets or the generation of bubbles, and improving the heat exchange efficiency.

[0059] It should be noted that when the conductive structure 2 is a conductive rib 22 or a spiral conductive belt 23, the two ends of the conductive rib 22 or the conductive belt 23 can be fixedly connected to the current-carrying shell 1. In this way, not only can the processing difficulty of the heat exchange unit be reduced on the basis of realizing the electrical conduction circuit, but also in this way, the main parts of the conductive rib 22 or the conductive belt 23 are separated from the outer surface of the current-carrying shell 1. Under the action of external force, the local position of the conductive rib 22 or the conductive belt 23 can form a small swing relative to the current-carrying shell 1, which is beneficial to generate mechanical force on the liquid film and improve the heat exchange efficiency.

[0060] It should also be noted that in the drawings of the present application, the outer surface of the current-carrying housing 1 is taken as an example of a smooth surface, but this does not constitute a limitation to the present application. In some other implementations, the outer surface of the current-carrying housing 1 may also be provided with structures such as ribs, threaded fins, etc. to increase the heat exchange area of ​​the current-carrying housing 1.

[0061] For example, when the current-carrying housing 1 is a copper tube with a smooth surface, its inner diameter can be selected to be 13 mm, its outer diameter can be 16 mm, and its length can be 200 mm. The conductive structure 2 is arranged in the middle part of the axial direction of the current-carrying housing 1. The size of the conductive structure 2 in the length direction of the current-carrying housing 1 can be determined according to actual needs. For example, when the two ends of the current-carrying housing 1 are not in contact with the heat exchange fluid, a distance can be left between the end of the conductive structure 2 and the end of the current-carrying housing 1, thereby saving material costs. When the outer surface of the current-carrying housing 1 is provided with ribs, the current-carrying housing 1 includes a base tube except the ribs. The inner diameter of the base tube can be selected to be 13.1 mm, and the outer diameter can be selected to be 14.3 mm. The outer diameter of the overall current-carrying housing 1 can be selected to be 15.8 mm, and the length can be selected to be 200 mm. When the outer surface of the current-carrying shell 1 is provided with spiral fins, the current-carrying shell 1 includes a base tube except the spiral fins, the inner diameter of the base tube can be selected as 13.1 mm, the outer diameter can be selected as 15.1 mm, the outer diameter of the overall current-carrying shell 1 can be selected as 18 mm, and the length can be selected as 200 mm. In addition, it should be noted that at this time, when the conductive structure 2 is a spiral conductive strip 23, the spiral angle of the conductive strip 23 and the spiral angle between the spiral fins on the outer surface of the current-carrying shell 1 can differ by 15°-30°.

[0062] The present application also discloses a heat exchange device, which includes the heat exchange monomer in any of the above embodiments, wherein in practical applications, the heat exchange device usually includes a plurality of heat exchange monomers, and the plurality of heat exchange monomers can be connected in series, in parallel, or in a mixed manner of series and parallel connection to form a pipeline network. The pipeline network formed by the plurality of heat exchange monomers is connected to a liquid storage device through a pipeline system, and a heat exchange medium is introduced into the heat exchange monomers through the liquid storage device, thereby forming a circulation loop.

[0063] The above-mentioned heat exchange device of the present application can be used as a condenser in a cooling system, or as a heater in pool boiling heat exchange. For example, when the heat exchange device is used as a condenser, multiple heat exchange units can be connected in series / parallel to form a cooling network to condense the surrounding gaseous working medium. When the heat exchange device is used as a heater, multiple heat exchange units can also be connected in series / parallel to form a heating network and immersed in the heat exchange fluid.

[0064] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A heat exchange monomer, characterized in that: include: A current-carrying shell, wherein a channel for the fluid to pass through is formed inside the current-carrying shell, and the current-carrying shell is made of a conductive material; A conductive structure, which is disposed on the outer surface of the current-carrying housing; A first wire and a second wire are both connected to the current-carrying shell, the first wire is used to connect to a power source, and the second wire is used to be grounded, so that the conductive structure and the current-carrying shell form an electrical conduction loop, thereby forming an electric field around the conductive structure when powered on.

2. The heat exchange monomer according to claim 1, characterized in that: The current-carrying housing is a tubular structure, and the conductive structure comprises a plurality of conductive pillars arranged in an array along the outer surface of the current-carrying housing.

3. The heat exchange monomer according to claim 2, characterized in that: The cross-sectional area of ​​the conductive column gradually decreases in a radially outward direction of the current-carrying housing.

4. The heat exchange monomer according to claim 2, characterized in that: In the circumferential direction of the current-carrying housing, the spacing between adjacent conductive pillars is 0.5-1 mm; and / or In the axial direction of the current-carrying housing, the spacing between adjacent conductive pillars is 1-2 mm.

5. The heat exchange monomer according to claim 1, characterized in that: The current-carrying housing is a tubular structure, and the conductive structure comprises a plurality of conductive ribs spaced apart along the circumferential direction of the current-carrying housing, and each of the conductive ribs extends along the axial direction of the current-carrying housing.

6. The heat exchange unit according to claim 5, characterized in that: In the circumferential direction of the current-carrying housing, the spacing between adjacent conductive ribs is 5-10 mm.

7. The heat exchange unit according to claim 1, characterized in that: The current-carrying housing is a tubular structure, and the conductive structure comprises a conductive belt extending in a spiral shape along the outer surface of the current-carrying housing.

8. The heat exchange unit according to claim 7, characterized in that: The helix angle of the conductive tape is 30°-70°.

9. The heat exchange monomer according to any one of claims 1 to 8, characterized in that: The conductive structure is a flexible structure.

10. A heat exchange device, characterized in that: include: A plurality of heat exchange monomers according to any one of claims 1 to 9, wherein the plurality of heat exchange monomers are connected in series or in parallel; A liquid storage device is connected with the heat exchange monomer through a pipeline system to form a circulation loop.

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