Operational amplifier test tool, system and method

Abstract

The invention belongs to the technical field of semiconductor chip testing, and particularly discloses an operational amplifier testing tool, system and method. The tool comprises a plurality of test board cards and a tool backboard. A connector is arranged on the tool back plate and is used for being connected with each test board card and introducing a test electric signal output by external test equipment for each test board card; each test board card comprises a test carrier plate and a core plate which are connected in sequence; each core board is connected with an operational amplifier to be tested; a control circuit and a test function circuit which are connected in sequence are arranged on each test carrier plate; the test function circuit comprises multiple types of test circuits; and each test carrier plate is used for driving the respective control circuit to gate the target test circuit in the multiple types of test circuits under the condition of receiving the test electric signal, so as to test the to-be-tested operational amplifier on the respective core plate in parallel under the respective corresponding target test circuit. According to the invention, the test efficiency of the operational amplifier can be greatly improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor chip testing technology, and more specifically, relates to an operational amplifier testing tool, system and method. Background Art

[0002] In the electronics manufacturing industry, operational amplifiers, as core components of the signal chain, undertake key functions such as proportional amplification, buffering and filtering.

[0003] However, at present, before testing the operational amplifier, it is usually necessary to independently make the corresponding test board according to the type of the operational amplifier to be tested and the test requirements. The whole process requires screening of a wide variety of electronic components, and the cycle of customizing the test board is long, so that the final test is usually done manually one by one, and multiple different operational amplifiers cannot be tested at the same time, which leads to the entire test cycle being too long, the operational amplifier test efficiency is low, and the product production efficiency is affected.

[0004] Therefore, how to better implement the testing of operational amplifiers has become a technical problem that needs to be solved urgently in the industry. Summary of the invention

[0005] In view of the defects of the prior art, the purpose of the present application is to better implement the test of the operational amplifier, aiming to solve the problem of low test efficiency of the operational amplifier in the prior art.

[0006] To achieve the above objectives, in a first aspect, the present application provides an operational amplifier test tool, comprising: A plurality of test boards and a tooling backplane; the tooling backplane is provided with a connector for connecting with each of the test boards to introduce a test electrical signal output by an external test device to each of the test boards; Each of the test boards includes a test carrier and a core board connected in sequence; each of the core boards is connected to an operational amplifier to be tested; each of the test carriers is provided with a control circuit and a test function circuit connected in sequence; the test function circuit includes multiple types of test circuits; Each of the test carriers is used to drive the respective control circuits to select the target test circuits among the multiple types of test circuits when receiving the test electrical signal, so as to test the operational amplifiers to be tested on the respective core boards in parallel under the respective corresponding target test circuits.

[0007] Optionally, the connector includes a first connector, a second connector and a third connector; the first connector, the second connector and the third connector are all connected to each of the test boards; The first connector is used to introduce power supply signals and control signals to each of the test boards, wherein the power supply signal is used to provide power to the operational amplifier to be tested on each test board; and the control signal is used to select a target test circuit among multiple types of test circuits on each test board; The second connector is used to introduce a test signal to each test board when each test board selects its own target test circuit, wherein the test electrical signal includes the power supply signal, the control signal and the test signal; The third connector is used to output the test results of the operational amplifier to be tested on each of the test boards after being processed by the test signal under the respective target test circuits.

[0008] Optionally, the control circuit on each of the test carriers comprises a microcontroller unit, a drive module, and a relay combination connected in sequence, wherein the relay combination comprises a multi-way relay, and the multi-way relay is connected to the multiple types of test circuits in a one-to-one correspondence; Each of the test boards is provided with an interface for connecting with the first connector, so that the first connector is connected with each of the test carriers; The microcontroller unit is used to receive the control signal and, under the instruction of the control signal, control the drive module to drive the relay combination to operate so that the multi-way relay is in a target opening and closing state to select the target test circuit among the multiple types of test circuits.

[0009] Optionally, a plurality of slots are provided on the tooling backplane, each slot is used for fixedly installing one of the test boards; the number of the slots is consistent with the number of the test boards.

[0010] Optionally, the tooling also includes: A tooling chassis; a power interface, a communication interface and a radio frequency signal interface are provided on the box surface of the tooling chassis; The tooling backplane is installed in the tooling chassis, and the output side of the power interface and the output side of the communication interface are both connected to the first connector of the tooling backplane; the signal input interface part of the RF signal interface is connected to the second connector of the tooling backplane, and the signal output interface part of the RF signal interface is connected to the third connector of the tooling backplane.

[0011] Optionally, each of the test boards adopts a VPX board, the tooling backplane adopts a VPX connector structure, and the tooling chassis adopts a VPX chassis.

[0012] Optionally, each of the core boards is provided with a temperature sensor, and the temperature sensor is used to monitor the operating temperature of the operational amplifier to be tested; each of the test carrier boards is provided with an alarm circuit connected to a microcontroller unit; Each of the temperature sensors is connected to a microcontroller unit on a corresponding test carrier board; The microcontroller unit on each of the test carriers is used to obtain the operating temperature of the corresponding operational amplifier to be tested, and trigger the corresponding monitoring circuit to alarm when the operating temperature of the corresponding operational amplifier to be tested exceeds a preset temperature threshold.

[0013] Optionally, each of the test carriers is provided with a target power supply circuit; each of the target power supply circuits includes a DC-DC converter and a low voltage drop linear regulator connected in sequence; The DC-DC converter is used to convert the voltage corresponding to the input power signal into an intermediate voltage close to the target voltage; The low voltage difference linear regulator is used to stabilize and adjust the intermediate voltage and output the target voltage; the target voltage is the operating voltage of the operational amplifier to be tested.

[0014] In a second aspect, the present application provides an operational amplifier test system, comprising any of the operational amplifier test fixtures described above, and also comprising a test device; The test equipment is connected to the operational amplifier test fixture; The testing device is used to input a test electrical signal to each test board in the operational amplifier testing fixture in response to a test instruction input by a user, so as to test the operational amplifier to be tested on each test board.

[0015] In a third aspect, the present application provides an operational amplifier testing method, which is applied to the aforementioned operational amplifier testing system, comprising: The test device receives a test instruction input by a user, and in response to the test instruction, inputs a test electrical signal to each test board in the operational amplifier test fixture; When receiving the test electrical signal, the test carrier on each test board drives the respective control circuit to select the target test circuit among the multiple types of test circuits, so as to test the operational amplifier to be tested on the respective core board in parallel under the respective corresponding target test circuit.

[0016] In general, the above technical solutions conceived by this application have the following beneficial effects compared with the prior art: The present application provides an operational amplifier test tool, system and method. Through a modular cascade design, the test board adopts a test carrier board to a core board mode, wherein the core board is used to connect the operational amplifier to be tested, and the test carrier board is provided with a control circuit and a test function circuit, so that the test of different test indicators of the operational amplifier can be completed on the same test board. At the same time, when testing different operational amplifiers, only the core board needs to be replaced without customizing and replacing the entire test board, thereby enhancing the interchangeability between test modules. By combining the parallel test design of multiple test boards, a multi-channel operational amplifier parallel test tool is realized, which can greatly shorten the entire test cycle of the operational amplifier, improve the test efficiency of the operational amplifier, and promote the improvement of the production efficiency of the operational amplifier. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is one of the structural schematic diagrams of the operational amplifier test tooling provided in the embodiment of the present application; Figure 2 This is the second structural schematic diagram of the operational amplifier test tooling provided in the embodiment of the present application; Figure 3 It is a schematic diagram of the control circuit principle structure of a single test board provided in an embodiment of the present application; Figure 4 It is a schematic diagram of the control principle flow of the test board provided in the embodiment of the present application; Figure 5 This is the third structural schematic diagram of the operational amplifier test tooling provided in the embodiment of the present application; Figure 6 It is one of the structural schematic diagrams of the operational amplifier test system provided in the embodiment of the present application; Figure 7 This is the second structural schematic diagram of the operational amplifier test system provided in the embodiment of the present application; Figure 8 It is a flowchart of the operational amplifier testing method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] The terms "first", "second", etc. in the specification and claims herein are used to distinguish different objects rather than to describe a specific order of the objects. For example, a first connector and a second connector are used to distinguish connectors with different functions rather than to describe a specific order of the connectors.

[0020] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0021] In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more than two. For example, multiple test boards refer to two or more test boards; multiple slots refer to two or more slots, etc.

[0022] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0023] Figure 1 is one of the structural schematic diagrams of the operational amplifier test tooling provided in the embodiment of the present application, such as Figure 1 As shown, the tool 10 includes: A plurality of test boards 1 and a tooling backplane 2; a connector 21 is provided on the tooling backplane 2 for connecting to each test board 1 and introducing a test electrical signal output by an external test device to each test board 1; Each test board 1 includes a test carrier 11 and a core board 12 connected in sequence; each core board 12 is connected to an operational amplifier 121 to be tested; each test carrier 11 is provided with a control circuit 111 and a test function circuit 112 connected in sequence, and the test function circuit 112 includes multiple types of test circuits 112; Each test carrier 11 is used to drive its own control circuit 111 to select a target test circuit among the multiple test circuits 112 when receiving a test electrical signal, so as to test the operational amplifiers to be tested on the respective core boards 12 in parallel under the respective corresponding target test circuits.

[0024] Specifically, the operational amplifier to be tested described in the embodiments of the present application may include an inverting amplifier, a non-inverting amplifier, a comparator, an integrator, and the like.

[0025] The core board described in the embodiment of the present application refers to an integrated circuit board mainly used to carry the operational amplifier to be tested. The core board can introduce signals to the test carrier board through a connector provided thereon, thereby realizing the connection between the two.

[0026] The test function circuit described in the embodiment of the present application refers to a functional module covering multiple types of test circuits, wherein the multiple types of test circuits may include functional test circuits such as in-phase proportional amplification, inverting proportional amplification, voltage following, and second-order active low-pass filtering. It is understandable that the design of the test function circuit can be determined according to the type of operational amplifier actually tested.

[0027] The target test circuit described in the embodiment of the present application refers to a type of test circuit selected from multiple types of test circuits for testing functional circuits, which can be specifically determined according to the test requirements of the actual operational amplifier to be tested.

[0028] In the embodiment of the present application, the tooling is mainly composed of a plurality of test boards 1 and a tooling backplane 2. The tooling backplane 2 can serve the purpose of carrying a plurality of test boards 1, and through the connector 21 provided on the tooling backplane 2, the connection between the external test equipment and each test board 1 is realized, so that the test electrical signal output by the external test equipment can be introduced into each test board 1.

[0029] In the embodiment of the present application, each test board 1 includes a test carrier 11 and a core board 12 connected in sequence; each core board 12 is connected to an operational amplifier 121 to be tested, and each test carrier 11 is provided with a control circuit 111 and a test function circuit 112 connected in sequence, and the test function circuit 112 includes multiple types of test circuits 112. Through the control logic of the control circuit 111, a certain type of circuit in the multiple types of test circuits 112 can be selected, so that different test conditions of different operational amplifiers can be simulated, and different functions of different operational amplifiers can be tested.

[0030] In the specific implementation process, the test electrical signal output by the external test equipment is introduced into each test board 1 through the connector 21 on the tooling backplane 2, and then each test carrier 11 can receive the test electrical signal. After receiving the test electrical signal, the control circuit 111 on each test carrier 11 is driven to select the target test circuit in the multi-type test circuit 112, so that each test board 1 can test the operational amplifier to be tested on each core board 12 in parallel under the corresponding target test circuit.

[0031] It should be noted that the operational amplifiers 121 to be tested set on each core board 12 can be different or the same. For example, when the operational amplifiers 121 to be tested set on each core board 12 are different, different functional indicators of different operational amplifiers 121 to be tested can be tested in parallel; when the operational amplifiers 121 to be tested set on each core board 12 are the same, different functional indicators of the same operational amplifier 121 to be tested can be tested in parallel. The above-mentioned tooling test mode can be adaptively selected by the user according to actual needs, and this application does not make specific restrictions on this.

[0032] It should also be noted that the number of test boards 1 participating in the parallel test can be freely set according to the actual test requirements and hardware environment, and can be 2 to 10, or even more, and this application does not make specific limitations on this.

[0033] The operational amplifier test tooling of the embodiment of the present application adopts a modular cascade design, and the test board adopts a test carrier board to a core board mode, wherein the core board is used to connect the operational amplifier to be tested, and the test carrier board is provided with a control circuit and a test function circuit, so that the testing of different test indicators of the operational amplifier can be completed on the same test board. At the same time, when testing different operational amplifiers, only the core board needs to be replaced without customizing and replacing the entire test board, thereby enhancing the interchangeability between test modules. By combining the parallel test design of multiple test boards, a multi-channel operational amplifier parallel test tooling is realized, which can greatly shorten the entire test cycle of the operational amplifier, improve the test efficiency of the operational amplifier, and promote the improvement of the production efficiency of the operational amplifier.

[0034] Figure 2 2 is a schematic diagram of the structure of the operational amplifier test tool provided in the embodiment of the present application. Figure 2 As shown, in the embodiment of the present application, the connector 21 includes a first connector 211, a second connector 212 and a third connector 213; the first connector 211, the second connector 212 and the third connector 213 are all connected to each test board 1; The first connector 211 is used to introduce power supply signals and control signals to each test board 1. The power supply signal is used to provide power to the operational amplifier 121 to be tested on each test board 1; the control signal is used to select the target test circuit among the multiple types of test circuits on each test board 1; The second connector 212 is used to introduce a test signal to each test board 1 when each test board 1 selects its own target test circuit; the test electrical signal includes a power signal, a control signal and a test signal; The third connector 213 is used to output the test result of the operational amplifier 121 to be tested on each test board 1 after being processed by the test signal under the respective target test circuit.

[0035] Specifically, in the embodiment of the present application, the connector 21 provided on the tooling back plate 2 may specifically include three types of connectors, namely a first connector 211 , a second connector 212 and a third connector 213 .

[0036] More specifically, in an embodiment of the present application, the tooling backplane 2 may adopt a VPX architecture, and its VPX standard connector adopts a PCB chip form, with a crosstalk of no more than 3%, excellent impedance control effect, and can fully meet the needs of high-speed data transmission.

[0037] Correspondingly, in the embodiment of the present application, each test board 1 can adopt a VPX board, for example, a standard 3U VPX board. A 3U VPX board usually includes three interfaces, P0, P1, and P2, which are used for signal connection between the test board and the daughter board and the tooling backplane.

[0038] It should be noted that in the 3U VPX board, P0 has an 8-chip structure, of which 3 chips are power supplies, which can provide ±12V, ±5V, and ±3.3V power supplies, 3 chips are single-ended signal chips, and the other 2 chips are differential signal chips; P1 has a 16-chip structure, which provides 16 sets of differential pair signals; P2 also has a 16-chip structure, which can provide 16 sets of differential pair signals or 16 single-ended signals.

[0039] Furthermore, in an embodiment of the present application, the first connector 211 of the tooling backplane 2 undertakes functions such as power management and serial communication, covering power pins, communication lines between external test equipment and test boards, JTAG interfaces, and chassis ground signals, and can build a two-way communication bridge between external test equipment and the control unit on the test carrier 11.

[0040] Specifically, the first connector 211 can introduce a power signal to each test board 1 by connecting to the P0 interface of each test board 1, thereby providing power for the operational amplifier 121 to be tested on each test board 1; at the same time, a control signal can also be introduced to command the control circuit 111 to select the target test circuit among the multiple types of test circuits on each test board 1.

[0041] In an embodiment of the present application, the second connector 212 of the tooling backplane 2 is connected to the P1 interface of each test board, and can provide an input test signal to the operational amplifier 121 under test when each test board 1 selects its own target test circuit.

[0042] The third connector 213 is connected to the P2 interface of each test board, and can provide an output signal connection for the operational amplifier 121 to be tested, that is, the test result of the operational amplifier 121 to be tested on each test board 1 after the test signal processing under the respective target test circuit is output through the third connector 213, so as to ensure the integrity and stability of the signal in high-frequency applications.

[0043] Among them, the VPX connector component model used can be VPX-21T8aDD8-A / VPX-21Z8fDD8-A, which is specifically composed of 1 basic module and 2 RF modules.

[0044] It should be noted that the tooling backplane 2 adopts a standardized VPX connector design to ensure seamless docking with the test board 3UVPX board. The unified interface standard simplifies the interoperability between modules and greatly improves compatibility. It not only ensures the consistency of physical size and interface, but also enables test boards with different functions to be seamlessly integrated into a unified test platform. The core board 12 of the same size and different functions is connected to the test carrier board 11 through a connector, without worrying about size mismatch or interface incompatibility.

[0045] Optionally, in an embodiment of the present application, an SMA / SMP debugging interface can be reserved on the test carrier 11. In this way, in addition to being transmitted through the VPX connector on the tooling backplane 2, the input and output test signals can also be directly transmitted through these SMA / SMP interfaces, thereby providing a variety of signal access methods for testing and enhancing flexibility of use.

[0046] The tooling of the embodiment of the present application can ensure the high-speed transmission performance, high reliability and stability of the tooling by adopting the VPX standard to modularly design the operational amplifier test tooling, thereby further improving the operational amplifier test efficiency and enhancing the test stability.

[0047] Figure 3 : is a schematic diagram of the control circuit principle structure of a single test board provided in an embodiment of the present application, such as Figure 3 As shown, in the embodiment of the present application, the control circuit 111 on each test carrier 11 includes a microcontroller unit (MCU), a drive module, and a relay combination connected in sequence, and the relay combination includes a multi-way relay, and the multi-way relay is connected to multiple types of test circuits in a one-to-one correspondence; Each test board 1 is provided with an interface for connecting with the first connector 211 so that the first connector 211 is connected with each test carrier 11; The microcontroller unit MCU is used to receive control signals, and under the instruction of the control signals, control the driving module to drive the relay combination to operate, so that the multi-channel relays are in the target opening and closing state, so as to select the target test circuit among the multiple types of test circuits.

[0048] Specifically, in the embodiment of the present application, each test board 1 can adopt a VPX board, and each test board 1 is provided with interfaces, namely, P0, P1, and P2 interfaces. Among them, the P0 interface is used to connect with the first connector 211, so that the first connector 211 realizes electrical connection with each test carrier 11. Similarly, the P1 interface is connected with the second connector 212, and the P2 interface is connected with the third connector 213, thereby realizing the electrical connection between the second connector 212, the third connector 213 and each test carrier 11.

[0049] In an embodiment of the present application, the control circuit 111 on each test carrier 11 includes a microcontroller unit MCU, a drive module and a relay combination connected in sequence, and the relay combination includes a multi-way relay, and the multi-way relay is connected to multiple types of test circuits in a one-to-one correspondence.

[0050] In this way, after the input control signal enters the test carrier 11 from the first connector 211 of the tooling backplane 2, the microcontroller unit MCU excites the driving module under the instruction of the control signal, and then the driving module drives the opening and closing state of the relay combination. By controlling the opening and closing state of the multi-way relays, the multi-way relays are placed in the target opening and closing state, and the target test circuit among the multiple types of test circuits is selected.

[0051] During the test process, according to different test requirements, the test carrier 11 can control the switching of the relay, so as to accurately select different circuit channels and route the corresponding test signal to the input end of the corresponding operational amplifier 121 to be tested, ensuring that each operational amplifier 121 to be tested can receive an accurate test signal, so as to adapt to different test conditions and carry out various test items.

[0052] The tooling of the embodiment of the present application realizes adjustable control of multiple test channels by constructing a control circuit using a microcontroller unit, a drive module and a relay combination. Multiple operating modes can be defined for the test carrier board to adapt to changing test scenarios without making hardware changes. It can adapt to the testing requirements of amplifier chips of different types and specifications, further improving the applicability and flexibility of the operational amplifier test tooling.

[0053] Continue to refer to Figure 3 ,like Figure 3 As shown, in some embodiments, an SMA interface (or SMP interface) can be pre-set on each test carrier 11 for testers to choose from, providing a variety of signal access methods for testing, adapting to different test scenarios, and further improving the applicability of the operational amplifier test tooling.

[0054] Continue to refer to Figure 3 , based on the content of the above embodiment, as an optional embodiment, each core board 12 is provided with a temperature sensor 122, and the temperature sensor 122 is used to monitor the operating temperature of the operational amplifier 121 to be tested; each test carrier board 11 is provided with an alarm circuit connected to the microcontroller unit MCU; Each temperature sensor 122 is connected to a microcontroller unit MCU on a corresponding test carrier board 11; The microcontroller unit MCU on each test carrier 11 is used to obtain the operating temperature of the corresponding operational amplifier 121 to be tested, and trigger the corresponding monitoring circuit to alarm when the operating temperature of the corresponding operational amplifier 121 to be tested exceeds a preset temperature threshold.

[0055] Specifically, the preset temperature threshold described in the embodiment of the present application refers to the over-temperature threshold of the operational amplifier, which can be determined according to the type of the operational amplifier being tested.

[0056] In the embodiment of the present application, each core board 12 is provided with a temperature sensor 122, which can be packaged into a uniform size together with the connector thereon after being connected to the operational amplifier 121 to be tested. The temperature sensor 122 on each core board 12 is connected to the microcontroller unit MCU in the control circuit 111 on the corresponding test carrier board 11.

[0057] More specifically, in this embodiment, the temperature sensor 122 can use an I2C bus interface to transmit the collected temperature data to the MCU on the test carrier 11 in real time. The MCU continuously monitors these temperature values, and once the operating temperature of a certain operational amplifier 121 to be tested exceeds the preset temperature threshold, the monitoring circuit will issue an alarm signal. In this way, the test personnel can be effectively prompted to handle it in time, avoiding damage to the operational amplifier due to overheating, and ensuring that the entire test process is carried out within a safe temperature range.

[0058] Figure 4 : is a schematic diagram of the control principle flow of the test board provided in the embodiment of the present application, such as Figure 4 As shown, in the embodiment of the present application, the tester debugs the control serial port of the test equipment connected to the tooling and sends the test command, and the command is transmitted to the microcontroller unit MCU of the test carrier 11 on the test board 1 through the communication line (such as RS232 standard) provided by the first connector 211 of the tooling backplane 2. According to the received command, the microcontroller unit MCU drives and controls the relay combination on the test carrier 11 through the driving module, that is, the Darlington tube, and configures the corresponding test function for each operational amplifier, that is, selects the corresponding target test circuit from the pre-designed test function circuit 112, for example, decides whether to perform the in-phase proportional amplification test, the reverse proportional amplification test, the voltage follower test or the second-order active low-pass filter test. Among them, the test function circuit 112 contains a plurality of typical circuits for operational amplifier testing.

[0059] Therefore, through different relay state combinations, different peripheral circuit configurations can be simulated to meet the needs of different functional tests.

[0060] At the same time, the temperature sensor 122 on each core board 12 communicates with the microcontroller unit MCU through the I2C bus interface to provide real-time feedback on the operating temperature monitoring result of the operational amplifier to be tested.

[0061] Continue to refer to Figure 3 , based on the content of the above embodiment, as an optional embodiment, each test carrier 11 is provided with a target power supply circuit; each target power supply circuit includes a direct current-to-direct current (DC-DC) converter 113 and a low voltage difference linear (LDO) regulator 114 connected in sequence; The DC-DC converter 113 is used to convert the voltage corresponding to the input power signal into an intermediate voltage close to the target voltage; The LDO regulator 114 is used to stabilize and adjust the intermediate voltage and output a target voltage; the target voltage is the operating voltage of the operational amplifier to be tested.

[0062] Specifically, in the embodiments of the present application, the target power supply circuit may be integrated into each test carrier board 11 by means of an integrated circuit.

[0063] In an embodiment of the present application, after the external input power signal is introduced into the test carrier 11 via the first connector 211 of the tooling backplane 2, it is first converted by the DC-DC converter 113 to convert the voltage corresponding to the input power signal into an intermediate voltage close to the target voltage, and then further stabilized and adjusted by the LDO regulator 114 to provide an operating voltage for the corresponding operational amplifier 121 to be tested.

[0064] At the same time, in the embodiment of the present application, by adjusting the output of the DC-DC converter, the operational amplifier 121 under test can also be subjected to a power pull-off test to evaluate their performance and stability under different power supply conditions, which helps to discover potential power supply sensitivity issues.

[0065] In addition, other power management-related control signals can also be exchanged between the test equipment and the test carrier through the first connector 211 of the tooling backplane 2 to achieve control of other functions such as monitoring of the power status.

[0066] The tooling of the embodiment of the present application, by constructing a power supply circuit using a DC-DC converter and an LDO regulator, can provide a stable and reliable voltage source for the operational amplifier being tested, which is beneficial to improving the stability and reliability of the operational amplifier testing process.

[0067] Based on the content of the above embodiment, as an optional embodiment, a plurality of slots are provided on the tooling backplane 2 , each slot is used for fixing and installing a test board 1 ; the number of the slots is consistent with the number of the test boards 1 .

[0068] The tooling of the embodiment of the present application, by designing the tooling backplane as a slot structure, allows different types of test boards to be inserted as needed without replacing the entire backplane, making maintenance and upgrading easy, thereby improving the flexibility and scalability of the operational amplifier test tooling.

[0069] Figure 5 3 is a schematic diagram of the structure of the operational amplifier test tool provided in the embodiment of the present application. Figure 5 As shown, as an optional embodiment, the tooling also includes: The tooling chassis 3; a power interface 31, a communication interface 32 and a radio frequency signal interface 33 are provided on the surface of the tooling chassis 3; The tooling backplane 2 is installed in the tooling chassis 3, and the output side of the power interface 31 and the output side of the communication interface 32 are both connected to the first connector 211 of the tooling backplane 2; the signal input interface part of the RF signal interface 33 is connected to the second connector 212 of the tooling backplane 2, and the signal output interface part of the RF signal interface 33 is connected to the third connector 213 of the tooling backplane 2.

[0070] Specifically, in the embodiment of the present application, each test board 1 adopts a VPX board, the tooling backplane 2 adopts a VPX connector structure, and the tooling chassis 3 can also be adapted to adopt a VPX chassis. Specifically, the tooling chassis 3 can adopt a standard 19-inch upper cabinet 3U VPX chassis, which has a reinforced mechanical structure and strong cooling capacity, good environmental adaptability, and can resist vibration, shock, and cope with harsh conditions such as rapid changes in wide temperature environments. In addition, Figure 5 As shown, three different interfaces are arranged on the side surface of the tooling chassis 3, namely, a power interface 31, a communication interface 32 and a radio frequency signal interface 33, which respectively correspond to input strong electric signals (power supply), weak electric signals (control signals) and analog signals (amplifier signals).

[0071] More specifically, in the embodiments of the present application, the power interface and the communication interface can both be in the form of aviation sockets, and the RF signal interface can support VPX interface communication and SMA / SMP interface communication.

[0072] It should be noted that the input side of the power interface 31 is connected to the port for providing power to the external test equipment, the input side of the communication interface 32 is connected to the port for outputting control signals of the external test equipment, and the RF signal interface 33 is connected to the signal test port of the external test equipment.

[0073] The tooling of the embodiment of the present application is designed and optimized according to the VPX standard, and the tooling backplane equipped with the test board is further installed in the VPX chassis to form the tooling as a whole. After debugging, the tooling equipment can be greatly improved with multiple advantages such as high-speed data transmission, low latency, high bandwidth, scalability, reliability, resistance to harsh environments, modular design and standardized interfaces, thereby further improving the test efficiency and quality of operational amplifiers.

[0074] Figure 6 is one of the structural diagrams of the operational amplifier test system provided in the embodiment of the present application, such as Figure 6 As shown, the system includes any of the aforementioned operational amplifier test fixtures 10, and also includes a test device 20; The testing device 20 is connected to the operational amplifier testing fixture 10; The testing device 20 is used to input a test electrical signal to each test board in the operational amplifier testing fixture 10 in response to a test instruction input by a user, so as to test the operational amplifier to be tested on each test board.

[0075] Specifically, in the embodiment of the present application, the test device 20 and the connector 21 on the tooling backplane 2 of the operational amplifier test tooling 10 are used to realize information communication between the test device 20 and the test carrier board 11 and the core board 12 through the connector 21 .

[0076] In an embodiment of the present application, the test device 20 allows the user to input test instructions at the front end, and the back end of the test device 20 will respond to the test instructions input by the user and input a test electrical signal to each test board 1 in the operational amplifier test fixture 10 to test the operational amplifier 121 to be tested on each test board 1 based on the test electrical signal.

[0077] In the specific implementation process, first, each operational amplifier 121 to be tested is installed on the corresponding core board 12 respectively, and the connector of the core board 12 is reliably connected to the test carrier board 11 to ensure that the signal path is normal. Then, the test board 1 is physically connected with the tooling backboard 2. For example, the tooling backboard 2 is provided with a slot structure, and the test board 1 is inserted into the corresponding slot of the tooling backboard 2, so that the whole test tool can form a complete electrical system. At this time, the external 12V power supply can be powered by each module through the connector 21 of the tooling backboard 2, and the test tool enters the standby state, and each module completes the initialization setting and waits for the test instruction.

[0078] Then, the test instruction is sent through the test device 20, and the test instruction is transmitted to the control circuit 111 on the test carrier 11 through the communication line provided by the connector 21 of the tooling backplane 2. The control circuit 111 controls the test function circuit on the test carrier 11 according to the received instruction, configures the corresponding test function for each operational amplifier 121 to be tested, and determines the corresponding target test circuit.

[0079] After completing the functional configuration, the test signal is input from the external test equipment 20 to the test carrier 11 via the connector 21 of the tooling backplane 2. The test carrier 11 accurately routes the input signal to the input end of the corresponding operational amplifier 121 to be tested according to the preset target test circuit. For multiple operational amplifiers 121 to be tested, this process is carried out in parallel, and each operational amplifier can receive the test signal required by each at the same time, thereby achieving the high efficiency of parallel testing.

[0080] Further, in the embodiment of the present application, after receiving the corresponding test signals, the plurality of operational amplifiers 121 to be tested perform corresponding processing operations such as amplification and filtering on the signals according to the preset functional configuration and parameter settings, and then output the processed signals. The output signals processed by the operational amplifiers 121 to be tested are routed through the corresponding circuits on the test carrier 11, and transmitted back to the external test equipment 20 through the connector 21 of the tooling backplane 2, thereby completing the parallel testing of the multi-channel operational amplifiers.

[0081] The operational amplifier test system of the embodiment of the present application implements a modular cascade design for its tooling, and the internal test board adopts a test carrier board to a core board mode, wherein the core board is used to connect the operational amplifier to be tested, and the test carrier board is provided with a control circuit and a test function circuit, so that the testing of different test indicators of the operational amplifier can be completed on the same test board. At the same time, when testing different operational amplifiers, only the core board needs to be replaced without customizing and replacing the entire test board, thereby enhancing the interchangeability between test modules. By combining the parallel test design of multiple test boards, a multi-channel operational amplifier parallel test tooling is realized, which can greatly shorten the entire test cycle of the operational amplifier, improve the test efficiency of the operational amplifier, and promote the improvement of the production efficiency of the operational amplifier.

[0082] Figure 7 FIG. 2 is a second structural diagram of the operational amplifier test system provided in an embodiment of the present application. Figure 7 As shown, in an embodiment of the present application, the test device 20 can provide an interface panel and a programmable power supply function. The user can set the relevant interface parameters of the power signal, control signal and radio frequency test signal through the interface panel to set different test scenarios as required; the power required for the operational amplifier test tool 10 can also be set and adjusted through the programmable power supply function.

[0083] In the embodiment of the present application, the operational amplifier test fixture 10 is mainly composed of a test board 1, a fixture backplane 2 and a fixture chassis 3. After each test board 1 is installed in the corresponding slot on the fixture backplane 2, it is fixedly installed in the fixture chassis 3, and various electrical connections are completed at the same time, so that the entire fixture forms a complete electrical system. Thus, the power output of the test equipment 20 can be introduced through the power interface on the fixture chassis 3, and the amplifier test carrier board, monitoring system and other parts in the chassis are powered through the first connector 211 on the fixture backplane 2, and a connection channel is provided for the inside and outside of the test chassis and between the boards.

[0084] In an embodiment of the present application, the control signal output by the test equipment 20 can be introduced through the communication interface on the tooling chassis 3, and the control signal is then introduced into the control circuit 111 on the test carrier 11 through the first connector 211 on the tooling backplane 2. Through the instruction processing of the microcontroller unit MCU in the control circuit 111 and the opening and closing state control of the relay combination, the target test circuit for testing each operational amplifier 121 to be tested is selected to complete the relevant functional configuration.

[0085] After completing the functional configuration, the test signal is input from the test equipment 20 to the test carrier 11 via the second connector 212 of the tooling backplane. The test carrier 11 accurately distributes the signal to the input end of the corresponding operational amplifier 121 to be tested according to the preset channel switching logic and the state of the relay, ensuring that each operational amplifier receives the correct test signal. In this way, the signal output by each operational amplifier 121 to be tested is then routed to the third connector 213 of the tooling backplane 2 by the circuit on the test carrier 11 according to the established rules, and then transmitted back to the test equipment 20 for result analysis. In the whole process, the relay on the test carrier 11 plays a key role in signal routing and switching, and realizes a variety of test condition configurations through different combination states to meet various functional and performance test requirements.

[0086] At the same time, in this process, the standardized test points on the test carrier 11 also play an important role. These test points cover key interfaces such as power supply, input signal and output signal. They can be connected to the test equipment 20 through direct circuit connection or using cables, which facilitates the test equipment 20 to perform real-time monitoring and data collection on key signals, and obtain the output results of each operational amplifier 121 under test under different test items, such as output voltage range, gain bandwidth product, total harmonic distortion, input offset voltage, frequency response, slew rate and other performance indicator data.

[0087] Optionally, in an embodiment of the present application, according to specific test items, the test device 20 can also send relevant parameter setting information such as amplification factor to the microcontroller unit MCU through the communication interface. The microcontroller unit MCU can further control the opening and closing state of the relay combination, accurately adjust the test conditions of each operational amplifier, and ensure that the test parameters meet the requirements.

[0088] In the embodiments of the present application, through the specific testing process within the above-mentioned tooling and the signal processing mechanism between the various modules, the testing tooling can efficiently and accurately carry out functional and performance tests on different operational amplifiers at the same time, and monitor the working status of the operational amplifier in real time during the test process, thereby ensuring the reliability and safety of the test and meeting the requirements for operational amplifier verification work in different application scenarios.

[0089] The operational amplifier testing method provided in the present application is described below. The operational amplifier testing method described below and the operational amplifier testing system described above can be referenced to each other.

[0090] Figure 8 is a flow chart of an operational amplifier testing method provided in an embodiment of the present application, which is applied to the aforementioned operational amplifier testing system, such as Figure 8 As shown, including: Step S1, the test device receives a test instruction input by a user, and in response to the test instruction, inputs a test electrical signal to each test board in the operational amplifier test fixture; Step S2, when receiving the test electrical signal, the test carrier on each test board drives the respective control circuit to select the target test circuit among the multiple types of test circuits, so as to test the operational amplifier to be tested on the respective core board in parallel under the respective corresponding target test circuits.

[0091] It is understandable that the detailed functional implementation of the above steps can be found in the introduction of the aforementioned system embodiment, and will not be repeated here.

[0092] It should be understood that the above method is applied to the system in the above embodiment, and the implementation principle and technical effect of the corresponding program of the method are similar to those described in the above system. The implementation process of the method can refer to the corresponding process in the above system, which will not be repeated here.

[0093] The operational amplifier testing method of the embodiment of the present application implements a modular cascade design for its tooling, and the internal test board adopts a test carrier board to a core board mode, wherein the core board is used to connect the operational amplifier to be tested, and the test carrier board is provided with a control circuit and a test function circuit, so that the testing of different test indicators of the operational amplifier can be completed on the same test board. At the same time, when testing different operational amplifiers, only the core board needs to be replaced without customizing and replacing the entire test board, thereby enhancing the interchangeability between test modules. By combining the parallel test design of multiple test boards, a multi-channel operational amplifier parallel test tooling is realized, which can greatly shorten the entire test cycle of the operational amplifier, improve the test efficiency of the operational amplifier, and promote the improvement of the production efficiency of the operational amplifier.

[0094] Based on the method in the above embodiment, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program runs on a processor, the processor executes the method in the above embodiment.

[0095] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0096] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

[0097] It should be understood that expressions such as "including" and "may include" that may be used in the present application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In the present application, terms such as "including" and / or "having" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0098] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. "Rotational connection" means that the two are connected to each other and can rotate relative to each other after the connection. "Sliding connection" means that the two are connected to each other and can slide relative to each other after the connection. The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0099] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An operational amplifier test tool, characterized in that: include: Multiple test boards and tooling backplanes; The tooling backplane is provided with a connector for connecting to each of the test boards to introduce a test electrical signal output by an external test device to each of the test boards; Each of the test boards includes a test carrier and a core board connected in sequence; each of the core boards is connected to an operational amplifier to be tested; each of the test carriers is provided with a control circuit and a test function circuit connected in sequence; the test function circuit includes multiple types of test circuits; Each of the test carriers is used to drive its own control circuit to select the target test circuit among the multiple types of test circuits when receiving the test electrical signal, so as to test the operational amplifiers to be tested on the respective core boards in parallel under the respective corresponding target test circuits.

2. The operational amplifier test fixture according to claim 1, characterized in that: The connector comprises a first connector, a second connector and a third connector; the first connector, the second connector and the third connector are all connected to each of the test boards; The first connector is used to introduce power supply signals and control signals to each of the test boards, wherein the power supply signal is used to provide power to the operational amplifier to be tested on each test board; and the control signal is used to select a target test circuit among multiple types of test circuits on each test board; The second connector is used to introduce a test signal to each test board when each test board selects its own target test circuit; the test electrical signal includes the power supply signal, the control signal and the test signal; The third connector is used to output the test results of the operational amplifier to be tested on each of the test boards after being processed by the test signal under the respective target test circuits.

3. The operational amplifier test fixture according to claim 2, characterized in that: The control circuit on each of the test carriers includes a microcontroller unit, a drive module, and a relay assembly connected in sequence, wherein the relay assembly includes a multi-way relay, and the multi-way relay is connected to the multiple types of test circuits in a one-to-one correspondence; Each of the test boards is provided with an interface for connecting with the first connector, so that the first connector is connected with each of the test carriers; The microcontroller unit is used to receive the control signal and, under the instruction of the control signal, control the drive module to drive the relay combination to operate so that the multi-way relay is in a target opening and closing state to select the target test circuit among the multiple types of test circuits.

4. The operational amplifier test fixture according to claim 2, characterized in that: The tooling backplane is provided with a plurality of slots, each slot being used for fixing and installing one of the test boards; the number of the slots is consistent with the number of the test boards.

5. The operational amplifier test fixture according to claim 4, characterized in that: Also includes: Tooling chassis; The box surface of the tooling box is provided with a power interface, a communication interface and a radio frequency signal interface; The tooling backplane is installed in the tooling chassis, and the output side of the power interface and the output side of the communication interface are both connected to the first connector of the tooling backplane; the signal input interface part of the RF signal interface is connected to the second connector of the tooling backplane, and the signal output interface part of the RF signal interface is connected to the third connector of the tooling backplane.

6. The operational amplifier test fixture according to claim 5, characterized in that: Each of the test boards adopts a VPX board, and the tooling backplane adopts a VPX connector structure; The tooling chassis adopts a VPX chassis.

7. The operational amplifier test fixture according to claim 3, characterized in that: Each of the core boards is provided with a temperature sensor, which is used to monitor the operating temperature of the operational amplifier to be tested; each of the test carrier boards is integrated with an alarm circuit connected to a microcontroller unit; Each of the temperature sensors is connected to a microcontroller unit on a corresponding test carrier board; The microcontroller unit on each of the test carriers is used to obtain the operating temperature of the corresponding operational amplifier to be tested, and trigger the corresponding monitoring circuit to alarm when the operating temperature of the corresponding operational amplifier to be tested exceeds a preset temperature threshold.

8. The operational amplifier test fixture according to any one of claims 1 to 7, characterized in that: Each of the test carriers is provided with a target power supply circuit; each of the target power supply circuits includes a DC-DC converter and a low voltage drop linear regulator connected in sequence; The DC-DC converter is used to convert the voltage corresponding to the input power signal into an intermediate voltage close to the target voltage; The low voltage difference linear regulator is used to stabilize and adjust the intermediate voltage and output the target voltage; the target voltage is the operating voltage of the operational amplifier to be tested.

9. An operational amplifier test system, characterized in that: An operational amplifier test fixture comprising any one of claims 1 to 8, further comprising a test device; The test equipment is connected to the operational amplifier test fixture; The testing device is used to input a test electrical signal to each test board in the operational amplifier testing fixture in response to a test instruction input by a user, so as to test the operational amplifier to be tested on each test board.

10. An operational amplifier testing method, characterized in that: The operational amplifier test system according to claim 9 comprises: The test device receives a test instruction input by a user, and in response to the test instruction, inputs a test electrical signal to each test board in the operational amplifier test fixture; When receiving the test electrical signal, the test carrier on each test board drives the respective control circuit to select the target test circuit among the multiple types of test circuits, so as to test the operational amplifier to be tested on the respective core board in parallel under the respective corresponding target test circuit.

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