Integrated circuit chip packaging and film covering device

By designing an integrated circuit chip packaging coating device, the coating frame and coating mechanism are used to achieve stable covering and cutting of the packaging film, solving the problem of unstable connection between the packaging film and the chip, and improving the packaging quality and efficiency.

CN119560406AInactive Publication Date: 2025-03-04SUZHOU WEIMO ELECTRONIC INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202411560420.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-03-04
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

In the absence of external force pressing in the existing integrated circuit chip packaging and coating devices, it is difficult for the packaging film to form a stable connection with the chip, resulting in poor packaging or coating peeling.

Method used

An integrated circuit chip packaging coating device is designed, including a coating frame, a rotating mechanism, a batch control mechanism, a guide mechanism and a coating mechanism. The slide drives the coating disc, rotating mechanism, intermittent control mechanism, guide mechanism and coating mechanism to move vertically simultaneously to realize the covering and cutting of the packaging film, ensuring the stable connection between the packaging film and the chip.

Benefits of technology

Through the design of this device, it is possible to effectively avoid wrinkles and unstable connections of the packaging film, improve the packaging quality and packaging efficiency of the chip, reduce packaging time and reduce costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention is suitable for the technical field of chip processing, and provides an integrated circuit chip packaging and film covering device which comprises a device frame, a sliding seat, a film covering frame, a packaging film, a reel, a conveying belt and a film covering disc and further comprises a rotating mechanism, an intermittent regulation and control mechanism, a guide mechanism and a film covering mechanism. The film covering mechanism comprises a pressing and covering assembly and a cutting assembly. According to the integrated circuit chip packaging and film covering device, the film covering mechanism is matched with the rotating mechanism, the film covering disc, the intermittent regulation and control mechanism and the guide mechanism, so that automatic packaging and film covering of the chip can be completed, and a packaging film on a track from the edge end of the chip to the center position of the chip can be effectively and fully pressed and covered; according to the invention, the connection stability of the packaging film and the chip is ensured, the packaging quality and the packaging efficiency of the chip are improved, the working efficiency and the practicability of the device are further improved, the packaging time of the chip is shortened, and the packaging cost of the chip is reduced.
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Description

Technical Field

[0001] The invention belongs to the technical field of chip processing, and in particular relates to an integrated circuit chip packaging coating device. Background Art

[0002] Integrated circuits are an indispensable part of electronic devices such as computers, communications, and televisions. Integrated circuit plastic packaging is a technology that protects chips. The plastic packaging process protects the chips from factors such as temperature, humidity, and mechanical impact, ensuring the stability of chip performance and service life. In the integrated circuit plastic packaging process, coating is a very critical step. It can prevent water ingress, enhance structural stability, improve dehumidification capacity, and isolate air and other impurities during the storage, transportation, and use of integrated circuits.

[0003] The existing integrated circuit chip packaging coating device includes a long plate concave rail, a film feeder, a film collector, a film tape, a multi-axis machine tool and an outer cover frame. The outer cover frame is buckled and pressed on the film tape at the outer edge of the hollow circular hole. The outer cover frame moves laterally to control the film tape, assist in the transportation of the film tape, and avoid wrinkles in the film tape. The coordinated design of the unit element and the cutting element achieves a stable cutting effect. The cutting element moves in a circular motion to cut the film tape. The cutting element encounters the unit element during its movement, triggering the deformation of the unit element, and then the cutting element passes through the unit element smoothly. In this way, at most only one unit element does not apply pressure to the film tape at a time, and the cutting element can stably cut the film tape.

[0004] Although the existing device can complete the cutting and stretching operations on the packaging film, thereby effectively avoiding the problem of wrinkles on the packaging film, it ignores a key detail. In the absence of external force, the packaging film covering the chip is difficult to form a stable connection with the chip due to its uneven surface. This instability will directly affect the packaging and coating effects of the chip, and then cause poor packaging or film falling off during the use of the chip.

[0005] Therefore, in view of the above situation, it is urgent to develop an integrated circuit chip packaging coating device to overcome the shortcomings in current practical applications. Summary of the invention

[0006] In view of the shortcomings of the prior art, an object of the embodiments of the present invention is to provide an integrated circuit chip packaging coating device to solve the problems in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] An integrated circuit chip packaging film coating device, comprising a device frame, a slide seat is vertically slidably mounted on the device frame, a film coating frame is fixed on one side of the slide seat, reels for winding and unwinding a packaging film are mounted on both sides of the device frame, two reels are distributed on both sides of the film coating frame, the packaging film is located directly below the film coating frame, a conveyor belt perpendicular to the packaging film is arranged below the packaging film, a chip is placed on the conveyor belt, a film coating disc is arranged between the film coating frame and the packaging film, the film coating disc is rotatably mounted on the film coating frame through a connecting shaft, and further comprising:

[0009] A rotating mechanism, which is mounted on the laminating frame and fixedly connected to the connecting shaft;

[0010] An intermittent regulating mechanism, the intermittent regulating mechanism comprising a linkage component and a regulating component, one end of the linkage component is mounted on the laminating frame and is located outside the laminating disk, and the other end of the linkage component is mounted on the laminating disk and connected to the regulating component mounted on the laminating disk;

[0011] A guide mechanism, which is circumferentially distributed on the coating disc and slidably cooperates with guide grooves circumferentially provided on the coating disc, and one end of the guide mechanism is fixedly connected to the regulating component;

[0012] The laminating mechanism comprises a pressing assembly and a cutting assembly, wherein the pressing assembly is mounted on the guide mechanism and is located at the bottom of the laminating disk, one end of the cutting assembly is mounted on the pressing assembly, and the other end of the cutting assembly is connected to the bottom of the laminating disk;

[0013] The slide can drive the laminating disk, the rotating mechanism, the intermittent regulating mechanism, the guiding mechanism and the laminating mechanism to move vertically synchronously through the laminating frame. The laminating mechanism presses the packaging film onto the chip on the conveyor belt and releases the packaging film by vertical movement.

[0014] When it is necessary to expand the pressing range of the pressing assembly on the packaging film, the rotating mechanism drives the connecting shaft to rotate forward, the connecting shaft drives the laminating disk to rotate, and the laminating disk drives one end of the linkage assembly, the regulating assembly, the guide mechanism and the laminating mechanism to rotate synchronously at the same time. One end of the linkage assembly drives the other end to rotate continuously by rotating and cooperating with the laminating frame, and the other end of the linkage assembly drives the regulating assembly to rotate continuously. The regulating assembly drives the pressing assembly and the cutting assembly to move continuously outward through the guide mechanism, and the cutting assembly deflects during the continuous outward movement.

[0015] When the pressing component and the cutting component move to the required positions, the cutting end on the cutting component contacts the packaging film, and the pressing component contacts the edge end of the chip and squeezes the packaging film above the chip. At this time, the rotating mechanism drives the connecting shaft to rotate in the opposite direction, and the connecting shaft drives the film coating disk to rotate in the opposite direction. The film coating disk simultaneously drives one end of the linkage component, the regulating component, the guiding mechanism and the film coating mechanism to rotate in the opposite direction synchronously. The cutting component in the rotating state can cut the packaging film located outside the edge end of the chip, and the pressing component in the rotating state covers the packaging film at the edge end of the chip.

[0016] One end of the linkage component can drive the other end to rotate in the opposite direction through the laminating frame, and the other end of the linkage component drives the regulating component to rotate intermittently. The regulating component drives the pressing component and the cutting component to move inward intermittently through the guiding mechanism, and the cutting component deflects in the opposite direction and separates from the packaging film. The pressing component effectively and fully presses the packaging film on the trajectory from the edge end of the chip to its center position by intermittent inward movement and continuous rotation.

[0017] As a further technical solution of the present invention, the rotating mechanism comprises:

[0018] a motor fixed to the laminating frame; and

[0019] A main shaft is fixed on the output end of the motor, and the main shaft is fixedly connected to the connecting shaft through a transmission member.

[0020] As a further technical solution of the present invention, the linkage component includes:

[0021] Bracket A and bracket B are respectively installed on the laminating disk;

[0022] The two ends of the rotating shaft B are rotatably mounted on the bracket A and the bracket B respectively, one end of the rotating shaft B is provided with a strip slide groove, the end of the strip slide groove is provided with a Z-shaped slide groove connected thereto, and the strip slide groove and the Z-shaped slide groove intermittently slide with the regulating component;

[0023] An annular internal gear fixed on the laminating frame and located outside the laminating disk, wherein the annular internal gear is concentric with the laminating disk;

[0024] Rotating a rotating shaft A mounted on the laminating disk, wherein the rotating shaft A is connected to the rotating shaft B via a universal joint; and

[0025] A bevel gear is fixed on the rotating shaft A, and the bevel gear is meshed with the annular internal gear.

[0026] As a further technical solution of the present invention, the regulating component includes:

[0027] A hollow worm gear sleeved on the outside of the rotating shaft B, one end of the hollow worm gear being connected to the bracket A through a spring A;

[0028] A worm wheel fixed on the guide mechanism, the worm wheel meshing with the hollow worm;

[0029] A strip column mounted on the other end of the hollow worm, the strip column intermittently cooperates with the strip slide groove and the Z-shaped slide groove;

[0030] A guide sleeve fixed on the bracket B, wherein the guide sleeve, the hollow worm and the rotating shaft B are all concentric, and one end of the guide sleeve is configured as an inclined end; and

[0031] A movable part is installed on one end of the strip column, and the outer wall of the movable part is intermittently slidably matched with the inclined end of the guide sleeve.

[0032] As a further technical solution of the present invention, the guiding mechanism comprises:

[0033] A connecting sleeve rotatably mounted on the coating disc and concentric with the connecting shaft, wherein a worm gear is fixed to the outside of the connecting sleeve;

[0034] a disc fixed to the outside of the connecting sleeve; and

[0035] The connecting rods are circumferentially distributed on the disc, the distribution number and distribution position of the connecting rods are consistent with the distribution number and distribution position of the guide groove, and one end of the connecting rod is rotatably connected to the pressing assembly installed in the guide groove.

[0036] As a further technical solution of the present invention, the pressing assembly includes:

[0037] A slider slidably mounted in the guide groove, wherein a cutting assembly is mounted on one side of the slider;

[0038] A sliding column vertically slidably mounted on the slider;

[0039] A U-shaped frame fixed to the bottom of the sliding column, wherein the top of the U-shaped frame is connected to the bottom of the sliding block via a spring B; and

[0040] The pressure wheel is installed at the bottom of the U-shaped frame.

[0041] As a further technical solution of the present invention, the cutting component comprises:

[0042] Rotate the mounting shaft mounted on one side of the slider;

[0043] A cutting knife fixed on the mounting shaft;

[0044] a spur gear fixed to the mounting shaft;

[0045] A mounting bracket fixed to the bottom of the laminating tray; and

[0046] A rack is fixed on the mounting frame, the rack is intermittently meshed with the spur gear, and the rack is distributed at the edge of the bottom of the coating disk.

[0047] Compared with the prior art, the present invention has the following beneficial effects:

[0048] The rotating mechanism can drive the film coating disk to rotate forward or reversely. The intermittent regulating mechanism can drive the guiding mechanism to work continuously in the forward direction or intermittently in the reverse direction by means of forward rotation or reverse rotation. When the guiding mechanism drives the film coating mechanism to work continuously in the forward direction, the film coating mechanism can continuously move outward, so that the pressing component and the cutting component thereon can adaptively move to the edge end of the chip. When the guiding mechanism drives the film coating mechanism to work intermittently in the reverse direction, the cutting component firstly packages the packaging film at the edge end of the chip by reversing, and the pressing component squeezes the packaging film at the edge end of the chip. Then, the cutting component deflects in the reverse direction and separates from the packaging film, so as to avoid the cutting component from damaging the chip or the packaging film on the chip during the inward or outward movement, thereby ensuring the packaging quality and packaging efficiency of the chip. The pressing component can effectively and fully press the packaging film on the trajectory from the edge end of the chip to its center position by means of intermittent inward movement and continuous rotation, thereby ensuring the connection stability between the packaging film and the chip, thereby improving the packaging quality and packaging efficiency of the chip, thereby improving the working efficiency and practicality of the device, reducing the packaging time of the chip, and reducing the cost of chip packaging.

[0049] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A schematic structural diagram of a first viewing angle of an integrated circuit chip packaging coating device provided by an embodiment of the present invention.

[0051] Figure 2 A schematic structural diagram of a second viewing angle of an integrated circuit chip packaging coating device provided by an embodiment of the present invention.

[0052] Figure 3 for Figure 1 An enlarged structural diagram of the middle laminating frame and the various mechanisms installed on it.

[0053] Figure 4 for Figure 3 Side view of the structure.

[0054] Figure 5 for Figure 4 A top view of the structure with partial section.

[0055] Figure 6 for Figure 4 Exploded diagram of the structure of the linkage component and the regulatory component.

[0056] Figure 7 for Figure 6 Side view of the exploded structure of the central linkage component and the control component.

[0057] Figure 8 for Figure 3 An enlarged view of the structure of the middle laminating mechanism.

[0058] Figure numerals: 100-device frame, 110-slide seat, 200-reel, 210-packaging film, 300-conveyor belt, 400-film coating frame, 500-rotating mechanism, 510-motor, 520-spindle, 530-transmission member, 600-film coating disk, 610-connecting shaft, 620-guide groove, 700-intermittent control mechanism, 710-linkage assembly, 711-annular internal gear, 712-bevel gear, 713-rotating shaft A, 714-universal joint, 715-rotating shaft B, 716-bracket A, 717-bracket B, 718-strip slide groove, 719-Z shaped slide groove, 720-regulating component, 721-hollow worm, 722-worm wheel, 723-spring A, 724-bar column, 725-movable part, 726-guide sleeve, 800-guide mechanism, 810-connecting sleeve, 820-disc, 830-connecting rod, 900-laminating mechanism, 910-pressing component, 911-slider, 912-sliding column, 913-U-shaped frame, 914-pressure wheel, 915-spring B, 920-cutting component, 921-spur gear, 922-mounting shaft, 923-cutting knife, 924-rack, 925-mounting frame. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0060] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0061] like Figures 1 to 8As shown, as an embodiment of the present invention, an integrated circuit chip packaging laminating device is provided, comprising a device frame 100, on which a slide 110 is vertically slidably mounted, a laminating frame 400 is fixed to one side of the slide 110, the slide 110 can move vertically on the device frame 100, thereby changing the vertical height of the laminating frame 400, and reels 200 for winding and unwinding a packaging film 210 are mounted on both sides of the device frame 100, and the two reels 200 are distributed on the laminating frame 400. 00, and the packaging film 210 is located directly below the film laminating frame 400, a conveyor belt 300 perpendicular to the packaging film 210 is arranged below the packaging film 210, a chip is placed on the conveyor belt 300, and the conveyor belt 300 is used to intermittently convey the chip to the bottom of the packaging film 210 so that the packaging film 210 performs automatic packaging processing on it, a film laminating plate 600 is arranged between the film laminating frame 400 and the packaging film 210, and the film laminating plate 600 is rotatably mounted on the film laminating frame 400 through a connecting shaft 610, and further includes:

[0062] A rotating mechanism 500, wherein the rotating mechanism 500 is mounted on the laminating frame 400 and is fixedly connected to the connecting shaft 610;

[0063] An intermittent regulating mechanism 700, comprising a linkage assembly 710 and a regulating assembly 720, wherein one end of the linkage assembly 710 is mounted on the laminating frame 400 and is located outside the laminating disk 600, and the other end of the linkage assembly 710 is mounted on the laminating disk 600 and connected to the regulating assembly 720 mounted on the laminating disk 600;

[0064] A guide mechanism 800, which is circumferentially distributed on the coating disc 600 and slidably cooperates with the guide grooves 620 circumferentially opened on the coating disc 600, and one end of the guide mechanism 800 is fixedly connected to the regulating component 720;

[0065] The laminating mechanism 900 includes a pressing component 910 and a cutting component 920. The pressing component 910 is mounted on the guide mechanism 800 and is located at the bottom of the laminating disk 600. One end of the cutting component 920 is mounted on the pressing component 910, and the other end of the cutting component 920 is connected to the bottom of the laminating disk 600.

[0066] The slide 110 can drive the laminating disk 600, the rotating mechanism 500, the intermittent regulating mechanism 700, the guiding mechanism 800 and the laminating mechanism 900 to move vertically synchronously through the laminating frame 400. The laminating mechanism 900 can not only press the packaging film 210 onto the chip on the conveyor belt 300 by vertical movement, so that the packaging film 210 can perform laminating treatment on the unpackaged chip, but also release the packaging film 210, so that the packaging film 210 is separated from the packaged chip, so that the packaged chip can enter the next process with the conveyor belt 300.

[0067] When it is necessary to expand the pressing range of the pressing component 910 on the packaging film 210, the rotating mechanism 500 drives the connecting shaft 610 to rotate forward, and the connecting shaft 610 drives the coating disc 600 to rotate. The coating disc 600 also drives one end of the linkage component 710, the regulating component 720, the guide mechanism 800 and the coating mechanism 900 to rotate synchronously. One end of the linkage component 710 can drive the other end to rotate continuously by rotating and cooperating with the coating frame 400. The other end of the linkage component 710 drives the regulating component 720 to rotate continuously. The regulating component 720 drives the pressing component 910 and the cutting component 920 to move continuously outward through the guide mechanism 800. The cutting component 920 deflects during the process of continuous outward movement.

[0068] When the pressing component 910 and the cutting component 920 move to the desired position, the cutting end of the cutting component 920 contacts the packaging film 210, and the pressing component 910 contacts the edge end of the chip and squeezes the packaging film 210 above the chip. At this time, the rotating mechanism 500 drives the connecting shaft 610 to rotate in the opposite direction, and the connecting shaft 610 drives the film coating disk 600 to rotate in the opposite direction. The film coating disk 600 also drives one end of the linkage component 710, the regulating component 720, the guide mechanism 800 and the film coating mechanism 900 to rotate in the opposite direction synchronously. The cutting component 920 in the rotating state can cut the packaging film 210 located outside the edge end of the chip, and the pressing component 910 in the rotating state covers the packaging film 210 at the edge end of the chip.

[0069] One end of the linkage component 710 can drive the other end thereof to rotate in the opposite direction through the film laminating frame 400, and the other end of the linkage component 710 drives the regulating component 720 to rotate intermittently. The regulating component 720 drives the pressing component 910 and the cutting component 920 to move inward intermittently through the guiding mechanism 800, so that the cutting component 920 deflects in the opposite direction and separates from the packaging film 210, thereby preventing the cutting component 920 from damaging the chip or the packaging film 210 on the chip during the inward or outward movement, thereby ensuring the packaging quality and packaging efficiency of the chip. The pressing component 910 can effectively and fully press the packaging film 210 on the trajectory from the edge end of the chip to its center position by intermittent inward movement and continuous rotation, thereby ensuring the connection stability between the packaging film 210 and the chip, thereby improving the packaging quality and packaging efficiency of the chip, thereby improving the working efficiency and practicality of the device, reducing the packaging time of the chip, and reducing the cost of chip packaging.

[0070] like Figure 3 and Figure 4 As shown, as a preferred embodiment of the present invention, the rotating mechanism 500 includes a motor 510, a main shaft 520 and a transmission member 530, the motor 510 is fixed on the coating frame 400, the main shaft 520 is fixed on the output end of the motor 510, and the main shaft 520 is fixedly connected to the connecting shaft 610 through the transmission member 530.

[0071] In this embodiment, the motor 510 drives the main shaft 520 to rotate, and the main shaft 520 drives the connecting shaft 610 to rotate through the transmission member 530, thereby driving the coating disk 600 to rotate forward or reverse, so that the coating mechanism 900 can complete the cutting and pressing of the packaging film 210, and then complete the automatic packaging of the chip, thereby improving the working efficiency and practicality of the device, reducing the chip packaging time, and reducing the chip packaging cost.

[0072] In a preferred embodiment, the transmission member 530 preferably adopts a transmission structure composed of a synchronous belt and a synchronous wheel.

[0073] like Figures 3 to 7As shown, as a preferred embodiment of the present invention, the linkage assembly 710 includes an annular internal gear 711, a bevel gear 712, a rotating shaft A713, a universal joint 714, a rotating shaft B715, a bracket A716, a bracket B717, a strip slide 718 and a Z-shaped slide 719, the annular internal gear 711 is fixed on the laminating frame 400 and is located on the outside of the laminating disk 600, and the annular internal gear 711 is concentric with the laminating disk 600, the bevel gear 712 is meshed with the annular internal gear 711, and the bevel gear 712 is fixed on the rotating shaft A713. On one side of the axis A713, the rotating shaft A713 is rotatably mounted on the coating disk 600, and one end of the rotating shaft A713 is connected to the rotating shaft B715 through a universal joint 714, and both ends of the rotating shaft B715 are rotatably mounted on the coating disk 600 through brackets A716 and B717 respectively, and one end of the rotating shaft B715 is provided with a strip slide groove 718, and the end of the strip slide groove 718 is provided with a Z-shaped slide groove 719 connected thereto, and the strip slide groove 718 and the Z-shaped slide groove 719 intermittently slide with the regulating component 720.

[0074] In this embodiment, the connecting shaft 610 drives the coating disk 600 to rotate, and the coating disk 600 drives the bevel gear 712 thereon to rotate. Since the annular internal gear 711 and the coating frame 400 are stationary, the bevel gear 712 in the rotating state can drive the rotating shaft A713 to rotate by meshing with the annular internal gear 711 in the stationary state. The rotating shaft A713 drives the rotating shaft B715 to rotate through the universal joint 714. The rotating shaft B715 drives the regulating component 720 to work through the strip slide groove 718 and the Z-shaped slide groove 719, so that the regulating component 720 can drive the coating mechanism 900 to move outward or inward through the guide mechanism 800. The coating mechanism 900 can effectively and fully press the packaging film 210 on the trajectory from the edge end of the chip to its center position, thereby ensuring the connection stability between the packaging film 210 and the chip, thereby improving the packaging quality and packaging efficiency of the chip.

[0075] In a preferred embodiment, the Z-shaped slide groove 719 is perpendicular to the strip slide groove 718, the Z-shaped slide groove 719 is opened in the circumferential direction of the rotating shaft B715, and the strip slide groove 718 is opened in the axial direction of the rotating shaft B715.

[0076] like Figures 3 to 7As shown in FIG. 1 , as a preferred embodiment of the present invention, the regulating assembly 720 includes a hollow worm 721, a worm wheel 722, a spring A723, a bar column 724, a movable part 725 and a guide sleeve 726. The hollow worm 721 is sleeved on the outside of the rotating shaft B715. The hollow worm 721 is meshed with the worm wheel 722 fixed on the guide mechanism 800. One end of the hollow worm 721 is equipped with a bar column 724. The other end of the hollow worm 721 is connected to the guide mechanism 800 by a spring. A723 is connected to the bracket A716, and the strip column 724 intermittently cooperates with the strip slide groove 718 and the Z-shaped slide groove 719. A movable part 725 is installed at one end of the strip column 724. The outer wall of the movable part 725 intermittently slides with the guide sleeve 726 fixed on the bracket B717. The guide sleeve 726, the hollow worm 721 and the rotating shaft B715 are all concentric, and the end of the guide sleeve 726 that slides with the outer wall of the movable part 725 is set as an inclined end.

[0077] In the present embodiment, when it is necessary to expand the pressing range of the pressing component 910 on the packaging film 210, the strip column 724 is located at the connection between the strip slide groove 718 and the Z-shaped slide groove 719, the motor 510 drives the main shaft 520 to rotate forward, the main shaft 520 drives the connecting shaft 610 to rotate forward through the transmission member 530, the connecting shaft 610 drives the coating disk 600 to rotate forward, and the coating disk 600 drives the bevel gear 712 thereon to rotate. Since the annular internal gear 711 and the coating frame 400 are stationary, the bevel gear 712 in the rotating state can drive the rotating shaft A713 to rotate by meshing with the stationary annular internal gear 711, and the rotating shaft A713 drives the rotating shaft B715 to rotate by the universal joint 714;

[0078] At this time, the rotating shaft B715 drives the Z-shaped slide groove 719 and the strip slide groove 718 to rotate at the same time, so that the strip column 724 cooperates with the Z-shaped slide groove 719, and the Z-shaped slide groove 719 drives the strip column 724 to rotate continuously. The strip column 724 drives the hollow worm 721 and the movable part 725 to rotate continuously at the same time. The movable part 725 does not slide with the guide sleeve 726 during the rotation process. The hollow worm 721 drives the worm wheel 722 to rotate continuously. The worm wheel 722 can drive the pressing assembly 910 and the cutting assembly 920 to move outward continuously through the guide mechanism 800. The cutting assembly 920 deflects during the continuous outward movement.

[0079] When the pressing component 910 and the cutting component 920 move to the required position, the cutting end of the cutting component 920 conflicts with the packaging film 210, and the pressing component 910 conflicts with the edge end of the chip and squeezes the packaging film 210 above the chip. At this time, the motor 510 drives the connecting shaft 610 to rotate in the opposite direction, and the connecting shaft 610 drives the coating disk 600 to rotate in the opposite direction, so that the cutting component 920 in the rotating state can cut the packaging film 210 located outside the edge end of the chip, and the pressing component 910 in the rotating state presses the packaging film 210 at the edge end of the chip. At the same time, the rotating shaft A713 and the rotating shaft B715 rotate in the opposite direction, and the rotating shaft B715 drives the strip slide 718 and the Z-shaped slide 719 to rotate in the opposite direction. The slide groove 719 can drive the bar column 724 located therein to the connection point between the bar column 724 and the bar slide groove 718 by reverse rotation, so that the bar column 724 will not cooperate with the Z-shaped slide groove 719 in the state of reverse rotation, and the spring A723 drives the hollow worm 721 to move by its own elastic force, and the hollow worm 721 drives the bar column 724 and the movable member 725 to move in the direction close to the guide sleeve 726, so that the movable member 725 slides and cooperates with the inclined end of the guide sleeve 726, and the movable member 725 can drive the bar column 724 to reciprocate in the bar slide groove 718 by cooperating with the guide sleeve 726 and the spring A723, and the bar column 724 can drive the hollow worm 721 to reciprocate;

[0080] When the hollow worm 721 in the self-rotating state moves in the direction close to the spring A723, the hollow worm 721 cannot drive the worm wheel 722 to perform normal rotational movement. The thread surface on the hollow worm 721 that rotates and moves synchronously can be regarded as a circular thread surface. Although it rotates in the tooth surface of the worm wheel 722, it does not drive it to rotate, and the two do not have a meshing relationship; when the hollow worm 721 in the self-rotating state moves in the direction away from the spring A723, the thread surface on the hollow worm 721 and the tooth surface on the worm wheel 722 resume the meshing relationship, so that the hollow worm 721 drives the worm wheel 722 to rotate normally, thereby realizing the intermittent self-rotation of the worm wheel 722;

[0081] The worm gear 722 drives the guide mechanism 800 to work intermittently, and the guide mechanism 800 drives the pressing component 910 and the cutting component 920 to move inward intermittently, so that the cutting component 920 deflects in the opposite direction and separates from the packaging film 210, thereby preventing the cutting component 920 from damaging the chip or the packaging film 210 on the chip during the inward or outward movement, thereby ensuring the packaging quality and packaging efficiency of the chip. The pressing component 910 can effectively and fully press the packaging film 210 on the trajectory from the edge of the chip to its center position by intermittent inward movement and continuous rotation, thereby ensuring the connection stability between the packaging film 210 and the chip, thereby improving the packaging quality and packaging efficiency of the chip, thereby improving the working efficiency and practicality of the device, reducing the packaging time of the chip, and reducing the cost of chip packaging.

[0082] In a preferred embodiment, the movable member 725 preferably adopts a roller structure.

[0083] like Figures 3 to 5 As shown, as a preferred embodiment of the present invention, the guide mechanism 800 includes a connecting sleeve 810, a disc 820 and a connecting rod 830. The connecting sleeve 810 is rotatably mounted on the coating disc 600 and is concentric with the connecting shaft 610. A worm gear 722 and a disc 820 are respectively fixed to the outside of the connecting sleeve 810. The disc 820 is circumferentially distributed with connecting rods 830. The distribution number and distribution position of the connecting rods 830 are consistent with the distribution number and distribution position of the guide groove 620. One end of the connecting rod 830 is rotatably connected to a pressure-coating assembly 910 installed in the guide groove 620.

[0084] In this embodiment, the worm gear 722 drives the connecting sleeve 810 to rotate, and the connecting sleeve 810 drives the disc 820 to rotate. The disc 820 can drive the pressing component 910 to move in the guide groove 620 by rotating and cooperating with the connecting rod 830, so that the pressing component 910 and the cutting component 920 thereon can move outward or inward, thereby realizing rapid packaging of the chip and improving the packaging quality and packaging efficiency of the chip.

[0085] In a preferred embodiment, the circular disc 820 is concentric with the coating disc 600, and the connecting sleeve 810, the connecting shaft 610, the circular disc 820 and the worm gear 722 are all concentric.

[0086] like Figure 2 , Figure 3 and Figure 8As shown, as a preferred embodiment of the present invention, the pressing assembly 910 includes a slider 911, a slide column 912, a U-shaped frame 913, a pressure wheel 914 and a spring B915, the slider 911 is slidably installed in the guide groove 620, the slider 911 is vertically slidably installed with a slide column 912, and a cutting assembly 920 is installed on one side of the slider 911, the bottom of the slide column 912 is fixed with a U-shaped frame 913, the top of the U-shaped frame 913 is connected to the bottom of the slider 911 through a spring B915, and the bottom of the U-shaped clamp is installed with a pressure wheel 914.

[0087] In this embodiment, the coating frame 400 can drive the pressing component 910 to rotate forward or reverse, and the disc 820 can drive the slider 911 to move in the guide groove 620 by rotating on its own and cooperating with the connecting rod 830. The slider 911 can drive the pressure wheel 914 to move outward or inward through the sliding column 912 and the U-shaped frame 913. The pressure wheel 914 in the forward or reverse state can effectively and fully press the packaging film 210 on the trajectory from the edge end of the chip to its center position by moving outward or inward, thereby ensuring the connection stability between the packaging film 210 and the chip, thereby improving the packaging quality and packaging efficiency of the chip.

[0088] like Figure 2 , Figure 3 and Figure 8 As shown, as a preferred embodiment of the present invention, the cutting assembly 920 includes a spur gear 921, a mounting shaft 922, a cutting knife 923, a rack 924 and a mounting frame 925, the mounting shaft 922 is rotatably mounted on one side of the slider 911, the spur gear 921 and the cutting knife 923 are respectively fixed on the mounting shaft 922, the bottom of the spur gear 921 is meshed with the rack 924 fixed on the mounting frame 925, the rack 924 is distributed at the edge position of the bottom of the coating tray 600, and the mounting frame 925 is fixed on the bottom of the coating tray 600.

[0089] In this embodiment, when the slider 911 drives the mounting shaft 922, the cutting knife 923 and the spur gear 921 to move outward, the cutting end of the cutting knife 923 is close to the bottom of the film coating disk 600. When the spur gear 921 moves to a position meshing with the rack 924, the rack 924 drives the spur gear 921 to deflect. The spur gear 921 drives the cutting knife 923 to deflect through the mounting shaft 922, so that the cutting end of the cutting knife 923 rotates toward the direction close to the packaging film 210. When the slider 911 moves to a desired position, the cutting end of the cutting knife 923 is in conflict with the packaging film 210 and is located outside the edge of the chip.

[0090] When the slider 911 drives the mounting shaft 922, the cutting knife 923 and the spur gear 921 to move inward, the cutting knife 923 first cuts the packaging film 210 outside the edge of the chip by reversing. At the same time, before the cutting end of the cutting knife 923 moves to the edge of the chip, the rack 924 drives the spur gear 921 to deflect in the opposite direction, so that the cutting end of the cutting knife 923 deflects in the opposite direction and moves away from the chip and the packaging film 210 thereon, thereby preventing the cutting knife 923 from damaging the chip or the packaging film 210 on the chip, thereby ensuring the packaging quality and packaging efficiency of the chip and improving the coating efficiency and coating quality of the device.

[0091] In a preferred embodiment, the position of the mounting frame 925 at the bottom of the coating disk 600 is adjustable and parallel to the guide groove 620, so that the meshing time of the rack 924 and the spur gear 921 can be changed at any time, so that the coating mechanism 900 can effectively and fully package chips of different diameters, thereby improving the practicality and convenience of the device.

[0092] The working principle of the present invention is:

[0093] The slide 110 can drive the laminating disk 600, the rotating mechanism 500, the intermittent regulating mechanism 700, the guiding mechanism 800 and the laminating mechanism 900 to move vertically synchronously through the laminating frame 400. The laminating mechanism 900 can not only press the packaging film 210 onto the chip on the conveyor belt 300 by vertical movement, so that the packaging film 210 can perform laminating treatment on the unpackaged chip, but also release the packaging film 210, so that the packaging film 210 is separated from the packaged chip, so that the packaged chip can enter the next process with the conveyor belt 300.

[0094] When it is necessary to expand the pressing range of the pressing component 910 on the packaging film 210, the strip column 724 is located at the connection between the strip slide groove 718 and the Z-shaped slide groove 719, the motor 510 drives the main shaft 520 to rotate forward, the main shaft 520 drives the connecting shaft 610 to rotate forward through the transmission member 530, the connecting shaft 610 drives the coating disk 600 to rotate forward, and the coating disk 600 drives the bevel gear 712 thereon to rotate. Since the annular internal gear 711 and the coating frame 400 are stationary, the bevel gear 712 in the rotating state can drive the rotating shaft A713 to rotate by meshing with the stationary annular internal gear 711, and the rotating shaft A713 drives the rotating shaft B715 to rotate by the universal joint 714;

[0095] At this time, the rotating shaft B715 drives the Z-shaped slide groove 719 and the strip slide groove 718 to rotate at the same time, so that the strip column 724 cooperates with the Z-shaped slide groove 719, and the Z-shaped slide groove 719 drives the strip column 724 to rotate continuously. The strip column 724 drives the hollow worm 721 and the movable part 725 to rotate continuously at the same time, and the movable part 725 does not slide and cooperate with the guide sleeve 726 during the rotation process. The hollow worm 721 drives the worm wheel 722 to rotate continuously, and the worm wheel 722 drives the connecting sleeve 810 to rotate, and the connecting sleeve 810 drives the disc 820 to rotate. The disc 820 can drive the slider 911 to move in the guide groove 620 by rotating and cooperating with the connecting rod 830. The slider 911 can slide The column 912 and the U-shaped frame 913 drive the pressing wheel 914 and the cutting knife 923 to continuously move outward. When the slider 911 drives the mounting shaft 922, the cutting knife 923 and the spur gear 921 to move outward, the cutting end of the cutting knife 923 is close to the bottom of the film coating disk 600. When the spur gear 921 moves to a position meshing with the rack 924, the rack 924 drives the spur gear 921 to deflect. The spur gear 921 drives the cutting knife 923 to deflect through the mounting shaft 922, so that the cutting end of the cutting knife 923 rotates in a direction close to the packaging film 210. When the slider 911 moves to a desired position, the cutting end of the cutting knife 923 is in conflict with the packaging film 210 and is located outside the edge of the chip.

[0096] When the pressing assembly 910 and the cutting assembly 920 move to the desired positions, the motor 510 drives the connecting shaft 610 to rotate in the opposite direction, and the connecting shaft 610 drives the film coating disk 600 to rotate in the opposite direction, so that the cutting knife 923 first cuts the packaging film 210 outside the edge of the chip in a reverse manner, and before the cutting end of the cutting knife 923 moves to the edge of the chip, the rack 924 drives the spur gear 921 to deflect in the opposite direction, so that the cutting end of the cutting knife 923 deflects in the opposite direction and moves away from the chip and the packaging film 210 thereon, so as to prevent the cutting knife 923 from damaging the chip or the packaging film 210 thereon, and the rotating pressing wheel 914 presses the packaging film 210 at the edge of the chip;

[0097] At the same time, the rotating shaft A713 and the rotating shaft B715 rotate in the opposite direction, and the rotating shaft B715 drives the strip slide groove 718 and the Z-shaped slide groove 719 to rotate in the opposite direction. The Z-shaped slide groove 719 can drive the strip column 724 located therein to the connection point between it and the strip slide groove 718 by means of reverse rotation, so that the strip column 724 will not cooperate with the Z-shaped slide groove 719 in the state of reverse rotation, and the spring A723 drives the hollow worm 721 to move by its own elastic force, and the hollow worm 721 drives the strip column 724 and the movable part 725 to move in the direction close to the guide sleeve 726, so that the movable part 725 slides and cooperates with the inclined end of the guide sleeve 726, and the movable part 725 can drive the strip column 724 to reciprocate in the strip slide groove 718 by means of cooperating with the guide sleeve 726 and the spring A723, and the strip column 724 can drive the hollow worm 721 to reciprocate;

[0098] When the hollow worm 721 in the self-rotating state moves in the direction close to the spring A723, the hollow worm 721 cannot drive the worm wheel 722 to perform normal rotational movement. The thread surface on the hollow worm 721 that rotates and moves synchronously can be regarded as a circular thread surface. Although it rotates in the tooth surface of the worm wheel 722, it does not drive it to rotate, and the two do not have a meshing relationship; when the hollow worm 721 in the self-rotating state moves in the direction away from the spring A723, the thread surface on the hollow worm 721 and the tooth surface on the worm wheel 722 resume the meshing relationship, so that the hollow worm 721 drives the worm wheel 722 to rotate normally, thereby realizing the intermittent self-rotation of the worm wheel 722;

[0099] The worm gear 722 drives the guide mechanism 800 to work intermittently, and the guide mechanism 800 drives the pressing wheel 914 to move inward intermittently through the slider 911, so that the pressing wheel 914 can effectively and fully press the packaging film 210 on the trajectory from the edge end of the chip to its center position by moving inward intermittently and rotating continuously;

[0100] The above is the working principle of the integrated circuit chip packaging coating device.

[0101] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit chip packaging coating device, comprising a device frame, a slide seat is vertically slidably mounted on the device frame, a coating frame is fixed to one side of the slide seat, reels for winding and unwinding the packaging film are mounted on both sides of the device frame, two reels are distributed on both sides of the coating frame, the packaging film is located directly below the coating frame, a conveyor belt perpendicular to the packaging film is arranged below the packaging film, a chip is placed on the conveyor belt, a coating disc is arranged between the coating frame and the packaging film, the coating disc is rotatably mounted on the coating frame through a connecting shaft, and is characterized in that: Also includes: A rotating mechanism, which is mounted on the laminating frame and fixedly connected to the connecting shaft; An intermittent regulating mechanism, the intermittent regulating mechanism comprising a linkage component and a regulating component, one end of the linkage component is mounted on the laminating frame and is located outside the laminating disk, and the other end of the linkage component is mounted on the laminating disk and connected to the regulating component mounted on the laminating disk; A guide mechanism, which is circumferentially distributed on the coating disc and slidably cooperates with guide grooves circumferentially provided on the coating disc, and one end of the guide mechanism is fixedly connected to the regulating component; The laminating mechanism comprises a pressing assembly and a cutting assembly, wherein the pressing assembly is mounted on the guide mechanism and is located at the bottom of the laminating disk, one end of the cutting assembly is mounted on the pressing assembly, and the other end of the cutting assembly is connected to the bottom of the laminating disk; The slide can drive the laminating disk, the rotating mechanism, the intermittent regulating mechanism, the guiding mechanism and the laminating mechanism to move vertically synchronously through the laminating frame. The laminating mechanism presses the packaging film onto the chip on the conveyor belt and releases the packaging film by vertical movement. When it is necessary to expand the pressing range of the pressing assembly on the packaging film, the rotating mechanism drives the connecting shaft to rotate forward, the connecting shaft drives the laminating disk to rotate, and the laminating disk drives one end of the linkage assembly, the regulating assembly, the guide mechanism and the laminating mechanism to rotate synchronously at the same time. One end of the linkage assembly drives the other end to rotate continuously by rotating and cooperating with the laminating frame, and the other end of the linkage assembly drives the regulating assembly to rotate continuously. The regulating assembly drives the pressing assembly and the cutting assembly to move continuously outward through the guide mechanism, and the cutting assembly deflects during the continuous outward movement. When the pressing component and the cutting component move to the required positions, the cutting end on the cutting component contacts the packaging film, and the pressing component contacts the edge end of the chip and squeezes the packaging film above the chip. At this time, the rotating mechanism drives the connecting shaft to rotate in the opposite direction, and the connecting shaft drives the film coating disk to rotate in the opposite direction. The film coating disk simultaneously drives one end of the linkage component, the regulating component, the guiding mechanism and the film coating mechanism to rotate in the opposite direction synchronously. The cutting component in the rotating state can cut the packaging film located outside the edge end of the chip, and the pressing component in the rotating state covers the packaging film at the edge end of the chip. One end of the linkage component can drive the other end to rotate in the opposite direction through the laminating frame, and the other end of the linkage component drives the regulating component to rotate intermittently. The regulating component drives the pressing component and the cutting component to move inward intermittently through the guiding mechanism, and the cutting component deflects in the opposite direction and separates from the packaging film. The pressing component effectively and fully presses the packaging film on the trajectory from the edge end of the chip to its center position by intermittent inward movement and continuous rotation.

2. The integrated circuit chip packaging coating device according to claim 1, characterized in that: The rotating mechanism comprises: a motor fixed to the laminating frame; and A main shaft is fixed on the output end of the motor, and the main shaft is fixedly connected to the connecting shaft through a transmission member.

3. The integrated circuit chip packaging coating device according to claim 1, characterized in that: The linkage components include: Bracket A and bracket B are respectively installed on the laminating disk; The two ends of the rotating shaft B are rotatably mounted on the bracket A and the bracket B respectively, one end of the rotating shaft B is provided with a strip slide groove, the end of the strip slide groove is provided with a Z-shaped slide groove connected thereto, and the strip slide groove and the Z-shaped slide groove intermittently slide with the regulating component; An annular internal gear fixed on the laminating frame and located outside the laminating disk, wherein the annular internal gear is concentric with the laminating disk; Rotating a rotating shaft A mounted on the laminating disk, wherein the rotating shaft A is connected to the rotating shaft B via a universal joint; and A bevel gear is fixed on the rotating shaft A, and the bevel gear is meshed with the annular internal gear.

4. The integrated circuit chip packaging coating device according to claim 3, characterized in that: The control components include: A hollow worm gear sleeved on the outside of the rotating shaft B, one end of the hollow worm gear being connected to the bracket A through a spring A; A worm wheel fixed on the guide mechanism, the worm wheel meshing with the hollow worm; A strip column mounted on the other end of the hollow worm, the strip column intermittently cooperates with the strip slide groove and the Z-shaped slide groove; A guide sleeve fixed on the bracket B, wherein the guide sleeve, the hollow worm and the rotating shaft B are all concentric, and one end of the guide sleeve is configured as an inclined end; and A movable part is installed on one end of the strip column, and the outer wall of the movable part is intermittently slidably matched with the inclined end of the guide sleeve.

5. The integrated circuit chip packaging coating device according to claim 4, characterized in that: The guiding mechanism comprises: A connecting sleeve rotatably mounted on the coating disc and concentric with the connecting shaft, wherein a worm gear is fixed to the outside of the connecting sleeve; a disc fixed to the outside of the connecting sleeve; and The connecting rods are circumferentially distributed on the disc, the distribution number and distribution position of the connecting rods are consistent with the distribution number and distribution position of the guide groove, and one end of the connecting rod is rotatably connected to the pressing assembly installed in the guide groove.

6. The integrated circuit chip packaging coating device according to claim 5, characterized in that: The pressing component comprises: A slider slidably mounted in the guide groove, wherein a cutting assembly is mounted on one side of the slider; A sliding column vertically slidably mounted on the slider; A U-shaped frame fixed to the bottom of the sliding column, wherein the top of the U-shaped frame is connected to the bottom of the sliding block via a spring B; and The pressure wheel is installed at the bottom of the U-shaped frame.

7. The integrated circuit chip packaging coating device according to claim 6, characterized in that: The cutting component comprises: Rotate the mounting shaft mounted on one side of the slider; A cutting knife fixed on the mounting shaft; a spur gear fixed to the mounting shaft; A mounting bracket fixed to the bottom of the laminating tray; and A rack is fixed on the mounting frame, the rack is intermittently meshed with the spur gear, and the rack is distributed at the edge of the bottom of the coating disk.

Citation Information

Cited By

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