Laminated two-dimensional array transducer and preparation method thereof

Abstract

The invention provides a laminated two-dimensional array transducer and a preparation method thereof, the two-dimensional array transducer comprises a fixed frame and M single-layer array elements, and each single-layer array element comprises a row array element and a flexible circuit board; the row array element comprises N array units arranged in rows; the flexible circuit board comprises a bonding wire end flexible board and a probe end flexible board; one end of the probe end flexible plate is fixedly connected with a row array element, and the other end is coupled with the bonding wire end flexible plate; the bonding wire end flexible board is used for being in communication connection with an external electronic imaging system; the fixing frame is used for fixing the probe end flexible plate and the row array element; the plurality of single-layer array elements are arranged in a stacked manner and form an M * N array unit matrix under the constraint of the fixed frame. Flexible disassembly and assembly between the transducer piezoelectric array and the cable can be achieved, the connection difficulty of the transducer array and the cable is reduced, the number of single-layer array elements can be adjusted and the single-layer array elements can be replaced according to needs, and higher-frequency transducer manufacturing is achieved.

Description

Technical Field

[0001] The present application relates to the field of ultrasonic transducers, and in particular to a stacked two-dimensional array transducer and a method for preparing the same. Background Art

[0002] Ultrasonic transducers are key components of ultrasonic imaging, and two-dimensional array transducers play an important role in the acquisition of three-dimensional volume data in space. In order to obtain high-quality and appropriate imaging depth ultrasonic images, full-sampling two-dimensional array transducers are generally used. This two-dimensional array array requires a large number of array units with fine spacing. There is a close relationship between the spacing, number and frequency of individual array elements in ultrasonic transducers. In order to avoid the influence of grating lobes in the sound field, the spacing between array elements should generally be less than 0.5 times the wavelength. The higher the frequency, the smaller the spacing between individual array elements. For example, for a 1MHz array transducer, the spacing should be less than 0.75mm; and for a 10MHz transducer, the spacing should be less than 0.075mm. In addition, the smaller the spacing between individual array elements, the more array elements there are in the same aperture of the array transducer, making the transducer's lateral spatial resolution better. In fact, considering the imaging area and the difficulty of the manufacturing process, the smaller the array element spacing, the more difficult it is to make, and the more array elements there are in the same imaging area, the more difficult it is to connect the array elements and the imaging electronic system, because the increase in the number of array elements means an increase in connection angles and connecting wires.

[0003] The traditional two-dimensional array manufacturing process is limited by the manufacturing process of the flexible board, and the minimum array element spacing that can be achieved is about 0.3mm, which limits the increase in array frequency and greatly limits the clinical application of two-dimensional arrays. In the prior art, there is a method for preparing a stacked array transducer, which can realize the preparation of high-frequency array transducers with tiny array element spacing. However, in order to control all elements in the two-dimensional array, all array elements must be connected to the imaging electronic system through cables. Traditional low-frequency array transducers with larger array element sizes directly weld the cables to the array elements. This method is time-consuming and labor-intensive, and is easy to damage the array elements. Arrays with smaller array element sizes usually use connectors designed on flexible circuit boards and external cable connectors, but the size of the connection between the connector and the cable will be relatively large, which limits the application of the transducer.

[0004] Currently, there is a plan to carve out each array unit on a whole chip, attach the specific flexible circuit board to the gold-plated piezoelectric material, weld a universal connector on one end of the flexible circuit board, and then connect it to the cable through the connector. In this way, the electrical signal generated by the piezoelectric material during the vibration process is brought out to the ultrasonic imaging system. However, the disadvantage of this technology is that the spacing between the array elements of the transducer is affected by the manufacturing process of the flexible board and it is difficult to reduce it, which greatly limits the imaging performance of the transducer. In addition, the connector is welded on the other end of the flexible board, which makes the size of the entire transducer larger, making it difficult to make a smaller two-dimensional array transducer.

[0005] Although the existing two-dimensional array transducer can realize a thousand-element array, due to the limitations of the existing manufacturing process, the transducer array electrode is led out through the flexible circuit board and electrically connected to the cable by traditional soldering method (such as Figure 1 ), and the other end of the flexible circuit board is connected through a connector (such as Figure 2 ), the connection size is large, resulting in a larger handle end of the entire transducer, and it is difficult to achieve good electrical shielding, which in turn affects the image quality, making it difficult to be widely used in clinical practice. Summary of the invention

[0006] Based on the problems existing in the prior art, the present application provides a stacked two-dimensional array transducer and a method for preparing the same. The specific solution is as follows:

[0007] A stacked two-dimensional array transducer comprises a fixed frame and M single-layer array elements, wherein the single-layer array elements comprise row array elements and a flexible circuit board;

[0008] The row array element comprises N array units arranged in rows;

[0009] The flexible circuit board comprises a wire bonding end flexible board and a probe end flexible board; one end of the probe end flexible board is fixedly connected to a row array element, and the other end is coupled to the wire bonding end flexible board; the wire bonding end flexible board is used for communication connection with an external electronic imaging system;

[0010] The fixed frame is used to fix the probe end flexible board and the row array elements; a plurality of single-layer array elements are stacked and arranged to form an M*N array unit matrix under the constraint of the fixed frame;

[0011] Wherein, M and N are both positive integers greater than 1.

[0012] In some specific embodiments, a flexible board frame is further included, and the flexible board frame is used to fix each flexible circuit board.

[0013] In some specific embodiments, one end of the probe end flexible board is provided with N electrode leads, and the cross-sectional area of ​​each electrode lead is smaller than the size of a single array unit, so that each electrode lead fits one-to-one with each array unit in the row array element.

[0014] In some specific embodiments, the fixed frame and / or the flexible board frame is a metal frame to achieve electrical shielding.

[0015] In some specific embodiments, the flexible circuit boards in each single-layer array element are bonded and connected.

[0016] A method for preparing a two-dimensional array transducer is used to prepare the two-dimensional array transducer described above, and the preparation method comprises the following steps:

[0017] After preparing the matching layer and the backing layer on the basis of the piezoelectric layer, a row array element consisting of a row of N array units is obtained by cutting out a plurality of sheet structures and filling them with decoupling materials;

[0018] A flexible circuit board is prepared according to the structure of the row array element, and one end of the flexible circuit board is attached to the row array element to obtain a single-layer array element, and the other end of the flexible circuit board has a welding wire connected to an external electronic imaging system;

[0019] M single-layer array elements are stacked and arranged so that the row array elements and the flexible circuit board are staggered, and one end of the flexible circuit board where the row array elements are located is fixed by the fixing frame.

[0020] In some specific embodiments, the method further includes: fixing the flexible circuit boards in each single-layer array element in close contact with each other through a flexible board frame.

[0021] In some specific embodiments, M single-layer array elements are placed in a flexible board frame that matches the size of the flexible circuit board to limit the relative displacement of each flexible circuit board in the first direction:

[0022] Applying force in a second direction to the flexible circuit boards by means of a pressing piece that matches the size of the pressing opening of the flexible board frame so that the flexible circuit boards are in close contact in the second direction;

[0023] After pressing to a preset degree, the pressing member is fixed in the pressing opening to complete the close contact and fixation between the flexible circuit boards.

[0024] In some specific embodiments, the preparation of the row array element specifically includes:

[0025] First, an electrode material is arranged on one surface of the piezoelectric layer according to preset requirements to obtain a matching layer; then the piezoelectric layer is turned over and an electrode material is arranged on the other surface thereof to obtain a backing layer;

[0026] After the electrode materials on both surfaces of the piezoelectric layer are solidified, they are first cut into multiple sheet structures, and after the sheet structures are fixed, array units are cut out, and then decoupling materials are filled in the cut gaps. After they are completely solidified, they are ground and finally cut out to obtain a row element consisting of a row of N array units.

[0027] In some specific embodiments, the method further includes: designing the shape and size of the fixing frame according to preset requirements for the two-dimensional array transducer.

[0028] Beneficial effects:

[0029] The present application proposes a stacked two-dimensional array transducer and a preparation method thereof, which can realize flexible disassembly and assembly between the transducer piezoelectric array and the cable, reducing the difficulty of connecting the transducer array and the cable. Each layer of single-layer array elements is connected by a fixed frame to form a planar array, which can realize the disassembly and adjustment of the single-layer array elements. In practical applications, the number of single-layer array elements can be adjusted and replaced as needed to achieve the production of higher frequency transducers. The preparation method can produce various special-shaped and small array element spacing two-dimensional array transducers, and at the same time can realize flexible disassembly and assembly between the transducer piezoelectric array and the cable, reducing the difficulty of connecting the transducer array and the cable, simplifying the process flow, and reducing the production cost, which is of great significance to the clinical use of two-dimensional array transducers.

[0030] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a schematic diagram of a traditional array element welding wire area array transducer;

[0033] Figure 2 It is a schematic diagram of a conventional flexible board lead area array transducer;

[0034] Figure 3 is a schematic diagram of the overall structure of the two-dimensional array transducer of the present application;

[0035] Figure 4 is a schematic diagram of the array structure of the two-dimensional array transducer of the present application;

[0036] Figure 5It is a schematic diagram of the single-layer array element structure of the present application;

[0037] Figure 6 It is a schematic diagram of the single-layer array element stacking structure of the present application;

[0038] Figure 7 It is a schematic diagram of the flexible circuit board connection of the present application;

[0039] Figure 8 It is a schematic diagram of the preparation method of the present application.

[0040] Figure numerals: 1-single-layer array element; 2-flexible circuit board; 3-fixed frame; 4-flexible board frame; 11-second matching layer; 12-first matching layer; 13-piezoelectric layer; 14-backing layer; 21-flexible board at the probe end; 22-flexible board at the welding wire end; 23-conductive protrusion; 24-welding wire. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0042] The present application proposes a stacked two-dimensional array transducer, which can realize flexible disassembly and assembly between the transducer piezoelectric array and the cable, reducing the difficulty of connecting the transducer array and the cable. Figure 3-6 The specific plan is as follows:

[0043] A stacked two-dimensional array transducer includes a fixed frame 3 and M single-layer array elements 1, wherein the single-layer array element 1 includes a row array element and a flexible circuit board 2; the row array element includes N array units arranged in rows; the flexible circuit board 2 includes a wire-welding end flexible board 22 and a probe end flexible board 21; one end of the probe end flexible board 21 is fixedly connected to a row array element, and the other end is coupled to the wire-welding end flexible board 22; the wire-welding end flexible board 22 is used for communication connection with an external electronic imaging system; the fixed frame 3 is used to fix the probe end flexible board 21 and the row array element; a plurality of single-layer array elements 1 are stacked and arranged to form an M*N array unit matrix under the constraint of the fixed frame 3; wherein M and N are both positive integers greater than 1. The relationship between the flexible circuit board 2 and the fixed frame 3 is shown in the attached figure. Figure 3 As shown, the relationship between the fixed frame 3 and the single-layer array element 1 is as shown in the attached Figure 4 As shown, the single-layer array element 1 is as shown in the attached Figure 5 As shown, the stacked single-layer array element 1 is as shown in the attached Figure 6 shown.

[0044] In the present application, each layer of single-layer array elements 1 in the two-dimensional array transducer is connected by a fixed frame 3 to form a planar array, which enables the disassembly and adjustment of the single-layer array elements 1. In practical applications, the number of single-layer array elements 1 can be adjusted and the single-layer array elements 1 can be replaced as needed. When a certain layer of the array is broken, each layer can be taken out and the damaged single-layer array element 1 structure can be replaced. The repair operation is simple, which greatly reduces the use cost and maintenance cost of the two-dimensional array transducer. In addition, the transducer components and connecting wires are more flexible to be detachable, which greatly reduces the number of welding wires, and can realize multiple plugs for one line, reducing labor costs. In addition, the two-dimensional array transducer of the present application can be designed and manufactured with a smaller array element spacing to achieve a higher array frequency.

[0045] In the present application, a single-layer array element 1 includes a row array element and a flexible circuit board 2, and each flexible circuit board 2 is provided with a row array element, thereby forming a single-layer array element 1. Multiple single-layer elements are stacked and distributed, so that multiple row array elements form a matrix of multiple rows and columns. The row array element includes N array units arranged in rows, and when M row array elements are stacked and distributed, an M*N array unit matrix is ​​formed.

[0046] In this application, in order to meet the requirements of one-line multi-purpose, convenient and compact, and easy disassembly and assembly of transducers and cables, a single-layer welding wire flexible circuit board is proposed. The flexible circuit board 2 includes a welding wire end flexible board 22 and a probe end flexible board 21. The welding wire end flexible board 22 is responsible for connecting the external imaging system, and the probe end flexible board 21 combines with the array element to form a probe. The flexible circuit board 2 adopts a one-line multi-plug solution, which significantly reduces the number of welding wires 24 required, which not only reduces the material cost, but also greatly improves the convenience of system maintenance.

[0047] Specifically, one end of the probe end flexible board 21 is fixedly connected to a row array element, and the other end is coupled to the wire end flexible board 22. In some embodiments, the row array element is bonded to the probe end flexible board 21. In some embodiments, the flexible circuit board 2 in each single-layer array element 1 is bonded. The bonding connection facilitates the adjustment and replacement of the single-layer array element 1, and realizes more flexible disassembly and assembly. The number of transducer matching layers can be changed as needed to realize the production of a higher frequency area array transducer.

[0048] In some embodiments, one end of the probe end flexible board 21 is provided with N electrode leads, and the cross-sectional area of ​​each electrode lead is smaller than the size of a single array unit, so that each electrode lead is bonded one-to-one with each array unit in the row array element. In practical applications, the probe end flexible board 21 includes a number of electrode leads and two ground wires, and the ground wires are located at both ends of the electrode leads. If there are special needs, the ground wires can also be designed at a certain position in the middle. The size, number and arrangement of the target array elements in the row array element correspond to the electrode leads on the probe end flexible board 21, so that each array element is conveniently bonded to the electrode leads corresponding to each other. The flexible circuit board with multiple array units pasted is a complete single-layer array element 1. These single-layer array elements 1 are precisely arranged according to the predetermined target shape to form a stable and neat two-dimensional linear array structure.

[0049] In some embodiments, the probe end flexible board 21 and the wire end flexible board 22 are as shown in the attached Figure 7 As shown in the attached Figure 7 In the figure, both the probe end flexible board 21 and the wire bonding end flexible board 22 are provided with conductive protrusions 23, and the conductive protrusions 23 on the wire bonding end flexible board 22 are connected to the external imaging system through welding wires. The connection between the probe end flexible board 21 and the wire bonding end flexible board 22 is shown in area A, and the connection between the probe end flexible board 21 and the conductive protrusions 23 on the wire bonding end flexible board 22 is achieved through welding wires.

[0050] The wire-bonding end flexible board 22 is responsible for completing the signal transmission with the electronic imaging system, and its width can be designed according to the requirements. In practical application, the width of this area is preferably slightly wider than the design requirements, so that the leads on the flexible board are wider and better contacted in the connector, making the transmission of electrical signals more stable.

[0051] In some specific embodiments, the two-dimensional array transducer further includes a flexible board frame 4, which is used to fix each flexible circuit board 2. In order to ensure that the two parts of the flexible board can be well coupled during use and to ensure that the part of the flexible board has good storage stability, it is also necessary to use a special material of a target thickness to reinforce the entire flexible board for mechanical and environmental protection, to provide moisture-proof, dust-proof, shock-proof, corrosion-proof and heat-dissipating effects, and to improve overall reliability and service life.

[0052] In the present application, the fixed frame 3 is responsible for fixing the probe part of the two-dimensional array transducer, and the flexible board frame 4 is responsible for fixing the flexible board. When multiple layers of flexible boards are combined, they are placed in an interlaced stacking manner. In order to make the flexible boards contact better, a flexible board frame 4 is designed and manufactured to fix the multiple layers of flexible boards, ensuring full contact of each layer of flexible circuit board 2, and finally achieving stable signal transmission. The fixed frame 3 and / or the flexible board frame 4 can be selected from materials that are easy to achieve electrical shielding. In some specific embodiments, the fixed frame 3 and / or the flexible board frame 4 is a metal frame to achieve electrical shielding. The metal frame can not only provide the necessary mechanical support and protection, but also form a good electrical shielding for the connection to avoid affecting the imaging quality.

[0053] In actual applications, in order to adapt to different application scenarios and functional requirements, the design team can customize metal frames of various shapes and sizes according to actual conditions to match the target forms of different array transducers, including the layout, arrangement order and number of layers of the array. The customized design enables the system to achieve functions while also having high flexibility, and can perform optimally in different environments.

[0054] The present application also proposes a method for preparing a two-dimensional array transducer, which is used to realize the production of the above-mentioned two-dimensional array transducer. The process of the preparation method is as shown in the attached Figure 8 As shown, the preparation method comprises the following:

[0055] 101. After preparing a matching layer and a backing layer 14 on the basis of the piezoelectric layer 13, a row array element consisting of a row of N array units is obtained by cutting out a plurality of sheet structures and filling them with decoupling materials;

[0056] 102. Prepare a flexible circuit board 2 according to the structure of the row array element, and make one end of the flexible circuit board 2 adhere to the row array element to obtain a single-layer array element 1, so that the other end of the flexible circuit board 2 has a welding wire connected to an external electronic imaging system;

[0057] 103 . Stack and arrange M single-layer array elements 1 so that the row array elements and the flexible circuit board 2 are staggered, and fix one end of the flexible circuit board 2 where the row array elements are located by a fixing frame 3 .

[0058] The present application first makes a large piezoelectric layer 13, and after the matching layer on the surface and the backing layer 14 on the other surface are solidified, it is cut into several sheet structures, and then a single array unit is cut out and attached to the flexible board to form a single-layer array element 1. These single-layer array elements 1 are precisely arranged into a stable structure according to the predetermined target form, and a specially customized metal frame is used to provide the necessary mechanical support and protection. One end of the flexible circuit board 2 is connected to the single-layer array element 1, and the other end is welded with a connecting wire. When multiple layers of flexible boards are combined, they are placed in a staggered stacking manner.

[0059] In step 101, the preparation of the piezoelectric layer 13, the matching layer and the backing layer 14 is implemented. In some embodiments, the preparation of the row array element specifically includes: firstly, according to the preset requirements, an electrode material is set on one surface of the piezoelectric layer 13 to obtain a matching layer; then, the piezoelectric layer 13 is flipped and an electrode material is set on the other surface to obtain a backing layer 14; after the electrode materials on both surfaces of the piezoelectric layer 13 are solidified, it is first cut into a plurality of sheet structures, and after the sheet structures are fixed, the array units are cut out, and then the decoupling material is filled in the cut gap position, and after it is completely solidified, it is ground, and finally, a row array element consisting of a row of N array units is obtained by cutting. In practical applications, the untreated piezoelectric material is first ground to the target thickness, and then a layer of electrode material is plated on one surface by sputtering, evaporation or other processes, and a first matching layer 12 is made on the surface. According to the requirements of different transducers, it may be necessary to make a second matching layer 11. After the matching layer is made, the piezoelectric layer 13 material is flipped, and a layer of electrode material is also plated on the other surface, and a backing layer 14 of corresponding thickness is made thereon. After all materials are completely solidified, the wafer is cut into several sheet structures, and then the sheet structures are fixed to cut out a single array unit. Then, the cut gaps are filled with decoupling materials, such as epoxy resin, silicone rubber, PDMS, etc., and after they are completely solidified, they are ground to the target thickness. Finally, the excess arrays on both sides are cut off to obtain a row of single array units with the target number.

[0060] In step 102, the connection of the flexible circuit board 2 is involved. The flexible board is divided into two parts. One part is used to paste the prepared array, including a number of electrode leads and two ground wires. The width of each lead is smaller than the width of a single array element, ensuring that the lead can be fitted one-to-one with each array element in the single-layer array; the other part is responsible for completing the signal transmission with the electronic imaging system, and its width can be designed according to the requirements. In actual application, the width of this area is preferably slightly wider than the design requirements, so that the leads on the flexible board are wider and better contacted in the connector, making the transmission of electrical signals more stable.

[0061] In step 103, a multi-layer array stacking arrangement is involved. In some specific embodiments, it also includes: designing the shape and size of the fixed frame 3 according to the preset requirements for the two-dimensional array transducer. According to the size, number, and arrangement of the target array elements in the single-layer array element 1 (generally, the ground wire is located at both ends of the electrode lead, and if there is a special requirement, the ground wire can also be designed at a certain position in the middle), etc., after completing the circuit design diagram of the flexible circuit board 2 (that is, the number of leads on this flexible circuit board 2 is the same as the number of array elements in the array, and the two ground leads are connected), each array element and the electrode lead corresponding to it are bonded.

[0062] In some specific embodiments, it also includes: the flexible circuit boards 2 in each single-layer array element 1 are fixed after being in close contact through the flexible board frame 4. In order to make the two parts of the flexible board contact better, the flexible board frame 4 is designed and manufactured as a clamp to fix the multi-layer flexible board, to ensure the full contact of each layer of flexible circuit boards 2, and finally to achieve stable signal transmission. Specifically, M single-layer array elements 1 are placed in a flexible board frame 4 that matches the size of the flexible circuit board 2 to limit the relative displacement of each flexible circuit board 2 in the first direction: with the help of a pressing piece that matches the size of the pressing port of the flexible board frame 4, a force in the second direction is applied to the flexible circuit board 2 so that each flexible circuit board 2 is in close contact in the second direction; after pressing to a preset degree, the pressing piece is fixed in the pressing port to complete the close contact and fixation between the flexible circuit boards 2.

[0063] The flexible circuit board 2 with the row array elements pasted on it is a complete single-layer array element 1. According to the predetermined target form, these single-layer array elements 1 are precisely arranged to form a stable and neat two-dimensional linear array structure. At this stage, in order to achieve the fixed position relationship of each layer of array elements, a specially customized flexible board frame 4 is designed to limit the relative movement between each layer of flexible boards. The layers of the transducer are connected with it to form a complete array, ensuring that the three-dimensional position relationship between all single-layer array elements 1 is accurate and stable. The flexible board frame 4 can provide the necessary mechanical support and protection to ensure that no displacement or deformation occurs during use, ensure that the relative position of each single-layer array element 1 is accurate, and achieve the best overall performance. In addition, the flexible board frame 4 can provide sufficient contact area to ensure the normal operation of the array transducer, and can also play the role of electrical shielding when the transducer is actually used. In addition, in order to adapt to different application scenarios and functional requirements, flexible board frames 4 of various shapes and sizes can be customized according to actual conditions to adapt to the target forms of different array transducers, including the layout, arrangement order and number of layers of the array. This customized design enables the system to achieve its functions while also having high flexibility and being able to perform at its best in different environments.

[0064] Since the other end of each single-layer array element 1 needs to complete the signal transmission with the electronic imaging system, the currently commonly used direct welding and connectors have major defects. The current flexible board manufacturing process has little effect on the spacing between the array elements of the array transducer. The traditional soldering method can form an electrical connection with the cable to achieve information interaction with the electronic imaging system. However, the two are difficult to separate after direct welding. Not only does one welding require a huge workload, but the cable can only be used for the transducers welded together, and cannot be used flexibly or disassembled at will. When using a connector to form an electrical connection with the cable, it is difficult to avoid the large size of the connection, which in turn leads to the problem that the handle end of the entire transducer is too large. At the same time, it is difficult to achieve good electrical shielding at the connection, which ultimately affects the quality of imaging.

[0065] Therefore, in order to meet the idea of ​​one-line multi-purpose, convenient and compact, and easy disassembly and assembly of the transducer and the cable, the present application designs a single-layer wire-welded flexible circuit board 2. In order to ensure the stable fitting state and better contact of the two parts of the flexible board, a clamp for fixing this part is also designed, that is, a clamp for auxiliary mechanical fixing of the flexible board.

[0066] In some embodiments, the fixture as a whole includes the following components: a flexible board frame 4 and a positioning block. Flexible board frame 4: that is, a position fixing drive component. The lower part of the flexible board frame 4 is a specially customized metal frame, the size of which matches the interface ends of the two flexible circuit boards 2 designed above, which can completely limit the relative displacement of each layer of flexible circuit boards 2 placed therein, and ensure full contact between the two parts of the flexible circuit boards 2 in each layer. The upper part of the flexible board frame 4 is designed with a suitable length nut to match the metal frame as needed, which is used to provide power for the up and down movement of the component. It can be combined with a torque wrench to conveniently provide a controllable and precise pressure source for pressurizing the stacked flexible boards, ensuring that the position between the upper and lower flexible boards is fixed. The positioning block is a metal block that completely matches the size of the pressing port on the flexible board frame 4. When in use, it is placed on the highest layer of flexible circuit board 2 after stacking to the target array layer number, and the positioning block provides pressure to press against the flexible circuit board 2 in the pressing port. The contact area between the metal block and the flexible circuit board 2 is reasonably designed so that the pressure can be evenly transmitted to each layer of the flexible circuit board 2, squeezing the air between the layers of the flexible circuit board 2 and tightly connecting the layers together. The above metal devices are all made of special shapes and materials, with good rigidity and durability. This design not only takes into account fixity and stability, but also fully considers manufacturing cost and ease of use, making it more practical and commercially valuable in actual production.

[0067] The specific use steps are: use the staggered stacking method to place the single-layer array element 1 and the flexible circuit board 2 layer by layer in the flexible board frame 4, pay attention to adjusting the front and rear position relationship of the flexible circuit board 2 when placing, and place the transducer array with enough layers in the flexible board frame 4. After placing a sufficient number of layers, place the positioning block on the top flexible circuit board 2, and slowly apply pressure to the positioning block. As the pressure increases, the air between each layer of the flexible circuit board 2 is reduced, and the fit becomes tighter, and finally the multi-layer flexible board is tightly connected. When the applied pressure is appropriate and sufficient, the metal block can be firmly bonded to the flexible board frame 4 using glue. This method ensures that the overall small size of the transducer meets the flexibility of the detachable transducer components and the connecting wires. When part of the transducer device is damaged or the transducer needs to be replaced as a whole, it is only necessary to simply take out each layer, and then re-stack the flexible board part of the required transducer. The whole process is fast and efficient. Through this design, a one-line multi-plug solution can be adopted, which significantly reduces the number of required welding wires 24, not only reduces the material cost, but also greatly improves the convenience of system maintenance. In addition, the skill level required for operators is also reduced accordingly, further reducing labor costs, improving production efficiency, and greatly improving the economy and maintainability of the entire system. This not only facilitates subsequent technology upgrades and replacements, but also provides more possibilities for future product improvements.

[0068] Considering the requirements of the finished probe, after confirming the final transducer design and performance, in order to further better package the probe, glue can be filled into the metal frame to firmly bond the stacked flexible circuit board 2. After the glue is completely cured, the probe is packaged according to conventional steps.

[0069] The present application proposes a stacked two-dimensional array transducer and a preparation method thereof, which can realize flexible disassembly and assembly between the transducer piezoelectric array and the cable, reducing the difficulty of connecting the transducer array and the cable. Each layer of single-layer array elements is connected by a fixed frame to form a planar array, which can realize the disassembly and adjustment of the single-layer array elements. In practical applications, the number of single-layer array elements can be adjusted and replaced as needed to achieve the production of higher frequency transducers. The preparation method can produce various special-shaped and small array element spacing two-dimensional array transducers, and at the same time can realize flexible disassembly and assembly between the transducer piezoelectric array and the cable, reducing the difficulty of connecting the transducer array and the cable, simplifying the process flow, and reducing the production cost, which is of great significance to the clinical use of two-dimensional array transducers.

[0070] Those skilled in the art should understand that the modules of the present application described above can be implemented by a general-purpose computing system, they can be concentrated on a single computing system, or distributed on a network composed of multiple computing systems, and optionally, they can be implemented by program codes executable by a computer system, so that they can be stored in a storage system and executed by the computing system, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0071] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

[0072] The above disclosure only discloses several specific implementation scenarios of the present application. However, the present application is not limited thereto, and any changes that can be conceived by technicians in this field should fall within the scope of protection of the present application.

Claims

1. A stacked two-dimensional array transducer, characterized in that: It comprises a fixed frame and M single-layer array elements, wherein the single-layer array elements comprise row array elements and a flexible circuit board; The row array element comprises N array units arranged in rows; The flexible circuit board comprises a wire bonding end flexible board and a probe end flexible board; one end of the probe end flexible board is fixedly connected to a row array element, and the other end is coupled to the wire bonding end flexible board; the wire bonding end flexible board is used for communication connection with an external electronic imaging system; The fixed frame is used to fix the probe end flexible board and the row array elements; a plurality of single-layer array elements are stacked and arranged to form an M*N array unit matrix under the constraint of the fixed frame; Wherein, M and N are both positive integers greater than 1.

2. The two-dimensional array transducer according to claim 1, characterized in that: Also included is a flexible board frame, which is used to fix each flexible circuit board.

3. The two-dimensional array transducer according to claim 1, characterized in that: One end of the probe end flexible board is provided with N electrode leads, and the cross-sectional area of ​​each electrode lead is smaller than the size of a single array unit, so that each electrode lead fits with each array unit in the row array element in a one-to-one correspondence.

4. The two-dimensional array transducer according to claim 1, characterized in that: The fixed frame and / or the flexible board frame is a metal frame to achieve electrical shielding.

5. The two-dimensional array transducer according to claim 1, characterized in that: The flexible circuit boards in each single-layer array element are bonded and connected.

6. A method for preparing a two-dimensional array transducer, characterized in that: For realizing the two-dimensional array transducer of claim 1, the manufacturing method includes the following: After the matching layer and the backing layer are prepared on the basis of the piezoelectric layer, a row array element consisting of a row of N array units is obtained by cutting out a plurality of sheet structures and filling them with decoupling materials; A flexible circuit board is prepared according to the structure of the row array element, and one end of the flexible circuit board is attached to the row array element to obtain a single-layer array element, and the other end of the flexible circuit board has a welding wire connected to an external electronic imaging system; M single-layer array elements are stacked and arranged so that the row array elements and the flexible circuit board are staggered, and one end of the flexible circuit board where the row array elements are located is fixed by the fixing frame.

7. The preparation method according to claim 6, characterized in that: Also includes: The flexible circuit boards in each single-layer array element are closely contacted and fixed by a flexible board frame.

8. The preparation method according to claim 7, characterized in that: M single-layer array elements are placed in a flexible board frame that matches the size of the flexible circuit board to limit the relative displacement of each flexible circuit board in the first direction: Applying force in a second direction to the flexible circuit boards by means of a pressing piece that matches the size of the pressing opening of the flexible board frame so that the flexible circuit boards are in close contact in the second direction; After pressing to a preset degree, the pressing member is fixed in the pressing opening to complete the close contact and fixation between the flexible circuit boards.

9. The preparation method according to claim 6, characterized in that: The preparation of the row array element specifically includes: First, an electrode material is arranged on one surface of the piezoelectric layer according to preset requirements to obtain a matching layer; then, the piezoelectric layer is turned over and an electrode material is arranged on the other surface thereof to obtain a backing layer; After the electrode materials on both surfaces of the piezoelectric layer are solidified, they are first cut into multiple sheet structures, and after the sheet structures are fixed, array units are cut out, and then decoupling materials are filled in the cut gaps. After they are completely solidified, they are ground and finally cut out to obtain a row element consisting of a row of N array units.

10. The preparation method according to claim 6, characterized in that: Also includes: The shape and size of the fixing frame are designed according to the preset requirements for the two-dimensional array transducer.

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