Dip welding type copper strip winding type welding column preparation device and method

Abstract

The invention relates to the technical field of integrated circuit component packaging, in particular to a dip welding type copper strip winding type welding column preparation device and method. Comprising a lead wire traction mechanism for leading out a lead wire, a copper strip winding mechanism for winding a copper strip on the lead wire, a segmented placement mechanism for cutting the copper strip wrapped lead wire, a gantry clamping mechanism for grabbing and rotating the copper strip wrapped lead wire, a dip welding mechanism for soldering the tin copper strip wrapped lead wire and a welding column cutting and collecting mechanism for cutting and collecting a welding column, the copper strip winding mechanism comprises a driving motor, a hollow rotating platform is arranged at the output end of the driving motor, a rotating wall plate is arranged on the hollow rotating platform, a copper strip damper for placing a copper strip is arranged at one end of the rotating wall plate, and a guide roller is arranged on the rotating wall plate; the dip welding mechanism comprises a scaling powder heating table, a tin pot heating table and a tin scraping mechanism which are arranged in sequence. The device is simplified, the automation degree is high, the size is small, and batch preparation of the enhanced welding columns can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit component packaging, and in particular to a device and method for preparing a dip soldering copper tape wound solder column. Background Art

[0002] With the improvement of integrated circuit technology requirements, electronic devices have more and more stringent requirements for stability, which has led to the continuous iteration and upgrading of packaging technology. Ceramic column grid array replaces ceramic ball grid array with solder column, and replaces ball grid with column grid, which improves the fatigue and stress problems between the device housing and the printed circuit board. Therefore, it has the advantages of high temperature resistance, impact resistance and high reliability. It has been widely used in high-reliability product fields.

[0003] The most critical issue in the ceramic column grid array is the preparation of the solder column. Commonly used solder columns are conventional solder columns and wrapped solder columns. The creep of the lead column and the conductivity of the copper strip make the wrapped solder column have higher reliability and electrical performance than the conventional solder column, but its preparation is also more complicated. The main evaluation index of the wrapped solder column is: the size of the porosity between the copper strip wrapped on the outside of the lead core and the lead core. The proportion of the porosity is directly related to its reliability. The presence of the hole will increase the probability of the copper strip peeling under stress and thermal shock. If the two peel off, the life of the solder column will be greatly reduced and may fail. NASA stipulates that the porosity value must be less than 5%. This standard has been recognized by the industry and has become an industry evaluation indicator. Although the existing preparation equipment has been able to solve the production difficulties of the wrapped solder column to a certain extent, the widespread problem of low qualified rate is still a key factor restricting the improvement of production efficiency. Summary of the invention

[0004] In order to solve the shortcomings of the prior art, the present invention provides a device and method for preparing a dip-welding copper tape wrapped solder column, which effectively reduces the porosity and improves the overall performance of the solder column by optimizing the production process, improving material properties and strengthening quality control.

[0005] To achieve the above-mentioned purpose, the technical scheme of the present invention is: a dip soldering copper tape winding type solder column preparation device, comprising a lead wire pulling mechanism for leading out the lead wire, a copper tape winding mechanism for winding the copper tape on the lead wire, a segmented placement mechanism for cutting the copper tape wrapped around the lead wire, a gantry clamping mechanism for grabbing the rotating copper tape wrapped around the lead wire, a dip soldering mechanism for soldering the copper tape wrapped around the lead wire, and a solder column cutting and collecting mechanism for cutting and collecting the solder column;

[0006] The copper belt winding mechanism comprises a driving motor, the output end of the driving motor is provided with a hollow rotating platform, the hollow rotating platform is provided with a rotating wall plate, one end of the rotating wall plate is provided with a copper belt damper for placing the copper belt, and the rotating wall plate is provided with a guide roller;

[0007] The soldering dip mechanism comprises a soldering flux hot stage, a tin pot hot stage and a tin scraping mechanism which are arranged in sequence.

[0008] Furthermore, the lead wire traction mechanism includes a lead wire feeding mechanism for guiding out the straightened lead wire and a lead wire rolling and straightening mechanism for tightly fitting the copper tape wrapped lead wire, and the copper tape winding mechanism is arranged between the lead wire feeding mechanism and the lead wire rolling and straightening mechanism.

[0009] Furthermore, the lead wire traction mechanism includes a damper fixing frame, on which a lead wire damper is arranged, and a first limit frame and a second limit frame are sequentially arranged on the right side of the damper fixing frame, the first limit frame is symmetrically provided with a first vertical roller, and the second limit frame is provided with a limit hole; the lead wire rolling straightening mechanism includes a support frame, on which a horizontal roller which can be adjusted up and down and a second vertical roller which can be adjusted left and right are arranged.

[0010] Furthermore, the segmented placement mechanism includes a cutting mechanism for cutting the copper tape wrapped around the lead wire, a swinging clamping mechanism for clamping and transferring the copper tape wrapped around the lead wire, and a placement displacement mechanism for placing the copper tape wrapped around the lead wire.

[0011] Furthermore, the cutting mechanism includes a flat plate, a cutting table is arranged on the flat plate, and a pneumatic element for cutting the copper tape wrapped around the lead wire is arranged above the cutting table; the swing clamping mechanism includes a displacement cylinder and a rotating air claw controlled by the displacement cylinder; the placement displacement mechanism includes a linear slide and a placement table that can move on the linear slide.

[0012] Furthermore, the flat plate is provided with a plurality of groups of positioning holes from left to right, and the cutting table is fixed on one of the groups of positioning holes.

[0013] Furthermore, the gantry clamping mechanism includes a flip clamping mechanism that can rotate at any angle, a vertical motion mechanism that controls the vertical displacement of the flip clamping mechanism, and a horizontal motion mechanism that controls the horizontal displacement of the flip clamping mechanism.

[0014] Furthermore, the soldering flux hot stage comprises a heating stage and a liquid tank, and a replenishing mechanism for monitoring and replenishing the soldering flux is disposed on one side of the liquid tank.

[0015] Furthermore, the welding column cutting and collecting mechanism includes a pneumatic cutting mechanism for cutting the welding column and a welding column collecting mechanism arranged below the pneumatic cutting mechanism.

[0016] A method for preparing a dip soldering copper tape winding type solder column device comprises the following steps:

[0017] Step 1: Lead out the lead wire and wrap it with copper tape;

[0018] Step 2: Cut the copper tape and wrap the lead wire to the preset length;

[0019] Step 3, grab the copper tape wrapped around the lead wire, dip the copper tape around the lead wire in flux and solder at a vertical angle in sequence, the temperature of the flux dipping is 60-80°C, and the temperature of the solder dipping is 180-200°C;

[0020] Step 4: Cut and recycle the solder column according to the preset length.

[0021] The beneficial effects achieved by the present invention are:

[0022] 1. The device of the present invention is simplified and highly automated. It is not only small in size but also has strong production capacity. It can prepare enhanced welding columns in batches, greatly improving production efficiency, making the preparation process of welding columns smoother and more efficient, and the production process is stable, meeting the needs of large-scale production.

[0023] 2. The copper tape winding mechanism adjusts the voltage according to the tension state of the copper tape through the copper tape damper, thereby ensuring that the tension of the copper tape is consistent at any angle. It can accurately control the tension force to ensure that the copper tape always maintains a stable tension state during the winding process, effectively avoiding the twisting and surface damage of the lead wire during the winding process, improving the consistency and accuracy of the copper tape winding, and ensuring the uniformity of the solder infiltration on the copper tape, thereby improving the surface quality and overall strength of the welded joint.

[0024] 3. The design of the dipping soldering mechanism reduces the residence time of the lead wire in the tin liquid, effectively reduces the risk of element melting and diffusion, and reduces the element contamination that may occur during the welding process; through reasonable insulation measures, the activity of the flux is ensured to be fully exerted, thereby achieving an extremely low porosity rate at the welding point between the copper strip and the lead wire, which is less than 1%, far exceeding the industry standard of less than 5%, significantly improving the strength and reliability of the welding joint, and further improving the overall welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the overall structure of the lead wire traction mechanism;

[0027] Figure 3 It is a schematic diagram of the overall structure of the copper strip winding mechanism;

[0028] Figure 4 It is a schematic diagram of the overall structure of the segmented placement mechanism;

[0029] Figure 5 It is a schematic diagram of the overall structure of the gantry clamping mechanism;

[0030] Figure 6It is a schematic diagram of the overall structure of the dip welding mechanism;

[0031] Figure 7 It is a schematic diagram of the overall structure of the welding column cutting and collecting mechanism.

[0032] Explanation of the marks in the figure: 1. Lead wire pulling mechanism; 2. Copper belt winding mechanism; 3. Segmented placement mechanism; 4. Gantry clamping mechanism; 5. Dip welding mechanism; 6. Weld column cutting and collecting mechanism; 11. Lead wire feeding mechanism; 12. Lead wire rolling straightening mechanism; 111. Damper fixing frame; 112. Lead wire damper; 113. First limit frame; 114. First vertical roller; 115. Second limit frame; 116. Limit hole; 121. Support frame; 122. Vertical guide rail; 123. Horizontal roller; 124. Second vertical roller; 21. Driving motor; 22. Electric slip ring; 23. Hollow rotating platform; 24. Rotating wall panel ; 25. Copper belt damper; 26. Copper belt pulley; 27. Guide roller; 28. Copper belt guide; 31. Cutting mechanism; 32. Swinging clamping mechanism; 33. Placement displacement mechanism; 311. Flat plate; 312. Cutting table; 313. Pneumatic element; 314. Positioning hole; 321. Displacement cylinder; 322. Rotating air claw; 331. Linear slide; 332. Placing table; 41. Horizontal motion mechanism; 42. Vertical motion mechanism; 43. Flipping clamping mechanism; 51. Flux hot plate; 52. Replenishment mechanism; 53. Tin pot hot plate; 54. Tin scraping mechanism; 61. Pneumatic cutting mechanism; 62. Solder column collecting mechanism. DETAILED DESCRIPTION

[0033] In order to better understand the purpose, structure and function of the present invention, a dip soldering copper tape winding type solder column preparation device of the present invention is further described in detail below in conjunction with the accompanying drawings.

[0034] like Figures 1 to 7 As shown, a device and method for preparing a dip-welding copper tape wrapped solder column comprises a lead wire traction mechanism 1, a copper tape winding mechanism 2, a segmented placement mechanism 3, a gantry clamping mechanism 4, a dip-welding mechanism 5 and a solder column cutting and collecting mechanism 6 which are arranged in sequence. The lead wire traction mechanism 1 is used to traction and straighten the lead wire and provide power for the lead wire. The copper tape winding mechanism 2 is used to evenly wind the copper tape around the moving lead wire. The segmented placement mechanism 3 is used to cut the straight copper tape wrapped lead wire into segments and arrange them in an arrangement. The gantry clamping mechanism 4 is used to clamp the copper tape wrapped lead wire cut by the moving and flipping segmented placement mechanism 3. The dip-welding mechanism 5 is used to dip the copper tape wrapped lead wire clamped by the gantry clamping mechanism 4 in flux and solder in sequence. The solder column cutting and collecting mechanism 6 is used to cut the copper tape wrapped lead wire after solder dipping into standard length and collect it.

[0035] like Figure 2As shown, the lead wire traction mechanism 1 includes a lead wire feeding mechanism 11 and a lead wire rolling and straightening mechanism 12 which are arranged in sequence. The lead wire feeding mechanism 11 is used to guide the lead wire and convey it along the axis, and the lead wire rolling and straightening mechanism 12 is used to tightly fit the copper strip wrapped lead wire and ensure that the lead wire is conveyed straight forward.

[0036] The lead wire feeding mechanism 11 includes a lead wire damper 112, which is arranged on a damper fixing frame 111. A rolled lead wire is placed on the rotating shaft of the lead wire damper 112. A first limiting frame 113 is arranged on the right side of the damper fixing frame 111. First vertical rollers 114 are symmetrically arranged on the top of the first limiting frame 113. There are two first vertical rollers 114. The first vertical rollers 114 can straighten the lead wire led out of the lead wire damper 112 to ensure that the lead wire can be transported in a horizontal direction. A second limiting frame 115 is arranged on the right side of the first limiting frame 113. A limiting hole 116 is arranged on the top of the second limiting frame 115. The lead wire passes through the limiting hole 116 on the top of the second limiting frame 115. The limiting hole 116 can ensure that the lead wire led out of the damper is transported along the set axis.

[0037] The lead wire rolling straightening mechanism 12 includes a support frame 121, and a horizontal roller 123 is symmetrically arranged on the top of the support frame 121. There are two horizontal rollers 123. A vertical guide rail 122 is arranged at the connection between the support frame 121 and the horizontal roller 123. The horizontal roller 123 can move along the direction of the vertical guide rail 122. The horizontal roller 123 is fixed to the support frame 121 by bolts. By adjusting the height of the horizontal roller 123, the distance between the upper and lower horizontal rollers 123 is adjusted. The upper and lower limit of the horizontal roller 123 is closely fitted to the copper tape wrapped lead wire. A motor for controlling the rotation of the horizontal roller 123 is arranged on one side of the horizontal roller 123. Driven by the motor, the lead wire can be transported along the same axis. A group of second vertical rollers 124 are arranged on the right side of the horizontal roller 123. There are two second vertical rollers 124. The second vertical rollers 124 are symmetrically arranged on both sides of the copper tape wrapped around the lead wire. The second vertical rollers 124 are arranged on the support frame 121 to straighten the copper tape wrapped around the lead wire.

[0038] like Figure 3As shown, the copper strip winding mechanism 2 is arranged between the lead wire feeding mechanism 11 and the lead wire rolling straightening mechanism 12, and can rotate around the lead wire when the lead wire is conveyed forward to wind the copper strip on the lead wire at a certain interval, including a driving motor 21, a hollow rotating platform 23 is arranged at the output end of the driving motor 21, an electric slip ring 22 is arranged between the driving motor 21 and the hollow rotating platform 23, a rotating wall plate 24 rotating with the hollow rotating platform 23 is arranged on the hollow rotating platform 23, a copper strip damper 25 is arranged at one end of the rotating wall plate 24, a copper strip pulley 26 is arranged on the rotating shaft of the copper strip damper 25, a rolled copper strip is placed on the copper strip pulley 26, and the rotating wall plate 24 A guide roller 27 and a copper belt guide 28 are provided on one side, and the guide roller 27 and the copper belt guide 28 ensure the direction and angle of the copper belt wrapped around the lead wire. The driving motor 21 drives the hollow rotating platform 23, and then drives the rotating arm plate to rotate, so that the copper belt makes uniform circular motion around the lead wire, so that the copper belt is wrapped around the lead wire. When the copper belt wheel 26 rotates 360°, the tension force will change during the process due to self-rotation. The copper belt damper 25 can adjust the voltage according to the tension state of the copper belt, so as to ensure that the tension of the copper belt is consistent at any angle, and ensure that the diameter size of the copper belt wrapped around the lead wire is uniform, thereby ensuring the subsequent dip welding effect.

[0039] like Figure 4 As shown, the segmented placement mechanism 3 is arranged on the right side of the lead wire rolling and straightening mechanism 12, including a cutting mechanism 31 for cutting the copper tape wrapped lead wire, a swinging clamping mechanism 32 for transferring the cut copper tape wrapped lead wire, and a placement displacement mechanism 33 for placing the copper tape wrapped lead wire.

[0040] The cutting mechanism 31 includes a cutting table 312 disposed on a flat plate 311, a pneumatic element 313 is disposed above the cutting table 312, a cutting knife is disposed at the bottom of the pneumatic element 313, and the pneumatic element 313 uses a pneumatic method to control the cutting knife to cut the copper tape wrapped lead wire. The flat plate 311 is provided with a plurality of positioning holes 314, and the cutting table 312 can be fixed in different positioning holes 314 to adjust the length of the copper tape wrapped lead wire after cutting. The swing clamping mechanism 32 clamps the copper strip wrapped around the lead wire and realizes rotation, including a displacement cylinder 321 and a rotating air claw 322 arranged at the telescopic end of the displacement cylinder 321. The displacement cylinder 321 drives the rotating air claw 322 to move forward and backward. When the cutting mechanism cuts the copper strip wrapped around the lead wire, the rotating air claw 322 will clamp the cut copper strip wrapped around the lead wire. Then the displacement cylinder 321 is started to push the rotating air claw 322 to move forward, ensuring that the rotating air claw 322 does not interfere with other structural parts when driving the copper strip wrapped around the lead wire to rotate. The placement displacement mechanism 33 includes a linear slide 331 and a placing table 332 that can move along the linear slide 331. A number of grooves are evenly arranged on the top of the placing table 332. The rotating air claw 322 clamps the cut copper tape wrapped lead wire and rotates 180° to place the copper tape wrapped lead wire on the placing table 332. The linear slide 331 controls the placing table 332 to move back and forth, thereby realizing the multi-section interval placement of the copper tape wrapped lead wire. The multi-section interval placement of the lead wire can improve the subsequent work efficiency and is also convenient for detecting the copper tape wrapping condition.

[0041] like Figure 5 As shown, the gantry clamping mechanism 4 includes a horizontal motion mechanism 41, a vertical motion mechanism 42 and a flip clamping mechanism 43. The horizontal motion mechanism 41 includes a slide rail and a slider moving on the slide rail; the vertical motion mechanism 42 is arranged on the slider, which can realize up and down movement, and control the horizontal height of the flip clamping mechanism 43 at the bottom of the vertical motion mechanism 42. The main component of the vertical motion mechanism 42 is a cylinder, and the main component of the flip clamping mechanism 43 is a rotating gripper, which can rotate at any angle. The horizontal motion mechanism 41 realizes the horizontal movement of the copper tape wrapped around the lead wire, the vertical motion mechanism 42 realizes the vertical movement of the copper tape wrapped around the lead wire, and the flip clamping mechanism 43 can clamp the copper tape wrapped around the lead wire and rotate it, and fix the copper tape wrapped around the lead wire in a horizontal state or a vertical state.

[0042] like Figure 6As shown, the dip soldering mechanism 5 can provide flux and solder without foreign matter on the surface so that the copper tape wrapped around the lead wire is dipped in flux and solder to obtain a dip soldering copper tape wrapped type solder column, including a flux hot table 51, a replenishing mechanism 52, a tin pot hot table 53 and a tin scraping mechanism 54, which are placed from left to right to complete the flux dipping and solder dipping. The flux hot table 51 includes a heating table and a liquid tank. The heating table is used to heat the flux so that the flux always remains active. The liquid tank is used to store the flux. The side wall of the liquid tank is provided with a through hole for replenishing the flux liquid level. A replenishing mechanism 52 is provided on one side of the flux hot table 51. The replenishing mechanism 52 can detect the liquid level height of the flux and replenish it in time to ensure the consistency of the dipping length of the copper tape wrapped around the lead wire. The tin pot hot table 53 is used for the solder to reach the welding temperature and keep the soldering temperature between 180 and 200°C. This temperature can reduce the occurrence of the hole phenomenon. The tin scraping mechanism 54 includes a position sensor and an electric push rod. When the copper tape is wrapped around the lead wire to complete the soldering flux coating, the tin scraping mechanism 54 moves to remove impurities on the soldering tin surface of the pot.

[0043] like Figure 7 As shown, the welding column cutting and collecting mechanism 6 will cut and collect the copper tape winding type welding columns according to the standard length to obtain a batch of winding type welding columns, including a pneumatic cutting mechanism 61 and a welding column collecting mechanism 62 located below the pneumatic cutting mechanism 61. The feeding distance of the clamping mechanism each time is the same as the cutting length. The pneumatic cutting mechanism 61 fixes the welding column to ensure the straightness of the welding column while realizing shearing under the action of compressed gas. The shearing can ensure the quality of the copper tape fracture and the straightness of the cross section. The top of the welding column collecting mechanism 62 is a conical trumpet-shaped structure, and a collection box is arranged below the conical trumpet-shaped structure. The collection box is used to collect the welding columns cut by the pneumatic cutting mechanism 61.

[0044] The preparation work before using the present invention comprises the following steps:

[0045] (1) The present invention is powered on to test whether the electrical and gas connections are normal;

[0046] (2) Place the rolled lead wire on the lead wire damper 112 in the lead wire pulling mechanism 1, place the copper belt on the copper belt damper 25 in the copper belt winding mechanism 2, pull the end of the lead wire through the lead wire rolling straightening mechanism 12, adjust the clamping force of the roller in the lead wire pulling mechanism 1, and ensure that the upper and lower limit horizontal rollers 123 make the lead wire horizontal and straight;

[0047] (4) Set the temperature of the flux hot plate to 60-80°C and the temperature of the tin pot hot plate to 180-200°C. Wait for the tin liquid to melt and stabilize for 5-10 minutes.

[0048] (5) Control the operation of the motors in the copper strip winding mechanism and the lead wire pulling mechanism to prepare the winding type welding column.

[0049] When the present invention is working, the rolled lead wire on the lead wire damper 112 is straightened by the first limit frame 113 and the second limit frame 115, and transported along the axial direction to enter the lead wire rolling straightening mechanism 12. During the lead wire transportation process, the copper belt winding mechanism 2 located between the lead wire feeding mechanism 11 and the lead wire rolling straightening mechanism 12, the copper belt damper 25 evenly winds the copper belt on the lead wire through the rotation of the rotating wall plate 24. After the lead wire is wrapped around the copper belt, the horizontal roller 123 limits the upper and lower positions to tightly fit the copper belt wrapped lead wire, and enters the segmented placement mechanism 3. The copper belt wrapped lead wire is cut into a preset length by the cutting mechanism 31, and the rotating air claw 322 in the swing clamping mechanism 32 clamps the cut copper belt wrapped lead wire and puts it into the placement table in the placement displacement mechanism 33. 332, the horizontal movement mechanism 41 controls the flipping and clamping mechanism 43 to move to the top of the display table 332, and the vertical movement mechanism 42 controls the flipping and clamping mechanism 43 to move down to grab the copper tape wrapped lead wire on the display table 332, and then move to the dipping soldering mechanism 5, the flipping and clamping mechanism 43 rotates to make the copper tape wrapped lead wire in a vertical state, the copper tape wrapped lead wire passes through the flux hot stage 51 and the tin pot hot stage 53 in turn, and the flux dipping and solder dipping of the copper tape wrapped lead wire are completed in turn, and finally the gantry clamping mechanism 4 carries the welding column into the welding column cutting and collecting mechanism 6, the flipping and clamping mechanism 43 rotates to make the welding column in a horizontal state, and enters the pneumatic cutting mechanism 61 for cutting with a preset length, and the cut welding column enters the welding column collecting mechanism 62 for collection.

[0050] The method for preparing a winding type welding column by using the present invention comprises the following steps:

[0051] Step 1: Lead out the lead wire and wrap it with copper tape;

[0052] Step 2: Cut the copper tape and wrap the lead wire to the preset length;

[0053] Step 3, grab the copper tape wrapped around the lead wire, dip the copper tape around the lead wire in flux and solder at a vertical angle in sequence, the temperature of the flux dipping is 60-80°C, and the temperature of the solder dipping is 180-200°C;

[0054] Step 4: Cut and recycle the solder column according to the preset length.

[0055] In order to reduce the manual operation of the device, the damper in the present invention, the first vertical roller 114, the second vertical roller 124 and the horizontal roller 123 in the wire traction mechanism 1 can be controlled by a program, and manual operation only requires replacing the wire roll and the copper strip roll to ensure the supply of materials.

[0056] The "left" and "right" mentioned above are defined according to the moving direction of the lead wire, with the position of the lead wire traction mechanism 1 being the "left" and the position of the welding column cutting and collecting mechanism 6 being the "right". This is only for the convenience of describing the scheme of the embodiments of the present invention and does not impose any restrictions on the substantive content of the schemes of each embodiment.

[0057] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A device for preparing a dip soldering copper tape winding solder column, characterized in that: The invention comprises a lead wire pulling mechanism (1) for leading out the lead wire, a copper tape winding mechanism (2) for winding the copper tape around the lead wire, a segmented placement mechanism (3) for cutting the copper tape wrapped around the lead wire, a gantry clamping mechanism (4) for grabbing the rotating copper tape wrapped around the lead wire, a soldering mechanism (5) for soldering the copper tape wrapped around the lead wire, and a soldering column cutting and collecting mechanism (6) for cutting and collecting soldering columns. The copper strip winding mechanism (2) comprises a driving motor (21), the output end of the driving motor (21) is provided with a hollow rotating platform (23), a rotating wall plate (24) is provided on the hollow rotating platform (23), a copper strip damper (25) for placing the copper strip is provided at one end of the rotating wall plate (24), and a guide roller (27) is provided on the rotating wall plate (24); The soldering dip mechanism (5) comprises a soldering flux hot stage (51), a tin pot hot stage (53) and a tin scraping mechanism (54) which are arranged in sequence.

2. A device for preparing a dip soldering copper tape wound solder column according to claim 1, characterized in that: The lead wire pulling mechanism (1) comprises a lead wire feeding mechanism (11) for guiding out the straightened lead wire and a lead wire rolling and straightening mechanism (12) for tightly fitting the copper tape wrapped lead wire, and the copper tape winding mechanism (2) is arranged between the lead wire feeding mechanism (11) and the lead wire rolling and straightening mechanism (12).

3. A device for preparing a dip soldering copper tape wound solder column according to claim 2, characterized in that: The lead wire pulling mechanism (1) comprises a damper fixing frame (111), on which a lead wire damper (112) is arranged, and on the right side of the damper fixing frame (111) a first limiting frame (113) and a second limiting frame (115) are arranged in sequence, the first limiting frame (113) is symmetrically provided with a first vertical roller (114), and the second limiting frame (115) is provided with a limiting hole (116); the lead wire rolling straightening mechanism (12) comprises a support frame (121), on which a horizontal roller (123) that can be adjusted up and down and a second vertical roller (124) that can be adjusted left and right are arranged.

4. The device for preparing a dip soldering copper tape wound solder column according to claim 1, characterized in that: The segmented placement mechanism (3) comprises a cutting mechanism (31) for cutting the copper strip wrapped around the lead wire, a swing clamping mechanism (32) for clamping and transferring the copper strip wrapped around the lead wire, and a placement displacement mechanism (33) for placing the copper strip wrapped around the lead wire.

5. The device for preparing a dip soldering copper tape wound solder column according to claim 4, characterized in that: The cutting mechanism (31) comprises a flat plate (311), a cutting table (312) is arranged on the flat plate (311), and a pneumatic element (313) for cutting the copper strip wrapped lead wire is arranged above the cutting table (312); the swing clamping mechanism (32) comprises a displacement cylinder (321) and a rotating air claw (322) controlled by the displacement cylinder (321); and the placement displacement mechanism (33) comprises a linear slide (331) and a placement table (332) movable on the linear slide (331).

6. A device for preparing a dip soldering copper tape wound solder column according to claim 5, characterized in that: The flat plate (311) is provided with a plurality of groups of positioning holes (314) in sequence from left to right, and the cutting table (312) is fixed on one of the groups of positioning holes (314).

7. The device for preparing a dip soldering copper tape wound solder column according to claim 1, characterized in that: The gantry clamping mechanism (4) comprises a flip clamping mechanism (43) that can rotate at any angle, a vertical motion mechanism (42) that controls the vertical displacement of the flip clamping mechanism (43), and a horizontal motion mechanism (41) that controls the horizontal displacement of the flip clamping mechanism (43).

8. The device for preparing a dip soldering copper tape wound solder column according to claim 1, characterized in that: The soldering flux hot stage (51) comprises a heating stage and a liquid tank, and a replenishing mechanism (52) for monitoring and replenishing soldering flux is arranged on one side of the liquid tank.

9. The device for preparing a dip soldering copper tape wound solder column according to claim 1, characterized in that: The welding column cutting and collecting mechanism (6) comprises a pneumatic cutting mechanism (61) for cutting welding columns and a welding column collecting mechanism (62) arranged below the pneumatic cutting mechanism (61).

10. A method for preparing a dip soldering copper tape wound solder column according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: Lead out the lead wire and wrap it with copper tape; Step 2: Cut the copper tape and wrap the lead wire to the preset length; Step 3, grab the copper tape wrapped around the lead wire, dip the copper tape around the lead wire in flux and solder at a vertical angle in sequence, the temperature of the flux dipping is 60-80°C, and the temperature of the solder dipping is 180-200°C; Step 4: Cut and recycle the solder column according to the preset length.

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