Laser beam pose debugging method of reflection type double-pendulum-shaft laser equipment

Abstract

The invention discloses a laser beam pose debugging method for reflection type double-pendulum-shaft laser equipment. The problems that an existing laser beam pose debugging method is tedious in process, low in efficiency, not easy to operate and high in adjusting cost are solved. An indication laser source or an imaging assembly is added on hardware, the double-pendulum-shaft C shaft is rotated four times, impact spots are formed on the positioning flat plate, the relative positions of the impact spots are observed, the inclination direction of machining laser is judged, and a fine adjustment screw of the reflection type double-pendulum-shaft laser equipment is adjusted and controlled, so that debugging can be completed. The method is easy and convenient to operate, the double pendulum shafts do not need to be disassembled, an existing laser machining device does not need to be modified, the adjusting efficiency is greatly improved, the time cost is saved, and the method is suitable for various laser machining devices.

Description

Technical Field

[0001] The invention relates to a laser precision adjustment method, and in particular to a laser beam posture adjustment method for a reflective double-swing axis laser device. Background Art

[0002] Large parts such as casings are important supporting and load-bearing parts of aircraft engines, and they require extremely high strength, rigidity and reliability. With the development of the aviation industry, aircraft engine casings are constantly developing in the direction of thin-walled, integrated and complex, and the manufacturing difficulty has been greatly increased.

[0003] Large aircraft engine components are reduced in weight by "engraving + milling". Laser processing has the advantages of a small heat-affected zone, processing is not limited by the mechanical properties of the material, there is no tool wear, and there is no processing stress during processing. It has been widely used in the processing of hard and brittle materials, difficult-to-process metals, and thin-walled parts. Laser engraving technology has become the main way to lightweight manufacturing of large thin-walled parts such as casing barrels, among which the double-swing axis laser processing head is its core component. For processing equipment, the double-swing axis refers to the two rotating axes at the processing head. Please refer to the Chinese invention patent "A multi-level anti-collision system for a double-swing axis laser processing head" with publication number CN109352192B. The double-swing axis usually includes an A-axis and a C-axis, which are arranged orthogonally to achieve multi-angle processing. For reflective double-swing axis laser equipment, the posture of its laser beam determines the spatial position positioning accuracy of the laser focus after the double-swing axis, which directly affects the processing accuracy of the parts to be processed.

[0004] like Figure 1 As shown, the reflective double-swing axis laser device includes a laser source 1, an optical four-dimensional adjustment system 2 installed on the optical path of the laser source 1, a double-swing axis installed at the action end of the optical four-dimensional adjustment system 2, and a focusing mirror 5 arranged at the exit end of the double-swing axis; the double-swing axis includes a C-axis 3 and an A-axis 4, the rotation directions of the C-axis 3 and the A-axis 4 are perpendicular to each other, the C-axis 3 is installed between the A-axis 4 and the optical four-dimensional adjustment system 2, when the C-axis 3 rotates, it drives the laser beam to swing in the XY plane of the coordinate system, and when the A-axis 4 rotates, it drives the laser beam to swing in the YZ plane of the coordinate system. The installation end face of the double-swing axis is highly parallel to the XY plane of the processing machine tool, and the laser beam enters the C-axis 3 and the A-axis 4 in turn through the optical four-dimensional adjustment system 2. The optical four-dimensional adjustment system 1 is provided with a first fine-tuning screw 6 and a second fine-tuning screw 9 and a corresponding translation mechanism, which are respectively used to adjust the angles of the internal reflector in the α direction and the β direction or the degrees of freedom in two directions in the XYZ space, so as to adjust the position and posture of the laser beam.

[0005] It can be seen that the direction of the laser beam is parallel to the rotation axis of the C-axis 3, and adjusting the C-axis is the key step in adjusting the laser beam direction in the device. However, in the prior art, for debugging the laser beam pointing accuracy of the reflective double-swing axis laser device, the double-swing axis needs to be disassembled, and the processing machine tool needs to be moved along the Z-axis for many times, and several millimeter spots are formed on the acrylic plate during each movement, and then the laser beam is made parallel to the Z-axis of the processing machine tool through the several millimeter spots, or it depends on instruments such as high-precision laser beam quality analyzers, resulting in high cost for adjusting the laser beam pointing, and the adjustment process is cumbersome, inefficient, and difficult to operate. Summary of the invention

[0006] In order to solve the technical problems of the existing laser beam posture debugging method being complicated, inefficient, difficult to operate and having high adjustment cost, the present invention provides a laser beam posture debugging method for a reflective dual-swing axis laser device.

[0007] The technical solution adopted by the present invention is:

[0008] A method for adjusting the laser beam posture of a reflective double-swing axis laser device, which is special in that it includes the following steps:

[0009] Step 1: Fix a positioning plate on the working platform of the processing machine tool so that the positioning plate is parallel to the working platform;

[0010] Step 2: Adjust the reflective double-swing axis laser equipment so that the processing laser focus emitted by its laser source is on the surface of the positioning plate, and the C axis is at zero position, so that the rotation axis of the A axis is parallel to the X axis of the processing machine tool's own coordinate system;

[0011] Step 3, start the reflective double-swing axis laser equipment to make the processing laser form an impact spot P0 on the positioning plate;

[0012] Step 4: an indicating laser source or an imaging component is arranged on one side of the processing laser and above the positioning plate, so that the indicating laser emitted by the laser or the marking point on the imaging surface indicates the impact spot P0 position on the positioning plate;

[0013] Step 5: Rotate the C axis 90°, 180°, and 270° in sequence. After each rotation, move the processing machine tool so that the indicating laser or the mark point on the imaging surface indicates the impact spot P0 position again. Then, the processing laser forms the impact spot P on the positioning plate respectively. 90 , P 180 , P 270 ;

[0014] Step 6: Get the impact spots P0 and P 180 The first connection line between the impact spot P 90 and P 270a second line between the first and second lines, obtaining the intersection I of the first and second lines, obtaining the distance Δd1 between the midpoint I1 of the first line and the intersection I, and obtaining the distance Δd2 between the midpoint I2 of the second line and the intersection I;

[0015] Step 7: Calculate the deflection angle between the processing laser and the C-axis rotation axis θ1≈tan -1 (Δd1 / f), and calculate the deflection angle θ2≈tan between the processing laser and the A-axis rotation axis -1 (Δd2 / f), where f is the focal length of the focusing mirror in the reflective dual-swing axis laser device;

[0016] Step 8: adjusting the position and posture of the processing laser based on the deflection angle θ1 and the deflection angle θ2;

[0017] Step 9, replace the positioning plate so that the replaced positioning plate is parallel to the work platform, repeat steps 3 to 8 until the midpoint I1 of the first connecting line and the midpoint I2 of the second connecting line reach a preset coincidence degree, and the laser beam posture debugging of the reflective double-swing axis laser equipment is completed.

[0018] Furthermore, step 8 specifically includes:

[0019] 8.1) Obtaining the corresponding adjustment angles A1 and A2 of the processing laser when the first fine-tuning screw and the second fine-tuning screw in the reflective double-swing axis laser device rotate one circle respectively;

[0020] 8.2) Calculate the number of turns n1 = θ1 / A1 of the first fine-tuning screw and the number of turns n2 = θ2 / A2 of the second fine-tuning screw;

[0021] 8.3) Rotate the first fine-tuning screw n1 turns and the second fine-tuning screw n2 turns to adjust the position of the processing laser.

[0022] Furthermore, step 6 is specifically as follows:

[0023] The camera captures the impact spots P0, P 90 , P 180 , P 270 The impact spots P0 and P in the image are obtained by a microscope measurement system. 90 , P 180 , P 270 The impact spots P0 and P 180 The first connection line between the impact spot P 90 and P 270 A second line between the first and second lines is obtained, the intersection I of the first and second lines is obtained, and then the distance Δd1 between the midpoint I1 of the first line and the intersection I is obtained, and the distance Δd2 between the midpoint I2 of the second line and the intersection I is obtained.

[0024] Furthermore, after step 2 and before step 3, the step of adjusting the laser parameters is also included:

[0025] The output power of the laser source is adjusted so that the processing laser outputted by the laser source forms an impact spot of minimum size on the positioning plate.

[0026] Furthermore, in step 3 and step 5, impact spots P0 and P 90 , P 180 , P 270 The laser source is turned on for 0.5 seconds.

[0027] Furthermore, the positioning plate is made of anodized black aluminum plate.

[0028] Furthermore, in step 4:

[0029] When setting the indicating laser source, the diameter of the light spot formed by the indicating laser emitted by the indicating laser source on the positioning plate is ≤0.5mm.

[0030] Beneficial effects of the present invention:

[0031] 1. The present invention provides a method for debugging the laser beam posture of a reflective double-swing axis laser device. It only needs to add an indicating laser source or an imaging component to the hardware. By rotating the C-axis of the double-swing axis four times and forming impact spots on the positioning plate respectively, the relative positions of the impact spots are observed, the inclination direction of the processing laser is judged, and the fine-tuning screw of the reflective double-swing axis laser device is adjusted to complete the debugging. The method is easy to operate, does not need to disassemble the double-swing axis, and does not need to modify the existing laser processing device. It greatly improves the adjustment efficiency, saves time cost, and is suitable for a variety of laser processing devices.

[0032] 2. The present invention obtains the relative position relationship between the four impact spots, and the angle between the processing laser pointing and the C-axis and A-axis rotation axes of the double pendulum shaft can be obtained from the relative position relationship, thereby obtaining an accurate adjustment parameter basis, and can accurately adjust the direction of the processing laser. The adjustment process is quick and simpler.

[0033] 3. The present invention adjusts the output power of the laser source so that the processing laser output forms an impact spot of the smallest size on the positioning plate, reduces the errors in calculating the deflection angles θ1 and θ2, improves the adjustment accuracy each time, and makes the adjustment more efficient and faster.

[0034] 4. The present invention uses a camera to obtain the impact spots P0, P 90 , P 180 , P 270 The image of the positioning plate is taken, and the impact spots P0 and P in the image are obtained by the microscope measurement system. 90 , P 180 , P270 The location is simple and efficient. The location accuracy is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the structure of a laser processing device in the form of a double swing axis structure;

[0036] Figure 2 It is a structural schematic diagram of a laser beam posture debugging method of a reflective double-swing axis laser device in the process of implementing the present invention;

[0037] Figure 3 Schematic diagram of the structure of forming four spots on the positioning plate in an embodiment of the present invention.

[0038] Figure Number:

[0039] 1-laser source, 11-processing laser, 2-optical four-dimensional adjustment system, 3-C axis, 4-A axis, 5-focusing mirror, 6-first fine-tuning screw, 7-indicating laser source, 71-indicating laser, 8-positioning plate, 9-second fine-tuning screw, 10-imaging component, 101-marking point on the imaging surface. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] This embodiment provides a method for adjusting the laser beam posture of a reflective dual-swing axis laser device, such as Figure 2 As shown, the following steps are included:

[0042] Step 1: A positioning plate 8 is fixedly arranged on the working platform of the processing machine tool so that the positioning plate 8 is parallel to the working platform; the positioning plate 8 is made of anodized black aluminum plate.

[0043] Step 2, adjust the reflective double-swing axis laser equipment so that the focus of the processing laser 11 emitted by the laser source 1 is on the surface of the positioning plate 8, and the C axis 3 is at zero position, so that the rotation axis of the A axis 4 is parallel to the X axis of the processing machine tool's own coordinate system;

[0044] Step 3: Start the reflective double-swing axis laser equipment to make the processing laser 11 form an impact spot P0 on the positioning plate 8, forming impact spots P0 and P 90 , P 180 , P 270 When , laser source 1 is turned on for 0.5 seconds.

[0045] In other embodiments, the laser parameters may also be adjusted at this time:

[0046] The output power of the laser source 1 is adjusted so that the processing laser 11 outputted therefrom forms a minimum-sized and clear impact spot on the positioning plate 8 .

[0047] Step 4: Set an indication laser source 7 or an imaging component 10 on one side of the processing laser 11 and above the positioning plate 8, so that the indication laser 71 emitted by it or the mark point 101 on the imaging surface indicates the impact spot P0 position; when setting the indication laser source 7, the spot diameter formed by the indication laser 71 emitted by the indication laser source 7 on the positioning plate 8 is ≤0.5mm.

[0048] Step 5: Figure 3 As shown, the C axis is rotated 390°, 180°, and 270° in sequence, and after each rotation, the processing machine tool is moved so that the indicating laser 71 or the mark point 101 on the imaging surface indicates the impact spot P0 position again, and then the processing laser 11 forms the impact spot P0 on the positioning plate 8 respectively. 90 , P 180 , P 270 ; forming impact spots P0, P 90 , P 180 , P 270 When , laser source 1 is turned on for 0.5 seconds.

[0049] Step 6: Use the camera to obtain the impact spots P0 and P 90 , P 180 , P 270 The image of the positioning plate 8 is obtained by the microscope measurement system. The impact spots P0 and P 90 , P 180 , P 270 The impact spots P0 and P 180 The first connection line between the impact spot P 90 and P 270 A second line between the first and second lines is obtained, the intersection I of the first and second lines is obtained, and then the distance Δd1 between the midpoint I1 of the first line and the intersection I is obtained, and the distance Δd2 between the midpoint I2 of the second line and the intersection I is obtained.

[0050] Step 7: Calculate the deflection angle θ1≈tan between the processing laser 11 and the rotation axis of the C-axis 3 -1 Δd1 / f=0.15°, and calculate the deflection angle θ2≈tan between the processing laser 11 and the rotation axis of the A-axis 4 -1 Δd2 / f=0.23°, where f is the focal length of the focusing mirror 5 in the reflective double-swing axis laser device, and in this embodiment, f=190.5 mm;

[0051] Step 8: adjusting the position of the processing laser 11 based on the deflection angle θ1 and the deflection angle θ2; specifically including:

[0052] 8.1. Obtain the corresponding adjustment angles A1=0.28° and A2=0.28° of the processing laser 11 when the first fine-tuning screw 6 and the second fine-tuning screw 9 in the reflective double-swing-axis laser device rotate one circle respectively;

[0053] 8.2. Calculate the number of turns n1 = θ1 / A1 of the first fine-tuning screw 6 and the number of turns n2 = θ2 / A2 of the second fine-tuning screw 9. In this embodiment, n1 = 0.54 turns and n2 = 0.82 turns are calculated.

[0054] 8.3. Rotate the first fine-tuning screw 0.54 turns and the second fine-tuning screw 0.82 turns to adjust the position of the processing laser 11.

[0055] Step 9, replace the positioning plate 8, make the replaced positioning plate 8 parallel to the working platform, repeat steps 3 to 8 until the midpoint I1 of the first connecting line and the midpoint I2 of the second connecting line reach the preset coincidence degree, then the posture adjustment of the processing laser is completed, and the laser beam posture debugging of the reflective double-swing axis laser equipment is completed.

[0056] Finally, the first fine-tuning screw and the second fine-tuning screw are fixed by thread fastening glue to prevent them from rotating, and then the processing operation is performed.

[0057] The method provided in this embodiment forms an impact spot on the positioning plate 8 by rotating the double pendulum axis C axis 390°, 180°, and 270° for multiple times, indicating the laser source 7 or the imaging component as the adjustment reference, and obtains the adjustment number of the first fine-tuning screw 6 and the second fine-tuning screw 9 by measuring the positional relationship and the deflection angle θ1 and the deflection angle θ2 of the formed spots, thereby adjusting the direction of the processing laser 11. In addition, by using the above method to measure the offset of the laser impact spot with the help of a microscope measurement system, the position and posture of the processing laser can be calibrated more accurately, so as to achieve the purpose of making the processing laser parallel to the rotary axis of the double pendulum axis C axis. Therefore, the method of the present invention is quick and simple, has high precision, and is economical, and is convenient for adjusting the laser beam position and posture of a double pendulum axis laser processing machine tool.

[0058] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for adjusting the laser beam posture of a reflective double-swing-axis laser device, characterized in that: The following steps are involved: Step 1, a positioning plate (8) is fixedly arranged on the working platform of the processing machine tool so that the positioning plate (8) is parallel to the working platform; Step 2, adjusting the reflective double-swing-axis laser device so that the focus of the processing laser (11) emitted by the laser source (1) is on the surface of the positioning plate (8), and the C-axis (3) is at zero position, so that the rotation axis of the A-axis (4) is parallel to the X-axis of the processing machine tool's own coordinate system; Step 3, starting the reflective double-swing axis laser equipment, so that the processing laser (11) forms an impact spot P0 on the positioning plate (8); Step 4: an indicating laser source (7) or an imaging component (10) is arranged on one side of the processing laser (11) and above the positioning plate (8), so that the indicating laser (71) emitted by the indicating laser source (71) or the marking point (101) on the imaging surface indicates the position of the impact spot P0 on the positioning plate (8); Step 5: Rotate the C axis (3) 90°, 180°, and 270° in sequence, and after each rotation, move the processing machine tool so that the indicating laser (71) or the marking point (101) on the imaging surface indicates the impact spot P0 position again, and then the processing laser (11) forms the impact spot P0 on the positioning plate (8) respectively. 90 , P 180 , P 270 ; Step 6: Get the impact spots P0 and P 180 The first connection line between the impact spot P 90 and P 270 a second line between the first and second lines, obtaining the intersection I of the first and second lines, obtaining the distance Δd1 between the midpoint I1 of the first line and the intersection I, and obtaining the distance Δd2 between the midpoint I2 of the second line and the intersection I; Step 7: Calculate the deflection angle θ1≈tan between the processing laser (11) and the rotation axis of the C axis (3) -1 (Δd1 / f), and calculate the deflection angle θ2≈tan between the processing laser (11) and the rotation axis of the A axis (4) -1 (Δd2 / f), where f is the focal length of the focusing mirror (5) in the reflective double-swing axis laser device; Step 8, adjusting the position of the processing laser (11) based on the deflection angle θ1 and the deflection angle θ2; Step 9, replace the positioning plate (8) so that the replaced positioning plate (8) is parallel to the working platform, and repeat steps 3 to 8 until the midpoint I1 of the first connecting line and the midpoint I2 of the second connecting line reach a preset coincidence degree, thereby completing the laser beam posture debugging of the reflective double-swing axis laser equipment.

2. The laser beam posture adjustment method of the reflective dual-swing axis laser device according to claim 1 is characterized in that: Step 8 specifically includes: 8.1) Obtaining the corresponding adjustment angles A1 and A2 of the processing laser (11) when the first fine-tuning screw (6) and the second fine-tuning screw (9) in the reflective double-swing axis laser device rotate one circle respectively; 8.2) Calculate the number of turns n1 = θ1 / A1 of the first fine-tuning screw (6) and the number of turns n2 = θ2 / A2 of the second fine-tuning screw (9); 8.3) Rotate the first fine-tuning screw (6) n1 turns, and rotate the second fine-tuning screw (9) n2 turns, so as to adjust the position of the processing laser (11).

3. The laser beam posture adjustment method of the reflective double-swing axis laser device according to claim 1 or 2, characterized in that: Step 6 is as follows: The camera captures the impact spots P0, P 90 , P 180 , P 270 The positioning plate (8) is pictured; the impact spots P0, P in the picture are obtained by a microscope measurement system. 90 , P 180 , P 270 The impact spots P0 and P 180 The first connection line between the impact spot P 90 and P 270 A second line between the first and second lines is obtained, the intersection I of the first and second lines is obtained, and then the distance Δd1 between the midpoint I1 of the first line and the intersection I is obtained, and the distance Δd2 between the midpoint I2 of the second line and the intersection I is obtained.

4. The laser beam posture adjustment method of the reflective dual-swing axis laser device according to claim 3 is characterized in that: After step 2 and before step 3, the following steps are also included to adjust the laser parameters: The output power of the laser source (1) is adjusted so that the processing laser (11) outputted therefrom forms an impact spot of minimum size on the positioning plate (8).

5. The laser beam posture adjustment method of the reflective dual-swing axis laser device according to claim 4, characterized in that: In step 3 and step 5, impact spots P0 and P 90 , P 180 , P 270 When the laser source (1) is turned on for 0.5 seconds.

6. The laser beam posture adjustment method of the reflective dual-swing axis laser device according to claim 5, characterized in that: The positioning plate (8) is made of anodized black aluminum plate.

7. The laser beam posture adjustment method of the reflective dual-swing axis laser device according to claim 6, characterized in that: In step 4: When the indicating laser source (7) is provided, the diameter of the light spot formed by the indicating laser (71) emitted by the indicating laser source (7) on the positioning plate (8) is ≤0.5 mm.

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