Integrated circuit chip composite suction device

Abstract

The invention discloses an integrated circuit chip composite suction device, and relates to the field of robot tool clamp application, the integrated circuit chip composite suction device comprises a connecting plate, the bottom of the connecting plate is provided with a first tool clamp and a second tool clamp by arranging a telescopic cylinder, and the first tool clamp is provided with a plurality of groups of first suckers and second suckers; the second tool clamp is provided with a plurality of sets of small third suction cups in a staggered mode and is suitable for adsorbing and clamping small-size chips and large-size chips within a certain range, and the second tool clamp is provided with a plurality of sets of small third suction cups in a staggered mode and is suitable for adsorbing small-size chips within a certain range. The first tool clamp and the second tool clamp can clamp and absorb volume chips and large-volume chips within a certain range, the first tool clamp can absorb the chips through the negative pressure suction cup and can also clamp the chips, the second tool clamp can absorb micro chips within a certain range, and the third suction cup arranged in a staggered mode can clamp the chips within a certain range. And the size of the adsorbed microchip can be increased on the same tool with small volume.

Description

Technical Field

[0001] The invention relates to the application field of robot fixtures, and in particular to an integrated circuit chip composite suction device. Background Art

[0002] An integrated circuit chip is a tiny electronic component, also known as a microcircuit, microchip, or integrated circuit. It refers to a silicon wafer containing an integrated circuit. It is small in size and is often part of a computer or other electronic device. It is a square block object with many small pins that we can see with our naked eyes or that cannot be seen by the pins.

[0003] Integrated circuit chips are usually installed on circuit boards for use. Circuit boards are the support bodies of electronic components and are used to electrically connect a variety of electronic components. Chip manufacturing is a complex process, which generally includes chip design, mask production, semiconductor manufacturing, packaging and testing, and finished product manufacturing. The batch manufacturing of chips goes from design to the final product, and there are multiple process steps such as cleaning, testing, deposition, and corrosion in the middle. Between different processing steps, a three-axis linkage mechanism is usually used to control the corresponding tooling and fixture to transfer each chip to a special pallet, and then the pallet is used for transportation throughout the entire manufacturing process. The design of the pallet can not only transport the chip, but also has a good protective effect on the chip.

[0004] Chips with the same functional model also have different specifications and sizes, mainly because different devices have different power and energy consumption. Large chips have better heat dissipation effect than small chips. For example, the chips in mobile phones are small and usually only the size of a fingernail, while large cloud computers need to use large and powerful chips due to power consumption issues. Therefore, when manufacturing chips, companies not only need to research and develop different types of chips, but also customize the size of the same type of chips according to different devices used. Chips often come in a variety of sizes, from large to small to some tiny chips. In order to meet the effective transfer of chips between different processing steps, chips of different specifications usually require targeted design of matching tooling and fixtures, which not only increases the investment in equipment costs, but also the management and storage of a large number of tooling and fixtures is quite cumbersome. The frequent replacement of tooling and fixtures is also time-consuming and labor-intensive, reducing the production efficiency of integrated circuit chips. Summary of the invention

[0005] Based on this, the object of the present invention is to provide an integrated circuit chip composite suction device to solve the technical problems mentioned in the above background.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an integrated circuit chip composite suction device, comprising a connecting plate, a first fixture and a second fixture are installed on the bottom of the connecting plate by arranging a telescopic cylinder, and the first fixture comprises a first mounting frame, the first mounting frame is internally rotatably connected with a forward and reverse screw rod, and one end of the forward and reverse screw rod is connected with a first driving device, and the external threads of the forward and reverse screw rod are connected with two groups of first movable plates, the bottoms of the two groups of the first movable plates are both installed with a first suction cup, and the sides of the two groups of the first suction cups are symmetrically installed with clamping plates, a fixed plate is installed inside the first mounting frame, and the internal rotation of the fixed plate is connected with a first threaded rod, and the first threaded rod and the forward and reverse screw rod are transmission connected by arranging a bevel gear group, the external threads of the first threaded rod are connected with the second movable plate, and the bottom of the second movable plate is installed with a second suction cup.

[0007] By adopting the above technical solution, the first tooling fixture can be set to absorb integrated circuit chips of different sizes. When the first suction cup and the second suction cup are at the same level, the six groups of suction cups work simultaneously to absorb larger chips. When the first suction cup expands to both sides and drives the second suction cup to descend, it can absorb a small chip that only requires two groups of suction cups to absorb. When the first suction cup shrinks and approaches the middle, it will drive the second suction cup to rise, and then the distance between the first suction cups can be adjusted, so that the first suction cup can absorb chips of any specifications between large chips and small chips. At the same time, the clamp installed on the side of the first suction cup is flush with the height of the suction cup. In the process of the first suction driving the clamp to shrink, the first tooling fixture can be driven by the three-axis linkage mechanism to clamp some chips that are not easy to absorb, such as chips in steps such as cleaning and etching. Suction cup adsorption will cause the suction cup to be contaminated. The first tooling fixture can be compatible with processing large chips and small chips, as well as chips of any specifications between large chips and small chips, thereby reducing the problem of frequent replacement of tooling fixtures during use, saving manpower and material resources, and improving production efficiency.

[0008] The present invention is further configured such that a limiting groove is provided inside the first mounting frame, and a first guide rod is installed inside the first mounting frame, a sliding block matching the limiting groove is provided outside the first movable plate, and the second movable plate movably passes through the outside of the first guide rod.

[0009] By adopting the above technical solution and providing the limiting groove and the first guide rod, the first movable plate and the second movable plate can be limited when moving.

[0010] The present invention is further configured such that two groups of forward and reverse screw rods are symmetrically arranged inside the first mounting frame, and the two groups of forward and reverse screw rods are connected by a pulley transmission, and the outside of one group of forward and reverse screw rods is connected to the first driving device.

[0011] By adopting the above technical solution and symmetrically arranging two groups of positive and negative screw rods, multiple groups of first suction cups and second suction cups can be arranged, thereby improving the adsorption capacity of the first fixture for the chip.

[0012] The present invention is further configured such that the second tooling fixture includes a second mounting frame, and an equidistant transformation module is installed inside the second mounting frame, and the second mounting frame is internally rotatably connected to a limit rod, a plurality of telescopic components are movably installed outside the limit rod, and a third suction cup is installed at the bottom of the plurality of telescopic components, and the limit rod is connected to a third driving device.

[0013] By adopting the above technical solution, some tiny integrated circuit chips can be adsorbed by setting up the second tooling fixture, and the spacing between multiple groups of third suction cups can be adjusted by setting up the equidistant transformation module. As the spacing between multiple groups of third suction cups expands from the smallest to the largest, tiny chips of different sizes within a certain range can be adsorbed. Multiple groups of third suction cups can be alternately set up using cams to further increase the size of microchips adsorbed by the second tooling fixture.

[0014] The present invention is further configured as follows: the equidistant transformation module includes two groups of second guide rods installed inside the second mounting frame, and the second mounting frame is rotatably connected to the inside of the second threaded rod, and the second threaded rod is connected to a second driving device, the second guide rod is movably installed with a first moving block outside, and the second guide rod is movably installed with multiple groups of second moving blocks outside, the first moving block and the second threaded rod are threadedly connected, and the second threaded rod movably passes through multiple groups of second moving blocks, a movable link assembly is installed on the top of the first moving block and the multiple groups of second moving blocks, and one end of the movable link assembly is rotatably connected to the first moving block, and the other end of the movable link assembly is rotatably connected to the second mounting frame.

[0015] By adopting the above technical solution, the distance between each group of telescopic components can be adjusted by setting an equidistant transformation module, thereby achieving the purpose of adjusting the distance between the third suction cups.

[0016] The present invention is further configured such that the telescopic assembly includes a sliding sleeve movably mounted on the outside of the limiting rod, and the outside of the sleeve is rotatably connected to the sleeve, and a cam is installed on the outside of the sliding sleeve, a fixed rod is movably mounted inside the sleeve, and an outer convex ring is installed on the outside of the fixed rod, and the outer sleeve of the fixed rod is provided with a spring.

[0017] By adopting the above technical solution, the third suction cup can be pushed to adjust its height by setting the telescopic component.

[0018] The present invention is further configured such that a hole groove matching the limiting rod is provided inside the sliding sleeve, the sliding sleeve can slide outside the limiting rod, and the limiting rod can drive the sliding sleeve to rotate.

[0019] By adopting the above technical solution and opening a hole groove in the sliding sleeve, the sliding sleeve can slide outside the limiting rod, and the limiting rod can drive the sliding sleeve to rotate.

[0020] The present invention is further configured such that a plurality of groups of the sleeves are respectively fixedly connected to the first moving block and the second moving block, and a plurality of groups of the third suction cups are respectively installed at the bottom of the fixing rod.

[0021] By adopting the above technical solution, by arranging multiple sets of sleeves and corresponding fixed connections with the first moving block and the second moving block, the equidistant transformation module can adjust the spacing of the telescopic components when working.

[0022] The present invention is further configured such that the plurality of groups of cams are staggered to be horizontally and vertically distributed, and two adjacent groups of cams are arranged in a perpendicular state to each other.

[0023] By adopting the above technical solution, multiple groups of cams are arranged in a staggered manner, and two adjacent groups of cams are perpendicular to each other, so that the rotation of the limit rod can drive multiple groups of third suction cups to rise and fall alternately.

[0024] In summary, the present invention mainly has the following beneficial effects: The present invention can absorb integrated circuit chips of different sizes by setting a first tooling fixture. When the first suction cup and the second suction cup are at the same level, the six groups of suction cups work simultaneously to absorb chips with larger specifications. When the first suction cup expands to both sides and drives the second suction cup to descend, it can absorb a small-specification chip that only requires two groups of suction cups to absorb. When the first suction cup shrinks and approaches the middle, it will drive the second suction cup to rise, and then the distance between the first suction cups can be adjusted, so that the first suction cup can absorb chips of any specifications between large chips and small chips. At the same time, the clamp installed on the side of the first suction cup is flush with the height of the suction cup. In the process of the clamp driven by the first suction to shrink, the first tooling fixture can be driven by the three-axis linkage mechanism to clamp some chips that are not convenient for absorption, such as chips in steps such as cleaning and etching. Suction cup absorption will cause the suction cup to be contaminated. The first tooling fixture can be compatible with processing large chips and small chips, as well as chips of any specifications between large chips and small chips, thereby reducing the problem of frequent replacement of tooling fixtures during use, saving manpower and material resources, and improving production efficiency.

[0025] The present invention can adsorb some tiny integrated circuit chips by setting up a second tooling fixture, and can adjust the spacing between multiple groups of third suction cups by setting up an equidistant transformation module. As the spacing between multiple groups of third suction cups expands from the smallest to the largest, tiny chips of different sizes within a certain range can be adsorbed. Multiple groups of third suction cups can be alternately arranged using cams to further increase the size of microchips adsorbed by the second tooling fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the structure of the first fixture of the present invention; Figure 3 It is a schematic diagram of the connection between the first mounting frame, the positive and negative screw rods and the first threaded rod of the present invention; Figure 4 For the present invention Figure 3 A magnified image; Figure 5 It is a schematic diagram of the limiting groove structure of the present invention; Figure 6 It is a schematic diagram of the internal structure of the first fixture of the present invention; Figure 7 It is a schematic diagram of the structure of the second fixture of the present invention; Figure 8 It is a schematic diagram of the connection between the second mounting frame, the second guide rod and the second threaded rod of the present invention; Fig. 9 It is a schematic diagram of the connection between the first moving block, the second moving block and the movable link assembly of the present invention; Fig.10 It is a schematic diagram of the connection between the limit rod, the telescopic assembly and the third suction cup of the present invention; Fig.11 It is a schematic diagram of the internal structure of the telescopic assembly of the present invention; Fig.12 It is a schematic diagram of the connection between the sliding sleeve, the cam and the hole groove of the present invention; Fig.13 This is a schematic diagram of the structure of the second fixture of the present invention for alternately adsorbing large and small chips; Fig.14 This is a schematic diagram of the structure of the second fixture of the present invention for alternately adsorbing smaller and tiny chips.

[0027] In the figure: 1, connecting plate; 2, first fixture; 3, second fixture; 4, first driving device; 5, second driving device; 6, third driving device; 201, first mounting frame; 202, positive and negative screw rods; 203, first movable plate; 204, first suction cup; 205, clamping plate; 206, limiting groove; 207, fixing plate; 208, first threaded rod; 209, bevel gear set; 210, second movable plate; 211, second suction cup; 212, first guide rod; 31, second mounting frame; 32, equidistant transformation module; 33, limiting rod; 34, telescopic Assembly; 35, third suction cup; 321, second guide rod; 322, first moving block; 323, second moving block; 324, second threaded rod; 325, movable connecting rod assembly; 341, sliding sleeve; 342, sleeve; 343, cam; 344, fixed rod; 345, outer convex ring; 346, spring; 347, hole groove; 351, third suction cup one; 352, third suction cup two; 353, third suction cup three; 354, third suction cup four; 355, third suction cup five; 356, third suction cup six; 357, third suction cup seven; 358, third suction cup eight. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] The following describes an embodiment of the present invention based on its overall structure.

[0030] An integrated circuit chip composite suction device, such as Figure 1-14As shown, it includes a connecting plate 1, and the bottom of the connecting plate 1 is installed with a first fixture 2 and a second fixture 3 by setting a telescopic cylinder. The first fixture 2 is provided with multiple groups of first suction cups 204 and second suction cups 211, which are suitable for adsorbing and clamping small-volume chips and large-volume chips within a certain range. The second fixture 3 is staggered with multiple groups of small third suction cups 35, which are suitable for adsorbing tiny chips within a certain range. The first fixture 2 includes a first mounting frame 201, and the first mounting frame 201 is internally rotatably connected with a forward and reverse screw rod 202, and one end of the forward and reverse screw rod 202 is connected with a first driving device 4, the first driving device 4 can drive the forward and reverse screw rod 202 to rotate, and the external threads of the forward and reverse screw rod 202 are connected with two groups of first movable plates 203. When the forward and reverse screw rod 202 rotates, it will cause the two groups of first movable plates 203 to approach or move away from each other, and the bottoms of the two groups of first movable plates 203 are both installed with first suction cups 2 04, and the sides of the two groups of first suction cups 204 are symmetrically installed with clamping plates 205. When the two groups of first movable plates 203 approach each other or move away from each other, the first suction cups 204 can be driven to approach each other or move away from each other, thereby driving the clamping plates 205 to clamp the chip. A fixed plate 207 is installed inside the first mounting frame 201, and the internal rotation of the fixed plate 207 is connected to the first threaded rod 208, and the first threaded rod 208 and the forward and reverse screw rod 202 are connected by a bevel gear set 209. When the forward and reverse screw rod 202 rotates, the bevel gear set 209 will be driven to work and then drive the first threaded rod 208 to rotate. The external thread of the first threaded rod 208 is connected to the second movable plate 210, and the second suction cup 211 is installed at the bottom of the second movable plate 210. The first threaded rod 208 rotates, and the second movable plate 210 can be raised and lowered on the outside of the first guide rod 212 by the screw principle, thereby adjusting the height of the second suction cup 211.

[0031] See also Figure 4 and Figure 5 A limiting groove 206 is provided inside the first mounting frame 201, and a first guide rod 212 is installed inside the first mounting frame 201. A slider matching the limiting groove 206 is provided outside the first movable plate 203. The second movable plate 210 is movable through the outside of the first guide rod 212. By providing the limiting groove 206 and the first guide rod 212, the first movable plate 203 and the second movable plate 210 can be limited when moving.

[0032] See also Figure 3 and Figure 6Two groups of forward and reverse screw rods 202 are symmetrically arranged inside the first mounting frame 201, and the two groups of forward and reverse screw rods 202 are connected by a pulley transmission, and the outside of one group of forward and reverse screw rods 202 is connected to the first driving device 4. By symmetrically arranging the two groups of forward and reverse screw rods 202, multiple groups of first suction cups 204 and second suction cups 211 can be arranged, thereby improving the adsorption capacity of the first fixture 2 to the chip.

[0033] See also Figure 7 The second fixture 3 includes a second mounting frame 31, and an equidistant transformation module 32 is installed inside the second mounting frame 31, and the second mounting frame 31 is internally rotatably connected to a limit rod 33, and multiple sets of telescopic components 34 are movably installed outside the limit rod 33, and the bottoms of the multiple sets of telescopic components 34 are all installed with third suction cups 35, and the limit rod 33 is connected to a third driving device 6. By setting the second fixture 3, some tiny integrated circuit chips can be adsorbed, and by setting the equidistant transformation module 32, the spacing of the multiple sets of third suction cups 35 can be adjusted. As the spacing of the multiple sets of third suction cups 35 expands from the minimum to the maximum, tiny chips of different sizes within a certain range can be adsorbed, and the multiple sets of third suction cups 35 are alternately set using the cam 343 to further increase the size of the microchip adsorbed by the second fixture 3.

[0034] See also Figure 8 and Fig. 9 The equidistant transformation module 32 includes two groups of second guide rods 321 installed inside the second mounting frame 31, and the second mounting frame 31 is rotatably connected with the second threaded rod 324 inside, and the second threaded rod 324 is connected to the second driving device 5, the first moving block 322 is movably installed outside the second guide rod 321, and multiple groups of second moving blocks 323 are movably installed outside the second guide rod 321, the first moving block 322 and the second threaded rod 324 are threadedly connected, and the second threaded rod 324 movably penetrates the multiple groups of second moving blocks 323, and a movable connecting rod assembly 325 is installed on the top of the first moving block 322 and the multiple groups of second moving blocks 323, and one end of the movable connecting rod assembly 325 is rotatably connected to the first moving block 322, and the other end of the movable connecting rod assembly 325 is rotatably connected to the second mounting frame 31, and the distance between each group of telescopic assemblies 34 can be adjusted by setting the equidistant transformation module 32, so as to achieve the purpose of adjusting the spacing between the third suction cups 35.

[0035] See also Fig.10 and Fig.11The telescopic component 34 includes a sliding sleeve 341 movably mounted on the outside of the limiting rod 33, and the outside of the sleeve 342 is rotatably connected to the sleeve 342, and a cam 343 is installed on the outside of the sliding sleeve 341, a fixed rod 344 is movably installed inside the sleeve 342, and an outer convex ring 345 is installed on the outside of the fixed rod 344, and a spring 346 is provided on the outer sleeve of the fixed rod 344. By setting the telescopic component 34, the third suction cup 35 can be pushed to adjust its height.

[0036] See also Fig.12 The sliding sleeve 341 has a hole groove 347 inside that matches the limiting rod 33. The sliding sleeve 341 can slide outside the limiting rod 33, and the limiting rod 33 can drive the sliding sleeve 341 to rotate. By providing the hole groove 347 in the sliding sleeve 341, the sliding sleeve 341 can slide outside the limiting rod 33, and the limiting rod 33 can drive the sliding sleeve 341 to rotate.

[0037] See also Figure 7 , multiple groups of sleeves 342 are respectively fixedly connected to the first moving block 322 and the second moving block 323, and multiple groups of third suction cups 35 are respectively installed at the bottom of the fixed rod 344. By setting multiple groups of sleeves 342 and the first moving block 322 and the second moving block 323 to be fixedly connected respectively, the equidistant transformation module 32 can adjust the spacing of the telescopic components 34 when working.

[0038] See also Fig.13 and Fig.14 The multiple groups of cams 343 are staggered in horizontal and vertical distribution, and the two adjacent groups of cams 343 are perpendicular to each other. By arranging the multiple groups of cams 343 in a staggered manner and the two adjacent groups of cams 343 are arranged in a perpendicular state to each other, the rotation of the limit rod 33 can drive the multiple groups of third suction cups 35 to alternately rise and fall.

[0039] The working principle of the present invention is: when using the first fixture 2, start the telescopic cylinder on the top of the first fixture 2 to push it down, and keep the telescopic cylinder on the top of the second fixture 3 in a contracted state. When it is necessary to adsorb a large chip, keep the first suction cup 204 and the second suction cup 211 at the same level. The large chip is heavier. Starting multiple groups of first suction cups 204 and second suction cups 211 at the same time to perform adsorption can improve the stability of the chip transfer process.

[0040] When it is necessary to adsorb a chip of medium specification, the first driving device 4 drives the forward and reverse screw rods 202 to rotate, and the two groups of forward and reverse screw rods 202 are mutually transmitted by the pulley assembly. By utilizing the screw principle, the first movable plates 203 located at both ends of the forward and reverse screw rods 202 slide in the limiting grooves 206 and approach each other, thereby driving the first suction cups 204 installed at the bottom thereof to approach each other. In the process of multiple groups of first suction cups 204 approaching each other, the rotation of the forward and reverse screw rods 202 will drive the first threaded rod 208 to rotate through the bevel gear set 209, and then the second movable plate 210 threadedly connected with the first threaded rod 208 will move along the first movable plate 210. When a guide rod 212 rises, it will also drive the second suction cup 211 to rise, and then start multiple groups of first suction cups 204 to adsorb medium-sized chips, and the distance between multiple groups of first suction cups 204 can be continuously reduced, so that medium-sized chips within a certain range can be adsorbed, and the clamping plate 205 on the side of the first suction cup 204 is flush with the height of the first suction cup 204, and then when the first suction cup 204 drives the clamping plate 205 to contract, the clamping plate 205 can be used to clamp chips that are not convenient for adsorption, such as chips in the process of cleaning, etching and other steps. Suction cup adsorption will cause the suction cup to be contaminated.

[0041] When it is necessary to adsorb small-sized chips, the first movable plate 203 is adjusted to drive the first suction cup 204 to expand to the same level as the second suction cup 211, and then the first suction cup 204 is allowed to continue to expand. According to the above, the second movable plate 210 will be lowered along the first guide rod 212, and then the height of the second suction cup 211 will be lower than the first suction cup 204, so that the second suction cup 211 can be started to adsorb small-sized chips.

[0042] When it is necessary to perform batch adsorption and transfer work on tiny chips, the telescopic cylinder on the top of the second fixture 3 is started to push it down, and the telescopic cylinder on the top of the first fixture 2 is kept in a retracted state. For example, the third suction cup 35 is provided with 8 groups, namely, the third suction cup 1 351, the third suction cup 2 352, the third suction cup 3 353, the third suction cup 4 354, the third suction cup 5 355, the third suction cup 6 356, the third suction cup 7 357, and the third suction cup 8 358.

[0043] The second driving device 5 is started to drive the second threaded rod 324 to rotate. The second threaded rod 324 is threadedly connected to the first moving block 322, thereby driving the first moving block 322 to slide on the outside of the second guide rod 321, and the multiple groups of second moving blocks 323 are pulled by the movable connecting rod assembly 325 to change their positions equidistantly, so that the multiple groups of sliding sleeves 341 slide on the outside of the limiting rod 33, thereby adjusting the telescopic assembly 34 and the third suction cup 35 to a suitable spacing, controlling the telescopic cylinder on the top of the second fixture 3 to extend a certain distance to push the second fixture 3 down, thereby allowing the third suction cup 2 352, the third suction cup 4 354, the third suction cup 6 356, and the third suction cup 8 358 to absorb the tiny chip respectively, and then starting the third The driving device 6 drives the limiting rod 33 to rotate 90°, and then drives the cam 343 to rotate 90°, so that the third suction cup 2 352, the third suction cup 4 354, the third suction cup 6 356, and the third suction cup 8 358, whose tops are connected to the fixing rod 344, rise under the resetting action of the spring 346, while the third suction cup 1 351, the third suction cup 353, the third suction cup 5 355, and the third suction cup 7 357, whose tops are connected to the fixing rod 344, are compressed and descended by the cam 343, that is, the third suction cup 1 351, the third suction cup 353, the third suction cup 5 355, and the third suction cup 7 357 are caused to exchange positions with the third suction cup 2 352, the third suction cup 4 354, the third suction cup 6 356, and the third suction cup 8 358.

[0044] Then, the third suction cup 1 351, the third suction cup 353, the third suction cup 5 355, and the third suction cup 7 357 are used to adsorb the tiny chip. In the prior art, multiple groups of third suction cups 35 are usually independently provided with telescopic cylinders for height adjustment, which not only has high initial equipment cost, but also has higher cost for repair of tooling damage in the later stage. A group of telescopic cylinders is provided on the top of the second tooling fixture 3 to push the overall second tooling fixture 3 for height adjustment, and multiple groups of third suction cups 35 in the second tooling fixture 3 are alternately provided with cams 343, so that the third suction cup 1 351, the third suction cup 353, the third suction cup 5 355, and the third suction cup 7 357 can be adjusted to a desired height. The suction cup three 353, the third suction cup five 355, the third suction cup seven 357 and the third suction cup two 352, the third suction cup four 354, the third suction cup six 356, and the third suction cup eight 358 can also be relatively height-adjusted to reduce the cost of the equipment. In actual production, the volume of the adsorption tooling for tiny chips is small. Because the volume of the tiny chips is small, the volume of the matching third suction cup 35 is also reduced accordingly. It can also solve the problem of space occupation during tooling storage. Compared with tools of the same volume, multiple groups of third suction cups 35 are alternately arranged to handle a wider range of sizes of adsorbed tiny chips.

[0045] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An integrated circuit chip composite suction device, comprising a connecting plate (1), characterized in that: The bottom of the connecting plate (1) is provided with a first fixture (2) and a second fixture (3) by means of a moving mechanism, and the first fixture (2) comprises a first mounting frame (201), the interior of the first mounting frame (201) is rotatably connected to a forward and reverse screw rod (202), one end of the forward and reverse screw rod (202) is connected to a first driving device (4), and the external threads of the forward and reverse screw rod (202) are connected to two sets of first movable plates (203), and the bottoms of the two sets of first movable plates (203) are both provided with first suction cups (204). ), and the sides of the two groups of first suction cups (204) are symmetrically mounted with clamping plates (205), the interior of the first mounting frame (201) is mounted with a fixing plate (207), the interior of the fixing plate (207) is rotatably connected with a first threaded rod (208), and the first threaded rod (208) and the forward and reverse screw rods (202) are transmission-connected by setting a bevel gear set (209), the external thread of the first threaded rod (208) is threadedly connected with a second movable plate (210), and a second suction cup (211) is mounted at the bottom of the second movable plate (210).

2. The integrated circuit chip composite suction device according to claim 1, characterized in that: A limiting groove (206) is provided inside the first mounting frame (201), and a first guide rod (212) is installed inside the first mounting frame (201); a sliding block matching the limiting groove (206) is arranged outside the first movable plate (203); and the second movable plate (210) movably passes through the outside of the first guide rod (212).

3. The integrated circuit chip composite suction device according to claim 2, characterized in that: The forward and reverse screw rods (202) are located inside the first mounting frame (201) and are symmetrically arranged in two groups. The two groups of forward and reverse screw rods (202) are connected by a belt pulley transmission, and the outside of one group of forward and reverse screw rods (202) is connected to the first driving device (4).

4. The integrated circuit chip composite suction device according to claim 1, characterized in that: The second fixture (3) comprises a second mounting frame (31), an isometric transformation module (32) being installed inside the second mounting frame (31), and the second mounting frame (31) is rotatably connected to a limit rod (33) inside, a plurality of telescopic components (34) being movably installed outside the limit rod (33), a third suction cup (35) being installed at the bottom of each of the plurality of telescopic components (34), and the limit rod (33) being connected to a third driving device (6).

5. The integrated circuit chip composite suction device according to claim 4, characterized in that: The isometric transformation module (32) comprises two groups of second guide rods (321) mounted inside the second mounting frame (31), and the second threaded rod (324) is rotatably connected inside the second mounting frame (31), and the second threaded rod (324) is connected to a second driving device (5); a first moving block (322) is movably mounted outside the second guide rod (321), and a plurality of second moving blocks (323) are movably mounted outside the second guide rod (321); the first moving block (322) and the second threaded rod (324) are threadably connected, and the second threaded rod (324) movably penetrates the plurality of second moving blocks (323); a movable link assembly (325) is mounted on the top of the first moving block (322) and the plurality of second moving blocks (323), and one end of the movable link assembly (325) is rotatably connected to the first moving block (322), and the other end of the movable link assembly (325) is rotatably connected to the second mounting frame (31).

6. The integrated circuit chip composite suction device according to claim 5, characterized in that: The telescopic assembly (34) comprises a sliding sleeve (341) movably mounted on the outside of the limiting rod (33), the outside of the sleeve (342) is rotatably connected to the sleeve (342), and a cam (343) is mounted on the outside of the sliding sleeve (341), a fixing rod (344) is movably mounted inside the sleeve (342), an outer convex ring (345) is mounted on the outside of the fixing rod (344), and a spring (346) is mounted on the outside of the fixing rod (344).

7. The integrated circuit chip composite suction device according to claim 6, characterized in that: The sliding sleeve (341) has a hole groove (347) inside that matches the limiting rod (33). The sliding sleeve (341) can slide outside the limiting rod (33), and the limiting rod (33) can drive the sliding sleeve (341) to rotate.

8. The integrated circuit chip composite suction device according to claim 7, characterized in that: The plurality of sets of sleeves (342) are respectively fixedly connected to the first moving block (322) and the second moving block (323), and the plurality of sets of third suction cups (35) are respectively installed at the bottom of the fixing rod (344).

9. The integrated circuit chip composite suction device according to claim 8, characterized in that: The plurality of groups of cams (343) are staggered and distributed horizontally and vertically, and two adjacent groups of cams (343) are arranged in a vertical state.

Images