Circuit board electroplating device

Abstract

The invention provides a circuit board electroplating device which comprises a conveying assembly, and the conveying assembly comprises a rack, an electroplating bath, a connecting column, a mounting cylinder, a synchronous electric cylinder, a connecting base, a mounting frame, a sliding block, a driving motor, a driving screw, a threaded hole, a mounting plate and a controller. According to the invention, the slot on the mounting plate is matched with the slidable adjusting rod, and the position of the adjusting rod can be accurately locked through the limiting screw hole and the limiting screw, so that the cathode clamp can be flexibly adjusted according to the size of the circuit board, and the cathode clamp clamping the circuit board is ensured to be completely immersed into an electroplating solution in an electroplating bath; meanwhile, the adjusting rod and the connecting block are quickly connected and separated through structures such as a pin rod and a spring, and a proper cathode clamp is conveniently replaced according to the specification of the circuit board, so that the adaptability is improved, the synchronous electric cylinder and the driving motor are uniformly regulated and controlled through the controller, accurate movement of the circuit board in the vertical direction and the horizontal direction is achieved, and the production efficiency is improved. All links from installation to electroplating are completed, manual intervention is reduced, and efficiency and accuracy are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic manufacturing, and in particular to a circuit board electroplating device. Background Art

[0002] In the field of electronic manufacturing, circuit boards are essential components of all kinds of electronic equipment. As electronic products continue to develop in the direction of miniaturization, multi-function and high performance, the manufacturing precision and quality requirements for circuit boards are also increasing. Electroplating, as an important process in the circuit board manufacturing process, can deposit metal coatings on the surface of the circuit board, which plays a key role in improving conductivity, enhancing corrosion resistance, improving welding performance, etc. However, traditional circuit board electroplating devices have many disadvantages; On the one hand, the fixtures of traditional circuit board electroplating devices are often of fixed specifications, which are difficult to adapt to circuit boards of different sizes and types. Every time the circuit board model is changed, it often takes a lot of time to adjust or replace the fixtures, which seriously affects production efficiency. On the other hand, the traditional circuit board electroplating equipment is relatively extensive in the control of the electroplating solution. After long-term use, the impurities in the electroplating solution increase, affecting the stability and uniformity of the electroplating effect. In addition, the lack of precise liquid level control makes it easy for the electroplating solution to be insufficient or overflow, which not only wastes resources but also may pollute the working environment. In addition, the cleaning and drying process of traditional circuit board electroplating equipment is not perfect after electroplating. Incomplete cleaning will leave residual pollutants, and irregular drying will easily cause the circuit board to get damp and damaged, which cannot meet the stringent requirements of current high-quality circuit board production. To this end, a circuit board electroplating device is proposed. Summary of the invention

[0003] In view of this, the present invention hopes to provide a circuit board electroplating device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0004] The technical solution of the embodiment of the present invention is implemented as follows: a circuit board electroplating device, comprising a conveying assembly, the conveying assembly comprising a frame, an electroplating tank, a connecting column, a mounting cylinder, a synchronous electric cylinder, a connecting seat, a mounting frame, a sliding block, a driving motor, a driving screw, a threaded hole, a mounting plate, a slot, an adjusting rod, a jack, a connecting block, a cathode fixture and a controller; The top of the inner side wall of the frame is fixedly connected with an electroplating tank, the center of the top of the front surface and the rear surface of the frame are welded with connecting columns, the ends of the upper surfaces of the two connecting columns that are away from each other are welded with mounting tubes, the inner side walls of the two mounting tubes are fixedly connected with synchronous electric cylinders, the output ends of the two synchronous electric cylinders are fixedly connected with connecting seats, the upper surfaces of the two connecting seats are fixedly connected with mounting frames, the inner side wall of the mounting frame is slidably connected with sliding blocks, the front part of the upper surface of the mounting frame is fixedly connected with a driving motor, the output end of the driving motor is fixedly connected with a driving screw, A threaded hole is provided on the upper part of the front surface of the sliding block, the outer wall of the driving screw is threadedly connected to the inner wall of the threaded hole, the lower surface of the sliding block is fixedly connected to a mounting plate, a plurality of slots are provided on both sides of the upper surface of the mounting plate, the inner walls of the plurality of slots are slidably connected to adjusting rods, a socket is provided on the lower surface of the adjusting rod, a connecting block is slidably connected to the inner wall of the socket, a cathode clamp is fixedly connected to the bottom of the connecting block, a controller is fixedly connected to the middle part of one side of the electroplating tank, and the input ends of the synchronous electric cylinder and the driving motor are electrically connected to the output end of the controller.

[0005] Further preferably, multiple limit screw holes are opened on both sides of the mounting plate, the inner walls of the multiple limit screw holes are threadedly connected with limit screws, multiple adjustment holes are opened on the upper part of one side of the adjusting rod, and the outer wall of the limit screw is slidably connected to the inner wall of the adjustment hole close to the side of the sliding block.

[0006] The cam is connected to the locking plate at the bottom of the locking plate, and the locking plate is connected to the locking plate at the bottom of the locking plate, wherein the locking plate is connected to the locking plate at the bottom of the locking plate, and the locking plate is connected to the locking plate at the bottom of the locking plate.

[0007] Further preferably, an operating table and a cleaning tank are fixedly connected to the middle of the upper surfaces of the two connecting columns respectively, and a drying mechanism is fixedly connected to the center of the top of both sides of the cleaning tank.

[0008] Further preferably, a liquid storage tank is fixedly connected to the lower portion of the inner wall of the frame, a liquid outlet pipe is connected to the lower portion of one side of the liquid storage tank, an infusion pump is installed at the end of the liquid outlet pipe away from the liquid storage tank, the liquid outlet end of the infusion pump is connected to a filter through a connecting pipe, an infusion pipe is installed at the liquid outlet end of the filter, the end of the infusion pipe away from the filter passes through the lower center of one side of the electroplating tank, the liquid outlet end of the infusion pipe is connected to an annular pipe, a plurality of liquid outlet holes are opened on the inner side wall of the annular pipe, a liquid level sensor is installed on one side of the inner side wall of the electroplating tank, the output end of the liquid level sensor is electrically connected to the input end of the controller, and the input end of the infusion pump is electrically connected to the output end of the controller.

[0009] Further preferably, both sides of the front surface and the rear surface of the electroplating tank are connected with overflow pipes, and the ends of the four overflow pipes away from the electroplating tank are respectively connected to the upper parts of both sides of the front surface and the rear surface of the liquid storage tank.

[0010] Further preferably, the ends of the two connecting columns that are away from each other are welded with limit frames, the middle parts of both sides of the installation frame are fixedly connected with limit blocks, and the outer side walls of the limit blocks are slidably connected to the inner side walls of the limit frames.

[0011] Further preferably, limiting sliding grooves are provided in the middle of both sides of the installation frame, limiting sliding blocks are fixedly connected to the lower parts of both sides of the sliding block, and the outer side walls of the limiting sliding blocks are slidably connected to the inner side walls of the limiting sliding grooves.

[0012] Further preferably, a side of the upper surface of the mounting frame away from the driving motor is fixedly connected to a limiting seat, and a side of the outer side wall of the driving screw away from the driving motor is rotationally connected to an inner side wall of the limiting seat.

[0013] Further preferably, a support column is welded to one end of the lower surface of the two connecting columns that is away from each other, a support plate is welded to the bottom of the support column, and a plurality of mounting holes are opened on the outer side of the upper surface of the support plate.

[0014] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution: 1. The present invention cooperates with the slidable adjustment rod through the slot on the mounting plate, and the position of the adjustment rod can be accurately locked through the limit screw hole and the limit screw, so that it can be flexibly adjusted according to the size of the circuit board to ensure that the cathode clamp holding the circuit board is completely immersed in the electroplating liquid in the electroplating tank; at the same time, the adjustment rod and the connecting block are quickly connected and separated through structures such as pins and springs, which is convenient for replacing the appropriate cathode clamp according to the specifications of the circuit board, thereby improving adaptability; 2. The present invention uses a controller to uniformly control the synchronous electric cylinder and the drive motor to achieve precise movement of the circuit board in the vertical and horizontal directions, complete all links from installation to electroplating, reduce manual intervention, and improve efficiency and accuracy; at the same time, the liquid level sensor monitors the liquid level of the electroplating tank in real time, and combines with the infusion pump, filter, annular pipe and overflow pipe to achieve automatic replenishment, uniform spraying and recycling of the electroplating liquid, ensuring stable liquid level and uniform composition, and ensuring stable electroplating quality.

[0015] 3. The present invention facilitates operators to perform operations such as circuit board installation and disassembly through the operating table. The cleaning tank cooperates with the drying mechanism to make the electroplating post-processing process coherent and efficient, reduce the complexity of manual operation, reduce labor intensity, and improve the overall convenience of operation.

[0016] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a structural diagram of a perspective of the present invention; Figure 2 Another perspective structural diagram of the present invention; Figure 3 It is a structural diagram of the connecting column and the synchronous electric cylinder of the present invention; Figure 4 It is a structural diagram of the mounting plate and the adjusting rod of the present invention; Figure 5 It is a structural diagram of the adjusting rod and the pin rod of the present invention; Figure 6 It is a structural diagram of the connection block and cathode fixture of the present invention; Figure 7 It is a structural diagram of the liquid storage box and the liquid outlet hole of the present invention.

[0019] Figure numerals: 1, conveying assembly; 11, frame; 12, electroplating tank; 13, connecting column; 14, mounting cylinder; 15, synchronous electric cylinder; 16, connecting seat; 17, mounting frame; 18, sliding block; 19, driving motor; 20, driving screw; 21, threaded hole; 22, mounting plate; 23, slot; 24, adjusting rod; 25, jack; 26, connecting block; 27, cathode fixture; 28, controller; 29, limiting screw hole; 30, limiting screw; 31, adjusting hole; 32, pin rod; 33, limiting ring; 34. Limiting shell; 35. Spring; 36. Pin hole; 37. Pull button; 38. Operating table; 39. Cleaning tank; 40. Drying mechanism; 41. Liquid storage tank; 42. Liquid outlet pipe; 43. Infusion pump; 44. Connecting pipe; 45. Filter; 46. Infusion pipe; 47. Ring pipe; 48. Liquid outlet hole; 49. Liquid level sensor; 50. Overflow pipe; 51. Limiting frame; 52. Limiting block; 53. Limiting slide groove; 54. Limiting slider; 55. Limiting seat; 56. Support column; 57. Support plate; 58. Mounting hole. DETAILED DESCRIPTION

[0020] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0021] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] Embodiment 1 like Figure 1-Figure 6 As shown, an embodiment of the present invention provides a circuit board electroplating device, including a conveying assembly 1, the conveying assembly 1 includes a frame 11, a plating tank 12, a connecting column 13, a mounting cylinder 14, a synchronous electric cylinder 15, a connecting seat 16, a mounting frame 17, a sliding block 18, a driving motor 19, a driving screw 20, a threaded hole 21, a mounting plate 22, a slot 23, an adjusting rod 24, a jack 25, a connecting block 26, a cathode fixture 27 and a controller 28; The top of the inner wall of the frame 11 is fixedly connected with an electroplating tank 12, the center of the top of the front surface and the rear surface of the frame 11 are welded with connecting columns 13, the ends of the upper surfaces of the two connecting columns 13 that are away from each other are welded with mounting tubes 14, the inner walls of the two mounting tubes 14 are fixedly connected with synchronous electric cylinders 15, the output ends of the two synchronous electric cylinders 15 are fixedly connected with connecting seats 16, the upper surfaces of the two connecting seats 16 are fixedly connected with mounting frames 17, the inner wall of the mounting frame 17 is slidably connected with sliding blocks 18, and the front part of the upper surface of the mounting frame 17 is fixedly connected with A driving motor 19 is provided, and a driving screw 20 is fixedly connected to the output end of the driving motor 19. A threaded hole 21 is provided on the upper front surface of the sliding block 18. The outer wall of the driving screw 20 is threadedly connected to the inner wall of the threaded hole 21. A mounting plate 22 is fixedly connected to the lower surface of the sliding block 18. A plurality of slots 23 are provided on both sides of the upper surface of the mounting plate 22. The inner walls of the plurality of slots 23 are slidably connected to adjusting rods 24. A socket 25 is provided on the lower surface of the adjusting rod 24. A connecting block 26 is slidably connected to the inner wall of the socket 25. The bottom of the connecting block 26 is fixed. A cathode fixture 27 is connected, a controller 28 is fixedly connected to the middle of one side of the electroplating tank 12, and the input ends of the synchronous electric cylinder 15 and the drive motor 19 are electrically connected to the output end of the controller 28; wherein, the frame 11 is a basic frame, and an electroplating tank 12 is provided on the top of its inner wall for containing electroplating liquid to carry out electroplating operations, a mounting cylinder 14 is welded on the connecting column 13 at the front and rear tops of the frame, and a synchronous electric cylinder 15 is fixed in the cylinder, and the output end of the electric cylinder is connected to the mounting frame 17 through the connecting seat 16, so that the mounting frame can be vertically lifted, and there is a slidable slide inside the mounting frame 17 The driving motor 19 on the upper surface of the frame drives the driving screw 20 to rotate, and cooperates with the threaded hole 21 of the sliding block 18 to drive the sliding block to move horizontally. The mounting plate 22 under the sliding block 18 is equipped with an adjusting rod 24 that can adjust the position. The connecting block 26 at the bottom of the adjusting rod fixes the cathode clamp 27, thereby clamping circuit boards of different sizes and accurately transferring them. The controller 28 located on one side of the electroplating tank 12 is electrically connected to the synchronous electric cylinder 15 and the driving motor 19, and is used to uniformly regulate the operation of these components to achieve an automated electroplating process.

[0023] In one embodiment, specifically: a plurality of limiting screw holes 29 are provided on both sides of the mounting plate 22, and the inner walls of the plurality of limiting screw holes 29 are threadedly connected to the limiting screws 30, and a plurality of adjusting holes 31 are provided on the upper part of one side of the adjusting rod 24, and the outer wall of the limiting screw 30 is slidably connected to the inner wall of the adjusting hole 31 on the side close to the sliding block 18. When it is necessary to adjust the position of the adjusting rod 24 on the mounting plate 22, the adjusting rod 24 can be slid in the slot 23 to reach a suitable position. Thereafter, the limiting screw 30 is screwed into the limiting screw hole 29, and the outer wall of the limiting screw 30 is slidably connected to the inner wall of the adjusting hole 31 of the adjusting rod 24 on the side close to the sliding block 18. In this way, the position of the adjusting rod 24 can be locked. This design provides flexibility in position adjustment for the adjusting rod 24, and at the same time, the limiting screw 30 can be used to ensure that the adjusting rod 24 will not move at will after the position is adjusted, thereby ensuring The stability of the position of the adjusting rod 24. In the entire circuit board electroplating device, this structure helps to flexibly adjust the position of the adjusting rod 24 according to the requirements of circuit boards of different sizes, thereby ensuring that the cathode clamp 27 can firmly and accurately fix the circuit board and ensure the smooth progress of the electroplating process; this design utilizes the characteristics of threaded connection and sliding connection. On the one hand, the threaded connection between the limit screw 30 and the limit screw hole 29 is utilized to adjust the degree of fixation of the adjusting rod 24 by tightening or loosening the limit screw 30. On the other hand, the sliding connection between the adjustment hole 31 and the limit screw 30 ensures that the adjusting rod 24 can achieve precise position adjustment within a certain range, realizing the function that the position of the adjusting rod 24 can be adjusted and fixed after adjustment, reflecting the flexibility and operability of the device, and is an important mechanical structure detail in the circuit board electroplating device, which helps to improve the adaptability and working stability of the entire device to circuit boards of different specifications.

[0024] In one embodiment, specifically: a pin rod 32 passes through the lower part of the side of the adjusting rod 24 away from the sliding block 18, a limit ring 33 is fixedly connected to the middle part of the outer wall of the pin rod 32, a limit shell 34 is fixedly connected to the outer side of the adjusting rod 24 near the pin rod 32 on the side away from the sliding block 18, an inner wall of the limit ring 33 is slidably connected to the inner wall of the limit shell 34, an end of the pin rod 32 away from the adjusting rod 24 passes through the center of the inner wall of the limit shell 34 away from the adjusting rod 24, a spring 35 is sleeved on the side of the outer wall of the pin rod 32 away from the adjusting rod 24, one side of the spring 35 is fitted and connected to the side of the limit ring 33 away from the adjusting rod 24, and the spring 35 The other side is fitted and connected to the outer side of the center of the inner side wall of the limiting shell 34 away from the adjusting rod 24. A pin hole 36 is opened at the center of one side of the connecting block 26. The outer side wall of the pin rod 32 is slidably connected to the inner side wall of the pin hole 36 on the side close to the sliding block 18, and a pull button 37 is fixedly connected to the end of the pin rod 32 away from the pin hole 36; first, there is a penetrating pin rod 32 at the lower part of the side of the adjusting rod 24 away from the sliding block 18, and the middle part of the outer side wall of the pin rod 32 is fixedly connected to the limiting ring 33. At the same time, the limiting shell 34 is also fixedly connected to the outer side of the pin rod 32 on the side of the adjusting rod 24 away from the sliding block 18, and the limiting ring 33 can slide on the inner side wall of the limiting shell 34. This design can limit the movement range of the pin rod 32 so that it can move axially within a certain range. One end of the pin rod 32 passes through the center of the side of the limit housing 34 away from the adjusting rod 24, and a spring 35 is sleeved on the outside of the side of the pin rod 32 away from the adjusting rod 24. One side of the spring 35 is attached to the side of the limit ring 33 away from the adjusting rod 24, and the other side is attached to the outside of the center of the side of the inner side wall of the limit housing 34 away from the adjusting rod 24. The function of the spring 35 is to provide an elastic force so that the pin rod 32 has a tendency to reset. A pin hole 36 is opened at the center of one side of the connecting block 26, and the outer side wall of the pin rod 32 close to the side of the sliding block 18 can be It is slidably connected to the inner wall of the pin hole 36. When the pin rod 32 is inserted into the pin hole 36, it can lock the connecting block 26 and fix the connecting block 26 in the socket 25 of the adjusting rod 24, so that the cathode clamp 27 fixed at the bottom of the connecting block 26 can be fixed, ensuring the stability of the cathode clamp 27 when fixing the circuit board. The end of the pin rod 32 away from the pin hole 36 is fixedly connected to the pull button 37. The operator can pull the pull button 37 to drive the pin rod 32 to overcome the elastic force of the spring 35 and pull the pin rod 32 out of the pin hole 36. In this way, the connecting block 26 can be taken out or put in from the socket 25 of the adjusting rod 24, which facilitates the operation of the cathode clamp 27.

[0025] In one embodiment, specifically: an operating table 38 and a cleaning tank 39 are fixedly connected to the middle of the upper surfaces of the two connecting posts 13, and a drying mechanism 40 is fixedly connected to the top center of both sides of the cleaning tank 39; wherein, the operating table 38 provides an exclusive working area for the operator, which is convenient for the operator to perform fine operations such as selecting an appropriate cathode fixture and installing the circuit board on the fixture before the electroplating process begins; it is also convenient to remove the circuit board from the fixture after the electroplating is completed, and to organize and store the finished products; and the role of the cleaning tank 39 is very critical. After the electroplating of the circuit board is completed, the electroplating liquid and metal will remain on its surface. Pollutants such as particles need to be cleaned in time. The circuit board can be immersed in the cleaning tank 39 to carry out the subsequent cleaning process. After the circuit board is cleaned in the cleaning tank 39, the wet state is not suitable for directly entering the next process or storage. At this time, the drying mechanism 40 located on both sides of the cleaning tank can play a role. By heating the air, blowing air, etc., the moisture on the surface of the circuit board is quickly removed to make the circuit board reach a dry state, ensuring that rust, short circuit and other problems will not occur due to residual moisture during subsequent processing, transportation or storage, thereby ensuring the quality and performance of the circuit board and making the entire electroplating process more complete and smooth.

[0026] In one embodiment, specifically: a liquid storage tank 41 is fixedly connected to the lower part of the inner wall of the frame 11, a liquid outlet pipe 42 is connected to the lower part of one side of the liquid storage tank 41, an infusion pump 43 is installed at the end of the liquid outlet pipe 42 away from the liquid storage tank 41, the liquid outlet end of the infusion pump 43 is connected to a filter 45 through a connecting pipe 44, a liquid infusion pipe 46 is installed at the liquid outlet end of the filter 45, the end of the liquid infusion pipe 46 away from the filter 45 passes through the lower center of one side of the electroplating tank 12, and the liquid outlet end of the liquid infusion pipe 46 is connected to a ring pipe 47 The inner wall of the annular tube 47 is provided with a plurality of liquid outlet holes 48, a liquid level sensor 49 is installed on one side of the inner wall of the electroplating tank 12, the output end of the liquid level sensor 49 is electrically connected to the input end of the controller 28, and the input end of the infusion pump 43 is electrically connected to the output end of the controller 28; wherein, a liquid storage tank 41 is fixed at the lower part of the inner wall of the frame 11, which is used to store the electroplating liquid and continuously supply the electroplating liquid for the electroplating process; the infusion pump 43 plays the role of power transmission, extracts the electroplating liquid in the liquid storage tank 41, and promotes the electroplating liquid The liquid flows along the subsequent connecting pipe 44, the filter 45, and the infusion pipe 46, and is finally transported to the electroplating tank 12; the filter 45 usually contains filter media such as activated carbon and microporous ceramic filter elements, which can intercept tiny impurity particles and suspended matter in the electroplating solution, prevent the dirty electroplating solution from affecting the electroplating effect, and ensure the purity of the electroplating solution entering the electroplating tank; the inner wall of the annular tube 47 is provided with a plurality of liquid outlet holes 48. This annular distribution and porous design can allow the electroplating solution to be sprayed into the electroplating tank 12 more evenly, maintaining the electroplating effect. The liquid components are evenly distributed in the tank, which is conducive to consistent electroplating effects at all parts of the circuit board; the liquid level sensor 49 is used to monitor the liquid level of the plating liquid in the plating tank in real time, and output the liquid level information in the form of an electrical signal to the input end of the controller 28. Once the liquid level is lower than the preset lower limit, the controller 28 will send a start command to the input end of the infusion pump 43 based on the signal, prompting the infusion pump 43 to draw plating liquid from the liquid storage tank 41 to replenish it, thereby realizing automatic and stable control of the plating liquid level to ensure smooth and continuous electroplating operations.

[0027] In one embodiment, specifically: overflow pipes 50 are connected to both sides of the front and rear surfaces of the electroplating tank 12, and the ends of the four overflow pipes 50 away from the electroplating tank 12 are respectively connected to the upper parts of the front and rear surfaces of the liquid storage tank 41. During the electroplating process, the plating liquid level in the electroplating tank 12 will fluctuate due to various factors. When the liquid level is too high, excess plating liquid will flow out along these overflow pipes 50, and the other ends of the four overflow pipes 50 are respectively connected to the upper parts of the front and rear surfaces of the liquid storage tank 41. In this way, the plating liquid overflowing from the electroplating tank 12 can naturally flow back into the liquid storage tank 41 by relying on gravity. This not only avoids the waste of plating liquid or pollution of the working environment due to overflow of the excessively high liquid level, but also cleverly constitutes a plating liquid circulation system, which cooperates with the previously mentioned mechanism of extracting plating liquid from the liquid storage tank to replenish the plating tank, further maintains the dynamic stability of the plating liquid composition, and ensures that the electroplating operation is carried out continuously and stably.

[0028] In one embodiment, specifically: a limiting frame 51 is welded to the ends of the two connecting columns 13 that are away from each other, a limiting block 52 is fixedly connected to the middle of both sides of the installation frame 17, and the outer wall of the limiting block 52 is slidably connected to the inner wall of the limiting frame 51. The limiting blocks 52 on both sides of the installation frame 17 slide inside the limiting frame 51, thereby limiting the limiting blocks 52, thereby increasing the stability of the up and down movement of the installation frame 17.

[0029] In one embodiment, specifically: a limiting groove 53 is opened in the middle of both sides of the installation frame 17, and the lower parts of both sides of the sliding block 18 are fixedly connected with the limiting slider 54, and the outer wall of the limiting slider 54 is slidably connected to the inner wall of the limiting groove 53. The limiting slider 54 on both sides of the sliding block 18 slides inside the limiting groove 53, thereby limiting the limiting slider 54, thereby increasing the stability of the movement of the sliding block 18.

[0030] In one embodiment, specifically: the upper surface of the mounting frame 17 is fixedly connected to a limiting seat 55 on a side away from the driving motor 19, and the outer wall of the driving screw 20 is rotatably connected to an inner wall of the limiting seat 55 on a side away from the driving motor 19. By rotating the outer wall of the driving screw 20 on a side away from the driving motor 19 inside the limiting seat 55, the driving screw 20 is limited, thereby increasing the stability of the rotation of the driving screw 20.

[0031] In one embodiment, specifically: a support column 56 is welded to one end of the lower surface of the two connecting columns 13 that is away from each other, a support plate 57 is welded to the bottom of the support column 56, and a plurality of mounting holes 58 are provided on the outer side of the upper surface of the support plate 57. The support of the connecting columns 13 by the support columns 56 and the support plates 57 increases the firmness of the connecting columns 13. The plurality of mounting holes 58 provided on the support plates 57 facilitates the use of expansion bolts to fix the support plates 57 to the ground, thereby further increasing the firmness of the connecting columns 13.

[0032] Embodiment 2 This embodiment provides a working process of a circuit board electroplating device, which is as follows: Two operators work simultaneously on both sides of the operating table 38. First, they neatly arrange cathode fixtures 27 of various types for easy observation and selection. When facing the circuit board to be electroplated, they carefully check its size specifications, measure the length, width and thickness, and accurately record the key parameters. At the same time, they pay attention to the layout of the area to be electroplated on the circuit board, such as the pin distribution, the direction of special lines, etc. Based on these detailed information, they select the most suitable one from the many cathode fixtures 27. After getting the selected cathode fixture 27, the operator fixes the circuit board with the cathode fixture 27, and then pulls the button 37. At this time, the pin rod 32 overcomes the elastic force of the spring 35 driven by the button 37 and moves away from the adjusting rod 24. The connecting block 26 on the cathode fixture 27 is inserted into the bottom jack 25 of the adjusting rod 24. The button 37 is released, and the spring 35 rebounds, pushing the pin rod 32 to accurately insert into the pin hole 36 on the connecting block 26. , thereby limiting and fixing the cathode fixture 27 that firmly clamps the circuit board; after completing the installation of the cathode fixture 27, the operator presses the start button of the synchronous electric cylinder 15 on the operation panel on the operating table 38, and the start signal is immediately transmitted to the controller 28. The control program built into the controller 28 quickly processes the signal and sends precise instructions to the two synchronous electric cylinders 15 to drive their telescopic rods to extend synchronously. As the telescopic rods extend, the connecting seat 16 begins to rise steadily. The connecting seat 16 is rigidly connected to the mounting frame 17, and the sliding block 18, the mounting plate 22 and the cathode fixture 27 fixed under the mounting frame 17 move upward as a whole. During the rising process, the limit blocks 52 in the middle of both sides of the mounting frame 17 slide smoothly along the inner wall of the limit frame 51 welded on the top of the connecting column 13. The inner wall of the limit frame 51 has been precisely processed with extremely low roughness, which provides precise guidance for the lifting and lowering of the mounting frame 17 and effectively prevents shaking. The synchronous electric cylinder 15 continues to operate until the cathode fixture 27 and the circuit board rise to a suitable height estimated above the electroplating tank 12. This height is a rough range preset based on previous experience in electroplating similar circuit boards, in preparation for subsequent fine adjustments. When the cathode fixture 27 reaches the initial suitable height, the operator then starts the drive motor 19, which drives the drive screw 20 to rotate. Since the drive screw 20 and the threaded hole 21 on the upper front surface of the sliding block 18 form a precise spiral transmission structure, during the rotation process, according to the principle of thread transmission, the sliding block 18 is subjected to an axial driving force, and at the same time When the sliding block 18 is moved, the limit sliders 54 fixed at the lower parts of both sides of the sliding block 18 fit tightly in the limit slide grooves 53 opened in the middle parts of both sides of the mounting frame 17. The width tolerance of the limit slide grooves 53 is extremely small, and they cooperate closely with the limit sliders 54 to ensure that the sliding block 18 can only move smoothly along the predetermined horizontal straight line direction. Under the rotation and push of the driving screw 20 and the guiding constraint of the limit sliders 54, the sliding block 18 carries the cathode fixture 27 and the circuit board and accurately translates toward the top of the electroplating tank 12. The translation speed is uniform and stable until it is accurately aligned with the center position of the electroplating tank 12, preparing for the next step of entering the tank for electroplating.After the horizontal positioning is completed, the drive motor 19 stops running, and the synchronous electric cylinder 15 receives the command from the controller 28 again, and its telescopic rod begins to retract. During the retraction process, the mounting frame 17, the sliding block 18, the mounting plate 22 and the cathode fixture 27 as a whole slowly descend in the vertical direction. The descending rate is optimized to ensure efficiency and prevent the electroplating liquid from splashing due to excessive descent. Finally, the cathode fixture 27 and the circuit board are completely immersed in the pre-prepared electroplating liquid in the electroplating tank 12. At this time, the electroplating tank 12 is powered on, and the current flows from the cathode fixture 27 to the circuit board. 7 flows into the plating solution, triggering a series of electrochemical reactions. The metal ions move in a directional manner under the action of the electric field and gradually deposit evenly in the area to be plated on the circuit board, starting the plating process of a predetermined duration. During the plating period, the liquid level sensor 49 continuously monitors the liquid level of the plating solution in the plating tank 12. Once it detects that the liquid level is lower than the preset lower limit, it immediately sends a low liquid level signal to the controller 28. After receiving the low liquid level signal, the controller 28 responds quickly and starts the infusion pump 43 to extract the plating solution in the liquid storage tank 41 through the liquid outlet pipe 42. The extracted plating solution first enters the The filter 45 is filled with a high-precision filter medium, such as a microporous ceramic filter element, activated carbon fiber, etc., which can effectively intercept tiny impurity particles and suspended solids in the electroplating solution to ensure the purity of the electroplating solution. The filtered electroplating solution flows along the infusion tube 46 and is finally sprayed evenly into the electroplating tank 12 through the multiple liquid outlet holes 48 on the annular tube 47 to replenish the electroplating solution, maintain the stability of the electroplating solution level, and ensure that the electroplating process continues to proceed stably. At the same time, the excess electroplating solution in the electroplating tank 12 will pass through the front and rear surfaces of the electroplating tank 12. The connected overflow pipe 50 flows back to the liquid storage tank 41 by gravity, forming a circulation loop of the plating liquid to maintain the dynamic balance of the components of the plating liquid; after the preset plating time is over, the telescopic rod of the synchronous electric cylinder 15 extends, driving the cathode fixture 27 and the electroplated circuit board to slowly rise from the plating tank 12. After completely leaving the plating tank 12, the drive motor 19 drives the screw 20 to rotate, driving the sliding block 18 to move horizontally toward the cleaning tank 39, and accurately moving the cathode fixture 27 and the circuit board to a specific position above the cleaning tank 39 to prepare for the cleaning operation;After the synchronous electric cylinder 15 receives the new command from the controller 28, the telescopic rod retracts, and the cathode fixture 27 holding the circuit board descends at a stable and slow speed until it is completely immersed in the cleaning liquid in the cleaning tank 39. At this time, the ultrasonic generator built into the cleaning tank 39 is immediately started, which converts electrical energy into high-frequency mechanical vibrations. The frequency is usually set between 20-100kHz. These high-frequency vibrations generate countless tiny cavitation bubbles in the cleaning liquid. At the moment of formation, growth, and collapse, the cavitation bubbles will release a strong impact force, which acts on the surface of the circuit board and removes the plating liquid, metal particles, impurities and other pollutants left after electroplating. The ultrasonic cleaning time is precisely set in advance in the controller 28 according to the complexity and pollution degree of the circuit board, so as to ensure the best cleaning effect. When the ultrasonic cleaning time is up, the telescopic rod of the synchronous electric cylinder 15 is extended again to steadily lift the cathode fixture 27 and the cleaned circuit board from the cleaning liquid in the cleaning tank 39. During the lifting process, the excess cleaning liquid flows back to the cleaning tank 39 along the surface of the circuit board and the fixture, so as to minimize the amount of liquid carried out. At the same time as the synchronous electric cylinder 15 rises, the cleaning liquid on both sides of the cleaning tank 39 The drying mechanism 40 is turned on synchronously, and the heating element inside the drying mechanism 40 heats the incoming air to a preset temperature, which is generally set between 40-80°C. The specific temperature depends on the material characteristics of the circuit board. Then, the fan blows out the heated clean air at a high speed, and the hot air blows evenly on the surface of the circuit board to quickly take away moisture and achieve a drying effect. The air flow rate, wind speed and other parameters blown out by the drying mechanism 40 are accurately controlled by the controller 28 to ensure that the drying process is efficient and will not cause damage to the circuit board due to overheating or excessive wind speed. After the drying is completed, the drive motor 19 is activated again to move the circuit board smoothly to the operating table 38, the operator pulls the button 37 to disengage the pin 32 from the connecting block 26, removes the cathode fixture 27, and loosens the cathode fixture 27, carefully removes the electroplated and dried circuit board from the fixture, gently places it in the finished product storage area, and arranges it neatly; the operator then takes a new circuit board to be electroplated from the processing area, repeats each of the above-mentioned fine steps starting from the fixture adaptation, selects the appropriate cathode fixture 27 according to the characteristics of the new circuit board, and then performs a series of operations such as installation, height adjustment, transportation, electroplating, cleaning, and drying in turn, and repeats this cycle to continuously and efficiently complete the electroplating of the circuit board. ;

[0033] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A circuit board electroplating device, characterized in that: The conveying assembly (1) comprises a frame (11), an electroplating tank (12), a connecting column (13), a mounting cylinder (14), a synchronous electric cylinder (15), a connecting seat (16), a mounting frame (17), a sliding block (18), a driving motor (19), a driving screw (20), a threaded hole (21), a mounting plate (22), a slot (23), an adjusting rod (24), a jack (25), a connecting block (26), a cathode clamp (27) and a controller (28); The top of the inner side wall of the frame (11) is fixedly connected to an electroplating tank (12); the center of the top of the front and rear surfaces of the frame (11) are both welded with connecting columns (13); the ends of the upper surfaces of the two connecting columns (13) that are away from each other are both welded with mounting tubes (14); the inner side walls of the two mounting tubes (14) are both fixedly connected to synchronous electric cylinders (15); the output ends of the two synchronous electric cylinders (15) are both fixedly connected to connecting seats (16); the upper surfaces of the two connecting seats (16) are fixedly connected to mounting frames (17); the inner side walls of the mounting frames (17) are slidably connected to sliding blocks (18); the front part of the upper surface of the mounting frame (17) is fixedly connected to a driving motor (19); the output end of the driving motor (19) is fixedly connected to a driving screw (20); the sliding block (18) ) is provided with a threaded hole (21) on the upper part of the front surface, the outer wall of the driving screw rod (20) is threadedly connected to the inner wall of the threaded hole (21), the lower surface of the sliding block (18) is fixedly connected to a mounting plate (22), a plurality of slots (23) are provided on both sides of the upper surface of the mounting plate (22), the inner walls of the plurality of slots (23) are slidably connected to an adjusting rod (24), a plug hole (25) is provided on the lower surface of the adjusting rod (24), the inner wall of the plug hole (25) is slidably connected to a connecting block (26), the bottom of the connecting block (26) is fixedly connected to a cathode fixture (27), a controller (28) is fixedly connected to the middle part of one side of the electroplating tank (12), and the input ends of the synchronous electric cylinder (15) and the driving motor (19) are electrically connected to the output end of the controller (28).

2. A circuit board electroplating device according to claim 1, characterized in that: A plurality of limiting screw holes (29) are provided on both sides of the mounting plate (22), and the inner walls of the plurality of limiting screw holes (29) are threadedly connected to limiting screws (30). A plurality of adjusting holes (31) are provided on an upper portion of one side of the adjusting rod (24), and the outer wall of the limiting screw (30) is slidably connected to the inner wall of the adjusting hole (31) on a side close to the sliding block (18).

3. A circuit board electroplating device according to claim 1, characterized in that: A pin rod (32) penetrates the lower part of the side of the adjusting rod (24) away from the sliding block (18); a limiting ring (33) is fixedly connected to the middle part of the outer wall of the pin rod (32); a limiting shell (34) is fixedly connected to the outer side of the side of the adjusting rod (24) away from the sliding block (18) near the pin rod (32); an inner wall of the limiting ring (33) is slidably connected to the inner wall of the limiting shell (34); an end of the pin rod (32) away from the adjusting rod (24) penetrates the center of the inner wall of the limiting shell (34) away from the adjusting rod (24); and the outer wall of the pin rod (32) away from the adjusting rod (24) is fixedly connected to the outer side of the limiting shell (34). A spring (35) is sleeved on one side away from the adjusting rod (24), one side of the spring (35) is closely connected to the side of the limiting ring (33) away from the adjusting rod (24), and the other side of the spring (35) is closely connected to the outside of the center of the inner side wall of the limiting shell (34) away from the adjusting rod (24). A pin hole (36) is opened at the center of one side of the connecting block (26), the outer side wall of the pin rod (32) close to the sliding block (18) is slidably connected to the inner side wall of the pin hole (36), and the end of the pin rod (32) away from the pin hole (36) is fixedly connected to a pull button (37).

4. A circuit board electroplating device according to claim 1, characterized in that: An operating table (38) and a cleaning tank (39) are respectively fixedly connected to the middle of the upper surfaces of the two connecting columns (13), and a drying mechanism (40) is fixedly connected to the center of the top of both sides of the cleaning tank (39).

5. A circuit board electroplating device according to claim 1, characterized in that: A liquid storage tank (41) is fixedly connected to the lower portion of the inner side wall of the frame (11); a liquid outlet pipe (42) is connected to the lower portion of one side of the liquid storage tank (41); an infusion pump (43) is installed at one end of the liquid outlet pipe (42) away from the liquid storage tank (41); a filter (45) is connected to the liquid outlet end of the infusion pump (43) via a connecting pipe (44); a liquid infusion pipe (46) is installed at the liquid outlet end of the filter (45); and a liquid infusion pipe (46) is installed at the end of the liquid infusion pipe (46) away from the filter (45). One end of the liquid infusion tube (46) passes through the lower center of one side of the electroplating tank (12); the liquid outlet end of the liquid infusion tube (46) is connected to the annular tube (47); the inner wall of the annular tube (47) is provided with a plurality of liquid outlet holes (48); a liquid level sensor (49) is installed on one side of the inner wall of the electroplating tank (12); the output end of the liquid level sensor (49) is electrically connected to the input end of the controller (28); and the input end of the liquid infusion pump (43) is electrically connected to the output end of the controller (28).

6. A circuit board electroplating device according to claim 5, characterized in that: Both sides of the front surface and the rear surface of the electroplating tank (12) are connected to overflow pipes (50), and the ends of the four overflow pipes (50) away from the electroplating tank (12) are respectively connected to the upper parts of both sides of the front surface and the rear surface of the liquid storage tank (41).

7. A circuit board electroplating device according to claim 1, characterized in that: The ends of the two connecting columns (13) that are away from each other are welded with a limit frame (51), the middle parts of both sides of the installation frame (17) are fixedly connected to the limit blocks (52), and the outer side walls of the limit blocks (52) are slidably connected to the inner side walls of the limit frames (51).

8. A circuit board electroplating device according to claim 1, characterized in that: The middle parts of both sides of the installation frame (17) are provided with limit sliding grooves (53), the lower parts of both sides of the sliding block (18) are fixedly connected to limit sliding blocks (54), and the outer side walls of the limit sliding blocks (54) are slidably connected to the inner side walls of the limit sliding grooves (53).

9. A circuit board electroplating device according to claim 1, characterized in that: The side of the upper surface of the mounting frame (17) away from the driving motor (19) is fixedly connected to the limiting seat (55), and the side of the outer side wall of the driving screw rod (20) away from the driving motor (19) is rotatably connected to the inner side wall of the limiting seat (55).

10. A circuit board electroplating device according to claim 7, characterized in that: A support column (56) is welded to one end of the lower surface of the two connecting columns (13) that is away from the other end, a support plate (57) is welded to the bottom of the support column (56), and a plurality of mounting holes (58) are provided on the outer side of the upper surface of the support plate (57).

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