Diode structure convenient to weld and production process thereof

Abstract

The invention relates to a diode structure convenient to weld, which comprises a tube core, a tube shell and two electrodes, the two electrodes are formed on the tube core and extend into the tube shell, and the tube shell comprises a top connecting piece, a middle connecting piece and a bottom connecting piece. Through the cooperative arrangement of the top connecting piece, the middle connecting piece and the bottom connecting piece, a weld joint matched with an electrode can be configured in the tube shell in advance, so that the convenience and the stability of welding and fixing of the diode are improved; by arranging a polymer tackifier when the top connecting piece and the bottom connecting piece are formed, the flowability and compactness of powder can be improved, so that the forming quality and performance of a product are improved; through the arrangement of the top connecting piece and bottom connecting piece forming process, the forming size can be accurately controlled when the top connecting piece and the bottom connecting piece are formed, and the error between the top connecting piece and the bottom connecting piece and the design size is greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency diodes, and in particular to a diode structure that is easy to weld and a production process thereof. Background Art

[0002] With the continuous optimization of RF chips in terms of power, efficiency and size, analog circuit functional modules such as power amplification, filtering, and switching can be realized by a single bare die or by stacking several chips. In order to finally integrate microwave components with complete functions in a single package, further improve the integration level, and realize the deviceization of microwave components, it is necessary to integrate digital circuit chips such as AD / DA, power control, and digital processing into the RF tube shell.

[0003] Radio frequency diodes are usually used for amplifying and processing high-frequency signals, and their structural design needs to ensure the stability of the electrodes and good electrical contact. However, in the prior art, the electrodes of radio frequency diodes are welded and fixed in the tube shell, and there are the following problems: the electrodes will be displaced during the welding process due to lack of support, resulting in loose welding or poor electrical contact; the solder cannot flow well to the place where it needs to be filled, resulting in poor welding, cold welding or incomplete welding. Summary of the invention

[0004] In order to improve the problems raised in the above background technology, the present application provides a diode structure that is easy to weld and a production process thereof.

[0005] The present application provides a diode structure that is easy to weld using the following technical solution: A diode structure that is easy to weld, comprises a tube core, a tube shell and two electrodes, the two electrodes are formed on the tube core, and the two electrodes extend into the tube shell, the tube shell comprises a top connector, a middle connector and a bottom connector, the two ends of the middle connector are respectively fixedly connected to the opposite sides of the top connector and the bottom connector, the bottom connector comprises a substrate, a convex column and a bottom column, the upper surface of the substrate is in contact with the bottom of the middle connector, the convex column is formed at the top center of the substrate and extends into the inner bottom of the middle connector, the convex column is formed at the bottom center of the substrate and protrudes downward, the substrate separates the bottom of the inner cavity of the middle connector to form a weld for welding with the electrodes, and the top of the inner cavity of the middle connector forms a placement cavity for cooperating with the tube core installation.

[0006] Furthermore, the top connecting piece includes an annular plate, a skirt and a positioning area. The lower surface of the annular plate is in close contact with the top of the middle connecting piece. The skirt is formed on the top of the annular plate and is located on the outside of the annular plate cavity. The top connecting piece is used to seal the top opening of the middle connecting piece, and the internal cavity of the skirt forms a positioning area.

[0007] Furthermore, the outer walls of the top connector and the bottom connector are both provided with a nickel-plated layer and a gold-plated layer.

[0008] Furthermore, the middle connecting piece is configured as a ceramic ring.

[0009] The present application provides a production process for a diode structure that is easy to weld using the following technical solution: Step 1: Connect the middle connecting piece and the bottom connecting piece into an integrated structure by means of resistance welding; Step, placing the tube core provided with two electrodes into the integrated structure consisting of the middle connector and the bottom connector obtained in the step, and inserting the two electrodes into the weld; Step, fill the solder in the gap of the weld, and use brazing to weld and fix the two electrodes in the tube shell; Step, forming a complete tube shell by resistance welding the top connector, the middle connector and the bottom connector obtained in the step, and sealing the tube core with the top connector.

[0010] Furthermore, the bottom connector and the top connector are both made of molybdenum copper or tungsten copper mixed with lubricants, plasticizers, sintering aids, non-metallic inclusion controllers, oxide additives, silicate additives, carbide additives, polymer thickeners, and hard particle thickeners to form a powder mixture, and the powder mixture is formed into a desired shape by pressure molding or pressureless molding using a mold that cooperates with the bottom connector and the top connector. The polymer thickener is set to polyvinyl alcohol or polymethacrylate, and the polymer thickener is used to improve the fluidity and compactness of the powder mixture.

[0011] Furthermore, when the nickel-plated layer and the gold-plated layer on the outer surface of the bottom connector and the top connector are electroplated, a zoned electroplating method is adopted and different electroplating parameters are set for each zone to achieve plating layers of different thicknesses.

[0012] Furthermore, the area division for the zoned electroplating is performed according to the error between the actual molding of the top connector and the bottom connector and the designed size, and a mask is applied on the areas not plated in the zoned electroplating to prevent the deposition of the plating solution on these areas.

[0013] The beneficial technical effects of the present application are as follows: by coordinating the top connector, the middle connector and the bottom connector, a weld that matches the electrode can be pre-configured in the tube shell, thereby improving the convenience of welding and fixing the diode and the stability of welding and fixing; by setting the polymer thickener during the molding of the top connector and the bottom connector, the fluidity and compactness of the powder can be improved, thereby improving the molding quality and performance of the product; by setting the molding process of the top connector and the bottom connector, the molding dimensions of the top connector and the bottom connector can be accurately controlled during molding, and the error between the design dimensions is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of a tube shell in a diode structure that is easy to weld according to an embodiment of the present application; Figure 2 yes Figure 1 A front view of the middle tube shell; Figure 3 yes Figure 1 Schematic diagram of the structure after the middle tube shell is cut open; Figure 4 yes Figure 1 Cross-sectional view of the mid-tube shell.

[0015] Figure numerals: 10, top connector; 11, annular plate; 12, skirt; 13, positioning area; 20, middle connector; 30, bottom connector; 31, base plate; 32, boss; 33, bottom column; 40, weld. DETAILED DESCRIPTION

[0016] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0017] The embodiments of the present application disclose a diode structure that is easy to weld and a production process thereof.

[0018] The diode structure convenient for welding includes a tube core, a tube shell and two electrodes, wherein the two electrodes are formed on the tube core and the two electrodes extend into the tube shell. Figures 1 to 4 The tube shell includes a top connector 10, a middle connector 20 and a bottom connector 30, and two ends of the middle connector 20 are fixedly connected to the opposite sides of the top connector 10 and the bottom connector 30 respectively.

[0019] In this embodiment, the top connector 10 may include an annular plate 11, a skirt 12, and a positioning area 13. The lower surface of the annular plate 11 is in close contact with the top of the middle connector 20, the skirt 12 is formed on the top of the annular plate 11 and is located outside the cavity of the annular plate 11, and the top connector 10 is used to cover the top opening of the middle connector 20. The inner cavity of the skirt 12 forms the positioning area 13.

[0020] In this embodiment, the middle connecting member 20 can be made of ceramic material and has a ring-shaped structure.

[0021] In this embodiment, the bottom connector 30 may include a substrate 31, a convex column 32, and a bottom column 33. The upper surface of the substrate 31 is in contact with the bottom of the middle connector 20, the convex column 32 is formed at the top center of the substrate 31 and extends into the bottom of the middle connector 20, and the convex column 32 is formed at the bottom center of the substrate 31 and protrudes downward. The substrate 31 separates the bottom of the inner cavity of the middle connector 20 to form a weld 40 for welding with the electrode, and the top of the inner cavity of the middle connector 20 forms a placement cavity for mounting the die.

[0022] In this embodiment, the top connector 10 and the bottom connector 30 can be made of molybdenum copper or tungsten copper material to form an integral structure, and the outer walls of the top connector 10 and the bottom connector 30 can also be electroplated with a nickel layer and a gold layer in sequence.

[0023] In this embodiment, when the bottom connector 30 and the top connector 10 are made of molybdenum copper or tungsten copper to form an integral structure, they can be mixed with lubricants, plasticizers, sintering aids, non-metallic inclusion control agents, oxide additives, silicate additives, carbide additives, polymer thickeners, and hard particle thickeners to form a powder mixture, and then the powder mixture is formed into a desired shape by pressure molding or pressureless molding using a mold that matches the bottom connector 30 and the top connector 10.

[0024] Lubricants can include fatty acids, fatty acid salts, fatty acid esters, alcohols, amines, amides, and high molecular polymers. The friction between the metal powder and the mold will cause wear on the mold surface, which will in turn increase the wear and failure of the equipment. Lubricants can significantly reduce the friction and wear between the mold and the metal powder, thereby extending the service life of the mold. In addition, lubricants can form a coating on the surface of the metal powder and enhance the plastic deformation ability of the powder, which helps to form uniform compaction and deformation, thereby improving the forming quality of the workpiece. The use of lubricants can also avoid errors and irregular shapes of metal powders during the pressing process, thereby improving the surface quality and dimensional accuracy of the workpiece. Plasticizers can be high-boiling liquid compounds such as esters or low-melting solid organic compounds. Their main function is to change the rheological properties of the system so that it exhibits good forming properties in the plastic forming process.

[0025] Polymer thickeners can be polyvinyl alcohol or polymethacrylate, and polymer thickeners are used to improve the fluidity and compactness of powder mixtures. Plasticizer molecules can be inserted between binder polymer molecules to separate the binder component molecules, providing more space for the movement of binder molecules, that is, increasing the own volume, thereby reducing the various attractions between binder polymer molecules and improving the rheological properties of the system. By improving the rheological properties of the system, plasticizers can make it easier for metal powder mixtures to form the desired shape during pressurized or pressureless molding, thereby improving the forming performance. In addition, the use of plasticizers can also enhance the toughness of the material, making it better resistant to deformation and fracture during subsequent processing and use.

[0026] Sintering aids can be various inorganic and organic compounds, such as alkali metal oxides, alkaline earth metal oxides, halides, borides, carbides, and high molecular polymers. Sintering aids can reduce the melting point of powder metallurgy materials and make the sintering process easier. They can react with oxides on the surface of metal powders to form low-melting eutectics, thereby promoting the sintering reaction. Sintering aids can also improve the performance of materials by refining grains, reducing porosity, and increasing densification.

[0027] Non-metallic inclusion control agents can be various inorganic salts, oxides, sulfides and high molecular polymers. Their main function is to remove or reduce non-metallic inclusions in metal powders. Non-metallic inclusion control agents can remove non-metallic inclusions such as oxides and sulfides in metal powders by chemical reaction or physical adsorption, thereby improving the purity of the material and thus improving its physical and mechanical properties.

[0028] Oxide additives can be various metal oxides and non-metal oxides, such as aluminum oxide, copper oxide, zinc oxide, magnesium oxide, etc. They can react with metal powder to form solid solutions or compounds, thereby improving the properties of the material. Oxide additives can serve as the core of heterogeneous nucleation, promote the nucleation and growth process of metal powder during sintering, thereby refining the grains, and improve the hardness of the material by refining the grains and reducing the porosity.

[0029] Silicate additives can be various silicate minerals and synthetic silicate compounds, such as sodium silicate, calcium silicate, aluminum silicate, etc. They can react with metal powder to form silicate compounds or glass phases, thereby improving the performance of the material. Silicate additives can promote the densification process of metal powder during sintering, reduce porosity, increase the densification degree of the material, and make it have better fracture resistance and heat resistance during use.

[0030] Carbide additives can adopt various metal carbides and non-metal carbides, such as silicon carbide, tungsten carbide, titanium carbide, etc. They can improve the performance of the material by reacting with metal powder to form carbide compounds or reinforcement phases.

[0031] Hard particle thickeners can be silicon carbide, diamond, etc., which can improve the hardness and wear resistance of the product and make the product more durable.

[0032] When the nickel-plated layer and the gold-plated layer on the outer surface of the bottom connector 30 and the top connector 10 are electroplated, a zoned electroplating method is adopted and different electroplating parameters are set for each area to achieve different thicknesses of the plating. The zoned electroplating method is adopted to form the plating in order to compare the size measurement results of the bottom connector 30 and the top connector 10 after forming with the design size, and then divide the top connector 10 and the bottom connector 30 into zones according to the error between the actual forming and the design size, and use the coating settings of different thicknesses in different zones, so that the bottom connector 30 and the top connector 10 can have more accurate production control after being manufactured. When the zoned electroplating is performed, a mask can be applied to the areas that are not electroplated to prevent the deposition of the plating solution on these areas.

[0033] After marking each area, determine the electroplating parameters for each area, including current density, electroplating time, and electroplating solution composition. In the partition electroplating process, the electroplating thickness calculation formula is as follows: σ = t × D × η × K; in: σ is the coating thickness (μm); t is the electroplating time (min); D is the current density (A / dm²); η is the current efficiency; K is the electrochemical equivalent (g / Ah), which represents the amount of electricity required to dissolve 1g of any substance at the anode or precipitate 1g at the cathode.

[0034] The production process of a diode structure that is easy to weld includes the following steps: Step 1: Connecting the middle connecting member 20 and the bottom connecting member 30 .

[0035] First, the middle connector 20 and the bottom connector 30 are connected into an integrated structure by resistance welding. Resistance welding is a method that uses the resistance heat effect generated by the current passing through the contact surface and the adjacent area of ​​the two workpieces to heat them to a molten or plastic state to form a metal bond. This welding method has the advantages of fast welding speed, good welding quality, and simple operation, and is very suitable for the production and processing of the diode structure.

[0036] During the connection process, parameters such as welding current, welding time and welding pressure need to be strictly controlled to ensure the formation quality and stability of the weld 40. At the same time, the weld 40 needs to be inspected and tested as necessary to ensure that it meets the design requirements.

[0037] Step 2: Placement of die and insertion of electrodes.

[0038] The tube core with two electrodes is placed into the integrated structure consisting of the middle connector 20 and the bottom connector 30 obtained in step 1. During the placement process, it is necessary to ensure that the tube core is positioned accurately and the electrodes are well aligned with the weld 40. Then, the two electrodes are inserted into the weld 40 to prepare for the subsequent welding process.

[0039] Step 3: Filling with solder and welding of electrodes.

[0040] Solder is filled in the gap of the weld 40. Solder is a metal or alloy material that can reduce the melting temperature of the material to be welded and form a good weld. When filling the solder, it is necessary to control parameters such as the type, quantity and filling method of the solder to ensure the smooth progress of the welding process and the stability of the welding quality.

[0041] Then, the two electrodes are welded and fixed in the tube shell by brazing. Brazing is a welding method that uses a brazing material with a lower melting point than the base material as a filler metal, heats the weldment and the brazing material to a temperature higher than the melting point of the brazing material but lower than the melting point of the base material, and uses the liquid brazing material to wet the surface of the base material and fill the joint gap to diffuse with the base material to achieve connection. This welding method has the advantages of low welding temperature, little impact on the base material, and smooth and flat welded joints.

[0042] During the welding process, parameters such as welding temperature, welding time and welding atmosphere need to be strictly controlled to ensure welding quality and electrode stability. At the same time, necessary inspections and tests are also required on the welded joints to ensure that they meet the design requirements.

[0043] Step 4: Soldering of the top connector 10 and capping of the die.

[0044] The top connector 10 is integrated with the middle connector 20 and the bottom connector 30 obtained in step 1 to form a complete tube shell by resistance welding. During the welding process, it is necessary to ensure that the connection between the top connector 10 and the middle connector 20 and the bottom connector 30 is firm and the weld quality is good.

[0045] Then, the tube die is capped with the top connector 10. During the capping process, it is necessary to ensure that the gap between the top connector 10 and the tube die is appropriate. At the same time, it is also necessary to perform necessary inspections and tests on the capped diode to ensure that it meets the design requirements and usage requirements.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A diode structure that is easy to weld, comprising a tube core, a tube shell and two electrodes, wherein the two electrodes are formed on the tube core and extend into the tube shell, characterized in that: The tube shell comprises a top connecting piece (10), a middle connecting piece (20) and a bottom connecting piece (30), wherein two ends of the middle connecting piece (20) are respectively fixedly connected to opposite sides of the top connecting piece (10) and the bottom connecting piece (30). The bottom connecting member (30) comprises a base plate (31), a convex column (32) and a bottom column (33); the upper surface of the base plate (31) is in contact with the bottom of the middle connecting member (20); the convex column (32) is formed at the top center of the base plate (31) and extends into the bottom of the middle connecting member (20); the convex column (32) is formed at the bottom center of the base plate (31) and protrudes downward; The substrate (31) separates the bottom of the inner cavity of the middle connecting piece (20) to form a welding seam (40) for welding with the electrode, and the top of the inner cavity of the middle connecting piece (20) forms a placement cavity for installing the tube core.

2. A diode structure that is easy to weld according to claim 1, characterized in that: The top connecting piece (10) comprises an annular plate (11), a skirt (12) and a positioning area (13); the lower surface of the annular plate (11) is in close contact with the top of the middle connecting piece (20); the skirt (12) is formed on the top of the annular plate (11) and is located outside the cavity of the annular plate (11); the top connecting piece (10) is used to cover the top opening of the middle connecting piece (20); and the internal cavity of the skirt (12) forms the positioning area (13).

3. A diode structure that is easy to weld according to claim 2, characterized in that: The outer walls of the top connecting piece (10) and the bottom connecting piece (30) are both provided with a nickel-plated layer and a gold-plated layer.

4. A diode structure that is easy to weld according to claim 3, characterized in that: The middle connecting piece (20) is configured as a ceramic ring.

5. A process for producing a diode structure that is easy to weld according to any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1: Connect the middle connecting piece (20) and the bottom connecting piece (30) into an integrated structure by means of resistance welding; Step 2, placing the tube core provided with two electrodes into the integrated structure consisting of the middle connecting piece (20) and the bottom connecting piece (30) obtained in step 1, and inserting the two electrodes into the welding seam (40); Step 3, filling the gap of the welding seam (40) with solder, and using brazing to weld and fix the two electrodes in the tube shell; Step 4: The top connector (10), the middle connector (20) and the bottom connector (30) obtained in step 1 are integrated into a complete tube shell by resistance welding, and the tube core is sealed with the top connector (10).

6. The production process of a diode structure that is easy to weld according to claim 5, characterized in that: The bottom connector (30) and the top connector (10) are both made of molybdenum copper or tungsten copper mixed with a lubricant, a plasticizer, a sintering aid, a non-metallic inclusion control agent, an oxide additive, a silicate additive, a carbide additive, a polymer thickener, and a hard particle thickener to form a powder mixture, and the powder mixture is formed into a desired shape by pressure molding or pressureless molding using a mold that matches the bottom connector (30) and the top connector (10).

7. A process for producing a diode structure that is easy to weld according to claim 6, characterized in that: The polymer thickener is configured as polyvinyl alcohol or polymethacrylate, and the polymer thickener is used to improve the fluidity and compactability of the powder mixture.

8. A process for producing a diode structure that is easy to weld according to claim 6 or 7, characterized in that: When the nickel-plated layer and the gold-plated layer on the outer surfaces of the bottom connector (30) and the top connector (10) are electroplated to form the coating, a zoned electroplating method is adopted and different electroplating parameters are set for each zone to achieve coatings of different thicknesses.

9. A process for producing a diode structure that is easy to weld according to claim 8, characterized in that: The area division of the zoned electroplating is carried out by dividing the top connecting piece (10) and the bottom connecting piece (30) into zones according to the error between the actual molding and the designed dimensions.

10. The production process of a diode structure that is easy to weld according to claim 9, characterized in that: A mask is applied to the areas not to be plated in the zone electroplating to prevent the deposition of the plating solution on these areas.

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