Circuit board X-shaped hole machining control method, system and equipment and medium

Abstract

The invention discloses a circuit board X-shaped hole processing control method, system and device and a medium. The method comprises the following steps: acquiring a first image of a first surface blind hole after a preset depth h'is processed for the Nth time; acquiring first hole offset data according to the first image; according to the first hole offset data, first hole machining correction parameters are obtained so as to guide machining of the first face blind hole; acquiring a second image of the blind hole in the second surface after the preset depth h'is processed for the Nth time; acquiring second hole offset data according to the second image; according to the second hole offset data, second hole machining correction parameters are obtained so as to guide machining of a second face blind hole; the X-shaped hole detection method and device have the advantages that the hole machining quality can be effectively controlled, and the detection accuracy is high.

Description

Technical Field

[0001] The present application relates to the technical field of hole processing data, and in particular to a circuit board X-shaped hole processing control method, system, equipment and medium. Background Art

[0002] Current ELIC board technology is characterized by a large number of layers while providing thin and light circuit boards (i.e., PCB boards). Such boards have greatly improved the performance of the electronics industry and have become an integral part of the development of electronic devices. They have high performance and can provide multi-layer boards that are lightweight and small in size, thereby achieving high performance and reliability.

[0003] ELIC-based circuit board products need to be processed into relatively symmetrical X-shaped holes with a small middle and large sides. First, the first side of the board is blind-hole processed, and then the second side is turned over to process the blind holes. The blind holes on both sides are connected to form a through hole. The middle position of the hole is smaller, and finally an X-shaped hole is formed (such as Figure 2 As shown in the figure, since both the blind holes on the first side and the blind holes on the second side are tapered holes, the processing parameters need to be adjusted continuously during the processing, and processing errors are easily caused during the adjustment process, resulting in unqualified hole processing quality. The existing X-shaped hole processing method for circuit boards only performs hole processing quality inspection after the processing is completed. The hole processing quality is difficult to effectively control, and simple measuring tools are generally used for detection, and the detection accuracy is low. Summary of the invention

[0004] The main purpose of the present application is to provide a circuit board X-shaped hole processing control method, system, equipment and medium, aiming to solve the technical problem that the existing circuit board X-shaped hole processing method is difficult to effectively control the hole processing quality.

[0005] To achieve the above object, the present application provides a circuit board X-shaped hole processing control method, comprising the following steps: Acquire a first image of the first-side blind hole after the N-th processing of the preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the total depth of the first-side blind hole is h1, then h1=N*h'; According to the first image, first hole offset data is acquired; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to the current depth position; According to the first hole offset data, a first hole processing correction parameter is obtained to guide the processing of the first surface blind hole; Acquire a second image of the second-side blind hole after the N-th processing of the preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole is h2, h2=h1; According to the second image, second hole offset data is obtained; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to the current depth position; According to the second hole offset data, a second hole processing correction parameter is obtained to guide the processing of the blind hole on the second surface; The symmetry information of the blind holes on the first surface and the blind holes on the second surface is obtained, and whether the X-shaped hole is qualified is determined according to the symmetry information; wherein the X-shaped hole is a through hole composed of the blind holes on the first surface and the blind holes on the second surface.

[0006] Optionally, acquiring first hole offset data according to the first image includes: According to the first image, a large circle contour and a small circle contour are identified and extracted; wherein the large circle contour is a contour formed by the top large diameter end of the blind hole on the first surface, and the small circle contour is a contour formed by the bottom small diameter end of the blind hole on the first surface; Select multiple reference points on the contour of the great circle and construct multiple radius line segments; wherein the radius line segment is a line connecting the reference point to the center point of the contour of the great circle; Get the distance value from the intersection of each radius line segment and the small circle contour to the corresponding reference point; Compare the spacing value with the theoretical value to obtain the first hole offset data.

[0007] Optionally, comparing the spacing value with a theoretical value to obtain first hole offset data includes: Screening multiple interval values ​​to find the maximum and minimum values ​​among the multiple interval values; Obtain a first difference between the maximum value and the theoretical value, and obtain a second difference between the minimum value and the theoretical value; The larger value of the first difference value and the second difference value is output as the first hole offset data.

[0008] Optionally, after outputting the larger value of the first difference and the second difference as the first hole offset data, the method further includes: Determine whether the first hole offset data is greater than a preset offset allowable value; If so, a stop processing signal is obtained and an alarm message is sent; If not, proceed to the next step.

[0009] Optionally, obtaining symmetry information of the blind holes on the first surface and the blind holes on the second surface, and judging whether the X-shaped holes are qualified according to the symmetry information, includes: Acquire a third image of the first-side blind hole after processing and a fourth image of the second-side blind hole after processing; wherein the third image includes a first top hole contour and a coplanar circle contour corresponding to the first-side blind hole, and the fourth image includes a corresponding second top hole contour and a coplanar circle contour, and the coplanar circle contour is a circular contour formed by a common bottom hole of the first-side blind hole and the second-side blind hole after processing; Overlapping the coplanar circle contours in the third image and the fourth image to fuse the third image and the fourth image and obtain a fused image; Obtain an intersecting area S of the first top hole outline and the second top hole outline in the fused image; It is determined whether the interleaving area S is greater than a preset first threshold value. If so, the X-shaped hole is determined to be unqualified.

[0010] Optionally, if it is determined that the interleaving area S is not greater than a preset first threshold, the method further includes: Acquire a first depth image of the first-side blind hole and a second depth image of the second-side blind hole after processing; Based on the first depth image, multiple first measurement point coordinates are selected at different depth positions of the blind hole on the first surface and along the corresponding circular contour; Based on the second depth image, multiple second measurement point coordinates corresponding to the first measurement point coordinates are selected along the corresponding circular contour at the same depth position of the second-surface blind hole corresponding to the first-surface blind hole; Obtaining a coordinate difference between the coordinates of the second measurement point and the corresponding coordinates of the first measurement point; Filter out the coordinate difference with the largest value and output it as the eigenvalue ΔX; It is determined whether the characteristic value ΔX is greater than a preset second threshold value. If so, the X-shaped hole is determined to be unqualified.

[0011] Optionally, if it is determined that the characteristic value ΔX is not greater than a preset second threshold, the method further includes: According to the staggered area S and the characteristic value ΔX, the symmetry U of the blind holes on the first surface and the blind holes on the second surface is obtained. The expression of U is: U = U'-(K1*S+K2*ΔX); Wherein, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient; It is judged whether the symmetry U is greater than a preset third threshold value. If so, the X-shaped hole is judged to be unqualified; if not, the X-shaped hole is judged to be qualified.

[0012] To achieve the above purpose, the present application also provides a circuit board X-shaped hole processing control system, comprising: A first image acquisition module is used to acquire a first image of the first-side blind hole after the N-th processing of the preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and the total depth of the first-side blind hole is h1, then h1=N*h'; A first data acquisition module is used to acquire first hole offset data according to the first image; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to the current depth position; A first correction module, used for obtaining a first hole processing correction parameter according to the first hole offset data to guide the processing of the first surface blind hole; The second image acquisition module is used to acquire a second image of the second-side blind hole after the N-th processing of the preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole is h2, h2=h1; A second data acquisition module is used to acquire second hole offset data according to the second image; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to the current depth position; A second correction module, used for obtaining a second hole processing correction parameter according to the second hole offset data to guide the processing of the second surface blind hole; The inspection module is used to obtain the symmetry information of the blind holes on the first surface and the blind holes on the second surface, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein the X-shaped hole is a through hole composed of the blind holes on the first surface and the blind holes on the second surface.

[0013] To achieve the above objectives, the present application also provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above method.

[0014] To achieve the above objectives, the present application also provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0015] The beneficial effects that this application can achieve are as follows: When processing the blind hole on the first side, the present application can obtain a first image after each processing depth h', and the first image can reflect the contour features of the blind hole on the first side after processing to the corresponding depth, so that contour feature recognition can be performed to obtain the first hole offset data, that is, the first hole processing correction parameters for correcting the processing parameters can be obtained, and then the processing depth h' is continued to make the blind hole on the first side reach the next step depth. At this time, the first image is obtained again to obtain new first hole offset data and the corresponding first hole processing correction parameters, and the operation is repeated until the guided processing of the blind hole on the first side is completed. Then, when processing the blind hole on the second side, similarly, according to According to the above principle, a second image is acquired after each processing depth h', and finally the second hole processing correction parameters are obtained to guide the completion of the processing of the second side blind hole, and finally a formed X-shaped hole is obtained. Therefore, the present application performs image acquisition and analysis after each processing depth h' and obtains correction data, so as to continuously correct the hole processing parameters, which can effectively control the processing quality of the X-shaped hole, greatly reducing the risk of the final X-shaped hole being unqualified due to processing errors during the hole processing process, and after the processing is completed, the symmetry information of the blind hole on the first side and the blind hole on the second side is also detected, and whether the X-shaped hole is qualified is finally judged based on the symmetry information, thereby ensuring the processing quality of the X-shaped hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the prior art description. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0017] Figure 1 A schematic diagram of a process flow of a circuit board X-shaped hole processing control method in an embodiment of the present application; Figure 2 This is a schematic diagram of the pre-processing structure of the X-shaped hole of the circuit board in the embodiment of the present application; Figure 3 It is a schematic diagram of the principle of calculating multiple spacing values ​​based on the first image in an embodiment of the present application; Figure 4 This is a schematic diagram of the principle of fusing the third image and the fourth image and calculating the interleaving area S in the embodiment of the present application; Figure 5 This is a schematic diagram (top view) of selecting coordinates of multiple first measurement points based on the first depth image in an embodiment of the present application; Figure 6 A schematic diagram (top view) of selecting coordinates of multiple second measurement points based on the second depth image in an embodiment of the present application; Figure 7This is a schematic diagram of point position correspondence when selecting the coordinates of the first measuring point at different depth positions of the blind hole on the first surface and selecting the coordinates of the second measuring point at the corresponding depth position of the blind hole on the second surface in an embodiment of the present application (front view).

[0018] Reference numerals: 110 - first surface blind hole, 120 - second surface blind hole, 130 - large circle contour, 140 - small circle contour, 150 - radius line segment, 160 - first top hole contour, 170 - coplanar circle contour, 180 - second top hole contour.

[0019] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0024] Example 1: Reference Figure 1-Figure 7 This embodiment provides a circuit board X-shaped hole processing control method, comprising the following steps: Acquire a first image of the first-side blind hole 110 after the Nth processing to a preset depth h'; wherein the first-side blind hole 110 is a blind hole pre-processed on the first side of the target circuit board, and assuming that the total depth of the first-side blind hole 110 is ha, then h1=N*h'; According to the first image, first hole offset data is acquired; wherein the first hole offset data is hole position offset data when the first surface blind hole 110 is processed to the current depth position; According to the first hole offset data, a first hole processing correction parameter is obtained to guide the processing of the first-surface blind hole 110; Acquire a second image of the second-side blind hole 120 after the N-th processing to a preset depth h'; wherein the second-side blind hole 120 is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole 120 is h2, h2=h1; According to the second image, second hole offset data is obtained; wherein the second hole offset data is hole position offset data when the second surface blind hole 120 is processed to the current depth position; According to the second hole offset data, a second hole processing correction parameter is obtained to guide the processing of the second surface blind hole 120; The symmetry information of the first-side blind hole 110 and the second-side blind hole 120 is obtained, and whether the X-shaped hole is qualified is determined according to the symmetry information; wherein the X-shaped hole is a through hole formed by the first-side blind hole 110 and the second-side blind hole 120.

[0025] In this embodiment, when processing the first-side blind hole 110, a first image can be acquired after each processing depth h', and the first image can reflect the contour features of the first-side blind hole 110 after processing to the corresponding depth, so that contour feature recognition can be performed to obtain the first hole offset data, that is, the first hole processing correction parameter for correcting the processing parameter can be obtained, and then the processing depth h' is continued to make the first-side blind hole 110 reach the next step depth. At this time, the first image is acquired again to obtain new first hole offset data and the corresponding first hole processing correction parameter. For example, when the first processing is performed to the depth H1, H1=h', that is, the first image is acquired for detection, and then when the second processing is performed to the depth H2, H1=2h', the first image is acquired again for detection, and when the third processing is performed to the depth H3, H3=3h', the first image is acquired again for detection. , and so on, until the total depth h1 of the first blind hole 110 is processed for the last time, thereby completing the guided processing of the first blind hole 110, and then processing the second blind hole 120. Similarly, according to the above principle, a second image is obtained after each processing depth h', and finally the second hole processing correction parameters are obtained to guide the completion of the processing of the second blind hole 120, and finally a formed X-shaped hole is obtained. Therefore, this embodiment performs image acquisition and analysis based on each processing depth h' and obtains correction data, thereby continuously correcting the hole processing parameters, which can effectively control the processing quality of the X-shaped hole, greatly reducing the risk of the final X-shaped hole being unqualified due to processing errors during the hole processing process, and after the processing is completed, the symmetry information of the first blind hole 110 and the second blind hole 120 is also detected, and whether the X-shaped hole is qualified is finally judged according to the symmetry information, thereby ensuring the processing quality of the X-shaped hole.

[0026] As an optional implementation, acquiring first hole offset data according to the first image includes: According to the first image, a large circle contour 130 and a small circle contour 140 are identified and extracted; wherein the large circle contour 130 is a contour formed by the top large diameter end of the first-side blind hole 110, and the small circle contour 140 is a contour formed by the bottom small diameter end of the first-side blind hole 110; Select multiple reference points on the large circle contour 130 and construct multiple radius line segments 150; wherein the radius line segment 150 is a line connecting the reference point to the center point of the large circle contour 130; Obtain the distance value from the intersection point of each radius line segment 150 and the small circle contour 140 to the corresponding reference point; Compare the spacing value with the theoretical value to obtain the first hole offset data.

[0027] In this embodiment, when calculating the first hole offset data, the features of the large circle contour 130 formed at the top large diameter end of the first blind hole 110 and the features of the small circle contour 140 formed at the bottom small diameter end thereof can be identified and extracted according to the first image. Due to the influence of the processing error, the small circle contour 140 formed here is not necessarily circular, and most of them are elliptical or quasi-circular. Therefore, it is difficult to obtain the center of the small circle contour 140 to calculate the deviation from the center of the large circle contour 130 to obtain the offset data. Therefore, here, multiple radius line segments 150 corresponding to the large circle contour 130 are constructed, and the radius line segments 150 will all pass through the small circle contour 140 to form an intersection, and then the spacing value from the intersection to the corresponding reference point on the large circle contour 130 is calculated, such as Figure 3 As shown, multiple spacing values ​​d1, d2, d3, ..., dn can be obtained, and the spacing values ​​are compared with the theoretical values ​​(i.e., the distance between the intersection point and the corresponding reference point when the small circle contour 140 has no deviation), that is, a difference comparison is performed, so as to obtain accurate and effective first hole offset data.

[0028] As an optional implementation, comparing the spacing value with a theoretical value to obtain first hole offset data includes: Screening multiple interval values ​​to find the maximum and minimum values ​​among the multiple interval values; Obtain a first difference between the maximum value and the theoretical value, and obtain a second difference between the minimum value and the theoretical value; The larger value of the first difference value and the second difference value is output as the first hole offset data.

[0029] In this embodiment, since there are a lot of spacing value data, if the difference comparison with the theoretical value is performed for all of them, the calculation pressure is relatively large. Therefore, only the maximum value and the minimum value among the multiple spacing values ​​are screened out here to characterize the more representative degree of deviation. Then, the maximum value and the minimum value are respectively compared with the theoretical value to obtain the first difference and the second difference (both are absolute values). Finally, the larger value of the first difference and the second difference is output as the first hole deviation data. Finally, representative hole deviation data can be obtained, which provides accurate parameters for the correction of processing parameters to improve the hole processing quality.

[0030] As an optional implementation manner, after outputting the larger value of the first difference and the second difference as the first hole offset data, the method further includes: Determine whether the first hole offset data is greater than a preset offset allowable value; If so, a stop processing signal is obtained and an alarm message is sent; If not, proceed to the next step.

[0031] In this embodiment, after the first hole offset data is obtained, it is also compared with the offset allowable value. If it is greater than the offset allowable value, it means that the first-side blind hole 110 processed to the current depth has exceeded the processing quality requirements, that is, it is already an unqualified hole, so no further processing is required. Here, a stop processing signal can be obtained to control the processing equipment to stop processing, avoid invalid processing, reduce waste of processing time, and send an alarm message to notify the staff to scrap the current workpiece.

[0032] It should be noted that the specific steps of obtaining the second hole offset data according to the second image are the same as the implementation steps of obtaining the first hole offset data according to the first image, and will not be repeated here.

[0033] As an optional implementation, obtaining symmetry information of the first-side blind hole 110 and the second-side blind hole 120 and judging whether the X-shaped hole is qualified according to the symmetry information includes: Acquire a third image of the first-side blind hole 110 and a fourth image of the second-side blind hole 120 after processing; wherein the third image includes a first top hole contour 160 and a coplanar circle contour 170 corresponding to the first-side blind hole 110, and the fourth image includes a corresponding second top hole contour 180 and a coplanar circle contour 170, wherein the coplanar circle contour 170 is a circular contour formed by a common bottom hole of the first-side blind hole 110 and the second-side blind hole 120 after processing; Overlapping the coplanar circle contours 170 in the third image and the fourth image to fuse the third image and the fourth image to obtain a fused image; Obtaining an intersecting area S of the first top hole outline 160 and the second top hole outline 180 in the fused image; It is determined whether the interleaving area S is greater than a preset first threshold value. If so, the X-shaped hole is determined to be unqualified.

[0034] In this embodiment, when detecting the symmetry of the first-side blind hole 110 and the second-side blind hole 120, firstly obtain the third image of the first-side blind hole 110 and the fourth image of the second-side blind hole 120 after processing, respectively. At this time, the third image may include the first top hole contour 160 and the coplanar circular contour 170, and the fourth image may include the second top hole contour 180 and the coplanar circular contour 170. Since the two images have the coplanar circular contour 170 with the same characteristics, the coplanar circular contour 170 in the two images is overlapped here to fuse the third image and the fourth image to obtain a fused image, and the intersecting area S (such as the area of ​​the first top hole contour 160 and the second top hole contour 180 after fusion) is identified. Figure 4The area of ​​the shaded part in the middle), which can characterize the symmetry of the upper and lower top holes of the first blind hole 110 and the second blind hole 120. If S=0, it means that the first top hole contour 160 and the second top hole contour 180 also completely overlap and there is no offset. If S>0, it means that there is a certain upper and lower top hole offset, resulting in the first blind hole 110 and the second blind hole 120 being not symmetrical. However, considering a certain allowable error, a first threshold value can be set here, and the staggered area S is compared with the first threshold value. If the staggered area S is greater than the first threshold value, it means that the symmetry is poor, and the X-type hole can be judged as unqualified.

[0035] As an optional implementation manner, if it is determined that the interleaving area S is not greater than a preset first threshold, the method further includes: Acquire a first depth image of the first-side blind hole 110 and a second depth image of the second-side blind hole 120 after processing; Based on the first depth image, multiple first measurement point coordinates are selected at different depth positions of the first-surface blind hole 110 and along the corresponding circular contour; Based on the second depth image, multiple second measurement point coordinates corresponding to the first measurement point coordinates are selected along the corresponding circular contour at the same depth position of the second-surface blind hole 120 corresponding to the first-surface blind hole 110; Obtaining a coordinate difference between the coordinates of the second measurement point and the corresponding coordinates of the first measurement point; Filter out the coordinate difference with the largest value and output it as the eigenvalue ΔX; It is determined whether the characteristic value ΔX is greater than a preset second threshold value. If so, the X-shaped hole is determined to be unqualified.

[0036] In the present embodiment, if the interleaving area S is not greater than the preset first threshold value, there may be a situation where the first-side blind hole 110 and the second-side blind hole 120 are asymmetric at the same depth position due to error accumulation. Therefore, a first depth image corresponding to the first-side blind hole 110 and a second depth image corresponding to the second-side blind hole 120 are obtained respectively (which can be acquired based on a depth camera). Here, a reference coordinate system is constructed with the center of the plane where the coplanar bottom holes of the first-side blind hole 110 and the second-side blind hole 120 are located as the origin, the horizontal axis is the x-axis, and the vertical axis is the y-axis. Then, based on the first depth image and the second depth image, a plurality of first measurement point coordinates are selected at different depth positions of the first-side blind hole 110 and along the corresponding circular contour. For example, the coordinates of the plurality of first measurement points selected at the first layer depth position are respectively recorded as a1(x1, y1), a1(x2, y2), a1(x3, y3), ..., a1(x n ,y n ), select a plurality of first measurement points at the second depth position and record their coordinates as b1(x1,y1), b1(x2,y2), b1(x3,y3), ..., b1(x n ,y n), and so on. Similarly, when selecting the coordinates of the second measuring point on the second blind hole 120, the coordinates are selected at the same first layer depth position as the first blind hole 110, and are respectively recorded as a2(x1,y1), a2(x2,y2), a2(x3,y3), ..., a2(x n ,y n ), and a2(x n ,y n ) and a1(x n ,y n ) points correspond to each other, that is, the y-axis coordinates are the same, and the coordinates of the second measurement point selected at the second depth position are b2(x1,y1), b2(x2,y2), b2(x3,y3), ..., b2(x n ,y n ), and then compare the difference values ​​of the same point. Since the y-axis coordinates of the same point are equal, the x-axis coordinate difference comparison is performed, thereby obtaining multiple coordinate difference values, and the coordinate difference value with the largest value is output as the characteristic value ΔX, which characterizes the maximum degree of asymmetry between the first-side blind hole 110 and the second-side blind hole 120 at the same depth position. Finally, the characteristic value ΔX is compared with the second threshold value. If it exceeds the second threshold value, it means that the symmetry is unqualified, and the X-type hole can be judged as unqualified, thereby realizing the online detection of the symmetry of the X-type hole, without the help of manual measurement tools, reducing the human measurement error, and improving the detection accuracy.

[0037] As an optional implementation manner, if it is determined that the characteristic value ΔX is not greater than a preset second threshold, the method further includes: According to the staggered area S and the characteristic value ΔX, the symmetry U of the first blind hole 110 and the second blind hole 120 is obtained, and the expression of U is: U = U'-(K1*S+K2*ΔX); Wherein, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient; It is judged whether the symmetry U is greater than a preset third threshold value. If so, the X-shaped hole is judged to be unqualified; if not, the X-shaped hole is judged to be qualified.

[0038] In this embodiment, if both the staggered area S and the characteristic value ΔX meet the qualified standard, due to the existence of the allowable error, the synergistic effect of the two parameters may have a certain impact on the quality of the X-type hole. Therefore, the calculation of the symmetry U is also introduced here, and the staggered area S and the characteristic value ΔX are taken into account. Since the staggered area S and the characteristic value ΔX are parameters of different unit magnitudes, the first adjustment coefficient K1 and the second adjustment coefficient K2 are respectively converted and adjusted here so that the two parameters can be superimposed on each other. The larger the staggered area S and the characteristic value ΔX, the worse the symmetry, that is, the smaller the value of the symmetry U. If the staggered area S and the characteristic value ΔX are both 0, it means that the first side blind hole 110 and the second side blind hole 120 are completely symmetrical. Similarly, under certain error tolerance conditions, a third threshold is set here. If the symmetry U exceeds the third threshold, the X-type hole is finally judged to be unqualified. Otherwise, the X-type hole can be judged to be qualified, thereby further improving the symmetry quality detection of the X-type hole, ensuring the quality of the final formed X-type hole, and thus improving the quality of the circuit board product.

[0039] Example 2: Reference Figure 1-Figure 2 Based on the same inventive concept as the above-mentioned embodiment, this embodiment also provides a circuit board X-shaped hole processing control system, including: The first image acquisition module is used to acquire a first image of the first-side blind hole 110 after the N-th processing to a preset depth h'; wherein the first-side blind hole 110 is a blind hole pre-processed on the first side of the target circuit board, and the total depth of the first-side blind hole 110 is h1, then h1=N*h'; A first data acquisition module is used to acquire first hole offset data according to the first image; wherein the first hole offset data is hole position offset data when the first surface blind hole 110 is processed to the current depth position; A first correction module, used to obtain a first hole processing correction parameter according to the first hole offset data to guide the processing of the first-side blind hole 110; The second image acquisition module is used to acquire a second image of the second-side blind hole 120 after the N-th processing to a preset depth h'; wherein the second-side blind hole 120 is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole 120 is h2, h2=h1; A second data acquisition module is used to acquire second hole offset data according to the second image; wherein the second hole offset data is hole position offset data when the second surface blind hole 120 is processed to the current depth position; A second correction module, used to obtain a second hole processing correction parameter according to the second hole offset data to guide the processing of the second surface blind hole 120; The inspection module is used to obtain the symmetry information of the first-side blind hole 110 and the second-side blind hole 120, and determine whether the X-shaped hole is qualified according to the symmetry information; wherein the X-shaped hole is a through hole composed of the first-side blind hole 110 and the second-side blind hole 120.

[0040] The relevant explanations and examples of each module in the device of this embodiment can refer to the method of the aforementioned embodiment, and will not be repeated here.

[0041] Embodiment 3: Based on the same inventive concept as the above embodiment, this embodiment provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above method.

[0042] Embodiment 4: Based on the same inventive concept as the above-mentioned embodiment, this embodiment provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above-mentioned method.

[0043] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board X-shaped hole processing control method, characterized in that: The following steps are involved: Acquire a first image of the first-side blind hole after the N-th processing of the preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the total depth of the first-side blind hole is h1, then h1=N*h'; According to the first image, first hole offset data is acquired; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to a current depth position; Obtaining a first hole processing correction parameter according to the first hole offset data to guide the processing of the first-face blind hole; Acquire a second image of the second-side blind hole after the N-th processing of the preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole is h2, h2=h1; According to the second image, second hole offset data is acquired; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to the current depth position; According to the second hole offset data, obtaining a second hole processing correction parameter to guide the processing of the second surface blind hole; The symmetry information of the first-surface blind holes and the second-surface blind holes is obtained, and whether the X-shaped holes are qualified is determined according to the symmetry information; wherein the X-shaped holes are through holes formed by the first-surface blind holes and the second-surface blind holes.

2. A circuit board X-shaped hole processing control method as claimed in claim 1, characterized in that: The step of acquiring first hole offset data according to the first image includes: According to the first image, a large circle contour and a small circle contour are identified and extracted; wherein the large circle contour is a contour formed by the top large diameter end of the blind hole in the first surface, and the small circle contour is a contour formed by the bottom small diameter end of the blind hole in the first surface; Select multiple reference points on the outline of the large circle and construct multiple radius line segments; wherein the radius line segment is a line connecting the reference point to the center point of the outline of the large circle; Obtaining the distance value from the intersection point of each of the radius line segments and the small circle contour to the corresponding reference point; The spacing value is compared with a theoretical value to obtain first hole offset data.

3. A circuit board X-shaped hole processing control method as claimed in claim 2, characterized in that: The step of comparing the spacing value with a theoretical value to obtain first hole offset data comprises: Screening the plurality of spacing values ​​to screen out the maximum value and the minimum value among the plurality of spacing values; Obtain a first difference between the maximum value and the theoretical value, and obtain a second difference between the minimum value and the theoretical value; A larger value of the first difference value and the second difference value is output as first hole offset data.

4. A circuit board X-shaped hole processing control method as claimed in claim 3, characterized in that: After outputting the larger value of the first difference and the second difference as the first hole offset data, the method further includes: Determining whether the first hole offset data is greater than a preset offset allowable value; If so, a stop processing signal is obtained and an alarm message is sent; If not, proceed to the next step.

5. A circuit board X-shaped hole processing control method as claimed in any one of claims 1 to 4, characterized in that: The obtaining symmetry information of the first-side blind hole and the second-side blind hole, and judging whether the X-shaped hole is qualified according to the symmetry information, comprises: Acquire a third image of the first-surface blind hole after processing and a fourth image of the second-surface blind hole; wherein the third image includes a first top hole contour and a coplanar circle contour corresponding to the first-surface blind hole, and the fourth image includes a corresponding second top hole contour and a coplanar circle contour, and the coplanar circle contour is a circular contour formed by a common bottom hole of the first-surface blind hole and the second-surface blind hole after processing; Overlapping the coplanar circle contours in the third image and the fourth image to fuse the third image and the fourth image to obtain a fused image; Acquire an intersecting area S of the first top hole outline and the second top hole outline in the fused image; It is determined whether the interleaving area S is greater than a preset first threshold value. If so, the X-shaped hole is determined to be unqualified.

6. A circuit board X-shaped hole processing control method as claimed in claim 5, characterized in that: If it is determined that the interleaving area S is not greater than a preset first threshold, the method further includes: Acquire a first depth image of the first-side blind hole and a second depth image of the second-side blind hole after processing; Based on the first depth image, selecting a plurality of first measurement point coordinates at different depth positions of the blind hole on the first surface and along the corresponding circular contour; Based on the second depth image, selecting a plurality of second measurement point coordinates corresponding one-to-one to the first measurement point coordinates at the same depth position of the second-side blind hole corresponding to the first-side blind hole and along the corresponding circular contour; Obtaining a coordinate difference between the coordinates of the second measurement point and the corresponding coordinates of the first measurement point; Filter out the coordinate difference with the largest value and output it as the characteristic value ΔX; It is determined whether the characteristic value ΔX is greater than a preset second threshold value. If so, it is determined that the X-shaped hole is unqualified.

7. A circuit board X-shaped hole processing control method as claimed in claim 6, characterized in that: If it is determined that the characteristic value ΔX is not greater than a preset second threshold, the method further includes: According to the staggered area S and the characteristic value ΔX, the symmetry U of the first-side blind hole and the second-side blind hole is obtained, and the expression of U is: U = U'-(K1*S+K2*ΔX); Wherein, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient; It is determined whether the symmetry U is greater than a preset third threshold value. If so, the X-shaped hole is determined to be unqualified; if not, the X-shaped hole is determined to be qualified.

8. A circuit board X-shaped hole processing control system, characterized in that: include: A first image acquisition module is used to acquire a first image of the first-side blind hole after the N-th processing to a preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the total depth of the first-side blind hole is h1, then h1=N*h'; A first data acquisition module is used to acquire first hole offset data according to the first image; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to a current depth position; A first correction module, used for obtaining a first hole processing correction parameter according to the first hole offset data to guide the processing of the first-face blind hole; A second image acquisition module is used to acquire a second image of the second-side blind hole after the N-th processing of the preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the total depth of the second-side blind hole is h2, h2=h1; A second data acquisition module is used to acquire second hole offset data according to the second image; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to a current depth position; A second correction module, used for obtaining a second hole processing correction parameter according to the second hole offset data, so as to guide the processing of the second-surface blind hole; The inspection module is used to obtain the symmetry information of the blind holes on the first surface and the blind holes on the second surface, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein the X-shaped hole is a through hole formed by the blind holes on the first surface and the blind holes on the second surface.

9. A computer device, characterized in that: The computer device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement a circuit board X-shaped hole processing control method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the processor executes the computer program to implement a circuit board X-shaped hole processing control method as described in any one of claims 1-7.

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