Method, system and equipment for controlling electroplating copper thickness of counter-pressing plate and medium

Abstract

The invention discloses a counter-pressing plate electroplating copper thickness control method, system and device and a medium. The method comprises the following steps that a depth image of a target electroplating hole in a target counter-pressing plate is obtained; according to the depth image, obtaining the measurement depth h of the target electroplating hole so as to obtain the measurement thickness h'of the electroplating copper layer; judging whether the measured thickness h'is within a preset theoretical thickness range or not; wherein the theoretical thickness is a range value; if not, acquiring copper thickness compensation data of the electroplating copper layer, and returning to acquiring the depth image of the target electroplating hole in the target counter-pressing plate until the measured thickness h'is within the theoretical thickness range; if yes, obtaining the thickness uniformity of the electroplating copper layer; judging whether the thickness uniformity meets a qualified standard or not; if not, acquiring copper thickness adjustment data of the electroplating copper layer, and returning to acquiring the thickness uniformity of the electroplating copper layer until the thickness uniformity meets the qualified standard; the method has the advantage that the control accuracy of the copper thickness of the pressing plate is improved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB electroplating process data processing, and in particular to a method, system, equipment and medium for controlling the thickness of electroplated copper on a pressure plate. Background Art

[0002] As the frequency of the working environment of optical module products becomes higher and higher, the impedance tolerance of optical module products becomes more and more stringent, and the stacking design space becomes narrower and more complex (such as combined pressing, mechanical half-hole buried hole grounding, etc.). How to improve the copper thickness quality of the PCB board before the pattern transfer to improve the stability control of the impedance during the subsequent pattern transfer production has become a problem encountered by the industry.

[0003] At present, the traditional copper thickness control of the pressing plate requires multiple copper plating, micro-etching and grinding from material cutting to pattern transfer, which is seriously unfavorable to the copper thickness control on the PCB copper foil. In the traditional process, the copper thickness R value from material cutting to pattern transfer will probably exceed 0.4mil, and this copper thickness R value is not conducive to impedance control at all. Therefore, the copper thickness of the pressing plate needs to be strictly controlled during the PCB manufacturing process. The existing copper thickness control method of the pressing plate has low accuracy and large measurement error, which affects product quality. Summary of the invention

[0004] The main purpose of the present application is to provide a method, system, equipment and medium for controlling the thickness of electroplated copper on a pressure plate, aiming to solve the technical problem of low precision of the existing method for controlling the thickness of copper on a pressure plate.

[0005] To achieve the above object, the present application provides a method for controlling the thickness of electroplated copper on a pressure plate, comprising the following steps: Acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form a target electroplated hole; According to the depth image, the measured depth h of the target electroplated hole is obtained to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; Determine whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; If not, the copper thickness compensation data of the electroplated copper layer is obtained, and the process returns to obtaining the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, the thickness uniformity of the electroplated copper layer is obtained; Determine whether the thickness uniformity meets the qualified standards; If not, the copper thickness adjustment data of the electroplated copper layer is obtained, and the process returns to obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, the process ends.

[0006] Optionally, obtaining the thickness uniformity of the electroplated copper layer includes: Extracting a target area in the depth image; wherein the target area is the area where the target electroplating hole is located; Divide the target area into grids to obtain multiple areas to be tested; Obtain the detection thickness H' of the electroplated copper layer corresponding to each area to be tested; Filter out the maximum value H' among multiple detected thicknesses H' max and minimum value H' min ; According to the maximum value H' max and minimum value H' max , to obtain the thickness uniformity of the electroplated copper layer.

[0007] Optionally, let the thickness uniformity be Q, and the expression of Q is: Q=K / (H' max -H' max ); Where K is the adjustment coefficient.

[0008] Optionally, obtaining the detection thickness H' of the electroplated copper layer corresponding to each area to be tested includes: Selecting a plurality of initial measurement points distributed in a rectangular array in the area to be measured; According to the initial measurement point, the highest measurement point and the lowest measurement point in the area to be measured are obtained; wherein the highest measurement point is the initial measurement point closest to the top surface of the dry film layer in the area to be measured, and the lowest measurement point is the initial measurement point farthest from the top surface of the dry film layer in the area to be measured; Obtain a first distance value d1 from the highest measuring point to the top surface of the dry film layer and a second distance value d2 from the lowest measuring point to the top surface of the dry film layer in each area to be measured; According to the first spacing value d1 and the second spacing value d2, the first detection thickness H1' and the second detection thickness H2' are obtained; wherein H1'=H-d1, H2'=H-d2.

[0009] Optionally, obtaining the highest measurement point and the lowest measurement point in the area to be measured according to the initial measurement point includes: Obtain the depth value of each initial measurement point, and select the candidate highest point with the smallest depth value and the candidate lowest point with the largest depth value among the initial measurement points; Constructing a first area circle with the candidate highest point as the center; wherein the radius of the first area circle is less than or equal to half of the distance between adjacent initial measurement points; Selecting a plurality of first candidate measurement points within the first area circle; Determine whether there is a first candidate measurement point that meets the first condition in the first area circle. If not, output the candidate highest point as the highest measurement point. If yes, output the first candidate measurement point with the smallest depth value as the candidate highest point, and return to construct a first area circle with the candidate highest point as the center. The first condition is that the depth value of the first candidate measurement point is less than the depth value of the candidate highest point. Constructing a second area circle with the alternative lowest point as the center; wherein the radius of the second area circle is less than or equal to half of the distance between adjacent initial measurement points; Selecting a plurality of second candidate measurement points within the second area circle; Determine whether there is a second candidate measurement point that meets the second condition within the second area circle. If not, output the candidate lowest point as the lowest measurement point. If yes, output the second candidate measurement point with the largest depth value as the candidate lowest point, and return to construct a second area circle with the candidate lowest point as the center. The second condition is that the depth value of the second candidate measurement point is greater than the depth value of the candidate lowest point.

[0010] Optionally, the copper thickness compensation data includes copper increase compensation data and copper reduction compensation data; Obtain copper thickness compensation data for electroplated copper layers, including: If the measured thickness h' is greater than the theoretical thickness, a first difference between the measured thickness h' and the standard thickness value is obtained, and the first difference is output as copper reduction compensation data; wherein the standard thickness value is the middle value of the theoretical thickness; If the measured thickness h' is less than the theoretical thickness, a second difference between the measured thickness h' and the standard thickness value is obtained, and the second difference is output as copper addition compensation data.

[0011] Optionally, the copper thickness adjustment data includes copper increase adjustment data and copper reduction adjustment data; Obtain copper thickness adjustment data for electroplated copper layers, including: If the measured thickness h' is greater than the standard thickness value, a third difference between the measured thickness h' and the standard thickness value is obtained, and the third difference is output as copper reduction adjustment data; If the measured thickness h' is less than the standard thickness value, a fourth difference between the measured thickness h' and the standard thickness value is obtained, and the fourth difference is output as copper addition adjustment data.

[0012] To achieve the above purpose, the present application also provides a control system for the thickness of electroplated copper on a pressing plate, comprising: An image acquisition module is used to acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate includes a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form a target electroplated hole; A data acquisition module is used to acquire the measured depth h of the target electroplated hole according to the depth image to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; The first judgment module is used to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; The first data processing module is used to obtain the copper thickness compensation data of the electroplated copper layer if no, and return to obtain the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if yes, obtain the thickness uniformity of the electroplated copper layer; The second judgment module is used to judge whether the thickness uniformity meets the qualified standard; The second data processing module is used to obtain the copper thickness adjustment data of the electroplated copper layer if no, and return to obtain the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, end.

[0013] To achieve the above objectives, the present application also provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above method.

[0014] To achieve the above objectives, the present application also provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0015] The beneficial effects that this application can achieve are as follows: The present application acquires a depth image of a target electroplated hole on a target pressure plate by acquisition. Since the depth image may contain information about the distance of each pixel from the camera, the measured depth h of the target electroplated hole may be acquired based on the depth image. Then, the measured thickness h' of the electroplated copper layer may be accurately calculated by subtracting the measured depth h from the known thickness H of the dry film layer. The present application is based on machine vision recognition technology and is more accurate and effective than traditional thickness gauge measurements. Then, it is determined whether the measured thickness h' is within a preset theoretical thickness range. If not, it is necessary to acquire copper thickness compensation data of the electroplated copper layer. The copper thickness compensation data may be used to guide the thickness increase or decrease processing technology of the electroplated copper layer. After the thickness of the electroplated copper layer is increased or decreased, the depth image of the target electroplated hole is acquired again. The measured thickness h' is calculated again until the measured thickness h' is within the theoretical thickness range, so that the thickness of the electroplated copper layer can be accurately controlled within the theoretical thickness range. Since the thickness uniformity of the electroplated copper layer is also one of the important indicators affecting product quality, it is also considered here to judge whether the thickness uniformity of the electroplated copper layer meets the qualified standards. If not, the copper thickness adjustment data of the electroplated copper layer is obtained. The copper thickness adjustment data can be used to guide the thickness fine-tuning processing technology of the electroplated copper layer. After adjustment, the thickness uniformity of the electroplated copper layer can be promoted. Then, the thickness uniformity of the electroplated copper layer is recalculated until the thickness uniformity meets the qualified standards. Therefore, the present application can achieve precise control of the thickness and uniformity of the electroplated copper layer based on the depth image, thereby greatly improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the prior art description. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0017] Figure 1 A schematic flow chart of a method for controlling the thickness of electroplated copper on a press plate in an embodiment of the present application; Figure 2 It is a schematic structural diagram of the target pressure plate in the embodiment of the present application; Figure 3 This is a schematic diagram of a target area after being divided into grids in an embodiment of the present application; Figure 4 This is a schematic diagram of the principle of selecting the highest measurement point and the lowest measurement point in the area to be measured in an embodiment of the present application; Figure 5 Schematic diagram of the principle of calculating the first spacing value d1 and the second spacing value d2 in the embodiment of the present application.

[0018] Reference numerals: 110-base layer, 120-substrate copper layer, 130-dry film layer, 140-electroplated copper layer, 150-target electroplated hole, 160-target area, 170-area to be measured, 180-initial measurement point, 190-alternative highest point, 210-alternative lowest point, 220-first area circle, 230-first alternative measurement point, 240-second area circle, 250-second alternative measurement point.

[0019] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application. Example 1

[0024] Reference Figure 1-Figure 5 This embodiment provides a method for controlling the thickness of electroplated copper on a pressure plate, comprising the following steps: Acquire a depth image of a target electroplated hole 150 on a target counter-pressed plate; wherein the target counter-pressed plate includes a base layer 110, a substrate copper layer 120 is disposed on the top surface of the base layer 110, a dry film layer 130 is disposed on the top surface of the substrate copper layer 120, a selectively plated hole is disposed in the dry film layer 130, and the selectively plated hole is filled with an electroplated copper layer 140, and the top surface of the electroplated copper layer 140 is lower than the top surface of the dry film layer 130, so as to form a target electroplated hole 150; According to the depth image, the measured depth h of the target electroplated hole 150 is obtained to obtain the measured thickness h' of the electroplated copper layer 140; wherein h'=Hh, H is the thickness of the dry film layer 130; Determine whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; If not, the copper thickness compensation data of the electroplated copper layer 140 is obtained, and the process returns to obtaining the depth image of the target electroplated hole 150 on the target counter-pressing plate until the measured thickness h' is within the theoretical thickness range; if so, the thickness uniformity of the electroplated copper layer 140 is obtained; Determine whether the thickness uniformity meets the qualified standards; If not, the copper thickness adjustment data of the electroplated copper layer 140 is obtained, and the process returns to obtaining the thickness uniformity of the electroplated copper layer 140 until the thickness uniformity meets the qualified standard; if yes, the process ends.

[0025] In this embodiment, a depth image of the target electroplated hole 150 on the target pressing plate is acquired. Since the depth image may contain the distance information of each pixel from the camera, the measured depth h of the target electroplated hole 150 may be acquired based on the depth image. Then, the measured depth h is subtracted from the known thickness H of the dry film layer 130 to accurately calculate the measured thickness h' of the electroplated copper layer 140. This embodiment is based on machine vision recognition technology and is more accurate and effective than traditional thickness gauge measurements. Then, it is determined whether the measured thickness h' is within a preset theoretical thickness range. If not, it is necessary to acquire copper thickness compensation data of the electroplated copper layer 140. The copper thickness compensation data may be used to guide the thickness increase or decrease processing technology (i.e., thickening or reducing processing) of the electroplated copper layer 140. After the thickness of the electroplated copper layer 140 is increased or decreased, the depth image of the target electroplated hole 150 is acquired again. For example, the measured thickness h' is calculated again until the measured thickness h' is within the theoretical thickness range, so that the thickness of the electroplated copper layer 140 can be accurately controlled within the theoretical thickness range. Since the thickness uniformity of the electroplated copper layer 140 is also one of the important indicators affecting product quality, it is also considered here to determine whether the thickness uniformity of the electroplated copper layer 140 meets the qualified standard. If not, the copper thickness adjustment data of the electroplated copper layer 140 is obtained. The copper thickness adjustment data can be used to guide the thickness fine-tuning process (i.e., thickening treatment or thickening treatment) of the electroplated copper layer 140. After adjustment, the thickness uniformity of the electroplated copper layer 140 can be promoted, and then the thickness uniformity of the electroplated copper layer 140 is recalculated until the thickness uniformity meets the qualified standard. Therefore, this embodiment can achieve precise control of the thickness and uniformity of the electroplated copper layer 140 based on the depth image, thereby greatly improving product quality.

[0026] As an optional implementation, obtaining the thickness uniformity of the electroplated copper layer 140 includes: Extracting a target area 160 in the depth image; wherein the target area 160 is the area where the target electroplating hole 150 is located; Divide the target area 160 into grids to obtain a plurality of test areas 170; Obtaining the detection thickness H' of the corresponding electroplated copper layer 140 in each test area 170; Filter out the maximum value H' among multiple detected thicknesses H' max and minimum value H' min ; According to the maximum value H' max and minimum value H' min , to obtain the thickness uniformity of the electroplated copper layer 140.

[0027] In this embodiment, when evaluating the thickness uniformity of the electroplated copper layer 140, the target area 160 corresponding to the target electroplated hole 150 can be extracted based on the depth image. In order to improve the detection accuracy, the target area 160 is divided into a grid to obtain a plurality of test areas 170, and then the detection thickness H' of the electroplated copper layer 140 corresponding to each test area 170 is calculated respectively, instead of directly roughly calculating the thickness of the electroplated copper layer 140 corresponding to the entire target area 160, and then screening out the maximum value H' among the plurality of detection thicknesses H' that best reflects the thickness fluctuation characteristics of the electroplated copper layer 140 max and minimum value H' min , and finally the thickness uniformity can be accurately calculated.

[0028] As an optional implementation, assuming that the thickness uniformity is Q, the expression of Q is: Q=K / (H' max- H' max ); Where K is the adjustment coefficient.

[0029] In this embodiment, the maximum value H' max and minimum value H' min The difference can reflect the thickness fluctuation of the electroplated copper layer 140. Here, an adjustment coefficient K is set to represent the difference (H' max- H' max ) and thickness uniformity Q, and the difference (H' max- H' max ) is set in inverse proportion to the thickness uniformity Q. Finally, the thickness uniformity Q with reference guidance can be calculated for subsequent numerical comparison. That is, the larger the value of thickness uniformity Q, the better the uniformity.

[0030] As an optional implementation, obtaining the detection thickness H' of the electroplated copper layer 140 corresponding to each test area 170 includes: Selecting a plurality of initial measurement points 180 distributed in a rectangular array in the area to be measured 170; According to the initial measurement point 180, the highest measurement point and the lowest measurement point in the test area 170 are obtained; wherein the highest measurement point is the initial measurement point 180 in the test area 170 that is closest to the top surface of the dry film layer 130, and the lowest measurement point is the initial measurement point 180 in the test area 170 that is farthest from the top surface of the dry film layer 130; Obtaining a first distance value d1 from the highest measuring point in each test area 170 to the top surface of the dry film layer 130 and a second distance value d2 from the lowest measuring point to the top surface of the dry film layer 130 ; According to the first spacing value d1 and the second spacing value d2, the first detection thickness H1' and the second detection thickness H2' are obtained; wherein H1'=H-d1, H2'=H-d2.

[0031] In this embodiment, when calculating the detection thickness H' of the electroplated copper layer 140 corresponding to each test area 170, since the thickness uniformity of the electroplated copper layer 140 can be reflected in the flatness of its upper surface, and there is also a certain degree of unevenness in the upper surface of each subdivided test area 170, the detection thickness H' here should include a first detection thickness H1' corresponding to the maximum thickness position and a second detection thickness H2' corresponding to the minimum thickness position. At the same time, in this embodiment, a plurality of initial measurement points 180 are uniformly selected in a rectangular array. The initial measurement point 180 can represent a pixel point, and the depth information of the depth image is used. The highest measurement point and the lowest measurement point in the initial measurement points 180 can be first screened out according to the depth information, and then the distances from the highest measurement point and the lowest measurement point to the top surface of the dry film layer 130 are calculated respectively to obtain the first distance value d1 and the second distance value d2, and the corresponding first detection thickness H1' and the second detection thickness H2' can be calculated. Since each of the areas to be measured 170 can calculate a first detection thickness H1' and a second detection thickness H2', multiple first detection thickness H1' and second detection thickness H2' data are finally formed, and finally the maximum value of the multiple first detection thicknesses H1' is screened out as the final H' max , select the minimum value among multiple second detection thicknesses H2' as the final H' min That is, the data reliability is strong and the calculation is accurate and effective.

[0032] As an optional implementation, obtaining the highest measurement point and the lowest measurement point in the area to be measured 170 according to the initial measurement point 180 includes: Obtaining the depth value of each initial measurement point 180, and screening out the candidate highest point 190 with the smallest depth value and the candidate lowest point 210 with the largest depth value among the initial measurement points 180; A first area circle 220 is constructed with the candidate highest point 190 as the center; wherein the radius of the first area circle 220 is less than or equal to half of the distance between adjacent initial measurement points 180; Selecting a plurality of first candidate measurement points 230 within the first area circle 220; Determine whether there is a first candidate measurement point 230 that meets the first condition within the first area circle 220. If not, output the candidate highest point 190 as the highest measurement point. If yes, output the first candidate measurement point 230 with the smallest depth value as the candidate highest point 190, and return to construct a first area circle 220 with the candidate highest point 190 as the center. The first condition is that the depth value of the first candidate measurement point 230 is less than the depth value of the candidate highest point 190. A second area circle 240 is constructed with the candidate lowest point 210 as the center; wherein the radius of the second area circle 240 is less than or equal to half of the distance between adjacent initial measurement points 180; Selecting a plurality of second candidate measurement points 250 within the second area circle 240; It is determined whether there is a second candidate measurement point 250 that meets the second condition within the second area circle 240. If not, the candidate lowest point 210 is output as the lowest measurement point. If yes, the second candidate measurement point 250 with the largest depth value is output as the candidate lowest point 210, and a second area circle 240 is constructed with the candidate lowest point 210 as the center. The second condition is that the depth value of the second candidate measurement point 250 is greater than the depth value of the candidate lowest point 210.

[0033] In this embodiment, since the corresponding pixel points in the initial measurement point 180 are not necessarily exactly the highest measurement point and the lowest measurement point, in order to improve the calculation accuracy here, the candidate highest point 190 with the smallest depth value and the candidate lowest point 210 with the largest depth value in the initial measurement point 180 can be screened as much as possible according to the depth value of each initial measurement point 180 (the larger the depth value, the lower the relative position of the pixel point). When searching for the highest measurement point, a first area circle 220 is first constructed with the candidate highest point 190 as the center. The first area circle 220 is a reasonable search range, and then multiple first candidate measurement points 230 are selected from the first area circle 220 to be compared with the candidate highest point 190. A depth value comparison is performed to determine whether there is a first candidate measurement point 230 that meets the first condition. If not, it means that the candidate highest point 190 already belongs to the ideal pixel point with the highest relative position. At this time, the candidate highest point 190 can be directly output as the highest measurement point. If it exists, the first candidate measurement point 230 with the smallest depth value is updated as the new candidate highest point 190, and then a first area circle 220 is reconstructed with the new candidate highest point 190 as the center until the highest measurement is found. Similarly, when finding the lowest measurement point, a second area circle 240 is constructed based on the above principle for searching, so that the ideal highest measurement point and the lowest measurement point can be accurately found to improve data accuracy.

[0034] As an optional implementation, the copper thickness compensation data includes copper increase compensation data and copper reduction compensation data; Obtaining copper thickness compensation data of the electroplated copper layer 140 includes: If the measured thickness h' is greater than the theoretical thickness, a first difference between the measured thickness h' and the standard thickness value is obtained, and the first difference is output as copper reduction compensation data; wherein the standard thickness value is the middle value of the theoretical thickness; If the measured thickness h' is less than the theoretical thickness, a second difference between the measured thickness h' and the standard thickness value is obtained, and the second difference is output as copper addition compensation data.

[0035] In this embodiment, according to the relationship between the measured thickness h' and the theoretical thickness, if the measured thickness h' is greater than the theoretical thickness, copper reduction treatment is required (the thickness of the electroplated copper layer 140 can be reduced by acid micro-etching). After the copper reduction treatment, the thickness of the electroplated copper layer 140 should be made to fit the most ideal standard thickness value as much as possible. Therefore, the first difference between the measured thickness h' and the standard thickness value is output as copper reduction compensation data to guide the copper reduction treatment process operation. Similarly, when the measured thickness h' is less than the theoretical thickness, copper increase treatment is required (i.e., copper plating is performed again to increase the thickness of the electroplated copper layer 140). The second difference between the measured thickness h' and the standard thickness value can be output as copper increase compensation data to guide the copper increase treatment process operation.

[0036] As an optional implementation manner, the copper thickness adjustment data includes copper increase adjustment data and copper reduction adjustment data; Obtaining copper thickness adjustment data of the electroplated copper layer 140 includes: If the measured thickness h' is greater than the standard thickness value, a third difference between the measured thickness h' and the standard thickness value is obtained, and the third difference is output as copper reduction adjustment data; If the measured thickness h' is less than the standard thickness value, a fourth difference between the measured thickness h' and the standard thickness value is obtained, and the fourth difference is output as copper addition adjustment data.

[0037] In this embodiment, when the thickness of the electroplated copper layer 140 needs to be adjusted, since the measured thickness h' is already within the theoretical thickness range at this time, the adjusted thickness is as close to the most ideal standard thickness value as possible. When the measured thickness h' is greater than the standard thickness value, the third difference between the measured thickness h' and the standard thickness value can be output as copper reduction adjustment data to guide the copper reduction processing operation. Similarly, when the measured thickness h' is less than the standard thickness value, the fourth difference between the measured thickness h' and the standard thickness value is output as copper increase adjustment data to guide the copper increase processing operation. Example 2

[0038] Reference Figure 1-Figure 2 Based on the same inventive concept as the above-mentioned embodiment, this embodiment further provides a control system for the thickness of electroplated copper on a pressure plate, comprising: An image acquisition module is used to acquire a depth image of a target electroplated hole 150 on a target counter-pressed plate; wherein the target counter-pressed plate includes a base layer 110, a substrate copper layer 120 is disposed on the top surface of the base layer 110, a dry film layer 130 is disposed on the top surface of the substrate copper layer 120, a selectively plated hole is disposed in the dry film layer 130, and the selectively plated hole is filled with an electroplated copper layer 140, and the top surface of the electroplated copper layer 140 is lower than the top surface of the dry film layer 130, so as to form a target electroplated hole 150; A data acquisition module, for acquiring a measured depth h of the target electroplated hole 150 according to the depth image, so as to obtain a measured thickness h' of the electroplated copper layer 140; wherein h'=Hh, H is the thickness of the dry film layer 130; The first judgment module is used to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; The first data processing module is used to obtain the copper thickness compensation data of the electroplated copper layer 140 if no, and return to obtain the depth image of the target electroplated hole 150 on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if yes, obtain the thickness uniformity of the electroplated copper layer 140; The second judgment module is used to judge whether the thickness uniformity meets the qualified standard; The second data processing module is used to obtain the copper thickness adjustment data of the electroplated copper layer 140 if no, and return to obtain the thickness uniformity of the electroplated copper layer 140 until the thickness uniformity meets the qualified standard; if yes, end.

[0039] The relevant explanations and examples of each module in the device of this embodiment can refer to the method of the aforementioned embodiment, and will not be repeated here. Example 3

[0040] Based on the same inventive concept as the above-mentioned embodiment, this embodiment provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-mentioned method. Example 4

[0041] Based on the same inventive concept as the aforementioned embodiment, this embodiment provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the aforementioned method.

[0042] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for controlling the thickness of electroplated copper on a pressing plate, characterized in that: The following steps are involved: Acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer, so as to form the target electroplated hole; According to the depth image, obtaining the measured depth h of the target electroplated hole to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; Determine whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; If not, then obtain the copper thickness compensation data of the electroplated copper layer, and return to the step of obtaining the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if so, then obtain the thickness uniformity of the electroplated copper layer; Determining whether the thickness uniformity meets the qualification standard; If not, the copper thickness adjustment data of the electroplated copper layer is obtained, and the process returns to the step of obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, the process ends.

2. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 1, characterized in that: The step of obtaining the thickness uniformity of the electroplated copper layer comprises: Extracting a target area in the depth image; wherein the target area is the area where the target electroplating hole is located; Dividing the target area into grids to obtain a plurality of areas to be tested; Obtaining a detection thickness H' of the electroplated copper layer corresponding to each of the areas to be tested; Filter out the maximum value H' among the multiple detected thicknesses H' max and minimum value H' min ; According to the maximum value H' max and the minimum value H' max , obtaining the thickness uniformity of the electroplated copper layer.

3. A method for controlling the thickness of electroplated copper on a pressure plate as claimed in claim 2, characterized in that The thickness uniformity is Q, and the expression of Q is: Q=K / (H' max -H' max ); Where K is the adjustment coefficient.

4. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 2 or 3, characterized in that: The step of obtaining the detected thickness H' of the electroplated copper layer corresponding to each of the tested areas comprises: Selecting a plurality of initial measurement points distributed in a rectangular array in the area to be measured; According to the initial measurement point, the highest measurement point and the lowest measurement point in the area to be measured are obtained; wherein the highest measurement point is the initial measurement point in the area to be measured that is closest to the top surface of the dry film layer, and the lowest measurement point is the initial measurement point in the area to be measured that is farthest from the top surface of the dry film layer; Obtaining a first distance value d1 from the highest measuring point to the top surface of the dry film layer and a second distance value d2 from the lowest measuring point to the top surface of the dry film layer in each of the areas to be measured; According to the first spacing value d1 and the second spacing value d2, a first detection thickness H1' and a second detection thickness H2' are obtained; wherein H1'=H-d1, H2'=H-d2.

5. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 4, characterized in that: The obtaining, according to the initial measurement point, the highest measurement point and the lowest measurement point in the area to be measured comprises: Obtaining the depth value of each of the initial measurement points, and screening out the candidate highest point with the smallest depth value and the candidate lowest point with the largest depth value among the initial measurement points; Constructing a first area circle with the candidate highest point as the center; wherein the radius of the first area circle is less than or equal to half of the distance between adjacent initial measurement points; Selecting a plurality of first candidate measurement points within the first area circle; Determine whether there is a first candidate measurement point that meets the first condition within the first area circle; if not, output the candidate highest point as the highest measurement point; if yes, output the first candidate measurement point with the smallest depth value as the candidate highest point, and return to the step of constructing a first area circle with the candidate highest point as the center; wherein the first condition is that the depth value of the first candidate measurement point is less than the depth value of the candidate highest point; Constructing a second area circle with the candidate lowest point as the center; wherein the radius of the second area circle is less than or equal to half of the distance between adjacent initial measurement points; Selecting a plurality of second candidate measurement points within the second area circle; Determine whether there is a second candidate measurement point that meets the second condition within the second area circle; if not, output the candidate lowest point as the lowest measurement point; if so, output the second candidate measurement point with the largest depth value as the candidate lowest point, and return to constructing a second area circle with the candidate lowest point as the center; wherein the second condition is that the depth value of the second candidate measurement point is greater than the depth value of the candidate lowest point.

6. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 1, characterized in that: The copper thickness compensation data includes copper increase compensation data and copper reduction compensation data; The step of obtaining the copper thickness compensation data of the electroplated copper layer comprises: If the measured thickness h' is greater than the theoretical thickness, a first difference between the measured thickness h' and the standard thickness value is obtained, and the first difference is output as the copper reduction compensation data; wherein the standard thickness value is the middle value of the theoretical thickness; If the measured thickness h' is less than the theoretical thickness, a second difference between the measured thickness h' and the standard thickness value is obtained, and the second difference is output as the copper increase compensation data.

7. A method for controlling the thickness of electroplated copper on a pressing plate as claimed in claim 6, characterized in that: The copper thickness adjustment data includes copper increase adjustment data and copper reduction adjustment data; The step of obtaining the copper thickness adjustment data of the electroplated copper layer comprises: If the measured thickness h' is greater than the standard thickness value, a third difference between the measured thickness h' and the standard thickness value is obtained, and the third difference is output as the copper reduction adjustment data; If the measured thickness h' is less than the standard thickness value, a fourth difference between the measured thickness h' and the standard thickness value is obtained, and the fourth difference is output as the copper addition adjustment data.

8. A control system for the thickness of electroplated copper on a pressure plate, characterized in that: include: An image acquisition module is used to acquire a depth image of a target electroplated hole on a target counter-pressing plate; wherein the target counter-pressing plate comprises a base layer, a substrate copper layer is disposed on the top surface of the base layer, a dry film layer is disposed on the top surface of the substrate copper layer, a selectively plated hole is disposed in the dry film layer, the selectively plated hole is filled with an electroplated copper layer, and the top surface of the electroplated copper layer is lower than the top surface of the dry film layer to form the target electroplated hole; A data acquisition module, used to acquire the measured depth h of the target electroplated hole according to the depth image, so as to obtain the measured thickness h' of the electroplated copper layer; wherein h'=Hh, H is the thickness of the dry film layer; A first judgment module is used to judge whether the measured thickness h' is within a preset theoretical thickness range; wherein the theoretical thickness is a range value; A first data processing module is used for obtaining the copper thickness compensation data of the electroplated copper layer if no, and returning to the acquisition of the depth image of the target electroplated hole on the target pressing plate until the measured thickness h' is within the theoretical thickness range; if yes, obtaining the thickness uniformity of the electroplated copper layer; A second judgment module is used to judge whether the thickness uniformity meets the qualification standard; The second data processing module is used for obtaining the copper thickness adjustment data of the electroplated copper layer if no, and returning to obtaining the thickness uniformity of the electroplated copper layer until the thickness uniformity meets the qualified standard; if yes, ending.

9. A computer device, characterized in that: The computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement a method for controlling the thickness of electroplated copper on a pressure plate as claimed in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the processor executes the computer program to implement a method for controlling the thickness of electroplated copper on a pressure plate according to any one of claims 1 to 7.

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