Miniature probe and monitoring equipment

Abstract

The invention discloses a miniature probe and monitoring equipment. The miniature probe comprises a shell, a PCB substrate, a middle carrier plate and a first sensor, a containing cavity and an opening communicated with the containing cavity are defined in the shell, the PCB substrate is arranged in the containing cavity, and a first bonding pad is arranged on the PCB substrate; the middle carrier plate is provided with a second bonding pad and a third bonding pad which are electrically connected with each other, and the middle carrier plate is attached to the PCB substrate, so that the first bonding pad and the second bonding pad are correspondingly welded; the first sensor is arranged in the containing cavity and provided with a first surface and a second surface which are opposite, the first surface can be exposed out of the opening, the second surface is provided with a fourth bonding pad, the first sensor is attached to the middle carrier plate, and the fourth bonding pad and the third bonding pad are correspondingly welded. The miniature probe is switched through the middle carrier plate instead of the existing metal lead, so that the problem that the metal lead is corroded is avoided.

Description

Technical Field

[0001] The present invention relates to the field of medical devices, and in particular to a miniature probe and monitoring equipment. Background Art

[0002] In clinical practice and medical research, the measurement of pressure and temperature in the human body plays a very important role. For example, during the treatment of critically ill patients, intracranial pressure, intracoronary pressure, renal artery pressure, etc. need to be directly measured through surgical intervention or implantation to obtain more accurate changes in subtle vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion location for measurement. Due to its small size, light weight and low energy consumption, micro-electromechanical system (MEMS) technology provides new possibilities for monitoring physiological parameters inside the human body.

[0003] Most existing miniature probes use metal leads to electrically connect the pressure sensor, temperature sensor and PCB substrate, and then use silicone to seal the probe end. However, since the probe end is immersed in blood for a long time, the blood will slowly penetrate the silicone and corrode the metal leads, causing the pressure sensor or temperature sensor to work abnormally. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a miniature probe, wherein the first sensor is packaged on an intermediate carrier through wafer-level packaging technology, and the intermediate carrier is used for switching to replace the existing metal leads, thereby avoiding the problem of corrosion of the metal leads.

[0005] The present invention also provides a monitoring device having the above-mentioned miniature probe.

[0006] The microprobe according to the first aspect of the present invention comprises:

[0007] A housing, wherein the housing defines a receiving cavity and an opening communicating with the receiving cavity;

[0008] A PCB substrate, the PCB substrate is disposed in the accommodating cavity, and the PCB substrate is provided with a first solder pad;

[0009] An intermediate carrier board, wherein the intermediate carrier board is provided with a second soldering pad and a third soldering pad electrically connected to each other, and the intermediate carrier board is arranged to be bonded to the PCB substrate so that the first soldering pad and the second soldering pad are correspondingly soldered;

[0010] A first sensor, wherein the first sensor is disposed in the accommodating cavity, the first sensor has a first surface and a second surface relative to each other, the first surface can be exposed by the opening, a fourth soldering pad is disposed on the second surface, the first sensor is attached to the intermediate carrier, and the fourth soldering pad is correspondingly soldered to the third soldering pad.

[0011] The micro probe according to the embodiment of the present invention has at least the following beneficial effects:

[0012] The microprobe of the present application replaces the wire bonding process in the prior art by switching the intermediate carrier, and the sensor and the intermediate carrier are attached and connected, thereby greatly reducing the possibility of the circuit being corroded by blood, thereby extending the working time of the microprobe in the human body, improving the working stability of the microprobe, and facilitating medical staff to obtain accurate physiological parameters. In addition, since the embodiment of the present application adopts the advanced 3D-Sip system packaging process (3D-System in Package, i.e., three-dimensional system-level packaging), it can realize automated packaging, greatly improving the production efficiency of the microprobe.

[0013] According to some embodiments of the present invention, the intermediate carrier is made of single crystal silicon or silicon dioxide material.

[0014] According to some embodiments of the present invention, the first sensor and the PCB substrate are respectively attached to two opposite surfaces of the intermediate carrier, the intermediate carrier is provided with a through hole, a conductive part is provided in the through hole, the second pad and the third pad are respectively provided at two ends of the through hole and are electrically connected through the conductive part.

[0015] According to some embodiments of the present invention, the first sensor and the PCB substrate are attached to the same surface of the intermediate carrier, the intermediate carrier is provided with a printed circuit, and the second pad and the third pad are connected through the printed circuit.

[0016] According to some embodiments of the present invention, the first sensor is a pressure sensor, and the microprobe further includes a temperature sensor, and the temperature sensor is communicatively connected to the pressure sensor.

[0017] According to some embodiments of the present invention, the pressure sensor is an absolute pressure sensor, and the absolute pressure sensor includes a first piezoresistor, a second piezoresistor, a third piezoresistor, and a fourth piezoresistor;

[0018] The first piezoresistor, the second piezoresistor, the third piezoresistor and the fourth piezoresistor are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure;

[0019] Alternatively, the first piezoresistor and the second piezoresistor are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure, and the third piezoresistor and the fourth piezoresistor are located on the intermediate carrier board or the PCB substrate.

[0020] According to some embodiments of the present invention, the temperature sensor is a chip-type thin-film resistor, which includes a substrate and a thermosensitive film, and the thermosensitive film is disposed on two opposite surfaces of the substrate.

[0021] According to some embodiments of the present invention, the micro probe further includes a conditioning chip, which is disposed on the intermediate carrier board and is communicatively connected to the pressure sensor and the temperature sensor, respectively.

[0022] According to some embodiments of the present invention, the accommodating cavity is filled with a first sealant and a second sealant, the second sealant covers at least a portion of the intermediate carrier and the PCB substrate to limit the movement of the intermediate carrier and the PCB substrate in the accommodating cavity, the first sealant covers the first sensor and separates the second sealant from the opening to prevent external liquid from contacting the second sealant.

[0023] The monitoring device according to the second aspect of the embodiment of the present invention includes the micro probe mentioned in the above embodiment.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 Schematic diagram of the structure of a micro probe according to an embodiment of the present invention;

[0027] Figure 2 A partial exploded schematic diagram of a micro probe according to an embodiment of the present invention;

[0028] Figure 3 is a schematic structural diagram of a first sensor according to an embodiment of the present invention;

[0029] Figure 4 A schematic diagram of welding of a micro probe according to an embodiment of the present invention;

[0030] Figure 5 FIG. 4 is another schematic diagram of the structure of the micro probe according to an embodiment of the present invention.

[0031] Reference numerals:

[0032] Housing 100; opening 110;

[0033] PCB substrate 200; first pad 210;

[0034] Intermediate carrier 300; second pad 310; third pad 320; through hole 330; printed circuit 340;

[0035] First sensor 400; first surface 410; second surface 420; fourth solder pad 421; solder ball 422;

[0036] Temperature sensor 500; substrate 510; thermal sensitive film 520;

[0037] Conditioning chip 600;

[0038] First sealant 700; second sealant 710; DETAILED DESCRIPTION

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0044] In clinical practice and medical research, the measurement of pressure and temperature in the human body plays a very important role. For example, during the treatment of critically ill patients, intracranial pressure, intracoronary pressure, renal artery pressure, etc. need to be directly measured through surgical intervention or implantation to obtain more accurate changes in subtle vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion location for measurement. Due to its small size, light weight and low energy consumption, micro-electromechanical system (MEMS) technology provides new possibilities for monitoring physiological parameters inside the human body.

[0045] Most existing miniature probes use metal leads to electrically connect the pressure sensor, temperature sensor and PCB substrate, and then use silicone to seal the probe end. However, since the probe end is immersed in blood for a long time, the blood will slowly penetrate the silicone and corrode the metal leads, causing the pressure sensor or temperature sensor to work abnormally.

[0046] In order to solve the problem that metal lead connections are easily corroded in the prior art, the present application proposes a miniature probe, such as Figures 1 to 4 As shown, the microprobe includes a housing 100, a PCB substrate 200, an intermediate carrier 300 and a first sensor 400. The housing 100 is a hollow tube, and a receiving cavity is defined inside the housing. The PCB substrate 200, the intermediate carrier 300 and the first sensor 400 are all arranged in the receiving cavity. An opening 110 is provided at one end of the housing 100 for extending into the human body, and the opening 110 is connected to the receiving cavity to expose the first sensor 400 in the receiving cavity. It can be understood that a shielding layer is provided on the housing 100, which can be used to shield external electromagnetic signals. The shielding layer can be provided on the cavity wall of the receiving cavity, or on the outer peripheral surface of the housing 100.

[0047] The PCB substrate 200 is disposed in the accommodating cavity. It should be noted that, considering the need for flexibility of the microprobe, the PCB substrate 200 is often made of flexible materials. For example, the PCB substrate 200 adopts a flexible circuit board structure and can be bent to a certain extent. It is understandable that flexible circuit boards are generally thinner and have relatively poor mechanical properties. The sensor in the prior art is directly welded on the flexible circuit board, which is prone to adverse effects on the zero drift and time drift of the sensor due to welding thermal stress, thereby affecting the product stability and production yield of the microprobe.

[0048] In the embodiment of the present application, the first sensor 400 is disposed on the intermediate carrier 300 and is switched through the intermediate carrier 300. Specifically, the intermediate carrier 300 is provided with a second soldering pad 310 and a third soldering pad 320 electrically connected to each other, and the second soldering pad 310 and the third soldering pad 320 are electrically connected. Figure 2 and Figure 4 As shown, the intermediate carrier 300 is arranged in affixed with the PCB substrate 200, and the PCB substrate 200 is provided with a first soldering pad 210, and the first soldering pad 210 and the second soldering pad 310 are in corresponding contact and electrically connected through a welding process. It should be noted that when the flexible PCB substrate 200 is welded to the intermediate carrier 300, there is no risk of welding thermal stress breaking through the first sensor 400.

[0049] The first sensor 400 may be a temperature sensor 500, a pressure sensor or one or more of other sensors, and may be adjusted according to the parameters to be detected by the microprobe. Figures 1 to 4 In the illustrated embodiment, the microprobe is mainly used to detect the pressure at the lesion location, and for this purpose, the microprobe at least includes a pressure sensor.

[0050] It should be noted that in the prior art, the wire bonding process is often used to electrically connect the sensor to the PCB board, thereby forming metal leads that are easily corroded. In addition, since the metal leads are easily deformed and moved during welding, manual welding is often required, and the degree of automation is low.

[0051] In the embodiment of the present application, the first sensor 400 is packaged on the intermediate carrier 300 by wafer-level packaging technology, and the intermediate carrier 300 is used for switching to replace the existing metal leads. Specifically, the first sensor 400 has a first surface 410 and a second surface 420 opposite to each other, and the first surface 410 can be exposed by the opening 110, that is, the first sensor 400 is located in the accommodating cavity and is arranged corresponding to the opening 110. Figure 1As shown, due to the piezoresistive pressure measurement principle of the pressure sensor, a first sealant 700 is encapsulated in the end area of ​​the accommodating cavity to fix and protect the first sensor 400. The first sealant 700 forms a groove at the position corresponding to the opening 110, and the bottom of the groove corresponds to the first surface 410 of the first sensor 400, so that body fluids such as blood and cerebrospinal fluid can enter the accommodating cavity from the opening 110 on the housing 100 and move to a position close to the first surface 410 to transmit the pressure of the body fluid to the first sensor 400, and then the first sensor 400 converts the body fluid pressure into an electrical signal output, while preventing the blood or the external environment from corroding the pressure sensor, ensuring that the pressure sensor can better respond to pressure changes. The second surface 420 of the first sensor 400 is provided with a fourth pad 421, and the first sensor 400 is attached to the intermediate carrier 300, and the fourth pad 421 is in contact with the third pad 320, and is electrically conductive through a welding process.

[0052] It is understandable that if Figure 3 and Figure 4 As shown, during the mounting and welding process of the first sensor 400 and the intermediate carrier 300, the fourth pad 421 of the first sensor 400 can be firstly formed with a solder ball 422 by means of a BGA ball planting technology (Ball Grid Array), and then mounted on the intermediate carrier 300 by means of a flip chip packaging process (Flip Chip) to form an integrated sensor component. Similarly, the pads on the intermediate carrier 300 and the PCB substrate 200 can also be balled by means of a laser ball planting process to facilitate packaging and welding.

[0053] Based on the above, it can be found that the microprobe of the present application replaces the wire bonding process in the prior art through the transfer of the intermediate carrier 300, and the sensor and the intermediate carrier 300 are attached and connected, thereby greatly reducing the possibility of the circuit being corroded by blood, thereby extending the working time of the microprobe in the human body, improving the working stability of the microprobe, and facilitating medical staff to obtain accurate physiological parameters. In addition, since the embodiment of the present application adopts the advanced 3D-Sip system packaging process (3D-System in Package, i.e., three-dimensional system-level packaging), it can realize automated packaging, greatly improving the production efficiency of the microprobe.

[0054] In addition, it should be noted that the intermediate carrier 300 is made of high-purity single crystal silicon or silicon dioxide material, and has the characteristics of stable mechanical properties, high thermal stability, high resistivity and low electrical loss, and because its thermal expansion coefficient is similar to that of the first sensor 400, it can produce the same expansion change as the first sensor 400 when the package is heated, thereby reducing the impact of the packaging process on the zero drift and time drift of the first sensor 400, and avoiding problems such as output drift caused by stress. In addition, the intermediate carrier 300 is not easily corroded by blood, avoiding problems such as zero output drift caused by leakage of metal leads. In addition, the intermediate carrier 300 can also be obtained in the form of wafers or panel formats, and can be manufactured into an ultra-thin intermediate carrier 300 with a thickness as low as 50μm, thereby realizing the miniaturized packaging of the micro probe.

[0055] In addition, the intermediate carrier 300 can be a TSV (Through Silicon Via) structure or a TGV (Through Glass Via) structure. The intermediate carrier 300 of the TSV or TGV structure uses screen printing of wafer glass paste and sintering to form a sealed protective layer on the surface and internal circuits, thereby preventing the corrosion of the circuit caused by the penetration of human tissue fluid during long-term testing in clinical use.

[0056] In some embodiments, the first sensor 400 and the PCB substrate 200 are respectively attached to two opposite surfaces of the intermediate carrier 300, and a through hole 330 is provided on the intermediate carrier 300. A conductive part is provided in the through hole 330, and the second solder pad 310 and the third solder pad 320 are respectively provided at two ends of the through hole 330 and are electrically connected through the conductive part.

[0057] The through hole 330 can be formed by laser drilling, or the through hole 330 can be manufactured by laser induced etching process. Specifically, the laser induced etching process first irradiates the pre-punched area of ​​the intermediate carrier 300 with a laser to change the microstructure inside the material, weaken the structure of the pre-opening area of ​​the intermediate carrier 300, improve its processing performance and make it easier to be removed by etching liquid, thereby increasing the etching rate of the pre-opening area compared to the surrounding area, so as to reduce the probability of cracks on the intermediate substrate during the etching process and improve the etching success rate. This process can form a through hole 330 with a diameter of 20μm to 200μm, which is conducive to the miniaturization of vertical circuits.

[0058] It should be noted that a conductive part connecting the pads at both ends is provided in the through hole 330. The conductive part can be a metal layer attached to the hole wall of the through hole 330 by a metal deposition process such as copper plating, or can also be a conductive material filled in the through hole 330, which can directly connect the sensor and the PCB substrate 200 attached to the opposite surface of the intermediate carrier 300 to achieve the circuit switching of the intermediate carrier 300. It can be understood that the circuit structure of the intermediate carrier 300 is formed inside the intermediate carrier 300, and the two ends of the through hole 330 are respectively closed by the sensor and the PCB substrate 200, thereby forming a relatively sealed environment, avoiding blood erosion, and improving the long-term stability of the micro probe.

[0059] It should be noted that the electrical connection between the sensor and the PCB substrate 200 is achieved through a straight conductive portion, and the data transmission distance is shorter, which is beneficial to reducing the package volume of the microprobe, helping to reduce the generation of noise and parasitic capacitance, and helping to reduce signal propagation delay and power consumption.

[0060] In other embodiments, Figure 5 As shown, the first sensor 400 and the PCB substrate 200 are attached to the same surface of the intermediate carrier 300, and a printed circuit 340 is provided on the intermediate carrier 300, and the second pad 310 and the third pad 320 are connected through the printed circuit 340. It can be understood that the printed circuit 340 is formed on the intermediate carrier 300 by etching, electroplating and other processes, and a protective coating is coated on the printed circuit 340 to prevent it from being corroded and damaged. In addition, the two ends of the printed circuit 340 extend to the bottom of the first sensor 400 and the bottom of the PCB substrate 200 respectively to achieve a fitting seal, thereby also being able to prevent corrosion by blood.

[0061] In such Figure 2 In the illustrated embodiment, a solution combining a printed circuit 340 and a conductive through hole 330 is adopted, and the interconnection between various sensors and chips is realized through the printed circuit 340 , and the connection between the chip and the PCB substrate 200 is realized through the conductive through hole 330 .

[0062] Specifically, in Figure 2In the embodiment shown, the first sensor 400 is a pressure sensor. It is understandable that during the pressure detection process, temperature changes have a great influence on the pressure detection accuracy. For this reason, in the micro probe of the present application, a temperature sensor 500 is also provided, and the communication connection between the temperature sensor 500 and the pressure sensor is realized through the intermediate carrier 300, so that the temperature data detected by the temperature sensor 500 can be used to compensate or correct the pressure data detected by the pressure sensor, thereby reducing the influence of temperature on the performance of the pressure sensor. It should be noted that the temperature sensor 500 can be a columnar or sheet-shaped NTC thermistor (full name: Negative Temperature Coefficient Thermi stor), which has the advantages of high sensitivity, small size, good stability, etc.

[0063] In some embodiments, the pressure sensor is an absolute pressure sensor. The absolute pressure sensor is based on crystalline silicon micromechanical technology. By measuring the slight effect of pressure on the degree of flexural deformation of crystalline silicon microbeams, the deformation is converted into a standard electrical signal output to achieve accurate measurement of the pressure value. It uses a vacuum reference as the reference point of the measurement object, thereby eliminating the influence of ambient pressure on the output signal. Among them, the absolute pressure sensor includes a first piezoresistor, a second piezoresistor, a third piezoresistor and a fourth piezoresistor, wherein the first piezoresistor, the second piezoresistor, the third piezoresistor and the fourth piezoresistor are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure. The four bridge arms of the structure are all connected to the measured object to form a differential full-bridge working mode, which has high measurement accuracy and sensitivity. In other embodiments, the first piezoresistor and the second piezoresistor are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure. The third piezoresistor and the fourth piezoresistor are located on the intermediate carrier 300 or on the PCB substrate 200 to form another Wheatstone half-bridge structure, which is conducive to reducing the volume of the sensor and thus reducing the packaging volume of the probe.

[0064] In some embodiments, Figure 2 As shown, the temperature sensor 500 is a chip type thin film resistor, which includes a substrate 510 and a thermosensitive film 520. The thermosensitive film 520 is provided on two opposite surfaces of the substrate 510. Preferably, platinum films are printed on both sides of the ceramic substrate 510, and solder is symmetrically arranged at both ends to meet the requirements of chip packaging. The temperature sensor 500 can be soldered to the pad of the intermediate carrier 300 by SMT chip process (i.e., surface mount technology chip process, Surface Mount Technology).

[0065] In some embodiments, the miniature probe further includes a conditioning chip 600, which is disposed on the intermediate carrier 300 and is respectively connected to the pressure sensor and the temperature sensor 500 through the printed circuit 340 of the intermediate carrier 300, so as to compensate and process the sensor signals, thereby further improving the performance of the sensor. The conditioning chip 600 can receive weak sensitive signals, perform amplification, zero point calibration, linear compensation, and temperature drift compensation, thereby outputting a purer digital signal with better linearity, which is then transmitted to an external controller through the internal circuit of the intermediate carrier 300, the circuit on the PCB substrate 200, or the wire, thereby achieving miniaturization while ensuring the quality of signal transmission.

[0066] In some embodiments, the accommodating cavity is filled with a first sealant 700 and a second sealant 710. The second sealant 710 covers at least a portion of the intermediate carrier 300 and the PCB substrate 200 to limit the movement of the intermediate carrier 300 and the PCB substrate 200 in the accommodating cavity. The first sealant 700 covers the first sensor 400. In the embodiment of the present application, the temperature sensor 500 and the pressure sensor are both covered by the first sealant 700. Figure 1 As shown, the first sealant 700 separates the second sealant 710 from the opening 110, thereby preventing external liquid from contacting the second sealant 710. It is understandable that the first sealant 700 is preferably a material with good biocompatibility, good insulation, good water vapor permeability, and no large stress, such as two-component epoxy glue, silicone resin, greenhouse vulcanized silicone rubber, etc. The second sealant 710 has high tensile strength while meeting biocompatibility, and is preferably medical-grade UV glue, epoxy resin glue, etc.

[0067] The second aspect of the present application also proposes a monitoring device, which includes the miniature probe mentioned in the above embodiment. Since the monitoring device adopts the technical solution in the above embodiment, it at least has all the beneficial effects brought by the technical solution in the above embodiment, which will not be repeated here.

[0068] In addition, the microprobes in the prior art will be accompanied by radio frequency heating, displacement force, torque force, and artifacts during MRI (Magnetic Resonance Imaging) detection, which poses a great safety hazard to patients and affects the judgment of doctors. Since the materials used to make the microprobes in the first aspect of the present application are all made of magnetic materials that do not contain iron or nickel, they can meet the safety requirements for use under 1.5T and 3.0T field strengths, will not generate excessive heat due to electromagnetic induction, and will not be displaced or damaged, thereby avoiding safety accidents caused by damage to the microprobe when patients undergo MRI detection, and will not affect the quality of MRI imaging.

[0069] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A miniature probe, characterized in that: include: A housing, wherein the housing defines a receiving cavity and an opening communicating with the receiving cavity; A PCB substrate, the PCB substrate is disposed in the accommodating cavity, and the PCB substrate is provided with a first solder pad; An intermediate carrier board, wherein the intermediate carrier board is provided with a second soldering pad and a third soldering pad electrically connected to each other, and the intermediate carrier board is arranged to be bonded to the PCB substrate so that the first soldering pad and the second soldering pad are correspondingly soldered; A first sensor, wherein the first sensor is disposed in the accommodating cavity, the first sensor has a first surface and a second surface relative to each other, the first surface can be exposed by the opening, a fourth soldering pad is disposed on the second surface, the first sensor is attached to the intermediate carrier, and the fourth soldering pad is correspondingly soldered to the third soldering pad.

2. The microprobe according to claim 1, characterized in that: The intermediate carrier is made of single crystal silicon or silicon dioxide.

3. The microprobe according to claim 1, characterized in that: The first sensor and the PCB substrate are respectively attached to two opposite surfaces of the intermediate carrier, the intermediate carrier is provided with a through hole, a conductive part is provided in the through hole, the second pad and the third pad are respectively provided at two ends of the through hole and are electrically connected through the conductive part.

4. The microprobe according to claim 1, characterized in that: The first sensor and the PCB substrate are attached to the same surface of the intermediate carrier. The intermediate carrier is provided with a printed circuit, and the second pad and the third pad are connected via the printed circuit.

5. The microprobe according to claim 1, characterized in that: The first sensor is a pressure sensor, and the micro probe further includes a temperature sensor, and the temperature sensor is communicatively connected to the pressure sensor.

6. The microprobe according to claim 5, characterized in that: The pressure sensor is an absolute pressure sensor, and the absolute pressure sensor includes a first piezoresistor, a second piezoresistor, a third piezoresistor and a fourth piezoresistor; The first piezoresistor, the second piezoresistor, the third piezoresistor and the fourth piezoresistor are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure; Alternatively, the first piezoresistor and the second piezoresistor are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure, and the third piezoresistor and the fourth piezoresistor are located on the intermediate carrier board or the PCB substrate.

7. The microprobe according to claim 5, characterized in that: The temperature sensor is a chip-type thin-film resistor, which includes a substrate and a thermosensitive film. The thermosensitive film is disposed on two opposite surfaces of the substrate.

8. The microprobe according to claim 5, characterized in that: The micro probe further comprises a conditioning chip, which is arranged on the intermediate carrier board and is respectively connected to the pressure sensor and the temperature sensor for communication.

9. The microprobe according to claim 1, characterized in that: The accommodating cavity is filled with a first sealant and a second sealant, the second sealant covers at least a portion of the intermediate carrier and the PCB substrate to limit the movement of the intermediate carrier and the PCB substrate in the accommodating cavity, the first sealant covers the first sensor and separates the second sealant from the opening to prevent external liquid from contacting the second sealant.

10. A monitoring device, characterized in that include: A microprobe as claimed in any one of claims 1 to 9.

Images