PCB automatic marking device for chip manufacturing

Abstract

The invention belongs to the technical field of laser marking, and particularly relates to an automatic PCB marking device for chip manufacturing, the automatic PCB marking device comprises a belt conveyor, an automatic laser marking machine and a grabbing mechanism, the automatic laser marking machine is fixed at the discharging end of the belt conveyor, the grabbing mechanism is arranged at the feeding end of the belt conveyor, a mounting frame is further fixed on the belt conveyor, and the mounting frame is connected with the automatic laser marking machine. A thickness detection module and a controller are fixed to the inner wall of the top of the mounting frame, a feeding table is arranged on one side of the feeding end of the belt conveyor, a qualified product discharging table and a defective product discharging table are arranged on the other side of the feeding end of the belt conveyor, and an image detection system is mounted in the automatic laser marking machine. According to the method, the copper foil thickness of the PCB is detected before marking, and the power of the marking machine is accurately calculated and adjusted according to the established mathematical model, so that the problems of unclear marking, overburning or light mark and the like caused by the thickness difference of the copper foil can be effectively avoided, and the stability and consistency of the marking quality are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of laser marking, and in particular to an automatic marking device for a PCB board used in chip manufacturing. Background Art

[0002] Chip products on the market are available in both stand-alone and PCB-connected forms. Stand-alone chips are also called bare chips: the most primitive stand-alone chip form, that is, bare chips that have not been packaged; connected to PCBs: chips soldered on PCBs, which is the most common form. Chips are soldered to corresponding pads on PCBs through their pins or solder balls to achieve electrical connection. For example, the CPU, memory chips, and graphics card chips on a computer motherboard are all soldered on PCBs. To improve the quality of chip products, laser marking devices are usually used to engrave QR codes and other identification marks on PCBs for identification, and bind them in a database to achieve product quality traceability.

[0003] The existing automatic marking device performs marking at a fixed power, and when the PCB board is thick, the marking is not clear, so corresponding improvements are made to address this problem. Summary of the invention

[0004] Based on the technical problems existing in the prior art, the present invention proposes an automatic marking device for PCB boards used in chip manufacturing.

[0005] The present invention proposes an automatic marking device for PCB boards used in chip manufacturing, comprising a belt conveyor, a laser automatic marking machine and a grabbing mechanism, wherein the laser automatic marking machine is fixed at the discharging end of the belt conveyor, the grabbing mechanism is arranged at the feeding end of the belt conveyor, a mounting frame located between the grabbing mechanism and the laser automatic marking machine is also fixed on the belt conveyor, a thickness detection module and a controller are fixed on the top inner wall of the mounting frame, a feeding table is arranged on one side of the feeding end of the belt conveyor, and a qualified product discharging table and a defective product discharging table are arranged on the other side, and an image detection system is installed in the laser automatic marking machine; The grabbing mechanism is used to carry the PCB board, and the moving direction is controlled by the moving mechanism; Belt conveyor, using a conveyor belt or roller conveying structure, driven by a motor, is used to transport PCB boards; The laser automatic marking machine can mark on the PCB board according to the received control signal, and its parameters can be adjusted by the control signal of the controller; Thickness detection module, used to detect the thickness of copper foil on PCB; Image detection system, used to grade and analyze the marking quality and determine whether the marked PCB board is qualified; The moving mechanism controls the grabbing mechanism to move to the feeding table, grabs the PCB board to be marked onto the belt conveyor, and then the belt conveyor transports the PCB board to the laser automatic marking machine. During this period, the thickness detection module on the mounting frame will detect the thickness of the copper foil of the PCB board, and then transmit the detection information to the controller. Then the controller sends a control signal to the laser automatic marking machine, and the laser automatic marking machine will adjust the parameters according to the control signal, and then mark the PCB board. After marking, the image detection system will rate and analyze the marking quality to determine whether the marked PCB board is qualified. Then the belt conveyor transports the PCB board to the initial position. If the PCB board is qualified, the grabbing mechanism will move the PCB board to the qualified product discharge table. If the PCB board is unqualified, the grabbing mechanism will move the PCB board to the defective product discharge table, and then repeat the marking work for the next PCB board.

[0006] Preferably, the controller adjusts the parameters of the automatic laser marking machine by the following formula: In the formula, and is the coefficient obtained by fitting the experimental data, is the copper foil thickness, is the exponential coefficient.

[0007] Preferably, the image detection system determines the marking quality by the following formula: By calculating the clarity index of the marking pattern and contrast index , and the set threshold and Compare and judge whether the PCB board is qualified or defective. ≥ ≥ , it is judged as a qualified product. < < , it is judged as a defective product.

[0008] Preferably, the thickness detection module is electrically connected to the controller, and the controller is electrically connected to the automatic laser marking machine.

[0009] Preferably, the moving mechanism comprises a transverse moving assembly, a translational moving assembly and a downward moving assembly, the grabbing mechanism is mounted on the free end of the downward pressing assembly, the transverse moving assembly is used to drive the grabbing mechanism to move laterally, the translational moving assembly is used to drive the grabbing mechanism to move horizontally along the conveying direction of the belt conveyor, and the downward moving assembly is used to drive the grabbing mechanism to move up and down; In this way, the grasping mechanism can be moved to any position through the cooperation of the transverse movement component, the translation component and the downward movement component, so as to perform precise grasping actions.

[0010] Preferably, the transverse movement assembly includes a first slide rail, a first slider is slidably connected in the first slide rail, a first screw is rotatably connected in the belt conveyor, the first screw and the first slider are threadedly connected, a first motor is fixed to one end of the first slide rail, and an output shaft of the first motor is fixedly connected to an end of the first screw; After the first motor is started, the output shaft of the first motor will drive the first screw to rotate, and then the first screw will drive the first slider to move horizontally, thereby realizing the horizontal movement of the grasping mechanism.

[0011] Preferably, the translation assembly includes a second slide rail, the second slide rail is fixed on the first slider, the second slide rail is slidably connected to the second slider, the second slide rail is also rotatably connected to the second screw, the second screw and the second slider are threadedly connected, the end of the second slide rail is fixed to a second motor, and the output shaft of the second motor is fixedly connected to the end of the second screw; After the second motor is started, the output shaft of the second motor will drive the second screw to rotate, and then the second screw will drive the second slider to move horizontally, so that the grabbing mechanism moves along the conveying direction of the belt conveyor.

[0012] Preferably, the downward moving assembly comprises a pair of electric push rods, which are symmetrically fixed at two ends of the second sliding block; After the electric push rod is started, the output shaft of the electric push rod will move telescopically, thereby realizing the up and down movement of the grasping mechanism.

[0013] Preferably, the gripping mechanism comprises a suction cup mounting seat, which is fixed on the output shafts of the two electric push rods, and a plurality of suction cups are installed below the suction cup mounting seat; In this way, the PCB board can be sucked by multiple suction cups, thereby achieving a grabbing action.

[0014] Preferably, a pair of rollers are rotatably connected to the first sliding block, and a sliding opening for the rollers to roll is provided on the first sliding rail; In this way, through the rolling cooperation between the sliding opening and the roller shaft, the movement process of the first sliding block can be made more stable and the movement resistance is smaller.

[0015] Compared with the prior art, the present invention provides a PCB board automatic marking device for chip manufacturing, which has the following beneficial effects: 1. An automatic marking device for PCB boards used in chip manufacturing can effectively avoid problems such as unclear marking, overburning or light marking caused by differences in copper foil thickness by detecting the copper foil thickness of the PCB board before marking and accurately calculating and adjusting the marking machine power according to the established mathematical model, thereby ensuring the stability and consistency of the marking quality and improving the product yield.

[0016] 2. An automatic marking device for PCB boards used in chip manufacturing uses an image detection system to automatically rate and analyze the marking quality, can quickly and accurately identify defective products, and combines a gripping mechanism to automatically classify and transport qualified and defective products, greatly improving production efficiency, reducing the workload and misjudgment rate of manual inspection and classification, and reducing production costs.

[0017] 3. An automatic marking device for PCB boards used in chip manufacturing integrates the processes of feeding, testing, marking, inspection and classification of PCB boards to form an automated production line. The modules work together to make the entire production process smoother and more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a PCB board automatic marking device for chip manufacturing proposed by the present invention from a first angle; Figure 2 This is a schematic diagram of the structure from a second angle of a PCB board automatic marking device for chip manufacturing proposed by the present invention; Figure 3 This is a schematic diagram of the installation structure of a thickness detection module of a PCB board automatic marking device for chip manufacturing proposed by the present invention; Figure 4 This is a schematic diagram of a PCB board automatic marking device for chip manufacturing proposed by the present invention; Figure 5 A schematic diagram of the structure of a moving mechanism of a PCB board automatic marking device for chip manufacturing proposed by the present invention; Figure 6 A schematic diagram of the structure of a translation component of a PCB board automatic marking device for chip manufacturing proposed by the present invention; Figure 7 For the present invention Figure 5 A is an enlarged structural diagram of FIG.

[0019] In the figure: 1. Belt conveyor; 2. Automatic laser marking machine; 3. Mounting frame; 4. Thickness detection module; 5. Feeding table; 6. Qualified product discharging table; 7. Defective product discharging table; 8. First slide rail; 9. First screw rod; 10. First slider; 11. First motor; 12. Second slide rail; 13. Second screw rod; 14. Second slider; 15. Second motor; 16. Electric push rod; 17. Suction cup mounting seat; 18. Suction cup; 19. Roller; 20. Slide; 21. Controller. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] Reference Figure 1-Figure 7 , a PCB board automatic marking device for chip manufacturing, comprising a belt conveyor 1, a laser automatic marking machine 2 and a grabbing mechanism, wherein the laser automatic marking machine 2 is fixed at the discharging end of the belt conveyor 1, and the grabbing mechanism is arranged at the feeding end of the belt conveyor 1, and a mounting frame 3 located between the grabbing mechanism and the laser automatic marking machine 2 is also fixed on the belt conveyor 1, and a thickness detection module 4 and a controller 21 are fixed on the top inner wall of the mounting frame 3, a feeding table 5 is arranged on one side of the feeding end of the belt conveyor 1, and a qualified product discharging table 6 and a defective product discharging table 7 are arranged on the other side, and an image detection system is installed in the laser automatic marking machine 2; The grabbing mechanism is used to carry the PCB board, and the moving direction is controlled by the moving mechanism; The belt conveyor 1 adopts a conveyor belt or roller conveying structure, driven by a motor, and is used to convey PCB boards; The automatic laser marking machine 2 can mark on the PCB board according to the received control signal, and its parameters can be adjusted by the control signal of the controller 21; Thickness detection module 4, used to detect the thickness of the copper foil of the PCB board; It should be noted that the thickness detection module 4 can be a laser displacement sensor or other equipment that can detect the thickness of the copper foil of the PCB board in real time. The thickness detection module 4 is not specifically limited here and can be selected according to actual needs; Image detection system, used to grade and analyze the marking quality and determine whether the marked PCB board is qualified; It should be noted that the moving mechanism controls the grabbing mechanism to move to the feeding table 5, grabs the PCB board to be marked onto the belt conveyor 1, and then the belt conveyor 1 conveys the PCB board to the laser automatic marking machine 2. During this period, the thickness detection module 4 on the mounting frame 3 will detect the thickness of the copper foil of the PCB board, and then transmit the detection information to the controller 21. Then the controller 21 sends a control signal to the laser automatic marking machine 2, and the laser automatic marking machine 2 will adjust the parameters according to the control signal, and then mark the PCB board. After the marking is completed, the image detection system will grade and analyze the marking quality to determine whether the marked PCB board is qualified. Then the belt conveyor 1 conveys the PCB board to the initial position. If the PCB board is qualified, the grabbing mechanism will move the PCB board to the qualified product discharge table 6. If the PCB board is unqualified, the grabbing mechanism will move the PCB board to the defective product discharge table 7, and then repeat the marking work for the next PCB board.

[0023] Furthermore, the controller 21 adjusts the parameters of the automatic laser marking machine 2 by the following formula: In the formula, and is the coefficient obtained by fitting a large amount of experimental data. is the copper foil thickness, is the exponential coefficient; It should be noted that and It is a coefficient obtained by fitting a large amount of experimental data. Then, substitute it into the above formula to calculate the optimal power of the laser automatic marking machine 2, and transmit the power value to the laser automatic marking machine 2 so that it automatically adjusts the power to ensure clear marking; It should be noted that the above formula is the expression after exponential mapping. Exponential mapping is used to normalize or transform data to make the distribution of data more in line with specific analysis requirements, more nonlinear, and better reflect actual needs. The exponential coefficient In order to more flexibly adapt to different working conditions and environmental changes in actual monitoring, these deviation coefficients can be adjusted according to specific circumstances to improve the performance and applicability of the monitoring system.

[0024] Furthermore, the image detection system determines the marking quality through the following formula: By calculating the clarity index of the marking pattern and contrast index , and the set threshold and Compare and judge whether the PCB board is qualified or defective. ≥ ≥ , it is judged as a qualified product. < < , it is judged as a defective product. These thresholds can be obtained through statistical analysis of a large number of qualified and unqualified marking samples, and adjusted and optimized according to actual production conditions.

[0025] Furthermore, the thickness detection module 4 is electrically connected to the controller 21 , and the controller 21 is electrically connected to the automatic laser marking machine 2 .

[0026] Further, the moving mechanism includes a transverse moving assembly, a translational moving assembly and a downward moving assembly, the grabbing mechanism is installed on the free end of the downward pressing assembly, the transverse moving assembly is used to drive the grabbing mechanism to move laterally, the translational moving assembly is used to drive the grabbing mechanism to move horizontally along the conveying direction of the belt conveyor 1, and the downward moving assembly is used to drive the grabbing mechanism to move up and down; It should be noted that, in this way, the grasping mechanism can be moved to any position and a precise grasping action can be performed through the cooperation of the transverse movement component, the translation component and the downward movement component.

[0027] Furthermore, the transverse movement assembly includes a first slide rail 8, a first slider 10 is slidably connected in the first slide rail 8, a first screw rod 9 is rotatably connected in the belt conveyor 1, the first screw rod 9 and the first slider 10 are threadedly connected, a first motor 11 is fixed to one end of the first slide rail 8, and an output shaft of the first motor 11 is fixedly connected to the end of the first screw rod 9; It should be noted that after the first motor 11 is started, the output shaft of the first motor 11 will drive the first screw 9 to rotate, and then the first screw 9 will drive the first slider 10 to move laterally, thereby realizing the lateral movement of the grasping mechanism.

[0028] Further, the translation assembly includes a second slide rail 12, the second slide rail 12 is fixed on the first slider 10, a second slider 14 is slidably connected in the second slide rail 12, a second screw 13 is rotatably connected in the second slide rail 12, the second screw 13 and the second slider 14 are threadedly connected, a second motor 15 is fixed to the end of the second slide rail 12, and the output shaft of the second motor 15 is fixedly connected to the end of the second screw 13; It should be noted that after the second motor 15 is started, the output shaft of the second motor 15 will drive the second screw 13 to rotate, and then the second screw 13 will drive the second slider 14 to move laterally, thereby realizing the movement of the grabbing mechanism along the conveying direction of the belt conveyor 1.

[0029] Furthermore, the downward moving assembly includes a pair of electric push rods 16, which are symmetrically fixed at both ends of the second slider 14; It should be noted that after the electric push rod 16 is started, the output shaft of the electric push rod 16 will move telescopically, thereby realizing the up and down movement of the grabbing mechanism.

[0030] Furthermore, the gripping mechanism includes a suction cup mounting seat 17, which is fixed on the output shafts of the two electric push rods 16, and a plurality of suction cups 18 are installed below the suction cup mounting seat 17; It should be noted that, in this way, the PCB board can be sucked by multiple suction cups 18, thereby achieving a grasping action.

[0031] Furthermore, a pair of rollers 19 are rotatably connected to the first slider 10, and a sliding opening 20 for the rollers 19 to roll is provided on the first slide rail 8; It should be noted that, through the rolling cooperation between the sliding opening 20 and the roller shaft 19, the movement process of the first sliding block 10 can be made more stable and the movement resistance can be smaller.

[0032] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0033] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0034] In the several embodiments provided in the present application, it should be understood that the disclosed overall system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another overall system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0035] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0036] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0037] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A PCB automatic marking device for chip manufacturing, comprising a belt conveyor (1), a laser automatic marking machine (2) and a gripping mechanism, characterized in that: The laser automatic marking machine (2) is fixed to the discharge end of the belt conveyor (1), the grabbing mechanism is arranged at the feed end of the belt conveyor (1), a mounting frame (3) is also fixed on the belt conveyor (1) and is located between the grabbing mechanism and the laser automatic marking machine (2), a thickness detection module (4) and a controller (21) are fixed to the top inner wall of the mounting frame (3), a feeding table (5) is arranged on one side of the feed end of the belt conveyor (1), and a qualified product discharge table (6) and a defective product discharge table (7) are arranged on the other side, and an image detection system is installed in the laser automatic marking machine (2); The grabbing mechanism is used to carry the PCB board, and the moving direction is controlled by the moving mechanism; The belt conveyor (1) adopts a conveyor belt or roller conveying structure, is driven by a motor, and is used to convey PCB boards; The automatic laser marking machine (2) is capable of marking on the PCB board according to the received control signal, and its parameters can be adjusted by the control signal of the controller (21); A thickness detection module (4) is used to detect the thickness of the copper foil of the PCB; The image detection system is used to grade and analyze the marking quality and determine whether the marked PCB board is qualified.

2. The automatic marking device for PCB board used in chip manufacturing according to claim 1 is characterized in that: The controller (21) adjusts the parameters of the automatic laser marking machine (2) by the following formula: In the formula, and is the coefficient obtained by fitting the experimental data, is the copper foil thickness, is the exponential coefficient.

3. The automatic marking device for PCB board used in chip manufacturing according to claim 1 is characterized in that: The image detection system determines the marking quality by the following formula: By calculating the clarity index of the marking pattern and contrast index , and the set threshold and Compare and judge whether the PCB board is qualified or defective. ≥ ≥ , it is judged as a qualified product. < < , it is judged as a defective product.

4. The automatic marking device for PCB board used for chip manufacturing according to claim 1 is characterized in that: The thickness detection module (4) is electrically connected to the controller (21), and the controller (21) is electrically connected to the automatic laser marking machine (2).

5. The automatic marking device for PCB board used in chip manufacturing according to claim 1 is characterized in that: The moving mechanism comprises a transverse moving assembly, a translational moving assembly and a downward moving assembly. The grabbing mechanism is mounted on the free end of the downward pressing assembly. The transverse moving assembly is used to drive the grabbing mechanism to move transversely. The translational moving assembly is used to drive the grabbing mechanism to move horizontally along the conveying direction of the belt conveyor (1). The downward moving assembly is used to drive the grabbing mechanism to move up and down.

6. The automatic marking device for PCB board used for chip manufacturing according to claim 5, characterized in that: The transverse movement assembly comprises a first slide rail (8), a first slider (10) is slidably connected inside the first slide rail (8), a first screw rod (9) is rotatably connected inside the belt conveyor (1), the first screw rod (9) and the first slider (10) are threadedly connected, a first motor (11) is fixed to one end of the first slide rail (8), and an output shaft of the first motor (11) is fixedly connected to an end of the first screw rod (9).

7. The automatic marking device for PCB board used for chip manufacturing according to claim 6, characterized in that: The translation assembly comprises a second slide rail (12), the second slide rail (12) being fixed on the first slider (10), a second slider (14) being slidably connected in the second slide rail (12), a second screw rod (13) being rotatably connected in the second slide rail (12), the second screw rod (13) and the second slider (14) being threadedly connected, a second motor (15) being fixed at the end of the second slide rail (12), and an output shaft of the second motor (15) being fixedly connected to the end of the second screw rod (13).

8. The automatic marking device for PCB board used in chip manufacturing according to claim 7, characterized in that: The downward moving assembly comprises a pair of electric push rods (16), and the pair of electric push rods (16) are symmetrically fixed at two ends of the second sliding block (14).

9. The automatic marking device for PCB board used in chip manufacturing according to claim 8, characterized in that: The gripping mechanism comprises a suction cup mounting seat (17), the suction cup mounting seat (17) being fixed on the output shafts of the two electric push rods (16), and a plurality of suction cups (18) being mounted below the suction cup mounting seat (17).

10. The automatic marking device for PCB board used in chip manufacturing according to claim 6, characterized in that: A pair of rollers (19) are rotatably connected to the first sliding block (10), and a sliding opening (20) for the rollers (19) to roll is provided on the first sliding rail (8).

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