Silicon wafer cutting device, cutting system and cutting method

Abstract

The invention provides a silicon wafer cutting device which comprises a cutting machine, distance measuring sensors and a wire bow automatic compensation system, the cutting machine comprises a cutting wire net formed by winding between a first wire wheel and a second wire wheel, the distance measuring sensors are arranged on the top side of the first wire wheel at intervals, and the distance measuring sensors are used for transmitting measurement data to a control center; the wire bow automatic compensation system is used for correcting the cutting parameters of the cutting machine according to the compensation signal sent by the control center and the transmitted alarm parameters so as to adjust the wire bow of the cutting wire net, and the cutting machine is used for cutting the crystal bar according to the corrected cutting parameters. The invention further provides a cutting system comprising the control center and the cutting device. The invention further provides a silicon wafer cutting method. According to the cutting system and the cutting method provided by the invention, the cutting quality of the silicon wafer is improved, and meanwhile, the operation of inspecting the wire bow by an operator is reduced, so that the labor intensity of workers is reduced, and the abnormality caused by incapability of inspection is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon rod slicing, and in particular to a silicon wafer cutting device, a cutting system and a cutting method. Background Art

[0002] The distance between the fine grids on the surface of the solar cell is 1-1.5mm, and the fine grids are parallel to the line marks. During the cutting process of the silicon wafer, the line bow causes a large curvature of the line, which causes the cutting line to cross or overlap with one or more fine grids to produce horizontal moiré fringes, which in turn causes the appearance of the line marks on the processed end of the cell to be degraded, affecting the performance of the cell. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a cutting device for silicon wafers which is helpful in improving the cutting quality of silicon wafers while also helping to reduce the operator's operation of checking wire bows to reduce manual labor intensity and abnormal silicon wafers caused by failure to detect.

[0004] In addition, the present application also provides a silicon wafer cutting system, which helps to improve the cutting quality of silicon wafers through the cooperation between the control center and the cutting device, and also helps to reduce the operation of operators checking the wire bow to reduce manual labor intensity and abnormalities caused by failure to detect.

[0005] In addition, the present application also provides a method for cutting a silicon wafer.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0007] A silicon wafer cutting device includes a cutting machine, wherein the cutting machine includes a cutting assembly, wherein the cutting assembly includes a cutting wire net wound between a first wire wheel and a second wire wheel, and the silicon wafer cutting device also includes:

[0008] a distance measuring sensor, which is arranged at intervals on the top side of the first wire wheel, the distance measuring sensor is arranged relative to the vertical diameter of the first wire wheel, the distance measuring sensor is used to emit light inclined toward the second wire wheel to the cutting surface of the cutting wire mesh that is stopped and carries the crystal rod, the detection site of the distance measuring sensor is placed on the side of the crystal rod adjacent to the first wire wheel, and the distance measuring sensor is used to transmit measurement data to the control center; and

[0009] The wire bow automatic compensation system is used to correct the cutting parameters of the cutting machine to adjust the wire bow of the cutting wire network according to the compensation signal sent by the control center and the transmitted alarm parameters. The cutting machine is used to cut the crystal rod according to the corrected cutting parameters.

[0010] In some possible implementations, the light emitted by the distance measuring sensor forms an angle of 45° with the vertical diameter of the first wire wheel.

[0011] In some possible implementations, the cutting machine is further configured to maintain original cutting parameters to cut the crystal rod according to a normal signal sent by the control center.

[0012] A silicon wafer cutting system comprises a control center and the silicon wafer cutting device, wherein the control center is used to calculate the deviation value of the cutting surface according to the measurement data transmitted by the ranging sensor, and if the deviation value exceeds a set threshold, the control center sends a compensation signal, and if the deviation value is within the set threshold range, the control center sends a normal signal, and the control center is also used to transmit alarm parameters.

[0013] A silicon wafer cutting method, using the silicon wafer cutting system, the cutting method comprises the following steps:

[0014] Using a distance measuring sensor to emit light to the cutting surface of the stopped cutting wire mesh carrying the crystal rod, the detection position of the distance measuring sensor is placed on the side of the crystal rod adjacent to the first wire wheel;

[0015] The control center receives the measurement data transmitted by the distance measuring sensor, calculates the deviation value of the cutting surface, and sends a compensation signal according to the deviation value exceeding a set threshold value;

[0016] The wire bow automatic compensation system corrects the cutting parameters of the cutting machine according to the received compensation signal and the alarm parameters transmitted by the control center to adjust the wire bow of the cutting wire network, and the cutting machine cuts the crystal rod according to the corrected cutting parameters.

[0017] In some possible implementations, the control center sends a normal signal according to the deviation value within a set threshold, and the cutting machine maintains the original cutting parameters to cut the crystal rod according to the received normal signal.

[0018] In some possible implementations, the cutting parameters include table speed, wire speed, wire supply amount, and wire return amount.

[0019] In some possible implementations, the step of correcting the cutting parameters of the cutting machine includes:

[0020] Reduce the table speed and line speed, while increasing the wire supply and reducing the wire return.

[0021] In some possible implementations, the reduction in the stage speed is greater than the reduction in the line speed.

[0022] In some possible embodiments, the speed reduction difference between the table speed and the wire speed in the initial cutting step is greater than the speed reduction difference between the two in subsequent cutting steps, the increase in the wire supply amount is the same in different cutting steps, and the decrease in the wire return amount is the same in different cutting steps.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] In the present application, the cutting device is equipped with a distance sensor and an automatic wire bow compensation system. When the cutting device is used in conjunction with the control center, the control center can calculate the deviation value of the cutting surface according to the measurement data of the distance sensor and send a compensation signal according to the deviation value exceeding the set threshold, so that the automatic wire bow compensation system can correct the cutting parameters of the cutting machine according to the compensation signal, thereby assisting in adjusting the wire bow of the cutting wire net, and thus facilitating ensuring that the cutting wire bow is within a predetermined range to avoid the crossing or overlapping of the cutting lines and fine grids. Therefore, the cutting device provided by the present application can not only assist in improving the cutting quality of silicon wafers, but also assist in reducing the operator's operation of checking the wire bow to reduce the labor intensity and the abnormalities caused by failure to check.

[0025] In the present application, the control center cooperates with the cutting device which is equipped with a distance measuring sensor and an automatic wire bow compensation system to automatically adjust the wire bow of the cutting wire network. Therefore, the cutting system provided by the present application is beneficial to improving the cutting quality of silicon wafers while also helping to reduce the operator's operation of checking the wire bow to reduce manual labor intensity and abnormalities caused by failure to check.

[0026] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic structural diagram of the relative position between the distance measuring sensor and the wire wheel provided in one embodiment of the present application.

[0028] Description of Figure Numbers:

[0029] 10-first wire wheel; 20-second wire wheel; 30-cutting wire net; 40-distance measuring sensor; 50-crystal rod. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a centered element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a centered element. When an element is referred to as "arranged on" another element, it can be arranged on the other element or there can be a centered element.

[0032] An embodiment of the present application provides a silicon wafer cutting device, which includes a cutting machine, a distance sensor 40 and a wire bow automatic compensation system. The cutting machine includes a cutting assembly, and the cutting assembly includes a cutting wire net 30 formed by winding between a first wire wheel 10 and a second wire wheel 20. Exemplarily, the cutting wire net 30 can be a diamond wire. Exemplarily, the first wire wheel 10 and the second wire wheel 20 can be arranged between a pay-off wheel and a take-up wheel. Exemplarily, the cutting machine can adopt a cutting machine of an existing mechanism, so the specific structure of the cutting machine is not repeated. Refer to Figure 1 , the distance sensor 40 is arranged at intervals on the top side of the first wire wheel 10, and the distance sensor 40 is arranged relative to the vertical diameter of the first wire wheel 10. The distance sensor 40 is used to emit light inclined toward the second wire wheel 20 to the cutting surface of the cutting wire net 30 that stops rotating and carries the crystal rod 50 (the side of the cutting wire net 30 cutting the crystal rod 50), that is, when the distance sensor 40 emits light for distance measurement, the cutting wire net 30 stops rotating to stop the cutting process. The detection site of the distance sensor 40 is placed on the side of the crystal rod 50 adjacent to the first wire wheel 10. Exemplarily, the distance sensor 40 can be an infrared distance sensor. The distance sensor 40 is used to transmit measurement data to the control center, so that the control center can calculate the deviation value of the cutting surface (the length of the BD segment) according to the measurement data (the length of the AC segment) and the distance between the distance sensor 40 and the first wire wheel 10 (the length of the AB segment) according to the relationship of the triangle. Exemplarily, the control center can be a PC or a tablet computer. The wire bow automatic compensation system is used to correct the cutting parameters of the cutting machine according to the compensation signal sent by the control center and the transmitted alarm parameters to adjust the wire bow (the distance between the highest point and the lowest point of the cutting surface) of the cutting wire mesh 30. Exemplarily, the wire bow automatic compensation system can be installed in the control center for use, or installed in the control end of the cutting machine for use. The cutting machine is used to cut the crystal rod 50 according to the corrected cutting parameters, so as to ensure that the cutting wire bow of the cutting wire mesh 30 is within a predetermined range, thereby avoiding the cutting lines and the fine grid from crossing or overlapping.

[0033] In the present application, the cutting device is additionally provided with a distance sensor 40 and a wire bow automatic compensation system. When the cutting device is used in conjunction with the control center, the control center can calculate the deviation value of the cutting surface according to the measurement data of the distance sensor 40 and send a compensation signal according to the deviation value exceeding the set threshold value, so that the wire bow automatic compensation system can correct the cutting parameters of the cutting machine according to the compensation signal, thereby being able to assist in adjusting the wire bow of the cutting wire mesh 30, thereby facilitating the cutting wire bow within a predetermined range to avoid the crossing or overlapping of the cutting lines and the fine grid. Therefore, the cutting device provided in the present application can not only assist in improving the cutting quality of the silicon wafer, but also assist in reducing the operator's operation of checking the wire bow to reduce the labor intensity and the abnormalities caused by failure to check.

[0034] In some embodiments, the cutting device may further include an alarm, which may activate an alarm according to the compensation signal.

[0035] In some embodiments, the light emitted by the ranging sensor 40 forms an angle of 45° with the vertical diameter of the first wire wheel 10. On the one hand, this helps to reduce the interference of the first wire wheel 10 on the measurement data at a predetermined test distance, and on the other hand, it helps to reduce the spatial interference between the emitted light and the crystal rod 50, thereby enabling the cutting device to adapt to crystal rods 50 of a wider size range.

[0036] In other embodiments, the light emitted by the distance measuring sensor 40 may form an acute angle within another range with the vertical diameter of the first wire wheel 10 , such as an angle of 60° or 30°.

[0037] In some embodiments, the cutting machine is also used to cut the crystal rod 50 according to the normal signal sent by the control center to maintain the original cutting parameters, so as to help improve the automation compactness and accuracy of the cutting device. That is, in the present application, if the control center sends a compensation signal, the wire bow automatic compensation system starts the operation to correct the cutting parameters of the cutting machine, and the subsequent cutting machine continues to cut the crystal rod 50 with the corrected cutting parameters. If the control center sends a normal signal, that is, an OK signal, the cutting machine subsequently maintains the original cutting parameters and continues to cut. Exemplarily, after the cutting machine cuts the crystal rod 50 with the corrected cutting parameters, it can automatically return to the original cutting parameters.

[0038] In another embodiment, the cutting behavior of the cutting device can be restored by setting a detection time interval of the cutting machine. For example, the cutting machine can be set to stop cutting after running for a certain period of time, so that the distance sensor 40 starts working to measure data, and then after stopping for a certain period of time, if the wire bow automatic compensation system does not correct the cutting parameters of the cutting machine, the cutting machine continues to cut the crystal rod 50 according to the original cutting parameters.

[0039] Another embodiment of the present application provides a silicon wafer cutting system, comprising a control center and a silicon wafer cutting device of any of the above embodiments. The control center is used to calculate the deviation value of the cutting surface according to the measurement data emitted by the distance measuring sensor 40. If the deviation value exceeds the set threshold, the control center sends an alarm signal, and if the deviation value is within the set threshold, the control center sends a normal signal. The control center is also used to transmit alarm parameters, so that the wire bow automatic compensation system can correct the cutting parameters of the cutting machine according to the corresponding set recipe based on the obtained alarm parameters.

[0040] In the present application, the control center cooperates with the cutting device which is equipped with an additional distance measuring sensor 40 and a wire bow automatic compensation system to automatically adjust the wire bow of the cutting wire net 30. Therefore, the cutting system provided by the present application is beneficial to improving the cutting quality of silicon wafers while also helping to reduce the operator's operation of checking the wire bow to reduce manual labor intensity and abnormalities caused by failure to check.

[0041] The present application also provides a silicon wafer cutting method, wherein the cutting method uses a silicon wafer cutting system. The cutting method comprises the following steps:

[0042] The ranging sensor 40 is used to emit light to the cutting surface of the stopped cutting wire mesh 30 carrying the crystal rod 50, and the detection position of the ranging sensor 40 is placed on the side of the crystal rod 50 adjacent to the first wire wheel 10. For example, a time interval can be set, and when detection is required, the corresponding motor stops rotating to control the first wire wheel 10 and the second wire wheel 20 to stop rotating. After the wire wheels stop rotating, the ranging sensor 40 starts the ranging work, and the measurement data obtained by the ranging sensor 40 is transmitted to the control center. For example, the data can be transmitted by wire.

[0043] The control center receives the measurement data transmitted by the ranging sensor 40, calculates the deviation value of the cutting surface, and determines whether the deviation value exceeds the set threshold. The control center sends a compensation signal according to the deviation value exceeding the set threshold. For example, it can be output as an NG signal.

[0044] The wire bow automatic compensation system corrects the cutting parameters of the cutting machine according to the received compensation signal and the alarm parameters transmitted by the control center to adjust the wire bow of the cutting wire mesh 30, and the cutting machine cuts the crystal rod 50 according to the corrected cutting parameters.

[0045] In some embodiments, the control center sends a normal signal according to the deviation value within the set threshold value, which can be output as an OK signal, and the cutting machine maintains the original cutting parameters to cut the crystal rod according to the received normal signal.

[0046] In another embodiment, the cutting machine may cut the crystal ingot 50 according to the original cutting parameters when the cutting parameters are not modified during the predetermined stop time.

[0047] In some embodiments, the cutting parameters include table speed, wire speed, wire supply amount and wire return amount. The coordination of the above parameters can broaden the adjustment range and adjustment accuracy of the wire bow, thereby facilitating improving the adaptability of the cutting method.

[0048] In some embodiments, the step of modifying the cutting parameters of the cutting machine includes: reducing the table speed and the wire speed, while increasing the wire supply and reducing the wire return. The modification method provided in the present application is conducive to reducing the wire bow caused by cutting, and is also conducive to improving the cutting capacity of the cutting wire web 30.

[0049] In some embodiments, the table speed is reduced more than the wire speed to further increase cutting capacity.

[0050] In some embodiments, the speed reduction difference between the table speed and the wire speed in the initial cutting step is greater than the speed reduction difference between the two in the subsequent cutting steps, the increase in the wire supply amount is the same in different cutting steps, and the decrease in the wire return amount is the same in different cutting steps, thereby facilitating further improving the cutting capacity.

[0051] The modified process parameters of one embodiment of the present application are shown in the following table.

[0052]

[0053] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A silicon wafer cutting device, comprising a cutting machine, wherein the cutting machine comprises a cutting assembly, wherein the cutting assembly comprises a cutting wire net wound between a first wire wheel and a second wire wheel, wherein: The silicon wafer cutting device also includes: a distance measuring sensor, which is arranged at intervals on the top side of the first wire wheel, the distance measuring sensor is arranged relative to the vertical diameter of the first wire wheel, the distance measuring sensor is used to emit light inclined toward the second wire wheel to the cutting surface of the cutting wire mesh that is stopped and carries the crystal rod, the detection site of the distance measuring sensor is placed on the side of the crystal rod adjacent to the first wire wheel, and the distance measuring sensor is used to transmit measurement data to the control center; and The wire bow automatic compensation system is used to correct the cutting parameters of the cutting machine to adjust the wire bow of the cutting wire network according to the compensation signal sent by the control center and the transmitted alarm parameters. The cutting machine is used to cut the crystal rod according to the corrected cutting parameters.

2. The silicon wafer cutting device according to claim 1, characterized in that: The light emitted by the distance measuring sensor forms an angle of 45° with the vertical diameter of the first wire wheel.

3. The silicon wafer cutting device according to claim 1, characterized in that: The cutting machine is also used to maintain the original cutting parameters and cut the crystal rod according to the normal signal sent by the control center.

4. A silicon wafer cutting system, characterized in that: The invention comprises a control center and a silicon wafer cutting device as claimed in any one of claims 1 to 3, wherein the control center is used to calculate the deviation value of the cutting surface according to the measurement data transmitted by the ranging sensor, and if the deviation value exceeds a set threshold, the control center sends a compensation signal; if the deviation value is within a set threshold, the control center sends a normal signal; and the control center is also used to transmit alarm parameters.

5. A method for cutting a silicon wafer, characterized in that: Using the silicon wafer cutting system as claimed in claim 4, the cutting method comprises the following steps: Using a distance measuring sensor to emit light to the cutting surface of the stopped cutting wire mesh carrying the crystal rod, the detection position of the distance measuring sensor is placed on the side of the crystal rod adjacent to the first wire wheel; The control center receives the measurement data transmitted by the distance measuring sensor, calculates the deviation value of the cutting surface, and sends a compensation signal according to the deviation value exceeding a set threshold value; The wire bow automatic compensation system corrects the cutting parameters of the cutting machine according to the received compensation signal and the alarm parameters transmitted by the control center to adjust the wire bow of the cutting wire network, and the cutting machine cuts the crystal rod according to the corrected cutting parameters.

6. The cutting method according to claim 5, characterized in that: The control center sends a normal signal within a set threshold value according to the deviation value, and the cutting machine maintains the original cutting parameters to cut the crystal rod according to the received normal signal.

7. The cutting method according to claim 5, characterized in that: The cutting parameters include table speed, wire speed, wire supply amount and wire return amount.

8. The cutting method according to claim 7, characterized in that: The step of correcting the cutting parameters of the cutting machine comprises: Reduce the table speed and line speed, while increasing the wire supply and reducing the wire return.

9. The cutting method according to claim 8, characterized in that: The reduction in the stage speed is greater than the reduction in the line speed.

10. The cutting method according to claim 9, characterized in that: The speed reduction difference between the table speed and the wire speed in the initial cutting step is greater than the speed reduction difference between the two in the subsequent cutting steps, the increase in the wire supply amount is the same in different cutting steps, and the decrease in the wire return amount is the same in different cutting steps.

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