Pouring control method and pouring system

Abstract

The invention provides a pouring control method and a pouring system, and relates to the technical field of pouring equipment. The pouring control method comprises the steps that the current material injection stage of pouring equipment is obtained, and the pouring equipment comprises a mold and a vacuum degree adjusting device; and based on the current material injection stage, determining a target adjustment strategy of the vacuum degree adjustment device in a plurality of preset adjustment strategies. And a vacuum degree adjusting device is controlled to adjust the vacuum degree of a cavity of the mold according to the target adjusting strategy, so that the cavity of the mold is in the vacuum degree corresponding to the current material injection stage. In the pouring process, the vacuum degree of the cavity is adjusted in real time, the production cost can be reduced, and the situation that the quality is poor or the rejection rate is high due to the bubble problem can be relieved.

Description

Technical Field

[0001] The present application relates to the technical field of pouring equipment, and in particular to a pouring control method and a pouring system. Background Art

[0002] Generally, vacuum casting is a production method that pours materials into the mold cavity under vacuum environment and solidifies them. However, vacuum casting still has the problem of poor quality or high scrap rate due to the existence of bubbles, resulting in high production costs.

[0003] Based on this, how to improve product quality and reduce production costs is a technical problem that technicians in this field urgently need to solve. Summary of the invention

[0004] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and to provide a pouring control method and a pouring system, which can reduce production costs and alleviate the poor quality or high scrap rate caused by the presence of bubbles by adjusting the vacuum degree of the cavity in real time during the pouring process.

[0005] This application provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a pouring control method, the pouring control method comprising:

[0007] Acquire a current injection stage of a casting device, the casting device comprising a mold and a vacuum adjustment device; and based on the current injection stage, determine a target adjustment strategy of the vacuum adjustment device from a plurality of preset adjustment strategies;

[0008] The vacuum degree adjusting device is controlled to adjust the vacuum degree of the cavity of the mold according to the target adjustment strategy, so that the cavity of the mold is at a vacuum degree corresponding to the current injection stage.

[0009] In some embodiments of the first aspect, before obtaining the current material injection stage of the pouring equipment, the method further includes:

[0010] Obtaining pouring parameters corresponding to the pouring equipment;

[0011] Comparing the pouring parameters with corresponding preset parameters to obtain a comparison result;

[0012] According to the comparison result, the current filling stage of the pouring equipment is determined among a plurality of preset filling stages.

[0013] In some embodiments of the first aspect, the pouring parameters include:

[0014] Injection time or injection amount.

[0015] In some embodiments of the first aspect, determining the target adjustment strategy of the vacuum adjustment device from a plurality of preset adjustment strategies based on the current injection stage includes:

[0016] Obtaining a mode correspondence relationship corresponding to the pouring equipment, wherein the mode correspondence relationship is used to characterize a correspondence relationship between a material injection stage and a preset adjustment strategy;

[0017] Based on the mode correspondence corresponding to the pouring equipment and the current material injection stage, a target adjustment strategy corresponding to the pouring equipment is determined from a plurality of preset adjustment strategies.

[0018] In some embodiments of the first aspect, the controlling the vacuum degree adjusting device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is before the vacuum degree corresponding to the current injection stage further includes:

[0019] The injection process of the casting equipment is divided into a plurality of injection stages; in terms of timing, the vacuum degree of the mold cavity of the mold corresponding to the plurality of injection stages changes from large to small;

[0020] Based on the current injection stage of the casting equipment, the vacuum degree of the cavity of the mold corresponding to the current injection stage is determined.

[0021] In some embodiments of the first aspect, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes:

[0022] Based on the injection stage, determining the vacuum degree corresponding to the cavity of the mold;

[0023] The vacuum degree adjusting device is controlled to operate according to the vacuum degree.

[0024] In some embodiments of the first aspect, the plurality of preset adjustment strategies include:

[0025] Increase vacuum adjustment strategy, maintain vacuum adjustment strategy and reduce vacuum adjustment strategy;

[0026] If the vacuum degree increasing adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes:

[0027] Controlling the vacuum degree adjustment device to increase the vacuum degree of the mold cavity according to the target adjustment strategy, so that the mold cavity is at a vacuum degree corresponding to the current injection stage;

[0028] If the vacuum degree adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes:

[0029] Controlling the vacuum degree adjustment device to maintain the current vacuum degree of the mold cavity according to the target adjustment strategy, so that the mold cavity is at the vacuum degree corresponding to the current injection stage;

[0030] If the vacuum degree reduction strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes:

[0031] The vacuum degree adjusting device is controlled to reduce the vacuum degree of the cavity of the mold according to the target adjustment strategy, so that the cavity of the mold is at a vacuum degree corresponding to the current injection stage.

[0032] In a second aspect, the present application further provides a pouring system, the pouring system comprising:

[0033] Vacuum box;

[0034] A mold, wherein the mold is arranged in the vacuum box and has a cavity;

[0035] A vacuum degree adjusting device is connected to the mold, and the vacuum degree adjusting device can adjust the vacuum degree of the cavity.

[0036] In some embodiments of the second aspect, the mold has an injection port and an exhaust port, the injection port is located at the bottom of the mold, and the exhaust port is located at the top of the mold.

[0037] In some embodiments of the second aspect, the vacuum degree adjusting device comprises a vacuum pump, a controller, a first vacuum degree sensor and a first vacuum valve; wherein the injection port is connected to the bottom of the cavity, and the exhaust port of the cavity is connected to the air inlet of the vacuum pump;

[0038] The first vacuum sensor is disposed at the exhaust port, and is used to detect the vacuum degree in the cavity. The air outlet interface of the first vacuum valve is connected to the exhaust port, and the air inlet interface of the first vacuum valve is connected to the outside of the vacuum box.

[0039] The controller is electrically connected to the vacuum pump, the first vacuum degree sensor, and the first vacuum valve respectively.

[0040] In some embodiments of the second aspect, the vacuum degree adjustment device further includes a second vacuum degree sensor and a second vacuum valve, the vacuum box has a vacuum port, and the vacuum port is connected to the air inlet of the vacuum pump;

[0041] The second vacuum degree sensors are all arranged in the vacuum box, and the second vacuum degree sensors are used to detect the vacuum degree in the vacuum box. The air outlet interface of the second vacuum valve is connected to the vacuum box, and the air inlet interface of the second vacuum valve is connected to the outside of the vacuum box, and the second vacuum degree sensor and the second vacuum valve are electrically connected to the controller respectively.

[0042] In some embodiments of the second aspect, the vacuum degree adjusting device further comprises a switch valve, and the vacuum port is connected to the air inlet of the vacuum pump through the switch valve;

[0043] And / or, the pouring system also includes an injection device and an information collection device, the injection device is used to inject material into the injection port, the information collection device is electrically connected to the injection device, the information collection device is used to collect the injection amount of the injection device, and the information collection device is electrically connected to the controller.

[0044] In a third aspect, the present application further provides an electronic device, including:

[0045] Memory, used to store computer programs;

[0046] A processor is used to execute the computer program to implement the pouring control method as described in any one of the above embodiments.

[0047] In a fourth aspect, the present application further provides a storage medium for storing a computer program, wherein the computer program, when executed by a processor, implements a pouring control method as described in any one of the above embodiments.

[0048] The embodiments of the present application have the following advantages:

[0049] The present application provides a pouring control method, and this improved pouring control method can indeed effectively deal with the bubble problem existing in the traditional vacuum pouring process, thereby improving product quality and reducing the scrap rate. By dynamically adjusting the vacuum degree in the mold cavity according to the different stages of the pouring process, the fluidity and exhaust effect of the material can be better controlled, and the formation of bubbles can be reduced. At the same time, since the scrap rate is reduced, it also means reducing production costs. Furthermore, as the pouring process proceeds, the vacuum degree of the cavity is adjusted to a lower vacuum degree through the control system, which can save the working time of the vacuum adjustment device and save energy. At the same time, a lower vacuum degree can also appropriately reduce the sealing requirements of the machine and the mold, thereby appropriately reducing the manufacturing cost of the machine and the mold.

[0050] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0052] Figure 1 A schematic flow chart of a pouring control method provided in an embodiment of the present application is shown;

[0053] Figure 2 A structural schematic diagram of a pouring system provided by an embodiment of the present application from one perspective is shown;

[0054] Figure 3 A schematic structural diagram of a pouring system provided by an embodiment of the present application from another perspective is shown;

[0055] Figure 4 The figure shows an internal structure diagram of an electronic device provided by an embodiment of the present application.

[0056] Description of main component symbols:

[0057] 100 - vacuum box; 110 - vacuum port; 120 - second vacuum valve; 200 - injection nozzle; 300 - mold; 310 - injection port; 320 - exhaust port; 400 - electronic device; 410 - processor; 420 - memory; 421 - operating system; 422 - computer program; 430 - power supply; 440 - communication interface; 450 - input and output interface; 460 - communication bus. DETAILED DESCRIPTION

[0058] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0059] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0060] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of the template are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0063] In the related art, the vacuum casting process is a production method in which the material is cast into the cavity of the mold 300 under a vacuum environment for solidification and molding. However, the vacuum casting process still has the problem of poor quality or high scrap rate due to the existence of bubbles, resulting in high production costs. Therefore, how to improve product quality and reduce production costs is a technical problem that technicians in this field need to solve urgently.

[0064] like Figure 2 and Figure 3 As shown, in order to solve the above technical problems, the present application also provides a casting system, which includes a vacuum box 100, a mold 300 and a vacuum regulating device, wherein the mold 300 is arranged in the vacuum box 100, and the mold 300 has a cavity; the vacuum regulating device is connected to the mold 300, and the vacuum regulating device can adjust the vacuum degree of the cavity.

[0065] In these embodiments, the vacuum box 100 provides a vacuum environment to ensure that the pouring process is performed without air interference. Generally, the vacuum box 100 is a sealed container that can accommodate the mold 300.

[0066] The mold 300 is used to shape the casting material to achieve the desired shape and size. The mold 300 has a cavity, and the shape and size of the cavity are determined according to the design requirements of the final product.

[0067] The vacuum degree regulating device is used to dynamically regulate the vacuum degree in the cavity of the mold 300 to optimize the pouring process. Generally, the vacuum degree regulating device includes components such as a vacuum pump, a vacuum valve, a vacuum degree sensor, and a control system.

[0068] For ease of understanding, the working process is:

[0069] Preparation stage: Place the mold 300 in the vacuum box 100 and ensure that the vacuum box 100 is well sealed. Start the vacuum degree adjustment device to extract the air in the vacuum box 100 and the cavity to create a vacuum environment.

[0070] Injection stage: the injection nozzle 200 is raised and pushed into the injection port 310 to close the injection port 310, and the casting material is injected into the cavity of the mold 300 through the injection port 310. By real-time monitoring of the injection time and injection amount, it is ensured that the injection process proceeds as planned.

[0071] Vacuum degree adjustment stage: 1) Get the current injection stage: obtain the current injection time, injection amount and other information through the flow sensor or timer to determine the current injection stage. 2) Find the mode correspondence: find the record matching the current injection stage in the preset mode correspondence and determine the target vacuum degree. 3) If the target vacuum degree corresponding to the current injection stage is lower than the actual vacuum degree, the vacuum degree is increased, and the vacuum degree adjustment device is controlled to increase the vacuum degree in the cavity. If the target vacuum degree corresponding to the current injection stage meets the actual vacuum degree, the vacuum degree adjustment device is controlled to maintain the current vacuum degree. If the target vacuum degree corresponding to the current injection stage is higher than the actual vacuum degree, the vacuum degree adjustment device is controlled to reduce the vacuum degree in the cavity. 4) Curing stage: After the injection is completed, continue to maintain or adjust the vacuum degree in the cavity to ensure that no bubbles are generated during the curing process. According to the characteristics of the material, heating or other auxiliary measures are required to accelerate the curing process. 5) Take out the finished product: After the material is completely cured, turn off the vacuum pump, open the vacuum box 100, and take out the finished product.

[0072] For example, there is a sealed environment inside the vacuum box 100, and the mold 300 is placed therein. The vacuum degree adjustment device is connected to the mold 300 through a pipeline, and can adjust the vacuum degree in the cavity.

[0073] Obviously, by dynamically adjusting the vacuum degree in the mold cavity of mold 300, defects such as bubbles can be effectively reduced, and the quality and consistency of the product can be improved. The scrap caused by bubble problems can be reduced, and the production cost can be reduced. Automatic control of the vacuum degree can speed up the production rhythm. And reduce production energy consumption.

[0074] like Figure 2 and Figure 3 As shown, in some embodiments, the mold 300 has an injection port 310 and an exhaust port 320 , the injection port 310 is located at the bottom of the mold 300 , the exhaust port 320 is located at the top of the mold 300 , and the injection port 310 is connected to the vacuum box 100 .

[0075] In these embodiments, the injection port 310 is located at the bottom of the mold 300. The injection port 310 is used to inject the casting material. Placing the injection port 310 at the bottom can ensure that the material fills the mold 300 from bottom to top, reducing the formation of bubbles.

[0076] The exhaust port 320 is located at the top of the mold 300. The exhaust port 320 is used to exhaust air and excess gas in the mold 300. Providing the exhaust port 320 at the top can ensure that the air and gas are naturally discharged during the material filling process to avoid the accumulation of bubbles.

[0077] Optionally, the injection nozzle 200 can be raised and lowered so that the injection nozzle 200 can dock with the injection port 310 to ensure that the material can be smoothly injected into the mold 300. When the injection nozzle 200 is separated from the injection port 310, the injection port 310 is connected to the vacuum box 100 so that the vacuum box 100 can be evacuated using the vacuum degree adjustment device. When the injection nozzle 200 docks with the injection port 310, the injection port 310 and the vacuum box 100 are separated by the injection nozzle 200, that is, the injection port 310 and the vacuum box 100 are in a disconnected state. At this time, the vacuum box 100 can be in a stable vacuum state, which is beneficial to the insulation of the mold 300. Subsequently, only the vacuum degree of the cavity needs to be adjusted, and there is no need to adjust the vacuum degree of the vacuum box 100, which is beneficial to reducing energy consumption.

[0078] In some embodiments, the vacuum degree adjustment device includes a vacuum pump, a controller, a first vacuum degree sensor and a first vacuum valve; wherein the injection port 310 is connected to the bottom of the cavity, and the exhaust port 320 of the cavity is connected to the air inlet of the vacuum pump;

[0079] The first vacuum sensor is disposed at the exhaust port 320, and is used to detect the vacuum degree in the cavity. The air outlet interface of the first vacuum valve is connected to the exhaust port 320, and the air inlet interface of the first vacuum valve is connected to the outside of the vacuum box.

[0080] The controller is electrically connected to the vacuum pump, the first vacuum degree sensor, and the first vacuum valve respectively.

[0081] In these embodiments, the composition of the vacuum degree adjusting device is described in detail. That is:

[0082] The vacuum pump is used to extract the air in the cavity of the mold 300 to create a vacuum environment. The air inlet of the vacuum pump is connected to the exhaust port 320 of the mold 300.

[0083] The controller is used to control the operation of the vacuum pump and the first vacuum valve, and adjust the vacuum degree according to the data fed back by the first vacuum degree sensor. The controller is electrically connected to the vacuum pump, the first vacuum degree sensor and the first vacuum valve respectively.

[0084] The first vacuum sensor is used to detect the vacuum degree in the cavity of the mold 300. The first vacuum sensor is disposed near the exhaust port 320 of the mold 300 to ensure that the vacuum degree in the cavity can be accurately measured.

[0085] The first vacuum valve is used to control the connection between the mold cavity of the mold 300 and the outside world and adjust the vacuum degree in the mold cavity. The air outlet interface of the first vacuum valve is connected to the exhaust port 320 of the mold 300, and the air inlet interface is connected to the outside world of the vacuum box.

[0086] Specific implementation steps: Place the mold 300 in the vacuum box 100 and ensure that the vacuum box 100 is well sealed. Start the vacuum pump to extract the air in the vacuum box 100 to create a vacuum environment.

[0087] The casting material is injected into the cavity of the mold 300 through the injection port 310. Since the injection port 310 is located at the bottom, the material will fill the mold 300 from the bottom to the top, reducing the formation of bubbles. By monitoring the injection time and injection amount, the injection process is ensured to proceed as planned. The air and gas in the mold 300 are discharged through the exhaust port 320. The first vacuum sensor detects the vacuum degree in the cavity and transmits the data to the controller. The controller controls the opening and closing of the first vacuum valve according to the current vacuum degree and the preset target vacuum degree, and adjusts the vacuum degree in the cavity until the vacuum degree of the cavity reaches the vacuum degree corresponding to the current injection stage.

[0088] Get the current injection stage, such as obtaining the current injection time, injection volume and other information, to determine the current injection stage. In the preset mode correspondence, find the record that matches the current injection stage and determine the target vacuum degree. Control the vacuum adjustment device to adjust the vacuum degree of the cavity. For example, increase the vacuum degree: if the target adjustment strategy is to increase the vacuum degree, the controller controls the vacuum pump to increase the suction force and close the first vacuum valve at the same time. Or. Maintain the vacuum degree: if the target adjustment strategy is to maintain the vacuum degree, the controller controls the vacuum pump to maintain the current suction force, and the first vacuum valve remains closed. Or, reduce the vacuum degree: if the target adjustment strategy is to reduce the vacuum degree, the controller controls the vacuum pump to reduce the suction force and open the first vacuum valve at the same time to allow some air to enter the cavity.

[0089] Exemplarily, the first vacuum degree sensor may be a piezoresistive vacuum gauge, a Pirani vacuum gauge, a thermocouple vacuum gauge, an oscillating vacuum gauge, an ion gauge, a cold cathode gauge, or the like.

[0090] In some embodiments, the vacuum degree adjustment device further includes a second vacuum degree sensor and a second vacuum valve 120, the vacuum box 100 has a vacuum port 110, and the vacuum port 110 is connected to the air inlet of the vacuum pump;

[0091] The second vacuum degree sensors are all arranged in the vacuum box 100, and the second vacuum degree sensors are used to detect the vacuum degree in the vacuum box 100. The air outlet interface of the second vacuum valve 120 is connected to the vacuum box, and the air inlet interface of the second vacuum valve 120 is connected to the outside of the vacuum box, and the second vacuum degree sensor and the second vacuum valve 120 are electrically connected to the controller respectively.

[0092] In these embodiments, the monitoring and control of the vacuum degree in the vacuum box 100 is added. This design can not only accurately control the vacuum degree in the cavity of the mold 300, but also ensure the vacuum environment in the entire vacuum box 100.

[0093] The air inlet of the vacuum pump is connected to the exhaust port 320 of the mold 300 and the vacuum port 110 of the vacuum box 100. The controller controls the operation of the vacuum pump, the first vacuum valve and the second vacuum valve 120 to adjust the vacuum degree. The controller is electrically connected to the vacuum pump, the first vacuum degree sensor, the first vacuum valve, the second vacuum degree sensor and the second vacuum valve 120 respectively.

[0094] The second vacuum sensor detects the vacuum degree in the vacuum box 100 to ensure that the vacuum degree in the vacuum box 100 can be accurately measured. The second vacuum valve 120 controls the connection between the vacuum box 100 and the outside world and adjusts the vacuum degree in the vacuum box 100. The air outlet interface of the second vacuum valve 120 is connected to the vacuum box 100, and the air inlet interface is connected to the outside world of the vacuum box.

[0095] Exemplarily, the second vacuum sensor may be a piezoresistive vacuum gauge, a Pirani vacuum gauge, a thermocouple vacuum gauge, an oscillating vacuum gauge, an ion gauge, a cold cathode gauge, or the like.

[0096] In some embodiments, the vacuum degree adjusting device further includes a switch valve, and the vacuum port 110 is connected to the air inlet of the vacuum pump via the switch valve.

[0097] In these embodiments, the switch valve is used to control the connection between the vacuum box 100 and the vacuum pump, and adjust the vacuum degree in the vacuum box 100. The air inlet interface of the switch valve is connected to the vacuum port 110 of the vacuum box 100, and the air outlet interface is connected to the air inlet of the vacuum pump. Obviously, when the vacuum box 100 reaches the set vacuum degree, the switch valve is closed, so that the vacuum box 100 and the vacuum pump are in a disconnected state. In the subsequent injection process, only the vacuum degree of the cavity needs to be adjusted, which is conducive to reducing energy consumption.

[0098] For example, the switch valve may be a butterfly valve or a ball valve, etc.

[0099] In some embodiments, the pouring system further includes an injection device and an information collection device, wherein the injection device is used to inject material into the injection port 310, the information collection device is electrically connected to the injection device, the information collection device is used to collect the injection amount of the injection device, and the information collection device is electrically connected to the controller.

[0100] In these embodiments, the mold 300 has an injection port 310 and an exhaust port 320, wherein the injection port 310 is located at the bottom of the mold 300 and the exhaust port 320 is located at the top of the mold 300. The injection port 310 is connected to the injection nozzle 200 of the injection device, and the exhaust port 320 is connected to the air inlet of the vacuum pump.

[0101] The injection device is used to inject material into the injection port 310 of the mold 300. It usually includes an injection pump, an injection pipe and an injection nozzle 200. The injection device is electrically connected to the information collection device, and the information collection device is electrically connected to the controller.

[0102] The information collection device collects the injection amount of the injection device. For example, a flow sensor or a weighing sensor can be used. The information collection device is connected to the injection device to ensure that the injection amount data can be collected in real time and the data can be transmitted to the controller.

[0103] The information acquisition device collects the injection amount of the injection device in real time and transmits the data to the controller. The controller ensures that the injection process proceeds as planned based on the injection amount data. The information acquisition device monitors the injection time and injection amount in real time, obtains the vacuum degree corresponding to the current injection stage, and ensures that the injection process proceeds as planned. The first vacuum degree sensor detects the vacuum degree in the cavity and transmits the data to the controller. The controller controls the opening and closing of the first vacuum valve and adjusts the vacuum degree in the cavity based on the current vacuum degree and the preset vacuum degree corresponding to the current injection stage.

[0104] The current injection time, injection volume and other information are obtained through sensors to determine the current injection stage. In the preset mode correspondence, the record matching the current injection stage is found to determine the target vacuum degree, and then the vacuum degree of the cavity is adjusted to match the vacuum degree corresponding to the current stage.

[0105] like Figure 1 As shown, in order to solve the above technical problems, an embodiment of the present application provides a pouring control method, which includes the following steps:

[0106] Step S100: obtaining a current injection stage of a casting device, the casting device comprising a mold 300 and a vacuum regulating device; and determining a target regulating strategy of the vacuum regulating device from a plurality of preset regulating strategies based on the current injection stage.

[0107] In these embodiments, this step involves using sensors or other monitoring devices to detect the current working state of the pouring equipment (including the mold 300 and the vacuum adjustment device), that is, which specific injection stage it is in. In other words, the pouring process is divided into multiple stages, such as the initial filling stage, the intermediate stabilization stage, and the final solidification stage. Each injection stage has different characteristics, so different control strategies need to be adopted.

[0108] Based on the information of the current filling stage, the most suitable strategy for the current situation is selected from a series of pre-set adjustment strategies. These preset adjustment strategies include but are not limited to: increase or decrease vacuum, maintain a specific vacuum, etc. Choosing the right strategy is crucial to ensure pouring quality and efficiency.

[0109] According to different injection stages, corresponding vacuum adjustment strategies are formulated. These strategies are pre-set based on experimental data or theoretical analysis, with the aim of ensuring that the optimal vacuum conditions can be achieved at each specific stage to promote good filling and exhaust of the material.

[0110] It should be noted that it is necessary to accurately identify the specific stage of the current pouring process, which involves monitoring parameters such as pouring time and material flow state. Accurate stage identification is the basis for the subsequent adoption of correct adjustment strategies.

[0111] Step S200: Control the vacuum degree adjustment device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy, so that the cavity of the mold 300 is at a vacuum degree corresponding to the current injection stage.

[0112] In these embodiments, based on the above steps, the target adjustment strategy is determined, and the next step is to execute this step, that is, to adjust the vacuum degree in the cavity of the mold 300 by controlling the vacuum adjustment device to make it meet the requirements of the current injection stage. This step requires high-precision control technology and response speed to ensure that the vacuum degree can be adjusted in a timely and accurate manner.

[0113] In other words, during the pouring process, the vacuum level in the cavity of the mold 300 is automatically adjusted depending on the current stage. This dynamic adjustment capability is the core of the method, allowing the system to react to actual conditions rather than adopting fixed settings.

[0114] Obviously, this improved pouring control method can indeed effectively deal with the bubble problem existing in the traditional vacuum pouring process, thereby improving product quality and reducing the scrap rate. By dynamically adjusting the vacuum degree in the mold cavity of the mold 300 according to the different stages of the pouring process, the fluidity and exhaust effect of the material can be better controlled, and the formation of bubbles can be reduced. At the same time, since the scrap rate is reduced, it also means reducing production costs. Furthermore, as the pouring process proceeds, the vacuum degree of the cavity is adjusted to a lower vacuum degree through the control system, which can save the working time of the vacuum adjustment device and save energy. At the same time, a lower vacuum degree can also appropriately reduce the sealing requirements of the machine and the mold 300, thereby appropriately reducing the manufacturing cost of the machine and the mold 300.

[0115] In addition, in order to implement this control method, it is also necessary to develop corresponding software control systems and accurate and reliable sensors to monitor the changes in various parameters during the pouring process.

[0116] In some embodiments, before obtaining the current material injection stage of the pouring equipment, the method further includes:

[0117] Obtaining pouring parameters corresponding to the pouring equipment;

[0118] Comparing the pouring parameters with corresponding preset parameters to obtain a comparison result;

[0119] According to the comparison result, the current filling stage of the pouring equipment is determined among a plurality of preset filling stages.

[0120] In these embodiments, an important preliminary step of the pouring control method is added, that is, how to accurately determine the specific material injection stage that the pouring equipment is currently in. This process not only improves the intelligence of the system, but also enhances the fine control capability of the pouring process.

[0121] Among them, obtaining the pouring parameters corresponding to the pouring equipment: This link mainly involves collecting key data about the pouring process, such as pouring volume, pouring time, etc. These parameters can be collected in real time through various sensors installed on the pouring equipment. For example, a timer can be used to monitor the change of pouring time; a flow sensor can be used to detect the pouring volume.

[0122] Compare the pouring parameters with the corresponding preset parameters to obtain the comparison results: Preset parameters are ideal values ​​or ranges that are pre-defined based on material properties and product requirements. These parameters come from historical data, experimental results or industry standards. The comparison process aims to evaluate the injection stage to which the actual pouring parameters belong. The comparison result can be a simple "match" or "mismatch" signal. It should be noted that each injection stage is set with matching preset parameters.

[0123] According to the comparison results, the current filling stage of the pouring equipment is determined in multiple preset filling stages: Based on the comparison results, the system can determine which specific stage the current pouring process is in. For example, if the injection volume reaches the preset filling stage standard, it can be confirmed that it is currently in the filling stage. Accurately judging the filling stage is crucial to selecting the appropriate regulation strategy. Different filling stages require different vacuum settings to optimize material flow and exhaust effects.

[0124] Obviously, by comparing the actual parameters with the preset parameters, the injection stage can be determined more accurately, avoiding possible errors caused by human judgment.

[0125] In some embodiments, the pouring parameters include: injection time or injection amount.

[0126] In these embodiments, these parameters can help to more accurately determine the current injection stage and select a suitable adjustment strategy accordingly.

[0127] The injection time refers to the time interval from the start of injecting material into the mold 300 to the stop of injection. When the flow rate of the injection port 310 is constant, the injection amount can be calculated by obtaining the injection time. The injection time can help determine the different stages of the casting process.

[0128] The injection amount refers to the amount of material injected into the mold 300 during the pouring process. Compared with the above method, it is more direct.

[0129] For example, when the material enters the mold 300 from the injection nozzle 200, timing and metering are started at the same time; when the material fills a certain proportion of the mold cavity 300, the vacuum degree of the mold cavity is adjusted; when the material fills the mold cavity 300, the vacuum degree of the mold cavity is adjusted again. Generally, the entire pouring process is divided into 3 to 5 injection stages, and the vacuum degree of different injection stages is set in advance. Generally, as the pouring process proceeds, the vacuum degree will gradually decrease to prevent the pouring material from boiling in the mold cavity of the mold 300 and generating bubbles.

[0130] Specific implementation steps:

[0131] Get injection time and injection amount: Use sensors such as flow meters and time counters to monitor the injection process in real time. Record the start and end time of each injection, as well as the total amount of material injected.

[0132] Compare with preset parameters: According to material characteristics and product requirements, pre-set standard values ​​or ranges for injection time and injection amount. Compare the actual measured injection time and injection amount with the preset values ​​to determine whether they meet expectations.

[0133] Determine the current injection stage: According to the comparison results, determine the current injection stage. For example, if the injection time is short and the injection amount is small, it is in the early stage of injection. If the injection time is long and the injection amount is close to the preset total amount, it is in the final stage of injection.

[0134] Select target adjustment strategy: Based on the current injection stage, select the most appropriate strategy from multiple preset adjustment strategies. Adjust the vacuum adjustment device so that the vacuum degree of the mold cavity 300 meets the requirements of the current stage.

[0135] For example, the preset injection time is 60 seconds and the injection volume is 1000 ml. In the actual pouring process:

[0136] Initial injection period (0-30 seconds): actual injection time: 20 seconds, actual injection volume: 500 ml.

[0137] Comparison results: injection time and injection volume are within the expected range. Current stage: Target adjustment strategy at the initial stage of injection: Maintain a high vacuum degree to ensure that the material flows smoothly into the mold 300.

[0138] At the end of filling (30-60 seconds): actual filling time: 40 seconds, actual filling volume: 900 ml.

[0139] Comparison results: injection time is close to the preset value, and injection volume is slightly lower than the preset value. Current stage: the end of injection. Target adjustment strategy: gradually reduce the vacuum degree to ensure that the mold 300 is fully filled. By this method, the pouring process can be controlled more accurately, defects such as bubbles can be reduced, and product quality and production efficiency can be improved.

[0140] In some embodiments, determining the target adjustment strategy of the vacuum adjustment device from a plurality of preset adjustment strategies based on the current injection stage includes:

[0141] Acquire a mode correspondence relationship corresponding to the pouring equipment, wherein the mode correspondence relationship is used to characterize a correspondence relationship between a material injection stage and a preset adjustment strategy;

[0142] Based on the mode correspondence corresponding to the pouring equipment and the current material injection stage, a target adjustment strategy corresponding to the pouring equipment is determined from a plurality of preset adjustment strategies.

[0143] In these embodiments, this method optimizes the pouring process by establishing a correspondence between the injection stage and the preset adjustment strategy to ensure that the most appropriate adjustment strategy is adopted in each stage.

[0144] Get the corresponding mode relationship of the pouring equipment:

[0145] The pattern correspondence is a set of rules or mapping tables that describe the correspondence between different injection stages and the corresponding preset adjustment strategies. Through multiple experiments, the optimal vacuum adjustment strategy for different injection stages is recorded. Based on material properties and process requirements, the optimal adjustment strategy for different stages is obtained through theoretical calculation. Using historical production data, the commonly used adjustment strategies for each stage are analyzed and summarized.

[0146] Based on the mode correspondence and the current injection stage, determine the target adjustment strategy:

[0147] Get the current injection stage: Get the information of the current injection stage, such as injection time, injection volume, etc. through sensors and monitoring equipment. Find the mode correspondence: Find the record that matches the current injection stage in the existing mode correspondence table. Determine the target adjustment strategy: Select the corresponding preset adjustment strategy based on the matching records.

[0148] For example, the corresponding relationship of the pouring process modes is shown in Table 1 below:

[0149] Table 1

[0150] Filling stage Injection time (seconds) Vacuum degree(mPa) Initial filling stage 0-20 5-25 Intermediate stable stage 20-40 30-80 Final filling stage 40-60 150-300

[0151] Get the current injection stage: Assume that the current injection time is 35 seconds. Find the pattern correspondence: In the pattern correspondence table, find the record with an injection time of 35 seconds. The matched record is: intermediate stable stage. Determine the target adjustment strategy: According to the pattern correspondence table, the target vacuum degree of the intermediate stable stage is 30-80mPa. Therefore, the selected target adjustment strategy is to adjust the vacuum degree of the mold 300 cavity to 30-80mPa.

[0152] Obviously, through the clear pattern correspondence, the adjustment strategy suitable for the current injection stage can be selected more accurately, avoiding the subjectivity and uncertainty of manual judgment. Each stage has a targeted adjustment strategy, which can better control the vacuum degree during the pouring process, reduce defects such as bubbles, and improve product quality. In addition, the automated selection of adjustment strategies can speed up the production rhythm and reduce production interruptions caused by improper adjustment.

[0153] In some embodiments, the controlling the vacuum degree adjusting device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy so that the cavity of the mold 300 is at a vacuum degree before the vacuum degree corresponding to the current injection stage further includes:

[0154] The injection process of the casting equipment is divided into a plurality of injection stages; in terms of timing, the vacuum degree of the cavity of the mold 300 corresponding to the plurality of injection stages changes from large to small;

[0155] Based on the current injection stage of the casting equipment, the vacuum degree of the cavity of the mold 300 corresponding to the current injection stage is determined.

[0156] In these embodiments, the pouring control method is further refined, especially how to dynamically adjust the vacuum degree of the mold cavity of the mold 300 according to the timing during the injection process. This method can more effectively control the pouring process, reduce defects such as bubbles, and improve product quality by dividing the injection process into multiple injection stages and dynamically adjusting the vacuum degree in each injection stage.

[0157] The filling process is divided into several filling stages:

[0158] The entire injection process is divided into several consecutive injection stages, each of which has different characteristics and requirements.

[0159] For example, the process is divided into multiple stages according to the injection time based on time, such as the initial stage, the middle stage and the final stage. Alternatively, in other embodiments, the injection amount is used as the basis for division, and the process is divided into multiple stages according to the change of the injection amount, such as the low injection amount stage, the medium injection amount stage and the high injection amount stage. Alternatively, the process is divided into multiple stages according to the flow state and filling condition of the material.

[0160] In terms of timing, the vacuum degree of the mold cavity 300 corresponding to the multiple injection stages changes from large to small: as the injection process proceeds, the vacuum degree in the mold cavity 300 is gradually reduced.

[0161] Exemplary, initial stage: A higher vacuum degree helps to quickly remove the air in the mold 300 and prevent the formation of bubbles.

[0162] Intermediate stage: A moderate vacuum degree can balance the fluidity of the material and the exhaust effect.

[0163] Final stage: A lower vacuum level helps the final filling and solidification of the material, avoiding deformation of the material due to over-vacuuming.

[0164] Based on the current injection stage, determine the vacuum degree of the mold cavity 300 corresponding to the current injection stage:

[0165] Get the current injection stage: Get the information of the current injection stage, such as injection time, injection volume, etc. through sensors and monitoring equipment. Determine the current injection stage: Determine the current injection stage according to the injection time and injection volume. Find the mode correspondence: Find the record that matches the current injection stage in the existing mode correspondence table. Determine the target vacuum degree: Select the corresponding target vacuum degree according to the matching record.

[0166] In some embodiments, controlling the vacuum degree adjusting device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy so that the cavity of the mold 300 is at a vacuum degree corresponding to the current injection stage includes:

[0167] Based on the current injection stage, determining the vacuum degree corresponding to the cavity of the mold 300;

[0168] According to the vacuum degree, the vacuum degree adjusting device is controlled to operate.

[0169] In these embodiments, after the vacuum degree corresponding to the current injection stage is determined, the determined target vacuum degree value is sent to the vacuum degree adjusting device. The vacuum degree adjusting device adjusts the vacuum degree in the cavity of the mold 300 to reach the target value according to the received instruction.

[0170] For example, the vacuum level in the cavity of the mold 300 is monitored in real time by a vacuum sensor to ensure that the vacuum level is maintained near a target value.

[0171] In some embodiments, the plurality of preset adjustment strategies include:

[0172] Increase vacuum degree adjustment strategy, maintain vacuum degree adjustment strategy and reduce vacuum degree strategy;

[0173] If the vacuum degree increasing adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy so that the cavity of the mold 300 is at a vacuum degree corresponding to the current injection stage includes:

[0174] Controlling the vacuum degree adjustment device to increase the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy, so that the cavity of the mold 300 is at the vacuum degree corresponding to the current injection stage;

[0175] If the vacuum degree adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy so that the cavity of the mold 300 is at a vacuum degree corresponding to the current injection stage includes:

[0176] Controlling the vacuum degree adjustment device to maintain the current vacuum degree of the cavity of the mold 300 according to the target adjustment strategy, so that the cavity of the mold 300 is at the vacuum degree corresponding to the current injection stage;

[0177] If the vacuum degree reduction strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy so that the cavity of the mold 300 is at a vacuum degree corresponding to the current injection stage includes:

[0178] The vacuum degree adjusting device is controlled to reduce the vacuum degree of the cavity of the mold 300 according to the target adjustment strategy, so that the cavity of the mold 300 is at the vacuum degree corresponding to the current injection stage.

[0179] In these embodiments, a vacuum degree adjustment strategy is added: in the current injection stage, the vacuum degree in the cavity of the mold 300 needs to be increased. Usually, in the early stage of injection, a higher vacuum degree is required to quickly remove the air in the mold 300 to prevent the formation of bubbles.

[0180] Maintaining vacuum degree adjustment strategy: Maintaining the vacuum degree in the cavity of the mold 300 unchanged during the current injection stage. In the middle of injection, when the material has partially filled the mold 300 but has not yet completely solidified, maintaining a stable vacuum degree is conducive to uniform distribution and exhaust of the material.

[0181] Strategy for reducing vacuum degree: In the current injection stage, it is necessary to reduce the vacuum degree in the cavity of the mold 300. At the end of the injection, when the material is close to completely filling the mold 300, reducing the vacuum degree helps the final filling and solidification of the material and avoids deformation of the material due to excessive vacuuming.

[0182] like Figure 4 As shown, in some embodiments, the embodiments of the present application also provide an electronic device 400, including a memory 420 for storing a computer program 422; and a processor 410 for executing the computer program 422 to implement the pouring control method as described in any of the above embodiments.

[0183] It should be noted that Figure 4 This is a structural diagram of an electronic device 400 according to an exemplary embodiment. The content in the diagram cannot be regarded as any limitation on the scope of use of the present application.

[0184] Specifically, the electronic device 400 may include: at least one processor 410, at least one memory 420, a power supply 430, a communication interface 440, an input / output interface 450, and a communication bus 460. The memory 420 is used to store a computer program 422, which is loaded and executed by the processor 410 to implement the relevant steps in the pouring control method disclosed in any of the above embodiments. In addition, the electronic device 400 in this embodiment may be specifically an electronic computer.

[0185] In this embodiment, the power supply 430 is used to provide working voltage for each hardware device on the electronic device 400; the communication interface 440 can create a data transmission channel between the electronic device 400 and external devices, and the communication protocol it follows is any communication protocol that can be applied to the technical solution of the present application, and is not specifically limited here; the input and output interface 450 is used to obtain external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs and is not specifically limited here.

[0186] In addition, the memory 420, as a carrier for storing resources, can be a read-only memory 420, a random access memory 420, a disk or an optical disk, etc. The resources stored thereon can include an operating system 421, a computer program 422, etc., and the storage method can be temporary storage or permanent storage.

[0187] The operating system 421 is used to manage and control the hardware devices and computer programs on the electronic device 400, and may be Windows Server, Netware, Unix, Linux, etc. In addition to the computer program 422 that can be used to complete the pouring control method performed by the electronic device 400 disclosed in any of the aforementioned embodiments, the computer program 422 may further include a computer program 422 that can be used to complete other specific tasks.

[0188] An embodiment of the present application further provides a computer-readable storage medium for storing a computer program 422 , wherein the computer program 422 implements the pouring control method as described in any of the above embodiments when executed by the processor 410 .

[0189] For the specific steps of the method, reference may be made to the corresponding contents disclosed in the aforementioned embodiments, which will not be described in detail here.

[0190] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0191] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0192] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, software modules executed by the processor 410, or a combination of the two. The software modules may be placed in a random access memory 420 (RAM), a memory, a read-only memory 420 (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0193] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0194] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0195] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A pouring control method, characterized in that: The pouring control method comprises: Acquire a current injection stage of a casting device, wherein the casting device includes a mold and a vacuum adjustment device; and based on the current injection stage, determine a target adjustment strategy of the vacuum adjustment device from a plurality of preset adjustment strategies; The vacuum degree adjusting device is controlled to adjust the vacuum degree of the cavity of the mold according to the target adjustment strategy, so that the cavity of the mold is at a vacuum degree corresponding to the current injection stage.

2. The pouring control method according to claim 1, characterized in that: Before obtaining the current material injection stage of the pouring equipment, the method further includes: Obtaining the pouring parameters corresponding to the pouring equipment; wherein the pouring parameters include the pouring time or the pouring amount; Comparing the pouring parameters with corresponding preset parameters to obtain a comparison result; According to the comparison result, the current filling stage of the pouring equipment is determined among a plurality of preset filling stages.

3. The pouring control method according to claim 1, characterized in that: The step of determining the target adjustment strategy of the vacuum adjustment device from a plurality of preset adjustment strategies based on the current injection stage includes: Acquire a mode correspondence relationship corresponding to the pouring equipment, wherein the mode correspondence relationship is used to characterize a correspondence relationship between a material injection stage and a preset adjustment strategy; Based on the mode correspondence corresponding to the pouring equipment and the current material injection stage, a target adjustment strategy corresponding to the pouring equipment is determined from a plurality of preset adjustment strategies.

4. The pouring control method according to claim 1, characterized in that: The controlling the vacuum degree adjusting device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is before the vacuum degree corresponding to the current injection stage also includes: The injection process of the casting equipment is divided into a plurality of injection stages; in terms of timing, the vacuum degree of the mold cavity of the mold corresponding to the plurality of injection stages changes from large to small; Based on the current injection stage of the casting equipment, the vacuum degree of the cavity of the mold corresponding to the current injection stage is determined.

5. The pouring control method according to claim 4, characterized in that: The controlling the vacuum degree adjusting device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at the vacuum degree corresponding to the current injection stage includes: Based on the injection stage, determining the vacuum degree corresponding to the cavity of the mold; According to the vacuum degree, the vacuum degree adjusting device is controlled to operate.

6. The pouring control method according to claim 5, characterized in that: The multiple preset adjustment strategies include: Increase vacuum degree adjustment strategy, maintain vacuum degree adjustment strategy and reduce vacuum degree strategy; If the vacuum degree increasing adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes: Controlling the vacuum degree adjustment device to increase the vacuum degree of the mold cavity according to the target adjustment strategy, so that the mold cavity is at a vacuum degree corresponding to the current injection stage; If the vacuum degree adjustment strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes: Controlling the vacuum degree adjustment device to maintain the current vacuum degree of the mold cavity according to the target adjustment strategy, so that the mold cavity is at the vacuum degree corresponding to the current injection stage; If the vacuum degree reduction strategy is a target adjustment strategy, controlling the vacuum degree adjustment device to adjust the vacuum degree of the mold cavity according to the target adjustment strategy so that the mold cavity is at a vacuum degree corresponding to the current injection stage includes: The vacuum degree adjusting device is controlled to reduce the vacuum degree of the cavity of the mold according to the target adjustment strategy, so that the cavity of the mold is at a vacuum degree corresponding to the current injection stage.

7. A pouring system, characterized in that: The pouring system comprises: Vacuum box; A mold, wherein the mold is arranged in the vacuum box and has a cavity; A vacuum degree adjusting device is connected to the mold, and the vacuum degree adjusting device can adjust the vacuum degree of the cavity.

8. The pouring system according to claim 7, characterized in that: The mold has an injection port and an exhaust port, wherein the injection port is located at the bottom of the mold and the exhaust port is located at the top of the mold.

9. The pouring system according to claim 8, characterized in that: The vacuum degree adjustment device comprises a vacuum pump, a controller, a first vacuum degree sensor and a first vacuum valve; wherein the injection port is connected to the bottom of the cavity, and the exhaust port of the cavity is connected to the air inlet of the vacuum pump; The first vacuum sensor is disposed at the exhaust port, and is used to detect the vacuum degree in the cavity. The air outlet interface of the first vacuum valve is connected to the exhaust port, and the air inlet interface of the first vacuum valve is connected to the outside of the vacuum box. The controller is electrically connected to the vacuum pump, the first vacuum degree sensor, and the valve driver of the first vacuum valve respectively.

10. The pouring system according to claim 9, characterized in that: The vacuum degree adjustment device further comprises a second vacuum degree sensor and a second vacuum valve, the vacuum box has a vacuum pumping port, and the vacuum pumping port is connected to the air inlet of the vacuum pump; The second vacuum degree sensors are all arranged in the vacuum box, and the second vacuum degree sensors are used to detect the vacuum degree in the vacuum box. The air outlet interface of the second vacuum valve is connected to the vacuum box, and the air inlet interface of the second vacuum valve is connected to the outside of the vacuum box. The second vacuum degree sensor and the valve driver of the second vacuum valve are electrically connected to the controller respectively. The vacuum degree adjustment device further comprises a switch valve, and the vacuum port is connected to the air inlet of the vacuum pump through the switch valve; And / or, the pouring system also includes an injection device and an information collection device, the injection device is used to inject material into the injection port, the information collection device is electrically connected to the injection device, the information collection device is used to collect the injection amount of the injection device, and the information collection device is electrically connected to the controller.

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