Method for chemically plating nickel on surface of aluminum-scandium alloy target material

Abstract

The invention provides a method for chemically plating nickel on the surface of an aluminum-scandium alloy target material, which comprises the following steps of: pretreating the aluminum-scandium alloy target material, removing oil, carrying out alkaline etching, pickling, activating palladium, and carrying out ultrasonic nickel plating and heat treatment by adopting a chemical nickel plating solution, so that a chemical nickel plating layer is formed on the surface of the aluminum-scandium alloy target material. The method is simple in process, convenient to operate, good in plating solution stability and capable of achieving rapid deposition, the obtained plating layer is flat, uniform and compact, the thickness is 4-10 microns, the phosphorus content is smaller than or equal to 10 wt.%, the bonding strength is larger than or equal to 20 MPa, and the method has the advantages of being good in weldability and the like.

Description

Technical Field

[0001] The invention belongs to the technical field of chemical plating, and in particular relates to a method for chemically plating nickel on the surface of an aluminum-scandium alloy target. Background Art

[0002] Piezoelectric film is the core material of high-frequency mobile communication RF filters, MEMS micro advanced sensors and other devices. Compared with piezoelectric films such as AlN, ZnO, Pb(Zr,Ti)O3 (PZT), AlScN film has better piezoelectric properties. AlScN film is prepared by magnetron sputtering using AlSc alloy target. The increase of Sc content in the target helps to improve the piezoelectric performance and quality factor of the prepared AlScN film. The target assembly consists of an alloy target and a backing plate. During the magnetron sputtering process, the backing plate provides effective heat dissipation and mechanical support for the alloy target. In the bonding process between the target and the backing plate, brazing is very suitable for industrial production due to its advantages such as simple operation, low equipment requirements and low cost. However, when the scandium content in the aluminum-scandium alloy target is ≥20 at.%, its brazing performance is not ideal. Therefore, the target must be surface treated to enhance its brazing performance.

[0003] Nickel plating on the welding surface of the target can not only improve the wettability between the target and the brazing material, thereby improving the welding bonding rate, but also reduce the residual stress caused by the inconsistent thermal expansion coefficients of the target and the back plate during the heating and cooling process of magnetron sputtering. The main methods of nickel plating are electroplating and chemical plating. The advantages of electroplating are low cost, fast deposition of the coating, simple nickel plating solution and long use time, and the nickel plating process is less affected by temperature and pH. The disadvantages are that the coating has pores, uneven coating thickness, limited deep plating ability, and requirements for the shape of the plated parts. The advantages of chemical plating are uniform coating thickness, suitable for various substrates and shapes, can obtain coatings of any thickness, strong bonding, good uniformity, and low porosity, but a matching pre-treatment process is required.

[0004] Aluminum-scandium alloy is a difficult metal to electrolessly plate. This is because the electronegativity of aluminum and scandium is 1.61 and 1.36 respectively, which can react with H in aqueous solution. + Ion reaction results in a large amount of H2 being produced during the chemical plating process, which causes the coating to become loose and the bonding strength of the coating to decrease. The hydrogen evolution reaction can also cause the nickel particles in the coating to fall off and pollute the plating solution. In addition, aluminum and scandium are both active metals, which easily form an oxide film on the surface of the alloy. The oxide film itself does not have catalytic activity, thereby hindering the close bonding between the coating and the substrate. The present invention has developed a method for preparing a nickel-plated layer for an aluminum-scandium alloy target by innovating the pretreatment process, nickel plating formula and nickel plating method, which has important practical significance. Summary of the invention

[0005] The object of the present invention is to provide a method for chemically plating nickel on the surface of an aluminum-scandium alloy target, wherein the obtained coating is flat, uniform, dense, has a phosphorus content of ≤10 wt.%, and a bonding strength of ≥20 MPa.

[0006] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions: A method for chemically plating nickel on the surface of an aluminum-scandium alloy target material comprises the following steps: (1) Pretreatment: Grinding and cleaning the surface of the aluminum-scandium alloy target; (2) Degreasing: The aluminum-scandium alloy target pretreated in step (1) is first immersed in an alkaline solution for degreasing, then rinsed with deionized water and blown dry, then placed in acetone for ultrasonic degreasing, then rinsed with deionized water and blown dry; (3) Alkaline etching: soak the aluminum-scandium alloy target after degreasing in step (2) in a sodium hydroxide solution and then rinse with deionized water; (4) Pickling: After the alkaline etching in step (3), the aluminum-scandium alloy target is immersed in a pickling solution at room temperature and then washed with deionized water; (5) Palladium activation: the aluminum-scandium alloy target after pickling in step (4) is placed in a palladium activation solution and immersed at room temperature, and then washed with deionized water; (6) Ultrasonic nickel plating: After heating the chemical nickel plating solution, put the aluminum-scandium alloy target after the activation treatment in step (5) into it, use ultrasonic assisted nickel plating, take out the aluminum-scandium alloy target, wash it, and blow it dry; (7) Heat treatment: The aluminum-scandium alloy target material after nickel plating in step (6) is heated and then cooled to room temperature.

[0007] Furthermore, the scandium content in the aluminum-scandium alloy target of the present invention is 20-50 at.%.

[0008] Many impurities and grease will remain on the surface of the aluminum-scandium alloy target substrate due to grinding. These substances will hinder the combination of the coating and the substrate, resulting in bulging of the aluminum-scandium alloy surface. The present invention adopts a dual degreasing method of alkaline degreasing and organic solution ultrasonic degreasing, that is, the oil on the surface of the plated part is first removed by using an alkaline solution, and then ultrasonication in acetone can not only vibrate off the impurities remaining from grinding, but also penetrate into the tiny gaps and pores on the surface of the plated part through ultrasonic waves to remove the oil that is difficult to reach.

[0009] In the pickling of the present invention, a mixed solution containing aminosalicylic acid and ammonium bifluoride with weak corrosive effect is used to remove alkaline corrosion products and oxide films to expose the surface of the aluminum-scandium substrate, thereby avoiding the problem of over-corrosion of the plated parts caused by pickling with traditional dilute hydrochloric acid and dilute sulfuric acid.

[0010] The present invention forms an activation layer on the surface of the aluminum-scandium alloy by using a palladium activation solution, which can promote the nucleation, growth and coating of nickel elements on the surface of the aluminum-scandium alloy, shorten the initiation time of chemical nickel plating, make the nickel plating process more rapid and efficient, and also reduce the corrosion of the plating solution on the surface of the plated part.

[0011] In the present invention, the bonding force between the coating and the substrate is very important. In order to improve the bonding force of the coating, the present invention first adopts ultrasonic nickel plating, and the activation, cavitation and stirring effects of ultrasonic waves can greatly improve the bonding force of the coating; secondly, heat treatment is used to improve the bonding force. This is because the coating obtained by chemical nickel plating inevitably has internal stress, which can cause deformation or cracking of the coating, thereby reducing the bonding force. Heat treatment can promote the redistribution and release of the internal stress of the coating, reduce the risk of cracking and peeling, and thus improve the bonding force of the coating.

[0012] The following are preferred technical solutions of the present invention, but are not intended to be limitations of the technical solutions provided by the present invention. Through the following technical solutions, the technical objectives and beneficial effects of the present invention can be better achieved and realized.

[0013] As a preferred technical solution of the present invention, in step (1), the surface of the aluminum-scandium alloy target is polished from coarse to fine using sandpaper of different mesh sizes until it is polished to above 1000#. Polishing the surface of the target can not only remove the roughness and some mechanical defects on the surface of the target, making the surface smooth, thereby improving the uniformity and density of the coating, but also provide a clean, pollution-free adhesion surface for the coating. After the polishing treatment, the bonding force between the coating and the plated part will be enhanced, and the coating will not easily fall off.

[0014] Furthermore, the alkaline solution in step (2) contains 20-25 g / L of sodium carbonate, 10-15 g / L of sodium silicate, and 1-3 g / L of emulsifier OP-10.

[0015] Furthermore, the immersion degreasing in step (2) is carried out at a temperature of 40-50°C and for a time of 5-10 min.

[0016] Furthermore, the temperature of the ultrasonic degreasing in step (2) is 25-40°C and the time is 5-10 min.

[0017] Furthermore, the concentration of the sodium hydroxide solution in step (3) is 20-30 g / L.

[0018] Furthermore, the soaking temperature in step (3) is 50-60°C and the soaking time is 60-90 s.

[0019] Furthermore, the pickling solution in step (4) contains 10-20 g / L of aminosalicylic acid and 10-15 g / L of ammonium bifluoride.

[0020] Furthermore, the soaking time in step (4) is 30 to 60 seconds.

[0021] Furthermore, the palladium activation solution in step (5) contains 0.1-1 g / L of palladium chloride, 1-10 mL / L of hydrochloric acid, and 0.5-1 g / L of ammonium chloride.

[0022] Furthermore, the soaking time in step (5) is 10 to 60 seconds.

[0023] Furthermore, the chemical nickel plating solution in step (6) contains: 25-30 g / L nickel salt, 25-32 g / L reducing agent, 25-40 g / L complexing agent, 15-25 g / L buffer, 2-4 g / L corrosion inhibitor, 2-6 mg / L stabilizer, 0.2-1 g / L accelerator, 1-2 g / L surfactant, and its pH is 7.5-9.0; Wherein, the nickel salt is nickel sulfate.

[0024] The reducing agent is sodium hypophosphite.

[0025] The complexing agent is a complex of citric acid or citrate and lactic acid in a mass ratio of (10-15):(15-25).

[0026] The buffer is sodium acetate, which can effectively maintain the stability of the pH value of the plating solution during the plating process.

[0027] The corrosion inhibitor is aminoacetic acid, which can be adsorbed on the aluminum-scandium interface to convert H + Separated from the aluminum-scandium interface, it promotes the reduction of nickel.

[0028] The stabilizer is thiourea or potassium iodide, which can improve the stability of the nickel plating solution.

[0029] The accelerator is a fluoride, preferably sodium fluoride or ammonium fluoride, which can effectively increase the plating speed.

[0030] The surfactant is sodium dodecylbenzene sulfonate, which can effectively reduce the porosity of the coating.

[0031] The complexing agent in the present invention is a complex of citric acid or citrate and lactic acid. Citric acid and citrate have the advantage of stabilizing the plating solution, but the plating speed is slow and the plating layer has poor bonding strength; lactic acid has the advantages of fast plating speed and good plating layer bonding strength, but the plating solution is unstable. By mixing the two in a certain proportion, the stability of the plating solution can be ensured, and a faster plating speed can be achieved, and the plating layer has good bonding strength.

[0032] At the same time, since aluminum and scandium are active metals, they easily react strongly with hydrogen ions in the plating solution. In the acidic plating solution, the reaction rate of aluminum and scandium elements with the solution is faster than the deposition rate of the coating, so it is difficult to obtain a complete coating. However, too high a pH value will cause the plating solution to be unstable, thereby affecting the performance of the coating. The present invention has found through experiments that when the pH value is 7.5-9.0, the bonding strength of the coating is relatively good.

[0033] Furthermore, the preparation method of the chemical nickel plating solution is to accurately weigh nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, dissolve them respectively with deionized water, and then add other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after sufficient dissolution, and finally dilute with deionized water to the required volume and adjust the pH.

[0034] The pH can be adjusted by using one or more of acetic acid, ammonia water, and sodium hydroxide.

[0035] The present invention has certain requirements on the dissolution mode and the order of addition of each component in the process of preparing the chemical nickel plating solution. The nickel salt solution and the reducing agent solution cannot be directly mixed, otherwise an oxidation-reduction reaction may occur, resulting in premature decomposition of the solution.

[0036] Furthermore, in step (6), the chemical nickel plating solution is preheated to 80-85°C.

[0037] Furthermore, the ultrasonic power of the ultrasonic assisted nickel plating in step (6) is 100-200 W, the nickel plating time is 20-40 min, and the loading amount (loading amount refers to the ratio of the surface area of ​​the aluminum-scandium alloy target immersed in the chemical plating solution to the volume of the plating solution) is 50-200 cm 2 / L.

[0038] The coating of the present invention is a brazing transition layer, which is used to improve the bonding between the aluminum-scandium alloy and the brazing material, so the coating on the surface of the aluminum-scandium alloy must achieve sufficient density, uniformity and good bonding strength. Since chemical plating has better characteristics than electroplating, chemical nickel plating is used to prepare the nickel plating layer of the aluminum-scandium alloy target.

[0039] At the same time, the present invention utilizes the effect of ultrasound to improve the bonding force of the coating, but too high power will weaken the ultrasonic cavitation effect, thereby reducing the effect of ultrasound on the plating solution and the plated parts. At the same time, too high power will also cause part of the energy to be absorbed by the plating solution and converted into heat energy, so that the temperature of the plating solution increases. Therefore, the present invention has certain requirements for ultrasonic power. The loading amount has a great influence on the plating solution during chemical nickel plating. When the loading amount is too large, the plating solution only remains stable for a short time, and then turbidity or even black precipitation occurs. This is because the loading amount is too large, the catalytic surface is too large, and the deposition speed is too fast, resulting in the generation of hypophosphite nickel precipitation.

[0040] Furthermore, the temperature of the heating treatment in step (6) and step (7) is 150-200°C, and the time is 30-60 minutes.

[0041] Furthermore, the thickness of the nickel coating obtained on the surface of the aluminum-scandium alloy target is 4-10 μm, and the phosphorus content is ≤10 wt.%.

[0042] The coating used in the present invention is used as a welding layer, and there are certain requirements for the thickness and phosphorus content of the coating. If the coating is too thin, the solder can easily penetrate the pore defects in the nickel coating, causing perforation or even rupture of the coating, which reduces the welding bonding rate; if the coating is too thick, the internal stress of the coating will increase, reducing the adhesion between the coating and the target substrate, and the coating will fall off or crack during welding, resulting in joint quality problems, and also increasing the nickel plating cost. When the phosphorus content in the coating is ≤10 wt.%, it helps to further improve the wettability of the solder and the coating.

[0043] The advantages of the present invention are: (1) The present invention provides a good catalytically active surface for chemical nickel plating through surface pretreatment, including grinding, alkaline degreasing, organic solution ultrasonic degreasing, alkaline etching, pickling with a mixed solution of aminosalicylic acid and ammonium bifluoride, and palladium activation. By improving the nickel plating formula and adjusting the pH value of the nickel plating solution, a complete coating is successfully obtained on the surface of the aluminum-scandium alloy target. The obtained coating is flat, uniform, and dense, with a thickness of 4 to 10 μm and a phosphorus content of ≤10 wt.%. At the same time, the coating deposition speed is relatively fast.

[0044] (2) The present invention significantly improves the bonding strength of the coating by using ultrasonic-assisted chemical nickel plating and combining it with a heat treatment process after chemical plating, and ultimately makes the bonding strength of the coating ≥20 MPa, meeting the requirements of the aluminum-scandium alloy (scandium content 20~50 at.%) target material for the bonding strength of the coating.

[0045] (3) The nickel plating process of the present invention is simple, the plating solution has good stability, the equipment is simple, and it is suitable for industrial production, and has important practical value and market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 This is a scanning electron microscope image of the chemically plated nickel layer of the aluminum-scandium alloy target obtained in Example 1.

[0047] Figure 2 This is a scanning electron microscope image of the chemically plated nickel layer of the aluminum-scandium alloy target obtained in Comparative Example 3. DETAILED DESCRIPTION

[0048] A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (the scandium content is 20-50 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: accurately weigh the corresponding mass of nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water, add other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after it is fully dissolved, and finally dilute it to the required volume with deionized water and adjust the solution pH to 7.5-9.0 with ammonia water; The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25-30 g / L, sodium hypophosphite 25-32 g / L, complexing agent 25-40 g / L, sodium acetate 15-25 g / L, aminoacetic acid 2-4 g / L, thiourea or potassium iodide 2-6 mg / L, sodium fluoride or ammonium fluoride 0.2-1 g / L, sodium dodecylbenzene sulfonate 1-2 g / L; wherein the complexing agent is a complex of citric acid or citrate and lactic acid in a mass ratio of (10-15):(15-25); (2) Surface grinding: Use sandpaper of different mesh sizes to grind the surface of the aluminum-scandium alloy target from coarse to fine until it is polished to above 1000#, and then clean the surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20-25 g / L sodium carbonate, 10-15 g / L sodium silicate, and 3 g / L OP-101, soak at 40-50 °C for 5-10 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25-40 °C for 5-10 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20-30 g / L sodium hydroxide solution at 50-60 °C for 60-90 seconds, then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 10-20 g / L aminosalicylic acid and 10-15 g / L ammonium bifluoride at room temperature for 30-60 seconds, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 0.1-1 g / L palladium chloride, 1-10 mL / L hydrochloric acid, and 0.5-1 g / L ammonium chloride, soak at room temperature for 10-60 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After heating the chemical nickel plating solution prepared in step (1) to a nickel plating temperature of 80-85°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 20-40 min under the action of 100-200 W ultrasonic waves with a loading of 50-200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 150-200 °C, keep the temperature constant for 30-60 min, and then cool. The thickness of the obtained nickel coating is 4-10 μm, and the phosphorus content is ≤10 wt.%.

[0049] In order to make the contents of the present invention easier to understand, the technical solution of the present invention is further described below in conjunction with specific implementation methods, but the present invention is not limited thereto.

[0050] Example 1 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 20 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: accurately weigh the corresponding mass of nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water, add other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after it is fully dissolved, and finally dilute it to the required volume with deionized water and adjust the solution pH to 7.5 with ammonia water; The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25 g / L, sodium hypophosphite 29 g / L, citric acid 10 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, aminoacetic acid 2 g / L, thiourea 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20 g / L sodium carbonate, 10 g / L sodium silicate, and 1 g / L OP-10, soak at 40 °C for 5 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25 °C for 5 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20 g / L sodium hydroxide solution at 50 °C for 60 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 10 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 30 s, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 0.1 g / L palladium chloride, 2 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soak at room temperature for 30 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After heating the chemical nickel plating solution prepared in step (1) to a nickel plating temperature of 80°C, the aluminum-scandium alloy target activated in step (7) was placed in the solution and nickel plated for 25 min under the action of 100 W ultrasonic waves. The loading amount was 50 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 150 °C, keep the temperature constant for 25 min, and then cool.

[0051] According to the test, the coating obtained in this embodiment has a thickness of 5.6 μm, a phosphorus content of 7.9 wt.%, and a bonding strength of 22.5 MPa.

[0052] Figure 1 The SEM image of the coating surface is shown in Figure 1. It can be seen that the coating is flat and uniform, the cellular structure is fine and dense, and there is no unplated area.

[0053] Example 2 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 30 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: accurately weigh the corresponding mass of nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water, add the other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after it is fully dissolved, and finally dilute it to the required volume with deionized water and adjust the solution pH to 8.0 with ammonia water; The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 28 g / L, sodium hypophosphite 25 g / L, sodium citrate 15 g / L, lactic acid 15 g / L, sodium acetate 20 g / L, aminoacetic acid 3 g / L, thiourea 4 mg / L, sodium fluoride 0.6 g / L, sodium dodecylbenzene sulfonate 1.5 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, and 1000# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20 g / L sodium carbonate, 15 g / L sodium silicate, and 2 g / L OP-10, soak at 45 °C for 6 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 30 °C for 9 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 50 °C for 70 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 15 g / L aminosalicylic acid and 10 g / L ammonium bifluoride at room temperature for 40 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.3 g / L palladium chloride, 4 mL / L hydrochloric acid, and 0.6 g / L ammonium chloride, soaked at room temperature for 25 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 80°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 20 min under the action of 100 W ultrasonic waves. The loading amount is 100 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 180 °C, keep the temperature constant for 55 min, and then cool.

[0054] According to the test, the thickness of the coating obtained in this embodiment is 4.2 μm, the phosphorus content is 8.2 wt.%, the bonding strength is 20.9 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0055] Example 3 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 40 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 9.0 with ammonia water.

[0056] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 28 g / L, citric acid 15 g / L, lactic acid 25 g / L, sodium acetate 25 g / L, aminoacetic acid 4 g / L, potassium iodide 6 mg / L, sodium fluoride 1 g / L, sodium dodecylbenzene sulfonate 2 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 25 g / L sodium carbonate, 15 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 10 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone, ultrasonicated at 40 °C for 10 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 30 g / L sodium hydroxide solution at 60 °C for 90 s, and then rinse with deionized water; (6) Pickling: Soak the alkaline-etched aluminum-scandium alloy target in a pickling solution containing 11 g / L aminosalicylic acid and 13 g / L ammonium bifluoride at room temperature for 60 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.5 g / L palladium chloride, 6 mL / L hydrochloric acid, and 0.7 g / L ammonium chloride, soaked at room temperature for 35 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 85°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 30 min under the action of 200 W ultrasonic waves. The loading amount is 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 200 °C, keep the temperature constant for 60 min, and then cool.

[0057] According to the test, the thickness of the coating obtained in this embodiment is 7.1 μm, the phosphorus content is 7.2 wt.%, the bonding strength is 26.6 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0058] Example 4 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 35 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 7.8 with ammonia water.

[0059] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25 g / L, sodium hypophosphite 32 g / L, citric acid 12 g / L, lactic acid 20 g / L, sodium acetate 20 g / L, aminoacetic acid 2 g / L, thiourea 5 mg / L, sodium fluoride 0.8 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 25 g / L sodium carbonate, 10 g / L sodium silicate, and 2 g / L OP-10, soak at 40 °C for 8 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 35 °C for 6 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 60 °C for 80 s, and then rinse with deionized water; (6) Pickling: Soak the alkaline-etched aluminum-scandium alloy target in a pickling solution containing 20 g / L aminosalicylic acid and 14 g / L ammonium bifluoride at room temperature for 45 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.7 g / L palladium chloride, 8 mL / L hydrochloric acid, and 0.8 g / L ammonium chloride, soaked at room temperature for 40 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 82°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 30 min under the action of 150 W ultrasonic waves with a loading volume of 150 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 170 °C, keep the temperature constant for 35 min, and then cool.

[0060] According to the test, the thickness of the coating obtained in this embodiment is 6.9 μm, the phosphorus content is 8.6 wt.%, the bonding strength is 24.4 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0061] Example 5 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 25 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 8.4 with ammonia water.

[0062] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 28 g / L, sodium hypophosphite 30 g / L, citric acid 11 g / L, lactic acid 25 g / L, sodium acetate 22 g / L, aminoacetic acid 2.5 g / L, thiourea 5 mg / L, sodium fluoride 0.5 g / L, sodium dodecylbenzene sulfonate 1.8 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, and 1000# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 23 g / L sodium carbonate, 12 g / L sodium silicate, and 1 g / L OP-10, soak at 45 °C for 7 min, wash, and blow dry; (4) Ultrasonic degreasing: The Al-Sc alloy target after alkaline degreasing was placed in acetone, ultrasonicated at 40 °C for 5 min, then rinsed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 30 g / L sodium hydroxide solution at 60 °C for 60 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 16 g / L aminosalicylic acid and 15 g / L ammonium bifluoride at room temperature for 55 s, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 1 g / L palladium chloride, 10 mL / L hydrochloric acid, and 1 g / L ammonium chloride, soak at room temperature for 45 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 83°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 20 min under the action of 200 W ultrasonic waves. The loading amount is 180 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 160 °C, keep the temperature constant for 45 min, and then cool.

[0063] According to the test, the thickness of the coating obtained in this embodiment is 4.6 μm, the phosphorus content is 9.2 wt.%, the bonding strength is 23.6 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0064] Example 6 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 45 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 8.2 with ammonia water.

[0065] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 29 g / L, sodium hypophosphite 27 g / L, citric acid 13 g / L, lactic acid 15 g / L, sodium acetate 24 g / L, aminoacetic acid 3.4 g / L, thiourea 3 mg / L, sodium fluoride 0.9 g / L, sodium dodecylbenzene sulfonate 1.6 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 24 g / L sodium carbonate, 13 g / L sodium silicate, and 2 g / L OP-10, soak at 40 °C for 9 min, wash, and blow dry; (4) Ultrasonic degreasing: The Al-Sc alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 30 °C for 6 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20 g / L sodium hydroxide solution at 50 °C for 90 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 18 g / L aminosalicylic acid and 15 g / L ammonium bifluoride at room temperature for 35 s, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 0.9 g / L palladium chloride, 5 mL / L hydrochloric acid, and 0.9 g / L ammonium chloride, soak at room temperature for 20 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 84°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 40 min under the action of 150 W ultrasonic waves with a loading of 120 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 200 °C, keep the temperature constant for 40 min, and then cool.

[0066] According to the test, the thickness of the coating obtained in this embodiment is 9.6 μm, the phosphorus content is 5.5 wt.%, the bonding strength is 27.4 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0067] Example 7 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 50 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 7.7 with ammonia water.

[0068] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 32 g / L, sodium citrate 13 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, aminoacetic acid 2 g / L, potassium iodide 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 22 g / L sodium carbonate, 14 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 9 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25 °C for 10 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 60 °C for 80 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 12 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 45 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.2 g / L palladium chloride, 1 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soaked at room temperature for 60 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 83°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 35 min under the action of 150 W ultrasonic waves with a loading of 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 190 °C, keep the temperature constant for 50 min, and then cool.

[0069] According to the test, the thickness of the coating obtained in this embodiment is 8.4 μm, the phosphorus content is 7.8 wt.%, the bonding strength is 29.3 MPa, the plating solution is stable, and the coating is flat, uniform and dense.

[0070] Comparative Example 1 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 20 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 7.5 with ammonia water.

[0071] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25 g / L, sodium hypophosphite 29 g / L, citric acid 10 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, aminoacetic acid 2 g / L, thiourea 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20 g / L sodium carbonate, 10 g / L sodium silicate, and 1 g / L OP-10, soak at 40 °C for 5 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25 °C for 5 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20 g / L sodium hydroxide solution at 50 °C for 60 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 10 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 30 s, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 0.1 g / L palladium chloride, 2 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soak at room temperature for 30 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 80°C, the aluminum-scandium alloy target after activation treatment in step (7) is placed in the solution and nickel plating is carried out normally for 25 min without adding ultrasonic waves. The loading amount is 50 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 150 °C, keep the temperature constant for 25 min, and then cool.

[0072] After testing, the thickness of the coating obtained in this comparative example is 4.2 μm, the phosphorus content is 8.5 wt.%, and the bonding strength is 6.2 MPa. This comparative example proves that when the preparation method lacks the ultrasonic assisted process for nickel plating, the bonding strength of the chemical nickel plating layer obtained will be greatly reduced.

[0073] Comparative Example 2 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 30 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: accurately weigh the corresponding mass of nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water, add the other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after it is fully dissolved, and finally dilute it to the required volume with deionized water and adjust the solution pH to 8.0 with ammonia water; The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 28 g / L, sodium hypophosphite 25 g / L, sodium citrate 15 g / L, lactic acid 15 g / L, sodium acetate 20 g / L, aminoacetic acid 3 g / L, thiourea 4 mg / L, sodium fluoride 0.6 g / L, sodium dodecylbenzene sulfonate 1.5 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, and 1000# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20 g / L sodium carbonate, 15 g / L sodium silicate, and 2 g / L OP-10, soak at 45 °C for 6 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 30 °C for 9 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 50 °C for 70 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 15 g / L aminosalicylic acid and 10 g / L ammonium bifluoride at room temperature for 40 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.3 g / L palladium chloride, 4 mL / L hydrochloric acid, and 0.6 g / L ammonium chloride, soaked at room temperature for 25 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 80°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 20 min under the action of 100 W ultrasonic waves. The loading amount is 100 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; After testing, the thickness of the coating obtained in this comparative example is 4.0 μm, the phosphorus content is 7.9 wt.%, and the bonding strength is 14.2 MPa. This comparative example proves that when the preparation method lacks a heat treatment process, the bonding strength of the chemical nickel plating layer obtained will be significantly reduced.

[0074] Comparative Example 3 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 40 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 5.0 with ammonia water.

[0075] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 28 g / L, citric acid 15 g / L, lactic acid 25 g / L, sodium acetate 25 g / L, aminoacetic acid 4 g / L, potassium iodide 6 mg / L, sodium fluoride 1 g / L, sodium dodecylbenzene sulfonate 2 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 25 g / L sodium carbonate, 15 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 10 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone, ultrasonicated at 40 °C for 10 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 30 g / L sodium hydroxide solution at 60 °C for 90 s, and then rinse with deionized water; (6) Pickling: Soak the alkaline-etched aluminum-scandium alloy target in a pickling solution containing 11 g / L aminosalicylic acid and 13 g / L ammonium bifluoride at room temperature for 60 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.5 g / L palladium chloride, 6 mL / L hydrochloric acid, and 0.7 g / L ammonium chloride, soaked at room temperature for 35 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 85°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 30 min under the action of 200 W ultrasonic waves. The loading amount is 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 200 °C, keep the temperature constant for 60 min, and then cool.

[0076] According to the test, the coating obtained in this comparative example has a thickness of 2.8 μm, a phosphorus content of 8.2 wt.%, and a bonding strength of 3.6 MPa.

[0077] Figure 2 The scanning electron microscope image of the coating surface of this comparative example. It can be seen from the figure that the obtained coating is not dense enough, there are a large number of unplated areas, the cellular structure is relatively coarse and the size uniformity is low. This comparative example proves that when the plating solution is an acidic plating solution, a complete coating cannot be formed, and the bonding strength of the chemical nickel plating layer of the aluminum-scandium alloy target obtained therefrom will be greatly reduced.

[0078] Comparative Example 4 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 35 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 7.8 with ammonia water.

[0079] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25 g / L, sodium hypophosphite 32 g / L, citric acid 32 g / L, sodium acetate 20 g / L, aminoacetic acid 2 g / L, thiourea 5 mg / L, sodium fluoride 0.8 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 25 g / L sodium carbonate, 10 g / L sodium silicate, and 2 g / L OP-10, soak at 40 °C for 8 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 35 °C for 6 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 60 °C for 80 s, and then rinse with deionized water; (6) Pickling: Soak the alkaline-etched aluminum-scandium alloy target in a pickling solution containing 20 g / L aminosalicylic acid and 14 g / L ammonium bifluoride at room temperature for 45 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.7 g / L palladium chloride, 8 mL / L hydrochloric acid, and 0.8 g / L ammonium chloride, soaked at room temperature for 40 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 82°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 30 min under the action of 150 W ultrasonic waves with a loading volume of 150 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 170 °C, keep the temperature constant for 35 min, and then cool.

[0080] According to the test, the coating obtained in this comparative example has a thickness of 4.5 μm, a phosphorus content of 14.2 wt.%, and a bonding strength of 17.3 MPa.

[0081] This comparative example proves that when single citric acid is used as a complexing agent in the plating solution, the bonding strength of the chemical nickel plating layer obtained is reduced, and the phosphorus mass content in the plating layer is significantly increased.

[0082] Comparative Example 5 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 25 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 8.4 with ammonia water.

[0083] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 28 g / L, sodium hypophosphite 30 g / L, citric acid 11 g / L, lactic acid 25 g / L, sodium acetate 22 g / L, aminoacetic acid 2.5 g / L, thiourea 5 mg / L, sodium fluoride 0.5 g / L, sodium dodecylbenzene sulfonate 1.8 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, and 1000# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 23 g / L sodium carbonate, 12 g / L sodium silicate, and 1 g / L OP-10, soak at 45 °C for 7 min, wash, and blow dry; (4) Ultrasonic degreasing: The Al-Sc alloy target after alkaline degreasing was placed in acetone, ultrasonicated at 40 °C for 5 min, then rinsed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 30 g / L sodium hydroxide solution at 60 °C for 60 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 16 g / L aminosalicylic acid and 15 g / L ammonium bifluoride at room temperature for 55 s, and then rinse with deionized water; (7) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 1 g / L palladium chloride, 10 mL / L hydrochloric acid, and 1 g / L ammonium chloride, soak at room temperature for 45 s, and then rinse with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 83°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 20 min under the action of 200 W ultrasonic waves with a loading of 400 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 160 °C, keep the temperature constant for 45 min, and then cool.

[0084] After testing, the thickness of the coating obtained in this comparative example is 4.1 μm, the phosphorus content is 8.6 wt.%, and the bonding strength is 8.2 MPa. This comparative example proves that when the loading amount in the plating solution exceeds the specified range, the bonding strength of the chemical nickel plating layer obtained will be greatly reduced.

[0085] Comparative Example 6 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 45 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 8.2 with ammonia water.

[0086] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 29 g / L, sodium hypophosphite 27 g / L, citric acid 13 g / L, lactic acid 15 g / L, sodium acetate 24 g / L, aminoacetic acid 3.4 g / L, thiourea 3 mg / L, sodium fluoride 0.9 g / L, sodium dodecylbenzene sulfonate 1.6 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 24 g / L sodium carbonate, 13 g / L sodium silicate, and 2 g / L OP-10, soak at 40 °C for 9 min, wash, and blow dry; (4) Ultrasonic degreasing: The Al-Sc alloy target after alkaline degreasing was placed in acetone and ultrasonicated at 30 °C for 6 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20 g / L sodium hydroxide solution at 50 °C for 90 s, and then rinse with deionized water; (6) Palladium activation: Place the alkaline-etched aluminum-scandium alloy target in a palladium activation solution consisting of 0.9 g / L palladium chloride, 5 mL / L hydrochloric acid, and 0.9 g / L ammonium chloride, soak at room temperature for 20 s, and then wash with deionized water; (7) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 84°C, the aluminum-scandium alloy target activated in step (6) is placed therein and nickel plated for 40 min under the action of 150 W ultrasonic waves with a loading of 120 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (8) Heat treatment: Heat the plated aluminum-scandium alloy target to 200 °C, keep the temperature constant for 40 min, and then cool.

[0087] After testing, the thickness of the coating obtained in this comparative example is 6.2 μm, the phosphorus content is 5.2 wt.%, and the bonding strength is 6.4 MPa. This comparative example proves that when the pickling process is missing in the preparation method, the bonding strength of the chemical nickel plating layer obtained will be greatly reduced.

[0088] Comparative Example 7 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 50 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 7.7 with ammonia water.

[0089] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 38 g / L, sodium citrate 13 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, aminoacetic acid 2 g / L, potassium iodide 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 0.6 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 22 g / L sodium carbonate, 14 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 9 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25 °C for 10 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 60 °C for 80 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 12 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 45 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.2 g / L palladium chloride, 1 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soaked at room temperature for 60 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 83°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 35 min under the action of 150 W ultrasonic waves with a loading of 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 190 °C, keep the temperature constant for 50 min, and then cool.

[0090] After testing, the thickness of the coating obtained in this comparative example is 5.9 μm, the phosphorus content is 13.8 wt.%, and the bonding strength is 8.4 MPa. This comparative example proves that only a slight adjustment in the amount of reducing agent and surfactant in the nickel plating formula can not only significantly increase the phosphorus mass content in the obtained chemical nickel plating layer, but also significantly reduce the bonding strength of the coating.

[0091] Comparative Example 8 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 20 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: accurately weigh the corresponding mass of nickel salt, reducing agent, complexing agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water, add other solutions except the reducing agent to the nickel salt solution in sequence, add the reducing agent solution after it is fully dissolved, and finally dilute it to the required volume with deionized water and adjust the solution pH to 7.5 with ammonia water; The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 25 g / L, sodium hypophosphite 29 g / L, citric acid 10 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, aminoacetic acid 2 g / L, thiourea 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, and 1200# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 20 g / L sodium carbonate, 10 g / L sodium silicate, and 1 g / L OP-10, soak at 40 °C for 5 min, wash, and blow dry; (3) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 20 g / L sodium hydroxide solution at 50 °C for 60 s, and then rinse with deionized water; (4) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 10 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 30 s, and then rinse with deionized water; (5) Palladium activation: Place the pickled aluminum-scandium alloy target in a palladium activation solution consisting of 0.1 g / L palladium chloride, 2 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soak at room temperature for 30 s, and then rinse with deionized water; (6) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 80°C, the aluminum-scandium alloy target activated in step (5) is placed therein and nickel plated for 25 min under the action of 100 W ultrasonic waves with a loading of 50 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (7) Heat treatment: Heat the plated aluminum-scandium alloy target to 150 °C, keep the temperature constant for 25 min, and then cool.

[0092] After testing, the thickness of the coating obtained in this comparative example is 5.2 μm, the phosphorus content is 8.2 wt.%, and the bonding strength is 7.4 MPa. This comparative example proves that when the preparation method lacks the ultrasonic degreasing process, the bonding strength of the chemical nickel plating layer obtained will be significantly reduced.

[0093] Comparative Example 9 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 40 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute to the required volume with deionized water and adjust the solution pH to 9.0 with ammonia water.

[0094] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 28 g / L, citric acid 15 g / L, lactic acid 25 g / L, sodium acetate 25 g / L, aminoacetic acid 4 g / L, potassium iodide 6 mg / L, sodium fluoride 1 g / L, sodium dodecylbenzene sulfonate 2 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 25 g / L sodium carbonate, 15 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 10 min, wash, and blow dry; (4) Ultrasonic degreasing: The aluminum-scandium alloy target after alkaline degreasing was placed in acetone, ultrasonicated at 40 °C for 10 min, then washed with deionized water and blown dry; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 30 g / L sodium hydroxide solution at 60 °C for 90 s, and then rinse with deionized water; (6) Pickling: Soak the alkaline-etched aluminum-scandium alloy target in a pickling solution containing 11 g / L aminosalicylic acid and 13 g / L ammonium bifluoride at room temperature for 60 s, and then rinse with deionized water; (7) Ultrasonic nickel plating: After heating the chemical nickel plating solution prepared in step (1) to a nickel plating temperature of 85°C, the aluminum-scandium alloy target material after pickling in step (6) was placed in the solution and nickel plated for 30 min under the action of 200 W ultrasonic waves. The loading amount was 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (8) Heat treatment: Heat the plated aluminum-scandium alloy target to 200 °C, keep the temperature constant for 60 min, and then cool.

[0095] After testing, the thickness of the coating obtained in this comparative example is 5.1 μm, the phosphorus content is 7.4 wt.%, and the bonding strength is 13.2 MPa. This comparative example proves that when the palladium activation process is missing in the preparation method, the bonding strength of the chemical nickel plating layer obtained will be significantly reduced.

[0096] Comparative Example 10 A method for chemically plating nickel on the surface of an aluminum-scandium alloy target (scandium content 50 at.%), comprising the following steps: (1) Preparation of chemical nickel plating solution: Accurately weigh the corresponding mass of nickel salt, reducing agent, chelating agent, buffer, corrosion inhibitor, stabilizer, accelerator, and surfactant, and then dissolve them respectively with a certain amount of deionized water. Add the other solutions except the reducing agent to the nickel salt solution in turn. After they are fully dissolved, add the reducing agent solution. Finally, dilute with deionized water to the required volume and adjust the solution pH to 7.7 with ammonia water.

[0097] The specific formula and content of the chemical nickel plating solution are as follows: Nickel sulfate 30 g / L, sodium hypophosphite 32 g / L, sodium citrate 13 g / L, lactic acid 15 g / L, sodium acetate 15 g / L, potassium iodide 2 mg / L, sodium fluoride 0.2 g / L, sodium dodecylbenzene sulfonate 1 g / L; (2) Surface grinding: Use 240#, 400#, 600#, 800#, 1000#, 1200#, and 1500# sandpaper to grind the aluminum-scandium alloy target, and clean its surface after grinding; (3) Alkaline degreasing: Place the polished aluminum-scandium alloy target in an alkaline solution containing 22 g / L sodium carbonate, 14 g / L sodium silicate, and 3 g / L OP-10, soak at 50 °C for 9 min, wash, and blow dry; (4) Ultrasonic degreasing: Place the aluminum-scandium alloy target after alkaline degreasing in acetone, ultrasonicate it at 25 °C for 10 min, then rinse it with deionized water and blow dry it; (5) Alkaline etching: Place the degreased aluminum-scandium alloy target in a 25 g / L sodium hydroxide solution at 60 °C for 80 s, and then rinse with deionized water; (6) Pickling: Soak the alkali-etched aluminum-scandium alloy target in a pickling solution containing 12 g / L aminosalicylic acid and 12 g / L ammonium bifluoride at room temperature for 45 s, and then rinse with deionized water; (7) Palladium activation: The acid-washed aluminum-scandium alloy target was placed in a palladium activation solution consisting of 0.2 g / L palladium chloride, 1 mL / L hydrochloric acid, and 0.5 g / L ammonium chloride, soaked at room temperature for 60 s, and then washed with deionized water; (8) Ultrasonic nickel plating: After the chemical nickel plating solution prepared in step (1) is heated to a nickel plating temperature of 83°C, the aluminum-scandium alloy target activated in step (7) is placed therein and nickel plated for 35 min under the action of 150 W ultrasonic waves with a loading of 200 cm 2 / L, then take out the aluminum-scandium alloy target, wash it and blow it dry; (9) Heat treatment: Heat the plated aluminum-scandium alloy target to 190 °C, keep the temperature constant for 50 min, and then cool.

[0098] After testing, the thickness of the coating obtained in this comparative example is 6.4 μm, the phosphorus content is 7.2 wt.%, and the bonding strength is 14.6 MPa. This comparative example proves that when the corrosion inhibitor is missing in the chemical nickel plating solution, the bonding strength of the chemical nickel plating layer obtained will be significantly reduced.

[0099] Table 1 Quality of chemically plated nickel layer of aluminum-scandium alloy target obtained in Examples and Comparative Examples

[0100] Table 1 is a comparison of the quality of the chemically plated nickel layer of the aluminum-scandium alloy target obtained in the embodiment and the comparative example. It can be seen from Table 1 that the chemically plated nickel layer of the aluminum-scandium alloy target prepared by the present invention is flat, uniform, and dense, with a thickness of 4-10 μm, a phosphorus content of ≤10wt.%, and a bonding strength of ≥20 MPa.

[0101] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A method for chemically plating nickel on the surface of an aluminum-scandium alloy target, characterized in that: The following steps are involved: (1) Pretreatment: Grinding and cleaning the surface of the aluminum-scandium alloy target; (2) Degreasing: The aluminum-scandium alloy target pretreated in step (1) is first immersed in an alkaline solution for degreasing, then rinsed with deionized water and blown dry, then placed in acetone for ultrasonic degreasing, then rinsed with deionized water and blown dry; (3) Alkaline etching: soak the aluminum-scandium alloy target after degreasing in step (2) in a sodium hydroxide solution and then rinse with deionized water; (4) Pickling: After the alkaline etching in step (3), the aluminum-scandium alloy target is immersed in a pickling solution at room temperature and then washed with deionized water; (5) Palladium activation: the aluminum-scandium alloy target after pickling in step (4) is placed in a palladium activation solution and immersed at room temperature, and then washed with deionized water; (6) Ultrasonic nickel plating: After heating the chemical nickel plating solution, put the aluminum-scandium alloy target after the activation treatment in step (5) into it, use ultrasonic assisted nickel plating, take out the aluminum-scandium alloy target, wash it, and blow it dry; (7) Heat treatment: The aluminum-scandium alloy target material after nickel plating in step (6) is heated and then cooled to room temperature.

2. The method according to claim 1, characterized in that The content of scandium in the aluminum-scandium alloy target in step (1) is 20-50 at.%; and the target is polished to a surface of more than 1000#.

3. The method according to claim 1, characterized in that The alkaline solution in step (2) contains 20-25 g / L sodium carbonate, 10-15 g / L sodium silicate, and 1-3 g / L OP-10; the temperature of the immersion degreasing is 40-50 °C, and the time is 5-10 min; the temperature of the ultrasonic degreasing is 25-40 °C, and the time is 5-10 min.

4. The method according to claim 1, characterized in that The concentration of the sodium hydroxide solution in step (3) is 20-30 g / L; the immersion temperature is 50-60°C, and the immersion time is 60-90 s.

5. The method according to claim 1, characterized in that The pickling solution in step (4) contains 10-20 g / L of aminosalicylic acid and 10-15 g / L of ammonium bifluoride; and the soaking time is 30-60 s.

6. The method according to claim 1, characterized in that The palladium activation solution in step (5) contains 0.1-1 g / L of palladium chloride, 1-10 mL / L of hydrochloric acid, and 0.5-1 g / L of ammonium chloride; and the immersion time is 10-60 s.

7. The method according to claim 1, characterized in that The chemical nickel plating solution in step (6) contains: 25-30 g / L nickel salt, 25-32 g / L reducing agent, 25-40 g / L complexing agent, 15-25 g / L buffer, 2-4 g / L corrosion inhibitor, 2-6 mg / L stabilizer, 0.2-1 g / L accelerator, 1-2 g / L surfactant, and its pH is 7.5-9.0; Wherein, the nickel salt is nickel sulfate; The reducing agent is sodium hypophosphite; The complexing agent is a complex of citric acid or citrate and lactic acid in a mass ratio of (10-15):(15-25); The buffer is sodium acetate; The corrosion inhibitor is aminoacetic acid; The stabilizer is thiourea or potassium iodide; The accelerator is fluoride; The surfactant is sodium dodecylbenzene sulfonate.

8. The method according to claim 1, characterized in that In step (6), the chemical nickel plating solution is preheated to 80-85°C; the ultrasonic power of the ultrasonic assisted nickel plating is 100-200 W, the nickel plating time is 20-40 min; the loading capacity is 50-200 cm 2 / L.

9. The method according to claim 1, characterized in that The temperature of the heating treatment in step (7) is 150-200°C and the time is 30-60 min.

10. The method according to claim 1, characterized in that The thickness of the nickel coating obtained on the surface of the aluminum-scandium alloy target is 4-10 μm, and the phosphorus content is ≤10 wt.%.

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